Hard and brittle material large depth-diameter ratio small hole laser milling-precision grinding process and device thereof

Abstract

The invention relates to a hard and brittle material large depth-diameter ratio small hole laser milling-precision grinding process and a device thereof.The method comprises the steps that firstly, a mapping relation between an inlet aperture and laser parameters is established through a response surface method, laser machining parameters are determined, and laser machining parameters are obtained on the basis of an optical image acquisition system; a pulse laser is adopted to prepare the large-depth-diameter-ratio micro through hole with the accurate and controllable ablation amount, the grinding amount is reduced, meanwhile, the strength, hardness or fracture toughness of materials at the machining position is reduced, and therefore the grinding force for machining hard and brittle materials and tool abrasion are reduced; and secondly, machining damage such as microcracks, recast layers and taper caused by laser machining is removed through grinding machining, and the machining quality of the small hole with the large depth-diameter ratio is improved. The device mainly comprises a machine body, a workbench, a laser machining main shaft, a grinding machining main shaft, a differential interference difference microscope, an optical CCD camera and an X-axis and Y-axis servo driving module, different machining processes and in-situ detection can be completed on the same machine tool, the problems of secondary clamping, poor repeated positioning precision and the like of workpieces are solved, the machining efficiency is improved, and the machining cost is reduced. According to the method, bottom hole laser machining of the hard and brittle materials is highly combined with grinding hole repairing and hole expanding, high-quality and high-efficiency machining of the hard and brittle materials is achieved, tool abrasion is reduced, and the machining cost is reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of grinding, and relates to a laser milling-precision grinding process for a small hole with a large depth-to-diameter ratio of a hard and brittle material and a device thereof. Background Art

[0002] Hard and brittle materials such as ceramic matrix composites are widely used in aerospace, national defense, military industry, nuclear energy and other fields due to their excellent properties such as high hardness, high strength and high temperature resistance. They perform outstandingly in dealing with high temperature and strong radiation environments, but still require some necessary cooling methods at temperatures exceeding 2000°C. Air film holes are common structures in cooling design. They are usually sub-millimeter small holes with a large depth-to-diameter ratio. The high depth-to-diameter ratio results in insufficient chip removal space during machining, which can easily lead to tool breakage. At the same time, hard and brittle materials are hard and brittle, which can cause severe tool wear and surface cracking during machining.

[0003] In response to the problem of deep hole processing, Xi'an Shiyou University has an invention patent application with publication number CN118478038A, which discloses a tool and processing method suitable for medium and large diameter deep hole processing. The present invention mainly opens a groove along the central axis of the tool, and respectively sets blades on the top surface of the processing end and the bottom surface of the groove, thereby dividing a processing area of ​​a traditional internal chip removal deep hole drill into two processing areas: sleeve processing and sleeve removal, thereby reducing the problems of cutting heat concentration and guide block extrusion and increasing chip removal space. However, the patent opens a groove in the center of the tool, which makes it difficult to ensure the cutting force balance of the two blade areas of the tool and the dynamic balance of the tool as a whole. At the same time, the blades are concentrated on the end face and the bottom of the groove, and the outer cylindrical surface of the tool is in contact with the surface of the deep hole, which can easily aggravate tool wear. The invention patent application with publication number CN116213904A owned by China Aero Engine Corporation Limited discloses a method for processing small holes with a large depth-to-diameter ratio based on a combination of mechanical drilling and ultrafast laser. The invention processes a bottom hole by mechanical deep hole drilling and uses an ultrafast laser to perform fine hole repair on the bottom hole to remove burrs, flash and metamorphic hardened layers, effectively improving processing quality and processing efficiency. However, the invention is prone to tool wear during the processing of hard and brittle materials, and the processing cost is relatively high.

[0004] Therefore, there is an urgent need for a method for machining small holes with large depth-to-diameter ratio in hard and brittle materials that takes into account tool life, chip removal and machining efficiency. Summary of the invention

[0005] In order to solve the problems of tool breakage and severe wear caused by insufficient chip removal space during the machining of small holes with a large aspect ratio of hard and brittle materials, the present invention proposes a laser milling-precision grinding process and a device for small holes with a large aspect ratio of hard and brittle materials, which combines the laser precise quantitative ablation machining of the bottom hole with the grinding hole repair and hole expansion height. First, laser ablation is used to ablate low-damage large aspect ratio through holes to improve the machinability of the material, and then high-speed grinding is performed to remove the damage layer and taper caused by the laser, thereby improving the machining quality and efficiency.

