Imprint mold for manufacturing a printed wiring board based on imprint technology and method for manufacturing the same

By using an improved semi-additive process (mSAP) to prepare imprinting molds, the problems of limited mold size, fragile materials, and complex manufacturing in existing technologies have been solved, enabling efficient and low-cost imprinting of large-size PCBs and improving the uniformity and stability of the circuit.

CN114506000BActive Publication Date: 2026-08-18SHANGHAI MEADVILLE SCI & TECH
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Patent Information

Application Number
CN202011289004.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-11-17
Publication Date
2026-08-18
Estimated Expiration
2040-11-17

AI Technical Summary

Technical Problem

Existing imprinting technology in the field of printed circuit boards suffers from problems such as limited template size, fragile materials, high production costs, low efficiency, and difficulty in controlling pattern complexity, making it difficult to meet the manufacturing needs of large-size PCBs.

Method used

An imprinting mold is prepared using a modified semi-additive process (mSAP). A pre-set metal plating layer is prepared on the substrate and an anti-sticking treatment is performed to form an anti-sticking layer. A nickel layer is plated on the copper template using a chemical nickel plating process. Combined with liquid phase deposition, a mesh self-assembled monolayer film is formed, which is suitable for imprinting on large-size PCB boards.

Benefits of technology

It improves the uniformity and steepness of lines with inconsistent dimensions and complex features, ensures the process stability of mass production, meets the hardness and tensile strength requirements in the PCB imprinting process, and reduces the complexity and cost of template manufacturing.

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Abstract

The application provides a stamping mold for manufacturing a printed circuit board based on a stamping technology and a preparation method thereof, the stamping mold is prepared based on an mSAP process in a PCB process, and the preparation method comprises the following steps: providing a substrate, preparing a to-be-stamped pattern layer on the substrate, preparing a preset metal plating layer on the to-be-stamped pattern layer, and preparing an anti-sticking treatment layer on the preset metal plating layer. The stamping mold is prepared by using an improved semi-additive process (mSAP), a preset metal plating layer is formed on the surface of the stamping mold, an anti-sticking treatment layer is formed by performing anti-sticking treatment on the preset metal plating layer, the stamping technology is applied to the manufacturing of the PCB, metal circuits are prepared through the PCB process, and the stamping mold is suitable for large-size PCBs. The uniformity of circuits with inconsistent complex feature sizes can be greatly improved, the steepness is high, the process stability is good, batch production can be ensured, and the requirements of hardness, tensile strength and the like of the mold in the PCB stamping process can be easily met.
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