Positive pressure impregnation tank, impregnation device and impregnation method

Abstract

The invention discloses a positive pressure impregnation tank, an impregnation device and an impregnation method, and relates to the technical field of copper-clad lamins.The positive pressure impregnation tank comprises a glue inlet channel, a glue overflow channel and a positive pressure cavity, the positive pressure cavity is arranged above the joint of the glue inlet channel and the glue overflow channel, and the bottom end of the glue inlet channel and the bottom end of the glue overflow channel both communicate with the positive pressure cavity; wherein the glue inlet channel and the glue overflow channel are both filled with glue liquid, the glue liquid is filled into a part of space of the positive pressure cavity, the other part of space of the positive pressure cavity is filled with gas, and the air pressure in the positive pressure cavity is larger than the atmospheric pressure. According to the invention, the positive pressure chamber is filled with the gas which occupies part of space, so that the whole positive pressure chamber does not need to be filled with the glue solution, the use amount of the glue solution in the circulation process is reduced, the utilization rate of the glue solution is improved, the phenomenon that the concentration of a solvent in the glue dipping room is too high is avoided, and a large number of ventilation facilities do not need to be arranged.

Description

Technical Field

[0001] The invention relates to the technical field of copper clad laminates, and in particular to a positive pressure glue dipping tank, a glue dipping device and a glue dipping method. Background Art

[0002] Copper clad laminate is the basic raw material for manufacturing printed circuit boards. Copper clad laminate is made by covering prepreg with copper foil and pressing it under high temperature and high pressure conditions. The prepreg is made of treated glass fiber cloth, impregnated with liquid resin, and then heat treated to make the resin enter a semi-cured state.

[0003] The dipping tank is a device for dipping prepregs. As described in the utility model patent with publication number "CN214021680U" and patent name "A dipping tank for prepreg production", it includes a tank body, which is composed of a liquid storage tank and a plurality of dipping tanks arranged at intervals at the bottom of the liquid storage tank and connected to the inside of the liquid storage tank, and the top opening of each dipping tank extends into the liquid storage tank; a plurality of overflow plates matching the open ends of the dipping tanks are connected to the periphery of the upper proximal end of each dipping tank through a height adjustment mechanism; a tape transmission mechanism is provided between the liquid storage tank and each dipping tank; a glue inlet is provided at the bottom of each dipping tank, and a glue outlet is provided at the upper proximal end of the liquid storage tank.

[0004] However, as described above, the existing glue dipping tank realizes the circulation of glue liquid by feeding glue from the bottom and overflowing glue from the top or sides. Such a glue dipping tank has the following problems: first, since the liquid surface at the top of the glue dipping tank is directly exposed to the outside, the glue liquid solvent evaporates quickly, resulting in glue liquid waste, and the solvent concentration in the glue dipping tank room is high, and a large-area ventilation facility needs to be set up, which is costly; second, due to the large amount of solvent evaporation and the large liquid surface area at the top of the glue dipping tank, when the liquid surface is less disturbed, a film will form on the surface of the glue liquid. When the glass cloth passes out of or into the liquid surface, the formed film will adhere to the glass cloth, affecting the glue dipping quality of the glass cloth; third, the volume of the glue dipping tank is very large, and the glue liquid needs to fill the entire glue dipping tank, and the required amount of glue liquid is large. Moreover, after the glue liquid forms a stable circulation, there is a partial dead zone in the glue dipping tank, and the glue liquid in the dead zone cannot circulate, affecting the uniformity and consistency of the glue liquid, and reducing the quality of the glue dipping. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is to propose a positive pressure glue dipping tank, a glue dipping device and a glue dipping method, which are used to solve the problems of low glue dipping quality and high cost caused by the little disturbance and easy volatility of the glue liquid in the glue dipping tank in the prior art.

[0006] The technical solution adopted by the present invention to solve the technical problem is a positive pressure dipping tank for dipping glass cloth, comprising: A glue inlet channel and a glue overflow channel, wherein the bottom end of the glue inlet channel is connected to the bottom end of the glue overflow channel, and the glass cloth can pass through the glue inlet channel and pass through the glue overflow channel; A positive pressure chamber, which is arranged above the connection between the glue inlet channel and the glue overflow channel, and the bottom end of the glue inlet channel and the bottom end of the glue overflow channel are both connected to the positive pressure chamber; The glue inlet channel and the glue overflow channel are both filled with glue liquid, the glue liquid is filled into part of the space of the positive pressure chamber, the other part of the space of the positive pressure chamber is filled with gas, and the gas pressure in the positive pressure chamber is greater than the atmospheric pressure.