[0006] In order to achieve the above-mentioned invention object, the technical solution adopted by the present invention is as follows:

[0007] A laser milling-precision grinding process for a small hole with a large aspect ratio of a hard and brittle material, firstly establishes a mapping relationship between an entrance aperture and laser parameters through a response surface method, determines laser processing parameters, and uses a pulsed laser to ablate a micro-through hole with a large aspect ratio based on an optical image acquisition system, thereby reducing the grinding amount while reducing the strength, hardness or fracture toughness of the material at the processing position, thereby reducing the grinding force and tool wear of the hard and brittle material; then, uses grinding to remove processing damage such as microcracks, recast layers and tapers caused by laser processing, thereby improving the processing quality of the small hole with a large aspect ratio; finally, precision grinding and hole expansion are performed to obtain a hole without burrs, flash and delamination.

[0008] The hard and brittle materials include, but are not limited to: optical glass, crystal materials, ceramic materials, particle-reinforced metal-based composite materials, whisker-reinforced ceramic-based composite materials, and fiber-reinforced ceramic-based composite materials.

[0009] A laser milling-precision grinding device for small holes with large depth-to-diameter ratio of hard and brittle materials, comprising:

[0010] X-axis servo drive module (1), body (2), dynamometer (3), laser processing spindle (4), laser head (41), focusing device (42), optical image acquisition system (5), optical CCD camera (51), differential interference contrast microscope (52), grinding spindle (6), tool holder (7), grinding wheel (8), workpiece (9), worktable (10), Y-axis servo drive module (11). Among them, the laser processing spindle and the grinding processing spindle are arranged vertically and can move along the Z axis. The laser processing spindle is connected to a laser head and a focusing device. The laser head is vertically placed on the upper surface of the workpiece to be processed. The focusing device is used to detect the defocus amount. The grinding processing spindle is rotatably connected with an optical image acquisition system to complete in-situ detection. The optical image acquisition system includes an optical CCD camera and a differential interference contrast microscope. The optical CCD camera collects surface morphology, and the differential interference contrast microscope collects damage data. The X and Y axis servo drive modules are arranged under the workbench to control the movement of the workbench in the X and Y directions. The workpiece to be processed is placed on the workbench, and the X-axis servo drive module drives the double-station movement. The laser is a nanosecond laser or a picosecond laser, and the grinding wheel is an electroplated diamond grinding wheel, a brazed diamond grinding wheel, and other super-hard abrasive grinding wheels, a ceramic bond sintered diamond grinding wheel, etc.

[0011] Specifically, the above process includes the following steps:

[0012] A laser milling-precision grinding process for a small hole with a large depth-to-diameter ratio in hard and brittle materials, the specific steps are as follows:

[0013] Step 1: Preliminary selection of laser processing parameters based on the empirical values ​​of the hard and brittle material workpiece to be processed, including but not limited to: laser power, spot overlap rate, feed speed, and track spacing; formulate the L29 matrix using the central composite design method, and conduct laser drilling experiments with the above laser parameters. The deep microholes on the workpiece after laser ablation under different processing parameters are detected and analyzed using an optical image acquisition system to obtain a series of data on the entrance diameter.

[0014] Step 2: Through the response surface method, the Design-Expert software is used to perform linear regression on the inlet diameter series data obtained in step 1 to obtain a quadratic regression significant model of the inlet diameter. The established regression model is:

[0015]

[0016] Where D1 is the micropore entrance aperture after laser ablation; P is the laser power; R is the spot overlap rate; ν1 is the feed speed; and d1 is the track spacing.

[0017] Five groups of parameters were randomly selected within the effective range of the obtained regression model for testing, and the predicted results were compared with the test results. The average error of the established inlet diameter prediction model was less than 5%, and the predicted results were consistent with the actual test results; otherwise, it was judged to be inaccurate, and insignificant items needed to be eliminated until the regression model was within an acceptable range.

[0018] Step 3: On the basis of ensuring the effective elimination of laser thermal defects and reserving processing allowance, the hole size after laser ablation is determined to be 90% of the final formed hole size D. The microhole entrance aperture D1 under different laser processing parameter combinations is analyzed and predicted through the above model. Based on the analysis results of this model, the optimal laser processing parameter combination is screened out;

[0019] Step 4: Use the above optimal parameter combination for microhole laser processing. Based on a fixed spot diameter d, a spiral trajectory is used to perform deep microhole ablation experiments with different laser powers P, spot overlap rates R, and track spacing d1.

