Methods for creating SMT carrier markings and SMT carriers

Abstract

This application relates to the field of circuit board manufacturing technology, and discloses a method for manufacturing SMT carrier markings and an SMT carrier. The method for manufacturing SMT carrier markings includes: providing an SMT carrier with a marking area; performing an oxidation treatment on the SMT carrier to cover its surface with an oxide layer; using a first laser to engrave the oxide layer within the marking area, making the marking area white; and using a second laser to further engrave the oxide layer within the marking area to form a marking, which is black. The above-described method for manufacturing SMT carrier markings optimizes the structure of the prepared markings, creating a strong contrast between the marking and the background color of the marking area, making them easily identifiable; furthermore, the white background color of the marking area reflects radiation and lowers the surface temperature of the carrier, making it less prone to discoloration and improving recognition speed. The markings prepared by this application have strong anti-aging properties, increased strength and hardness, and are less prone to wear.

Description

Technical Field

[0001] This application relates to the field of circuit board manufacturing, and more particularly to a method for manufacturing SMT carrier markings and an SMT carrier. Background Technology

[0002] Because the electronics assembly industry requires traceability of product manufacturing conditions and tools, the carriers and fixtures used in the production process need to be monitored throughout and tracked with the corresponding products. This involves tracking the quality stability of products manufactured using different carriers and quickly tracing the working conditions and fixtures of defective products. Carriers are reused multiple times during processing, undergoing repeated high-temperature heating and cooling in a reflow oven, and flux from the solder paste can also remain on the carriers. Therefore, after multiple uses, markings such as QR codes on the carriers are prone to oxidation or contamination, rendering them unreadable. Summary of the Invention

[0003] The purpose of this application is to provide a method for manufacturing SMT carrier markings and an SMT carrier, in order to solve the technical problem that markings on related products cannot be scanned and identified due to oxidation or contamination after repeated use.

[0004] To address the aforementioned problems, in a first aspect, this application provides a method for manufacturing SMT carrier markings, used to create markings on SMT carriers, the method comprising:

[0005] An SMT carrier is provided, the SMT carrier having an identification area;

[0006] The SMT carrier is subjected to an oxidation treatment to cover the surface of the SMT carrier with an oxide layer;

[0007] The oxide layer within the marking area is engraved using a first laser, making the marking area appear white;

[0008] The oxide layer within the marking area is re-engraved using a second laser to form a black marking.

[0009] In one embodiment, the fabrication method further includes, prior to oxidizing the SMT carrier:

[0010] A groove is prepared in the marking area.

[0011] In one embodiment, the depth of the groove is 0.4 mm to 0.6 mm.

[0012] In one embodiment, after re-engraving the oxide layer within the marking area using a second laser to form the marking, the method further includes:

[0013] The identification is scanned using a scanning device to obtain identification information, and the identification information is then entered into the production management system.

[0014] In one embodiment, the oxidation process is anodic oxidation.

[0015] In one embodiment, the ratio of the thickness of the oxide layer to the engraving depth of the first laser engraving is 2:1 to 4:1, and the ratio of the thickness of the oxide layer to the engraving depth of the second laser engraving is 2:1 to 4:1.

[0016] In one embodiment, the thickness of the oxide layer is 20 μm to 30 μm, the engraving depth of the first laser engraving is 5 μm to 15 μm, and the engraving depth of the second laser engraving is 8 μm to 12 μm.

[0017] In one embodiment, the first laser is an ultraviolet laser and the second laser is an infrared laser.

[0018] The aforementioned method for manufacturing SMT carrier markings optimizes the resulting marking structure. First, an oxide layer is prepared on the SMT carrier. Then, a first laser engraving is used to make the marking area white, followed by a second laser engraving to form a black marking. This creates a strong contrast between the marking and the background color, making it easily identifiable. Secondly, the white background reflects radiation and lowers the surface temperature of the carrier, reducing discoloration and improving recognition speed. Furthermore, compared to traditional inkjet printing, the markings produced in this application have stronger anti-aging properties, greater strength and hardness, and are less prone to wear. This effectively solves the technical problem in existing technologies where markings on related products become unreadable after repeated use due to oxidation or contamination.

[0019] An embodiment of the second aspect of this application provides an SMT carrier, the SMT carrier including an identification area and the identification area having an SMT carrier identifier, the SMT carrier identifier being prepared using the SMT carrier identifier manufacturing method described in any embodiment of the first aspect, the surface of the identification area being white, and the identifier being black.

