Board-level test method and system for power module devices

Abstract

The invention provides a board-level test method and system for a power module device, and the method comprises the steps: transmitting an electric signal to a to-be-tested part of the power module device, and obtaining an output signal of the to-be-tested part; a load is provided for the tested piece, and performance parameters of the tested piece are obtained; performing fault detection on the electric signal, the output signal, the load and / or the performance parameter to obtain fault characteristics of the electric signal, the output signal, the load and / or the performance parameter; and performing parameter adjustment on the electric signal, the output signal, the load and / or the performance parameter based on the fault feature to obtain a corrected power module type device test parameter. According to the method and the device, the fault characteristics are identified and the typical failure mode of the board-level test system is analyzed aiming at various fault modes existing in the board-level test system, so that the fault types can be distinguished more effectively and quickly, and effective and accurate fault tolerance compensation is carried out.

Description

Technical Field

[0001] The present disclosure relates to the field of chip testing technology, and in particular to a board-level test method and system for power module devices. Background Art

[0002] This section is intended to provide a background or context to the embodiments of the disclosure that are recited in the claims. No description herein is admitted to be prior art by inclusion in this section.

[0003] Power module devices are key electronic components that are responsible for converting input power into the required voltage and current for use in various electronic devices and systems. As the functions of electronic devices become increasingly complex and customized, power modules must not only provide a stable power supply, but also meet requirements such as high efficiency, high reliability, and environmental adaptability. In board-level testing, the performance parameters of these devices, such as output voltage, current, efficiency, and stability under different load and environmental conditions, need to be measured and evaluated through precise signal acquisition and transmission modules.

[0004] However, in the related art, the signal acquisition and transmission module of the board-level test system realizes the connection between the control board and the test sub-board through a soft connection; this connection method is easily interfered in harsh environments, which may cause distortion of the output signal of the chip under test, and then cause errors in the test data recorded by the system, which cannot accurately reflect the true performance of power module devices. Summary of the invention

[0005] In view of this, the purpose of the present disclosure is to propose a board-level test method and system for power module devices, which at least solves one of the technical problems in the related art to a certain extent.

[0006] Based on the above purpose, the first aspect of the exemplary embodiment of the present disclosure provides a board-level test method for power module devices, which is applied to a server. The method includes:

[0007] Transmitting an electrical signal to a device under test of a power module type device to obtain an output signal of the device under test;

[0008] Providing a load to the device under test to obtain performance parameters of the device under test;

[0009] Performing fault detection on the electrical signal, the output signal, the load and / or the performance parameter to obtain fault characteristics of the electrical signal, the output signal, the load and / or the performance parameter;

[0010] Based on the fault characteristics, the electrical signal, the output signal, the load and / or the performance parameter are adjusted to obtain corrected power module device test parameters.

[0011] Based on the same inventive concept, the second aspect of the exemplary embodiment of the present disclosure provides a board-level test system for power module type devices, including: a DC power supply, an electrical signal transmission module, a test board, an electronic load and a device under test;

[0012] The electrical signal transmission module is connected to the device under test and is configured to transmit the electrical signal to the device under test;

[0013] The test board is connected to the electrical signal transmission module, and is configured to receive the electrical signal from the electrical signal transmission module, and process and analyze the electrical signal;

[0014] The electronic load is connected to the device under test and the DC power supply, and is configured to provide a load to the device under test;

[0015] The tested device is arranged on the testing board.

[0016] From the above, it can be seen that the embodiments of the present disclosure provide the following methods: transmitting an electrical signal to a device under test of a power module type device to obtain an output signal of the device under test; providing a load to the device under test to obtain performance parameters of the device under test; performing fault detection on the electrical signal, the output signal, the load and / or the performance parameter to obtain fault characteristics of the electrical signal, the output signal, the load and / or the performance parameter; and adjusting parameters of the electrical signal, the output signal, the load and / or the performance parameter based on the fault characteristics to obtain corrected test parameters of the power module type device. The present disclosure identifies the characteristics of the faults and analyzes their typical failure modes for various fault modes existing in board-level test systems, which can more effectively and quickly distinguish fault types and perform effective and accurate fault tolerance compensation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present disclosure or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A schematic diagram of a board-level test system structure for a board-level test method for power module devices provided by an exemplary embodiment of the present disclosure;

[0019] Figure 2 A schematic flow chart of a board-level test method for a power module device according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0020] It is understandable that before using the technical solutions disclosed in the embodiments of this application, the type, scope of use, usage scenarios, etc. of the personal information involved in this application should be informed to the user and the user's authorization should be obtained in an appropriate manner in accordance with relevant laws and regulations.