[0007] Further, the positive pressure chamber comprises a glue liquid chamber and a positive pressure chamber which are communicated with each other, and the glue liquid chamber is located below the positive pressure chamber, and the glue liquid can enter the glue liquid chamber from the bottom end of the glue inlet channel; an air inlet pipe and a pressure relief pipe are provided at the upper end of the positive pressure chamber; Among them, the air pressure in the positive pressure chamber is increased to make the glue in the glue chamber flow to the glue inlet channel and the glue overflow channel, and the air pressure in the positive pressure chamber is reduced to make the glue in the glue inlet channel and the glue overflow channel flow to the positive pressure chamber.

[0008] Furthermore, the liquid levels in the glue inlet channel and the glue overflow channel are both higher than the liquid level in the positive pressure chamber.

[0009] Furthermore, the glue inlet channel is provided with a glue inlet, the glue overflow channel is provided with a glue overflow outlet, the height of the glue inlet is higher than the height of the glue overflow outlet, and the height of the glue overflow outlet is higher than the top height of the positive pressure chamber.

[0010] Furthermore, a guide roller is provided at the connection between the glue inlet channel and the glue overflow channel, and the glass cloth is wound around a side of the guide roller away from the positive pressure chamber.

[0011] Furthermore, the glue inlet channel is gradually inclined from bottom to top in a direction away from the glue overflow channel.

[0012] Furthermore, a glue dipping device is also disclosed, comprising the positive pressure glue dipping tank, and further comprising: Adhesive tank; A glue return pipe, one end of which is connected to the glue overflow port, and the other end of which is connected to the viscosity adjustment tank; A glue inlet pipe, one end of which is connected to the viscosity adjusting tank, and the other end of which is connected to the glue inlet; Two metering rollers are also provided above the overflow glue channel; A glue receiving plate is also provided on the overflow glue channel, and the glue receiving plate is located below the metering roller; a glue outlet is provided on the glue receiving plate, and the glue outlet is communicated with the glue return pipe; the height of the glue receiving plate gradually decreases along the direction toward the glue outlet.

[0013] Furthermore, a dipping method is disclosed, which is applied to the dipping device, and the dipping method comprises the following steps: S1, take a positive pressure glue dipping tank, pass the glass cloth through the glue inlet channel and out through the glue overflow channel; S2, introducing glue liquid into the positive pressure glue dipping tank until the liquid levels in the glue inlet channel and the glue overflow channel are at a first height; S3, filling gas into the positive pressure chamber until the liquid levels in the glue inlet channel and the glue overflow channel are at a second height; S4, continuously introducing glue into the glue inlet channel, and allowing the glue to continuously flow out from the glue overflow channel; S5. Drive the glass cloth to move along the glue inlet channel toward the glue overflow channel.

[0014] Furthermore, in step S5, it also includes: filling gas into the positive pressure chamber, and / or exhausting part of the gas in the positive pressure chamber.

[0015] Furthermore, the overflow glue channel is provided with an overflow glue port; The first height is lower than the height of the glue overflow port, and the second height is equal to the height of the glue overflow port.

