Manufacturing method and system of strip packaging chip

Abstract

The invention discloses a manufacturing method of a strip packaging chip. The manufacturing method comprises the following steps: coating DAF glue on the bottom of the chip; suspending the strip between the chip and the heating module, and heating by the heating module; and the chip is pressed down, meanwhile, the heating module ascends, and the chip is pasted to the strip through the DAF glue. The DAF glue is adopted, the thickness consistency is good, the DAF glue is flat, small and free of overflow, 15 N destructive tests can be passed through three rounds of experiments, the reliability of the product is improved, and the service life of the product is prolonged. In addition, the invention also discloses a strip packaging chip system.

Description

Technical Field

[0001] The present invention relates to the field of packaging technology, and in particular to a method and system for manufacturing a strip-packaged chip. Background Art

[0002] With the continuous development of integrated circuit technology, the application of smart cards has become more abundant and extensive. Before smart cards are produced as finished products, smart card chip suppliers generally provide chips packaged in strips to smart card manufacturers and developers. Strip packaged chips are an important part of the production of smart cards.

[0003] The conventional method for making strip-packaged chips is to first apply non-conductive glue on the strip, then stick the chip on the strip, and then bake and cure it in a tunnel furnace. However, traditional non-conductive glue has at least the following four disadvantages: (1) Since non-conductive glue is liquid, it takes a long time to bake when curing, which consumes a lot of energy and has a long production process. (2) For relatively thin chips, the overflow height of non-conductive glue is difficult to control, and there is a risk of overflowing onto the chip surface. (3) The thickness control capability of non-conductive glue is 5-30um, and there will be a height difference around the chip, which makes the chip easy to tilt. (4) The service life of non-conductive glue is short, generally not more than 24 hours, which is a serious waste and has a large impact on the environment. Summary of the invention

[0004] The object of the present invention is to provide a new method and system for manufacturing a strip-packaged chip.

[0005] To achieve the above-mentioned purpose, the present invention adopts the following technical solution: a method for manufacturing a strip package chip, comprising:

[0006] The bottom of the chip is covered with DAF glue, wherein the DAF glue is a modified epoxy glue with elasticity;

[0007] The strip is suspended between the chip and the heating module, and the heating module is heated;

[0008] The chip is pressed down, while the heating module rises, and the chip is attached to the strip by DAF glue.

[0009] As a further improved technical solution of the present invention, it also includes: the heating module descends and resets, and the gear mechanism drives the strip to move.

[0010] As a further improved technical solution of the present invention, the DAF glue includes a UV glue layer for bonding the chip and an epoxy resin layer for bonding the strip.

[0011] As a further improved technical solution of the present invention, the thickness of the DAF glue is 10 μm, 20 μm or 25 μm.

[0012] As a further improved technical solution of the present invention, the strip adopts a fiber cloth substrate, the thickness of the substrate ranges from 0.2mm to 0.3mm, and the heating module heats the temperature of the substrate to more than 150 degrees.

[0013] As a further improved technical solution of the present invention, the strip is a soft strip, the soft strip is positioned by a metal clamp, and the surface of the metal clamp is provided with a nano anti-scratch coating.

[0014] As a further improved technical solution of the present invention, the gear mechanism is a multi-gear linkage mechanism.

[0015] As a further improved technical solution of the present invention, the heating module includes an automatic lifting mechanism.

[0016] As a further improved technical solution of the present invention, the DAF glue is a modified epoxy glue with elasticity.

[0017] As a further improved technical solution of the present invention, the material mass percentages of the DAF glue are as follows: resin matrix 35%-65%, filler 10%-30%, additive 2-10%, low dielectric constant material 4%-10%, thermal interface material 4-10%.

[0018] As a further improved technical solution of the present invention, the resin matrix includes 20%-40% UV resin and 15%-25% epoxy resin; the hardener includes 1%-6% UV initiator and 1%-4% epoxy curing agent; the filler is an inorganic filler; the low dielectric constant material is nanoparticles; and the thermal interface material is a rubber elastomer.

[0019] As a further improved technical solution of the present invention, the elastic modulus of the DAF glue at room temperature ranges from 700 to 1500 MPa, and the elastic modulus of the DAF glue at a heating temperature ≥ 120 degrees ranges from 5 to 100 MPa.

[0020] As a further improved technical solution of the present invention, the material yield strength of the DAF glue is in the range of 8MPa-18MPa, and the material Poisson's ratio of the DAF glue is less than or equal to 0.35.