[0020] During laser processing, the center line of the laser beam is perpendicular to the surface to be processed, the focal plane is the upper surface of the workpiece, and the laser beam is fed downward at a uniform speed to compensate for the defocus, and the moving distance is the thickness of the workpiece.

[0021] Step 5: Move the workpiece after laser processing horizontally to the grinding station, and use the real-time image feedback of the optical CCD camera to detect the processing effect. Detect the aperture range of the micropores after laser ablation. Use the differential interference contrast microscope to detect the range of the thermal damage area, determine the grinding allowance, and perform precision grinding and hole expansion to remove the damage caused by laser processing. During the grinding process, the grinding wheel is fed downward at a uniform speed and cooled by a water-based coolant to obtain a small hole with a large depth-to-diameter ratio without burrs, flash, and stratification on the surface.

[0022] When grinding, according to the machining allowance = D-D1, select the grinding parameters: grinding wheel speed ν s , spindle feed speed ν2 and processing stroke, input the processing coordinates of the bottom hole, and perform precision grinding and hole repairing. During the processing, the grinding wheel feeds vertically, and the processing stroke = workpiece thickness + 2mm (effective grinding length of the grinding wheel);

[0023] Wherein, D is the final processed aperture, and D1 is the entrance aperture of the laser processed microhole measured by optical measurement.

[0024] The beneficial effects of the present invention compared to the prior art are:

[0025] The present invention aims at the problem that laser-assisted grinding mechanical processing technology has become increasingly mature, but there is little research on laser-assisted grinding of small holes with large depth-to-diameter ratio of hard and brittle materials. The laser ablation processing bottom hole is combined with grinding hole repair and hole expansion height, and the workbench is moved in the X and Y axes. The laser is fed downward during the laser ablation process. Based on the fixed spot diameter, a spiral track is used to ablate deep micro holes 8 with different laser powers P, spot overlap rate R and track spacing d1; the laser processing of large depth-to-diameter ratio conical micro-through holes is realized, a part of the material is removed to improve the chip removal environment, solve the problem of insufficient chip removal space, and reduce the hardness and fracture toughness of the material. On the same workbench, when high-speed grinding is performed, the microcracks, recast layer and taper structure generated by laser processing are removed, and the grinding wheel is fed downward at this time, which can reduce the grinding force, tool wear, reduce the stiffness problem caused by material anisotropy and improve the processing quality, and realize the workpiece to complete different processing processes and in-situ detection on the same machine tool, avoid secondary clamping and repeated positioning of the workpiece, improve the overall processing efficiency of the workpiece, reduce tool wear, and reduce processing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for describing the embodiments or the prior art are briefly introduced below.

[0027] Figure 1 A flow chart of the laser-assisted grinding method for small holes with large aspect ratios of hard and brittle materials provided by the present invention;

[0028] Figure 2 A schematic diagram of the laser-assisted grinding platform provided by the present invention;

[0029] Figure 3 Schematic diagram of the scanning path and hole cross section of the laser ablation of a micro-through hole with a large aspect ratio provided by the present invention: (a) schematic diagram of the laser trajectory, (b) schematic diagram of the spot overlap, (c) schematic diagram of the hole cross section;

[0030] Figure 4 The schematic diagram of the experiment of laser processing a small hole with a large aspect ratio provided by the present invention;

[0031] Figure 5 Schematic diagram of the experiment of grinding a small hole with a large aspect ratio provided by the present invention;

[0032] Figure 6 This is an electron microscope image of the micropore entrance and exit after laser processing and precision grinding in Example 1.

[0033] Explanation of main reference numerals: 1. X-axis servo drive module; 2. Machine body; 3. Dynamometer; 4. Laser processing spindle; 41. Laser head; 42. Focusing device; 5. Optical image acquisition system; 51. Optical CCD camera; 52. Differential interference contrast microscope; 6. Grinding spindle; 7. Tool handle; 8. Grinding wheel; 9. Workpiece to be processed; 10. Workbench; 11. Y-axis servo drive module. DETAILED DESCRIPTION

[0034] The present invention will be further described in detail below in conjunction with the drawings, implementation processes and embodiments in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0035] Embodiment 1:

[0036] In this embodiment, the ceramic matrix composite material SiC f / SiC is used to process small holes with a hole diameter of 0.4mm and an aspect ratio of 10.

