Device for gold removing and tin coating of electric connector lead

Abstract

The invention relates to the technical field of welding, in particular to a gold removing and tin coating device for an electric connector lead, which comprises a liquid outlet, a heating container, a solder wire, a wire feeding wheel and a driver, and is characterized in that the front end of the heating container is conical and is connected with the liquid outlet in a matched manner; the rear end of the heating container is cylindrical and is used for a solder wire to enter; the wire feeding wheels are arranged on the two sides of the solder wire and clamp the solder wire. And the driver is electrically connected with the wire feeding wheel and is used for driving the wire feeding wheel to rotate, so that the solder wire continuously enters the heating container. The high-frequency heating principle is adopted, heating and melting of the solder wire are efficiently and rapidly achieved, the piston push rod formed by the solder wire is used for achieving extrusion of molten solder, the molten liquid solder is kept to flow in the soldering groove, and it is guaranteed that the outer surface of the soldering groove is not polluted by the solder.

Description

Technical Field

[0001] The present application relates to the field of welding technology, and in particular to a device for removing gold and tinning lead wires of electrical connectors. Background Art

[0002] For electronic products in aviation, aerospace and other fields with harsh environmental conditions and high reliability requirements, the gold element will combine with the tin element in the lead-tin solder to form a brittle alloy layer, which may crack during use. Therefore, the gold-plated surface of the component leads must be de-golded and tin-plated to reduce the risk of reduced solder joint reliability due to the presence of gold after soldering.

[0003] Since the lead soldering groove of the electrical connector is a semicircular groove, the electrical connector contact including the lead at the tail adopts a surface gold plating process. During welding, the gold-plated layer inside the semicircular groove of the lead needs to be tinned so that the gold element diffuses and melts into the solder under the high temperature of the molten solder. Then the solder is removed in the molten state to complete the gold-plated layer on the inner surface of the semicircular groove of the lead of the electrical connector, while the outer surface of the lead groove maintains the original gold-plated surface.

[0004] For a long time, the traditional manual electric soldering iron tinning process has been used to remove the gold-plated layer inside the lead soldering groove of the electrical connector. First, the electric soldering iron is used to heat the electrical connector lead and solder so that the gold-plated layer in the lead soldering groove is melted into one, and at the same time, the diffusion and melting of the gold element in the solder is completed to complete the first tinning; then the electric soldering iron is used to heat the tin-absorbing rope and the lead soldering groove to melt the solder after the first tinning, and the solder is kept in liquid state and the capillary action of the tin-absorbing rope is used to absorb the solder inside the lead soldering groove; after removal, the electric soldering iron is used to heat the electrical connector lead and solder to complete the second tinning, so as to prepare for the subsequent welding of the wire in the lead soldering groove. The above method of removing gold and tinning requires a high skill level of the operator. If the operation is not careful, the gold-plated surface outside the lead groove will be adhered by the solder, causing pollution; and it is impossible to continuously output liquid solder, and the work efficiency is low. Summary of the invention

[0005] The present application provides a device for removing gold and tinning the leads of electrical connectors, which utilizes heating and extrusion functions to spray molten solder onto the inner wall surface of a solder cup, dissolves and removes the gold-plated layer on the surface and completes the tinning process.

[0006] In order to achieve the above-mentioned objectives, the present application provides a device for de-golding and tinning the leads of electrical connectors, comprising a liquid outlet, a heating container, a solder wire, a wire feeding wheel and a driver, wherein: the front end of the heating container is conical and connected with the liquid outlet; the rear end of the heating container is cylindrical and is used for the entry of the solder wire; the wire feeding wheels are arranged on both sides of the solder wire to clamp the solder wire; the driver is electrically connected to the wire feeding wheel and is used to drive the wire feeding wheel to rotate, so that the solder wire continuously enters the heating container.

[0007] Furthermore, a heating device is provided outside the heating container for heating the heating container.

[0008] Furthermore, the heating device includes a heating power supply, a temperature controller and a high-frequency heater, wherein: the heating power supply is connected to the high-frequency heater; the high-frequency heater is arranged outside the heating container; and the temperature controller is connected to the heating power supply.

[0009] Furthermore, it also includes a control switch, which is connected to the driver and the heating power supply respectively.

