Jig for coating film with connecting portion

Abstract

The present disclosure provides a jig for coating, characterized by comprising: a loading portion having a first loading surface and a bottom surface intersecting the first loading surface, and a plurality of positioning grooves for placing microelectrodes being provided side by side on the first loading surface, the positioning grooves penetrating through the bottom surface along a direction parallel to the first loading surface; and a cover plate cooperating with the first loading surface of the loading portion to fix the microelectrodes located in the positioning grooves, wherein the microelectrodes have an exposed portion not in contact with the loading portion and the cover plate. According to the present disclosure, a jig for coating capable of both batch coating and improving the consistency of coating can be provided.

Description

[0001] This application is a divisional application of the patent application with application number 2019109448957, titled "Jig for coating film", and filed on September 30, 2019. TECHNICAL FIELD

[0002] The present disclosure relates to a jig for coating film. BACKGROUND

[0003] Common coating liquid phase coating techniques include brush coating, dip coating, and spray coating. Dip coating is a method in which a cleaned substrate is immersed in a prepared solution, and then the substrate is smoothly pulled out of the solution at a uniform speed controlled in advance. Under the action of viscosity and gravity, a uniform liquid film is formed on the surface of the substrate. With rapid evaporation of the solvent, the solution attached to the surface of the substrate quickly gels to form a gel film. Dip coating is a commonly used film preparation method. This method can be used to coat a uniform film on a base cloth substrate or a base film, and is widely used in sol-gel, solution, and suspension pull film formation.

[0004] Dip coating has been widely used because it has higher coating quality than brush coating and simpler and cheaper equipment than spray coating. However, there are some problems in batch film coating production, such as large differences in film coating of each part to be coated, and difficulty in ensuring the consistency of film coating. SUMMARY

[0005] The present disclosure was completed in view of the above-mentioned prior art, and aims to provide a jig for coating film that can batch coat and improve the consistency of film coating.

[0006] To this end, the present disclosure provides a jig for coating film, characterized by comprising: a loading portion having a first loading surface and a bottom surface intersecting the first loading surface, and a plurality of positioning grooves for placing microelectrodes are provided side by side on the first loading surface, the positioning grooves penetrating through the bottom surface in a direction parallel to the first loading surface; and a cover plate cooperating with the first loading surface of the loading portion to fix the microelectrodes located in the positioning grooves, wherein the microelectrodes have an exposed portion that does not contact the loading portion and the cover plate.

[0007] In the present disclosure, the loading part of the jig for coating has a plurality of positioning grooves for placing microelectrodes arranged side by side on the first loading surface. In this case, the jig can place a plurality of microelectrodes at the same time, and the positions of the microelectrodes fixed on the jig are consistent, so that the state of the microelectrodes before coating can be relatively consistent, thereby improving the consistency of coating. In addition, the jig has a cover plate matched with the first loading surface of the loading part, so that the microelectrodes can be better fixed, which is beneficial to improve the coating quality. Therefore, a jig for coating can be provided, which can batch coat and improve the consistency of coating.

[0008] In addition, in the jig related to the present disclosure, the jig further comprises a connecting part, and the loading part is mounted on the connecting part. In this case, it is beneficial to subsequently mount the jig on the coating machine through the connecting part.

[0009] In addition, in the jig related to the present disclosure, the loading part can be mounted on the connecting part by a fixing mechanism. In this case, the loading part can be better mounted on the connecting part.

[0010] In addition, in the jig related to the present disclosure, the fixing mechanism can be a clamping structure or a screwing structure. In this case, the loading part can be better fixed on the connecting part.

[0011] In addition, in the jig related to the present disclosure, the cover plate can be matched with the loading part by screw fixing or magnetic attraction. In this case, the cover plate can be better matched with the loading part, and the microelectrodes placed in the positioning grooves can be better fixed.

[0012] In addition, in the jig related to the present disclosure, the jig has a plurality of plate-shaped loading parts. In this case, the plate-shaped loading parts are beneficial to be fixed with the cover plate, so that more microelectrodes can be better fixed in the jig.

[0013] In addition, in the jig related to the present disclosure, the loading part further comprises a second loading surface parallel to the first loading surface, the bottom surface connects the first loading surface and the second loading surface, and the edge of the cover plate does not exceed the bottom surface. In this way, more microelectrodes can be fixed, and the interference of the microelectrodes during coating can be reduced, which is beneficial to improve the consistency of microelectrode coating.

[0014] In addition, in the jig related to the present disclosure, the jig further comprises a back plate matched with the second loading surface of the loading part, and the edge of the back plate does not exceed the bottom surface. In this case, the microelectrodes placed in the second loading surface can be better fixed.

[0015] In addition, in the jig according to the present disclosure, the cover plate can have a protrusion portion that cooperates with the positioning groove. Thus, the microelectrode can be fixed more securely.

[0016] In addition, in the jig according to the present disclosure, the cover plate and the back plate can have the same structure. Thus, more microelectrodes can be fixed more securely.

[0017] According to the present disclosure, a jig for coating can be provided that can coat in batches and improve the uniformity of the coating. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 A flowchart of a method of coating the surface of a microelectrode according to an example of the present disclosure is shown.

[0019] Figure 2 A perspective view of a dip-and-pull coater according to an example of the present disclosure is shown.

[0020] Figure 3 A schematic view of a dip-and-pull process according to an example of the present disclosure is shown.

[0021] Figure 4 A perspective view of a jig according to an example of the present disclosure is shown.

