A terahertz energy transmission window assembly and a test fixture thereof

Abstract

The present invention belongs to the technical field of vacuum electronic devices and specifically discloses a terahertz energy transmission window assembly, comprising an upper window frame and a lower window frame. The upper window frame is provided with an upper rectangular waveguide and an upper circular waveguide, and the lower window frame is provided with a lower rectangular waveguide and a lower circular waveguide. A window piece is provided between the upper window frame and the lower window frame. The lower window frame is provided with a first solder groove, the first solder groove being located at the bottom of the window piece. An upper second solder groove and a lower second solder groove are provided at the contacting ends of the upper and lower window frames, respectively. After the upper and lower window frames are assembled, the upper second solder groove and the lower second solder groove can interlock with each other. Solder rings are placed in the first solder groove and in the second solder groove and / or the lower second solder groove. The upper and lower window frames are welded by melting the solder rings. A test fixture for a terahertz energy transmission window assembly is provided for clamping and fixing a terahertz energy transmission window assembly. The present invention can effectively simplify the welding process and improve welding efficiency and airtightness.

Description

Technical Field

[0001] The present invention relates to the technical field of vacuum electronic devices, and in particular to a terahertz energy transmission window assembly and a test fixture thereof. Background Art

[0002] Terahertz (THz) technology, one of the most promising cutting-edge technologies of the 21st century, is developing at an unprecedented pace and demonstrating enormous potential for application in a variety of key areas. These include, but are not limited to, high-speed wireless communications, high-resolution imaging, non-invasive detection, precision spectroscopy, and advanced security scanning systems. Notably, as operating frequencies continue to increase, the output power advantages of vacuum electronics become increasingly significant, particularly compared to traditional solid-state electronics. In the field of miniaturized and high-power terahertz vacuum electronics, various linear vacuum injection amplifiers play an indispensable role. These devices, including klystrons, traveling-wave tubes, anti-wave tubes, and extended interaction devices, collectively form the core foundation for the application of terahertz vacuum radiation sources.

[0003] The energy transmission window is a key component in vacuum electronic devices. Its structural design and electromagnetic performance directly determine the transmission efficiency of radio frequency signals and the imaging quality of the system. An excellent energy transmission window design must simultaneously meet three core functional requirements: (1) High transmittance and low reflectivity: This is the basic premise for ensuring efficient and low-loss transmission of terahertz waves. The selection of energy transmission window materials and the optimization of structure should revolve around this goal; (2) Excellent thermal stability: The energy transmission window must be able to adapt to various harsh environmental conditions, including temperature fluctuations, mechanical shocks, and pressure changes. It is particularly noteworthy that it must be able to maintain structural stability and prevent deformation during high-temperature processes such as welding; (3) High mechanical strength and good airtightness. In order to ensure the stable operation of vacuum electronic devices under high vacuum conditions, the energy transmission window must have excellent sealing performance and be able to withstand the huge pressure difference in the vacuum process without generating micro cracks. Among the many energy transmission window designs, the box-type window is widely favored in the millimeter wave and terahertz wave bands due to its unique advantages. These advantages include simple structural design, reliable manufacturing process and excellent electromagnetic properties.

[0004] The quality control and performance verification of the energy transmission window involves a series of complex and rigorous testing processes that run through all stages of device manufacturing, assembly and application. These test scenarios include: (1) Cold test before welding: a test performed before the welding process begins, the purpose of which is to confirm the electromagnetic characteristics and structural integrity of the energy transmission window in the unwelded state. This step is to ensure that the processed window frame assembly and window assembly meet the design specifications and avoid unnecessary quality problems during the welding process; (2) Cold test after welding: performed immediately after the welding operation, the main purpose of this test is to evaluate the impact of the welding process on the electromagnetic characteristics and structural integrity of the energy transmission window. The focus is on detecting whether welding introduces any adverse effects, such as increased internal stress in the material, structural deformation or decreased electromagnetic performance; (3) Cold / hot test after welding with tube: a test performed after the energy transmission window is combined with the corresponding tube and the welding is completed, the purpose of which is to verify the function and stability of the overall component, which is a key step in evaluating the final assembly quality and operational performance. These multi-scenario testing processes not only ensure the quality and performance of the energy transmission window at each stage, but also reflect its application flexibility and reliability throughout the entire production and assembly process. Each test is a rigorous verification of the performance indicators of the energy transmission window in actual use, providing a solid guarantee for its stable operation in application.

