Liquid crystal panel and liquid crystal panel preparation method

Abstract

The invention relates to the technical field of liquid crystal display, in particular to a liquid crystal panel and a preparation method of the liquid crystal panel. The liquid crystal panel comprises an I TO glass substrate and a wafer substrate which are parallel and spaced; the I TO glass substrate is provided with a display area and a non-display area located on the periphery of the display area, a black shading layer and an annular retaining wall are arranged between the I TO glass substrate and the wafer substrate, and the black shading layer and the annular retaining wall are both located in the non-display area of the I TO glass substrate and surround the periphery of the display area; the inner side of the annular retaining wall is filled with liquid crystal, and sealing frame glue is arranged on the outer side of the annular retaining wall in a surrounding mode. The liquid crystal panel not only can isolate liquid crystal from the frame glue and prevent the frame glue from polluting the liquid crystal, but also can improve the shading effect, thereby effectively improving the display quality of the liquid crystal panel.

Description

Technical Field

[0001] The present application relates to the field of liquid crystal display technology, and more specifically, to a liquid crystal panel and a method for preparing the liquid crystal panel. Background Art

[0002] Silicon-based liquid crystal microdisplay technology is widely used in display fields such as holographic display, AR / VR, projection, quantum computing, head-up display (HUD), and laser printing because of its high integration, high resolution, and high device aperture ratio. The current LCD panel uses light-shielding glue to block stray reflected light. The light-shielding tape is manually attached, which is prone to misalignment, causing areas outside the display area to be exposed to light. In addition, after the reliability verification, the tape will be affected by the high temperature and high humidity environment and become deformed. The above reasons will cause the stray light to increase, resulting in poor display quality. In addition, the current LCD panel uses frame glue to bond the glass substrate to the wafer substrate, and then form a chamber for storing liquid crystal. In this structure, the inner wall of the frame glue is in direct contact with the liquid crystal, and it is impossible to avoid the small molecule components and ionic impurities of the frame glue from contaminating the liquid crystal, resulting in poor display effect. Summary of the invention

[0003] The purpose of the present application is to provide a liquid crystal panel and a method for preparing the liquid crystal panel, which can not only isolate the liquid crystal from the frame glue to prevent the frame glue from contaminating the liquid crystal, but also improve the shading effect, thereby effectively improving the display quality of the liquid crystal panel.

[0004] The embodiment of the present application is implemented as follows:

[0005] In the first aspect, an embodiment of the present application provides a liquid crystal panel, comprising a parallel and spaced ITO glass substrate and a wafer substrate; the ITO glass substrate has a display area and a non-display area located outside the display area, a black shading layer and an annular retaining wall are arranged between the ITO glass substrate and the wafer substrate, the black shading layer and the annular retaining wall are both located in the non-display area of ​​the ITO glass substrate and surround the periphery of the display area; liquid crystal is filled on the inside of the annular retaining wall, and a sealing frame glue is arranged on the outside of the annular retaining wall.

[0006] As an optional implementation, the black light-shielding layer is sandwiched between the sealing frame glue and the ITO glass substrate.

[0007] As an optional implementation manner, the surface of the black light shielding layer on the side facing away from the I TO glass substrate has an undulating surface, and the sealing frame glue is arranged in contact with the undulating surface.

[0008] As an optional implementation, part of the black light-shielding layer is located between the annular retaining wall and the ITO glass substrate.

[0009] As an optional implementation manner, a surface of the black light shielding layer on one side facing away from the I TO glass substrate has a contact plane, and the annular retaining wall is connected to the contact plane.

[0010] As an optional implementation, the black light-shielding layer and the annular retaining wall are made of composite carbon black photosensitive resin.