[0022] Figure 5 A partial view of a jig according to another example of the present disclosure is shown. DETAILED DESCRIPTION

[0023] Hereinafter, a preferred embodiment of the present disclosure will be described in detail with reference to the accompanying drawings. In the following description, the same parts are given the same reference numerals, and repetitive description will be omitted. In addition, the drawings are merely schematic views, and the proportions of the sizes of the parts with respect to each other or the shapes of the parts, etc. can differ from reality.

[0024] Figure 1 A flowchart of a method of coating the surface of a microelectrode according to an example of the present disclosure is shown. Figure 3 A schematic view of a dip-and-pull process according to an example of the present disclosure is shown.

[0025] As Figure 1As shown, the method for coating a microelectrode surface according to this embodiment may include: preparing a microelectrode to be coated (step S10); fixing the microelectrode (step S20); preparing a film solution and a crosslinking agent, mixing them to obtain a lifting liquid, the viscosity of which may be 0.1 to 20 cP (step S30); immersing and pulling the microelectrode from the lifting liquid in a predetermined procedure under a protective atmosphere, wherein the composition of the gas in the protective atmosphere is the same as the solvent of the film solution (step S40); and placing the microelectrode in a vacuum environment for curing (step S50).

[0026] In the microelectrode surface coating method of this embodiment, the microelectrode is fixed, and then a film solution of appropriate concentration is prepared and mixed with an appropriate amount of crosslinking agent to obtain a lifting liquid with a viscosity of 0.1 to 20 cP. The microelectrode is then immersed and lifted. During the immersion and lifting process, the lifting liquid is protected by an atmosphere, and the composition of the atmosphere is the same as the solvent of the film solution. Under these circumstances, the concentration of the film solution can be suppressed due to solvent evaporation by the atmosphere protection, thereby reducing the viscosity change of the lifting liquid and reducing the sagging effect. Therefore, the uniformity and consistency of the coating thickness of the film on the surface of the microelectrode can be improved. Thus, the film on the surface of the microelectrode has good consistency, uniform thickness and smooth appearance.

[0027] In this embodiment, the microelectrode can be coated with a film on its surface by dip-coating. For example... Figure 3 As shown, the dip-coating process can involve immersing the part to be coated into a solution and then pulling it out of the solution. Under the influence of viscosity and gravity, and with the evaporation of the solvent, the solution adhering to the surface of the part to be coated forms a thin film.

[0028] In this embodiment, the microelectrode to be coated can be prepared in step S10. Additionally, in some examples, the prepared microelectrode to be coated can be cleaned in step S10. In other examples, in step (a), the microelectrode can be cleaned with ethanol for 1 to 10 minutes, followed by cleaning with deionized water for 1 to 10 minutes. This removes foreign matter from the surface of the microelectrode, facilitating the formation of a smooth film. For example, the microelectrode can be cleaned with ethanol for 1 minute, followed by cleaning with deionized water for 5 minutes.

[0029] In some examples, the microelectrode can be cleaned with ethanol for 5 minutes, followed by rinsing with deionized water for 1 minute. In other examples, the microelectrode can be cleaned with ethanol for 10 minutes, followed by rinsing with deionized water for 10 minutes, and so on.

[0030] Furthermore, in this embodiment, the surface roughness of the microelectrode in step S10 can be from 0.01 μm to 10 μm. This facilitates the formation of a thin film of the lifting liquid on the microelectrode surface.

[0031] In some examples, the roughness of the microelectrode surface can be 0.01 pm. In other examples, the roughness of the microelectrode surface can be 10 pm. In addition, in some examples, the roughness of the microelectrode surface can be 0.05 pm, 0.1 pm, 0.5 pm, 1 pm, 2 pm, 3 pm, 4 pm, 5 pm, 6 pm, 7 pm, or 8 pm.

[0032] In the present embodiment, the material of the microelectrode is not particularly limited and can be selected according to actual needs. In some examples, the microelectrode can be made of a biologically safe material. In this way, it can be implanted or act on the human body.

[0033] In some examples, the microelectrode can be made of a metal material. In addition, in some examples, the microelectrode can be made of at least one of platinum, nickel, cobalt, titanium, tantalum, niobium, and zirconium. For example, the microelectrode can be made of metal platinum, metal niobium, or nickel-cobalt alloy, etc.

[0034] In the present embodiment, the shape of the microelectrode is not particularly limited and can be selected according to actual needs. For example, the microelectrode can be needle-shaped, flaky, etc.

[0035] In some examples, the microelectrode can be connected with a pad. In addition, in some examples, the pad can be circular or polygonal. In other examples, the size of the microelectrode and the pad can be inconsistent. For example, the pad can be wider than the microelectrode. In addition, the microelectrode and the pad can be integrally formed. In some examples, the microelectrode can be an electrode flake connected with a pad. In other examples, the microelectrode can include a pad.

[0036] In some examples, the microelectrode has an exposed portion that does not contact the loading portion 10 and the cover plate 20. In other examples, the exposed portion of the microelectrode can be the portion of the microelectrode on which the film is coated.

[0037] In addition, in the present embodiment, the microelectrode is fixed in step S20. Specifically, the microelectrode obtained in step S10 can be assembled to the film-coated jig 1 for fixation, and then the film-coated jig 1 is obtained.

[0038] Hereinafter, the jig 1 used in step 20 involved in the present embodiment will be described in detail in conjunction with the drawings.