[0016] Compared with the prior art, the present invention has at least the following beneficial effects: 1. A positive pressure chamber is set at the connection between the glue inlet channel and the glue overflow channel. The glue enters from the glue inlet channel and flows out from the glue overflow channel to maintain flow. During this period, part of the glue enters the lower part of the positive pressure chamber, and the upper part of the positive pressure chamber is filled with gas (nitrogen or carbon dioxide and other gases), so that the positive pressure chamber can form a sealed space to avoid solvent volatilization, reduce the amount of solvent used, and avoid the phenomenon of excessive solvent concentration in the dipping room. There is no need to set up a large number of ventilation facilities; 2. The positive pressure chamber is filled with gas, which occupies part of the space. It is not necessary to fill the entire positive pressure chamber with glue, which reduces the amount of glue used in the circulation process and improves the utilization rate of glue; 3. The air pressure in the positive pressure chamber is greater than the external atmospheric pressure, so that it can exert a downward force on the glue in the positive pressure chamber, thereby raising the liquid level in the glue inlet channel and the glue overflow channel, which can further reduce the amount of glue used, extend the length of the glass cloth immersed in the glue inlet channel and the glue overflow channel, and improve the glue dipping effect; 4. The glass cloth passes through the glue feed channel and then passes through the glue overflow channel. It will not pass through the liquid surface of the positive pressure chamber in the middle. Therefore, the film on the liquid surface of the positive pressure chamber will not adhere to the glass cloth, thereby improving the quality of glue dipping. Moreover, compared with the design in which the top of the original glue dipping tank is completely exposed to the air, the width of the glue feed channel and the glue overflow channel is very narrow, and the liquid surface area exposed to the air is very small. Even if the liquid surface circulation speed is slow, no film will be formed on the liquid surface of the glue feed channel and the glue overflow channel. It can be seen that in the entire glue dipping tank of the present application, only the liquid surfaces of the glue feed channel and the glue overflow channel will be exposed to the air, and their area is too small to form a film, thus avoiding the phenomenon that the film on the liquid surface adheres to the glass cloth and affects the quality of glue dipping; 5. An air inlet pipe and a pressure relief pipe are set in the positive pressure chamber to adjust the air pressure in the positive pressure chamber, thereby adjusting the liquid level in the positive pressure chamber. The liquid levels of the glue inlet channel and the glue overflow channel can also be adjusted at the same time to achieve the disturbance of the glue liquid. The disturbance of all liquid levels in the entire dipping tank can be achieved by simply adjusting the air pressure in the positive pressure chamber; 6. The inclined glue feeding channel has a longer length. At the same liquid level, the length of the glass cloth immersed under the liquid surface is longer, and it has a longer glue dipping path. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a cross-sectional view of a dipping device in an embodiment; Figure 2 This is a front view of the dipping device in the embodiment; Figure 3 Schematic diagram of the glue inlet pipe and the viscosity adjusting tank in the embodiment.

[0018] In the figure: 100, positive pressure glue dipping tank; 110, glue inlet pipe; 120, glue return pipe; 130, glue inlet channel; 131, glue inlet port; 140, glue overflow channel; 141, glue overflow port; 150, positive pressure chamber; 151, observation window; 160, guide roller; 170, exhaust pipe; 180, pressure relief pipe; 200, glue receiving plate; 210, glue outlet; 300, metering roller; 310, scraper; 400, glass cloth; 500, viscosity adjustment tank. DETAILED DESCRIPTION

[0019] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0020] Please refer to Figure 1-Figure 3 The present invention discloses a positive pressure dip tank for dipping glass cloth 400, comprising: A glue inlet channel 130 and a glue overflow channel 140, wherein the bottom end of the glue inlet channel 130 is communicated with the bottom end of the glue overflow channel 140, and the glass cloth 400 can pass through the glue inlet channel 130 and pass through the glue overflow channel 140; A positive pressure chamber 150 is disposed above the connection between the glue inlet channel 130 and the glue overflow channel 140, and the bottom end of the glue inlet channel 130 and the bottom end of the glue overflow channel 140 are both connected to the positive pressure chamber 150; The glue inlet channel 130 and the glue overflow channel 140 are both filled with glue liquid, the glue liquid is filled into a part of the space of the positive pressure chamber 150, the other part of the space of the positive pressure chamber 150 is filled with gas, and the gas pressure in the positive pressure chamber 150 is greater than the atmospheric pressure. The glass cloth 400 passes through the upper end of the glue inlet channel 130 and continuously passes through the glue overflow channel 140 to achieve continuous glue dipping of the glass cloth 400. At the same time, the glue inlet channel 130 continuously passes the glue liquid, and the glue overflow channel 140 continuously overflows the glue liquid, so that the glue liquid circulates in the glue dipping tank.

[0021] Specifically, the present application sets a positive pressure chamber 150 at the connection between the glue inlet channel 130 and the glue overflow channel 140. The glue enters from the glue inlet channel 130 and flows out from the glue overflow channel 140 to maintain flow. During this period, part of the glue enters the lower part of the positive pressure chamber 150, and the upper part of the positive pressure chamber 150 is filled with gas (nitrogen or carbon dioxide and other gases). The positive pressure chamber 150 can form a sealed space to avoid solvent volatilization, reduce the amount of solvent used, and at the same time avoid the phenomenon of excessive solvent concentration in the dipping room, without the need to set up a large number of ventilation facilities.