[0011] In a second aspect, an embodiment of the present application provides a method for preparing a liquid crystal panel, comprising:

[0012] Providing an ITO glass substrate, wherein the ITO glass substrate has a display area and a non-display area located outside the display area;

[0013] Laying a black light-shielding layer on the non-display area of ​​the ITO glass substrate, and forming an annular retaining wall on the side of the black light-shielding layer away from the ITO glass substrate;

[0014] Coating a first alignment layer on a wafer substrate, coating a second alignment layer on a display area of ​​the ITO glass substrate, and performing rubbing alignment on the first alignment layer and the second alignment layer respectively;

[0015] The wafer substrate and the black light shielding layer of the ITO glass substrate are bonded by using a sealing frame adhesive, the sealing frame adhesive is located outside the annular retaining wall, and liquid crystal is filled inside the annular retaining wall.

[0016] As an optional implementation, the wafer substrate and the black light shielding layer of the ITO glass substrate are bonded with a sealing frame adhesive, the sealing frame adhesive is located outside the annular retaining wall, and liquid crystal is filled inside the annular retaining wall, including:

[0017] Injecting liquid crystal onto an ITO glass substrate with an annular retaining wall;

[0018] Applying sealing glue on the wafer substrate;

[0019] The wafer substrate with the sealing frame glue is buckled on the ITO glass substrate carrying the liquid crystal, and the sealing frame glue is bonded to the black light shielding layer.

[0020] As an optional implementation, the wafer substrate and the black light shielding layer of the ITO glass substrate are bonded with a sealing frame adhesive, the sealing frame adhesive is located outside the annular retaining wall, and liquid crystal is filled inside the annular retaining wall, including:

[0021] Applying sealing glue to the wafer substrate;

[0022] A retaining wall opening is formed on the annular retaining wall of the ITO glass substrate; the ITO glass substrate with the retaining wall opening is buckled with the wafer substrate with the sealing frame glue, and the sealing frame glue is bonded to the black light shielding layer;

[0023] Infusing liquid crystal between the ITO glass substrate and the wafer substrate through the opening of the retaining wall;

[0024] The retaining wall opening is sealed.

[0025] As an optional implementation manner, a black light shielding layer is laid on the non-display area of ​​the ITO glass substrate, and an annular retaining wall is formed on the side of the black light shielding layer away from the ITO glass substrate, including:

[0026] A black light shielding layer and an annular retaining wall are formed on the non-display area of ​​the ITO glass substrate through the HTM photolithography process.

[0027] As an optional implementation, the wafer substrate and the black light shielding layer of the ITO glass substrate are bonded with a sealing frame glue, the sealing frame glue is located outside the annular retaining wall, and before the liquid crystal is filled inside the annular retaining wall, the method further includes:

[0028] A first alignment mark is formed on the periphery of the ITO glass substrate by using an HTM photolithography process, which can be used to align with a second alignment mark on the wafer substrate; and the black light shielding layer of the wafer substrate and the ITO glass substrate is bonded by using a sealing frame adhesive, including:

[0029] The wafer substrate and the ITO glass substrate are placed parallel and spaced apart, and the projections of the first alignment mark and the second alignment mark are overlapped.

[0030] The beneficial effects of the embodiments of the present application include:

[0031] The embodiment of the present application provides a liquid crystal panel, including a parallel and spaced ITO glass substrate and a wafer substrate; the ITO glass substrate of the embodiment of the present application has a display area and a non-display area located outside the display area, and a black light shielding layer and an annular retaining wall are arranged between the ITO glass substrate and the wafer substrate, and the black light shielding layer and the annular retaining wall are both located in the non-display area of ​​the ITO glass substrate and surround the periphery of the display area; liquid crystal is filled inside the annular retaining wall, and a sealing frame glue is arranged outside the annular retaining wall. The embodiment of the present application sets an annular retaining wall between the parallel and spaced ITO glass substrate and the wafer substrate, and the annular retaining wall is arranged around the periphery of the display area, and then a sealing frame glue is arranged around the periphery of the annular retaining wall, and liquid crystal is filled in the annular retaining wall. The embodiment of the present application can effectively isolate the liquid crystal from the sealing frame glue through the annular retaining wall, so the sealing frame glue will not directly contact the liquid crystal, thereby preventing the small molecule components and ionic impurities of the sealing frame glue from contaminating the liquid crystal, thereby improving the display quality of the liquid crystal panel.

