Heat spreader

Abstract

This invention provides a heat spreader, comprising a first housing, a second housing, and a working fluid. The first housing has a first recess and pillars. The pillars are disposed on the first bottom surface of the first recess, and a flow channel is formed between the pillars. The second housing has a second recess and a microstructure. The microstructure is disposed on the second bottom surface of the second recess. The microstructure has a reservoir hole. The first housing and the second housing are assembled together, so that the first recess and the second recess are closed to form an accommodating space, and the pillars and the microstructure are aligned. The working fluid is disposed in the accommodating space, and the alignment of the pillars and the microstructure allows the working fluid to be adsorbed between the pillars and the microstructure by capillary force, while simultaneously allowing the working fluid to flow through the flow channel and the reservoir hole.

Description

Technical Field

[0001] This case relates to a heat dissipation device, particularly a vapor chamber. Background Technology

[0002] With the advancement and development of technology, the working efficiency of electronic devices has gradually improved, leading to a corresponding increase in the power of the electronic components inside these devices. Since these components generate more heat during operation, heat dissipation has become increasingly important. Currently, vapor chambers are a common heat dissipation device that can be installed inside electronic devices to cool the electronic components.

[0003] Traditional vapor chambers consist of a shell, a mesh structure, and a working fluid. The shell includes a vacuum chamber, and the mesh structure is disposed within the vacuum chamber to adsorb the working fluid within the space. The working fluid is transferred from the cold end to the hot end through evaporation and condensation circulation, as well as the capillary action of the mesh structure, achieving temperature equalization and heat dissipation. However, with the increasing trend towards thinner electronic devices, the thickness of vapor chambers also needs to be further reduced, necessitating the formation of the mesh structure using thinner and finer copper wires. However, finer copper meshes require higher manufacturing costs and reduce the capillary adhesion of the working fluid, increasing flow resistance and slowing the diffusion rate of the working fluid within the mesh structure, resulting in poorer heat transfer performance of the vapor chamber.

[0004] On the other hand, conventional vapor chambers form vapor channels within a mesh structure and are positioned parallel to the thickness. When the required thickness of the vapor chamber is further reduced, the mesh structure becomes even thinner, resulting in excessively small vapor channels. Consequently, the mesh structure is unable to adsorb the cooled working fluid within the vapor channels, leading to a decrease in the thermal conductivity of the vapor chamber and affecting its heat dissipation efficiency.

[0005] Therefore, it is necessary to develop a heat spreader to solve the problems faced by existing technologies. Summary of the Invention

[0006] The purpose of this invention is to provide a vapor chamber that can achieve thinness, reduce the flow resistance of the working fluid, and increase the working fluid storage capacity, while also enabling rapid heat conduction and temperature uniformity, and improving heat dissipation efficiency.

[0007] To achieve the above objectives, one broader embodiment of this invention provides a heat spreader comprising a first housing, a second housing, and a working fluid. The first housing has a first recess and a plurality of pillars. The first recess has a first bottom surface, and the plurality of pillars are disposed on the first bottom surface, forming flow channels between the pillars. The second housing has a second recess and a microstructure. The second recess has a second bottom surface, and the microstructure is disposed on the second bottom surface. The microstructure has a plurality of reservoir holes. The first housing and the second housing are joined together, so that the first recess and the second recess are closed to form an accommodating space, and the plurality of pillars and the microstructure are aligned. The working fluid is disposed in the accommodating space, and through the alignment of the plurality of pillars and the microstructure, the working fluid is adsorbed between the plurality of pillars and the microstructure by capillary force, while simultaneously flowing through the flow channels and the plurality of reservoir holes. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the heat spreader in the first embodiment of this case.

[0009] Figure 2 This is an exploded structural diagram of the heat spreader in the first embodiment of this case.

[0010] Figure 3 This is a schematic diagram of the structure of the first housing of the heat exchange plate in the first embodiment of this case.

[0011] Figure 4 for Figure 1 The diagram shows a cross-sectional view of the temperature equalization plate at section AA.

[0012] Figure 5 This is a cross-sectional schematic diagram of the heat spreader connected to the heat source in the first embodiment of this case.