[0021] For example, in response to receiving an active request from a user, a prompt message is sent to the user to clearly prompt the user that the operation requested to be performed will require obtaining and using the user's personal information. Thus, the user can autonomously choose whether to provide personal information to software or hardware such as an electronic device, application, server, or storage medium that performs the operation of the technical solution of the present application according to the prompt message.

[0022] As an optional but non-limiting implementation, in response to receiving an active request from the user, the prompt information may be sent to the user in the form of a pop-up window, in which the prompt information may be presented in text form. In addition, the pop-up window may also carry a selection control for the user to choose "agree" or "disagree" to provide personal information to the electronic device.

[0023] It is understandable that the above notification and the process of obtaining user authorization are merely illustrative and do not constitute a limitation on the implementation method of the present application. Other methods that meet the relevant laws and regulations may also be applied to the implementation method of the present application.

[0024] It is understandable that the data involved in this technical solution (including but not limited to the data itself, the acquisition or use of the data) shall comply with the requirements of relevant laws, regulations and relevant provisions.

[0025] In order to make the purpose, technical solutions and advantages of the present disclosure more clear, the principles and spirit of the present disclosure will be described with reference to several exemplary embodiments. It should be understood that these embodiments are provided only to enable those skilled in the art to better understand and implement the present disclosure, and are not intended to limit the scope of the present disclosure in any way. On the contrary, these embodiments are provided to make the present disclosure more thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art.

[0026] It should be understood herein that any number of elements in the drawings is for illustration rather than limitation, and any naming is only for distinction rather than having any limiting meaning.

[0027] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the embodiments of the present disclosure do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connecting" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly. The article "one" or "a" before an element does not exclude the existence of multiple such elements.

[0028] The principle and spirit of the present disclosure are explained in detail below with reference to several representative embodiments of the present disclosure.

[0029] As described in the background technology, in the related art, the signal acquisition and transmission module of the board-level test system realizes the connection between the control board and the test sub-board through a soft connection method; this connection method is easily disturbed in harsh environments, which may cause distortion of the output signal of the chip under test, and then cause errors in the test data recorded by the system, and cannot accurately reflect the true performance of power module devices. Specifically, the complexity of current power module devices is getting higher and higher, and the functions of power module devices tend to be diversified and customized, and the test schemes corresponding to different functions are also diversified. The printed circuit board (PCB board) is combined with the power module device to build a simulated chip actual working environment, and the interface of the chip is led to monitor whether the chip application function test, parameter test, and environmental adaptability test work normally under various harsh environments. Therefore, the hardware and software platform construction is required to meet the full parameter test requirements of complex chips. The signal acquisition and transmission module of the board-level test system uses a soft connection to connect the control board and the test sub-board. Affected by various harsh environments, the chip output signal will be disturbed, resulting in deviations in the system detection value, and the correct test value cannot be obtained.

[0030] In current board-level test systems, signal acquisition and transmission modules usually use soft connections to achieve communication between the control board and the test sub-board. This soft connection usually refers to the use of flexible printed circuit boards (FPCs) or cables and other flexible connection media, which can provide a certain degree of flexibility and convenience, making the test system more convenient to assemble and maintain.

[0031] However, this soft connection method has certain limitations in harsh environments. Harsh environments may include conditions such as high temperature, high humidity, strong electromagnetic interference, vibration, dust, etc. In these environments, the physical and electrical properties of the soft connection may be affected. For example, the flexible circuit board or cable may soften at high temperatures, resulting in unstable connections; in high humidity environments, the connector may oxidize, increasing contact resistance; under strong electromagnetic interference, the signal line may become an antenna that receives interference, resulting in signal distortion.

[0032] When the signal is disturbed, the chip's output signal may be distorted. This distortion may be caused by electromagnetic induction, capacitive coupling or resistance change of the signal line. Signal distortion means that the amplitude, phase or waveform of the signal may change, which directly affects the integrity of the signal.

[0033] Due to signal distortion, errors may occur in the test data recorded by the system. These errors may appear as high or low readings, or unstable fluctuations in the signal. In this case, the test data cannot accurately reflect the true performance of the DUT in power module devices, which may lead to wrong judgments and decisions. For example, a DUT with good performance may be misjudged as unqualified due to test errors, or conversely, a defective DUT may be misjudged as qualified.