[0010] Furthermore, in the initial state, the solder wire is in a solid state.

[0011] Furthermore, after the solder wire enters the heating container, it is melted by the heat and becomes liquid, and is discharged through the liquid outlet.

[0012] Furthermore, the size of the liquid outlet matches the groove of the lead wire of the electrical connector.

[0013] The present application provides a device for removing gold and tin from leads of an electrical connector, which has the following beneficial effects:

[0014] The present application adopts the high-frequency heating principle to efficiently and quickly heat and melt the solder wire, and utilizes the solder wire to form a piston push rod to extrude the molten solder. The molten liquid solder is kept flowing inside the solder tank to ensure that the outer surface of the solder tank is not contaminated by the solder; at the same time, the time and temperature of the liquid solder outflow can be controlled to ensure that the liquid solder can be continuously output, thereby completing the gold removal and tinning operations of the electrical connector leads. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings constituting a part of this application are used to provide a further understanding of this application, so that other features, purposes and advantages of this application become more obvious. The schematic embodiment drawings and their descriptions of this application are used to explain this application and do not constitute an improper limitation on this application. In the drawings:

[0016] Figure 1 It is a structural schematic diagram of a device for removing gold and tin from leads of an electrical connector provided in accordance with an embodiment of the present application;

[0017] Figure 2It is a schematic diagram of using the embodiment of the present application to remove gold and tin from the leads of an electrical connector;

[0018] In the figure: 1-liquid outlet, 2-heating container, 3-solder wire, 4-wire feeding wheel, 5-driver, 6-heating power supply, 7-high frequency heater, 8-control switch, 9-electrical connector. DETAILED DESCRIPTION

[0019] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0020] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0021] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0022] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0023] In addition, the term "plurality" shall mean two or more.

[0024] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0025] like Figure 1-2 As shown, the present application provides a device for de-golding and tinning the leads of electrical connectors, comprising a liquid outlet 1, a heating container 2, a solder wire 3, a wire feeding wheel 4 and a driver 5, wherein: the front end of the heating container 2 is a cone, which is connected with the liquid outlet 1; the rear end of the heating container 2 is a column, which is used for the entry of the solder wire 3; the wire feeding wheel 4 is arranged on both sides of the solder wire 3 to clamp the solder wire 3; the driver 5 is electrically connected to the wire feeding wheel 4, and is used to drive the wire feeding wheel 4 to rotate, so that the solder wire 3 continuously enters the heating container 2.

[0026] Specifically, utilizing the fast diffusion characteristic of gold (Au) atoms in molten solder (lead-tin alloy, generally >200°C), molten solder is injected into the solder groove of the lead of the electrical connector 9. When the molten solder flows and flushes, the gold layer plated on the inner wall of the lead groove is melted and taken away, thereby completing the gold removal and tin plating operations inside the semicircular groove of the lead of the electrical connector 9 in one operation.

[0027] More specifically, the device for removing gold and tinning the leads of electrical connectors provided in the embodiment of the present application is mainly used for removing the gold-plated layer inside the soldering groove of the leads of the electrical connector 9 and completing the tinning work. The molten solder is sprayed onto the inner wall surface of the solder cup by means of heating and extrusion functions, so as to melt and remove the gold-plated layer on the surface and complete the tinning process. It can also be used for the removal of gold and tinning and welding of gold-plated leads of other components. Among them, the liquid outlet 1 is preferably a soldering iron nozzle structure, which is mainly used to extrude the melted liquid solder material; the heating container 2 is used to heat the solid solder wire 3 entering, so that it quickly melts into liquid; the wire feeding wheel 4 is used to fix the solder wire 3, and use the inertia of rotation to move the solder wire 3 as a whole forward into the interior of the heating container 2; the driver 5 is used to control the rotation of the wire feeding wheel 4.

[0028] Furthermore, a heating device is provided outside the heating container 2 for heating the heating container 2 .

[0029] Furthermore, the heating device includes a heating power supply 6, a temperature controller and a high-frequency heater 7, wherein: the heating power supply 6 is connected to the high-frequency heater 7; the high-frequency heater 7 is arranged outside the heating container 2; and the temperature controller is connected to the heating power supply 6.