[0005] As terahertz technology develops towards higher frequency bands, the design of energy transmission windows faces new challenges. The increase in operating frequency has led to a continuous reduction in the size of the window frame assembly and window panel assembly of the energy transmission window. This trend has caused the stress at the sealing interface to gradually approach or even exceed the tensile strength limit of each component material, thereby significantly reducing the overall reliability of the energy transmission window. In order to effectively reduce the stress concentration at the sealing interface of the energy transmission window, the industry generally adopts a side sealing welding solution. Compared with the traditional flat sealing welding solution (sealing the window panel surface with one side surface of the metal window frame), the side sealing welding technology can significantly reduce stress concentration by sealing the outer diameter side wall of the window panel with the inner diameter side wall of the metal window frame, thereby greatly improving the structural stability and long-term reliability of the energy transmission window.

[0006] Recent advances in materials science have shown great potential for application in terahertz (THz) energy windows due to their exceptional comprehensive properties. Diamond films exhibit exceptional properties including extremely high hardness, low dielectric constant, extremely low dielectric loss, wide optical transparency, and high thermal conductivity. These characteristics make them particularly suitable for use in THz TWT energy windows. Microcrystalline diamond (MCD) technology, which enables the production of multilayer composite diamond films through a composite growth process, is particularly noteworthy. In-depth modification and mechanistic analysis of the mechanical strength and sealing properties of these composite films will further enhance their performance, enabling them to better meet the stringent application requirements of THz energy window assemblies. This innovation, based on advanced materials science, has the potential to not only address key material challenges currently facing THz technology but also pave the way for the development of higher-frequency and higher-power THz devices in the future.

[0007] The complexity of traditional double-sided soldering: Existing double-sided flat-sealing soldering technology exhibits significant limitations in the manufacturing of terahertz energy windows. This method requires solder sheets to be placed on both the top and bottom surfaces of the window, with the expectation that both sheets will melt and flow evenly during the soldering process. This approach places high demands on temperature control and timing during the soldering process, increasing the complexity and uncertainty of the soldering process. Furthermore, this method can lead to inconsistent soldering quality, which in turn affects the overall performance and reliability of the energy window.

[0008] Difficulty in stress release in traditional structures: In the structural design of terahertz energy transmission windows, the difference in thermal expansion characteristics of materials is a key challenge. Oxygen-free copper, as a window frame material, has a large thermal expansion coefficient and is highly sensitive to temperature changes. In contrast, the thermal expansion coefficient of diamond windows is smaller and the temperature stability is higher. This mismatch in material properties is particularly prominent during the cooling process after welding. When the temperature drops, the oxygen-free copper window frame will shrink significantly, exerting a strong squeezing force on the diamond window. Due to the huge difference in the thermal expansion coefficients of the two materials, stress is rapidly concentrated, which can easily lead to microcracks or even complete rupture of the window assembly. This problem is particularly serious in the terahertz frequency band, significantly reducing the overall reliability of traditional structural energy transmission windows in high-frequency applications.

[0009] The traditional integrated window frame design has high limitations in multi-scenario applications: the integrated design solution commonly used in existing technologies, that is, integrating the energy transmission window and the test flange into a whole, has exposed many problems in actual applications. This design usually relies on welding or fixed installation methods, which makes the structural design complicated. More importantly, during the cold test process after welding, due to the integrity of the structure, the window frame may be subjected to uneven stress distribution, which not only increases the risk of material fatigue and damage, but also greatly increases the difficulty and cost of subsequent testing and maintenance. In addition, this design lacks flexibility and is difficult to adapt to the needs of different test scenarios, which limits the applicability of energy transmission windows in diverse application environments. Summary of the Invention

[0010] The present invention provides a terahertz energy transmission window assembly, the purpose of which is to simplify the welding process and improve welding efficiency and air tightness.

[0011] The present invention is achieved through the following technical solution: a terahertz energy transmission window assembly, comprising an upper window frame and a lower window frame, wherein the upper window frame is provided with an upper rectangular waveguide and an upper circular waveguide connected to each other, and the lower window frame is provided with a lower rectangular waveguide and a lower circular waveguide connected to each other, a window piece is provided between the upper window frame and the lower window frame, the upper circular waveguide and the lower circular waveguide are respectively located on both sides of the window piece, a first solder groove is provided in the lower window frame, the first solder groove is located at the bottom of the window piece, an upper second solder groove and a lower second solder groove are respectively provided at the ends where the upper window frame and the lower window frame contact each other, and after the upper window frame and the lower window frame are assembled with each other, the upper second solder groove and the lower second solder groove can be buckled with each other; a solder ring is placed in the first solder groove and the upper second solder groove and / or the lower second solder groove, and the upper window frame and the lower window frame are welded by melting the solder ring.