[0013] Figure 6 This is an exploded structural diagram of the heat spreader in the second embodiment of this case.

[0014] Figure 7 This is an exploded structural diagram of the second shell of the heat spreader in the second embodiment of this case.

[0015] Figure 8 This is a cross-sectional schematic diagram of the temperature distribution plate in the second embodiment of this case.

[0016] Figure 9 This is a cross-sectional schematic diagram of the microstructure of the heat exchanger plate in the second embodiment of this case.

[0017] Figure 10 This is a partial perspective view of the microstructure of the heat exchanger in the second embodiment of this case.

[0018] Figure 11 This is a cross-sectional schematic diagram of the heat spreader connected to the heat source in the second embodiment of this case.

[0019] The attached figures are labeled as follows:

[0020] 1, 5: Heat spreader

[0021] 100, 500: Storage space

[0022] 2, 6: First shell

[0023] 3, 7: Second shell

[0024] 20, 60: first concave part

[0025] 20a, 60a: First bottom surface

[0026] 21, 61: Column

[0027] 22, 62: Flow channels

[0028] 30, 70: Second concave part

[0029] 30a, 70a: Second bottom surface

[0030] 31, 71: Microstructure

[0031] 201, 301: First sidewall

[0032] 202, 302: Second sidewall

[0033] 203, 303: Third sidewall

[0034] 204, 304: Fourth sidewall

[0035] 711: First Floor

[0036] 711a: First surface layer

[0037] 712: Second Floor

[0038] 712a: Second surface layer

[0039] 310, 710: Storage holes

[0040] 32, 72: Outer surface

[0041] 721: First Hole

[0042] 722: Second hole

[0043] 721a: First long side

[0044] 722a: Second longest side

[0045] 4: Support body

[0046] 41: First Support Column

[0047] 42: Second support column

[0048] A: Evaporation zone

[0049] B: Transmission Area

[0050] H: Heat source

[0051] θ: included angle Detailed Implementation

[0052] Some typical embodiments that embody the features and advantages of this invention will be described in detail in the following description. It should be understood that this invention can have various variations in different forms, all of which do not depart from the scope of this invention, and the descriptions and illustrations therein are for illustrative purposes only, and are not intended to limit this invention.

[0053] Please see Figures 1 to 4 , Figure 1 This is a schematic diagram of the heat spreader plate in the first embodiment of this case. Figure 2 This is an exploded structural diagram of the heat spreader plate in the first embodiment of this case. Figure 3 This is a schematic diagram of the structure of the first shell of the heat spreader in the first embodiment of this case. Figure 4 for Figure 1The diagram shows a cross-sectional view of the heat spreader at section AA. In this embodiment, the heat spreader 1 includes a first housing 2, a second housing 3, and a working fluid (not shown). The first housing 2 includes a first recess 20 and multiple pillars 21. The first recess 20 includes a first bottom surface 20a, and the multiple pillars 21 are disposed on the first bottom surface 20a. Flow channels 22 are formed between the multiple pillars 21. The second housing 3 includes a second recess 30 and microstructures 31. The second recess 30 includes a second bottom surface 30a, and the microstructures 31 are disposed on the second bottom surface 30a. The positions of the microstructures 31 correspond to the positions of the multiple pillars 21, forming an aligned arrangement. That is, the position of each pillar 21 corresponds to the position of the microstructure 31. The microstructure 31 has multiple flow storage holes 310, all of which are blind holes that do not penetrate the second housing 3, and can be used to store the working fluid. When the first housing 2 and the second housing 3 are assembled, the first recess 20 and the second recess 30 are closed to form an accommodating space 100. The multiple pillars 21 of the first housing 2 are aligned with the microstructures 31 so that each pillar 21 contacts the microstructure 31. When the working fluid is placed in the accommodating space 100, the alignment of the multiple pillars 21 and the microstructures 31 causes the working fluid to be adsorbed between the multiple pillars 21 and the microstructures 31 through capillary action, and flows through the flow channel 22 and the multiple storage holes 310. In this embodiment, the heat spreader 1 is configured by aligning multiple pillars 21 of the first housing 2 with the microstructures 31 of the second housing 3. This allows the working fluid to be adsorbed between the pillars 21 and the microstructures 31 through capillary action. Besides replacing the mesh structure used in traditional heat spreaders, this design allows the heat spreader 1 to meet the thickness requirements of a thin heat spreader, preferably less than or equal to 0.6 mm, and more preferably less than or equal to 0.3 mm. Furthermore, because the heat spreader 1 in this embodiment is configured by aligning multiple pillars 21 with the microstructures 31, the working fluid can be adsorbed through capillary action without the need for a mesh structure made of woven metal wire. This reduces the flow resistance of the working fluid, achieves rapid heat conduction and temperature uniformity, and improves heat dissipation efficiency.

