A co-fired ceramic phased array antenna

Abstract

The embodiment of the present disclosure provides a co-fired ceramic phased array antenna, comprising: a low-temperature co-fired ceramic substrate, a radiating antenna array, a radio frequency feeding network, a high-temperature co-fired ceramic substrate, a control and power supply network, a radio frequency interface, and a device-level TR component; wherein the radio frequency interface is welded on the lower surface of the high-temperature co-fired ceramic substrate; the control and power supply network is located in the high-temperature co-fired ceramic substrate; the device-level TR component is welded on the lower surface of the high-temperature co-fired ceramic substrate; the upper surface of the high-temperature co-fired ceramic substrate and the lower surface of the low-temperature co-fired ceramic substrate form a hybrid stacked ceramic substrate through welding; the radio frequency feeding network is located in the low-temperature co-fired ceramic substrate; and the radiating antenna array is located on the upper surface of the low-temperature co-fired ceramic substrate. In this way, the overall structure internal stress can be reduced, the phased array antenna heat dissipation capacity can be improved, the phased array antenna radiation performance can be enhanced, the phased array antenna miniaturization, integration and light weight can be realized, and meanwhile, the phased array antenna has good reliability.

Description

Technical Field

[0001] This invention relates to the field of phased array antenna technology, and in particular to a co-fired ceramic phased array antenna. Background Technology

[0002] In recent years, phased array antennas have been widely used due to their advantages such as large spatial beam scanning, beam agility, and high-power spatial combining. With the rapid development of 5G communication technology and satellite communication technology, the demand for low-cost, miniaturized, and lightweight phased array antennas in communication systems is becoming increasingly urgent.

[0003] However, due to limitations in circuit board materials, existing phased array antennas have poor heat dissipation capabilities, leading to overheating of the power chip and posing a significant threat to safety. This also severely restricts the performance improvement of phased array antennas. Therefore, improving the heat dissipation capability and enhancing the radiation performance of phased array antennas are key to achieving lightweight and miniaturized phased array antennas. Summary of the Invention

[0004] To address the aforementioned technical problems, this disclosure provides a co-fired ceramic phased array antenna, which solves the problems of poor heat dissipation and weak radiation performance of existing phased array antennas, thereby satisfying the requirements of miniaturization, integration, and lightweighting of phased array antennas while ensuring their good reliability.

[0005] According to a first aspect of the present invention, a co-fired ceramic phased array antenna is provided, comprising: a low-temperature co-fired ceramic substrate, a radiating antenna array, an RF feed network, a high-temperature co-fired ceramic substrate, a control and power supply network, an RF interface, and a device-level TR component; wherein...

[0006] The radio frequency interface is soldered to the lower surface of the high-temperature co-fired ceramic substrate;

[0007] The control and power supply network is located within the high-temperature co-fired ceramic substrate;

[0008] Device-level TR components are soldered onto the lower surface of a high-temperature co-fired ceramic substrate;

[0009] The upper surface of a high-temperature co-fired ceramic substrate and the lower surface of a low-temperature co-fired ceramic substrate are welded together to form a hybrid stacked ceramic substrate.

[0010] The radio frequency feed network is located within a low-temperature co-fired ceramic substrate;

[0011] The radiating antenna array is located on the upper surface of a low-temperature co-fired ceramic substrate.

[0012] In one embodiment, both the low-temperature co-fired ceramic substrate and the high-temperature co-fired ceramic substrate are multilayer ceramic structures.

[0013] The upper surface of a high-temperature co-fired ceramic substrate and the lower surface of a low-temperature co-fired ceramic substrate are welded together to form a hybrid stacked ceramic substrate, including: the upper surface of a high-temperature co-fired ceramic substrate and the lower surface of a low-temperature co-fired ceramic substrate are welded together by metal solder ball A to form a hybrid stacked ceramic substrate.

[0014] The device-level TR assembly is soldered to the lower surface of the high-temperature co-fired ceramic substrate by means of: the device-level TR assembly is soldered to the lower surface of the high-temperature co-fired ceramic substrate by means of metal solder ball B.

[0015] In one embodiment, the control and power supply network consists of multiple layers of metal circuits, which are electrically connected to each other through metal pillars inside a high-temperature co-fired ceramic substrate.

[0016] In one implementation, the radio frequency feed network consists of multilayer metal circuits and resistive elements.

[0017] In one embodiment, the radiating antenna array consists of a plurality of identical metal circuits arranged uniformly.

[0018] In one embodiment, the phased array antenna further includes a mounting structure welded to the lower surface of a high-temperature co-fired ceramic substrate; a device-level TR component is located within the mounting structure and is provided with an elastic insulating thermal pad between it and the mounting structure.