[0039] Figure 2 A perspective view of the immersion and pulling plating film coater 2 involved in an example of the present disclosure is shown. Figure 4 A perspective view of the jig 1 involved in an example of the present disclosure is shown, wherein Figure 4 (a) shows a perspective view of the jig 1 involved in an example of the present disclosure,Figure 4 (b) shows a structural schematic diagram of the connecting part 30 involved in the example of the present disclosure, Figure 4 (c) shows a structural schematic diagram of the loading part 10 involved in the example of the present disclosure, Figure 4 (d) shows a structural schematic diagram of the cover plate 20 involved in the example of the present disclosure.

[0040] In the present embodiment, as shown in Figure 4 the film-coating jig 1 (hereinafter sometimes referred to as “jig 1”) can include a loading part 10 and a cover plate 20. In some examples, the loading part 10 has a first loading surface 11 and a bottom surface (not shown) intersecting the first loading surface 11. Among them, a plurality of positioning grooves 111 for fixing microelectrodes are arranged side by side on the first loading surface 11, and the positioning grooves 111 penetrate through the bottom surface along a direction parallel to the first loading surface 11. In addition, in some examples, the cover plate 20 cooperates with the first loading surface 11 of the loading part 10 to fix the microelectrodes located in the positioning grooves 111.

[0041] In the film-coating jig 1 involved in the present embodiment, the first loading surface 11 of the loading part 10 has a plurality of positioning grooves 111 for placing microelectrodes arranged side by side. In this case, the jig 1 can simultaneously place a plurality of microelectrodes, and the positions of the microelectrodes fixed on the jig 1 have consistency, so that the state of the microelectrodes before film coating can be relatively consistent, thereby improving the consistency of film coating. In addition, in some examples, the jig 1 has a cover plate 20 cooperating with the first loading surface 11 of the loading part 10. In this case, the microelectrodes can be better fixed, which is conducive to improving the film coating quality, thereby providing a film-coating jig 1 that can batch film coating and improve the consistency of film coating.

[0042] In addition, in some examples, the jig 1 can further include a connecting part 30. In addition, one end of the loading part 10 away from the positioning grooves 111 can cooperate with the connecting part 30. In this case, the jig 1 can be installed on a film coating machine through the connecting part 30, so that the film coating machine can control the jig 1 to perform film coating. In addition, the bottom surface of the loading part 10 is away from the connecting part 30.

[0043] In addition, in some examples, as shown in Figure 4 (b), the connecting part 30 can be a combined structure. In this case, the connecting part 30 can connect the film coating machine and fix the loading part 10 (to be described later). In addition, in some examples, the connecting part 30 can be combined by a flat plate. In this way, it is conducive to the connection of the connecting part 30 and the film coating machine. For example, in some examples, the connecting part 30 can be combined by a first flat plate 31 and a second flat plate 32.

[0044] In addition, in some examples, as shown in Figure 4As shown in (b), the first plate 31 can have the first fixing holes 311, and the second plate 32 can be fitted with the first fixing holes 311. In some examples, the first plate 31 and the second plate 32 can be fixed by screws. In other examples, the connecting portion 30 can be formed by a combination of a plate and a cylinder. In addition, in some examples, the connecting portion 30 can be integrally formed.

[0045] In some examples, the first plate 31 can have a plurality of first fixing holes 311. In addition, in some examples, the first plate 31 can have 2 to 10 first fixing holes 311. For example, the first plate 31 can have 2, 3, 4, 5, 6, 7, 8, 9, or 10 first fixing holes 311. In other examples, the plurality of first fixing holes 311 can be located on the same horizontal line.

[0046] In addition, in some examples, as shown in (b), the connecting portion 30 can have the grooves 321 fitted with the loading portion 10. In some examples, the connecting portion 30 can have a plurality of grooves 321 fitted with the loading portion 10. For example, the connecting portion 30 can have 2 to 8 grooves 321 fitted with the loading portion 10. In addition, in some examples, the connecting portion 30 can have 1, 2, 3, 4, 5, 6, 7, or 8 grooves 321. Figure 4 In addition, in some examples, the grooves 321 can have the second fixing holes 322 for fixing the loading portion 10, and the loading portion 10 can be fitted with the second fixing holes 322.

[0047] In some examples, the grooves 321 can have a plurality of second fixing holes 322. In addition, in some examples, the grooves 321 can have 2 to 10 second fixing holes 322. For example, the grooves 321 can have 2, 3, 4, 5, 6, 7, 8, 9, or 10 second fixing holes 322. In other examples, the plurality of second fixing holes 322 can be located on the same horizontal line.

[0048] In addition, in some examples, the loading portion 10 can be mounted to the connecting portion 30 by a fixing mechanism. In this case, the loading portion 10 can be well mounted to the connecting portion 30. In addition, in some examples, the fixing mechanism can be a snap-fit structure or a screwing structure. In this case, the loading portion 10 can be better fixed to the connecting portion 30. For example, in some examples, the loading portion 10 can be mounted to the connecting portion 30 by screws. In other examples, the loading portion 10 can be mounted to the connecting portion 30 by a snap-fit structure.

[0049]

[0050] ​In some examples, the connecting portion 30 can be fixed to the coating machine by screwing, by snap fitting, or by magnetic attraction. In this case, the jig 1 for coating can be fixed to the coating machine, so that the microelectrode can be well coated by the coating machine. In some examples, the coating machine can be a dip-and-pull coater 2 (see Figure 2 ). In some examples, the connecting portion 30 can be fixed to the dip-and-pull coater 2 by screwing. In other examples, the connecting portion 30 can be fixed to the dip-and-pull coater 2 by magnetic attraction.

