A mechanical polishing apparatus for gallium arsenide single crystals

Abstract

The application discloses a gallium arsenide single crystal mechanical polishing device in the technical field of wafer polishing, and comprises a supporting mechanism, characterized in that the device further comprises a polishing mechanism, a conversion mechanism and a clamping hand; the clamping hand is slidingly installed at the upper end of the supporting mechanism, the polishing mechanism is installed at the middle position of the supporting mechanism, and the conversion mechanism is fixedly installed on the supporting mechanism and is communicated with the polishing mechanism and the clamping hand respectively; under the premise of ensuring that the wafer can be normally processed, the wafer is prevented from being damaged by clamping force in the processing process to the maximum extent.

Description

Technical Field

[0001] This invention relates to the field of wafer polishing technology, specifically to a gallium arsenide single crystal mechanical polishing device. Background Technology

[0002] Gallium arsenide (GaAs) wafers are manufactured from single-crystal GaAs material synthesized and grown from pure arsenic and gallium, through processes such as cutting, grinding, polishing, and cleaning. Among these processes, polishing is crucial for achieving the ultra-high precision surface finish required for GaAs wafers. Currently, the most commonly used polishing process for GaAs wafers both domestically and internationally is chemical mechanical polishing (CMP). A CMP machine mainly consists of three parts: a wafer holder, a worktable supporting the polishing pad, and a polishing slurry supply device. During CMP, the wafer holder, with the wafer to be polished, presses it against a rotating polishing pad under a certain pressure. The oxidizing polishing slurry reacts chemically with the wafer surface to form an easily removable oxide film. This oxide film is then removed from the wafer surface by the mechanical cutting action of the rotating polishing pad. The CMP process is completed through alternating chemical film formation and mechanical film removal. To accelerate production efficiency, double-sided processing is often used in existing technologies.

[0003] In existing CMP (Chemical Mechanical Polishing) technology, the cutting depth is too small during wafer processing and polishing, requiring timing to control the cutting depth. This necessitates maintaining stable processing parameters throughout the process to ensure cutting accuracy. One crucial parameter is the relative rotational speed between the wafer and the polishing pad. This necessitates preventing relative rotation between the wafer and the wafer holder during processing, requiring the wafer holder to clamp the wafer with a significant force throughout the process. However, existing wafer holders cannot achieve optimal clamping force for wafers of different radii while ensuring normal processing. Because wafers are fragile, excessive clamping force can easily damage them, while wafers of different radii experience varying torsional forces. In contrast, insufficient clamping force can cause the wafer to rotate, affecting processing accuracy. Consequently, the range of wafer holders suitable for different radii is limited, and they fail to provide adequate protection for the wafers.

[0004] Based on this, the present invention designs a gallium arsenide single crystal mechanical polishing device to solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to provide a gallium arsenide single crystal mechanical polishing device to solve the problems mentioned in the background art. Existing wafer holders, when dealing with wafers of different radii, cannot clamp wafers of different radii with the most suitable force while ensuring normal processing. Since wafers are very fragile, large clamping forces can easily damage them. Furthermore, wafers of different radii experience different torsional forces, and small clamping forces can cause the wafers to rotate, affecting processing accuracy. This limits the range of wafer holders that can handle wafers of different radii and fails to provide adequate protection for the wafers.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a gallium arsenide single crystal mechanical polishing device, comprising a support mechanism, characterized in that: it further comprises a grinding mechanism, a conversion mechanism, and a clamp; the clamp is slidably mounted on the upper end of the support mechanism; the grinding mechanism is mounted in the middle position of the support mechanism and can provide real-time feedback on the magnitude of the torque force received during operation to the conversion mechanism; the conversion mechanism is fixedly mounted on the support mechanism and is connected to both the grinding mechanism and the clamp, and the conversion mechanism can dynamically adjust the clamping force of the clamp by adjusting the magnitude of the torque force received by the grinding mechanism.

[0007] As a further embodiment of the present invention, slide rails are fixedly installed on the upper ends of both sides of the support mechanism, and clamps are symmetrically installed on the opposite surfaces of the two slide rails.