[0012] Compared with the existing technology, this technical solution has the following advantages and beneficial effects:

[0013] In the assembly connection between the upper window frame and the lower window frame in the energy transmission window in the present technical solution, a solution completely different from that in the prior art is adopted. In the prior art, solder sheets are placed on the upper and lower sides of the window piece, so that the upper and lower sides of the window piece are respectively welded to the upper circular waveguide of the upper window frame and the lower circular waveguide of the lower window frame. This bilateral welding method of welding on both the upper and lower sides of the window piece is complicated to operate and has high requirements on the welding process, which can easily affect the overall reliability of the energy transmission window.

[0014] However, in the energy transmission window in the present technical solution, a first solder groove is reserved in the lower window frame, and an upper second solder groove and a lower second solder groove are respectively opened at the end where the upper window frame and the lower window frame contact each other. In this way, the double-sided welding method of the window piece is changed to a single-sided welding method, and the welding position between the traditional middle window piece and the upper circular waveguide can be transferred to the end where the upper window frame and the lower window frame contact each other, while only the single-sided welding position between the window piece and the lower circular waveguide is retained. This not only reduces the complexity of the operation, but also significantly improves the welding efficiency. In addition, in the traditional double-sided welding method, the welding quality on both sides of the window piece is prone to inconsistency, and the air tightness between the upper window frame and the lower window frame is also poor, which will lead to poor air tightness of the overall energy transmission window.

[0015] This innovation of the solution solves many technical difficulties existing in the traditional bilateral welding method and brings new breakthroughs to the manufacturing process of high-frequency components.

[0016] Furthermore, a plug hole is provided at the top of the lower window frame, and a plug post matching the plug hole is provided at the bottom of the upper window frame, and the plug post can be inserted into the plug hole.

[0017] Beneficial effect: In this solution, the plug-in cooperation between the upper window frame and the lower window frame through the plug-in column and the plug-in hole can improve the cooperation accuracy between the two, so that the performance of the entire energy transmission window is better and the reliability is stronger.

[0018] Furthermore, a bottom hole is provided at the bottom of the socket, the window piece is located at the bottom of the bottom hole, the bottom of the plug column is connected to a bottom column that matches the bottom hole, the bottom column can be inserted into the bottom hole, and the contact surface between the bottom column and the bottom hole is a slope.

[0019] Beneficial effects: In this solution, the contact surface between the bottom column and the bottom hole is a bevel. In this way, when the upper window frame and the lower window frame are assembled with each other, the bevel design can ensure that the bottom column fits more tightly when inserted into the bottom hole, and can ensure that the upper circular waveguide and the lower circular waveguide are in close contact with the two ends of the window piece respectively, ensuring the precise docking of the upper window frame, the lower window frame and the window piece at the center position, greatly improving the assembly accuracy, and can improve the airtightness of the connection and ensure the stability of the overall structure.

[0020] Furthermore, the bottom hole is a tapered hole, and the bottom column is a tapered column.

[0021] Beneficial effects: The structure of the tapered hole and the tapered column in this solution is easier to operate during assembly, is convenient for mutual coordination and assembly, and is also convenient for processing and manufacturing.

[0022] Furthermore, the upper window frame is made of nickel-copper, the lower window frame is made of oxygen-free copper, and the window sheet is made of diamond.

[0023] Beneficial effect: This unique multi-material fusion design concept in this solution not only meets the high requirements of the welding process, but also meets the strong demand for low-loss transmission of the terahertz energy transmission window.

[0024] Furthermore, an annular groove is provided in the lower window frame and on the outside of the window piece.

[0025] Beneficial Effects: Due to temperature fluctuations during the welding process, the lower window frame and the diamond window plate expand and contract. Since the thermal expansion coefficient of oxygen-free copper is much greater than that of diamond, the lower window frame will experience significant deformation. Preserving an annular groove near the diamond window plate can cut off stress conduction near the window plate during cooling, effectively alleviating stress release issues on the diamond window plate during heating and cooling.