[0051] In some examples, as shown in Figure 4 , the jig 1 can have a plurality of loading portions 10 in the form of plates. In this case, the plate-shaped loading portions 10 facilitate the fixing to the cover plate 20, so that more microelectrodes can be well fixed in the jig 1. In some examples, the jig 1 can have 2 to 12 loading portions 10. For example, the jig 1 can have 2, 4, 5, 6, 8, 10, or 12 loading portions 10. In other examples, the jig 1 can also have only one loading portion 10.

[0052] In some examples, the loading portion 10 can have a first loading surface 11. In some examples, the loading portion 10 can also have a bottom surface intersecting the first loading surface 11.

[0053] In some examples, as shown in Figure 4 (c), the loading portion 10 can have a positioning groove 111. In some examples, the loading portion 10 can be provided with a plurality of positioning grooves 111. As shown in Figure 4 (c), the first loading surface 11 can be provided with a plurality of positioning grooves 111. In other examples, the plurality of positioning grooves 111 can be arranged side by side on the first loading surface 11.

[0054] In some examples, the positioning groove 111 can be used to fix the microelectrode. In some examples, the microelectrode can be placed in the positioning groove 111. In other examples, the pad connected to the microelectrode can be placed in the positioning groove 111. Thus, the microelectrode can be fixed by fixing the pad.

[0055] In some examples, one loading portion 10 can have 2, 4, 6, 8, 10, 12, 14, 16, 18, 20, 22, or 24 positioning grooves 111. In other examples, one loading portion 10 can have one positioning groove 111.

[0056] In some examples, as shown in Figure 4(c) As shown, the positioning groove 111 can run through the bottom surface in a direction parallel to the first loading surface 11. In addition, in some examples, the positioning groove 111 can have a shape that matches the shape of the microelectrode. In other examples, the portion of the positioning groove 111 close to the bottom surface can be larger than the portion away from the bottom surface.

[0057] In addition, in some examples, the positioning groove 111 can have a shape and depth that are substantially the same as the contact portion of the microelectrode with the cover plate 20 and the loading portion 10. In this way, the microelectrode can be fixed more easily. In other examples, the positioning groove 111 can have a shape and depth that are slightly larger than the contact portion of the microelectrode with the cover plate 20 and the loading portion 10. In some examples, the positioning groove 111 can run in a direction perpendicular to the bottom surface.

[0058] In addition, in some examples, the loading portion 10 further includes a second loading surface (not shown) parallel to the first loading surface 11, and the bottom surface connects the first loading surface 11 and the second loading surface. The edge of the cover plate 20 (to be described later) does not exceed the bottom surface. In this way, more microelectrodes can be fixed, and the microelectrodes can be less disturbed during the coating process, which helps to improve the consistency of the microelectrode coating. In some examples, the edge of the cover plate 20 can be aligned with the bottom surface.

[0059] In addition, in some examples, the second loading surface is provided with a plurality of positioning grooves 111 for placing the microelectrodes side by side, similar to the first loading surface 11. For example, in some examples, the first loading surface 11 of the loading portion 10 can have 1, 2, 4, 6, 8, 10, 12, 14, or 16 positioning grooves 111, and the second loading surface of the loading portion 10 can have the same 1, 2, 4, 6, 8, 10, 12, 14, or 16 positioning grooves 111.

[0060] In addition, in some examples, the first loading surface 11 of the loading portion 10 can have the positioning grooves 111, and the second loading surface of the loading portion 10 can not have the positioning grooves 111. For example, the first loading surface 11 of the loading portion 10 can have 1, 3, 5, 7, 9, 11, 13, 15, or 16 positioning grooves 111, and the second loading surface of the loading portion 10 can not have the positioning grooves 111.

[0061] In addition, in some examples, the second loading surface of the loading portion 10 can have the positioning grooves 111, and the first loading surface 11 of the loading portion 10 can not have the positioning grooves 111. For example, the second loading surface of the loading portion 10 can have 1, 3, 5, 7, 9, 11, 13, 15, or 16 positioning grooves 111, and the first loading surface 11 of the loading portion 10 can not have the positioning grooves 111.

[0062] In addition, in some examples, the jig 1 can further include a back plate 40 that cooperates with the second loading surface of the loading portion 10, and the edge of the back plate 40 does not exceed the bottom surface. In this case, the microelectrode placed in the second loading surface can be well fixed. In some examples, the edge of the back plate 40 can be aligned with the bottom surface. In addition, in some examples, the cover plate 20 can have the same structure as the back plate 40. Thus, more microelectrodes can be better fixed.

[0063] In addition, in some examples, as shown in Figure 4 (c) and Figure 4 (d), the loading portion 10 can have a third type of fixing hole 12, and the cover plate 20 (to be described later) can have a fourth type of fixing hole 21 that cooperates with the third type of fixing hole 12. Thus, the cover plate 20 can be fixed to the loading portion 10.

[0064] In some examples, the loading portion 10 can have a plurality of third type of fixing holes 12. In addition, in some examples, the loading portion 10 can have 2 to 10 third type of fixing holes 12. For example, the loading portion 10 can have 2, 3, 4, 5, 6, 7, 8, 9, or 10 third type of fixing holes 12. In other examples, the plurality of third type of fixing holes 12 can be located on the same or different horizontal lines.

