Metal net and preparation method thereof

Abstract

The invention discloses a metal net and a preparation method thereof, the metal net is of a grid structure formed by metal lines in a closed mode, the aperture ratio of the metal net is larger than or equal to 95%, the average area of all holes of the metal net is smaller than 45 mm < 2 >, and the width of the metal lines larger than or equal to 50% in the metal net is smaller than 0.05 mm. The corresponding concave grids are designed on the female die, and the electroplating process is adopted, so that metal is deposited in the concave grids to obtain the metal net; different metal nets can be obtained by adjusting the line width and the line number density of the concave grids of the female die and replacing corresponding main body metal electroplating liquid, meanwhile, a plurality of different kinds of metal can be electroplated on the metal nets through a plurality of coating metal electroplating tanks, operation is flexible, and preparation is easy.

Description

Technical Field

[0001] The invention relates to the field of metal meshes, in particular to a metal mesh and a preparation method thereof. Background Art

[0002] The existing metal mesh adopts a grid structure composed of crossed metal lines. The commonly used metal mesh can be used in the field of construction for reinforcement, and can also be used in the fields of decoration, filtering, protection, etc. In addition, the metal mesh can also be used on photovoltaic cells. In this case, the crossed metal lines on the metal mesh play the role of main grid lines and fine grid lines, which are used to realize the convergence and output of the current generated by the photovoltaic cells.

[0003] At present, the main grid lines and fine grid lines of the metal mesh applied to photovoltaic cells are usually achieved by printing silver paste on the photovoltaic cells through screen printing. The width of the fine grid lines manufactured by this method is usually 20~28μm, or even up to 25-35um, which will greatly reduce the light-receiving area of ​​the photovoltaic cell, thereby affecting the power generation efficiency of the photovoltaic cell.

[0004] In view of the existence of the above problems, it is necessary to study a metal mesh and a preparation method thereof, wherein the metal mesh has a small shading area for photovoltaic cells. Summary of the invention

[0005] The object of the present invention is to provide a metal mesh and a preparation method thereof, wherein the metal mesh has a small shading area for photovoltaic cells.

[0006] In order to achieve the above object, the solution of the present invention is: A metal mesh having a mesh structure formed by a plurality of metal lines, the opening rate of the metal mesh is greater than or equal to 95%, and the average area of ​​each opening of the metal mesh is less than 45mm 2 , greater than or equal to 50% of all the metal lines of the metal mesh have a line width less than 0.05 mm.

[0007] The metal wires are made of copper, silver, aluminum, nickel or alloy metal.

[0008] The surface of the metal line is plated with a coating.

[0009] The plating layer is a copper plating layer, a silver plating layer, a tin plating layer or a nickel plating layer.

[0010] The opening rate of the metal mesh is greater than or equal to 97%.

[0011] Among all the metal lines of the metal mesh, greater than or equal to 50% of the metal lines have a line width less than 0.02 mm.

[0012] The widths of the metal lines of the metal mesh are the same or completely different or different.

[0013] The multiple metal lines of the metal mesh include multiple first metal lines and multiple second metal lines that cross each other; the number density of the first metal lines is 5 to 15 lines / cm, and the line width of the first metal lines is equal to or less than 0.035 mm; the number density of the second metal lines is 0.2 to 4 lines / cm, and the line width of the second metal lines is greater than 0.035 mm.

[0014] The multiple metal lines of the metal mesh also include at least one third metal line, the line width of the third metal line is greater than the line width of the first metal line, and when the number of third metal lines is greater than or equal to two, at least one first metal line is spaced between adjacent third metal lines.

[0015] When the number of the third metal lines is greater than or equal to two, the line widths of the third metal lines are the same, completely different, or not exactly the same.

[0016] The plurality of metal lines of the metal mesh further include frame metal lines with a line width greater than or equal to 0.2 mm, and the frame metal lines are fixedly connected to each of the first metal lines and / or each of the second metal lines.

[0017] A method for preparing the metal mesh as described above comprises the following steps in sequence: Step 1: immersing a master mold with a prefabricated concave grid on the surface into a main metal electroplating tank with a main metal electroplating solution; the concave grid of the master mold is formed by a plurality of closed molding lines, the molding lines are located at the bottom of the concave grid of the master mold, the molding lines are made of metal, and the surface of the master mold except for the molding lines is made of non-conductive material; Step 2: operating the master mold and performing electroplating, so that the metal in the main metal electroplating solution in the main metal electroplating tank is deposited in the concave grid of the master mold, thereby forming a metal mesh with a grid structure; Step 3: The formed metal mesh is peeled off from the master mold through a peeling device and transported to the outside of the main metal electroplating tank.

[0018] The master mold is a roller structure or a flat belt structure.

[0019] The recessed grids are distributed continuously or discontinuously on the surface of the master mold.