[0026] This invention introduces a unique annular groove design, an innovative structure that effectively promotes stress relief and reduces structural stress. This design significantly improves the stability and durability of components under thermal deformation and physical loads, providing a solid foundation for the long-term reliable operation of high-frequency electronic devices.

[0027] A testing fixture for a terahertz energy transmission window assembly is used to clamp and fix the above-mentioned terahertz energy transmission window assembly, including an electromagnetic function test module. The electromagnetic function test module is provided with a slot, and the slot is a stepped hole structure. The upper window frame and lower window frame of the above-mentioned terahertz energy transmission window assembly are assembled and inserted into the slot. The electromagnetic function test module is provided with multiple connection holes.

[0028] Beneficial effect: In the prior art, the energy transmission window and the test flange are integrated into a whole, while in this technical solution, a separate test fixture is provided, so that there is no need to separately provide a flange structure for connecting the test structure on the energy transmission window, thereby avoiding affecting the performance of the energy transmission window.

[0029] In this fixture, a slot is provided on the electromagnetic function test module. When the cold side transmission characteristics are required, the upper and lower window frames of the energy transmission window are assembled and inserted into the slot. The connection holes on the electromagnetic function test module facilitate connection with the test flange, thereby connecting the device under test to the test flange at the test end. Using this electromagnetic function test module can effectively reduce material fatigue and damage to key electromagnetic components. In addition, the stepped hole shape of the slot in this solution can serve as a limit for the energy transmission window, and this limit structure is simpler.

[0030] Furthermore, the shape of the upper window frame and the lower window frame after assembly matches the shape of the slot.

[0031] Beneficial effect: Such an arrangement can make the assembled energy transmission window structure and the fixture fit more closely, facilitating later stability testing.

[0032] Furthermore, the upper portion and / or lower portion of the card slot is a square hole.

[0033] Beneficial effect: In this solution, a portion of the slot is a square hole, which limits the circumferential movement of the energy transmission window and prevents the energy transmission window from rotating as a whole during the test, thereby affecting the accuracy of the test.

[0034] Furthermore, the top surface of the electromagnetic function test module is lower than the top surface of the upper window frame inserted into the card slot.

[0035] Beneficial effect: Such a setting can ensure that when the electromagnetic function test module is connected to the test flange at the test end, the upper window frame is tightly attached to the test flange port, avoiding the occurrence of gaps when the upper window frame is not tightly attached to the test flange port after the electromagnetic function test module is connected into place, thereby avoiding the risk of electromagnetic wave leakage.

[0036] Beneficial effects of the present invention:

[0037] (1) Modular design of the energy transmission window: The concept of "electromagnetic function test module" is innovatively introduced. This module is specifically used for cold electromagnetic characteristic testing before and after welding. This design significantly simplifies the testing process and greatly reduces the risk of physical damage to core components. The traditional integrated box-shaped window design is optimized and decomposed into three independent but functionally complementary parts: the upper window frame assembly, the lower window frame assembly and the electromagnetic function test module. This modular solution not only simplifies the structural design of the upper window frame assembly and the lower window frame assembly, but also improves the flexibility and maintainability of the overall system. The innovative electromagnetic test module design can achieve precise coordination with the upper window frame assembly and the lower window frame assembly, effectively preventing extrusion damage to the upper window frame assembly and the lower window sheet assembly at different test stages. This feature not only protects the window frame assembly and the window sheet assembly, but also significantly improves the reliability and life of the entire terahertz energy transmission window system.

[0038] (2) Structural design optimization: The lower window frame assembly has been innovatively improved, with the introduction of an annular groove structure. This design can effectively promote the release and redistribution of thermal stress, significantly reducing damage to the window assembly due to local stress concentration, thereby improving the stability and durability of the overall structure and extending the service life of the energy transmission window.

[0039] (3) Single-sided welding design: This invention adopts a single-sided welding method and cleverly reserves the first solder groove in the lower window frame. This not only simplifies the welding process, but also significantly reduces the complexity of the operation, and improves the consistency of welding quality and production efficiency.

[0040] (4) Airtightness Enhancement Measures: A second soldering groove is designed and reserved at the interface between the upper and lower window frames. This innovation ensures a high degree of airtightness at the interface after welding, significantly improving the reliability, durability, and stability of the overall structure, providing a solid guarantee for long-term stable operation.