[0008] The gripper includes a slide rod 1, which is slidably mounted on a slide rail. A slide rod 2 is slidably connected to slide rod 1, and a spring is installed between slide rod 1 and slide rod 2. A threaded pin is threadedly connected to one end of slide rod 1 near slide rod 2. A clamping mechanism is fixedly connected to slide rod 2. Conventional clamping schemes directly clamp the wafer to be processed, providing a force to hold it in place and prevent its rotation. This clamping force is relatively large and can easily damage the wafer. Therefore, this scheme uses a spring to first provide a small clamping force to support the weight of the wafer to be processed, and then locks slide rod 1 and slide rod 2 with a threaded pin, maintaining this clamping force while providing support for the subsequent force to prevent the wafer from rotating.

[0009] As a further embodiment of the present invention, an arc-shaped cavity is provided inside the clamping mechanism, and a fifth pipe port is fixedly connected to the outside of the clamping mechanism. The fifth pipe port communicates with the arc-shaped cavity. On the side of the outer wall of the clamping mechanism away from the slide rod two, multiple pressure heads are equidistantly and slidably installed in a sealed manner. The pressure heads communicate with the arc-shaped cavity, and a pressure plate is elastically and slidably connected to the side of the arc-shaped cavity away from the pressure heads. The liquid pressure inside the arc-shaped cavity is used to squeeze the pressure heads, thereby providing a clamping force to the wafer to prevent it from rotating. At the same time, the liquid pressure changes in real time with the torque force on the wafer, so that the total clamping force on the wafer is always kept within a small range, maximizing the protection of the wafer and preventing it from breaking.

[0010] As a further embodiment of the present invention, a processing groove is provided in the middle of the support mechanism, and the processing groove is at the same horizontal position as the grinding mechanism; so that the loading and unloading of the entire processing are carried out on the upper left and right sides of the support mechanism respectively, so that if the wafer is detached from the gripper due to operational errors or other unconventional phenomena during the loading and unloading process, the support mechanism acts as a protection to prevent the wafer from falling directly to the ground and causing damage.

[0011] As a further embodiment of the present invention, the support mechanism is symmetrically fixedly installed with support frames at its upper and lower ends, and a grinding mechanism is installed at the end of each support frame; the grinding mechanism includes a motor, the motor is fixedly connected to the end of the support frame, a rotating shaft is rotatably installed near the end of the support mechanism, the rotating shaft is slidably connected to a sliding shaft, and a grinding disc is rotatably connected to the sliding shaft; a pressure mechanism is externally connected between the rotating shaft and the sliding shaft to control the squeezing force of the sliding shaft in the direction of the grinding disc;

[0012] The grinding mechanism is equipped with a force transmission mechanism, which includes a fixed rod fixedly connected to the side wall of the sliding shaft. An arc-shaped cylinder is fixedly connected to the fixed rod. A first pipe opening is fixedly installed at one end of the arc-shaped cylinder, and an arc-shaped rod is slidably connected to the other end. A fixed block is fixedly connected to the end of the arc-shaped rod, and the fixed block is fixedly connected to the grinding disc. The force transmission mechanisms on the upper and lower grinding mechanisms are symmetrical about the vertical plane. The force transmission mechanism drives the grinding disc to rotate, so that the friction between the grinding disc and the wafer during operation can be fed back to the force transmission mechanism, thereby controlling the magnitude of the clamping force on the wafer and maximizing the protection of the wafer to prevent damage.

[0013] As a further embodiment of the present invention, the conversion mechanism includes a first hydraulic tank, which is fixedly installed on the upper end of a slide rail. The two ends of the first hydraulic tank are respectively fixedly connected to and communicate with a second pipe opening and a third pipe opening. A second hydraulic tank is fixedly connected to the side of the first hydraulic tank. A first sliding groove is formed through the connecting wall of the first and second hydraulic tanks. A second sliding groove is formed on the first sliding groove. A sliding plate is slidably connected to the first sliding groove. Sealing walls are vertically arranged on both sides of the sliding plate, and the sealing walls are slidably and sealingly connected to the second sliding groove. The two ends of the sliding plate are slidably and sealingly connected to the inner walls of the first and second hydraulic tanks, respectively.

[0014] A third hydraulic tank is fixedly connected to the upper end of the second hydraulic tank, and the two ends of the third hydraulic tank are respectively connected to the second hydraulic tank; a fourth hydraulic tank is vertically connected to the side wall of the third hydraulic tank, and the connection is through and connected.