[0020] The widths of the various shaping lines of the recessed grid are the same, completely different, or different.

[0021] The multiple forming lines of the recessed grid include multiple first forming lines and multiple second forming lines that intersect each other, the number density of the first forming lines is 5 to 15 lines / cm, the line width of the first forming lines is equal to or less than 0.035 mm, the number density of the second forming lines is 0.2 to 4 lines / cm, and the line width of the second forming lines is greater than 0.035 mm.

[0022] The multiple shaping lines of the recessed grid further include at least one third shaping line, the line width of the third shaping line is greater than the line width of the first shaping line, and when the number of the third shaping lines is greater than or equal to two, at least one first shaping line is spaced between adjacent third shaping lines.

[0023] When the number of the third forming lines is greater than or equal to two, the line widths of the third forming lines are the same, completely different, or not exactly the same.

[0024] The multiple shaping lines of the recessed grid further include a frame shaping line with a width greater than or equal to 0.2 mm, and the frame shaping line is fixedly connected to each first shaping line and / or each second shaping line.

[0025] In the step 2, after the formed metal mesh is peeled off from the master mold, the metal mesh also enters at least one metal plating tank having a metal plating solution for electroplating, so that the metal in the metal plating solution in the metal plating tank is plated on the surface of the metal mesh, thereby forming a metal mesh with a coating.

[0026] When the number of the coating metal electroplating tanks is greater than or equal to two, the color temperature metal electroplating solutions in the respective metal electroplating tanks are the same, completely different or not exactly the same.

[0027] The plating metal electroplating solution is a silver electroplating solution, a copper electroplating solution, an aluminum electroplating solution, a nickel electroplating solution, a tin electroplating solution or a mixed metal electroplating solution.

[0028] The main layer metal plating solution is a silver plating solution, a copper plating solution, an aluminum plating solution, a nickel plating solution, a tin plating solution or a mixed metal plating solution.

[0029] In the step three, the formed metal mesh is peeled off from the mother mold by a peeling device, and then the metal mesh is collected by a collecting device to form a metal mesh sheet.

[0030] In the step three, the formed metal mesh is peeled off from the master mold by a peeling device, and then rolled up by a rolling device to form a metal mesh coil.

[0031] In step three, the formed metal mesh is firstly peeled off from the master mold by a peeling device, and then the metal mesh is compounded with the support layer, and then the metal mesh and the support layer are collected or rolled up together by a collecting device or a winding device to obtain a metal mesh sheet or a metal mesh coil.

[0032] The support layer is a film or paper.

[0033] An adhesive layer is provided between the metal mesh and the supporting layer.

[0034] After adopting the above scheme, the metal mesh prepared by the preparation method of a metal mesh of the present invention has a line width of more than or equal to 50% of the metal lines of all the metal lines of the metal mesh less than 0.05mm, and the opening rate of the metal mesh is greater than or equal to 95%, so that the shading area of ​​the metal mesh to the photovoltaic cell is small; the metal lines of the metal mesh are relatively thin, and it is difficult to prepare and realize the traditional method of stretching the metal into wires and weaving them; while the present invention only needs to design a corresponding concave grid on the master mold to realize it, and adopts the electroplating process. Since the forming lines of the concave grid are located at the bottom of the concave grid of the master mold, and only the concave grid The forming lines of the grid are made of metal, and the rest are made of non-conductive material. The metal is only deposited inside the recessed grid, so the end faces of the metal lines of the formed metal mesh are smooth and free of burrs. The line width and line density of the forming lines of the recessed grid of the master mold can also be adjusted to obtain metal meshes with different grid structures. In addition, metal meshes of different materials can be obtained by simply replacing the corresponding main metal electroplating solution. At the same time, several different metals can be electroplated on the metal mesh through multiple plating metal electroplating tanks, which is flexible to operate and simple to prepare. The metal mesh prepared by the present invention can be used as the main grid and fine grid on the photovoltaic cell. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 This is a schematic diagram of a metal mesh according to Embodiment 1 of the present invention.

[0036] Figure 2 Schematic diagram of a preparation device according to Example 1 of the present invention.

[0037] Figure 3 It is a schematic diagram of the partial structure of the mother mold roller of the first embodiment of the present invention.

[0038] Figure 4 This is a schematic diagram of preparing a metal mesh according to Example 1 of the present invention.

[0039] Figure 5 This is a schematic diagram of a metal mesh according to a second embodiment of the present invention.

[0040] Figure 6 Schematic diagram of the preparation device of Example 2 of the present invention.

[0041] Figure 7 This is a schematic diagram of preparing a metal mesh according to the second embodiment of the present invention.

[0042] Figure 8 This is a schematic diagram of a metal mesh according to Embodiment 3 of the present invention.

[0043] Fig. 9 Schematic diagram of the preparation device of Example 3 of the present invention.