[0034] In order to solve the above problems, the present disclosure provides a board-level test method and system solution for power module devices, specifically including: transmitting an electrical signal to a device under test of a power module device to obtain an output signal of the device under test; providing a load to the device under test to obtain performance parameters of the device under test; performing fault detection on the electrical signal, the output signal, the load and / or the performance parameter to obtain fault characteristics of the electrical signal, the output signal, the load and / or the performance parameter; adjusting the electrical signal, the output signal, the load and / or the performance parameter based on the fault characteristics to obtain corrected test parameters of the power module device. The present disclosure ensures that in a diverse and severe environment, when the board-level test system performs application functional testing, parameter testing and environmental adaptability testing of the device under test in the power module device, the signal acquisition and transmission module can stably collect and transmit information, and at the same time has fault-tolerant compensation capabilities for specific faults, so that the board-level test system can accurately output test results.

[0035] After introducing the basic principles of the present disclosure, various non-limiting embodiments of the present disclosure are described in detail below.

[0036] refer to Figure 1 , which is a schematic diagram of the structure of a board-level test system for a board-level test method of a power module device provided by an exemplary embodiment of the present disclosure.

[0037] refer to Figure 1 The board-level test system for the power module type device includes: a DC power supply, an electrical signal transmission module, a test board, an electronic load and a device under test; the electrical signal transmission module is connected to the device under test and is configured to transmit the electrical signal to the device under test; the test board is connected to the electrical signal transmission module and is configured to receive the electrical signal from the electrical signal transmission module and process and analyze the electrical signal; the electronic load is connected to the device under test and the DC power supply and is configured to provide a load to the device under test; the device under test is arranged on the test board.

[0038] The electrical signal transmission module comprises: a signal generator and a coupler;

[0039] The signal generator is connected to the DC power supply and is configured to generate an electrical signal for the electrical signal transmission module; the coupler connects the signal generator and the DC power supply and is configured to receive the electrical signal from the signal generator and transmit it to the device under test.

[0040] The board-level test system for power module devices also includes: sensors;

[0041] The sensor is disposed on the test board and is configured to measure voltage, current and / or temperature on the test board.

[0042] The board-level test system for power module devices also includes: an oscilloscope;

[0043] The oscilloscope is connected to the device under test and is configured to display the current waveform and voltage waveform of the device under test.

[0044] The system of the above embodiment is used to implement the board-level test method of the corresponding power module type device in any of the above embodiments, and has the beneficial effects of the corresponding method embodiment, which will not be repeated here.

[0045] Based on the same inventive concept, corresponding to any of the above-mentioned embodiment systems, the present disclosure also provides a board-level test method for power module type devices.

[0046] refer to Figure 2 , a board-level test method for power module devices, applied to a server, the method comprising the following steps:

[0047] Step S210: transmitting an electrical signal to a device under test of a power module type device to obtain an output signal of the device under test.

[0048] In this exemplary embodiment, the step of transmitting an electrical signal to a device under test of a power module type device to obtain an output signal of the device under test includes:

[0049] The electrical signal of the signal generator is determined, and the electrical signal is transmitted to the device under test through a signal transmission device to obtain the output signal.

[0050] In a specific implementation, the electrical signal of the signal generator is determined, and the electrical signal is transmitted to the device under test through a signal transmission device to obtain the output signal:

[0051] As a specific example, refer to Figure 1 The board-level test system includes: a signal generator, a DC power supply, a coupler, a test board, an oscilloscope and an electronic load; wherein the test board is provided with a chip under test (device under test) and several sensors. In the board-level test system, the signal generator generates the electrical signals required for the test, which are used to simulate the input signals that the device under test may encounter under actual working conditions; the DC power supply provides a stable DC voltage or current for the signal generator and other test equipment; the coupler transmits the signal generated by the signal generator to the chip under test; the coupler can be a transformer, an optocoupler or other type of signal transmission device, which is used to transmit signals between different circuits; the chip under test is the main object of the test; it receives the signal from the coupler and performs corresponding processing according to its design. The output signal can be a stable or regulated voltage, a precisely controlled current, a converted signal type, or an electrical signal that conforms to the expected waveform. These are key parameters for evaluating the performance of the chip under test. By testing these output signals, it can be verified whether the chip under test can provide reliable and efficient power supply under various working conditions. The sensor is installed on the test board to monitor and record electrical parameters such as voltage, current, temperature, etc. during the test process. The test board is connected to the chip under test, provides necessary circuit support, and connects the electronic load. The test board contains circuit elements such as capacitors, resistors, etc. to simulate the actual working environment. The oscilloscope is connected to the output end of the chip under test to monitor and record the waveform of the output signal in order to analyze its performance.

[0052] Step S220: Provide a load to the device under test to obtain performance parameters of the device under test.

[0053] In this exemplary embodiment, the load includes: a constant current load, a constant voltage load, a constant resistance load and / or a constant power load.