[0041] (5) Optimized design of contact surface: The assembly between the upper window frame and the lower window frame is achieved through the mutual cooperation between the bottom column and the bottom hole, and the contact surface between the bottom column and the bottom hole is an inclined surface. This chamfered angle cooperation method can improve the precision of assembly, and this precise design ensures the precise docking of the upper window frame, the lower window frame and the window sheet at the center position, greatly improving the contact quality and the stability of the overall structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, constitute a part of this application, and do not constitute a limitation of the embodiments of the present invention. In the drawings:

[0043] Figure 1 This is a schematic diagram of the structure after the traditional window frame is assembled;

[0044] Figure 2 This is a schematic structural diagram of a terahertz energy transmission window assembly and a fixture assembled according to the present invention;

[0045] Figure 3 This is a schematic structural diagram of the upper window frame of the present invention;

[0046] Figure 4 This is a schematic structural diagram of the lower window frame of the present invention;

[0047] Figure 5 A partial enlarged view of the upper portion of the lower window frame of the present invention;

[0048] Figure 6 This is a schematic structural diagram of a fixture for testing a terahertz energy transmission window assembly according to the present invention;

[0049] Figure 7 2 is a transmission characteristic diagram of an embodiment of the present invention.

[0050] Markings and corresponding parts names in the accompanying drawings:

[0051] Upper window frame 100, upper rectangular waveguide 101, upper circular waveguide 102, upper second solder groove 105, bottom column 106, plug column 1061, lower window frame 200, lower rectangular waveguide 201, lower circular waveguide 202, lower second solder groove 205, bottom hole 206, plug hole 2061, first solder groove 207, annular groove 208, window piece 300, electromagnetic function test module 400, card slot 401, limit hole 402, connecting hole 4. DETAILED DESCRIPTION

[0052] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with examples and drawings. The exemplary embodiments of the present invention and their descriptions are only used to explain the present invention and are not intended to limit the present invention.

[0053] like Figure 1 Figure 1 shows the assembly diagram of a conventional energy transmission window and window frame. The conventional window frame comprises an upper window frame 100, a lower window frame 200, and a window slat 300. The upper window frame 100 is provided with an interconnected upper rectangular waveguide 101 and an upper circular waveguide 102, while the lower window frame 200 is provided with an interconnected lower rectangular waveguide 201 and a lower circular waveguide 202. The outer periphery of the upper window frame 100 is threaded with standard 4-40 UNC threads and is integrally designed with a standard test flange having connection holes 4. The standard upper rectangular waveguide 101 and lower rectangular waveguide 201, the upper circular waveguide 102 and lower circular waveguide 202, and the window slat 300 form the box-shaped energy transmission window.

[0054] The diamond window 300 is metallized by a multi-layer composite thin film metallization method. Two solder sheets are placed on the upper and lower sides of the diamond window 300, and then precisely assembled with the upper window frame 100 and the lower window frame 200 made of oxygen-free copper and then welded.

[0055] like Figure 2 、 Figure 4 and Figure 5 As shown, this embodiment provides a terahertz energy transmission window assembly, including an upper window frame 100 and a lower window frame 200. The upper window frame 100 is provided with an upper rectangular waveguide 101 and an upper circular waveguide 102 connected to each other, and the lower window frame 200 is provided with a lower rectangular waveguide 201 and a lower circular waveguide 202 connected to each other. A window piece 300 is provided between the upper window frame 100 and the lower window frame 200, and the upper circular waveguide 102 and the lower circular waveguide 202 are respectively located on both sides of the window piece 300.

[0056] In this embodiment, the upper window frame 100 is made of nickel-copper, the lower window frame 200 is made of oxygen-free copper, and the window 300 is made of diamond. This unique multi-material design concept not only meets the high requirements of the welding process, but also meets the strong demand for low-loss transmission of terahertz energy transmission windows.

[0057] Combine Figure 4 and Figure 5As shown, in this embodiment, a first solder groove 207 is opened in the lower window frame 200, and the first solder groove 207 is located at the bottom of the window piece 300. In this embodiment, the design protection scope of the first solder groove 207 of the present invention is extremely broad, and its size, shape and groove position are not limited to the specific configuration shown in this embodiment. For example, the outer diameter of the first solder groove 207 can be larger than the outer diameter of the window piece 300, can be smaller than the outer diameter of the window piece 300, or can be equal to the outer diameter of the window piece 300.