[0032] The embodiment of the present application provides a method for preparing a liquid crystal panel, including: providing an ITO glass substrate, the ITO glass substrate having a display area and a non-display area located outside the display area; laying a black shading layer on the non-display area of ​​the ITO glass substrate, and forming an annular retaining wall on the side of the black shading layer away from the ITO glass substrate; coating a first alignment layer on a wafer substrate, coating a second alignment layer on the display area of ​​the ITO glass substrate, and performing friction alignment on the first alignment layer and the second alignment layer respectively; using a sealing frame glue to bond the wafer substrate and the black shading layer of the ITO glass substrate, the sealing frame glue is located on the outside of the annular retaining wall, and liquid crystal is filled inside the annular retaining wall. The embodiment of the present application sets an annular retaining wall between the parallel and spaced ITO glass substrate and the wafer substrate, the annular retaining wall is arranged around the periphery of the display area, and then a sealing frame glue is arranged on the periphery of the annular retaining wall, and liquid crystal is filled in the annular retaining wall. The embodiment of the present application can effectively isolate the liquid crystal and the sealing frame glue through the annular retaining wall, so that the sealing frame glue will not directly contact the liquid crystal, thereby preventing the small molecule components and ionic impurities of the sealing frame glue from contaminating the liquid crystal, thereby improving the display quality of the liquid crystal panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1 This is one of the structural schematic diagrams of the liquid crystal panel of the embodiment of the present application;

[0035] Figure 2This is the second structural diagram of the liquid crystal panel of the embodiment of the present application;

[0036] Figure 3 This is the third structural schematic diagram of the liquid crystal panel according to the embodiment of the present application.

[0037] icon:

[0038] 100-I TO glass substrate; 101-wafer substrate; 102-display area; 103-non-display area; 104-black shading layer; 105-annular retaining wall; 106-liquid crystal; 107-sealing frame glue; 108-undulating surface; 109-first alignment layer; 110-second alignment layer; 111-first alignment mark; 112-second alignment mark. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0040] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0041] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0042] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0043] Silicon-based liquid crystal microdisplay technology is widely used in display fields such as holographic display, AR / VR, projection, quantum computing, head-up display (HUD), and laser printing because of its high integration, high resolution, and high device aperture ratio. The current liquid crystal display panel uses light-shielding glue to block stray reflected light, which easily causes light leakage problems and deteriorates the display quality. In addition, the current liquid crystal display panel uses frame glue to bond the glass substrate to the wafer substrate 101, and then forms a chamber for storing liquid crystal 106. In this structure, the inner wall of the frame glue is in direct contact with the liquid crystal 106, and it is impossible to avoid the small molecule components and ionic impurities of the frame glue from contaminating the liquid crystal 106, resulting in a poor display effect.

[0044] In order to solve the above technical problems, the embodiments of the present application provide a liquid crystal panel and a preparation method thereof.

[0045] Reference Figure 1 , Figure 2 as well as Figure 3 As shown, an embodiment of the present application provides a liquid crystal panel, including a parallel and spaced ITO glass substrate 100 and a wafer substrate 101; the ITO glass substrate 100 has a display area 102 and a non-display area 103 located outside the display area 102, and a black shading layer 104 and an annular retaining wall 105 are arranged between the ITO glass substrate 100 and the wafer substrate 101, and the black shading layer 104 and the annular retaining wall 105 are both located in the non-display area 103 of the ITO glass substrate 100 and surround the periphery of the display area 102; liquid crystal 106 is filled on the inside of the annular retaining wall 105, and a sealing frame glue 107 is arranged on the outside of the annular retaining wall 105.

