Dynamic compensation method, system and equipment for PCB (Printed Circuit Board) processing equipment and medium

Abstract

The invention discloses a method, a system and equipment for dynamic compensation of PCB (Printed Circuit Board) processing equipment and a medium. The method comprises the following steps: monitoring and collecting actual temperature data of parts of the PCB processing equipment in work; determining a temperature interval to which the actual temperature data belongs according to the actual temperature data; acquiring an expansion coefficient of the component according to the temperature interval; calculating the actual displacement required to be compensated through the expansion coefficient; and performing motion compensation on the corresponding part according to the displacement. According to the invention, the position feedback data is compensated under the most suitable actual expansion and contraction coefficient matched with the temperature and the compensation mode, and the compensation precision is effectively improved. Through the temperature monitoring and compensation technology, the precision loss of the PCB processing equipment caused by temperature change is remarkably reduced, the overall performance of the equipment is improved, the service life is prolonged, the PCB processing equipment is particularly suitable for precision processing occasions, and the product quality and the production efficiency are improved.

Description

Technical Field

[0001] The present application relates to the field of machine tool processing technology, and in particular to a method, system, equipment and medium for dynamic compensation of PCB processing equipment. Background Art

[0002] As the processing accuracy requirements of PCB processing equipment such as PCB drilling machines continue to increase, the impact of factors such as ambient temperature changes and thermal deformation caused by workload on equipment accuracy has become increasingly prominent. The existing technology cannot effectively control the displacement error caused by thermal expansion and contraction of key components, resulting in precision loss and performance degradation of PCB processing equipment. Summary of the invention

[0003] The main purpose of the present application is to provide a method, system, device and medium for dynamic compensation of PCB processing equipment, which can solve the technical problem in the prior art that PCB processing equipment produces displacement error and precision loss due to thermal expansion and contraction.

[0004] To achieve the above-mentioned purpose, the first aspect of the present application provides a method for dynamic compensation of PCB processing equipment, the method comprising:

[0005] Monitor and collect actual temperature data of components of PCB processing equipment during operation;

[0006] According to the actual temperature data, determine the temperature range to which the actual temperature data belongs;

[0007] Obtain the expansion and contraction coefficient of the component according to the temperature range;

[0008] Calculate the actual displacement that needs to be compensated through the expansion and contraction coefficient;

[0009] The corresponding components are motion compensated according to the displacement.

[0010] To achieve the above-mentioned purpose, the second aspect of the present application provides a system for dynamic compensation of PCB processing equipment, the system comprising: a control module and a temperature sensor;

[0011] Temperature sensors are provided in various parts of the PCB processing equipment, including the workbench, the crossbeam and the grating ruler;

[0012] Temperature sensor, used to monitor the operating temperature of each component and transmit the actual temperature data to the control module;

[0013] A control module is used to dynamically compensate the PCB processing equipment according to any of the above methods.

[0014] To achieve the above-mentioned purpose, the third aspect of the present application provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, the processor performs the following steps:

[0015] Monitor and collect actual temperature data of components of PCB processing equipment during operation;

[0016] According to the actual temperature data, determine the temperature range to which the actual temperature data belongs;

[0017] Obtain the expansion and contraction coefficient of the component according to the temperature range;

[0018] Calculate the actual displacement that needs to be compensated through the expansion and contraction coefficient;

[0019] The corresponding components are motion compensated according to the displacement.

[0020] To achieve the above-mentioned purpose, the fourth aspect of the present application provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor performs the following steps:

[0021] Monitor and collect actual temperature data of components of PCB processing equipment during operation;

[0022] According to the actual temperature data, determine the temperature range to which the actual temperature data belongs;

[0023] Obtain the expansion and contraction coefficient of the component according to the temperature range;

[0024] Calculate the actual displacement that needs to be compensated through the expansion and contraction coefficient;

[0025] The corresponding components are motion compensated according to the displacement.

[0026] The embodiments of the present application have the following beneficial effects:

[0027] Through temperature monitoring, each component can be switched to the most suitable actual expansion and contraction coefficient that matches the temperature, and the position feedback data can be compensated in the most suitable compensation mode, which effectively improves the compensation accuracy. Through temperature monitoring and compensation technology, this application significantly reduces the accuracy loss of PCB processing equipment caused by temperature changes, improves the overall performance of the equipment, and extends the service life. It is especially suitable for precision processing occasions and improves product quality and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0029] in:

[0030] Figure 1 This is a flow chart of a method for dynamic compensation of PCB processing equipment in an embodiment of the present application;

[0031] Figure 2 This is a structural block diagram of a system for dynamic compensation of PCB processing equipment in an embodiment of the present application;

[0032] Figure 3 It is a structural block diagram of a computer device in an embodiment of the present application. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0034] like Figure 1 As shown, in one embodiment, a method for dynamic compensation of PCB processing equipment is provided. The method can be applied to both a terminal and a server. The method for dynamic compensation of PCB processing equipment specifically includes the following steps:

[0035] S100: Monitor and collect actual temperature data of components of PCB processing equipment during operation.

[0036] Specifically, the method for dynamic compensation of PCB processing equipment can be applied to a system for dynamic compensation of PCB processing equipment.

[0037] The PCB processing equipment of the present application may specifically be a processing equipment with an XYZ three-axis grating ruler. For example, the PCB processing equipment may be a PCB drilling machine, a PCB forming machine, or a drilling and gong integrated machine, etc., and the present application does not limit this.

[0038] The present application can use a temperature sensor to monitor and collect actual temperature data of each component of the PCB processing equipment. The temperature sensor is arranged on at least one component to be monitored in the PCB processing equipment. The high-precision temperature sensor can be used to monitor and obtain the actual temperature data of each component in real time.