[0022] Importantly, since the positive pressure chamber 150 is filled with gas, this part of the gas occupies part of the space, and there is no need to fill the entire positive pressure chamber 150 with glue, which reduces the amount of glue used in the circulation process and improves the utilization rate of the glue. At the same time, since the air pressure in the positive pressure chamber 150 is greater than the external atmospheric pressure, it can exert a downward force on the glue in the positive pressure chamber 150, thereby raising the liquid level in the glue inlet channel 130 and the glue overflow channel 140, which can further reduce the amount of glue used, extend the length of the glass cloth 400 immersed in the glue inlet channel 130 and the glue overflow channel 140, and improve the glue dipping effect.

[0023] Furthermore, the glass cloth 400 in the present application passes through the glue inlet channel 130 and then passes through the glue overflow channel 140, and will not pass through the liquid surface of the positive pressure chamber 150 in the middle, so the film on the liquid surface of the positive pressure chamber 150 will not adhere to the glass cloth 400, thereby improving the quality of glue dipping. Moreover, compared with the design in which the top of the original glue dipping tank is completely exposed to the air, the width of the glue inlet channel 130 and the glue overflow channel 140 is very narrow, and the liquid surface area exposed to the air is very small. Even if the circulation speed of the glue liquid is slow, a film will not be formed at the liquid surface of the glue inlet channel 130 and the glue overflow channel 140. It can be seen that in the entire glue dipping tank of the present application, only the liquid surface of the glue inlet channel 130 and the glue overflow channel 140 will be exposed to the air, and its area is too small to form a film, thus avoiding the phenomenon that the film on the liquid surface adheres to the glass cloth 400 and affects the quality of glue dipping.

[0024] Further, the positive pressure chamber 150 includes a glue chamber and a positive pressure chamber which are communicated with each other, and the glue chamber is located below the positive pressure chamber, and the glue can enter the glue chamber from the bottom end of the glue inlet channel 130; an air inlet pipe and a pressure relief pipe 180 are provided at the upper end of the positive pressure chamber; The air pressure in the positive pressure chamber is increased so that the glue in the glue chamber flows to the glue feed channel 130 and the glue overflow channel 140, and the air pressure in the positive pressure chamber is reduced so that the glue in the glue feed channel 130 and the glue overflow channel 140 flows to the positive pressure chamber.

[0025] It should be mentioned that before dipping in glue, firstly, the glue liquid is poured into the dipping tank from the glue feeding channel 130, so that the glue liquid enters and fills or does not fill the positive pressure chamber 150, and then a certain amount of gas is introduced into the positive pressure chamber 150 through the air inlet pipe, so that the liquid level in the positive pressure chamber 150 drops, and at the same time, the liquid levels in the glue feeding channel 130 and the overflow glue channel 140 are raised to a predetermined height, and then glue is continuously poured from the glue feeding channel 130 to maintain the circulation of the glue liquid. Among them, the amount of glue fed into the glue feeding channel 130 can be controlled to make the liquid level in the glue feeding channel 130 rise and fall continuously, so as to achieve the disturbance of the liquid level and further reduce the probability of film formation on its surface. However, such a method can obviously only increase the disturbance in the glue feeding channel 130, while the liquid level in the overflow glue channel 140 and the positive pressure chamber 150 is less affected, and the disturbance generated is insufficient.

[0026] Based on this, the present application sets an air inlet pipe and a pressure relief pipe 180 in the positive pressure chamber 150 to adjust the air pressure in the positive pressure chamber 150, thereby adjusting the liquid level in the positive pressure chamber 150, and can also adjust the liquid level of the glue inlet channel 130 and the glue overflow channel 140 at the same time to achieve the disturbance of the glue liquid. It can be seen that the present application can achieve the disturbance of all liquid levels in the entire dipping tank only by adjusting the air pressure in the positive pressure chamber 150.

[0027] Specifically, when gas is introduced into the positive pressure chamber 150 through the air inlet pipe, the air pressure in the positive pressure chamber 150 increases, thereby forcing the liquid level in the positive pressure chamber 150 to decrease, and at the same time raising the liquid levels in the glue inlet channel 130 and the glue overflow channel 140; when the gas in the positive pressure chamber 150 is discharged through the pressure relief pipe 180, the air pressure in the positive pressure chamber 150 decreases, thereby forcing the liquid level in the positive pressure chamber 150 to increase, and at the same time lowering the liquid levels in the glue inlet channel 130 and the glue overflow channel 140. In this way, by continuously adjusting the air pressure in the positive pressure chamber 150 through the air inlet pipe and the pressure relief pipe 180, the height adjustment of the three liquid levels in the glue inlet channel 130, the glue overflow channel 140 and the positive pressure chamber 150 can be achieved, and the disturbance of the glue liquid can be enhanced.