[0020] In one embodiment, the marking area has a groove, and the marking is located at the bottom of the groove.

[0021] The aforementioned SMT carrier features black markings against a white background, creating a strong contrast that enhances visibility. Secondly, the white background reflects radiation and lowers the carrier's surface temperature, reducing discoloration and improving readability. Furthermore, compared to traditional inkjet printing, the markings produced in this application exhibit stronger anti-aging properties, greater strength and hardness, and are less prone to wear. This effectively solves the technical problem in existing technologies where markings on related products become unreadable after repeated use due to oxidation or contamination. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 A top view of the SMT carrier and printed circuit board provided in an embodiment of this application;

[0024] Figure 2 for Figure 1 A schematic diagram of the printed circuit board from another angle;

[0025] Figure 3 A flowchart illustrating the method for creating an SMT carrier identifier as provided in this application embodiment.

[0026] Explanation of key component symbols:

[0027] 100. SMT vehicle;

[0028] 10. Signage Area; 20. Product Area;

[0029] 200. Printed circuit boards;

[0030] 31. Zone 1; 32. Zone 2. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0032] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly or indirectly attached to that other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are for descriptive convenience only, not indicating or implying that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the patent. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0033] In this specification, references to "one embodiment," "some embodiments," or simply "embodiment" mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. Furthermore, in one or more embodiments, specific features, structures, or characteristics may be combined in any suitable manner.

[0034] The first aspect of this application proposes a method for manufacturing SMT carrier markings, which are used to create markings on SMT carriers so that the markings on the SMT carriers remain clear and easily scanned after multiple reflow oven cycles, thereby achieving the ability to simultaneously track the product, carrier, and cover plate during the manufacturing process.

[0035] The markings on the SMT carrier can be QR codes or barcodes. This application uses QR codes as an example. According to product requirements, the product board edge code, the SMT carrier QR code, and the steel cover plate QR code must be combined into one code to facilitate the production management system in recording product classification during the production process.

[0036] Please refer to Figures 1 to 3 In one embodiment of this application, the method for creating an SMT carrier identifier includes:

[0037] Step S10: Provide an SMT carrier 100, which has an identification area 10.

[0038] Specifically, based on the dimensions and specifications of the SMT carrier 100, the SMT carrier 100 is manufactured into a finished product. The SMT carrier 100 has a product area 20 for placing printed circuit boards 200, and the printed circuit boards 200 are fixed within the product area 20 to prevent misalignment. The marking area 10 is for laser marking and is located in an empty space away from the product area 20; for example, the marking area 10 is located at the edge of the SMT carrier 100.

[0039] Step S20: Oxidize the SMT carrier 100 to cover the surface of the SMT carrier 100 with an oxide layer.

[0040] The SMT carrier 100 is made of synthetic stone. Oxidizing the surface of the SMT carrier 100 not only prevents oxidation but also enhances its wear resistance. Before oxidizing the SMT carrier 100, it needs to undergo pretreatment, including processes such as washing, degreasing, and pickling, to remove impurities from its surface. This ensures good adhesion between the subsequent oxide layer and the SMT carrier 100 and prevents contamination of the PCB board. Specifically, the oxide layer can be prepared through anodizing, magnetron sputtering, or vapor deposition. The oxide layer is a dark, dense aluminum oxide film with high hardness and is not easily melted at high temperatures.

[0041] Step S30: Use the first laser to engrave the oxide layer in the marking area 10 to make the marking area 10 white.

[0042] Specifically, the oxide layer forms a white surface under the action of the first laser, meaning that the first laser ablates a certain thickness of oxide layer within the marking area 10. Because white reflects radiation, the surface temperature of the vehicle is lower, making it less prone to discoloration.

[0043] In step S40, the oxide layer in the marking area 10 is engraved again using a second laser to form a marking, which is black.

[0044] Specifically, when the marking area 10 is re-engraved using the second laser, a portion of the oxide layer is removed again under the action of the second laser. It can be understood that by adjusting the output energy intensity of the second laser, only a portion of the oxide layer is melted and removed without burning the SMT carrier 100. Furthermore, since the marking is black, the black marking contrasts strongly with the white background within the marking area 10, making it easier to identify. Compared to the disadvantage of traditional inkjet printing, which is prone to wear, the markings produced by the SMT carrier marking method of this application have strong anti-aging properties, increased strength and hardness, and are less prone to discoloration even after repeated high-temperature exposures.