[0054] In a specific implementation, the load includes: a constant current load, a constant voltage load, a constant resistance load and / or a constant power load, which means:

[0055] Following the above exemplary embodiments, refer to Figure 1 The electronic load simulates the load under the actual working conditions of the chip under test and is used to test the performance of the chip under different loads. The load refers to the different types of load conditions applied when testing the chip under test in order to simulate the actual working conditions and evaluate its performance. These load types include:

[0056] Constant Current Load (CC): In this mode, the electronic load draws a constant current regardless of how the voltage of the chip under test changes. This load is used to test the performance of the chip under test when providing a constant current output.

[0057] Constant voltage load (CV): The electronic load simulates a constant voltage load to ensure that the chip under test works at this voltage. This load is used to test the performance of the chip under test when maintaining a constant output voltage.

[0058] Constant resistance load (CR): The electronic load simulates a constant resistance load, which means that the chip under test will provide a corresponding current based on its output voltage and the load resistance value. This load is used to test the response of the chip under test when faced with changing current demands.

[0059] Constant Power Load (CP): In this mode, the electronic load draws constant power, which may involve variations in current and voltage to keep the power constant. This load is used to test the performance of the chip under test when providing a constant power output.

[0060] These load types allow test engineers to evaluate the stability, efficiency, response time, and overall performance of the chip under test under different operating conditions. By simulating these load conditions, it can be ensured that the chip under test can work reliably in a variety of application scenarios.

[0061] In the above exemplary embodiment, the load is introduced. Now, the method of obtaining the performance parameters of the device under test is introduced:

[0062] In this exemplary embodiment, providing a load to the device under test to obtain the performance parameter of the device under test includes:

[0063] The constant current load, the constant voltage load, the constant resistance load and / or the constant power load are provided to the device under test to obtain the performance parameters of the device under test.

[0064] In a specific implementation, the constant current load, the constant voltage load, the constant resistance load and / or the constant power load are provided to the device under test to obtain the performance parameter of the device under test:

[0065] Following the above exemplary embodiments, refer to Figure 1In order to fully evaluate the performance of the chip under test, different types of load conditions are applied to the chip under test through electronic loads, including constant current load, constant voltage load, constant resistance load, and constant power load. These loads simulate various working scenarios that the chip under test may encounter in actual applications. By testing the response of the chip under test under these different load conditions, its performance parameters such as output voltage stability, current accuracy, efficiency, thermal performance, and response speed under dynamic load changes can be obtained through sensors, electronic loads, and oscilloscopes. In this way, it can be ensured that the power module can provide stable and reliable power output under various working conditions.

[0066] Step S230: perform fault detection on the electrical signal, the output signal, the load and / or the performance parameter to obtain fault characteristics of the electrical signal, the output signal, the load and / or the performance parameter.

[0067] In this exemplary embodiment, the fault characteristics include: test signal acquisition and transmission noise interference and / or signal acquisition and transmission jamming.

[0068] In specific implementation, the test signal acquisition and transmission noise interference and / or signal acquisition and transmission jam refers to:

[0069] Following the above exemplary embodiments, refer to Figure 1 Signal acquisition transmission noise interference refers to the degradation of signal quality, additional noise or distortion caused by external factors or internal system factors during the signal transmission from the signal generator to the chip under test. The causes may include electromagnetic interference (EMI), radio frequency interference (RFI), power supply noise, poor grounding, cable or connector problems, and environmental noise (such as lightning, power line noise, etc.).

[0070] Signal acquisition and transmission stuck means that the signal acquisition and transmission module suddenly stops responding during operation, and the output signal becomes a constant value, which cannot correctly reflect the changes of the input signal. The causes may include hardware failure (such as chip damage, circuit board failure), software problems (such as firmware errors, control logic failure), overheating, unstable power supply or external environmental conditions (such as extreme temperature, humidity) leading to performance degradation.

[0071] In the above exemplary embodiments, fault characteristics are introduced. The following describes a method for obtaining the fault characteristics of the electrical signal, the output signal, the load and / or the performance parameter:

[0072] In this exemplary embodiment, the performing fault detection on the electrical signal, the output signal, the load and / or the performance parameter to obtain the fault characteristics of the electrical signal, the output signal, the load and / or the performance parameter includes:

[0073] Determine the first real acquisition and transmission value of the electrical signal, the output signal, the load and / or the performance parameter at the first moment, add the first noise of the power module-type device performing signal acquisition and transmission to the first real acquisition and transmission value, and obtain the first measurement value of the electrical signal, the output signal, the load and / or the performance parameter; based on the analysis of the first measurement value, determine that the experimental test is the signal acquisition and transmission noise interference and / or the signal acquisition and transmission is stuck.