[0065] In some examples, the cover plate 20 can have a plurality of fourth type of fixing holes 21. In addition, in some examples, the cover plate 20 can have 2 to 10 fourth type of fixing holes 21. For example, the cover plate 20 can have 2, 3, 4, 5, 6, 7, 8, 9, or 10 fourth type of fixing holes 21. In other examples, the plurality of fourth type of fixing holes 21 can be located on the same or different horizontal lines.

[0066] In some examples, the cover plate 20 can cooperate with the loading portion 10. In other words, the third type of fixing hole 12 can cooperate with the fourth type of fixing hole 21. Thus, the cover plate 20 can be fixed to the loading portion 10. In addition, in some examples, the cover plate 20 can cooperate with the loading portion 10 by screw fixing or magnetic attraction. In this case, the cover plate 20 can well cooperate with the loading portion 10, and thus the microelectrode located in the positioning groove 111 can be well fixed. In other examples, the cover plate 20 can cooperate with the loading portion 10 by a clamping structure.

[0067] In some examples, the cover plate 20 can be engaged with the loading part 10 using screws. For example, the loading part 10 and the cover plate 20 can be fastened together via third-type fixing holes 12 and fourth-type fixing holes 21 using screws. In other examples, the cover plate 20 can be engaged with the loading part 10 using magnetic attraction. For example, the loading part 10 and the cover plate 20 can be secured together via third-type fixing holes 12 and fourth-type fixing holes 21 using magnets.

[0068] Additionally, in some examples, the cover plate 20 may mate with the first loading surface 11 of the loading portion 10 to secure the microelectrode located in the positioning groove 111. In some examples, the cover plate 20 may have a mating surface 22 that mates with the first loading surface 11.

[0069] Additionally, in some examples, the cover plate 20 may have a protrusion 221 that mates with the positioning groove 111. This allows for better fixation of the microelectrode. In some examples, the protrusion 221 may be provided on the mating surface 22 of the cover plate 20.

[0070] Additionally, in some examples, the protrusion 221 can be made of a flexible material. In this case, when the cover plate 20 engages with the positioning groove 111, the protrusion 221 can adaptably deform, thereby better securing the microelectrode. For example, in some examples, the protrusion 221 can be adhesive tape.

[0071] In some examples, the flexible material may be selected from at least one of silicone, rubber, poly(p-xylene), polyimide, polytetrafluoroethylene, and polyvinyl alcohol. This allows for further fixation of the microelectrode. For example, in some examples, the flexible material may be silicone. In other examples, the flexible material may be polyimide. Furthermore, in still other examples, the flexible material may be polyvinyl alcohol.

[0072] Additionally, in some examples, such as Figure 4 As shown in (d), the protrusion 221 on the cover plate 20 that mates with the positioning groove 111 can be continuous. For example, the cover plate 20 may have a strip of adhesive tape that mates with the positioning groove 111. In other examples, the protrusion 221 on the cover plate 20 that mates with the positioning groove 111 can be discontinuous. For example, the cover plate 20 may have a silicone pad only at the position corresponding to the positioning groove 111.

[0073] In some examples, fixture 1 may not include connecting part 30, and loading part 10 may be directly fixed to dip-coating machine 2 by magnetic attraction.

[0074] Figure 5 A partial schematic diagram of fixture 1, as described in another example of this disclosure, is shown. Figure 5(a) shows a structural schematic view of a loading portion 10A related to another example of the present disclosure, Figure 5 (b) shows a structural schematic view of a cover plate 20A related to another example of the present disclosure.

[0075] In other examples, as shown in Figure 5 The jig 1 can include the loading portion 10A and the cover plate 20A. In some examples, the jig 1 can include the loading portion 10A without the positioning slot 111 and the cover plate 20A without the protruding portion 221. In addition, in some examples, the cover plate 20A and the loading portion 10A can be fixed by magnetic attraction or screw fixation.

[0076] In some examples, as shown in Figure 5 (a), the loading portion 10A can include the first type of limiting hole 13. In addition, in some examples, as shown in Figure 5 (b), the cover plate 20A can include the second type of limiting hole 23.

[0077] In some examples, the loading portion 10A can include a plurality of first type of limiting holes 13, and the cover plate 20A can include a plurality of second type of limiting holes 23. In addition, in some examples, the first type of limiting hole 13 can cooperate with the second type of limiting hole 23. Thus, it can be used to assist in fixing the microelectrode.

[0078] In some examples, the microelectrode can have a through hole cooperating with the first type of limiting hole 13 and the second type of limiting hole 23. In other examples, the microelectrode can have a plurality of through holes. That is, each microelectrode can have a plurality of through holes.

[0079] In some examples, the microelectrode can have 2 to 5 through holes. For example, the microelectrode can have 2, 3, 4, or 5 through holes. In addition, in some examples, the microelectrode can have 1 through hole.

[0080] In other examples, the pad can have a through hole cooperating with the first type of limiting hole 13 and the second type of limiting hole 23. In this case, if the pad is placed in the positioning slot 111, the pad can cooperate with the first type of limiting hole 13 and the second type of limiting hole 23 to fix the pad, thereby fixing the microelectrode. In addition, in some examples, the pad can have a plurality of through holes. That is, each pad can have a plurality of through holes.

[0081] In other examples, the pad can have 2 to 5 through holes. For example, the pad can have 2, 3, 4, or 5 through holes. In addition, in some examples, the pad can have 1 through hole.

[0082] In some examples, the jig 1 can include a plurality of limit posts (not shown). In other examples, the limit posts can be cylindrical or prismatic. In addition, the limit posts can have a diameter slightly smaller than the first limit holes 13 and the second limit holes 23.