[0039] The data collected by the temperature sensor can be sent to the system at a time interval of one second or shorter, and this application does not impose any limitation on this.

[0040] The components are key mechanical parts in the PCB processing equipment that are greatly affected by thermal expansion and contraction. The components may include, for example, a grating ruler (such as an XYZ three-axis grating ruler), and may also include one or more components such as the bed, beam, spindle, guide rail or linear guide rail, XYZ three-axis spindle motor, slider and grating ruler base of the PCB processing equipment. This application does not impose any restrictions on this.

[0041] For example, in the field of mechanical drilling machines, temperature sensors are designed on the beam and the XYZ axis grating scale of the platform, which only compensates for the temperature expansion and contraction changes of the grating scale. The grating scale and the platform are made of different materials, and the expansion and contraction coefficients will also be different. For example, when the current expansion and contraction of the grating scale XY axis is 0, the platform may expand and contract to 1. When the moving coordinate is X0Y0, the platform may actually be X0Y1. Therefore, it is necessary to set the temperature compensation for the platform.

[0042] Among them, the grating ruler, also known as the grating ruler displacement sensor (grating ruler sensor), is a measurement feedback device that works on the optical principle of the grating. The grating ruler is often used in the closed-loop servo system of CNC machine tools and can be used to detect linear displacement or angular displacement. The measurement output signal is a digital pulse, which has the characteristics of large detection range, high detection accuracy and fast response speed. For example, it is often used in CNC machine tools to detect the coordinates of tools and workpieces to observe and track tool feeding errors, so as to play a role in compensating for tool motion errors. Grating rulers are divided into transmission gratings and reflection gratings according to different manufacturing methods and optical principles.

[0043] S200: Determine, according to the actual temperature data, a temperature range to which the actual temperature data belongs.

[0044] S300: Acquire the expansion / contraction coefficient of the component according to the temperature range.

[0045] Specifically, the same component has a corresponding expansion / contraction coefficient in different temperature ranges. According to the relationship between the temperature range and the expansion / contraction coefficient, the expansion / contraction coefficient of the component can be dynamically matched in real time.

[0046] Among them, the expansion coefficient is the thermal expansion coefficient.

[0047] The actual length of mechanical parts and grating rulers changing with (due to) temperature can be calculated based on the actual temperature data. The actual expansion coefficient, that is, the actual thermal expansion coefficient, can be calculated based on the theoretical length at standard temperature and the actual length.

[0048] S400: Calculating the displacement actually required to be compensated by using the expansion / contraction coefficient.

[0049] S500: Perform motion compensation on corresponding components according to the displacement.

[0050] Specifically, the position feedback data or displacement of the component is adjusted according to the expansion and contraction coefficient, the expansion and contraction coefficient package is updated according to the actual expansion and contraction coefficient, and the drilling file coordinates are re-compensated according to the updated expansion and contraction coefficient package.

[0051] More specifically, after obtaining the actual expansion / contraction coefficient, the original compensation expansion / contraction coefficient is replaced, and the compensation amount is calculated based on the actual expansion / contraction coefficient. According to the compensation amount, the position feedback data or displacement of the target component whose temperature has changed can be adjusted to correct the position of the target component.

[0052] By correcting the current position feedback data of the target component and achieving dynamic compensation, the actual position perceived by the machine tool can be kept consistent with the real physical position. This ensures that the component can move along the set precise path even under temperature changes, effectively preventing precision errors caused by thermal expansion.

[0053] The above steps S100-S500 are executed cyclically, the temperature is continuously monitored, and the compensation parameters (expansion and contraction coefficients) of the target components with temperature changes are continuously updated to ensure the effectiveness and accuracy of dynamic compensation. The compensation measures are dynamically adjusted according to the real-time changing temperature data, so as to respond to the impact of temperature fluctuations in a timely manner.

[0054] Among them, the component that needs motion compensation can be a component where there is a difference between the current actual operating temperature and the previous actual operating temperature (or, the previous actual operating temperature); it can also be a component where the temperature range between the current actual operating temperature and the previous actual operating temperature changes; it can also be a component where the current actual operating temperature remains in a new temperature range for a continuous preset time period relative to the previous temperature range, etc. The present application does not impose any restrictions on this.

[0055] In the prior art, when installing and debugging equipment, a standard temperature such as 22°C is used for debugging and installation. There is only one compensation expansion and contraction coefficient. During production and processing, the equipment will be controlled to be kept at 22°C as much as possible to ensure processing accuracy. In this embodiment, there is no need to control the processing accuracy from the perspective of temperature control, but to control the accuracy from the perspective of expansion and contraction coefficient. The accuracy control is more efficient, convenient and accurate.

[0056] Through temperature monitoring, each component can be switched to the most suitable actual expansion and contraction coefficient that matches the temperature, and the position feedback data can be compensated in the most suitable compensation mode, which effectively improves the compensation accuracy, especially reduces the displacement error of the grating ruler. Through temperature monitoring and compensation technology, this embodiment significantly reduces the accuracy loss of PCB processing equipment caused by temperature changes, improves the overall performance of the equipment, and extends the service life. It is particularly suitable for precision processing occasions and improves product quality and production efficiency.

[0057] In one embodiment, the PCB processing equipment includes at least one grating ruler, and the method specifically includes:

[0058] Monitor and collect actual temperature data of each grating ruler during operation;

[0059] According to each actual temperature data, determine the temperature range to which each actual temperature data belongs;

[0060] Obtain the expansion and contraction coefficient corresponding to each grating ruler according to each temperature range;

[0061] Calculate the actual displacement that needs to be compensated through each expansion and contraction coefficient;

[0062] Independent motion compensation is performed on the corresponding grating scale according to each displacement.