[0046] It should be noted that the material of the annular retaining wall 105 is different from the material of the sealing frame glue 107. The small molecular components and ionic impurities in the material of the sealing frame glue 107 can contaminate the liquid crystal 106, resulting in poor display effect. The material of the annular retaining wall 105 in the embodiment of the present application is a composite carbon black photosensitive resin, which has the characteristics of small particle size (5nm), high specific surface area, and large electrostatic force. Its optical density can reach more than 4.0, and it can also absorb ionic impurities and residual charges in the frame glue and liquid crystal 106.

[0047] It should be noted that the existing technology avoids the interference of stray reflected light on the display effect by attaching a shading tape on the glass substrate. However, the current process of attaching the shading tape has a low degree of automation, poor precision and high cost, and is easily affected by high temperature and high humidity environments, causing the shading tape to deform, resulting in poor shading effect, and ultimately causing a reduction in display quality.

[0048] The embodiment of the present application also uses a composite carbon black photosensitive resin on the ITO glass substrate 100 to form a black shading layer 104. The black shading layer 104 has a high shading density and can effectively prevent the influence of stray light reflection on the display effect, thereby improving the display quality of the display panel.

[0049] Regarding the specific parameters of the annular retaining wall 105 and the black light shielding layer 104 in the embodiment of the present application, those skilled in the art can set them according to needs, and no special limitation is made to this.

[0050] For example, the width of the annular retaining wall 105 in the embodiment of the present application is 10-20 microns, and the height of the annular retaining wall 105 can be set to be substantially equal to the thickness of the liquid crystal panel. The annular retaining wall 105 can be set at a distance of 200-500 microns from the display area 102.

[0051] Exemplarily, the thickness of the black light shielding layer 104 is about 0.5-1.0 micrometers.

[0052] Compared with the prior art, the embodiment of the present application sets an annular retaining wall 105 between the parallel and spaced ITO glass substrate 100 and the wafer substrate 101, the annular retaining wall 105 is arranged around the periphery of the display area 102, and then a sealing frame glue 107 is arranged around the periphery of the annular retaining wall 105, and the liquid crystal 106 is filled in the annular retaining wall 105. The embodiment of the present application can effectively isolate the liquid crystal 106 from the sealing frame glue 107 through the annular retaining wall 105, so the sealing frame glue 107 will not directly contact the liquid crystal 106, thereby preventing the small molecule components and ionic impurities of the sealing frame glue 107 from contaminating the liquid crystal 106, thereby improving the display quality of the liquid crystal panel.

[0053] The annular retaining wall 105 provided in the embodiment of the present application has a certain strength, so it can play a supporting role and improve the uniformity of the thickness of the liquid crystal panel. In addition, the annular retaining wall 105 in the embodiment of the present application can prevent the puncture of the inner boundary of the sealant frame, effectively preventing the liquid crystal 106 from leaking or external contaminants from entering the liquid crystal 106.

[0054] It should be noted that, refer to Figure 1 As shown, the sealing frame glue 107 of the embodiment of the present application is provided with silicon balls, which can further enhance the supporting performance of the sealing frame and improve the uniformity of the thickness of the liquid crystal panel.

[0055] Reference Figure 1 As shown, as an optional implementation, the black light shielding layer 104 is sandwiched between the sealing frame glue 107 and the ITO glass substrate 100 .

[0056] It should be noted that the black light shielding layer 104 is sandwiched between the sealing frame glue 107 and the ITO glass substrate 100, that is, the black light shielding layer 104 is laid flat on the surface of the ITO glass substrate 100 close to the wafer substrate 101. The black light shielding layer 104 is arranged around the periphery of the display area 102 and does not block the light from the display area 102.

[0057] Further, see Figure 1 As shown, the black light shielding layer 104 has an undulating surface 108 on the side facing away from the I TO glass substrate 100 , and the sealing sealant 107 is bonded to the undulating surface 108 .