[0074] In a specific implementation, the first real acquisition and transmission value of the electrical signal, the output signal, the load and / or the performance parameter at the first moment is determined, and the first noise of the power module type device for signal acquisition and transmission is added to the first real acquisition and transmission value to obtain the first measurement value of the electrical signal, the output signal, the load and / or the performance parameter:

[0075] Following the above exemplary embodiments, refer to Figure 1 The real value of the signal acquisition and transmission of the current board-level test system, i.e., y, is obtained through the signal acquisition and transmission module composed of power module devices such as signal generator, coupler, oscilloscope, sensor, and electronic load. real1 ; Then the measured value of the signal acquisition transmission of the current board-level test system can be obtained by the following formula:

[0076] y m1 =y real +N1(0,σ1);

[0077] Among them, y m1 is the measured value of the current signal acquisition and transmission module, y real is the true value of the current signal acquisition and transmission module; N1(0, σ1) is the transmission noise of the current board-level test system.

[0078] In the above exemplary embodiments, it is introduced that the first real acquisition and transmission value of the electrical signal, the output signal, the load and / or the performance parameter at the first moment is determined, and the first noise of the power module type device for signal acquisition and transmission is added to the first real acquisition and transmission value to obtain the first measurement value of the electrical signal, the output signal, the load and / or the performance parameter; based on the analysis of the first measurement value, it is judged that the experimental test is the signal acquisition and transmission noise interference and / or the signal acquisition and transmission is stuck. The following further introduces the method of judging the experimental test signal acquisition and transmission noise interference and / or the signal acquisition and transmission is stuck based on the analysis of the first measurement value:

[0079] In this exemplary embodiment, the determining, based on analyzing the first measurement value, that the test signal acquisition and transmission noise is interfering and / or the signal acquisition and transmission is stuck, includes:

[0080] Determine the second noise of the power module type device for signal acquisition and transmission, add the first real acquisition and transmission value to the second noise, and obtain the second measurement value of the electrical signal, the output signal, the load and / or the performance parameter; determine the difference between the first measurement value and the second measurement value, judge the difference with a preset deviation threshold, and in response to the difference being greater than the preset deviation threshold, the experimental test is the signal acquisition and transmission noise interference; analyze the first measurement value, and in response to the first measurement value being a constant constant, the experimental test is the signal acquisition and transmission stuck.

[0081] In a specific implementation, a second noise of the power module type device for signal acquisition and transmission is determined, and the first real acquisition and transmission value is added to the second noise to obtain a second measurement value of the electrical signal, the output signal, the load and / or the performance parameter; a difference between the first measurement value and the second measurement value is determined, and the difference is judged with a preset deviation threshold. In response to the difference being greater than the preset deviation threshold, the test test is a mode of signal acquisition and transmission noise interference:

[0082] Following the above exemplary embodiments, refer to Figure 1 , under ideal conditions without external interference, the device is subjected to multiple signal acquisition and transmission, and then the obtained data is statistically analyzed to extract the noise components of consistency and repeatability, so as to determine the inherent noise level of the power module under normal working conditions, that is, the normal noise of the power module type device for signal acquisition and transmission. The measured value of the signal acquisition and transmission module when it is working normally can be obtained by the following formula:

[0083] y m =y real +N(0,σ0);

[0084] Among them, N(0,σ0) is normal noise.

[0085] Assume y real is 10V (true voltage value); the standard deviation σ0 of normal noise N(0,σ0) is 0.1V, which means that the measured value y m1 Usually fluctuates between 9.9V and 10.1V.

[0086] If at a certain moment, the measured value y m1Suddenly it changes to 10.5V or 9.5V, which is far beyond the normal noise range (9.9V to 10.1V); in this case, it can be inferred that the deviation of the measured value may be caused by noise interference rather than normal random fluctuations.

[0087] In a specific implementation, the first measurement value is analyzed, and in response to the first measurement value being a constant, the test is a method in which the signal acquisition and transmission is stuck:

[0088] Following the above exemplary embodiment, when the measured value y of the signal acquisition transmission of the current board-level test system m1 is a constant, then in this case, it can be inferred that the constant value is caused by the jam of the signal acquisition and transmission module, where y m1 =C m1 , C m1 is a constant.

[0089] Step S240: adjusting the electrical signal, the output signal, the load and / or the performance parameter based on the fault characteristics to obtain corrected power module device test parameters.