[0030] Specifically, the heating device is mainly used to heat the heating container 2, so that the solder wire 3 inside the heating container 2 melts into a liquid state. In the embodiment of the present application, high-frequency heating is preferably used, and the heating power supply 6 and the high-frequency heater 7 are used to achieve rapid heating of the heating container 2 to ensure that the solder wire 3 inside the heating container 2 can be melted efficiently and quickly. During the heating process, the temperature inside the heating container 2 can be controlled by a temperature controller to ensure the flexibility of adjusting the melting temperature.

[0031] Furthermore, a control switch 8 is included, and the control switch 8 is respectively connected to the driver 5 and the heating power supply 6. The control switch 8 can be connected to the control system, and is used to control the driver 5 on the one hand to realize the control of the rotation of the wire feeding wheel 4, and is used to control the heating power supply 6 on the other hand to realize the heating of the heating container 2.

[0032] Furthermore, in the initial state, the solder wire 3 is in a solid state.

[0033] Furthermore, after the solder wire 3 enters the heating container 2 , it is melted by the heat and becomes liquid, and is discharged through the liquid outlet 1 .

[0034] Specifically, the solder wire 3 is solid in the initial state and is fixed between the wire feeding wheels 4 on both sides; when working, the control switch 8 is used to control the driver 5 to turn on, so that the wire feeding wheel 4 starts to rotate, so that the solder wire 3 is fed into the heating container 2, and then the control switch 8 is used to turn on the heating power supply 6 and the high-frequency heater 7 to heat the heating container 2, so that the solid solder wire 3 entering the heating container 2 will melt and become liquid. During the heating process, the temperature controller is adjusted at any time to keep the temperature of the liquid solder at a reasonable level; at this time, as the solid solder wire 3 continuously enters the heating container 2 and is melted, the inside of the heating container 2 will be filled with liquid solder, and the solid solder wire 3 is similar to a piston push rod structure, so that the melted liquid solder will be squeezed out of the liquid outlet 1 and flow into the lead groove of the electrical connector 9, heating the lead, and completing the diffusion and melting of the gold element in the molten tin material, continuously sending out the molten solder material, and washing away the solder material molten with gold elements, completing the gold removal process of the gold-plated surface inside the lead groove of the electrical connector 9.

[0035] Furthermore, the size of the liquid outlet 1 matches the groove of the lead of the electrical connector 9. In the embodiment of the present application, the size of the liquid outlet 1 matches the groove of the lead of the electrical connector 9; when removing the gold and tinning, the lead groove is slightly tilted downward, and the molten solder will only flow in the lead groove, which can ensure that the gold-plated surface outside the lead groove will not be contaminated by the solder.

[0036] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A device for removing gold and tin from leads of electrical connectors, characterized in that: It includes a liquid outlet, a heating container, a solder wire, a wire feeding wheel and a driver, wherein: The front end of the heating container is in the form of a cone, and is cooperatively connected with the liquid outlet; The rear end of the heating container is cylindrical and is used for the solder wire to enter; The wire feeding wheels are arranged on both sides of the solder wire to clamp the solder wire; The driver is electrically connected to the wire feeding wheel and is used to drive the wire feeding wheel to rotate, so that the solder wire continuously enters the heating container.

2. The device for removing gold and tin from leads of electrical connectors according to claim 1, characterized in that: A heating device is arranged outside the heating container for heating the heating container.

3. The device for removing gold and tin from leads of electrical connectors according to claim 2, characterized in that: The heating device comprises a heating power supply, a temperature controller and a high-frequency heater, wherein: The heating power supply is connected to the high-frequency heater; The high-frequency heater is arranged outside the heating container; The temperature controller is connected to the heating power supply.

4. The device for removing gold and tin from leads of electrical connectors according to claim 3, characterized in that: It also includes a control switch, which is connected to the driver and the heating power supply respectively.

5. The device for removing gold and tin from leads of electrical connectors according to claim 4, characterized in that: In an initial state, the solder wire is in a solid state.

6. The device for removing gold and tin from leads of electrical connectors according to claim 5, characterized in that: After the solder wire enters the heating container, it is heated and melted to become liquid, and is discharged through the liquid outlet.

7. The device for removing gold and tinning the leads of electrical connectors according to claim 6, characterized in that: The size of the liquid outlet matches the groove of the lead wire of the electrical connector.

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