[0044] Fig.10 This is a schematic diagram of preparing a metal mesh according to Embodiment 3 of the present invention.

[0045] Fig.11 This is a schematic diagram of a metal mesh according to a fourth embodiment of the present invention.

[0046] Fig.12 Schematic diagram of the preparation device of Example 4 of the present invention.

[0047] Fig.13 This is a schematic diagram of preparing a metal mesh according to Embodiment 4 of the present invention.

[0048] Description of labels: Metal mesh a, Opening a0, first metal line a1, second metal line a2, third metal line a3, frame metal line a4, Preparation device 1, Mother mold A, recessed grid A1, first molding line A11, second molding line A12, third molding line A13, frame molding line A14, Main metal plating tank B, main metal plating solution b Plating metal electroplating tank C, plating metal electroplating solution c, Stripping roller D, collecting device E, Metal mesh coil 2, Metal mesh sheet 3, Support layer 4. DETAILED DESCRIPTION

[0049] like Figures 1 to 13 As shown, the present invention discloses a metal mesh a, which is a mesh structure formed by a plurality of metal lines, the opening rate of the metal mesh a is greater than or equal to 95%, and the average area of ​​each opening a0 of the metal mesh a is less than 45mm 2 , greater than or equal to 50% of all the metal lines of the metal mesh a have a width of less than 0.05 mm; the preparation device 1 used in the preparation method of the metal mesh a includes a mother mold A and a main metal electroplating tank B, the surface of the mother mold A is prefabricated with a recessed grid A1 formed by a plurality of molding lines, the molding lines are located at the bottom of the recessed grid A1 of the mother mold A, the molding lines are made of metal, and the surface of the mother mold except the molding lines is made of non-conductive material.

[0050] In the present invention, the material of the metal lines of the metal mesh a can be copper, silver, aluminum, nickel or alloy metal. The surface of the metal line can be plated with a coating as needed, and the coating can be a silver coating, a tin coating or a nickel coating. The cross-section of the metal line can be circular, elliptical, triangular or polygonal, and the shape is not limited. The line widths of the metal lines of the metal mesh a can be the same or completely different or not exactly the same. When the metal mesh a is collected as a metal mesh sheet, a frame metal line a4 can be set around the metal mesh a; when the metal mesh a is rolled up into a metal mesh coil 2, the two sides of the metal mesh a can also be set with a frame metal line a4; the width of the frame metal line a4 is relatively large, which can provide good strength to the metal mesh a, so that when the metal mesh a is peeled off the master mold, it can effectively prevent the damage of the metal lines of the metal mesh a, so that it is easy to demold. The recessed grid A1 on the master mold A is formed into a plurality of closed grid structures by a plurality of molding lines. The main metal electroplating tank B may contain a main metal electroplating solution b, which may be a silver electroplating solution, a copper electroplating solution, an aluminum electroplating solution, a nickel electroplating solution, a tin electroplating solution or a mixed metal electroplating solution.

[0051] The testing method for the porosity of the metal mesh a of the present invention is: use a nickel mesh porosity detector to detect the metal mesh a, place the nickel mesh porosity detector close to the surface of the metal mesh a, test 5 different positions of the metal mesh a, read the porosity data and calculate the average value, so as to obtain the porosity of the metal mesh a.

[0052] The test method for the average area of ​​the openings a0 of the metal mesh a of the present invention is: using a Shanghai Changfang XTL-200 electron microscope (connected to a computer) and a CF-2000MIS image analysis system; firstly, opening the CF-2000MIS image analysis system, adjusting the magnification to 1.0 and calibrating; then placing the sample under the lens, turning on the light source, and adjusting the light source to a threshold of 95 when two peaks appear in the histogram; then clicking the "capture image" icon, adjusting the focal length to make the image the clearest; then clicking the "freeze image" icon to capture the image; then clicking the "lasso target selection tool" icon, checking 1 to 5 openings a0 in the analysis area; then clicking Click the "Select and Color Analysis Targets" icon, and when the "Determine Analysis Targets" dialog box appears, adjust the threshold to 95 and click OK; then click the "Target Analysis" icon, and when the "Analysis Results - Visualization" dialog box appears, click the "Analysis" button; when the "Single Parameter Analysis" dialog box appears, select "Algebraic Sum" as the current calculation option in the calculation options and click the "Calculate" button. The dialog box will display the analysis result B, where B is the total area of ​​the checked openings a0; finally, calculate the average area of ​​the openings a0 based on the number of checked openings a0.