[0090] In this exemplary embodiment, the step of adjusting the electrical signal, the output signal, the load and / or the performance parameter based on the fault characteristics to obtain a corrected power module device test parameter includes:

[0091] The first measurement value is predicted based on the adaptive Kalman algorithm to obtain a first prediction value; the second real acquisition and transmission value of the electrical signal, the output signal, the load and / or the performance parameter at the second moment is determined, and the second real acquisition and transmission value is added with the second noise of the power module type device for signal acquisition and transmission to obtain the second measurement value of the electrical signal, the output signal, the load and / or the performance parameter; the second measurement value is predicted based on the adaptive Kalman algorithm to obtain a second prediction value; the prediction difference between the first prediction value and the second prediction value is determined, and adaptive noise adjustment is performed based on the prediction difference to obtain time-varying measurement noise; the time-varying measurement noise is added with the first real acquisition and transmission value to obtain the corrected power module type device test parameters.

[0092] In a specific implementation, the first measured value is predicted based on the adaptive Kalman algorithm to obtain the first predicted value:

[0093] Following the above exemplary embodiments, refer to Figure 1According to the fault type of the signal acquisition and transmission module, the output value of the signal acquisition and transmission module is subjected to fault-tolerant compensation processing. The adaptive Kalman predictor is used to collect the transmission value observation data x(t) (i.e., y) through the board-level test system using the current system state equation. m1 , the optimal prediction of the board-level test system x(t) value is obtained to obtain the first predicted value x′(t). Among them, the adaptive Kalman filter is an algorithm based on the Kalman filter theory. It adds adaptive capabilities on the basis of the standard Kalman filter and can dynamically adjust its parameters to adapt to changes in the system model and the uncertainty of noise characteristics. This algorithm is well known in the field of control theory and signal processing, especially in applications that require real-time processing and accurate estimation of system states.

[0094] In a specific implementation, the second real acquisition and transmission value of the electrical signal, the output signal, the load and / or the performance parameter at the second moment is determined, and the second real acquisition and transmission value is added with the second noise of the power module type device for signal acquisition and transmission to obtain the second measurement value of the electrical signal, the output signal, the load and / or the performance parameter:

[0095] Following the above exemplary embodiments, refer to Figure 1 The real value of the signal acquisition and transmission of the board-level test system at the previous moment, i.e., y, is obtained through the signal acquisition and transmission module composed of power module devices such as signal generator, coupler, oscilloscope, sensor, and electronic load. real0 ; Then the measured value of the signal acquisition transmission of the board-level test system at the previous moment can be obtained by the following formula:

[0096] y m0 =y real0 +N0(0,σ -1 );

[0097] Among them, y m0 is the measurement value x(t) of the signal acquisition and transmission module at the previous moment, y real0 is the real value of the signal acquisition and transmission module at the previous moment; N0(0, σ -1 ) is the transmission noise of the board-level test system at the previous moment.

[0098] In a specific implementation, the second measured value is predicted based on the adaptive Kalman algorithm to obtain the second predicted value:

[0099] Following the above exemplary embodiment, an adaptive Kalman predictor is used to use the system state equation at the previous moment, and the transmission value observation data x(t-1) collected by the board-level test system at the previous moment, that is, y m0, the optimal prediction of the x(t-1) value of the board-level test system is obtained to obtain the second predicted value x′(t-1).

[0100] In a specific implementation, a prediction difference between the first prediction value and the second prediction value is determined, and adaptive noise adjustment is performed based on the prediction difference to obtain a time-varying measurement noise:

[0101] Adaptive Kalman algorithm is used to automatically adjust parameters according to the noise level of the measurement. The model input of the adaptive Kalman algorithm is and the output value of the predictor is The difference between two adjacent prediction values, this difference It is used to quantify the changes in system state and is part of the Kalman filter prediction step. The observation input is the input value of the signal acquisition and transmission module, where the observation input refers to the input value actually received by the signal acquisition and transmission module to evaluate the accuracy of the prediction.

[0102] Adaptive noise adjustment is performed based on the predicted difference to obtain a time-varying measurement noise R(t), wherein the time-varying measurement noise R(t) can be obtained by the following formula:

[0103]

[0104] Among them, Std stands for standard deviation, which is a statistic used to measure the degree of dispersion of a set of values. Here, it is used to quantify the fluctuation of measurement error within the time period T; represents the interval from time tT to time t, which is the time period for calculating the standard deviation; δ1(t) represents the actual measured value at time t, which is the data directly obtained from the signal acquisition and transmission module; δ2(t) represents the estimated value at time t; this is the current value predicted by the Kalman predictor based on the model and the information of the previous moment; T represents the time period for calculating the standard deviation, which determines the time range of the historical data considered when calculating R(t); k is an adjustable proportional coefficient used to scale the estimate of the measurement noise. This coefficient can be adjusted according to the specific needs of the system to improve the accuracy of the noise estimate.