[0015] A partition is fixedly installed in the middle of the fourth hydraulic tank, extending into the third hydraulic tank and fixedly connected to its inner wall. Sliding blocks are slidably connected to both sides of the partition, and a telescopic block is slidably installed on one end of the sliding block near the third hydraulic tank. The end of the fourth hydraulic tank away from the third hydraulic tank is fixedly connected to and connected to a fourth pipe opening. By utilizing the cooperation of multiple hydraulic tanks, sliding blocks, and a sliding plate, the frictional forces exerted on the wafer by the upper and lower grinding discs are canceled out and aggregated, thus obtaining the final resultant force of the frictional forces on the wafer. This resultant force is then hydraulically fed back to the clamping hand to obtain a minimum clamping force. A stable and efficient real-time feedback mechanism is achieved with a simple mechanical structure, enabling the equipment to apply a minimum clamping force to the wafer stably and efficiently, maximizing wafer protection.

[0016] As a further aspect of the present invention, the first pipe port on the force transmission mechanism of the upper and lower grinding mechanisms is connected to the second and third pipe ports respectively via hoses; the fifth pipe ports on the two clamps are connected to the fourth pipe port; the force transmission mechanism, the conversion mechanism, the clamps, and the connecting hoses are filled with hydraulic oil; by connecting the hydraulic oil in each mechanism through common and relatively inexpensive hoses, the equipment cost is reduced, thereby increasing profits.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] 1. The elastic force generated by the movement of the pressure plate is converted by a conversion mechanism and combined with the resultant force applied to the slide plate by the upper and lower force transmission mechanisms to achieve mechanical equilibrium. This results in the hydraulic oil in the arc-shaped cavity having an increasing pressure as the resultant force on the slide plate increases (the component forces applied to the slide plate by the upper and lower force transmission mechanisms are directly proportional to the frictional force between their corresponding grinding discs and the wafer; furthermore, the resultant force on the slide plate is positively correlated with the resultant frictional force generated by the grinding discs on the wafer; furthermore, the hydraulic oil pressure in the arc-shaped cavity is positively correlated with the resultant force experienced by the wafer during processing). Furthermore, the pressing force of the pressure head is positively correlated with the wafer torque force (the pressure of the wafer...). The torque force on the wafer is the resultant force of the frictional force generated by the grinding disc on the wafer. This causes the clamping force that prevents the wafer from rotating to increase as the torque force on the wafer increases. As a result, the total clamping force on the wafer can always be kept within a small range. This ensures that the wafer can be processed normally while minimizing the probability of damage to the wafer due to the clamping force during processing. Furthermore, since the clamping force that prevents the wafer from rotating increases with the torque force on the wafer and is not affected by the radius of the wafer itself, the equipment can process wafers of different radii, thus broadening the scope of application of the equipment and saving equipment costs.

[0019] 2. By utilizing the cooperation of multiple hydraulic tanks, sliding blocks, and sliding plates, the frictional forces exerted on the wafer by the upper and lower grinding discs are canceled out and combined to obtain the final resultant force of the frictional forces on the wafer. The magnitude of the resultant force is then fed back to the clamping hand via hydraulics to obtain the minimum clamping force. A stable and efficient real-time feedback mechanism is obtained with a simple mechanical structure, which enables the equipment to apply a minimum clamping force to the wafer stably and efficiently, thus protecting the wafer to the greatest extent.

[0020] 3. The grinding disc is rotated by the force transmission mechanism, so that the friction between the grinding disc and the wafer can be fed back to the force transmission mechanism when the grinding disc is working, thereby controlling the magnitude of the clamping force on the wafer, protecting the wafer to the greatest extent and preventing it from being damaged. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0024] Figure 3 This is a schematic diagram of the grinding mechanism.

[0025] Figure 4 This is a schematic diagram of the conversion mechanism;

[0026] Figure 5 for Figure 4 A top-section structural diagram of the first hydraulic tank in the middle section;

[0027] Figure 6 for Figure 5 Enlarged view of point B in the middle;

[0028] Figure 7 for Figure 4 Schematic diagram of the front section of the third hydraulic tank;

[0029] Figure 8 for Figure 4 Schematic diagram of the top section of the third hydraulic tank;

[0030] Figure 9 This is a top-section diagram of the gripper 4 and the chip 5;

[0031] Figure 10 for Figure 9Enlarged diagram of point C in the middle.