[0063] Specifically, if the component is a grating ruler, the method includes temperature monitoring and motion compensation of the grating ruler.

[0064] The grating ruler can specifically be an XYZ three-axis grating ruler, including an X-axis grating ruler, a Y-axis grating ruler and a Z-axis grating ruler, a total of three single-axis grating rulers.

[0065] This embodiment has the function of independent temperature monitoring and compensation for the grating rulers of each axis. Each single-axis grating ruler is equipped with a temperature sensor. Therefore, the actual temperature data of each single-axis grating ruler can be independently monitored, and whether a temperature change occurs can be determined based on the actual temperature data of each single-axis grating ruler, and the actual expansion and contraction coefficient of the single-axis grating ruler can be obtained when a temperature change occurs. Independent dynamic compensation of the single-axis grating ruler is achieved.

[0066] For example, if the temperature of the X-axis increases and causes the length of the grating scale to change, while the temperature of the Y-axis and Z-axis remain stable, then only the feedback data of the X-axis is temperature compensated, which does not affect the positioning accuracy of the Y-axis and Z-axis. This independent compensation mechanism ensures that each axis can get the most suitable compensation according to its own temperature conditions, avoiding mutual interference, thereby improving the overall three-dimensional positioning accuracy.

[0067] In addition, it should be noted that the temperature sensor provided for each component is provided with a sensor identification, and the component to which the acquired temperature data belongs can be determined according to the sensor identification.

[0068] This embodiment performs independent compensation calculations based on the temperature changes of each single-axis grating ruler, ensuring that the positioning accuracy of each axis of the grating ruler is not affected by the thermal effects of other axes.

[0069] In one embodiment, obtaining the expansion / contraction coefficient of the component according to the temperature range in step S300 includes:

[0070] The component whose temperature range changes is regarded as the target component;

[0071] According to the mapping relationship between the temperature range corresponding to the target component and the expansion / contraction coefficient, the expansion / contraction coefficient of the target component in the current target temperature range is obtained.

[0072] Specifically, the current actual operating temperature of the component whose temperature changes before and after is obtained according to the actual temperature data, and the target temperature range of the current actual operating temperature and the previous temperature range of the component are determined; if the temperature range of the component whose temperature changes changes changes, the component whose temperature changes is taken as the target component; based on the mapping relationship between the temperature range corresponding to the target component and the expansion and contraction coefficient, the actual expansion and contraction coefficient of the target temperature range in which the target component is currently located is obtained.

[0073] More specifically, if the target temperature interval of the component is currently different from the previous temperature interval, the component whose temperature has changed is taken as the target component.

[0074] If the current target temperature range of the component is the same as the previous temperature range, the component whose temperature has changed cannot be used as the target component, that is, there is no need to replace and update the expansion and contraction coefficient.

[0075] The target component is a component whose temperature range changes and which needs to have its expansion and contraction coefficient replaced and updated.

[0076] Because the thermal expansion coefficient of a material often changes with temperature, different compensation coefficients are required at different temperatures to achieve the best effect. Based on this, the present embodiment presets in advance the mapping relationship between the temperature range corresponding to the target component and the expansion and contraction coefficient. The same component has a corresponding expansion and contraction coefficient in different temperature ranges.

[0077] Therefore, according to the mapping relationship between the temperature range corresponding to the target component and the expansion / contraction coefficient, the actual expansion / contraction coefficient of the target temperature range in which the target component is currently located can be obtained by searching and matching.

[0078] The actual expansion coefficient of the target temperature range is the target expansion coefficient of the target component at the current actual operating temperature.

[0079] Taking the component as an example, if it is monitored according to the actual temperature data that the working temperature of any one or more single-axis grating rulers changes, the expansion and contraction coefficient of each target single-axis grating ruler whose temperature changes is obtained.

[0080] The specific steps of this embodiment are: presetting the expansion and contraction coefficients of important components at different temperatures; setting the expansion and contraction coefficients in temperature ranges; the sensor collects temperature information and feeds it back to the control system; the control system replaces the expansion and contraction coefficient package; for example, a mechanical drilling machine: after replacing the expansion and contraction coefficient package, re-compensate the drilling file coordinates.

[0081] In this embodiment, when the device is in different temperature ranges, it can automatically switch to the most suitable compensation mode to improve the compensation accuracy. For example, a smaller compensation amount may be required at low temperatures, while a larger compensation amount may be required at high temperatures.

[0082] This embodiment timely adjusts and replaces the expansion and contraction coefficient of the target component when the temperature range changes, that is, the expansion and contraction coefficient is adjusted from the expansion and contraction coefficient of the previous temperature range to the expansion and contraction coefficient of the target temperature range, thereby achieving real-time or timely temperature compensation.

[0083] This embodiment can accurately judge and determine the target component that needs to update the expansion and contraction coefficient by whether the temperature interval changes. According to the mapping relationship between the preset temperature interval and the expansion and contraction coefficient, the actual expansion and contraction coefficient of the target component at the current actual working temperature can be accurately obtained, realizing real-time or timely temperature compensation. In addition, by setting different temperature intervals and using the corresponding compensation expansion and contraction coefficient for each temperature interval, the thermal deformation behavior of the equipment in a wide temperature range can be more accurately simulated, and dynamic position compensation can be performed, which can effectively offset the displacement error caused by thermal expansion and contraction.