[0053] The testing method for the line width of the metal lines (i.e., the first metal line a1 described below, the second metal line a2 described below, the third metal line a3 described below, and the frame metal line a4 described below) is as follows: use an ultra-depth of field 3D digital microscope (the model may be KEYENCE VHX-6000) to photograph the metal mesh a, and then use the measurement software of the ultra-depth of field 3D digital microscope to measure the image of the metal mesh a, measure the maximum width of a single metal line in the metal mesh a as the width of the metal line, measure 5 groups, and average the measured widths of the metal lines to obtain the width of the metal lines.

[0054] In order to further explain the technical solution of the present invention, the present invention is described in detail below through specific embodiments.

[0055] Embodiment 1: Cooperate Figures 1 to 4 As shown, in the first embodiment of the present invention, the method for preparing the metal mesh of the present invention comprises the following steps in sequence: Step 1: immerse a master mold A with a prefabricated concave grid A1 on the surface in a main metal electroplating tank B with a main metal electroplating solution b, wherein: the master mold A is a roller structure, and the concave grid A1 is continuously distributed on the surface of the master mold A; the concave grid A1 of the master mold A is formed by a plurality of closed molding lines, and the shape of the concave grid A1 formed by the molding lines can be a polygon such as a quadrilateral, pentagon, hexagon, or a circle or an irregular shape; the molding line is located at the bottom of the concave grid A1 of the master mold A, the molding line is made of metal, and the surface of the master mold A except the molding line is made of non-conductive material; Step 2: operating the master mold and performing electroplating, so that the metal in the main metal electroplating solution b in the main metal electroplating tank B is deposited at the bottom of the recessed grid A1 of the master mold A, thereby forming a metal mesh a having a grid structure formed by metal lines; Step 3: The formed metal mesh a is peeled off from the mother mold A through a peeling roller D, and transported to the outside of the main metal electroplating tank B, and finally rolled up to form a metal mesh coil 2.

[0056] In the first embodiment of the present invention, a metal mesh a can be prepared through the design of the master mold A and the electroplating process, and the metal lines of all the metal lines of the metal mesh a are greater than or equal to 50% and have a width of less than 0.05 mm, and the opening rate of the metal mesh a is greater than or equal to 95%; because the metal lines of the metal mesh a are relatively thin, and the traditional method of stretching the metal into wires and weaving them is difficult to prepare and difficult to achieve, while the present invention only needs to design a corresponding concave grid A1 with line width on the master mold A to achieve it, and the preparation is simple. The multiple molding lines constituting the concave grid A1 can form polygons such as quadrilaterals, pentagons, and hexagons, and can also form circular or irregular shapes. And because the molding lines are located at the bottom of the concave grid A1 of the master mold A, and only the molding lines are made of metal material, and the rest are non-conductive materials, so that the metal will only be deposited inside the concave grid, so the end face of the metal lines of the formed metal mesh a is smooth and has no burrs.

[0057] In the first embodiment of the present invention, there are frame molding lines A14 on both sides of the recessed grid A1 (i.e., the multiple molding lines of the recessed grid A1 include the frame molding lines A14), and the frame molding lines A14 are connected to other molding lines of the recessed grid A1, so that the two sides of the formed metal mesh coil 2 have frame metal lines a4 (i.e., the multiple metal lines of the metal mesh a include the frame metal lines a4), and the frame metal lines a4 are connected to other metal lines of the metal mesh coil 2; since the width of the frame metal lines a4 is relatively large, it can provide good strength to the metal mesh a, and when the metal mesh a is peeled off the master mold, it can effectively prevent the damage of the metal lines of the metal mesh a, making it easy to demold. The metal mesh coil 2 of the present invention can continuously unwind the entire roll of metal mesh a in subsequent applications to achieve continuous production.

[0058] In the first embodiment of the present invention, the specific parameters for preparing the metal mesh a of the present invention can be: the material of each metal line of the metal mesh a is copper, the opening rate of the metal mesh a is 95%, and the average area of ​​each opening of the metal mesh a is 40 mm 2 , greater than or equal to 50% of all metal lines of the metal mesh a have a line width less than 0.05 mm, and the main metal electroplating solution b is a copper electroplating solution.

[0059] Embodiment 2: Cooperate Figures 5 to 7 As shown, in the second embodiment of the present invention, the method for preparing the metal mesh of the present invention comprises the following steps in sequence: Step 1: immerse a master mold A having a prefabricated concave grid A1 on the surface thereof in a main metal electroplating tank B having a main metal electroplating solution b, wherein: the master mold A is a flat strip structure, the concave grid A1 of the master mold A is intermittently distributed on the surface of the master mold A, and the concave grid A1 of the master mold A is formed by a plurality of closed molding lines; specifically, the plurality of molding lines of the concave grid A1 of the master mold A include a plurality of first molding lines A11 and a plurality of second molding lines A12 that intersect each other, the number density of the first molding lines A11 is 10 / cm, and the number density of the second molding lines A12 is 10 / cm. The line width of the first molding line A11 is 0.02 mm, the line number density of the second molding line A12 is 2 lines / cm, the line width of the second molding line A12 is greater than 0.06 mm, and the line width of the first molding line A11 is less than the line width of the second molding line A12; the first molding line A11 and the second molding line A12 are located at the bottom of the recessed grid A1 of the mother mold A, the first molding line A11 and the second molding line A12 are made of metal, and the surface of the mother mold A except the metal lines is made of non-conductive material; Step 2: operate the master mold and perform electroplating, so that the metal in the main metal plating solution b in the main metal plating tank B is deposited at the bottom of the recessed grid A1 of the master mold A, thereby forming a metal mesh a with a grid structure formed by the first metal line a1 and the second metal line a2; Step 3: The formed metal mesh a is peeled off from the mother mold A through a peeling roller D, and transported to the outside of the main metal electroplating tank B, and finally collected by a collecting device E to form a metal mesh sheet 3.