[0032] The attached diagram lists the components represented by each number as follows:

[0033] Support mechanism 1, processing groove 1-1, support frame 1-2, slide rail 1-3, grinding mechanism 2, motor 2-1, rotating shaft 2-2, sliding shaft 2-3, grinding disc 2-4, force transmission mechanism 2-5, fixing block 2-5-1, arc rod 2-5-2, arc cylinder 2-5-3, fixing rod 2-5-4, first pipe opening 2-5-5, conversion mechanism 3, first hydraulic tank 3-1, second pipe opening 3-1-1, third pipe opening 3-1-2, first sliding groove 3-1-3, second sliding groove 3-1-4, second hydraulic tank 3-2, third hydraulic tank 3-3, fourth hydraulic tank 3-4, fourth pipe opening 3-4-1, partition 3-4-2, slide plate 3-5, sealing wall 3-5-1, sliding block 3-6, telescopic block 3-6-1, gripper 4, slide rod one 4-1, spring 4-1-1, threaded pin 4-2, slide rod two 4-3, clamping mechanism 4-4, arc cavity 4-4-1, fifth pipe opening 4-4-2, pressure plate 4-4-3, pressure head 4-4-5, wafer 5. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] Please see Figure 1-10 This invention provides a technical solution: a gallium arsenide single crystal mechanical polishing device, comprising a support mechanism 1, characterized in that: it further comprises a grinding mechanism 2, a conversion mechanism 3, and a clamp 4; the clamp 4 is slidably mounted on the upper end of the support mechanism 1; the grinding mechanism 2 is mounted in the middle position of the support mechanism 1 and can provide real-time feedback on the magnitude of the torque force received during operation to the conversion mechanism 3; the conversion mechanism 3 is fixedly mounted on the support mechanism 1 and is connected to both the grinding mechanism 2 and the clamp 4, and the conversion mechanism 3 can dynamically adjust the clamping force of the clamp 4 based on the magnitude of the torque force received by the grinding mechanism 2.

[0036] As a further embodiment of the present invention, slide rails 1-3 are fixedly installed on the upper ends of both sides of the support mechanism 1, and clamps 4 are symmetrically installed on the opposite surfaces of the two slide rails 1-3.

[0037] The clamp 4 includes a slide rod 4-1, which is slidably mounted on the slide rail 1-3. A slide rod 4-3 is slidably connected to the slide rod 4-1. A spring 4-1-1 is installed between the slide rod 4-1 and the slide rod 4-3. A threaded pin 4-2 is connected through the end of the slide rod 4-1 near the slide rod 4-3. A clamping mechanism 4-4 is fixedly connected to the slide rod 4-3. Conventional clamping schemes provide a clamping force and a force to prevent the wafer from rotating by directly clamping it. This clamping force is relatively large and can easily damage the wafer. Therefore, this scheme sets the spring 4-1-1 to first provide a small clamping force to support the weight of the wafer, and then locks the slide rod 4-1 and the slide rod 4-3 by the threaded pin 4-2, maintaining this clamping force while providing support for the subsequent force to prevent the wafer from rotating.

[0038] As a further embodiment of the present invention, an arc-shaped cavity 4-4-1 is provided inside the clamping mechanism 4-4, and a fifth pipe port 4-4-2 is fixedly connected to the outside of the clamping mechanism 4-4. The fifth pipe port 4-4-2 communicates with the arc-shaped cavity 4-4-1. On the side of the outer wall of the clamping mechanism 4-4 away from the slide bar 4-3, a plurality of pressure heads 4-4-5 are equidistantly and slidably installed in a sealed manner. The pressure heads 4-4-5 communicate with the arc-shaped cavity 4-4-1. A pressure plate 4-4-3 is elastically and slidably connected to the side of the arc-shaped cavity 4-4-1 away from the pressure heads 4-4-5. The liquid pressure in the arc-shaped cavity 4-4-1 is used to squeeze the pressure heads 4-4-5, thereby providing a clamping force to prevent the wafer from rotating. At the same time, the liquid pressure changes in real time with the torque force on the wafer, so that the total clamping force on the wafer is always kept within a small range, maximizing the protection of the wafer and preventing its breakage.

[0039] As a further embodiment of the present invention, a processing groove 1-1 is provided in the middle of the support mechanism 1, and the processing groove 1-1 is at the same horizontal position as the grinding mechanism 2.