[0105] In a specific implementation, the time-varying measurement noise is added to the first real acquisition transmission value to obtain the method of correcting the test parameters of the power module type device:

[0106] Following the above exemplary embodiment, first, the adaptive Kalman algorithm is used to analyze this deviation; the algorithm calculates the current measurement noise R(t), i.e., σ1, and compares it with the expected normal noise σ0. If R(t), i.e., σ1, is significantly greater than σ0, this further confirms the presence of noise interference. Next, the adaptive Kalman algorithm adjusts its parameters to try to reduce the impact of noise on the measurement value, thereby providing a value closer to the true value yreal Estimates.

[0107] The system state is continuously monitored through the adaptive Kalman predictor. If the difference between the predicted value x′(t) and the actual observed value δ1(t) suddenly increases or the predicted value no longer changes (i.e., x′(t)-x′(t-1) is close to zero), this may indicate that the system is "stuck".

[0108] The adaptive Kalman algorithm can automatically adjust parameters according to the noise level measured in real time. If it detects that the system may be "stuck", the algorithm can adjust the proportional coefficient k to make the noise estimate R(t) more sensitive, thereby identifying and responding to abnormal situations more quickly.

[0109] It should be noted that the method of the embodiment of the present disclosure can be performed by a single device, such as a computer or a server. The method of the present embodiment can also be applied in a distributed scenario and completed by multiple devices cooperating with each other. In the case of such a distributed scenario, one of the multiple devices can only perform one or more steps in the method of the embodiment of the present disclosure, and the multiple devices will interact with each other to complete the described method.

[0110] It should be noted that the above describes some embodiments of the present disclosure. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0111] For the convenience of description, the above device is described by dividing it into various modules according to its functions. Of course, when implementing the present disclosure, the functions of each module can be implemented in the same or multiple software and / or hardware.

[0112] In addition, although the operations of the disclosed method are described in a particular order in the accompanying drawings, this does not require or imply that the operations must be performed in this particular order, or that all the operations shown must be performed to achieve the desired results. On the contrary, the steps depicted in the flow chart can be performed in a different order. Additionally or alternatively, some steps can be omitted, multiple steps can be combined into one step, and / or one step can be decomposed into multiple steps.

[0113] The flowchart and block diagram in the accompanying drawings illustrate the possible architecture, functions and operations of the system, method and computer program product according to various embodiments of the present application. Wherein, each box in the flowchart or block diagram can represent a module, a program segment, or a part of the code, and the above-mentioned module, program segment, or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram or flowchart, and the combination of boxes in the block diagram or flowchart can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0114] It should be noted that, although several modules or units of the equipment for action execution are mentioned in the above detailed description, this division is not mandatory. In fact, according to the embodiments of the present application, the features and functions of two or more modules or units described above can be embodied in one module or unit. On the contrary, the features and functions of one module or unit described above can be further divided into being embodied by multiple modules or units.

[0115] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application (including the claims) is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0116] In addition, to simplify the description and discussion, and in order not to make the embodiments of the present application difficult to understand, the known power supply / ground connection with the integrated circuit (IC) chip and other components may or may not be shown in the provided drawings. In addition, the device can be shown in the form of a block diagram to avoid making the embodiments of the present application difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform to be implemented in the embodiments of the present application (that is, these details should be fully within the scope of understanding of those skilled in the art). In the case of elaborating specific details (e.g., circuits) to describe exemplary embodiments of the present application, it is obvious to those skilled in the art that the embodiments of the present application can be implemented without these specific details or when these specific details are changed. Therefore, these descriptions should be considered to be illustrative rather than restrictive.

[0117] Although the present application has been described in conjunction with specific embodiments of the present application, many replacements, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.

[0118] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of the present application.

[0119] Although the spirit and principle of the present disclosure have been described with reference to several specific embodiments, it should be understood that the present disclosure is not limited to the disclosed specific embodiments, and the division of various aspects does not mean that the features in these aspects cannot be combined to benefit, and such division is only for the convenience of expression. The present disclosure is intended to cover various modifications and equivalent arrangements included in the spirit and scope of the attached claims. The scope of the attached claims conforms to the broadest interpretation, thereby including all such modifications and equivalent structures and functions.