[0054] In this embodiment, the first housing 2 and the second housing 3 are both made of metal, such as, but not limited to, copper or copper alloy. Each of the plurality of pillars 21 is a polygonal pillar, preferably hexagonal. The plurality of pillars 21 are arranged in an interlaced array, and flow channels 22 are formed between the plurality of pillars 21, thereby constructing a honeycomb-type capillary structure. In this embodiment, a plurality of storage holes 310 are recessed on the surface of the microstructure 31, such that the plurality of storage holes 310 are blind holes that do not penetrate the second housing 3. Each storage hole 310 is a polygonal groove, preferably hexagonal. The plurality of storage holes 310 are also arranged in an interlaced array to form a honeycomb-type storage structure. In one embodiment, the plurality of storage holes 310 are independent grooves, which are not interconnected with each other. By setting multiple storage holes 310, the storage capacity of the working fluid is increased, thereby improving the heat dissipation efficiency of the heat exchange plate 1.

[0055] In this embodiment, the accommodating space 100 of the heat spreader 1 is a vacuum chamber. The first recess 20 of the first housing 2 has a first sidewall 201, a second sidewall 202, a third sidewall 203, and a fourth sidewall 204, wherein the first sidewall 201 is opposite to the second sidewall 202, and the first sidewall 201 and the second sidewall 202 are respectively adjacent to the two opposite short sides of the heat spreader 1. The third sidewall 203 is opposite to the fourth sidewall 204, and the third sidewall 203 and the fourth sidewall 204 are respectively adjacent to the two opposite long sides of the heat spreader 1. A honeycomb-shaped capillary structure formed by a plurality of pillars 21 and flow channels 22 extends from the middle section of the first sidewall 201 of the first recess 20 to the middle section of the second sidewall 202, and the two opposite sides of the honeycomb-shaped capillary structure are respectively separated from the third sidewall 203 and the fourth sidewall 204 of the first recess 20. The second recess 30 of the second housing 3 has a first sidewall 301, a second sidewall 302, a third sidewall 303, and a fourth sidewall 304, wherein the first sidewall 301 is opposite to the second sidewall 302, and the first sidewall 301 and the second sidewall 302 are respectively adjacent to the two opposite short sides of the heat spreader 1. The third sidewall 303 is opposite to the fourth sidewall 304, and the third sidewall 303 and the fourth sidewall 304 are respectively adjacent to the two opposite long sides of the heat spreader 1. A honeycomb-shaped flow storage structure formed by the microstructure 31 and a plurality of flow storage holes 310 extends from the middle section of the first sidewall 301 of the second recess 30 to the middle section of the second sidewall 302, and the two opposite sides of the honeycomb-shaped flow storage structure are respectively separated from the third sidewall 303 and the fourth sidewall 304 of the second recess 30. In one embodiment, the honeycomb-shaped capillary structure of the first housing 2 and the honeycomb-shaped flow storage structure of the second housing 3 are aligned.

[0056] In this embodiment, the first recess 20, the plurality of pillars 21, and the flow channel 22 of the first housing 2 are formed by an etching process, wherein the first recess 20, the plurality of pillars 21, and the flow channel 22 are integrally formed with the first housing 2 as a single component. The second recess 30, the microstructure 31, and the plurality of reservoir holes 310 of the second housing 3 are formed by an etching process, wherein the second recess 30, the microstructure 31, and the plurality of reservoir holes 310 are integrally formed with the second housing 3 as a single component. Since the aforementioned structure is formed by an etching process, the thickness of the heat spreader 1 can be further reduced.