[0019] In one embodiment, one end of the radio frequency interface is connected to a metal pillar in the high-temperature co-fired ceramic substrate, and the other end penetrates the mounting structure; the phased array antenna also includes a control power supply connector, one end of which is connected to a control and power supply network located in the high-temperature co-fired ceramic substrate, and the other end penetrates the mounting structure.

[0020] In one embodiment, the mounting structure, radio frequency interface, and control power supply connector are made of Kovar alloy.

[0021] According to a second aspect of the present invention, a method for use in a co-fired ceramic phased array antenna is provided, the method comprising:

[0022] When the phased array antenna is working, the microwave signal enters the radio frequency interface, passes through the metal pillars in the high-temperature co-fired ceramic substrate, and enters the radio frequency feed network in the low-temperature co-fired ceramic substrate. After power distribution by the radio frequency feed network, the signal passes through the metal pillars in the high-temperature co-fired ceramic substrate and enters the collection port of the device-level TR component. The device-level TR component amplifies and phase-shifts the signal, and then feeds it into the radiating antenna array through the metal pillars in the high-temperature co-fired ceramic substrate, ultimately forming spatial radiation.

[0023] The technical solution provided by this invention has the following advantages compared with the prior art:

[0024] By combining low-temperature co-fired ceramics with high-temperature co-fired ceramics and using Kovar alloy components, the overall internal stress of the phased array antenna is reduced, the heat dissipation capacity of the phased array antenna is improved, and the radiation performance of the phased array antenna is enhanced. This achieves miniaturization, integration, and lightweighting of the phased array antenna while ensuring its good reliability.

[0025] It should be understood that the description in the Summary of the Invention is not intended to limit the key or essential features of the embodiments of this disclosure, nor is it intended to restrict the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0026] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. The drawings are provided for a better understanding of the invention and are not intended to limit the scope of this disclosure. In the drawings, the same or similar reference numerals denote the same or similar elements, wherein:

[0027] Figure 1 This is a schematic diagram of the structure of an embodiment of the present disclosure;

[0028] Figure 2 This is a circuit diagram of a radiating antenna array according to an embodiment of this disclosure;

[0029] Figure 3 This is a circuit diagram of the radio frequency feed network according to an embodiment of the present disclosure;

[0030] Figure 4 This is a circuit diagram of the control and power supply network according to an embodiment of the present disclosure;

[0031] Explanation of the labels in the diagram:

[0032] 1. Low-temperature co-fired ceramic substrate 2. Radiating antenna array 3. RF feed network 4. High-temperature co-fired ceramic substrate 5. Control and power supply network 6. Mounting structure 7. RF interface 8. Control and power supply connector

[0033] 9. Metal solder ball A 10. Flexible insulating thermal pad 11. Device-grade TR assembly 12. Metal solder ball B Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0035] Furthermore, the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0036] Example 1

[0037] The purpose of this disclosure is to disclose a co-fired ceramic phased array antenna, which uses a superimposed structure of low-temperature co-fired ceramic and high-temperature co-fired ceramic, combined with components made of Kovar alloy material, to absorb stress in the overall structure, reduce the temperature of the overall structure, and ensure that the overall structure has high reliability.

[0038] The following reference Figures 1 to 4 This describes the co-fired ceramic phased array antenna provided in the embodiments of this disclosure.

[0039] This disclosure embodiment is based on a millimeter-wave phased array antenna, which is a co-fired ceramic phased array antenna with a Kovar alloy mounting structure. The welding process used between the Kovar alloy and the co-fired ceramic is a high-temperature brazing process.

[0040] Co-fired ceramics include low-temperature co-fired ceramics and high-temperature co-fired ceramics.

[0041] Low Temperature Cofired Ceramic (LTCC) technology is a multilayer circuit made by stacking unsintered cast ceramic materials together, containing printed interconnect conductors, components and circuits, and then sintering the structure into an integrated ceramic multilayer material.

[0042] High Temperature Cofired Ceramic (HTCC) is made by printing heating resistor pastes of high-melting-point metals such as tungsten, molybdenum, and manganese onto a 92-96% alumina cast ceramic green body according to the requirements of the heating circuit design. It is then multi-layered with 4-8% sintering aids and co-fired at a high temperature of 1500-1600℃ to form a whole.

[0043] Kovar alloy is a hard glass iron-based sealing alloy containing 29% nickel and 18% cobalt. It is an internationally used iron-nickel-cobalt hard glass sealing alloy. In the temperature range of -70℃ to 500℃, its coefficient of thermal expansion is close to that of the sealing material such as glass or ceramic, and it has good low-temperature structural stability.

[0044] High-temperature brazing refers to a process in which materials are heated to the brazing temperature in the presence of a filler metal with a liquidus line above 840 degrees Fahrenheit (450 degrees Celsius) and below the solidus line of the base material, thereby causing the materials to coalesce.