[0037] like Figure 2 As shown, a laser milling and precision grinding device for small holes with a large depth-to-diameter ratio of hard and brittle materials comprises an X-axis servo drive module 1, a body 2, a dynamometer 3, a laser processing spindle 4, an optical image acquisition system 5, a grinding spindle 6, a tool holder 7, a grinding wheel 8, a workpiece 9, a workbench 10, and a Y-axis servo drive module 11. Among them, the laser processing spindle 4 and the grinding processing spindle 6 can move along the Z axis, the laser processing spindle 4 is connected to a laser head 41 and a focusing device 42, the laser head 41 is vertically placed on the upper surface of the workpiece 9 to be processed, and the focusing device 42 is used to detect the defocus amount. The grinding processing spindle 6 is rotatably connected with an optical image acquisition system 5 to complete in-situ detection. The optical image acquisition system 5 includes an optical CCD camera 51 and a differential interference contrast microscope 52. The optical CCD camera 51 collects surface morphology, and the differential interference contrast microscope 52 collects damage data. The X-axis servo drive module 1 and the Y-axis servo drive module 11 are used to control the movement of the workbench in the X and Y directions. The workpiece 9 to be processed is placed on the workbench 10, and the X-axis servo drive module 1 drives the double-station movement. The laser is a nanosecond laser, and the workpiece 9 to be processed is a rectangular SiC with a thickness of 4 mm. f / SiC ceramic matrix composite material. The grinding wheel 8 used is an electroplated diamond grinding wheel with a diameter of 0.4 mm.

[0038] like Figure 1 As shown, a laser milling-precision grinding process for a small hole with a large depth-to-diameter ratio of a hard and brittle material includes the following steps:

[0039] Step 1: Install the workpiece 9 to be processed on the workbench 10, use a level to level, position and clamp it;

[0040] Step 2: Turn on the laser processing spindle 4, adjust the center line of the laser beam output by the laser head 41 to be perpendicular to the surface to be processed, adjust the defocus amount to 0 according to the focusing device 42, and adjust the laser processing SiC f / SiC theoretical knowledge and processing experience, the preliminary selected laser power range is 35w-50w, the spot overlap rate range is 84%-98%, the feed speed range is 100μm / s-500μm / s, and the track spacing range is 15μm-45μm. The central composite design method is used to formulate the L29 matrix, and laser drilling experiments with corresponding parameters are carried out. The deep microholes on the workpiece 9 after laser ablation under different processing parameters are detected and analyzed using the optical image acquisition system 5 to obtain the entrance diameter.

[0041] Step 3: Use the Design-Expert software to perform regression analysis on the inlet diameter through the response surface method to obtain a quadratic regression significant model of the inlet diameter; the established regression model is:

[0042]

[0043] Where D1 is the microhole entrance aperture after laser ablation measured by optical measurement; P is the laser power; R is the spot overlap rate; ν1 is the feed speed; d1 is the track spacing.

[0044] Five groups of parameters were randomly selected within the effective range of the above regression model for testing. The predicted results were compared with the test results. The average error of the established inlet diameter prediction model was 3.7%, and the maximum error was 4.5%, both less than 5%. The overall error is still within the acceptable range, and the predicted results are consistent with the actual test results.

[0045] Step 4: Taking the aperture D1 = 0.36 mm after laser ablation as the target, according to the above regression prediction model, the optimal processing parameter combination is selected as follows: laser power is 46 W, spot overlap rate is 85%, feed speed is 293 μm / s, and track spacing is 45 μm.

[0046] Step 5: Use the above optimal parameter combination to perform 0.4 mm micro-hole laser processing. Repeat the experiment 40 times to prepare an 8x5 hole array. Figure 4 The schematic diagram of laser ablation of a small hole with a large depth-to-diameter ratio is shown. During the processing, the workpiece is fed upward, and the moving distance is the thickness of the workpiece. Based on the fixed spot diameter d, a spiral trajectory is used (see Figure 3 (a)) different laser powers P, spot overlap ratio R (see Figure 3 (b)) and deep micro-hole 8 ablation experiment with track pitch d1,