[0058] An upper second soldering groove 105 and a lower second soldering groove 205 are respectively provided at the contacting end of the upper window frame 100 and the lower window frame 200 . In this embodiment, the upper second soldering groove 105 and the lower second soldering groove 205 are respectively provided on the interface between the upper window frame 100 and the lower window frame 200 .

[0059] After the upper window frame 100 and the lower window frame 200 are assembled with each other, the upper second solder groove 105 and the lower second solder groove 205 can be interlocked with each other. The size, shape and groove position of the upper second solder groove 105 and the lower second solder groove 205 are also not limited to the specific description in this embodiment. For example, the reserved size of the upper second solder groove 105 and the lower second solder groove 205 can be exactly the same, or there can be a size difference.

[0060] In addition, in this embodiment, the upper second solder trough 105 and the lower second solder trough 205 can be an annular trough structure, or a structure in which multiple troughs are opened and circumferentially distributed. The upper second solder trough 105 and the lower second solder trough 205 are not limited to one, and multiple can also be sufficient. In practice, the upper second solder trough 105 and the lower second solder trough 205 can be arranged into an inner and outer multi-layer structure as needed. This multi-layer trough design provides technical support for more complex structures and higher requirements for air tightness, and this multi-layer trough welding design provides new possibilities for improving the air tightness and stability of the overall structure.

[0061] Solder rings are placed in the first solder tank 207 and the upper second solder tank 105 and / or the lower second solder tank 205, and then the assembled upper window frame 100 and lower window frame 200 are placed in the welding furnace as a whole, and the upper window frame 100 and lower window frame 200 are welded by melting the solder rings.

[0062] like Figure 5 As shown, in one embodiment, a plug hole 2061 is provided at the top and center of the lower window frame 200. Figure 3As shown, the bottom of the upper window frame 100 is a plug post 1061 that matches the insertion hole 2061 and can be inserted into the insertion hole 2061. The bottom of the insertion hole 2061 also has a bottom hole 206. The inner diameter of the bottom hole 206 is smaller than the inner diameter of the insertion hole 2061. The window piece 300 is located at the bottom of the bottom hole 206. The bottom of the plug post 1061 is connected to a bottom column 106 that matches the bottom hole 206. The outer diameter of the bottom column 106 is smaller than the outer diameter of the plug post 1061. The bottom column 106 can be inserted into the bottom hole 206, and the contact surface between the bottom column 106 and the bottom hole 206 is an inclined surface.

[0063] In one embodiment, the bottom hole 206 is a tapered hole, and the bottom post 106 is a tapered post. The inclined contact surface between the bottom post 106 and the bottom hole 206 allows for more precise docking of the upper window frame 100 and the lower window frame 200, thereby ensuring that both the upper circular waveguide 102 and the lower circular waveguide 202 are in contact with the window 300. This improves assembly accuracy, avoids assembly gaps, and thus prevents electromagnetic wave leakage.

[0064] This invention significantly simplifies the soldering process by innovatively employing single-sided soldering technology and ingeniously designing a reserved first solder tank 207 in the lower window frame 200. This design not only reduces operational complexity but also significantly improves soldering efficiency and airtightness. This innovation solves many technical challenges associated with traditional double-sided soldering methods, bringing new breakthroughs to the manufacturing process of high-frequency components.

[0065] In one embodiment, an annular groove 208 is formed within the lower window frame 200 and outside the window 300. The welding process involves metallizing the diamond window 300 using a multi-layer composite thin film metallization method. A solder ring is placed in the first solder groove 207 below the diamond window 300, and another solder ring is placed in the upper second solder groove 105 and the lower second solder groove 205. After the upper window frame 100 and lower window frame 200 components are precisely assembled, welding is performed.

[0066] Due to temperature fluctuations during the welding process, the lower window frame 200 assembly and the diamond window 300 will expand and contract. Given that the thermal expansion coefficient of oxygen-free copper is much greater than that of diamond, the lower window frame 200 assembly will experience significant deformation. An annular groove 208 is reserved near the diamond window 300 to prevent stress conduction near the window 300 during the cooling process, effectively alleviating stress release issues within the diamond window 300 during the heating and cooling process.

[0067] The present invention introduces a unique annular groove 208 design, an innovative structure that effectively promotes stress relief and reduces structural stress. This design significantly improves the stability and durability of components under thermal deformation and physical loads, providing a solid foundation for the long-term reliable operation of high-frequency electronic devices.

[0068] The present invention provides a wide range of protection for the annular groove 208, and its size, shape, and groove position are not limited to the specific configuration shown in this embodiment. This design flexibility provides diverse solutions for stress management in different application scenarios.