[0060] In the second embodiment of the present invention, the master mold A used in the present invention is a flat belt structure prefabricated with a recessed grid A1. By running the master mold A, the metal in the main metal plating solution b is deposited in the recessed grid A1 to form a metal mesh a. Compared with the master mold A with a roller structure, the master mold A with a flat belt structure is more affected by its surface area and is not suitable for setting a larger recessed grid A1, especially a discontinuous recessed grid A1; while the master mold A with a flat belt structure can be adjusted in length according to the size of the prefabricated recessed grid A1, is not affected by the size of the recessed grid A1, and multiple recessed grids A1 with different structures can be set on the same metal mesh belt, so that multiple metal meshes a with different grid structures can be obtained at one time. Moreover, the master mold A with a flat belt structure has a longer running stroke, which is more conducive to metal deposition, so that the formed metal mesh a is uniform in thickness. In the present invention, the metal mesh sheet 3 can be obtained by the intermittently distributed recessed grid A1 and the collecting device on the master mold A. The metal mesh sheet 3 can be set when the recessed grid A1 is designed according to the sheet size requirements, and does not need to be cut when used, which is convenient to use. In addition, the frame forming lines A14 connected to the multiple first forming lines A11 and the multiple second forming lines A12 can be set around the intermittently distributed recessed grid A1, so that the formed metal mesh sheet 3 has frame metal lines a4 connected to the multiple first metal lines a1 and the multiple second metal lines a2 around it. Since the width of the frame metal lines a4 is large, it can provide good strength to the metal mesh a, making it easy to demold when the metal mesh a is peeled off the master mold A, and it is not easy to damage the metal lines of the metal mesh a; in addition, when taking the metal mesh sheet 3, the presence of the frame metal lines a4 can give the metal mesh sheet 3 a certain stiffness, which is convenient for taking.

[0061] In the second embodiment of the present invention, the specific parameters for preparing the metal mesh a of the present invention can be as follows: the material of the metal wire of the metal mesh a is silver, the opening rate of the metal mesh a is 97%, and the average area of ​​each opening a0 of the metal mesh a is 35 mm 2 , greater than or equal to 50% of all metal lines of the metal mesh a have a line width of 0.02 mm, wherein: the line width of the first metal line a1 is 0.02 mm, the line width of the second metal line a2 is 0.06 mm, and the main metal plating solution b is a silver plating solution.

[0062] Embodiment three: Cooperate Figures 8 to 10 As shown, in the third embodiment of the present invention, the method for preparing the metal mesh of the present invention comprises the following steps in sequence: Step 1: immerse a master mold A having a prefabricated concave grid A1 on the surface thereof in a main metal electroplating tank B having a main metal electroplating solution b, wherein: the master mold A is a flat strip structure, the concave grid A1 is continuously distributed on the surface of the master mold, and the concave grid A1 of the master mold A is formed by a plurality of closed molding lines; specifically, the plurality of molding lines of the concave grid A1 of the master mold A include a plurality of first molding lines A11 and a plurality of second molding lines A12 that intersect each other; the plurality of molding lines of the concave grid A1 also include at least one third molding line A13, and the line width of the third molding line A13 is greater than The line width of the first molding line A11; when the number of the third molding lines A13 is greater than or equal to two, there is at least one first molding line A11 between adjacent third molding lines A13, and the line widths of the third molding lines A13 are the same or completely different or not exactly the same; the first molding line A11, the second molding line A12 and the third molding line A13 are located at the bottom of the recessed grid A1 of the mother mold A, the first molding line A11, the second molding line A12 and the third molding line A13 are made of metal, and the surface of the mother mold A except the molding lines is made of non-conductive material; Step 2: operate the master mold and perform electroplating, so that the metal in the main metal electroplating solution b in the main metal electroplating tank B is deposited at the bottom of the recessed grid A1 of the master mold A, thereby forming a metal mesh a having a grid structure formed by the first metal line a1, the second metal line a2 and the third metal line a3; Step three: first, the formed metal mesh a is peeled off from the mother mold A through a peeling device (i.e., a peeling roller D); then the metal mesh a is also placed in a coating metal electroplating tank C having a coating metal electroplating solution c for electroplating, so that the metal in the coating metal electroplating solution c in the coating metal electroplating tank C is plated on the surface of the metal mesh a, thereby forming a coated metal mesh a; finally, the coated metal mesh a is compounded with the support layer 4 and then rolled up together to form a metal mesh coil 2.