[0084] In one embodiment, the step S300 of obtaining the expansion / contraction coefficient of the component according to the temperature range includes:

[0085] The component whose temperature range changes is regarded as the target component;

[0086] Calculating the expansion / contraction coefficient of the target component at the current actual working temperature according to the expansion / contraction coefficient of the target temperature interval in which the target component is currently located and the temperature difference between the sub-temperatures contained in the target temperature interval, wherein each temperature interval contains a number of sub-temperatures, and there is a corresponding temperature difference between adjacent sub-temperatures;

[0087] or;

[0088] The expansion / contraction coefficient of the target component at the current actual working temperature is calculated according to the expansion / contraction coefficient of the target temperature interval in which the target component is currently located, the expansion / contraction coefficient of the adjacent temperature interval and the temperature difference between the sub-temperatures.

[0089] Specifically, the current actual operating temperature of the component whose temperature changes before and after is obtained according to the actual temperature data, and the target temperature interval in which the current actual operating temperature is located and the previous temperature interval in which the component was previously located are determined;

[0090] If the current target temperature interval of the component is different from the previous temperature interval, the component whose temperature has changed is used as the target component.

[0091] If the current target temperature range of the component is the same as the previous temperature range, the component whose temperature has changed cannot be used as the target component, that is, there is no need to replace and update the expansion and contraction coefficient.

[0092] The target component is a component whose temperature range changes and which needs to have its expansion and contraction coefficient replaced and updated.

[0093] The mapping relationship between the temperature range and the expansion coefficient corresponding to the target component is preset in advance. The same component has a corresponding expansion coefficient in different temperature ranges.

[0094] This embodiment can calculate the actual expansion coefficient of the target component at the current actual operating temperature based on the sum of the actual expansion coefficients of the target temperature interval and the adjacent temperature intervals where the target component is currently located, the proportion of the current actual operating temperature in the target temperature interval, and the maximum temperature difference between the target temperature interval and the adjacent temperature interval.

[0095] In a specific embodiment, the actual expansion / contraction coefficient of the target component at the current actual working temperature is calculated based on the expansion / contraction coefficient of the target temperature interval in which the target component is currently located and the temperature difference between the sub-temperatures included in the target temperature interval.

[0096] For example, different temperature intervals correspond to different temperature ranges. For example, taking 1°C as the difference between the highest temperature and the lowest temperature of a temperature interval, 18°C-18.9°C is a temperature interval, and the corresponding expansion and contraction coefficient is k1; 19°C-19.9°C is a temperature interval, and the corresponding expansion and contraction coefficient is k2; 20°C-20.9°C is a temperature interval, and the corresponding expansion and contraction coefficient is k3; 21°C-21.9°C is a temperature interval, and the corresponding expansion and contraction coefficient is k4; 22°C-22.9°C is a temperature interval, and the corresponding expansion and contraction coefficient is k5; 23°C-23.9°C is a temperature interval, and the corresponding expansion and contraction coefficient is k6; 24°C-24.9°C is a temperature interval, and the corresponding expansion and contraction coefficient is k7; ... and so on.

[0097] The expansion coefficient of each temperature interval is equivalent to the average expansion coefficient of all sub-temperatures in the temperature interval. That is:

[0098]

[0099] Among them, k n is the expansion / contraction coefficient corresponding to the target temperature range, k n1 , k n2 ,...k n(m-1) is the expansion and contraction coefficient of the 1st to m-1st sub-temperatures; q is the difference between the expansion and contraction coefficients of two adjacent sub-temperatures, and m is the number of sub-temperatures in the target temperature range.

[0100] If the current actual working temperature is 23.6℃, ​​which is within the target temperature range of 23℃-23.9℃, the corresponding expansion / contraction coefficient is k6.

[0101] The target temperature range of 23℃-23.9℃ is divided into 10 sub-temperatures with intervals of 0.1℃: 23.0℃, 23.1℃, 23.2℃, 23.3℃, ​​23.4℃, 23.5℃, 23.6℃, ​​23.7℃, 23.8℃, and 23.9℃.

[0102] Therefore, m = 10, k n = k6, q is the difference in expansion and contraction coefficients of two adjacent sub-temperatures when the temperature difference between the adjacent sub-temperatures is 0.1°C, which is a known quantity. q can be calculated in advance based on experimental data.

[0103] Therefore, according to Formula 1, k can be calculated n1 , k n2 ,...k n10 Any value in .

[0104] k n6 =k n1 +5q

[0105] Among them, 23.6℃ corresponds to k n6 .

[0106] In another specific embodiment, the adjacent temperature interval is a temperature interval previous to the target temperature interval or a temperature interval next to the target temperature interval, or the adjacent temperature interval includes a temperature interval previous to the target temperature interval and a temperature interval next to the target temperature interval.

[0107] The average expansion and contraction coefficient can be calculated based on the original expansion and contraction coefficient of the target temperature range and the original expansion and contraction coefficient of the adjacent temperature range, and the average expansion and contraction coefficient is used as the updated expansion and contraction coefficient k of the target temperature range. n, calculate the expansion and contraction coefficient of the target component at the current actual working temperature according to the following formula 2.

[0108]

[0109] Among them, k n is the expansion coefficient updated in the target temperature range, specifically the average expansion coefficient, k n1 , k n2 ,...k nm is the expansion and contraction coefficient of the 1st to mth sub-temperatures; q is the difference between the expansion and contraction coefficients of two adjacent sub-temperatures, and m is the number of sub-temperatures in the target temperature range.

[0110] According to formula 2, k can be calculated n1 , k n2 ,...k n10 The current actual operating temperature is a sub-temperature in the target temperature range.

[0111] If the current actual working temperature is 23.6℃, ​​which is in the target temperature range of 23℃-23.9℃, the corresponding expansion coefficient is k6. The previous temperature range is 22℃-22.9℃, the corresponding expansion coefficient is k5; the next temperature range is 24℃-24.9℃, the corresponding expansion coefficient is k7.