[0069] Combine Figure 2 and Figure 6 As shown, another embodiment also discloses a test fixture for a terahertz energy transmission window assembly. This fixture is used to clamp and secure a terahertz energy transmission window assembly such as the one described in the above embodiment. The fixture includes an electromagnetic function test module 400, made of brass. This structure is not used in actual vacuum tubes. It serves only as a modular test fixture for connecting the side component to the test flange at the test end during cold transmission characteristic testing of core components. Using this electromagnetic function test module 400 can effectively reduce material fatigue and damage to key electromagnetic components.

[0070] A card slot 401 is provided on the electromagnetic function test module 400, and the card slot 401 is centrally arranged. In this embodiment, the card slot 401 is a stepped hole structure. When the cold side of the transmission characteristics is required, the upper window frame 100 and the lower window frame 200 of the above-mentioned terahertz energy transmission window assembly can be assembled and inserted into the card slot 401 and confined in the stepped hole structure of the card slot 401. A plurality of connecting holes 4 are provided on the electromagnetic function test module 400, and the connecting holes 4 are used to connect and cooperate with the test flange of the test end.

[0071] like Figure 2 As shown, in this embodiment, the shape of the upper window frame 100 and the lower window frame 200 after assembly matches the shape of the card slot 401, so that the upper window frame 100 and the lower window frame 200 can fit more closely with the card slot 401 after assembly, and the assembly accuracy is higher, which is convenient for subsequent inspection operations.

[0072] In addition, the upper and / or lower parts of the card slot 401 are square holes or polygonal holes. In this embodiment, the lower part of the card slot 401 is set as a square hole or a polygonal hole, and the upper part of the card slot 401 is set as a circular hole. The shapes of the upper window frame 100 and the lower window frame 200 correspond to the shape of the card slot 401. In this embodiment, the parts of the lower window frame 200 and the upper window frame 100 with larger inner diameters in the card slot 401 are circular, and the part of the lower window frame 200 with smaller inner diameters in the card slot 401 is a square or polygonal structure matching the shape of the card slot 401. This can limit the assembled upper window frame 100 and the lower window frame 200 to avoid rotation, thereby ensuring the accuracy and stability of the detection.

[0073] like Figure 2As shown, in this embodiment, the top surface of the electromagnetic function test module 400 is 0.5-2um lower than the top surface of the upper window frame 100 inserted into the card slot 401. This can ensure that the upper window frame 100 is attached to the test flange port of the test end before the electromagnetic function test module 400, thereby reducing the assembly gap and avoiding electromagnetic wave leakage.

[0074] like Figure 7 As shown in FIG. 1 , the transmission characteristics of an embodiment of the present invention are as follows: in the frequency range of 645-680 GHz, the reflection coefficient S11 of the embodiment of the present invention reaches below -15 dB, and the transmission coefficient S21 is higher than -1.5 dB, which verifies the reliability and high energy performance of the terahertz box-shaped window designed in the embodiment.

[0075] Diamonds were grown using the advanced MCD (microcrystalline diamond) method, and the diamond window 300 was treated using innovative multi-layer composite thin-film metallization technology. The window was then precisely assembled and welded to the oxygen-free copper window frame. After welding, a high-precision helium leak detector was used to test the seal tightness. The results showed a helium leak rate of ≤5×10-10 Pa·m³ / s, fully demonstrating the excellent sealing performance of the present invention.

[0076] The electromagnetic functional test module 400 of the present invention has a wide range of technical applications, not limited to the specific case of testing box-shaped energy transmission windows as described in this embodiment. This technology is also applicable to the testing of high-frequency components such as slow-wave structures and various vacuum energy transmission windows. In particular, the present invention provides an effective solution for high-frequency components that require multi-stage testing and have extremely high requirements for component integrity and reliability.

[0077] The electromagnetic functional test module 400 of the present invention has a high degree of flexibility in shape design. Although this embodiment shows a circular, stepped slot 401 design, the scope of protection of the present invention is not limited to this. Other slot 401 shapes and other innovative designs are also within the scope of protection of the present invention.

[0078] The present invention also provides a wide range of possibilities in material selection. In addition to the oxygen-free copper mentioned in the embodiment, the application of other materials such as brass and various alloy materials is within the scope of protection of the present invention.