[0063] In the third embodiment of the present invention, a third molding line A13 having a line width greater than the first molding line A11 is further provided in the recessed grid A1 of the mother mold A, so that the formed metal mesh a will correspondingly have a third metal line a3. Since the line width of the third metal line a3 is relatively large, the third metal line a3 can play a supporting role in the metal mesh a, thereby increasing the strength of the metal mesh a and effectively preventing the problem of metal line breakage in the metal mesh a during use.

[0064] In the third embodiment of the present invention, after the metal mesh a is peeled off from the mother mold A, it enters the coating metal electroplating tank C for electroplating, so that the surface of the metal mesh a is coated with a layer of metal coating. The coated metal mesh a can have different metal materials, which can not only have the characteristics of different metal materials, but also reduce the manufacturing cost.

[0065] In the third embodiment of the present invention, the metal mesh a can enter multiple coating metal electroplating tanks C for electroplating and perform multiple electroplating processes; when the number of coating metal electroplating tanks C is greater than or equal to two, the metal plating solutions in each metal electroplating tank can be the same or completely different or not exactly the same, and can be flexibly designed and operated according to the required use of the metal mesh a; the coating metal plating solution c in the coating metal plating tank C can be a silver plating solution, a copper plating solution, an aluminum plating solution, a nickel plating solution, a tin plating solution or a mixed metal plating solution.

[0066] In the third embodiment of the present invention, due to the presence of the support layer 4 in the metal mesh coil 2, the metal mesh a can be effectively isolated to prevent multiple layers of the metal mesh a from sticking together, thereby facilitating the subsequent unwinding operation. The support layer 4 can be a film or paper, and there can be an adhesive layer between the metal mesh a or the plated metal mesh a' and the support layer 4, so that the support layer 4 can adhere to the metal mesh a, effectively preventing the support layer 4 from moving during the winding process.

[0067] In the third embodiment of the present invention, the specific parameters for preparing the metal mesh a of the present invention can be as follows: the material of the metal wire of the metal mesh a is nickel, the plating layer is copper plating, the opening rate of the metal mesh a is 96%, and the average area of ​​each opening a0 of the metal mesh a is 30 mm 2 , the line width of greater than or equal to 50% of all the metal lines of the metal mesh a is 0.035 mm; the number density of the first molding line A11 of the recessed grid A1 of the master mold A is 5 lines / cm, and the line width of the first molding line A11 is 0.035 mm; the number density of the second molding line A12 is 4 lines / cm, and the line width of the second molding line A12 is 0.05 mm, the width of the third molding line A13 of the recessed grid A1 of the master mold A is 0.04 mm, the main metal electroplating solution b is a nickel electroplating solution, and the plating metal electroplating solution c is a copper electroplating solution.

[0068] Embodiment 4: Cooperate Figures 11 to 13 As shown, in the third embodiment of the present invention, the method for preparing the metal mesh of the present invention comprises the following steps in sequence: Step 1: immerse a master mold A with a prefabricated concave grid A1 on the surface in a main metal electroplating tank B with a main metal electroplating solution b, wherein: the master mold A is a roller structure, the concave grid A1 of the master mold A is continuously distributed on the surface of the master mold A, and the concave grid A1 of the master mold A is formed by a plurality of closed molding lines; specifically, the plurality of molding lines of the concave grid A1 of the master mold A include a plurality of first molding lines A11 and a plurality of second molding lines A12 that intersect each other; the plurality of molding lines of the concave grid A1 It also includes a frame molding line A14 with a width greater than or equal to 0.2 mm, and the frame molding line A14 is fixedly connected to each first molding line A11 and / or each second molding line A12; the first molding line A11, the second molding line A12 and the frame molding line A14 are located at the bottom of the recessed grid A1 of the mother mold A, the first molding line A11, the second molding line A12 and the frame molding line A14 are made of metal, and the surface of the mother mold A except the lines A00 is made of non-conductive material; Step 2: operate the master mold and perform electroplating, so that the metal in the main metal electroplating solution b in the main metal electroplating tank B is deposited at the bottom of the recessed grid A1 of the master mold A, thereby forming a metal mesh a with a grid structure composed of the first metal line a1, the second metal line a2 and the fourth metal line a13; Step three: first, the formed metal mesh a is peeled off from the mother mold A through the peeling roller D; then the metal mesh a is successively placed into two coating metal electroplating tanks C with coating metal electroplating solution c for electroplating, so that the metal in the coating metal electroplating solution c in each coating metal electroplating tank C is plated on the surface of the metal mesh a, thereby forming a metal mesh a with a coating; finally, the coated metal mesh a' is compounded with the support layer 4 and then rolled up together to form a metal mesh coil 2.