[0058] It should be noted that, in the embodiment of the present application, an undulating surface 108 is formed on the surface of one side where the black light-shielding layer 104 contacts the sealing frame. The undulating surface 108 can greatly increase the contact area between the black light-shielding layer 104 and the sealing frame, thereby improving the bonding strength between the sealing frame and the black light-shielding layer 104, so that the ITO glass substrate 100 and the wafer substrate 101 can be reliably bonded, which is beneficial to improving the sealing of the liquid crystal panel.

[0059] It should be noted that a convex structure is provided on the surface of the black light shielding layer 104 facing away from the ITO glass substrate 100 and the above-mentioned undulating surface 108 can be formed. The contact area is increased by a plurality of convex structures arranged in an array. The specific shape of the convex structure can be set by those skilled in the art as needed, and is not particularly limited thereto.

[0060] Exemplarily, a black shading layer 104 and an annular retaining wall 105 are formed in the non-display area 103 of the ITO glass substrate 100 through the HTM photolithography process. The mask opening shape used in the photolithography can be circular, elliptical, triangular, prismatic, square, etc., and the protrusions produced can form hemispherical, triangular pyramidal and other structures according to the mask opening.

[0061] As an optional implementation, refer to Figure 1 As shown, part of the black light shielding layer 104 is located between the annular retaining wall 105 and the I TO glass substrate 100 .

[0062] The surface of the black light shielding layer 104 facing away from the ITO glass substrate 100 has a contact plane, and the annular retaining wall 105 is connected to the contact plane.

[0063] It should be noted that the black light shielding layer 104 and the annular retaining wall 105 in the embodiment of the present application are both made of composite carbon black photosensitive resin.

[0064] The method for preparing a liquid crystal panel provided in the embodiment of the present application includes:

[0065] An ITO glass substrate 100 is provided. The ITO glass substrate 100 has a display area 102 and a non-display area 103 located outside the display area 102;

[0066] A black light shielding layer 104 is laid on the non-display area 103 of the ITO glass substrate 100, and an annular retaining wall 105 is formed on the side of the black light shielding layer 104 away from the ITO glass substrate 100;

[0067] A first alignment layer 109 is coated on the wafer substrate 101, a second alignment layer 110 is coated on the display area 102 of the ITO glass substrate 100, and the first alignment layer 109 and the second alignment layer 110 are rubbed and aligned respectively;

[0068] The wafer substrate 101 and the black light shielding layer 104 of the ITO glass substrate 100 are bonded by using a sealing frame glue 107 . The sealing frame glue 107 is located outside the annular retaining wall 105 , and the liquid crystal 106 is filled inside the annular retaining wall 105 .

[0069] It should be noted that the liquid crystal panel provided in the embodiment of the present application is not only applicable to the existing ODF process but also to the die casting packaging process.

[0070] As an optional implementation, a sealing frame glue 107 is used to bond the wafer substrate 101 and the black light shielding layer 104 of the ITO glass substrate 100, the sealing frame glue 107 is located outside the annular retaining wall 105, and the liquid crystal 106 is filled inside the annular retaining wall 105, including:

[0071] Injecting liquid crystal 106 onto an ITO glass substrate 100 with an annular retaining wall 105;

[0072] Applying sealing glue 107 on the wafer substrate 101;

[0073] The wafer substrate 101 with the sealing glue 107 is buckled onto the ITO glass substrate 100 carrying the liquid crystal 106 , and the sealing glue 107 is bonded to the black light shielding layer 104 .

[0074] As an optional implementation, a sealing frame glue 107 is used to bond the wafer substrate 101 and the black light shielding layer 104 of the ITO glass substrate 100, the sealing frame glue 107 is located outside the annular retaining wall 105, and the liquid crystal 106 is filled inside the annular retaining wall 105, including:

[0075] Applying sealing glue 107 onto the wafer substrate 101;

[0076] A retaining wall opening is formed on the annular retaining wall 105 of the ITO glass substrate 100; the ITO glass substrate 100 with the retaining wall opening is buckled with the wafer substrate 101 with the sealing frame glue 107, and the sealing frame glue 107 is bonded to the black light shielding layer 104;

[0077] Liquid crystal 106 is poured between the ITO glass substrate 100 and the wafer substrate 101 through the opening of the baffle wall;

[0078] Seal retaining wall openings.