[0083] In some examples, the limit posts can pass through the first limit holes 13, the second limit holes 23, and the through holes. In addition, in some examples, the microelectrodes can be mounted on the jig 1 through the first limit holes 13, the second limit holes 23, the through holes, and the limit posts.

[0084] In some examples, each limit post can pass through both the first limit holes 13 and the second limit holes 23 to fix the microelectrodes. In other examples, each limit post can pass through only a portion of the first limit holes 13 and a portion of the second limit holes 23 to fix the microelectrodes.

[0085] In addition, in some examples, the jig 1 can further have a pressing plate (not shown). In addition, the pressing plate can have the same structure as the cover plate 20A. For example, the pressing plate can have third limit holes (not shown) that cooperate with the first limit holes 13. In addition, the pressing plate can cooperate with the second surface of the loading portion 10A.

[0086] In some examples, each limit post can pass through the first limit holes 13, the second limit holes 23, and the third limit holes to fix two microelectrodes. In other examples, each limit post can pass through the first limit holes 13 and extend partially into the second limit holes 23 and the third limit holes to fix two microelectrodes.

[0087] In addition, in some examples, in the cooperating first limit holes 13, second limit holes 23, and third limit holes, one limit post can pass through the first limit holes 13 and extend partially into the second limit holes 23 to fix a microelectrode, and another limit post can pass through the first limit holes 13 and extend partially into the third limit holes to fix another microelectrode.

[0088] In addition, in some examples, the jig 1 can fix 1 to 200 microelectrodes. In this case, it is possible to facilitate subsequent simultaneous batch coating of a plurality of microelectrodes, and to make the pre-coating state of the microelectrodes within and between batches relatively uniform, thereby making the consistency of the thin film formed by the microelectrodes within and between batches good.

[0089] In addition, in the present embodiment, in step S20, each microelectrode can be fixed at a substantially uniform position in the jig 1. In this case, it is possible to improve the uniformity of the clamping of each microelectrode before coating, and further to make the state of each microelectrode uniform each time it is coated.

[0090] In some examples, the film solution can be prepared in step S30. Specifically, in step S30, the film solution can be prepared by dissolving a solute in a solvent. In addition, the concentration of the film solution can be 1 mg / ml to 150 mg / ml. Thereby, the film solution having a suitable viscosity can be selected as needed.

[0091] In some examples, the concentration of the film solution can be 64 mg / ml. In other examples, the concentration of the film solution can be 150 mg / ml. In addition, in some examples, the concentration of the film solution can be 1 mg / ml, 5 mg / ml, 10 mg / ml, 20 mg / ml, 40 mg / ml, 60 mg / ml, 70 mg / ml, 80 mg / ml, 100 mg / ml, 120 mg / ml, or 140 mg / ml.

[0092] In addition, in the present embodiment, in step S30, the solute of the film solution can be selected from at least one of poly 4-vinylpyridine (P4VP), poly 4-vinylpyridine-SO3 (P4VP-SO3), polyvinylpyrrolidone (PVP), polyurethane (PU), polypropylene (PP), polyethylene oxide (PEO), polyvinyl alcohol (PVA), polyacrylate (PEA), and polyacrylic acid (PAA). In this case, the film solution can have one or more different solutes, whereby different solutes can be selected as needed.

[0093] In some examples, the solute of the film solution can be poly 4-vinylpyridine-SO3. In other examples, the solute of the film solution can be polyethylene oxide. In addition, in yet other examples, the solute of the film solution can be polyvinylpyrrolidone.

[0094] In addition, in the present embodiment, in step S30, the solvent can be selected from ethanol, water, and thereby, the solute can be well dissolved to form the film solution. In addition, since the solvent is volatile, the generation of an atmosphere for protection can be facilitated, and the drying of the thin film can be facilitated. For example, in some examples, the solvent can be ethanol. In other examples, the solvent can be tetrahydrofuran. In addition, in some examples, the solvent can be a mixture of ethanol and water.

[0095] In the present embodiment, the cross-linking agent can be mixed with the film solution to obtain a pulling solution in step S30. Specifically, in step S30, the pulling solution can be formed by mixing the cross-linking agent added to the prepared film solution. In addition, the viscosity of the pulling solution can be 0.1 to 20 cP. Thereby, the thin film can be formed on the surface of the microelectrode.

[0096] In some examples, the pulling solution can have a viscosity of 0.1 cP. In other examples, the pulling solution can have a viscosity of 20 cP. In addition, in some examples, the pulling solution can have a viscosity of 0.2 cP, 0.5 cP, 1 cP, 2 cP, 5 cP, 8 cP, 10 cP, 12 cP, 15 cP, or 18 cP.

[0097] In addition, in some examples, in step S30, the component of the cross-linking agent can be selected from at least one of polyethylene glycol dimethyl ether, polyethylene glycol, boric acid, adipic acid dihydrazide, polyacrylic amine, and polyisocyanate. Thereby, the tensile strength, water resistance, and viscosity of the thin film can be improved. For example, in some examples, the component of the cross-linking agent can be polyethylene glycol dimethyl ether. In other examples, the component of the cross-linking agent can be adipic acid dihydrazide. In addition, in yet other examples, the component of the cross-linking agent can be polyethylene glycol.