[0045] The above-described method for manufacturing SMT carrier markings optimizes the marking structure. First, an oxide layer is prepared on the SMT carrier 100. Then, a first laser engraving is used to make the marking area 10 white. A second laser engraving is then used to form a black marking, creating a strong contrast between the marking and the background color of the marking area 10, making it easy to identify. Secondly, the white background of the marking area 10 reflects radiation and lowers the surface temperature of the carrier, making it less prone to discoloration and improving recognition speed. Furthermore, compared to traditional inkjet printing, the markings prepared in this application have stronger anti-aging properties, greater strength and hardness, and are less prone to wear, effectively solving the technical problem in the prior art where markings on related products become unreadable due to oxidation or contamination after repeated use.

[0046] In one embodiment of this application, before step S20, which involves oxidizing the SMT carrier 100, the manufacturing method further includes:

[0047] A groove is prepared in the marking area 10.

[0048] Specifically, the groove can be square. The SMT carrier 100 is positioned on a CNC milling machine, and a groove is milled in the marking area 10 using a milling cutter. The groove has dimensions of 14mm x 14mm and a depth of 0.5mm; that is, the bottom wall of the groove is square, and the edges of the groove must be flat. In this way, the subsequently prepared markings are located within the groove, preventing the squeegee from directly contacting the markings during solder paste printing. This prevents the markings from becoming blurred due to repeated friction between the squeegee and the markings during solder paste printing. It is understood that the dimensions of the groove can also be other than those in other embodiments of this application, and are not limited here.

[0049] In one embodiment of this application, the depth of the groove is 0.5 mm.

[0050] In other embodiments of this application, the depth of the groove can also be any value within the range of 0.4mm to 0.6mm, and is not limited thereto. On the one hand, the groove has sufficient depth to facilitate the subsequent preparation of the mark to be completely contained within the groove, and the mark not protruding from the groove can reduce wear caused by excessive friction between the mark and foreign objects; on the other hand, a groove depth of 0.4mm to 0.6mm relative to the thickness of the SMT carrier 100 itself will not affect the mechanical strength of the SMT carrier 100.

[0051] In one embodiment of this application, after step S40, the method for creating the SMT carrier identifier further includes:

[0052] Step S50: Use a scanning mechanism to scan the label to obtain the label information, and enter the label information into the production management system.

[0053] Specifically, the scanning mechanism may include barcode scanners or vision scanning systems, which identify and record markings on the SMT carrier to facilitate tracking and traceability. Taking QR codes as an example, the SMT carrier markings combine the product board edge code, the SMT carrier QR code, and the steel cover plate QR code into a single code, meaning the information is linked between the three, which facilitates subsequent quality control and process issue traceability. Please refer to [link / reference needed]. Figure 2 The area where the product board edge code is located is designated as Zone 31, and the area where the steel cover plate QR code is located is designated as Zone 32. It can be understood that both Zone 31 and Zone 32 must avoid the graphic lines on the printed circuit board 200.

[0054] It is understood that the production management system also records information contained in the board edge code of the product fixed by the SMT carrier and the information contained in the QR code of the steel cover plate. This information can be obtained by scanning the board edge code and the QR code of the steel cover plate of the product fixed by the SMT carrier; therefore, no restrictions are imposed here.

[0055] In one embodiment of this application, the oxidation process is anodizing.

[0056] Specifically, the processing steps are as follows: feeding, washing, ultrasonic treatment, degreasing, washing, acid washing, washing, neutralization, washing, anodizing, pure water washing, dyeing, sealing, washing, hot water washing, drying, and unloading.

[0057] Pickling refers to immersing the degreased SMT carrier 100 in an acid bath. The acid in the acid bath can be at least one or a mixture of several of the following: oxalic acid solution, sulfuric acid solution, and formic acid solution, but is not limited to these.

[0058] In addition, the anodizing temperature is 18℃~23℃, the voltage is 12V~18V, and the current density is 1.5A / dm³. 2 ~2.0A / dm 2 The reaction time is 30-60 minutes, and a uniform oxide layer is obtained on the SMT carrier 100 after anodizing. It can be understood that compared with magnetron sputtering or vapor deposition, the anodizing process is easier to control the parameters, thus making it easier to control the thickness of the oxide layer; in addition, the process is mature and the production cost is low.

[0059] To distinguish the identification area 10 from other areas of the SMT carrier 100, the identification area 10 can be dyed. Specifically, an acidic dye solution can be applied to the identification area 10 of the SMT carrier 100, which is covered with an oxide layer; then, it can be left to stand for a preset time; finally, after cleaning and drying, a transparent protective layer can be applied to the surface. It is understood that in other embodiments of this application, the dyeing process may be omitted, and this is not a limitation.