[0079] The electromagnetic functional test module 400 of the present invention utilizes a unique design concept that allows for precise coordination with the window frame assembly during multiple testing phases. This design significantly reduces the risk of physical damage to core components while ensuring high reliability during electromagnetic property testing before and after welding.

[0080] It should be noted that the above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present application. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

[0081] In the description of the present invention, it should be noted that the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0082] In the description of this document, the terms "up", "down", "left", "right", "front", "back", "top", "bottom", "inside", "outside", "middle", "vertical", "horizontal", "lateral", "longitudinal", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only used to illustrate the relative position relationship between the various components or components, and do not particularly limit the specific installation orientation of the various components or components.

[0083] In the descriptions of this document, some terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0084] In this document, the terms "installed," "disposed," "provided with," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0085] The structures, proportions, sizes, etc. drawn in the drawings in this application are only used to match the contents disclosed in this technical briefing document for those skilled in the art to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose that can be achieved by this application.

[0086] The terms used in this document are those commonly used in the art currently in consideration of the functions of the present disclosure, but these terms may vary according to the intentions of those skilled in the art, precedents, or new technologies in the art. In addition, specific terms may be selected by the applicant, and in such cases, their detailed meanings will be described in the detailed description of the present disclosure. Therefore, the terms used in the document should not be understood as simple names, but rather as a general description based on the meaning of the terms and the present disclosure.

[0087] Flowcharts or text are used in this document to illustrate the operational steps performed according to the embodiments of the present application. It should be understood that the operational steps in the embodiments of the present application are not necessarily performed in the exact order in which they are described. Instead, the various steps may be processed in reverse order or simultaneously, as needed. Furthermore, other operations may be added to these processes, or one or more operations may be removed from these processes.

[0088] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A terahertz energy transmission window assembly, comprising an upper window frame and a lower window frame, wherein the upper window frame is provided with an upper rectangular waveguide and an upper circular waveguide connected to each other, and the lower window frame is provided with a lower rectangular waveguide and a lower circular waveguide connected to each other, a window plate is provided between the upper window frame and the lower window frame, and the upper circular waveguide and the lower circular waveguide are respectively located on either side of the window plate, characterized in that: A first solder groove is formed in the lower window frame, and the first solder groove is located at the bottom of the window piece. An upper second solder groove and a lower second solder groove are respectively formed at the ends of the upper window frame and the lower window frame where they contact each other, and the upper second solder groove and the lower second solder groove can be interlocked after the upper window frame and the lower window frame are assembled with each other; A solder ring is placed in the first solder tank and the upper second solder tank and / or the lower second solder tank, and the upper window frame and the lower window frame are welded by melting the solder ring; a socket is provided at the top of the lower window frame, and a pin that matches the socket is provided at the bottom of the upper window frame, and the pin can be inserted into the socket; a bottom hole is also provided at the bottom of the socket, and the window piece is located at the bottom of the bottom hole; a bottom column that matches the bottom hole is connected to the bottom of the pin, and the bottom column can be inserted into the bottom hole, and the contact surface between the bottom column and the bottom hole is an inclined surface.

2. The terahertz energy transmission window assembly according to claim 1, characterized in that: The bottom hole is a tapered hole, and the bottom column is a tapered column.

3. A terahertz energy transmission window assembly according to any one of claims 1-2, characterized in that: The upper window frame is made of nickel-copper, the lower window frame is made of oxygen-free copper, and the window sheet is made of diamond.

4. The terahertz energy transmission window assembly according to claim 3, characterized in that: An annular groove is provided in the lower window frame and outside the window sheet.

5. A test fixture for a terahertz energy transmission window assembly, characterized in that: A terahertz energy transmission window assembly as described in any one of claims 1 to 4 is clamped and fixed, including an electromagnetic function test module, wherein a card slot is provided on the electromagnetic function test module, and the card slot is a stepped hole structure. The upper window frame and the lower window frame of the terahertz energy transmission window assembly are assembled and inserted into the card slot, and the electromagnetic function test module is provided with multiple connecting holes; the top surface of the electromagnetic function test module is lower than the top surface of the upper window frame inserted into the card slot.

6. A test fixture for a terahertz energy transmission window assembly according to claim 5, characterized in that: The shapes of the upper and lower window frames after assembly match the shape of the slot.

7. A test fixture for a terahertz energy transmission window assembly according to claim 6, characterized in that: The upper portion and / or lower portion of the card slot is a square hole or a polygonal hole.

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