[0057] In one embodiment, when the first housing 2 and the second housing 3 are assembled, each column 21 is staggered with each reservoir 310 of the microstructure 31, that is, each column 21 partially overlaps with each reservoir 310 of the microstructure 31, so that the free end of each column 21 does not completely cover the opening of the reservoir 310, but only a portion of the free end covers the opening of the reservoir 310. In other words, each reservoir 310 is interconnected with the flow channel 22 formed between the multiple columns 21, allowing the working fluid or vaporized working fluid to flow between the reservoir 310 and the flow channel 22.

[0058] In some embodiments, when the first housing 2 and the second housing 3 are assembled, each column 21 is aligned with each reservoir 310 of the microstructure 31, that is, the free end of each column 21 overlaps the opening of each reservoir 310 of the microstructure 31, and the area of ​​the opening of each reservoir 310 is larger than the surface area of ​​the free end of the aligned column 21. Since the area of ​​the opening of the reservoir 310 is larger than the surface area of ​​the free end of the column 21, the column 21 will not completely cover the reservoir 310 between the column 21 and the corresponding reservoir 310. In other words, each reservoir 310 is interconnected with the flow channel 22 formed between the multiple columns 21, so that the working fluid or the vaporized working fluid can flow between the reservoir 310 and the flow channel 22.

[0059] In this embodiment, the heat spreader 1 further includes a plurality of support bodies 4. The plurality of support bodies 4 are disposed in the accommodating space 100 and between the first bottom surface 20a of the first housing 2 and the second bottom surface 30a of the second housing 3. In one embodiment, each support body 4 includes a first support column 41 and a second support column 42. The first support column 41 is disposed on the first bottom surface 20a of the first housing 2, and the second support column 42 is disposed on the second bottom surface 30a of the second housing 3. The position of each second support column 42 corresponds to the position of each first support column 41, such that when the first housing 2 and the second housing 3 of the heat spreader 1 are assembled, the first support column 41 and the second support column 42 of each support body 4 are aligned and engaged. In one embodiment, multiple arrays of first support pillars 41 are arranged on the first bottom surface 20a of the first recess 20, wherein some of the first support pillars 41 are located between the first sidewall 201, second sidewall 202, third sidewall 203 and the honeycomb-shaped capillary structure of the first recess 20, and the remaining first support pillars 41 are located between the first sidewall 201, second sidewall 202, fourth sidewall 204 and the honeycomb-shaped capillary structure of the first recess 20. Multiple arrays of second support pillars 42 are arranged on the second bottom surface 30a of the second recess 30, wherein some of the second support pillars 42 are located between the first sidewall 301, second sidewall 302, third sidewall 303 and the honeycomb-shaped storage structure of the second recess 30, and the remaining second support pillars 42 are located between the first sidewall 301, second sidewall 302, fourth sidewall 304 and the honeycomb-shaped storage structure of the second recess 30. The first support column 41 may be formed on the first housing 2 by an etching process, but is not limited to this, wherein the first support column 41 and the first housing 2 are integrally formed as a single component. The second support column 42 may be formed on the second housing 3 by an etching process, wherein the second support column 42 and the second housing 3 are integrally formed as a single component. By setting multiple supports 4, the structure of the heat spreader 1 is strengthened and deformation of the surface of the first housing 2 or the second housing 3 is avoided.