[0040] As a further embodiment of the present invention, the support mechanism 1 is symmetrically fixedly mounted with support frames 1-2 at its upper and lower ends, and a grinding mechanism 2 is mounted at each end of the support frame 1-2; the grinding mechanism 2 includes a motor 2-1, the motor 2-1 is fixedly connected to the end of the support frame 1-2, a rotating shaft 2-2 is rotatably mounted on the end of the motor 2-1 near the support mechanism 1, a sliding shaft 2-3 is slidably connected to the rotating shaft 2-2, and a grinding disc 2-4 is rotatably connected to the sliding shaft 2-3; a pressure mechanism is externally connected between the rotating shaft 2-2 and the sliding shaft 2-3 to control the pressing force of the sliding shaft 2-3 towards the grinding disc 2-4;

[0041] The grinding mechanism 2 is equipped with a force transmission mechanism 2-5. The force transmission mechanism 2-5 includes a fixed rod 2-5-4, which is fixedly connected to the side wall of the sliding shaft 2-3. An arc-shaped cylinder 2-5-3 is fixedly connected to the fixed rod 2-5-4. A first pipe opening 2-5-5 is fixedly installed at one end of the arc-shaped cylinder 2-5-3, and an arc-shaped rod 2-5-2 is slidably connected to the other end. A fixed block 2-5-1 is fixedly connected to the end of the arc-shaped rod 2-5-2, and the fixed block 2-5-1 is fixedly connected to the grinding disc 2-4. The force transmission mechanisms 2-5 on the upper and lower grinding mechanisms 2 are symmetrical about the vertical plane. The force transmission mechanism 2-5 drives the grinding disc 2-4 to rotate, so that when the grinding disc 2-4 is working, the friction between it and the wafer can be fed back to the force transmission mechanism 2-5, thereby controlling the magnitude of the clamping force on the wafer and protecting the wafer to the greatest extent to prevent it from breaking.

[0042] As a further embodiment of the present invention, the conversion mechanism 3 includes a first hydraulic tank 3-1, which is fixedly installed on the upper end of the slide rail 1-3. The first hydraulic tank 3-1 has a second pipe opening 3-1-1 and a third pipe opening 3-1-2 fixedly connected to its two ends respectively. A second hydraulic tank 3-2 is fixedly connected to the side of the first hydraulic tank 3-1. A first sliding groove 3-1-3 is formed through the connecting wall of the first hydraulic tank 3-1 and the second hydraulic tank 3-2. A second sliding groove 3-1-4 is formed on the first sliding groove 3-1-3. A sliding plate 3-5 is slidably connected to the first sliding groove 3-1-3. Sealing walls 3-5-1 are vertically arranged on both sides of the sliding plate 3-5. The sealing walls 3-5-1 are slidably and sealingly connected to the second sliding groove 3-1-4. The two ends of the sliding plate 3-5 are slidably and sealingly connected to the inner walls of the first hydraulic tank 3-1 and the second hydraulic tank 3-2 respectively.

[0043] A third hydraulic tank 3-3 is fixedly connected to the upper end of the second hydraulic tank 3-2, and the third hydraulic tank 3-3 is connected to both ends of the second hydraulic tank 3-2 respectively; a fourth hydraulic tank 3-4 is vertically connected to the side wall of the third hydraulic tank 3-3, and the connection is through and connected.

[0044] A partition 3-4-2 is fixedly installed in the middle of the fourth hydraulic tank 3-4. The partition 3-4-2 extends into the third hydraulic tank 3-3 and is fixedly connected to the inner wall of the third hydraulic tank 3-3. Sliding blocks 3-6 are slidably connected to both sides of the partition 3-4-2. A telescopic block 3-6-1 is slidably installed on one end of the sliding block 3-6 near the third hydraulic tank 3-3. The end of the fourth hydraulic tank 3-4 away from the third hydraulic tank 3-3 is fixedly connected to and connected to the fourth pipe port 3-4-1. By utilizing the cooperation of multiple hydraulic tanks, sliding blocks 3-6, and sliding plate 3-5, the frictional force of the upper and lower grinding discs 2-4 on the wafer is canceled and summarized, thereby obtaining the final resultant force of the frictional force on the wafer. The magnitude of the resultant force is then hydraulically fed back to the gripper 4 to obtain the minimum clamping force. A stable and efficient real-time feedback mechanism is obtained with a simple mechanical structure, thereby enabling the equipment to apply a minimum clamping force to the wafer stably and efficiently, and to protect the wafer to the greatest extent.

[0045] As a further embodiment of the present invention, the first pipe port 2-5-5 on the force transmission mechanism 2-5 of the two grinding mechanisms 2 are respectively connected to the second pipe port 3-1-1 and the third pipe port 3-1-2 through a hose; the fifth pipe port 4-4-2 on the two grippers 4 are connected to the fourth pipe port 3-4-1; the force transmission mechanism 2-5, the conversion mechanism 3, the grippers 4 and the connecting hose are filled with hydraulic oil.