[0069] In the fourth embodiment of the present invention, by further providing a frame forming line A14 with a width greater than or equal to 0.2 mm on the master mold roller A1 of the master mold roller A, the metal mesh a2 formed in this way will have a corresponding frame metal line a4, and the frame metal line a4 can be located inside the metal mesh coil 2 and fixedly connected to the first metal line a1 and / or the second metal line a13, and the frame metal line a4 can also be located on the side of the metal mesh coil 2 and fixedly connected to the first metal line a1 or the second metal line a13; since the width of the frame metal line a4 is relatively large, it can provide good strength to the metal mesh a, and when the metal mesh a is peeled off from the master mold A, it can effectively prevent the damage of the metal line of the metal mesh a, making it easy to demold, and when used, the frame metal line a4 can be cut as needed to prevent damage to other metal lines.

[0070] In the fourth embodiment of the present invention, the metal mesh a is first formed by the main metal electroplating tank B, and then the metal mesh a is electroplated twice by two coating metal electroplating tanks C; wherein, the metal mesh a formed by electroplating in the main metal electroplating tank B is thinner, so that the metal mesh a formed in this way is easy to be peeled off from the mother mold A, and the metal lines of the formed metal mesh a are not easily damaged, and then the metal mesh a can be thickened by electroplating in the first coating metal electroplating tank C, and then other metals are electroplated on its surface as needed in the second coating metal electroplating tank C to form a metal mesh a with a coating, giving the metal mesh a multi-metal functional characteristics.

[0071] In the fourth embodiment of the present invention, the specific parameters for preparing the metal mesh a of the present invention can be as follows: the metal wire material of the metal mesh a is copper, the two coatings are copper coating and tin coating, the opening rate of the metal mesh a is 98%, and the average area of ​​each opening of the metal mesh a is 30 mm 2 , the line width of greater than or equal to 50% of all the metal lines a of the metal mesh a is 0.016 mm; the number density of the first molding line A11 of the recessed grid A1 of the mother mold A is 15 lines / cm, and the line width of the first molding line A11 is 0.016 mm; the number density of the second molding line A12 of the recessed grid A1 of the mother mold A is 1 line / cm, and the line width of the second molding line A12 is 0.055 mm, the main metal electroplating solution b is a copper electroplating solution, the plating metal electroplating solution c in the first plating metal electroplating tank C is a copper electroplating solution, and the plating metal electroplating solution c in the second plating metal electroplating tank C is a tin electroplating solution.

[0072] It should be noted that, in the present invention, line density refers to the number of lines per unit length, and line width refers to the maximum width of the line in the cross-sectional direction.

[0073] The above embodiments and drawings do not limit the product form and style of the present invention. Any appropriate changes or modifications made by ordinary technicians in the relevant technical field should be deemed to be within the patent scope of the present invention.

Claims

1. A metal mesh, characterized in that: The metal mesh is a grid structure formed by a plurality of metal lines, the opening rate of the metal mesh is greater than or equal to 95%, and the average area of ​​each opening of the metal mesh is less than 45mm 2 , greater than or equal to 50% of all the metal lines of the metal mesh have a line width less than 0.05 mm.

2. The metal mesh according to claim 1, characterized in that: The metal wires are made of copper, silver, aluminum, nickel or alloy metal.

3. The metal mesh according to claim 1, characterized in that: The surface of the metal line is plated with a coating.

4. The metal mesh according to claim 3, characterized in that: The plating layer is a copper plating layer, a silver plating layer, a tin plating layer or a nickel plating layer.

5. The metal mesh according to claim 1, characterized in that: The opening rate of the metal mesh is greater than or equal to 97%.

6. The metal mesh according to claim 1, characterized in that: Among all the metal lines of the metal mesh, greater than or equal to 50% of the metal lines have a line width less than 0.02 mm.

7. The metal mesh according to claim 1, characterized in that: The widths of the metal lines of the metal mesh are the same or completely different or different.

8. The metal mesh according to claim 1, characterized in that: The multiple metal lines of the metal mesh include multiple first metal lines and multiple second metal lines that cross each other; the number density of the first metal lines is 5 to 15 lines / cm, and the line width of the first metal lines is equal to or less than 0.035 mm; the number density of the second metal lines is 0.2 to 4 lines / cm, and the line width of the second metal lines is greater than 0.035 mm.