[0060] Figure 5 This is a cross-sectional schematic diagram of the heat spreader connected to a heat source in the first embodiment of this case. Figure 5As shown, the outer surface 32 of the second housing 3 of the heat spreader 1 in this case can be connected to or contact a heat source H, and the heat source H is correspondingly arranged with at least a portion of the column 21 and at least a portion of the storage hole 310, thereby escaping the heat energy generated by the heat source H, wherein the heat source H can be, but is not limited to, an electronic component. As shown in the figure, the area where the column 21 and storage hole 310 corresponding to the heat source H are arranged is defined as the evaporation zone A of the heat spreader 1, and the area where the column 21 and storage hole 310 are arranged outside the evaporation zone A is defined as the transmission zone B of the heat spreader 1. Since the heat source H contacts the outer surface 32 of the second housing 3, the working fluid in the evaporation zone A receives the heat energy transferred by the heat source H, causing the working fluid in the storage hole 310 to change from liquid to gas and flow to the flow channel 22, and the gaseous working fluid cools and condenses after flowing to the transmission zone B. At this time, the working fluid in the transmission zone B is driven by the capillary force of the honeycomb-shaped capillary structure formed by multiple columns 21 and flow channels 22, which first diffuses the working fluid away from the heat source H, and then flows back to the evaporation zone A through the microstructure 31. By the evaporation and condensation cycle of the working fluid and the capillary force of the honeycomb-shaped capillary structure, the working fluid is transferred from the cold end to the hot end, so as to achieve rapid temperature uniformity and heat dissipation. Furthermore, the arrangement of multiple storage holes 310 increases the storage capacity of the working fluid, thereby improving the heat dissipation efficiency of the heat spreader 1.

[0061] Please see Figures 6 to 8 , Figure 6 This is an exploded structural diagram of the heat spreader plate in the second embodiment of this case. Figure 7 This is an exploded structural diagram of the second shell of the heat spreader in the second embodiment of this case. Figure 8This is a cross-sectional schematic diagram of the heat spreader plate according to the second embodiment of this case. The heat spreader plate 5 of this embodiment includes a first housing 6, a second housing 7, and a working fluid (not shown). The first housing 6 includes a first recess 60 and a plurality of pillars 61. The first recess 60 has a first bottom surface 60a, and the plurality of pillars 61 are disposed on the first bottom surface 60a, forming a flow channel 62 between the plurality of pillars 61. The second housing 7 includes a second recess 70 and a microstructure 71. The second recess 70 has a second bottom surface 70a, and the microstructure 71 is disposed on the second bottom surface 70a. The microstructure 71 has a plurality of reservoir holes 710. When the first housing 6 and the second housing 7 are assembled, the first recess 60 and the second recess 70 are closed to form an accommodating space 500, and the plurality of pillars 61 and the microstructure 71 are aligned. The working fluid is disposed in the accommodating space 500, and the working fluid is adsorbed between the plurality of pillars 61 and the microstructure 71 by capillary action, and flows through the flow channel 62 and the plurality of reservoir holes 710. In this embodiment, the heat spreader 5, through the cooperation of multiple pillars 61 of the first housing 6 with the microstructure 71 and the reservoir holes 710, can replace the mesh structure of a traditional heat spreader, enabling the heat spreader 5 to meet the thickness requirements of a thin heat spreader, for example, preferably less than or equal to 0.6 mm, more preferably less than or equal to 0.3 mm. Furthermore, the heat spreader 5 of this embodiment does not require a mesh structure made of copper wire, which can reduce the flow resistance of the working fluid, achieve rapid heat conduction and temperature uniformity, and improve heat dissipation efficiency.

[0062] In one embodiment, the first housing 6 and the second housing 7 are both made of metal, such as, but not limited to, copper or copper alloy. The accommodating space 500 is a vacuum chamber. A plurality of pillars 61 are arranged in groups on the first bottom surface 60a of the first recess 60. In another embodiment, the outline of the microstructure 71 matches the outline of the second recess 70, thereby allowing the microstructure 71 to be embedded in the second recess 70.

[0063] Figure 9 This is a cross-sectional schematic diagram of the microstructure of the heat spreader in the second embodiment of this case. Figure 9As shown, in this embodiment, the microstructure 71 is assembled to the second housing 7. The microstructure 71 is made of a metallic material, and the plurality of storage holes 710 of the microstructure 71 are formed by an etching process, but are not limited thereto. The microstructure 71 has a first layer 711 and a second layer 712, and the first layer 711 is connected to the second layer 712. The first layer 711 has a first layer surface 711a, and the second layer 712 has a second layer surface 712a, wherein the first layer surface 711a and the second layer surface 712a are disposed opposite to each other on both sides of the microstructure 71. Each storage hole 710 includes a first hole 721 and a second hole 722, wherein the first hole 721 is disposed in the first layer 711 of the microstructure 71, and the second hole 722 is disposed in the second layer 712 of the microstructure 71, wherein the first hole 721 and the second hole 722 are at least partially connected, and the storage hole 710 penetrates the first layer surface 711a and the second layer surface 712a of the microstructure 71.