[0098] In addition, in the present embodiment, in step S30, the amount of the cross-linking agent added to the pulling solution can be 1 mg / ml to 25 mg / ml. Thereby, the tensile strength and water resistance of the thin film can be improved, and a pulling solution with a suitable viscosity can be formed. For example, in some examples, the amount of the cross-linking agent added can be 6 mg / ml. In other examples, the amount of the cross-linking agent added can be 25 mg / ml. In addition, in yet other examples, the amount of the cross-linking agent added can be 1 mg / ml, 2 mg / ml, 5 mg / ml, 7 mg / ml, 10 mg / ml, 12 mg / ml, 15 mg / ml, 20 mg / ml, or 22 mg / ml.

[0099] In addition, in some examples, the cross-linking agent can be a solid. In other examples, the cross-linking agent can be a cross-linking agent solution. In some examples, the solvent of the cross-linking agent solution can be the same as the solvent of the film solution.

[0100] In some examples, in step S40, the microelectrode can be immersed and pulled under an atmosphere protection. In addition, in some examples, in step S40, the microelectrode can be immersed and pulled out of the pulling solution in a predetermined procedure under an atmosphere protection.

[0101] In addition, in some examples, in step S40, the predetermined procedure can include immersing the microelectrode into the pulling solution at an immersion rate of 2 mm / s to 8 mm / s, immersing for 1 s to 60 s, and then pulling the microelectrode out of the pulling solution at a pulling rate of 2 mm / s to 8 mm / s. Thereby, a thin film with a certain thickness can be formed on the surface of the microelectrode.

[0102] In some examples, the immersion rate, the pulling rate, and the immersing time can affect the thickness of the thin film. In addition, in some examples, a suitable immersion rate, a suitable pulling rate, and a suitable immersing time can be selected according to actual needs.

[0103] In some examples, the predetermined procedure can comprise immersing the microelectrode into the pulling solution at an immersion rate of 6 mm / s for an immersion time of 5 s, followed by withdrawing the microelectrode from the pulling solution at a withdrawal rate of 6 mm / s.

[0104] In some examples, the parameters of the pulling step can be: a lowering rate of 4 mm / s, a withdrawal rate of 4 mm / s, and an immersion time of 8 s. In addition, in some examples, the parameters of the pulling step can be: a lowering rate of 5 mm / s, a withdrawal rate of 5 mm / s, and an immersion time of 12 s. In yet other examples, the parameters of the pulling step can be: a lowering rate of 7 mm / s, a withdrawal rate of 7 mm / s, and an immersion time of 15 s.

[0105] In some examples, in step S40, the predetermined procedure can further comprise repeating the pulling step at least once. In this way, a multi-layer film can be formed, so that the surface of the microelectrode is smoother and the performance is more stable. In addition, in some examples, when the number of repetitions is greater than 5, the withdrawal rate in the pulling step can be reduced from the 6th time onwards. In this case, since the uniformity of the coating film decreases as the withdrawal rate increases, on the basis of the multi-layer film, the film formed on the surface of the microelectrode can be made more uniform by reducing the withdrawal rate, i.e. the consistency of the film on the microelectrode can be improved.

[0106] In some examples, in the predetermined procedure, the pulling step can be repeated 1 to 30 times. For example, the pulling step can be repeated 1, 5, 6, 8, 10, 12, 15, 20, 25, or 30 times, etc. In some examples, the number of repetitions can be selected according to the desired thickness of the surface of the microelectrode.

[0107] In some examples, when the pulling step is repeated 1 to 5 times, the microelectrode can be immersed into the pulling solution at an immersion rate of 6 mm / s for an immersion time of 5 s, followed by withdrawing the microelectrode from the pulling solution at a withdrawal rate of 6 mm / s; when the pulling step is repeated 6 to 10 times, the microelectrode can be immersed into the pulling solution at an immersion rate of 6 mm / s for an immersion time of 5 s, followed by withdrawing the microelectrode from the pulling solution at a withdrawal rate of 3 mm / s.

[0108] In some examples, when the pulling step is repeated 1 to 5 times, the microelectrode can be immersed into the pulling solution at an immersion rate of 8 mm / s for an immersion time of 4 s, followed by withdrawing the microelectrode from the pulling solution at a withdrawal rate of 6 mm / s; when the pulling step is repeated 6 to 15 times, the microelectrode can be immersed into the pulling solution at an immersion rate of 6 mm / s for an immersion time of 4 s, followed by withdrawing the microelectrode from the pulling solution at a withdrawal rate of 2 mm / s.

[0109] In some examples, the parameters of the pulling step can be adjusted according to actual needs from the 6th time when the number of repetitions is greater than 5. For example, the immersion rate can be increased, the immersion time can be extended, and the like.

[0110] In addition, in some examples, the predetermined procedure can be performed by the dip-pulling plating machine 2 in step S40. Thus, the dip-pulling can be performed well. In addition, in some examples, the dip-pulling plating machine 2 can have a device that forms an atmosphere protection. Thus, step S40 can be performed in the atmosphere protection. For example, in some examples, the dip-pulling plating machine 2 can have a cavity in which the dip-pulling can be performed in a sealable manner.

[0111] In addition, in some examples, in step S40, the fixing of the microelectrodes to be plated in the dip-pulling plating machine 2 can be included. In this case, the dip-pulling can be performed better for a batch of microelectrodes.

[0112] In addition, in some examples, in step S40, the pulling solution prepared in step S30 can be placed in the cavity of the dip-pulling plating machine 2 in which the dip-pulling can be performed in a sealable manner. In addition, in some examples, the pulling solution can be placed in the dip-pulling plating machine 2 only in one container, in which case all the microelectrodes fixed in the jig 1 can be subjected to the dip-pulling in the pulling solution in the one container. In other examples, the pulling solution can be placed in the dip-pulling plating machine 2 only in a plurality of containers, in which case each row (or column) of the microelectrodes fixed in the jig 1 can be subjected to the dip-pulling in the pulling solution in one container, or each microelectrode fixed in the jig 1 can be subjected to the dip-pulling in the pulling solution in a corresponding container.