[0112] In addition, in a specific embodiment, if the current actual operating temperature accounts for a proportion of the target temperature range that is greater than 0.5, for example, (23.6°C-23°C) / (23.9°C-23°C)=0.67 is greater than 0.5, then the adjacent temperature range is the next temperature range of the target temperature range.

[0113] If the proportion of the current actual operating temperature in the target temperature range is less than 0.5, for example, (23.4° C.-23° C.) / (23.9° C.-23° C.)=0.44 is less than 0.5, then the adjacent temperature range is the previous temperature range of the target temperature range.

[0114] If the proportion of the current actual operating temperature in the target temperature interval is equal to 0.5, the adjacent temperature interval includes the previous temperature interval and / or the next temperature interval of the target temperature interval.

[0115] This embodiment further divides the target temperature range into a plurality of sub-temperatures, so that the calculation of the actual expansion / contraction coefficient in a smaller range can be realized, and the obtained expansion / contraction coefficient of the current actual operating temperature is more accurate.

[0116] In one embodiment, taking a component whose temperature range changes as a target component includes:

[0117] Monitor whether the temperature of each component changes according to the actual temperature data. If the actual operating temperature of the component whose temperature has changed is always in the same target temperature range within a continuous first preset time period, the component whose temperature has changed will be used as the target component whose temperature range has changed, wherein the target temperature range is different from the previous temperature range in which the target component was before the first preset time period.

[0118] Specifically, the current actual operating temperature of the component whose temperature has changed is obtained according to the actual temperature data, and the target temperature interval in which the current actual operating temperature is located and the previous temperature interval in which the component is located are determined;

[0119] If the actual operating temperature of a component is always within the target temperature range within a continuous first preset time period, that is, different from the previous temperature range before the first preset time period, the component with the changed temperature is taken as the target component.

[0120] Monitor each component for temperature changes based on actual temperature data, and obtain the expansion and contraction coefficient of the target component whose temperature changes. The target component whose temperature range changes may include the XYZ three-axis grating ruler and other components, or the target component whose temperature range changes may include other components in addition to the XYZ three-axis grating ruler, which is determined by temperature measurement according to actual working conditions.

[0121] This embodiment continuously determines whether the component jumps from the previous temperature range to the target temperature range and maintains the first preset time in the target temperature range. The expansion and contraction coefficient of the component is replaced only after it is determined that the component maintains the first preset time in the new target temperature range, that is, the expansion and contraction coefficient obtained from the previous temperature range is replaced by the expansion and contraction coefficient obtained from the target temperature range. This can reduce the frequent replacement of the expansion and contraction coefficient when the component temperature is unstable. Replacing the expansion and contraction coefficient after the temperature is stable ensures the stable performance of the PCB processing equipment and the control system.

[0122] In one embodiment, the mapping relationship between the temperature range and the expansion / contraction coefficient is obtained by the following steps:

[0123] Obtain the standard dimension length of the component at standard temperature;

[0124] Obtaining the actual dimension length of the component at any first temperature different from the standard temperature;

[0125] The ratio of the actual dimension length to the standard dimension length is used as the expansion / contraction coefficient of the component in a first temperature interval corresponding to the first temperature, wherein any temperature interval does not include the standard temperature.

[0126] Specifically, the standard dimension length at the standard temperature is the theoretical dimension length at the ideal working temperature. For example, if the standard temperature is 22°C, the standard dimension length is the dimension length of the component at a working temperature of 22°C.

[0127] The first temperature is any temperature other than the standard temperature, for example, 21.5°C, 21°C, 20.5°C, 23°C, 22.5°C, 24°C, etc., and this application does not impose any limitation on this.

[0128] If the component is a grating ruler, obtain the standard size length of the grating ruler at the standard temperature;

[0129] Obtaining the actual dimension length of the grating ruler at any first temperature different from the standard temperature;

[0130] The ratio of the actual dimension length to the standard dimension length is used as the expansion / contraction coefficient of the grating ruler in the first temperature range corresponding to the first temperature.

[0131] Of course, it is also possible to obtain the standard dimension length of the single-axis grating ruler at the standard temperature; obtain the actual dimension length of the single-axis grating ruler at any first temperature different from the standard temperature; and use the ratio of the actual dimension length to the standard dimension length as the expansion and contraction coefficient of the single-axis grating ruler in the first temperature range corresponding to the first temperature.

[0132] For example, the first temperature interval is the interval [first temperature, first temperature+first temperature interval] or [first temperature-second temperature interval, first temperature+third temperature interval].

[0133] The interval is, for example: (22, 22.5] or [21.5, 22) or (22, 23], etc., and this application does not impose any limitation on this.

[0134] For example, the standard length of a single-axis grating ruler at standard temperature is 100mm, and the actual length (expansion and contraction due to temperature change) at a first temperature (the first temperature is greater than the standard temperature, such as 23°C) is 101mm. The actual expansion and contraction coefficient of the single-axis grating ruler at 23°C is 101÷100=1.01.

[0135] Similarly, the actual dimensional lengths at different first temperatures can be measured in advance, the actual expansion and contraction coefficients can be calculated, and a mapping relationship between the temperature range and the expansion and contraction coefficients can be constructed.

[0136] In addition, if the component is a grating ruler, each single-axis grating corresponds to a mapping relationship between a set of temperature ranges and expansion and contraction coefficients.

[0137] Taking a mechanical drilling machine as an example, the main factors affecting the machine are the grating ruler and the platform that carries the processed material. Taking the Y-axis grating ruler as an example, a laser interferometer can be used to measure the actual length data of the Y-axis grating ruler under different temperature changes, and then the expansion and contraction coefficient under different temperatures can be calculated.