[0064] Figure 10 This is a partial perspective view of the microstructure of the heat spreader in the second embodiment of this case. Figure 9 and Figure 10 As shown, in this embodiment, the first hole 721 and the second hole 722 of each storage hole 710 can be, but are not limited to, elongated holes with the same outline. The first hole 721 includes a first long side 721a, and the second hole 722 includes a second long side 722a, with an included angle θ between the first long side 721a and the second long side 722a. In one embodiment, the included angle θ can be, but is not limited to, 90 degrees. Therefore, the first hole 721 and the second hole 722 are connected in a partially overlapping manner. The first hole 721 and the second hole 722 of the storage hole 710 are partially connected, which increases the contact area between the storage hole 710 and the working fluid, enhances the capillary adsorption force of the working fluid, and increases the storage capacity of the working fluid. At the same time, it avoids the flow resistance of the conventional heat spreader's mesh structure to the working fluid, and allows the thickness of the heat spreader 5 to be further reduced.

[0065] In one embodiment, each first hole 721 is partially connected to a plurality of second holes 722, and each second hole 722 is also partially connected to a plurality of first holes 721. In other words, each first hole 721 can be simultaneously associated with two or more second holes 722, and each second hole 722 can also be simultaneously associated with two or more first holes 721. Through the above-described arrangement of the first holes 721 and second holes 722, the working fluid storage capacity can be increased, the capillary adhesion of the working fluid can be enhanced, the flow resistance of the conventional heat spreader's mesh structure on the working fluid can be avoided, and the transmission efficiency of the working fluid within the storage hole 710 can be improved.

[0066] Figure 11 This is a cross-sectional schematic diagram of the heat spreader connected to a heat source in the second embodiment of this case. Figure 11As shown, in this embodiment, the outer surface 72 of the second housing 7 of the heat spreader 5 can be connected to or contact a heat source H, and the heat source H is correspondingly disposed with at least a portion of the column 61 and at least a portion of the storage hole 710, thereby escaping the heat energy generated by the heat source H, wherein the heat source H can be, but is not limited to, an electronic component. As shown, the area where the column 61 and storage hole 710 corresponding to the heat source H are disposed is defined as the evaporation zone A of the heat spreader 5, and the area where the column 61 and storage hole 710 are disposed outside the evaporation zone A is defined as the transmission zone B of the heat spreader 5. Since the heat source H contacts the outer surface 72 of the second housing 7, the working fluid in the evaporation zone A receives the heat energy transferred by the heat source H, causing the working fluid in the storage hole 710 to change from liquid to gas and flow to the flow channel 62. The gaseous working fluid further flows to the transmission zone B, and diffuses away from the heat source H through the flow channel 62 and cools and condenses. At this time, the liquid working fluid in the transfer zone B flows to the microstructure 71, and is driven back to the evaporation zone A by the capillary force of the microstructure 71 and the storage holes 710. Through the evaporation and condensation circulation of the working fluid and the capillary force of the flow channel 62, microstructure 71 and storage holes 710, the working fluid is transferred from the cold end to the hot end to achieve rapid temperature equalization and heat dissipation. Furthermore, the arrangement of multiple storage holes 710 increases the storage capacity of the working fluid, thereby improving the heat dissipation efficiency of the heat spreader 5.

[0067] In one embodiment, the density of the storage holes 710 in the evaporation zone A of the heat spreader 5 is greater than that in the transmission zone B, resulting in a greater capillary adsorption force in the evaporation zone A than in the transmission zone B. Therefore, when the working fluid in the evaporation zone A changes from a liquid to a gaseous state and flows to the flow channel 62, the working fluid in the transmission zone B can quickly replenish the evaporation zone A, thereby improving the heat dissipation efficiency of the heat spreader 5. The dense area of ​​the storage holes 710 in the microstructure 71 can be adjusted according to the location of the heat source H and can vary according to actual application requirements, and is not limited to the above embodiment.