[0046] Working principle: (e.g.) Figure 1 Combination Figure 9 During operation, the wafer 5 is placed between the two grippers 4. The spring force of the spring 4-1-1 pushes the slide bar 4-3, which in turn drives the grippers 4 to clamp the wafer 5 between the two grippers 4, preventing it from falling. (It should be noted that conventional clamping methods, after the clamping force is sufficient to support the wafer 5 and prevent it from falling off the grippers 4, will continue to increase the clamping force to prevent it from rotating during processing. Here, the clamping force provided by the spring 4-1-1 is only used to keep the wafer 5 from falling off the grippers 4.) Then, the threaded pin 4-2 is rotated to lock the slide bar 4-3 relative to the slide bar 4-1, maintaining the clamping state of the grippers 4 on the wafer 5, and at the same time providing support for the force to prevent the wafer 5 from rotating later.

[0047] Then, slide the slide bar 4-1 to the right relative to the slide rail 1-3, thereby causing the gripper 4 to move the wafer 5 to the processing tank 1-1, so that the wafer 5 is positioned between the upper and lower grinding mechanisms 2; (e.g. Figure 3Then, the polishing mechanism 2 is started. First, the pressure mechanism connected to the polishing mechanism 2 drives the sliding shaft 2-3 to slide towards the wafer 5, thereby causing the polishing disc 2-4 to apply a preset pressure to the end face of the wafer 5. Then, the motor 2-1 is started and drives the sliding shaft 2-3 to rotate through the rotating shaft 2-2. At this time, the sliding shaft 2-3 drives the arc-shaped cylinder 2-5-3 to rotate through the fixed rod 2-5-4, thereby causing the arc-shaped rod 2-5-2 to drive the polishing disc 2-4 to rotate. (When the arc-shaped cylinder 2-5-3 rotates, the hydraulic oil inside it will push the arc-shaped rod 2-5-2, thereby driving the polishing disc 2-4 to rotate. During this process, since the polishing disc 2-4 squeezes the wafer 5 and rotates relative to the wafer 5, the polishing disc 2-4 will be subjected to a certain friction force, and this friction force will squeeze the hydraulic oil in the arc-shaped cylinder 2-5-3 through the arc-shaped rod 2-5-2.) Furthermore, the hydraulic oil in the arc-shaped cylinder 2-5-3 has a tendency to be squeezed from the first pipe opening 2-5-5 into the first hydraulic tank 3-1.