[0138] In this embodiment, by obtaining the actual length of the key part at different temperatures, the expansion and contraction coefficient and the mapping relationship at different temperatures can be simply and conveniently obtained according to the actual length and the standard length.

[0139] In one embodiment, calculating the displacement amount actually required to be compensated by using the expansion / contraction coefficient includes:

[0140] According to the product of the expansion and contraction coefficient of the target component and the expected displacement of the target component at the standard temperature, the actual displacement of the target component corresponding to the expected displacement after the temperature changes is obtained;

[0141] Subtract the expected displacement from the actual displacement to obtain the displacement error;

[0142] The displacement error is used to compensate the expected displacement to obtain the actual displacement that needs to be compensated for the target component.

[0143] Specifically, actual expansion / contraction coefficient=actual length / theoretical length.

[0144] If the target component is a target single-axis grating ruler, the actual displacement of the target single-axis grating ruler after the temperature change is obtained based on the product of the actual expansion and contraction coefficient of the target single-axis grating ruler and the expected displacement of the target single-axis grating ruler at the standard temperature; the expected displacement is subtracted from the actual displacement to obtain the displacement error; the expected displacement is compensated using the displacement error to obtain the position feedback data (displacement) of the target single-axis grating ruler.

[0145] Taking a single-axis grating ruler as an example, the distance from point A to point B of the single-axis grating ruler is 100mm. The current temperature of the single-axis grating ruler is the first temperature which is a non-standard temperature. The actual length of expansion and contraction due to temperature change is 101mm. At this time, the expansion and contraction coefficient of the single-axis grating ruler is 101÷100=1.01.

[0146] If the current coordinate of point A is X0, and it moves 50mm along the X direction to point B, because the grating ruler is the equipment scale, if it is at standard temperature, theoretically point A needs to move 50mm along the X direction according to the grating ruler.

[0147] However, due to temperature changes, the 50mm of the grating ruler is not the theoretical 50mm. The 50mm of the grating ruler is actually (101÷100)*50=50.5mm (actual distance).

[0148] If point A moves 50 mm along the X direction according to the grating ruler at the first temperature, due to the inaccurate scale of the single-axis grating ruler and thermal expansion, point A actually moves 50.5 mm, which is inconsistent with the expected 50 mm.

[0149] Now the error value (displacement error) is known, and the error value is compensated to the single-axis grating ruler, the error value is 50-50.5=-0.5, that is, the grating ruler only needs to move 50mm-0.5mm=49.5mm to achieve the actual distance requirement of 50mm. That is, the position feedback data of the single-axis grating ruler is X0+49.5mm or X0-49.5mm.

[0150] The position feedback data or actual displacement of other components are calculated in the same way as the single-axis grating ruler and will not be repeated here.

[0151] In addition, if the length of the component is shortened due to a drop in temperature, the actual displacement = expected displacement + displacement error.

[0152] The position correction of the mechanical structure is achieved through compensation of the expansion and contraction coefficient. Adjusting the compensation coefficient or the expansion and contraction coefficient is a method of adjusting the control parameters of the equipment. A control instruction after compensation adjustment is generated according to the updated actual expansion and contraction coefficient. Executing the adjusted control instruction can ensure that the equipment can still maintain high-precision operation under temperature changes.

[0153] This embodiment accurately calculates the actual displacement or actual position feedback data of the target component through the actual expansion and contraction coefficient and the expected displacement.

[0154] This application establishes a mapping relationship between temperature and expansion coefficient in advance through the collection and processing of temperature sensor data, calculates the compensation amount based on the actual expansion coefficient using a compensation model, and updates it to the control system in real time, thereby correcting the measurement data of components including the XYZ three-axis grating ruler, thereby achieving the purpose of improving the overall equipment accuracy.

[0155] In one embodiment, the PCB processing equipment further includes a workbench, and the method specifically includes:

[0156] The workbench is placed under different temperature conditions, and the expansion and contraction coefficients of the workbench at different temperatures are measured using a drilling precision plate, or the expansion and contraction coefficients of the workbench at different temperatures are measured by drilling holes on the workbench, and a mapping relationship between the temperature range of the workbench and the expansion and contraction coefficient is obtained according to the measured expansion and contraction coefficients;

[0157] Monitoring and collecting actual temperature data of the workbench during operation;

[0158] Determining the temperature range to which the workbench belongs according to the actual temperature data;

[0159] Based on the mapping relationship between the temperature range of the workbench and the expansion / contraction coefficient, the expansion / contraction coefficient corresponding to the workbench is obtained according to the temperature range;

[0160] Calculating the displacement amount that the workbench actually needs to compensate for through the expansion and contraction coefficient;

[0161] The workbench is independently motion compensated according to the displacement.

[0162] Specifically, since there is no scale reference for the expansion and contraction data of the Y-axis platform, a drilling precision plate can be used, or holes can be drilled on the platform. The platform can be placed under different temperature conditions to measure the actual size and length data of the platform, and then the expansion and contraction coefficients at different temperatures can be calculated.

[0163] refer to Figure 2 ,This application also provides a system for dynamic compensation of PCB processing equipment, the system comprising: a control module and a temperature sensor;

[0164] A temperature sensor is provided at least one of the components of the PCB processing equipment, wherein the components include a workbench, a crossbeam and a grating ruler;

[0165] Temperature sensor, used to monitor the operating temperature of each component and transmit the actual temperature data to the control module;

[0166] A control module is used to dynamically compensate the PCB processing equipment according to any of the above methods.