[0047] Step 6: Move the laser-processed workpiece 9 to the grinding machine table through the X-axis servo drive module 1, install the tool holder 7 holding the grinding wheel 8 on the grinding spindle 6, the grinding wheel diameter is 0.4mm, the handle diameter is 3mm, the sand plating length is 2mm, and the tool length is 35mm. Measure the two-dimensional morphology of the hole after laser ablation through the optical CCD camera 51, and specifically analyze the shape and size of the ablation slot, such as the aperture D1. Measure the thermal damage processing range of the hole after laser ablation through the differential interference contrast microscope 52. The processing effect is as follows: Figure 6 As shown, the actual entrance diameter range is 0.3652-0.3773mm, the ablation depth is 4mm, and the laser-induced recast layer and thermal damage layer can be controlled below 0.4mm, meeting the grinding processing requirements. Figure 5 The schematic diagram of the grinding experiment of a small hole with a large depth-to-diameter ratio is shown. Figure 4 Based on the laser ablated tapered hole with a large depth-to-diameter ratio, a single-factor grinding experiment with multiple machining parameters (grinding wheel speed and feed speed) was carried out, with the grinding wheel fed downward.

[0048] Step 7: The machining allowance is D-D1=(22.7,34.8)μm, and the grinding parameters are selected as: grinding wheel speed ν s =15000rpm, spindle feed speed ν2 =1.5mm / min, processing stroke is 5mm, precision grinding and hole expansion experiment is carried out, the processing effect is as follows Figure 6 As shown, there are no burrs, flashes or delamination on the hole surface, and the number of holes that can be processed by the tool has increased from 2 holes to 16 holes, which greatly improves the tool processing life.

[0049] Step 8: After the processing is completed, the grinding spindle 4 and the laser processing spindle 6 are turned off, and the workpiece is removed.

[0050] Embodiment 2:

[0051] The main contents of this embodiment are the same as those of Embodiment 1, wherein the workpiece 5 to be processed is single crystal silicon, the processing hole diameter is 0.2 mm, the processing depth is 2 mm, the laser is a picosecond laser, and a segmented upward feeding method is adopted during the laser processing. The single feeding depth is 200 μm, and the total number of feedings is 10 times. The laser parameters selected according to the basic experimental results are: the track spacing d1 is 10 μm, the processing power P is 16 W, the spot overlap rate R is 87.5%, the number of processing times is 20 times, and the laser processing microhole entrance aperture D1=0.18 mm is selected. The hole entrance diameter range after laser processing is: 0.1901-0.1953 mm.

[0052] The specific implementation modes of the present invention are described above in conjunction with the accompanying drawings, but these descriptions cannot be understood as limiting the scope of the present invention. The protection scope of the present invention is defined by the attached claims, and any changes based on the claims of the present invention are within the protection scope of the present invention.

Claims

1. A laser milling-precision grinding process for small holes with large depth-to-diameter ratio in hard and brittle materials, characterized in that: Firstly, the mapping relationship between the entrance aperture and the laser parameters is established by the response surface method to determine the laser processing parameters. Based on the optical image acquisition system, a pulsed laser is used to ablate a micro-through hole with a large aspect ratio. During the laser ablation process, the workpiece is fed upward. Based on a fixed spot diameter, a spiral trajectory is used to perform different laser power ablation. P , spot overlap ratio R and track spacing d 1 deep micro-hole ablation; then, grinding wheel grinding is used to remove the surface damage caused by laser processing and improve the processing quality of small holes with large aspect ratio; finally, precision grinding and hole expansion are performed to obtain small holes with large aspect ratio without burrs, flash and delamination.