[0048] At this time, the hydraulic oil in the upper and lower arc-shaped cylinders 2-5-3 tends to flow from their respective first pipe openings 2-5-5 through the second pipe openings 3-1-1 and the third pipe openings 3-1-2 at both ends of the first hydraulic tank 3-1 into the first hydraulic tank 3-1. Consequently, the two streams of hydraulic oil will respectively squeeze the sides of the slide plate 3-5 located in the middle of the first hydraulic tank 3-1. Finally, the squeezing forces on both sides of the slide plate 3-5 cancel each other out, and the combined force pushes the slide plate 3-5 to slide. During the sliding process of the slide plate 3-5, (as...) Figure 7 The portion located inside the second hydraulic tank 3-2 pushes the hydraulic oil within it, which in turn propels the sliding block 3-6 on the sliding side of the slide plate 3-5 forward. Simultaneously, the telescopic block 3-6-1 on the other sliding block 3-6 extends. (The slide plate 3-5, together with the second hydraulic tank 3-2, the third hydraulic tank 3-3, the fourth hydraulic tank 3-4, the partition 3-4-2, and the two sliding blocks 3-6, constitutes two independent cavities located on either side of the slide plate 3-5. When the slide plate 3-5 slides towards one side of the cavity, the volume of that cavity decreases, and the volume of the corresponding cavity on the other side increases.) Correspondingly, the sliding block 3-6 on one side slides forward to increase the cavity volume, while the telescopic block 3-6-1 on the other side of the sliding block 3-6 extends to decrease the volume, thereby offsetting the volume change caused by the sliding plate 3-5. It should be noted that when the sliding block 3-6 is in its initial position, it is also the limit position for backward sliding, that is, when the volume changes, the sliding block 3-6 cannot move backward and cannot offset the volume change by sliding backward. Furthermore, the hydraulic oil in the fourth hydraulic tank 3-4 located at the front end of the sliding block 3-6 is compressed (in conjunction with...). Figure 9The hydraulic oil flows from the fourth pipe port 3-4-1 through two fifth pipe ports 4-4-2 into the arc-shaped cavity 4-4-1 of the two grippers 4, thereby pushing the pressure plate 4-4-3. At this time, the elastic element at the connection of the pressure plate 4-4-3 generates elastic force, driving the pressure plate 4-4-3 to squeeze the hydraulic oil in the arc-shaped cavity 4-4-1, thereby generating pressure in the hydraulic oil. The pressure of the hydraulic oil drives the pressure head 4-4-5 to move outward from the clamping mechanism 4-4, thereby squeezing the wafer 5 and generating pressure on the sidewall of the wafer 5. Extrusion pressure is applied to prevent slippage of the wafer 5 during processing. Here, the elastic force generated by the movement of the pressure plate 4-4-3 is converted by the conversion mechanism 3 and combined with the resultant force applied to the slide plate 3-5 by the upper and lower force transmission mechanisms 2-5 to achieve mechanical balance. This ensures that the hydraulic oil in the arc-shaped cavity 4-4-1 has a force proportional to the resultant force on the slide plate 3-5 (the component forces applied to the slide plate 3-5 by the upper and lower force transmission mechanisms 2-5 are directly proportional to the frictional force between their corresponding grinding discs 2-4 and the wafer 5). The resultant force on the slide plate 3-5 is positively correlated with the resultant frictional force generated by the grinding disc 2-4 on the wafer 5. Furthermore, the hydraulic oil pressure in the arc cavity 4-4-1 is positively correlated with the resultant force on the wafer 5 during processing. As the pressure increases, the extrusion force of the pressure head 4-4-5 becomes positively correlated with the torque force on the wafer 5 (the torque force on the wafer 5 is the resultant frictional force generated by the grinding disc 2-4 on the wafer 5). This causes the clamping force on the wafer 5 to prevent rotation to increase with the increase of the torque force on the wafer 5. Consequently, the total clamping force on the wafer 5 can always be kept within a small range. This ensures that the wafer 5 can be processed normally while minimizing the probability of damage to the wafer 5 due to the clamping force during processing. Moreover, since the clamping force to prevent the wafer 5 from rotating increases with the increase of the torque force on the wafer 5 and is not affected by the radius of the wafer 5 itself, the equipment can process wafers 5 of different radii, making the equipment more versatile and saving equipment costs.

Claims

1. A gallium arsenide single crystal mechanical polishing device, comprising a support mechanism (1), characterized in that: It also includes a grinding mechanism (2), a conversion mechanism (3), and a gripper (4); the gripper (4) is slidably mounted on the upper end of the support mechanism (1); the grinding mechanism (2) is mounted in the middle of the support mechanism (1) and can provide real-time feedback on the magnitude of the torque force received during operation to the conversion mechanism (3); the conversion mechanism (3) is fixedly mounted on the support mechanism (1) and is connected to the grinding mechanism (2) and the gripper (4) respectively; the conversion mechanism (3) can dynamically adjust the gripping force of the gripper (4) by the magnitude of the torque force received by the grinding mechanism (2); The support mechanism (1) has slide rails (1-3) fixedly installed on both upper ends, and clamps (4) are symmetrically installed on the opposite surfaces of the two slide rails (1-3); The clamp (4) includes a slide rod one (4-1), which is slidably mounted on the slide rail (1-3). The slide rod one (4-1) is slidably connected to a slide rod two (4-3). A spring (4-1-1) is installed between the slide rod one (4-1) and the slide rod two (4-3). A threaded pin (4-2) is passed through the end of the slide rod one (4-1) near the slide rod two (4-3). The slide rod two (4-3) is fixedly connected to a clamping mechanism (4-4). The conversion mechanism (3) includes a first hydraulic tank (3-1), which is fixedly installed on the upper end of the slide rail (1-3). The two ends of the first hydraulic tank (3-1) are respectively fixedly connected to and connected to a second pipe port (3-1-1) and a third pipe port (3-1-2). A second hydraulic tank (3-2) is fixedly connected to the side of the first hydraulic tank (3-1). A first sliding groove is formed through the connecting wall of the first hydraulic tank (3-1) and the second hydraulic tank (3-2). 3-1-3), a second slide groove (3-1-4) is provided on the first slide groove (3-1-3), a slide plate (3-5) is slidably connected to the first slide groove (3-1-3), and sealing walls (3-5-1) are vertically provided on both sides of the slide plate (3-5). The sealing walls (3-5-1) are slidably connected to the second slide groove (3-1-4); the two ends of the slide plate (3-5) are slidably connected to the inner walls of the first hydraulic tank (3-1) and the second hydraulic tank (3-2) respectively. A third hydraulic tank (3-3) is fixedly connected to the upper end of the second hydraulic tank (3-2), and the third hydraulic tank (3-3) is connected to both ends of the second hydraulic tank (3-2); a fourth hydraulic tank (3-4) is vertically connected to the side wall of the third hydraulic tank (3-3), and the connection is through and connected. A partition (3-4-2) is fixedly installed in the middle of the fourth hydraulic tank (3-4). The partition (3-4-2) extends into the third hydraulic tank (3-3) and is fixedly connected to the inner wall of the third hydraulic tank (3-3). Sliding blocks (3-6) are slidably connected to both sides of the partition (3-4-2). A telescopic block (3-6-1) is slidably installed on one end of the sliding block (3-6) near the third hydraulic tank (3-3). The fourth hydraulic tank (3-4) is fixedly connected to and connected to a fourth pipe port (3-4-1) at the end away from the third hydraulic tank (3-3).