[0113] In addition, in some examples, in step S40, the composition of the gas in the atmosphere protection can be the same as the solvent of the film solution. In this case, the concentration of the film solution due to the volatilization of the solvent can be suppressed, i.e., the change in the concentration of the pulling solution during the dip-pulling can be reduced. For example, in some examples, the solvent can be ethanol, and the composition of the atmosphere can be ethanol.

[0114] In addition, in the present embodiment, in step S40, the saturation of the gas can be 90% to 100%. In this case, the gas can effectively suppress the volatilization of the solution, and thus the concentration of the pulling solution during the dip-pulling can be maintained.

[0115] In addition, in some examples, preferably, the saturation of the atmosphere can be 90%; more preferably, the saturation of the atmosphere can be 95%; more preferably, the saturation of the atmosphere can be 96%; more preferably, the saturation of the atmosphere can be 97%; more preferably, the saturation of the atmosphere can be 98%; more preferably, the saturation of the atmosphere can be 99%; more preferably, the saturation of the atmosphere can be 99.5%; more preferably, the saturation of the atmosphere can be 99.8%; more preferably, the saturation of the atmosphere can be 99.9%; most preferably, the saturation of the atmosphere can be 100%.

[0116] In the present embodiment, the microelectrode can be cured in a vacuum environment in step S50. Thus, the thin film can be less likely to be contaminated. In addition, in some examples, the microelectrode can be cured in a vacuum environment for 20 to 30 hours in step S50. Thus, the thin film can be better condensed on the surface of the microelectrode.

[0117] In some examples, the microelectrode can be cured in a vacuum environment for 24 hours. In other examples, the microelectrode can be cured in a vacuum environment for 22 hours. In yet other examples, the microelectrode can be cured in a vacuum environment for 26 hours. In addition, in some examples, the vacuum environment can be a vacuum box, a vacuum room, or the like.

[0118] In addition, in the present embodiment, the thickness of the thin film after the completion of the plating on the surface of the microelectrode can be 50 nm to 50 μm. For example, in some examples, the thickness of the thin film after the completion of the plating on the surface of the microelectrode can be 50 μm. In other examples, the thickness of the thin film after the completion of the plating on the surface of the microelectrode can be 50 nm. In yet other examples, the thickness of the thin film after the completion of the plating on the surface of the microelectrode can be 100 nm, 500 nm, 800 nm, 1 μm, 2 μm, 5 μm, 10 μm, 20 μm, 30 μm, 40 μm, or 45 μm.

[0119] According to the present disclosure, a jig for plating that can both batch plating and improve the consistency of plating can be provided.

[0120] Although the present disclosure has been specifically described above with reference to the drawings and embodiments, it will be appreciated that the above description is not intended to limit the present disclosure in any form. Those skilled in the art can modify and change the present disclosure as needed without departing from the spirit and scope of the present disclosure, and such modifications and changes fall within the scope of the present disclosure.

Claims

1.A jig for coating film having a connecting portion, comprising: a loading portion having a first loading surface and a bottom surface intersecting the first loading surface, and a plurality of positioning grooves arranged side by side on the first loading surface and used for placing microelectrodes, the positioning grooves penetrating through the bottom surface along a direction parallel to the first loading surface; a cover plate cooperating with the first loading surface of the loading portion to fix the microelectrodes located in the positioning grooves, the cover plate having protrusions cooperating with the positioning grooves; and a connecting portion cooperating with an end of the loading portion distal from the positioning grooves and used for fixing the loading portion and a coating film machine, wherein the microelectrodes have exposed portions not in contact with the loading portion and the cover plate. 2.The jig of claim 1, wherein the connecting portion comprises a first flat plate having first type fixing holes and a second flat plate cooperating with the first type fixing holes. 3.The jig of claim 1, wherein the connecting portion has a groove cooperating with the loading portion, the groove having second type fixing holes used for fixing the loading portion, and the loading portion cooperating with the second type fixing holes. 4.The jig of claim 3, wherein the loading portion is installed on the connecting portion by a fixing mechanism, the fixing mechanism being a snap-fit structure or a screwing structure. 5.The jig of claim 1, wherein the connecting portion is fixed to the coating film machine by a screwing method, a snap-fit method or a magnetic attraction method. 6.The jig of claim 1, wherein the cover plate and the loading portion are fixed to each other by a magnetic attraction method or a screwing method. 7.The jig of claim 1, wherein the loading portion comprises first type limiting holes, the cover plate comprises second type limiting holes cooperating with the first type limiting holes, the microelectrodes have through holes cooperating with the first type limiting holes and the second type limiting holes, and the jig further comprises a limiting column which can penetrate through the first type limiting holes, the second type limiting holes and the through holes. 8.The jig of claim 1, wherein the loading portion further comprises a bottom surface intersecting the first loading surface, and an edge of the cover plate does not exceed the bottom surface. 9.The jig of claim 8, wherein the loading portion further comprises a second loading surface parallel to the first loading surface, the bottom surface connecting the first loading surface and the second loading surface, and the jig further comprises a back plate cooperating with the second loading surface, an edge of the back plate does not exceed the bottom surface. 10.The jig of claim 1, wherein the coating film machine is an immersion and pulling plating machine. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​

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