[0060] In one embodiment of this application, the ratio of the oxide layer thickness to the engraving depth of the first laser engraving is 2:1 to 4:1, and the ratio of the oxide layer thickness to the engraving depth of the second laser engraving is also 2:1 to 4:1. Thus, after the first and second laser engravings, only a portion of the oxide layer is melted and removed, without damaging the SMT carrier 100. Furthermore, the distance between the engraved mark and the bottom wall of the groove is appropriate, making the mark clear and easily identifiable.

[0061] In this embodiment, the thickness of the oxide layer is 20μm to 30μm. This moderate oxide layer thickness not only ensures the protection of the SMT carrier 100 during subsequent laser engraving, preventing laser damage, but also provides sufficient thickness for the engraved markings to achieve a certain height for easy identification. Furthermore, the moderate oxide layer thickness balances laser marking effect and efficiency, improving yield.

[0062] Specifically, the engraving depth of both the first laser engraving and the second laser engraving is 10μm.

[0063] In other embodiments of this application, the engraving depth of the first laser engraving can be any value in the range of 5μm to 15μm, such as 5μm, 10μm, 15μm, etc.; the engraving depth of the second laser engraving can be any value in the range of 8μm to 12μm, such as 8μm, 10μm, 12μm, etc.; no limitation is made here.

[0064] In one embodiment of this application, the first laser is an ultraviolet laser, which can be generated by an ultraviolet laser generator, and its marking speed can be 1000mm / s to 3000mm / s. Since the first laser is an ultraviolet laser, its wavelength is short and its energy is concentrated. Therefore, when using the first laser to engrave the oxide layer, the principle is to achieve engraving through photochemical ablation. Even if part of the oxide layer becomes small molecules that vaporize and evaporate, the focused spot of the first laser is small and the processing heat effect is low, so there will be no scorching problem. It belongs to the cold processing mode, thereby ensuring that the surface of the marking area 10 after engraving is white.

[0065] The second laser is an infrared laser, which can be generated by an infrared laser generator and operates in continuous laser mode, with a marking speed of 1000mm / s to 5000mm / s. It can be understood that the precision of the first laser in processing the oxide layer is higher than that of the second laser. When using the second laser to engrave the oxide layer, some of the oxide layer absorbs light energy, converts it into heat energy, and melts. Because the second laser treatment reduces the particle size of some oxide layer particles to the nanometer level, it enhances light absorption. Therefore, when visible light shines on the oxide layer surface irradiated by the second laser, it is absorbed. In other words, the mark absorbs most of the visible light, reflecting very little, making the mark appear black to the human eye. It should be noted that the black referred to here is relative black; it can also be a gray that is visible to the naked eye, both of which constitute blackening.

[0066] In one embodiment of this application, the specific implementation steps of the method for creating SMT vehicle identifiers include:

[0067] First, the corresponding QR code symbols are designed and generated based on the design data.

[0068] Secondly, design the dimensions and specifications of the SMT carrier 100, and process the SMT carrier 100 into finished products according to the specifications.

[0069] Secondly, the QR code location, i.e. the identification area 10, is placed in an empty space on the SMT carrier 100 away from the product area 20.

[0070] Next, position the SMT carrier 100 on a CNC milling machine and use a milling cutter to mill a square groove with a size of 14mm*14mm and a depth of 0.5mm in the marked area 10. The square groove must be flat during processing.

[0071] Secondly, the SMT carrier 100 with the square groove is anodized to deposit an oxide layer with a thickness of 20um to 30um on the surface of the carrier, and the entire SMT carrier 100 becomes dark in color.

[0072] Secondly, the marking area 10 is engraved using ultraviolet laser with a depth of 10um to 15um and a size of 14mm*14mm. After engraving, the area is white, meaning the surface of the marking area 10 is white.

[0073] Secondly, infrared laser is used to re-engrave the marking area 10 to form a QR code. The QR code mark after engraving is black, and the engraving depth is controlled at 10um±2um.

[0074] Secondly, the engraved QR codes are scanned and identified, and the QR codes are repeatedly scanned and identified in the reflow oven to determine their quality, confirming that they can be identified quickly and effectively.

[0075] Finally, production proceeds according to the SMT manufacturing process. After positioning the product on the SMT carrier 100, the product board edge code and the SMT carrier 100 QR code are scanned simultaneously. The identification information obtained from the scanning is then entered into the production management system, and production officially begins.