[0079] As an optional implementation, a black light shielding layer 104 is laid on the non-display area 103 of the ITO glass substrate 100, and an annular retaining wall 105 is formed on the side of the black light shielding layer 104 away from the ITO glass substrate 100, including:

[0080] A black light shielding layer 104 and an annular retaining wall 105 are formed on the non-display area 103 of the ITO glass substrate 100 by HTM photolithography.

[0081] The embodiment of the present application uses a sealing frame glue 107 to bond the wafer substrate 101 and the black light shielding layer 104 of the ITO glass substrate 100. The sealing frame glue 107 is located outside the annular retaining wall 105 and before the liquid crystal 106 is filled inside the annular retaining wall 105. The embodiment also includes:

[0082] A first alignment mark 111 is formed on the periphery of the ITO glass substrate 100 by using the HTM photolithography process, which can be used for alignment with the second alignment mark 112 formed on the wafer substrate 101;

[0083] The black light shielding layer 104 of the wafer substrate 101 and the ITO glass substrate 100 bonded by the sealing frame glue 107 includes:

[0084] The wafer substrate 101 and the ITO glass substrate 100 are placed parallel to each other and spaced apart from each other, and the projections of the first alignment mark 111 and the second alignment mark 112 are overlapped.

[0085] It should be noted that, in the embodiment of the present application, the first alignment mark 111, the black light shielding layer 104 and the annular retaining wall 105 can be formed on the ITO glass substrate 100 at one time through the HTM photolithography process.

[0086] Since it is difficult to collect the alignment mark pattern after the ITO glass substrate 100 is thinned, the embodiment of the present application forms a black first alignment mark 111 on the ITO glass substrate through the HTM photolithography process, so as to use the black mark for better alignment. Compared with the prior art, the process used in the embodiment of the present application can greatly improve the manufacturing accuracy.

[0087] The embodiment of the present application can be used for aligning the ITO glass substrate 100 and the wafer substrate 101 in the bonding process through the setting of the first alignment mark 111 and the second alignment mark 112, thereby improving the alignment accuracy of the black light shielding layer 104 and reducing the influence of stray reflected light on display quality.

[0088] The specific shapes of the first alignment mark 111 and the second alignment mark 112 are not particularly limited, and those skilled in the art can configure them as needed.

[0089] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A liquid crystal panel, characterized in that: The invention comprises a parallel and spaced ITO glass substrate (100) and a wafer substrate (101); the ITO glass substrate (100) has a display area (102) and a non-display area (103) located outside the display area (102); a black light shielding layer (104) and an annular retaining wall (105) are arranged between the ITO glass substrate (100) and the wafer substrate (101); the black light shielding layer (104) and the annular retaining wall (105) are both located in the non-display area (103) of the ITO glass substrate (100) and surround the display area (102); liquid crystal (106) is filled inside the annular retaining wall (105), and a sealing frame glue (107) is arranged outside the annular retaining wall (105).

2. The liquid crystal panel according to claim 1, characterized in that: The black light shielding layer (104) is sandwiched between the sealing frame glue (107) and the ITO glass substrate (100).

3. The liquid crystal panel according to claim 2, characterized in that: The surface of the black light shielding layer (104) on the side facing away from the ITO glass substrate (100) has an undulating surface (108), and the sealing frame glue (107) is arranged in contact with the undulating surface (108).

4. The liquid crystal panel according to claim 1, characterized in that: Part of the black light shielding layer (104) is located between the annular retaining wall (105) and the ITO glass substrate (100).

5. The liquid crystal panel according to claim 4, characterized in that: A surface of the black light shielding layer (104) on one side facing away from the ITO glass substrate (100) has a contact plane, and the annular retaining wall (105) is connected to the contact plane.