Claims

1. A board-level test method for power module devices, characterized in that: include: Transmitting an electrical signal to a device under test of a power module type device to obtain an output signal of the device under test; Providing a load to the device under test to obtain performance parameters of the device under test; Performing fault detection on the electrical signal, the output signal, the load and / or the performance parameter to obtain fault characteristics of the electrical signal, the output signal, the load and / or the performance parameter; Based on the fault characteristics, the electrical signal, the output signal, the load and / or the performance parameter are adjusted to obtain corrected power module device test parameters.

2. The method according to claim 1, characterized in that The step of transmitting an electrical signal to a device under test of a power module type device to obtain an output signal of the device under test includes: The electrical signal of the signal generator is determined, and the electrical signal is transmitted to the device under test through a signal transmission device to obtain the output signal.

3. The method according to claim 1, characterized in that The load includes: a constant current load, a constant voltage load, a constant resistance load and / or a constant power load; Providing a load to the device under test to obtain performance parameters of the device under test includes: The constant current load, the constant voltage load, the constant resistance load and / or the constant power load are provided to the device under test to obtain the performance parameters of the device under test.

4. The method according to claim 1, characterized in that: The fault characteristics include: experimental test signal acquisition and transmission noise interference and / or signal acquisition and transmission jam; The performing fault detection on the electrical signal, the output signal, the load and / or the performance parameter to obtain fault characteristics of the electrical signal, the output signal, the load and / or the performance parameter includes: Determine the first real acquisition and transmission value of the electrical signal, the output signal, the load and / or the performance parameter at the first moment, add the first noise of the power module type device performing signal acquisition and transmission to the first real acquisition and transmission value, and obtain the first measurement value of the electrical signal, the output signal, the load and / or the performance parameter; Based on the analysis of the first measurement value, it is determined that the test result is noise interference of the signal acquisition and transmission and / or a jam of the signal acquisition and transmission.

5. The method according to claim 4, characterized in that The determining, based on analyzing the first measurement value, that the test signal acquisition and transmission noise is interfering and / or the signal acquisition and transmission is stuck, includes: Determine a second noise of the power module type device for signal acquisition and transmission, add the first real acquisition and transmission value to the second noise, and obtain a second measurement value of the electrical signal, the output signal, the load and / or the performance parameter; determine the difference between the first measurement value and the second measurement value, and judge the difference with a preset deviation threshold value. In response to the difference being greater than the preset deviation threshold value, the test test is the signal acquisition and transmission noise interference; The first measurement value is analyzed, and in response to the first measurement value being a constant, the experimental test is that the signal acquisition transmission is stuck.

6. The method according to claim 5, characterized in that The step of adjusting the electrical signal, the output signal, the load and / or the performance parameter based on the fault characteristics to obtain a corrected power module device test parameter includes: Predicting the first measurement value based on an adaptive Kalman algorithm to obtain a first predicted value; Determine a second real acquisition and transmission value of the electrical signal, the output signal, the load and / or the performance parameter at a second moment, add a second noise of the power module-type device performing signal acquisition and transmission to the second real acquisition and transmission value, and obtain a second measurement value of the electrical signal, the output signal, the load and / or the performance parameter; Predicting the second measured value based on the adaptive Kalman algorithm to obtain a second predicted value; Determine a prediction difference between the first prediction value and the second prediction value, and perform adaptive noise adjustment based on the prediction difference to obtain time-varying measurement noise; The time-varying measurement noise is added to the first real acquisition transmission value to obtain the corrected power module type device test parameter.

7. A board-level test system for power module devices, characterized in that: The system is used to implement the board-level test method for power module devices according to any one of claims 1 to 6, and the system comprises: a DC power supply, an electrical signal transmission module, a test board, an electronic load and a device under test; The electrical signal transmission module is connected to the device under test and is configured to transmit the electrical signal to the device under test; The test board is connected to the electrical signal transmission module, and is configured to receive the electrical signal from the electrical signal transmission module, and process and analyze the electrical signal; The electronic load is connected to the device under test and the DC power supply, and is configured to provide a load to the device under test; The tested device is arranged on the testing board.

8. The system according to claim 7, characterized in that The electrical signal transmission module comprises: a signal generator and a coupler; The signal generator is connected to the DC power supply and is configured to generate an electrical signal for the electrical signal transmission module; The coupler is connected to the signal generator and the DC power supply, and is configured to receive the electrical signal from the signal generator and transmit the electrical signal to the device under test.

9. The system according to claim 7, characterized in that The system further comprises: a sensor; The sensor is disposed on the test board and is configured to measure voltage, current and / or temperature on the test board.

10. The system according to claim 7, characterized in that The system also includes: an oscilloscope; The oscilloscope is connected to the device under test and is configured to display the current waveform and voltage waveform of the device under test.

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