Miniature spectral imaging chip and miniature imaging spectrometer

By integrating a metasurface filter layer onto a miniature spectral imaging chip on a CMOS image sensor, the miniaturization and stability issues of existing spectral imaging devices have been solved, enabling the simultaneous acquisition of high spectral resolution and high image resolution, and reducing costs.

CN117419807BActive Publication Date: 2026-09-04HANGZHOU NAJING TECHNOLOGY CO LTD
8 Cites 0 Cited by

Patent Information

Application Number
CN202210808715.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-07-11
Publication Date
2026-09-04
Estimated Expiration
2042-07-11

AI Technical Summary

Technical Problem

Existing image sensors cannot effectively distinguish colors, which limits the miniaturization of spectral imaging technology. Furthermore, the way existing spectral imaging devices are combined with image sensors results in high device stability and cost.

Method used

A miniature spectral imaging chip is used, which replaces the Bayer array filter with a metasurface filter layer and is integrated on a CMOS image sensor. Combined with a signal processing layer and an image sensing layer, it enables the synchronous acquisition of spectrum and image.

Benefits of technology

It achieves the simultaneous realization of high spectral resolution and high image resolution in miniaturized devices, reduces costs and improves device stability, and obtains high-fidelity spectral images.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The application relates to a miniature spectral imaging chip and a miniature imaging spectrometer, and belongs to the technical field of spectral imaging. The chip comprises, from top to bottom, an optical filtering layer, an image sensing layer and a signal processing layer. The optical filtering layer is composed of a transparent medium substrate and a plurality of different micro-nano structure units, each of which comprises a plurality of micro-nano structure arrays. The micro-nano structure arrays are single-layer or multi-layer structures. Each micro-nano structure unit covers a single or multiple photosensitive pixel units on a photodetector array layer. The area of the photodetector array layer covered by the micro-nano structure unit is a spectral chip area. The image sensing layer comprises the photodetector array layer and a metal circuit layer arranged on the photodetector array layer. The application realizes high spectral resolution and high image resolution in a very small volume.
Need to check novelty before this filing date? Find Prior Art