[0028] Furthermore, the liquid levels in the glue inlet channel 130 and the glue overflow channel 140 are both higher than the liquid level in the positive pressure chamber 150 .

[0029] It should be noted that, since the pressure in the positive pressure chamber 150 is always greater than the external atmospheric pressure, the air pressure in the positive pressure chamber 150 can raise the liquid level of the glue feed channel 130 and the glue overflow channel 140, ensuring that the glue feed channel 130 and the glue overflow channel 140 are always full of glue, thereby extending the glue dipping path. At the same time, it can also ensure that there is always gas in the positive pressure chamber 150. In the process of continuously adjusting the air pressure of the positive pressure chamber 150, the glue liquid can never fill the entire positive pressure chamber 150, thereby reducing the circulating amount of glue liquid and improving the utilization rate of glue liquid.

[0030] Furthermore, the glue inlet channel 130 is provided with a glue inlet 131 , and the glue overflow channel 140 is provided with a glue overflow outlet 141 . The height of the glue inlet 131 is higher than the height of the glue overflow outlet 141 , and the height of the glue overflow outlet 141 is higher than the top height of the positive pressure chamber 150 .

[0031] Specifically, when the glue inlet channel 130 is initially filled with glue, the glue liquid can be filled to a height that does not reach the glue overflow port 141, and then gas is introduced into the positive pressure chamber 150 until the liquid level of the glue overflow channel 140 is raised to the height of the glue overflow port 141. An observation window 151 is provided on the side wall of the positive pressure chamber 150, through which the change of the liquid level in the positive pressure chamber 150 can be observed, so as to avoid the excessive gas pressure in the positive pressure chamber 150 causing the liquid level to be lower than the guide roller 160.

[0032] Furthermore, a guide roller 160 is provided at the connection between the glue inlet channel 130 and the glue overflow channel 140 , and the glass cloth 400 is wound around a side of the guide roller 160 away from the positive pressure chamber 150 .

[0033] Specifically, the position with the largest surface area of ​​the glue liquid in the entire dipping tank is the liquid surface of the glue liquid in the positive pressure chamber 150, and the liquid surface of this part is most likely to form a film. Based on this, the glass cloth 400 of the present application enters from the glue inlet channel 130, then wraps around the lower half of the guide roller 160, and finally passes through the overflow glue channel 140, thereby bypassing the positive pressure chamber 150. The glass cloth 400 does not need to pass through the liquid surface of the positive pressure chamber 150, and the phenomenon of the film on the liquid surface adhering to the glass cloth 400 is completely eliminated.

[0034] Furthermore, the glue inlet channel is gradually inclined from bottom to top in a direction away from the glue overflow channel 140 .

[0035] Specifically, the entire glue dipping tank is arranged in a V-shape, the overflow glue channel 140 is arranged vertically, and the glue feeding channel 130 is gradually inclined outward from bottom to top. The advantage of such an arrangement is that the glue feeding channel 130 can avoid the space above the positive pressure chamber 150, and avoid interference between the glue feeding channel 130 and the metering roller 300 and other components above the overflow glue channel 140. At the same time, the inclined glue feeding channel 130 has a longer length. At the same liquid level, the glass cloth 400 is immersed in the liquid for a longer length, and has a longer glue dipping path.

[0036] Furthermore, a dipping device is disclosed, including the positive pressure dipping tank 100, and further including: Viscosity adjustment tank 500; A glue return pipe 120, one end of which is connected to the glue overflow port 141, and the other end of which is connected to the viscosity adjustment tank 500; The glue inlet pipe 110 has one end connected to the viscosity adjusting tank 500 and the other end connected to the glue inlet port 131 .

[0037] Specifically, the glue liquid flows out of the overflow port 141 and flows back to the viscosity adjustment tank 500 through the glue return pipe 120. After being processed by the viscosity adjustment tank 500, it is poured into the glue inlet 131 through the glue inlet pipe 110 again, and enters the glue inlet channel 130 from the glue inlet 131, thereby realizing the circulation of the entire glue liquid.