9. The metal mesh according to claim 8, characterized in that: The multiple metal lines of the metal mesh also include at least one third metal line, the line width of the third metal line is greater than the line width of the first metal line, and when the number of third metal lines is greater than or equal to two, at least one first metal line is spaced between adjacent third metal lines.

10. The metal mesh according to claim 9, characterized in that: When the number of the third metal lines is greater than or equal to two, the line widths of the third metal lines are the same, completely different, or not exactly the same.

11. The metal mesh according to claim 8, characterized in that: The plurality of metal lines of the metal mesh further include frame metal lines with a line width greater than or equal to 0.2 mm, and the frame metal lines are fixedly connected to each of the first metal lines and / or each of the second metal lines.

12. A method for preparing a metal mesh as claimed in claim 1, characterized in that: The steps are as follows: Step 1: immersing a master mold with a prefabricated concave grid on the surface into a main metal electroplating tank with a main metal electroplating solution; the concave grid of the master mold is formed by a plurality of closed molding lines, the molding lines are located at the bottom of the concave grid of the master mold, the molding lines are made of metal, and the surface of the master mold except for the molding lines is made of non-conductive material; Step 2: operating the master mold and performing electroplating, so that the metal in the main metal electroplating solution in the main metal electroplating tank is deposited in the concave grid of the master mold, thereby forming a metal mesh with a grid structure; Step 3: The formed metal mesh is peeled off from the master mold through a peeling device and transported to the outside of the main metal electroplating tank.

13. The preparation method according to claim 12, characterized in that: The master mold is a roller structure or a flat belt structure.

14. The preparation method according to claim 12, characterized in that: The recessed grids are distributed continuously or discontinuously on the surface of the master mold.

15. The preparation method according to claim 12, characterized in that: The widths of the various shaping lines of the recessed grid are the same, completely different, or different.

16. The preparation method according to claim 12, characterized in that: The multiple forming lines of the recessed grid include multiple first forming lines and multiple second forming lines that intersect each other, the number density of the first forming lines is 5 to 15 lines / cm, the line width of the first forming lines is equal to or less than 0.035 mm, the number density of the second forming lines is 0.2 to 4 lines / cm, and the line width of the second forming lines is greater than 0.035 mm.

17. The preparation method according to claim 16, characterized in that: The multiple shaping lines of the recessed grid further include at least one third shaping line, the line width of the third shaping line is greater than the line width of the first shaping line, and when the number of the third shaping lines is greater than or equal to two, at least one first shaping line is spaced between adjacent third shaping lines.

18. The preparation method according to claim 17, characterized in that: When the number of the third forming lines is greater than or equal to two, the line widths of the third forming lines are the same, completely different, or not exactly the same.

19. The preparation method according to claim 16, characterized in that: The multiple shaping lines of the recessed grid further include a frame shaping line with a width greater than or equal to 0.2 mm, and the frame shaping line is fixedly connected to each first shaping line and / or each second shaping line.

20. The preparation method according to claim 12, characterized in that: In the step 2, after the formed metal mesh is peeled off from the master mold, the metal mesh also enters at least one metal plating tank having a metal plating solution for electroplating, so that the metal in the metal plating solution in the metal plating tank is plated on the surface of the metal mesh, thereby forming a metal mesh with a coating.

21. The preparation method according to claim 20, characterized in that: When the number of the coating metal electroplating tanks is greater than or equal to two, the color temperature metal electroplating solutions in the respective metal electroplating tanks are the same, completely different or not exactly the same.

22. The preparation method according to claim 20 or 21, characterized in that: The plating metal electroplating solution is a silver electroplating solution, a copper electroplating solution, an aluminum electroplating solution, a nickel electroplating solution, a tin electroplating solution or a mixed metal electroplating solution.

23. The preparation method according to claim 12, characterized in that: The main layer metal plating solution is a silver plating solution, a copper plating solution, an aluminum plating solution, a nickel plating solution, a tin plating solution or a mixed metal plating solution.

24. The preparation method according to claim 12, characterized in that: In the step three, the formed metal mesh is peeled off from the mother mold by a peeling device, and then the metal mesh is collected by a collecting device to form a metal mesh sheet.

25. The preparation method according to claim 12, characterized in that: In the step three, the formed metal mesh is peeled off from the master mold by a peeling device, and then rolled up by a rolling device to form a metal mesh coil.

26. The preparation method according to claim 12, characterized in that: In step three, the formed metal mesh is firstly peeled off from the master mold by a peeling device, and then the metal mesh is compounded with the support layer, and then the metal mesh and the support layer are collected or rolled up together by a collecting device or a winding device to obtain a metal mesh sheet or a metal mesh coil.

27. The preparation method according to claim 26, characterized in that: The support layer is a film or paper.

28. The preparation method according to claim 26, characterized in that: An adhesive layer is provided between the metal mesh and the supporting layer.

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