Device and method for forming a conductive micro-pattern

By alternately ejecting the photocuring and volatile inks and controlling the photocuring process, the problem of difficulty in producing conductive micropatterns less than 20μm is solved in inkjet printing, and efficient and accurate micropattern formation is achieved.

CN115428596BActive Publication Date: 2025-07-04UNIJET
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Patent Information

Application Number
CN202180029463.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2020-04-20
Filing Date
2021-02-03
Publication Date
2025-07-04
Estimated Expiration
2041-02-03

AI Technical Summary

Technical Problem

The existing inkjet printing technology is difficult to quickly and at low cost to manufacture conductive micropatterns less than 20 μm, and there are accuracy problems caused by nozzle clogging and thermal expansion.

Method used

By using the inkjet printing method, the photocuring ink and the volatile ink containing tiny metal particles are alternately discharged on the substrate, and the curing process of the ink is controlled by using light energy to form a conductive micro pattern to prevent the spread of the photocuring ink, and the nozzle resistance is reduced using a helium atmosphere.

Benefits of technology

It realizes the rapid and simplified process manufacturing of conductive micro patterns less than 20 μm, which improves accuracy and thickness, avoids nozzle clogging, and is suitable for high-integration PCB manufacturing.

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Abstract

The present invention relates to an apparatus and method for forming a conductive micro-pattern, in which all processes are simplified using an inkjet printing method, and thus a substrate having a micro-pattern of less than 20 μm can be manufactured quickly. To this end, a method for forming a conductive micro-pattern according to the present invention forms a conductive micro-pattern on a substrate having the same surface energy by using an inkjet printing that prints ink along a path. The method for forming a conductive micro-pattern includes a droplet ejection process of simultaneously performing the following steps: discharging a photocurable ink at a front side of the path; discharging a volatile ink containing fine metal particles at a rear side of the path; and applying light energy to the discharged photocurable ink, wherein the light energy is configured to have a light intensity such that: the photocurable ink is semi-cured and ejected onto the substrate in a gel state, thereby forming a boundary with the liquid volatile ink ejected onto the substrate; and the photocurable ink is completely cured after the ejection of both the photocurable ink and the volatile ink is completed.
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