[0038] Furthermore, two metering rollers 300 are provided above the overflow glue channel 140; A glue receiving plate 200 is also disposed on the glue overflow channel 140 , and the glue receiving plate 200 is located below the metering roller 300 .

[0039] Furthermore, the glue receiving tray 200 is provided with a glue outlet 210 , and the glue outlet 210 is communicated with the glue return tube 120 .

[0040] Specifically, after the glass cloth 400 passes through the overflow glue channel 140, it passes between the two metering rollers 300. The metering rollers 300 scrape off the excess glue on the surface of the glass cloth 400, and the excess glue falls down onto the glue receiving tray 200. The glue on the glue receiving tray 200 flows from the glue outlet 210 to the glue return pipe 120 and enters the viscosity adjustment tank 500. In this way, the glue scraped off the glass cloth 400 can also be reused.

[0041] A scraper 310 is disposed on the side of each metering roller 300 to scrape off foreign matter adhered to the metering roller 300 .

[0042] Furthermore, the height of the glue receiving tray 200 gradually decreases in the direction toward the glue outlet 210 .

[0043] Specifically, the glue receiving tray 200 is tilted, and the glue outlet 210 is at the lowest height, so that the glue on the glue receiving tray 200 can flow to the glue outlet 210 under its own gravity and flow out from the glue outlet 210. In this way, the glue can be prevented from stagnating on the glue receiving tray 200, the glue can be kept flowing, and a film can be prevented from forming on the liquid surface.

[0044] Furthermore, a dipping method is disclosed, which is applied to the dipping device, and the dipping method comprises the following steps: S1, taking a positive pressure glue dipping tank 100, passing the glass cloth 400 through the glue inlet channel 130 and passing it out through the glue overflow channel 140; S2, introducing glue liquid into the positive pressure glue dipping tank 100 until the liquid levels in the glue inlet channel 130 and the glue overflow channel 140 are at a first height; S3, filling the positive pressure chamber 150 with gas until the liquid levels in the glue inlet channel 130 and the glue overflow channel 140 are at a second height; S4, continuously introducing glue into the glue inlet channel 130 and allowing the glue to continuously flow out from the glue overflow channel 140; S5 , driving the glass cloth 400 to move along the glue inlet channel 130 toward the glue overflow channel 140 .

[0045] Specifically, in step S3, a certain amount of gas is introduced into the positive pressure chamber 150 to reduce the glue level in the positive pressure chamber 150 and increase the glue levels in the glue inlet channel 130 and the glue overflow channel 140, thereby reducing the amount of glue used.

[0046] Furthermore, in step S5 , it also includes: filling gas into the positive pressure chamber 150 , and / or discharging part of the gas in the positive pressure chamber 150 .

[0047] Specifically, during the process of dipping glue, gas is continuously filled into and / or exhausted from the positive pressure chamber 150 to adjust the air pressure in the positive pressure chamber 150, thereby causing the liquid levels of the positive pressure chamber 150, the glue inlet channel 130 and the glue overflow channel 140 to change continuously, thereby enhancing the liquid surface disturbance and avoiding the formation of a film on the liquid surface of the glue.

[0048] It should be noted that the liquid level in the positive pressure chamber 150 has a minimum liquid level height and a maximum liquid level height. When the positive pressure chamber 150 is inflated or exhausted, it is necessary to ensure that the liquid level height is not lower than the minimum liquid level height, nor higher than the maximum liquid level height, so as to avoid the gas in the positive pressure chamber 150 from entering the glue inlet channel 130 and the glue overflow channel 140, and ensure that the glass cloth 400 can be completely immersed in the glue.

[0049] Of course, the minimum liquid level and the maximum liquid level can be set to different safety values ​​according to different requirements, and the minimum liquid level is usually set above the guide roller 160 .

[0050] Furthermore, the overflow glue channel 140 is provided with an overflow glue port 141; The first height is lower than the height of the glue overflow opening 141 , and the second height is equal to the height of the glue overflow opening 141 .

[0051] Specifically, in step S2, the initial glue feeding amount is small, and there is no need to fill the entire glue feeding channel 130 and the glue overflow channel 140 with glue liquid. It is only necessary to fill gas into the positive pressure chamber 150 in step S3 until the liquid level of the glue overflow channel 140 rises to the glue overflow port 141, thereby reducing the amount of glue liquid used.