2. The gallium arsenide single crystal mechanical polishing equipment according to claim 1, characterized in that: The clamping mechanism (4-4) has an arc-shaped cavity (4-4-1) inside. A fifth pipe port (4-4-2) is fixedly connected to the outside of the clamping mechanism (4-4). The fifth pipe port (4-4-2) communicates with the arc-shaped cavity (4-4-1). On the side of the outer wall of the clamping mechanism (4-4) away from the slide rod (4-3), a plurality of pressure heads (4-4-5) are equidistantly and slidably installed. The pressure heads (4-4-5) communicate with the arc-shaped cavity (4-4-1). A pressure plate (4-4-3) is elastically and slidably connected to the side of the arc-shaped cavity (4-4-1) away from the pressure heads (4-4-5).

3. The gallium arsenide single crystal mechanical polishing equipment according to claim 2, characterized in that: The support mechanism (1) has a processing groove (1-1) in the middle position, and the processing groove (1-1) and the grinding mechanism (2) are at the same horizontal position.

4. The gallium arsenide single crystal mechanical polishing equipment according to claim 3, characterized in that: The support mechanism (1) has support frames (1-2) symmetrically fixedly installed at its upper and lower ends, and a grinding mechanism (2) is installed at the end of each support frame (1-2); the grinding mechanism (2) includes a motor (2-1), which is fixedly connected to the end of the support frame (1-2), and a rotating shaft (2-2) is rotatably installed near the end of the support mechanism (1) of the motor (2-1), a sliding shaft (2-3) is slidably connected to the rotating shaft (2-2), and a grinding disc (2-4) is rotatably connected to the sliding shaft (2-3); a pressure mechanism is externally connected between the rotating shaft (2-2) and the sliding shaft (2-3) to control the squeezing force of the sliding shaft (2-3) towards the grinding disc (2-4); The grinding mechanism (2) is equipped with a force transmission mechanism (2-5). The force transmission mechanism (2-5) includes a fixed rod (2-5-4). The fixed rod (2-5-4) is fixedly connected to the side wall of the sliding shaft (2-3). The fixed rod (2-5-4) is fixedly connected to an arc-shaped cylinder (2-5-3). One end of the arc-shaped cylinder (2-5-3) is fixedly installed with a first pipe opening (2-5-5), and the other end is slidably connected to an arc-shaped rod (2-5-2). The end of the arc-shaped rod (2-5-2) is fixedly connected to a fixed block (2-5-1). The fixed block (2-5-1) is fixedly connected to the grinding disc (2-4). The force transmission mechanisms (2-5) on the upper and lower grinding mechanisms (2) are symmetrical about the vertical plane.

5. The gallium arsenide single crystal mechanical polishing equipment according to claim 1, characterized in that: The first pipe port (2-5-5) on the force transmission mechanism (2-5) of the two grinding mechanisms (2) are connected to the second pipe port (3-1-1) and the third pipe port (3-1-2) respectively through hoses; the fifth pipe port (4-4-2) on the two grippers (4) are connected to the fourth pipe port (3-4-1); the force transmission mechanism (2-5), the conversion mechanism (3), the grippers (4) and the connecting hoses are filled with hydraulic oil.

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