[0167] In one embodiment, the control module specifically includes:

[0168] A temperature data acquisition module, used to monitor and collect actual temperature data of each grating ruler during operation;

[0169] An interval determination module, used for determining the temperature interval to which each actual temperature data belongs according to each actual temperature data;

[0170] An expansion / contraction coefficient acquisition module, used for acquiring the expansion / contraction coefficient corresponding to each of the grating rulers according to each of the temperature intervals;

[0171] A calculation module, used for respectively calculating the displacement amount actually required to be compensated through each of the expansion and contraction coefficients;

[0172] The compensation module is used to perform independent motion compensation on the corresponding grating ruler according to each displacement.

[0173] In one embodiment, the PCB processing equipment includes at least one grating ruler, and the method specifically includes:

[0174] A temperature data acquisition module, used to monitor and collect actual temperature data of each grating ruler during operation;

[0175] An interval determination module, used for determining the temperature interval to which each actual temperature data belongs according to each actual temperature data;

[0176] An expansion / contraction coefficient acquisition module, used for acquiring the expansion / contraction coefficient corresponding to each of the grating rulers according to each of the temperature intervals;

[0177] A calculation module, used for respectively calculating the displacement amount actually required to be compensated through each of the expansion and contraction coefficients;

[0178] The compensation module is used to perform independent motion compensation on the corresponding grating ruler according to each displacement.

[0179] In one embodiment, the expansion / contraction coefficient acquisition module specifically includes:

[0180] An interval change judgment module is used to take the components whose temperature interval changes as target components;

[0181] The expansion / contraction coefficient matching module is used to obtain the expansion / contraction coefficient of the target component in the current target temperature range according to the mapping relationship between the temperature range corresponding to the target component and the expansion / contraction coefficient.

[0182] In one embodiment, the expansion / contraction coefficient acquisition module specifically includes:

[0183] An interval change judgment module is used to take the components whose temperature interval changes as target components;

[0184] an expansion / contraction coefficient calculation module, configured to calculate the expansion / contraction coefficient of the target component at the current actual working temperature according to the expansion / contraction coefficient of the target temperature interval in which the target component is currently located and the temperature difference between the sub-temperatures contained in the target temperature interval, wherein each temperature interval contains a plurality of sub-temperatures, and there is a corresponding temperature difference between adjacent sub-temperatures;

[0185] or,

[0186] An expansion / contraction coefficient calculation module, used to calculate the expansion / contraction coefficient of the target component at the current actual working temperature according to the expansion / contraction coefficient of the target temperature interval in which the target component is currently located, the expansion / contraction coefficient of the adjacent temperature interval and the temperature difference between the sub-temperatures;

[0187] or,

[0188] The expansion / contraction coefficient calculation module is used to calculate the expansion / contraction coefficient of the target component at the current actual working temperature based on the sum of the expansion / contraction coefficients of the target temperature interval and the adjacent temperature interval in which the target component is currently located, the proportion of the current actual working temperature in the target temperature interval, and the maximum temperature difference between the target temperature interval and the adjacent temperature interval.

[0189] In one embodiment, the interval change judgment module is specifically used to: monitor whether the temperature of each component changes according to the actual temperature data; if the actual operating temperature of the component whose temperature has changed is always in the same target temperature interval within a continuous first preset time period, the component whose temperature has changed will be used as the target component whose temperature interval has changed, wherein the target temperature interval is different from the previous temperature interval in which the target component was before the first preset time period.

[0190] In one embodiment, the control module further includes:

[0191] A standard size acquisition module is used to obtain the standard size length of a component at a standard temperature;

[0192] An actual size acquisition module, used to acquire the actual size length of the component at any first temperature different from the standard temperature;

[0193] The interval expansion and contraction coefficient calculation module is used to use the ratio of the actual dimension length to the standard dimension length as the expansion and contraction coefficient of the component in a first temperature interval corresponding to a first temperature, wherein any temperature interval does not include the standard temperature.

[0194] In one embodiment, the computing module specifically includes:

[0195] The actual displacement calculation module is used to obtain the actual displacement of the target component corresponding to the expected displacement after the temperature changes according to the product of the actual expansion and contraction coefficient of the target component and the expected displacement of the target component at the standard temperature;

[0196] A displacement error calculation module is used to obtain a displacement error by subtracting the expected displacement from the actual displacement;

[0197] The displacement calculation module is used to compensate the expected displacement using the displacement error to obtain the actual displacement of the target component that needs to be compensated.

[0198] Figure 3 FIG. 1 shows an internal structure diagram of a computer device in an embodiment. The computer device may be a terminal or a server. Figure 3As shown, the computer device includes a processor, a memory and a network interface connected via a system bus. The memory includes a non-volatile storage medium and an internal memory. The non-volatile storage medium of the computer device stores an operating system and may also store a computer program. When the computer program is executed by the processor, the processor may implement each step in the above method embodiment. The internal memory may also store a computer program. When the computer program is executed by the processor, the processor may implement each step in the above method embodiment. Those skilled in the art will understand that Figure 3 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0199] In one embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor performs the following steps:

[0200] Monitor and collect actual temperature data of components of PCB processing equipment during operation;

[0201] Determining, according to the actual temperature data, a temperature interval to which the actual temperature data belongs;

[0202] Acquire the expansion / contraction coefficient of the component according to the temperature range;

[0203] Calculate the actual displacement that needs to be compensated through the expansion and contraction coefficient;

[0204] Motion compensation is performed on corresponding components according to the displacement.