2. The laser milling-precision grinding process for small holes with large depth-to-diameter ratio of hard and brittle materials according to claim 1 is characterized in that: The specific steps are as follows: Step 1: Preliminary selection of laser processing parameters based on the empirical values ​​of the hard and brittle material workpiece to be processed, including but not limited to: laser power, spot overlap rate, feed speed, and track spacing; formulate the L29 matrix using the central composite design method, and conduct laser drilling experiments with the above laser parameters, detect and analyze the deep microholes on the workpiece after laser ablation under different laser parameters, and obtain a series of data on the entrance diameter; Step 2: Through the response surface method, the Design-Expert software is used to perform linear regression on the inlet diameter series data obtained in step 1 to obtain a quadratic regression significant model of the inlet diameter. The established regression model is: ; In the formula, D 1 is the micropore entrance aperture after laser ablation measured by optical measurement; P is the laser power; R is the spot overlap ratio; ν 1 is the feed speed; d 1 is the track spacing; Step 3: On the basis of ensuring the effective elimination of laser thermal defects and reserving processing allowance, the aperture after laser ablation is D 1 Determine the final aperture D The above regression model is used to analyze and predict the microhole entrance aperture under different laser processing parameter combinations. D 1. Based on the analysis results of this model, select the optimal combination of laser processing parameters; Step 4: Use the above optimal laser processing parameter combination for micro-hole laser processing, based on a fixed spot diameter d , using spiral trajectory for different laser powers P , spot overlap ratio R and track spacing d 1 deep micropore ablation experiment; Step 5: Move the workpiece after laser processing horizontally to the grinding station, use the optical CCD camera to feedback the processing effect in real time, detect the aperture range of the micropores after laser ablation, use the differential interference contrast microscope to detect the range of the thermal damage area, determine the grinding allowance, and perform precision grinding and hole expansion to remove the damage caused by laser processing; during the grinding process, the grinding wheel is fed downward at a uniform speed and cooled by a water-based coolant to obtain a small hole with a large depth-to-diameter ratio without burrs, flash, and stratification on the surface.

3. The laser milling-precision grinding process for small holes with large depth-to-diameter ratio of hard and brittle materials according to claim 1 is characterized in that: In step 2, 5 groups of parameters are randomly selected within the effective range of the obtained regression model for testing, and the predicted results are compared with the test results. If the average error of the established inlet diameter prediction model is less than 5%, the predicted results are consistent with the actual test results; otherwise, it is judged to be inaccurate, and the insignificant items need to be eliminated until the regression model error is within an acceptable range.

4. The laser milling-precision grinding process for small holes with large depth-to-diameter ratio of hard and brittle materials according to claim 1 is characterized in that: In step 4, during the laser processing, the center line of the laser beam is perpendicular to the surface to be processed, and the laser is fed downward at a uniform speed to compensate for the defocus amount, and the moving distance is the thickness of the workpiece.

5. The laser milling-precision grinding process for small holes with large depth-to-diameter ratio of hard and brittle materials according to claim 1 is characterized in that: Step 5: During grinding, according to the machining allowance = DD 1. Select grinding parameters: Grinding wheel speed ν s , spindle feed speed ν 2 and the processing stroke, input the processing coordinates of the bottom hole, and perform precision grinding and hole repairing. During the processing, the grinding wheel feeds vertically, and the processing stroke = workpiece thickness + 2mm (effective grinding length of the grinding wheel); in, D The final processing hole diameter, D 1 is the entrance aperture of the laser-processed microhole measured by optical measurement.

6. A laser milling-precision grinding process for small holes with large aspect ratios of hard and brittle materials according to claim 1 or 2, characterized in that: The hard and brittle materials include, but are not limited to: optical glass, crystal materials, ceramic materials, particle-reinforced metal-based composite materials, whisker-reinforced ceramic-based composite materials, and fiber-reinforced ceramic-based composite materials.

7. A laser milling-precision grinding device for small holes with large depth-to-diameter ratio in hard and brittle materials, characterized in that: include: X-axis servo drive module (1), body (2), dynamometer (3), laser processing spindle (4), laser head (41), focusing device (42), optical image acquisition system (5), optical CCD camera (51), differential interference contrast microscope (52), grinding processing spindle (6), tool holder (7), grinding wheel (8), workpiece (9), worktable (10), Y-axis servo drive module (11); wherein the laser processing spindle and the grinding processing spindle can move along the Z axis, the laser processing spindle is connected to the laser head and the focusing device, the laser head is vertically placed on the upper surface of the workpiece to be processed, the focusing device is used to detect the defocus amount, and the grinding spindle is used to detect the defocus amount. An optical image acquisition system is rotatably connected to the processing spindle to complete in-situ detection. The optical image acquisition system includes an optical CCD camera and a differential interference contrast microscope. The optical CCD camera collects surface morphology, and the differential interference contrast microscope collects damage data. X- and Y-axis servo drive modules are arranged under the workbench to control the movement of the workbench in the X and Y directions. The workpiece to be processed is placed on the workbench, and the X-axis servo drive module drives the double-station movement. The laser is a nanosecond laser or a picosecond laser. The grinding wheel is selected from but not limited to super-hard abrasive grinding wheels such as electroplated diamond grinding wheels, brazed diamond grinding wheels, or ceramic bonded sintered diamond grinding wheels.

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