[0045] Brazing is a welding method in which a filler metal with a flux that is below the melting point of the workpiece and the workpiece are heated to the melting temperature of the filler metal, and the liquid filler metal is used to fill the gaps in the solid workpiece to connect the metals.

[0046] The co-fired ceramic phased array antenna of this embodiment, such as Figure 1 As shown, it includes:

[0047] The system comprises a low-temperature co-fired ceramic substrate 1, a radiating antenna array 2, an RF feed network 3, a high-temperature co-fired ceramic substrate 4, a control and power supply network 5, an RF interface 7, and a device-level TR assembly 11. The RF interface 7 is soldered to the lower surface of the high-temperature co-fired ceramic substrate 4; the control and power supply network 5 is located within the high-temperature co-fired ceramic substrate 4; the device-level TR assembly 11 is soldered to the lower surface of the high-temperature co-fired ceramic substrate 4; the upper surface of the high-temperature co-fired ceramic substrate 4 and the lower surface of the low-temperature co-fired ceramic substrate 1 are soldered to form a hybrid stacked ceramic substrate; the RF feed network 3 is located within the low-temperature co-fired ceramic substrate 1; and the radiating antenna array is located on the upper surface of the low-temperature co-fired ceramic substrate 1.

[0048] In the above embodiments, such as Figure 1 As shown, both the low-temperature co-fired ceramic substrate 1 and the high-temperature co-fired ceramic substrate 4 are multilayer ceramic structures. The upper surface of the high-temperature co-fired ceramic substrate 4 and the lower surface of the low-temperature co-fired ceramic substrate 1 are welded together to form a hybrid stacked ceramic substrate. This includes welding the upper surface of the high-temperature co-fired ceramic substrate 4 and the lower surface of the low-temperature co-fired ceramic substrate 1 together using metal solder balls A9. The device-level TR component 11 is welded to the lower surface of the high-temperature co-fired ceramic substrate 4 using metal solder balls B12. The overall structure has excellent high-frequency transmission characteristics and circuit design flexibility, enabling multilayer RF circuit layout, multi-path heat dissipation, providing a good thermal environment for power devices, and simultaneously realizing complex control and power supply circuits.

[0049] In the above embodiments, such as Figure 1 As shown, the control and power supply network 5 consists of multiple layers of metal circuits, which are electrically connected to each other through metal pillars inside the high-temperature co-fired ceramic substrate 4. These metal pillars serve as connection paths, linking the various metal circuit layers to achieve complex control and power supply circuitry.

[0050] In the above embodiments, the RF feed network 3 consists of multilayer metal circuits and resistive elements. The multilayer RF circuit layout achieves power distribution for the overall structure.

[0051] In the above embodiments, such as Figure 2As shown, the radiating antenna array 2 is composed of multiple identical metal circuits arranged uniformly. The radiating antenna array 2 is located on the upper surface of the low-temperature co-fired ceramic substrate 1 and is used to complete the final radiation task.

[0052] In the above embodiment, a mounting structure 6 is also included, which is welded to the lower surface of the high-temperature co-fired ceramic substrate 4. The device-level TR assembly 11 is located within the mounting structure 6, and an elastic insulating thermally conductive pad 10 is provided between the device-level TR assembly 11 and the mounting structure 6. The elastic insulating thermally conductive pad adds a heat dissipation path to the overall structure, ensuring that the overall structure has a good thermal conductivity environment.

[0053] In the above embodiment, one end of the radio frequency interface 7 is connected to a metal pillar in the high-temperature co-fired ceramic substrate 4, and the other end penetrates the mounting structure 6; it also includes a control power supply connector 8, one end of which is connected to a control and power supply network 5 located in the high-temperature co-fired ceramic substrate 4, and the other end penetrates the mounting structure 6. The radio frequency interface 7 can be connected to the outside, and microwave signals enter the overall structure through the radio frequency interface 7.

[0054] In the above embodiments, the mounting structure 6, the radio frequency interface 7, and the control power supply connector 8 are made of Kovar alloy. Due to the properties of Kovar alloy, a large amount of thermal stress will not be generated inside the ceramic substrate under high and low temperature conditions; at the same time, it can absorb the structural stress generated when the phased array antenna is installed with other structural components, so as to avoid stress damage to the ceramic substrate during the installation process, thereby ensuring that the co-fired ceramic phased array antenna has good reliability.

[0055] According to embodiments of the present invention, the present invention also provides a method for operating a co-fired ceramic phased array antenna, comprising:

[0056] When the phased array antenna is working, the microwave signal enters the radio frequency interface 7, passes through the metal pillars in the high-temperature co-fired ceramic substrate 4, and enters the radio frequency feed network 3 in the low-temperature co-fired ceramic substrate 1. After power distribution by the radio frequency feed network 3, the signal passes through the metal pillars in the high-temperature co-fired ceramic substrate 4 and enters the collection port of the device-level TR component 11. The device-level TR component 11 amplifies and phase-shifts the signal, and then feeds it into the radiating antenna array 2 through the metal pillars in the high-temperature co-fired ceramic substrate 4, ultimately forming spatial radiation.