[0052] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0053] In addition, in the present invention, descriptions such as "first", "second", "one", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0054] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0055] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

Claims

1. A positive pressure dipping tank for dipping glass cloth, characterized in that: include: A glue inlet channel and a glue overflow channel, wherein the bottom end of the glue inlet channel is connected to the bottom end of the glue overflow channel, and the glass cloth can pass through the glue inlet channel and pass through the glue overflow channel; A positive pressure chamber, which is arranged above the connection between the glue inlet channel and the glue overflow channel, and the bottom end of the glue inlet channel and the bottom end of the glue overflow channel are both connected to the positive pressure chamber; The glue inlet channel and the glue overflow channel are both filled with glue liquid, the glue liquid is filled into part of the space of the positive pressure chamber, the other part of the space of the positive pressure chamber is filled with gas, and the gas pressure in the positive pressure chamber is greater than the atmospheric pressure.

2. A positive pressure dipping tank according to claim 1, characterized in that: The positive pressure chamber comprises a glue liquid chamber and a positive pressure chamber which are communicated with each other, and the glue liquid chamber is located below the positive pressure chamber, and the glue liquid can enter the glue liquid chamber from the bottom end of the glue inlet channel; an air inlet pipe and a pressure relief pipe are provided at the upper end of the positive pressure chamber; Among them, the air pressure in the positive pressure chamber is increased to make the glue in the glue chamber flow to the glue inlet channel and the glue overflow channel, and the air pressure in the positive pressure chamber is reduced to make the glue in the glue inlet channel and the glue overflow channel flow to the positive pressure chamber.

3. A positive pressure dipping tank according to claim 2, characterized in that: The liquid levels in the glue inlet channel and the glue overflow channel are both higher than the liquid level in the positive pressure chamber.

4. The positive pressure dipping tank according to claim 1, characterized in that: The glue inlet channel is provided with a glue inlet, and the glue overflow channel is provided with a glue overflow outlet. The height of the glue inlet is higher than the height of the glue overflow outlet, and the height of the glue overflow outlet is higher than the top height of the positive pressure chamber.

5. The positive pressure dipping tank according to claim 1, characterized in that: A guide roller is arranged at the connection between the glue inlet channel and the glue overflow channel, and the glass cloth is wound around the side of the guide roller away from the positive pressure chamber.

6. The positive pressure dipping tank according to claim 1, characterized in that: The glue inlet channel is gradually inclined from bottom to top in a direction away from the glue overflow channel.

7. A dipping device, characterized in that: The positive pressure glue dipping tank according to any one of claims 1 to 6, wherein a glue inlet is provided on the glue inlet channel, and a glue overflow port is provided on the glue overflow channel, and further comprising: Adhesive tank; A glue return pipe, one end of which is connected to the glue overflow port, and the other end of which is connected to the viscosity adjustment tank; A glue inlet pipe, one end of which is connected to the viscosity adjusting tank, and the other end of which is connected to the glue inlet; Two metering rollers are also provided above the overflow glue channel; A glue receiving plate is also provided on the overflow glue channel, and the glue receiving plate is located below the metering roller; a glue outlet is provided on the glue receiving plate, and the glue outlet is communicated with the glue return pipe; the height of the glue receiving plate gradually decreases along the direction toward the glue outlet.

8. A dipping method, applied to a dipping device as claimed in claim 7, characterized in that: The dipping method comprises the steps of: S1, take a positive pressure glue dipping tank, pass the glass cloth through the glue inlet channel and out through the glue overflow channel; S2, introducing glue liquid into the positive pressure glue dipping tank until the liquid levels in the glue inlet channel and the glue overflow channel are at a first height; S3, filling gas into the positive pressure chamber until the liquid levels in the glue inlet channel and the glue overflow channel are at a second height; S4, continuously introducing glue into the glue inlet channel, and allowing the glue to continuously flow out from the glue overflow channel; S5. Drive the glass cloth to move along the glue inlet channel toward the glue overflow channel.

9. A dipping method according to claim 8, characterized in that: In step S5, it also includes: filling gas into the positive pressure chamber, and / or exhausting part of the gas in the positive pressure chamber.

10. A dipping method according to claim 8, characterized in that: The overflow glue channel is provided with an overflow glue port; The first height is lower than the height of the glue overflow port, and the second height is equal to the height of the glue overflow port.

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