6. The liquid crystal panel according to claim 1, characterized in that: The black light shielding layer (104) and the annular retaining wall (105) are made of composite carbon black photosensitive resin.

7. A method for preparing a liquid crystal panel, characterized in that: include: An ITO glass substrate (100) is provided, wherein the ITO glass substrate (100) has a display area (102) and a non-display area (103) located outside the display area (102); Laying a black light shielding layer (104) on a non-display area (103) of an ITO glass substrate (100), and forming an annular retaining wall (105) on a side of the black light shielding layer (104) facing away from the ITO glass substrate (100); A first alignment layer (109) is coated on a wafer substrate (101), a second alignment layer (110) is coated on a display area (102) of the ITO glass substrate (100), and the first alignment layer (109) and the second alignment layer (110) are respectively subjected to friction alignment; The wafer substrate (101) and the black light shielding layer (104) of the ITO glass substrate (100) are bonded by using a sealing frame glue (107), the sealing frame glue (107) is located outside the annular retaining wall (105), and the inside of the annular retaining wall (105) is filled with liquid crystal (106).

8. The method for preparing a liquid crystal panel according to claim 7, characterized in that: The method of bonding the wafer substrate (101) and the black light shielding layer (104) of the ITO glass substrate (100) with a sealing frame glue (107), wherein the sealing frame glue (107) is located outside the annular retaining wall (105) and a liquid crystal (106) is filled inside the annular retaining wall (105), comprises: Injecting liquid crystal (106) onto an ITO glass substrate (100) having an annular retaining wall (105); Applying a sealing glue (107) on the wafer substrate (101); A wafer substrate (101) with a sealing frame glue (107) is buckled onto an ITO glass substrate (100) carrying liquid crystal (106), and the sealing frame glue (107) is bonded to a black light shielding layer (104).

9. The method for preparing a liquid crystal panel according to claim 7, characterized in that: The method of bonding the wafer substrate (101) and the black light shielding layer (104) of the ITO glass substrate (100) with a sealing frame glue (107), wherein the sealing frame glue (107) is located outside the annular retaining wall (105) and a liquid crystal (106) is filled inside the annular retaining wall (105), comprises: Applying a sealing glue (107) onto the wafer substrate (101); A retaining wall opening is formed on the annular retaining wall (105) of the ITO glass substrate (100); the ITO glass substrate (100) with the retaining wall opening is buckled with a wafer substrate (101) with a sealing frame glue (107), and the sealing frame glue (107) is bonded to the black light shielding layer (104); injecting liquid crystal (106) between the ITO glass substrate (100) and the wafer substrate (101) through the baffle opening; The retaining wall opening is sealed.

10. The method for preparing a liquid crystal panel according to claim 7, characterized in that: The method comprises laying a black light shielding layer (104) on a non-display area (103) of an ITO glass substrate (100), and forming an annular retaining wall (105) on a side of the black light shielding layer (104) away from the ITO glass substrate (100), comprising: A black light shielding layer (104) and an annular retaining wall (105) are formed on a non-display area (103) of an ITO glass substrate (100) by means of an HTM photolithography process.

11. The method for preparing a liquid crystal panel according to claim 8, characterized in that: The method of bonding the wafer substrate (101) and the black light shielding layer (104) of the ITO glass substrate (100) by using a sealing frame glue (107), wherein the sealing frame glue (107) is located outside the annular retaining wall (105) and before the liquid crystal (106) is filled inside the annular retaining wall (105), further comprises: A first alignment mark (111) is formed on the periphery of the ITO glass substrate (100) by using an HTM photolithography process, which can be used to align with a second alignment mark (112) on the wafer substrate (101); The black light shielding layer (104) bonded to the wafer substrate (101) and the ITO glass substrate (100) using a sealing frame glue (107) comprises: The wafer substrate (101) and the ITO glass substrate (100) are placed in parallel and spaced apart from each other, and the first alignment mark (111) is aligned with the second alignment mark (112) on the wafer substrate (101).

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