[0205] In one embodiment, a computer-readable storage medium is provided, storing a computer program, and when the computer program is executed by a processor, the processor performs the following steps:

[0206] Monitor and collect actual temperature data of components of PCB processing equipment during operation;

[0207] Determining, according to the actual temperature data, a temperature interval to which the actual temperature data belongs;

[0208] Acquire the expansion / contraction coefficient of the component according to the temperature range;

[0209] Calculate the actual displacement that needs to be compensated through the expansion and contraction coefficient;

[0210] Motion compensation is performed on corresponding components according to the displacement.

[0211] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the program can be stored in a non-volatile computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0212] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0213] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A method for dynamic compensation of PCB processing equipment, characterized in that: The method comprises: Monitor and collect actual temperature data of components of PCB processing equipment during operation; Determining, according to the actual temperature data, a temperature interval to which the actual temperature data belongs; Acquire the expansion / contraction coefficient of the component according to the temperature range; Calculate the actual displacement that needs to be compensated through the expansion and contraction coefficient; Motion compensation is performed on corresponding components according to the displacement.

2. The method according to claim 1, characterized in that The PCB processing equipment includes at least one grating ruler, and the method specifically includes: Monitor and collect actual temperature data of each grating ruler during operation; According to each of the actual temperature data, determining the temperature interval to which each of the actual temperature data belongs; Obtaining the expansion and contraction coefficient corresponding to each grating ruler according to each temperature interval; Calculating the actual displacement amount that needs to be compensated respectively through each of the expansion and contraction coefficients; Independent motion compensation is performed on the corresponding grating scale according to each displacement.

3. The method according to claim 1, characterized in that The obtaining the expansion / contraction coefficient of the component according to the temperature range includes: The component whose temperature range changes is regarded as the target component; According to the mapping relationship between the temperature range corresponding to the target component and the expansion / contraction coefficient, the expansion / contraction coefficient of the target component in the current target temperature range is obtained.

4. The method according to claim 1, characterized in that: The obtaining the expansion / contraction coefficient of the component according to the temperature range includes: The component whose temperature range changes is regarded as the target component; Calculating the expansion / contraction coefficient of the target component at the current actual working temperature according to the expansion / contraction coefficient of the target temperature interval in which the target component is currently located and the temperature difference between the sub-temperatures contained in the target temperature interval, wherein each temperature interval contains a plurality of sub-temperatures, and there is a corresponding temperature difference between adjacent sub-temperatures; or; The expansion / contraction coefficient of the target component at the current actual working temperature is calculated according to the expansion / contraction coefficient of the target temperature interval in which the target component is currently located, the expansion / contraction coefficient of the adjacent temperature interval and the temperature difference between the sub-temperatures.

5. The method according to claim 3 or 4, characterized in that: The method of taking a component whose temperature range changes as a target component includes: Monitor whether each component has temperature changes based on the actual temperature data; if the actual operating temperature of the component whose temperature has changed is always in the same target temperature range within a continuous first preset time period, the component whose temperature has changed will be used as a target component whose temperature range has changed, wherein the target temperature range is different from the previous temperature range in which the target component was before the first preset time period.

6. The method according to claim 3, characterized in that The mapping relationship between the temperature range and the expansion / contraction coefficient is obtained by the following steps: Obtain the standard dimension length of the component at standard temperature; Obtaining the actual length of the component at any first temperature different from the standard temperature; The ratio of the actual dimension length to the standard dimension length is used as the expansion / contraction coefficient of the component in a first temperature range corresponding to the first temperature.

7. The method according to claim 6, characterized in that The calculation of the displacement actually required to be compensated by the expansion / contraction coefficient includes: Obtaining an actual displacement of the target component corresponding to the expected displacement after the temperature changes according to the product of the expansion / contraction coefficient of the target component and the expected displacement of the target component at the standard temperature; Subtracting the expected displacement from the actual displacement to obtain a displacement error; The expected displacement is compensated by using the displacement error to obtain the displacement amount of the target component that actually needs to be compensated.

8. The method according to claim 1, characterized in that The PCB processing equipment also includes a workbench, and the method specifically includes: The workbench is placed under different temperature conditions, and the expansion and contraction coefficients of the workbench at different temperatures are measured using a drilling precision plate, or the expansion and contraction coefficients of the workbench at different temperatures are measured by drilling holes on the workbench, and a mapping relationship between the temperature range of the workbench and the expansion and contraction coefficient is obtained according to the measured expansion and contraction coefficients; Monitoring and collecting actual temperature data of the workbench during operation; Determining the temperature range to which the workbench belongs according to the actual temperature data; Based on the mapping relationship between the temperature range of the workbench and the expansion / contraction coefficient, the expansion / contraction coefficient corresponding to the workbench is obtained according to the temperature range; Calculating the displacement amount that the workbench actually needs to compensate for through the expansion and contraction coefficient; The workbench is independently motion compensated according to the displacement.

9. A system for dynamic compensation of PCB processing equipment, characterized in that: The system comprises: a control module and a temperature sensor; The temperature sensor is provided at least one of the components of the PCB processing equipment, wherein the components include a workbench, a crossbeam and a grating ruler; The temperature sensor is used to monitor the operating temperature of the component and transmit the actual temperature data to the control module; The control module is used to dynamically compensate the PCB processing equipment according to the method described in any one of claims 1-8.

10. The system for dynamic compensation of PCB processing equipment according to claim 9, characterized in that: The components include at least one of a workbench, a crossbeam, a grating ruler, a bed, a spindle, a guide rail, a motor, a slider and a grating ruler base.

11. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the processor is caused to perform the steps of the method according to any one of claims 1 to 8.

12. A computer device comprising a memory and a processor, characterized in that: The memory stores a computer program, and when the computer program is executed by the processor, the processor is caused to perform the steps of the method according to any one of claims 1 to 8.

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