[0068] In summary, the vapor chamber of this invention, through the arrangement of columns and microstructures, eliminates the need for the mesh structure of conventional vapor chambers, achieving a thinner profile, reduced flow resistance of the working fluid, rapid heat conduction, and temperature uniformity, while also improving heat dissipation efficiency. Furthermore, the inclusion of flow storage holes increases the storage capacity of the working fluid, further enhancing the vapor chamber's heat dissipation performance. Moreover, the support structure strengthens the vapor chamber structure and prevents deformation of the surfaces of the first or second housing. Even more significantly, the higher density of flow storage holes in the evaporation zone and the lower density in the transmission zone facilitates the easy transfer of the working fluid to the evaporation zone by capillary action, thereby improving heat dissipation efficiency.

[0069] This case can be modified in various ways by those who are familiar with this technology, but all of them are still subject to the protection sought by the attached patent application.

Claims

1. A heat spreader, comprising: A first housing has a first recess and a plurality of pillars. The first recess has a first bottom surface, and the pillars are disposed on the first bottom surface, with a flow channel formed between the pillars. A second housing has a second recess and a microstructure. The second recess has a second bottom surface, and the microstructure is disposed on the second bottom surface. The microstructure has multiple storage holes. The first housing and the second housing are assembled together, so that the first recess and the second recess close to form an accommodating space. The pillars are aligned with the microstructure. The microstructure includes a first layer and a second layer connected to each other. Each storage hole includes a first hole and a second hole. The first hole is located in the first layer, and the second hole is located in the second layer. The first hole and the second hole are connected in a partially overlapping manner. A working fluid is disposed in the accommodating space. The working fluid is adsorbed between the columns and the microstructure by capillary force through the alignment of the columns and the microstructure, while the working fluid flows through the flow channel and the storage holes.

2. The heat spreader as claimed in claim 1, wherein the columns are polygonal columns and the storage holes are polygonal grooves.

3. The heat spreader as claimed in claim 2, wherein the columns are hexagonal columns and the columns are arranged in an interlaced array to form a honeycomb capillary structure, wherein the storage holes are hexagonal grooves and the storage holes are arranged in an interlaced array to form a honeycomb storage structure.

4. The temperature distribution plate as claimed in claim 1, wherein the columns are offset from the reservoir holes, and the flow channel is connected to the reservoir holes.

5. The heat spreader as claimed in claim 4, wherein a free end portion of the columns covers an opening of the reservoir holes.

6. The temperature distribution plate as claimed in claim 1, wherein the columns are aligned with the reservoir holes, and the flow channel is connected to the reservoir holes.

7. The heat spreader as claimed in claim 5, wherein the area of ​​the opening of the reservoir holes is greater than the surface area of ​​the free end of the corresponding column.

8. The heat spreader as claimed in claim 1 further comprises a plurality of supports disposed between the first bottom surface of the first housing and the second bottom surface of the second housing.

9. The temperature distribution plate as claimed in claim 8, wherein the supports include a first support column and a second support column, wherein the first support column is disposed on the first bottom surface and the second support column is disposed on the second bottom surface, wherein when the first housing and the second housing are assembled, the first support column and the second support column of each support are aligned and engaged.

10. The heat spreader as claimed in claim 1, wherein the columns of the first housing and the reservoir holes of the second housing are formed by an etching process, wherein the reservoir holes are not interconnected.

11. The heat spreader as claimed in claim 1, wherein when the second housing is connected to or in contact with a heat source, the heat source is correspondingly disposed with a portion of the columns and a portion of the storage holes, wherein the area where the columns and storage holes corresponding to the heat source are disposed is defined as an evaporation zone, the area where the columns and storage holes are disposed outside the evaporation zone is defined as a transmission zone, and the storage hole density in the evaporation zone is greater than the storage hole density in the transmission zone.

12. The heat spreader of claim 1, wherein the reservoir holes of the microstructure are formed by an etching process.

13. The heat spreader as claimed in claim 1, wherein the thickness of the heat spreader is less than or equal to 0.6 mm.

14. The heat spreader as claimed in claim 1, wherein the first housing and the second housing are each made of metal, and the accommodating space is a vacuum chamber.

Images