[0057] According to embodiments of the present invention, the following technical effects are achieved:

[0058] By combining low-temperature co-fired ceramics with high-temperature co-fired ceramics and using Kovar alloy components, the overall internal stress of the phased array antenna is reduced, the heat dissipation capacity of the phased array antenna is improved, and the radiation performance of the phased array antenna is enhanced. This achieves miniaturization, integration, and lightweighting of the phased array antenna while ensuring its good reliability.

[0059] In the description of this specification, the terms "connection," "installation," and "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0060] In the description of this specification, the terms "one embodiment," "some embodiments," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0061] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A co-fired ceramic phased array antenna, characterized in that, include: Low-temperature co-fired ceramic substrate (1), radiating antenna array (2), RF feed network (3), high-temperature co-fired ceramic substrate (4), control and power supply network (5), RF interface (7), device-level TR component (11); among which, The radio frequency interface (7) is welded to the lower surface of the high-temperature co-fired ceramic substrate (4); The control and power supply network (5) is located within the high-temperature co-fired ceramic substrate (4); The device-level TR component (11) is welded to the lower surface of the high-temperature co-fired ceramic substrate (4); The upper surface of the high-temperature co-fired ceramic substrate (4) and the lower surface of the low-temperature co-fired ceramic substrate (1) are welded together to form a hybrid stacked ceramic substrate. The radio frequency feed network (3) is located within the low-temperature co-fired ceramic substrate (1); The radiating antenna array (2) is located on the upper surface of the low-temperature co-fired ceramic substrate (1).

2. The phased array antenna according to claim 1, characterized in that, Both the high-temperature co-fired ceramic substrate (4) and the low-temperature co-fired ceramic substrate (1) are multilayer ceramic structures; The upper surface of the high-temperature co-fired ceramic substrate (4) and the lower surface of the low-temperature co-fired ceramic substrate (1) are welded to form a hybrid stacked ceramic substrate, including: the upper surface of the high-temperature co-fired ceramic substrate (4) and the lower surface of the low-temperature co-fired ceramic substrate (1) are welded together by metal solder balls A (9) to form a hybrid stacked ceramic substrate. The device-level TR assembly (11) is welded to the lower surface of the high-temperature co-fired ceramic substrate (4) by means of metal solder ball B (12).

3. The phased array antenna according to claim 2, characterized in that, The control and power supply network (5) consists of multiple layers of metal circuits, and the metal circuits are electrically connected to each other through the metal pillars inside the high-temperature co-fired ceramic substrate (4).

4. The phased array antenna according to claim 3, characterized in that, The radio frequency feed network (3) consists of multilayer metal circuits and resistive elements.

5. The phased array antenna according to claim 4, characterized in that, The radiating antenna array (2) is composed of multiple identical metal circuits arranged uniformly.

6. The phased array antenna according to claim 1, characterized in that, The phased array antenna also includes a mounting structure (6), which is welded to the lower surface of the high-temperature co-fired ceramic substrate (4); The device-level TR component (11) is located within the mounting structure (6), and an elastic insulating thermally conductive pad (10) is provided between it and the mounting structure (6).

7. The phased array antenna according to claim 6, characterized in that, One end of the radio frequency interface (7) is connected to the metal pillar in the high-temperature co-fired ceramic substrate (4), and the other end penetrates the mounting structure (6); The phased array antenna also includes a control power supply connector (8), one end of which is connected to a control and power supply network (5) located in the high-temperature co-fired ceramic substrate (4), and the other end penetrates the mounting structure (6).

8. The phased array antenna according to claim 7, characterized in that, The mounting structure (6), the radio frequency interface (7), and the control power supply connector (8) are made of Kovar alloy material.

9. A method for operating a co-fired ceramic phased array antenna according to any one of claims 1-8, characterized in that, The method includes: When the phased array antenna is in operation, the microwave signal enters the radio frequency interface (7), passes through the metal pillars in the high-temperature co-fired ceramic substrate (4), and enters the radio frequency feed network (3) in the low-temperature co-fired ceramic substrate (1). After power distribution by the radio frequency feed network (3), the signal enters the collection port of the device-level TR component (11) through the metal pillars in the high-temperature co-fired ceramic substrate (4). The device-level TR component (11) amplifies and phase-shifts the signal, and then feeds it into the radiating antenna array (2) through the metal pillars in the high-temperature co-fired ceramic substrate (4), ultimately forming spatial radiation.

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