[0076] The above-described method for manufacturing SMT carrier markings optimizes the marking structure. First, an oxide layer is prepared on the SMT carrier 100. Then, a first laser engraving is used to make the marking area 10 white. A second laser engraving is then used to form a black marking, creating a strong contrast between the marking and the background color of the marking area 10, making it easy to identify. Secondly, the white background of the marking area 10 reflects radiation and lowers the surface temperature of the carrier, making it less prone to discoloration and improving recognition speed. Furthermore, compared to traditional inkjet printing, the markings prepared in this application have stronger anti-aging properties, greater strength and hardness, and are less prone to wear, effectively solving the technical problem in the prior art where markings on related products become unreadable due to oxidation or contamination after repeated use.

[0077] The second aspect of this application proposes an SMT carrier, please refer to... Figure 1 The SMT carrier includes a marking area 10, and the marking area 10 is provided with an SMT carrier mark. The SMT carrier mark is prepared using the manufacturing method of the SMT carrier mark of any embodiment of the first aspect. The surface of the marking area 10 is white, and the mark is located in the marking area 10 and is black. In this way, the color contrast between the mark and the surface of the marking area 10 is large, making it easy to observe and fast to identify.

[0078] In one embodiment of this application, the marking area 10 has a groove, and the marking is located at the bottom of the groove.

[0079] Specifically, the groove is 14mm x 14mm in size and 0.5mm in depth, meaning the marking area 10 is square with dimensions of 14mm x 14mm. The oxide layer has a thickness of 20μm to 30μm. The first laser depth is 10μm, and the second laser depth is 10μm.

[0080] It is understood that in other embodiments of this application, the size of the groove may also be other, and no limitation is made here.

[0081] The markings on the aforementioned SMT carrier are black, while the background of marking area 10 is white, creating a strong contrast that makes them easily identifiable. Secondly, the white background of marking area 10 reflects radiation and lowers the surface temperature of the carrier, making it less prone to discoloration and improving recognition speed. Furthermore, compared to traditional inkjet printing, the markings produced in this application have stronger anti-aging properties, greater strength and hardness, and are less prone to wear, effectively solving the technical problem in existing technologies where markings on related products become unreadable due to oxidation or contamination after repeated use.

[0082] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for manufacturing SMT carrier markings, used to manufacture markings on SMT carriers, characterized in that, The manufacturing method includes: An SMT carrier is provided, the SMT carrier having an identification area; A groove is prepared in the marking area; The SMT carrier is subjected to anodizing, magnetron sputtering, or vapor deposition to coat its surface with an oxide layer; wherein the SMT carrier is made of synthetic stone and the oxide layer is an aluminum oxide film. The oxide layer within the marking area is engraved using a first laser, making the marking area appear white; The oxide layer within the marking area is re-engraved using a second laser to form a black marking.

2. The method for manufacturing SMT carrier markings according to claim 1, characterized in that, The depth of the groove is 0.4mm to 0.6mm.

3. The method for manufacturing SMT carrier markings according to claim 1, characterized in that, After using a second laser to re-engrave the oxide layer within the marking area to form the marking, the process further includes: The identification is scanned using a scanning device to obtain identification information, and the identification information is then entered into the production management system.

4. The method for manufacturing SMT carrier markings according to any one of claims 1-3, characterized in that, The ratio of the thickness of the oxide layer to the engraving depth of the first laser engraving is 2:1 to 4:1, and the ratio of the thickness of the oxide layer to the engraving depth of the second laser engraving is 2:1 to 4:

1.

5. The method for manufacturing SMT carrier markings according to claim 4, characterized in that, The thickness of the oxide layer is 20μm~30μm, the engraving depth of the first laser engraving is 5μm~15μm, and the engraving depth of the second laser engraving is 8μm~12μm.

6. The method for manufacturing SMT carrier markings according to any one of claims 1-3, characterized in that, The first laser is an ultraviolet laser, and the second laser is an infrared laser.

7. An SMT carrier, characterized in that, The SMT carrier includes an identification area and the identification area is provided with an SMT carrier identification mark. The SMT carrier identification mark is prepared by the manufacturing method of the SMT carrier identification mark according to any one of claims 1-6. The surface of the identification area is white and the identification mark is black.

8. The SMT carrier according to claim 7, characterized in that, The marking area has a groove, and the marking is located at the bottom of the groove.

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