[0021] In addition, the present invention also provides a strip packaging chip system, which includes:

[0022] A strip module, comprising a strip, a metal clamp for clamping the strip, and a multi-gear linkage mechanism for driving the strip to move;

[0023] A chip module, the gap of which is arranged on the upper side of the strip, the chip module comprising a chip with DAF glue, and a patch mechanism for mounting and pressing down the chip;

[0024] The heating module has a gap arranged at the lower side of the strip, and the heating module comprises a heating mechanism and a lifting mechanism for driving the heating mechanism to rise and fall.

[0025] The beneficial effects of the present invention are: the manufacturing method of the strip packaged chip of the present invention adopts DAF glue, which has good thickness consistency and is flat, small, and has no overflow. Three rounds of experiments can pass the 15 Newton destructive test, thereby increasing the reliability of the product and prolonging its service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic flow chart of a method for manufacturing a strip package chip of the present invention;

[0027] Figure 2 It is a schematic diagram of the strip packaging chip system of the present invention. DETAILED DESCRIPTION

[0028] The present invention will be described in detail below in conjunction with the various embodiments shown in the accompanying drawings. Please refer to the drawings for preferred embodiments of the present invention. However, it should be noted that these embodiments are not limitations of the present invention, and equivalent changes or substitutions in functions, methods, or structures made by ordinary technicians in the field according to these embodiments are all within the protection scope of the present invention.

[0029] Please refer to Figure 1 The present invention discloses a method for manufacturing a strip package chip, which comprises the following steps:

[0030] Step 101, covering the bottom of the chip with DAF glue, where DAF glue is a modified epoxy glue with elasticity;

[0031] Step 102, suspending the strip between the chip and the heating module, and heating the heating module;

[0032] Step 103, the chip is pressed down, and the heating module is raised at the same time, and the chip is adhered to the strip by DAF glue;

[0033] The step also includes step 104, the heating module is lowered and reset, and the gear mechanism drives the strip to move.

[0034] Specifically, the thickness of DAF glue can be selected as 10μm, 20μm or 25μm. The elastic modulus of DAF glue at room temperature ranges from 700-1500MPa, and the elastic modulus of DAF glue when heated at a temperature ≥120 degrees ranges from 5-100MPa. The material yield strength of DAF glue ranges from 8MPa to 18MPa, and the material Poisson's ratio of DAF glue is less than or equal to 0.35. Thermoplastic DAF glue is used to replace conventional liquid non-conductive glue. Because the thickness of DAF glue is optional, the thickness consistency is better than that of non-conductive glue (the thickness of non-conductive glue ranges from 5-30um), and DAF glue has the advantages of being flat, small, and without overflow. For example, one of the important indicators of reliability testing in the SIM industry is the three-round test (that is, applying a certain force to the product to see if the product structure will be damaged). The current industry standards are 8 Newtons and 10 Newtons. Products that use DAF glue have a uniform thickness of DAF glue on the bottom of the chip, and there is almost no height difference around the chip. The chip is very flat and has elastic buffering. The three-round test can pass the 15 Newton destructive test, thereby increasing the reliability of the product and extending its service life.

[0035] Preferably, the DAF glue includes a UV glue layer for bonding the chip and an epoxy resin layer for bonding the strip. The UV glue layer is bonded to the chip by light curing, and the epoxy resin layer is bonded to the strip by heat curing, so that the DAF glue can effectively bond the chip and the strip in a targeted manner. The material mass percentages of the DAF glue are as follows: resin matrix 35%-65%, filler 10%-30%, additive 2-10%, low dielectric constant material 4%-10%, thermal interface material 4-10%. For example: the material mass percentages of the DAF glue are as follows: resin matrix 60%, filler 20%, additive 10%, low dielectric constant material 5%, thermal interface material 5%.

[0036] Furthermore, the resin matrix includes 20%-40% UV resin and 15%-25% epoxy resin. The hardener includes 1%-6% UV initiator and 1%-4% epoxy curing agent. The filler is an inorganic filler. The low dielectric constant material is nanoparticles. The thermal interface material is a rubber elastomer. DAF glue combines two curing properties of UV resin and epoxy resin, and rubber elastomer and nanoparticles are added to the epoxy resin, so that it has a certain elasticity after curing, becoming a modified epoxy glue with elasticity, which can make the chip flat and have elastic buffering. Three rounds of experiments can pass the 15 Newton destructive test, which increases the reliability of the product and increases its service life.

[0037] Specifically, the strip is a soft strip, which is positioned by a metal clamp. The surface of the metal clamp is provided with a nano-anti-scratch coating, which effectively solves the problem of the clamp positioning accuracy and the problem of the clamp temperature resistance.

[0038] Specifically, the strip uses a fiber cloth substrate with a thickness ranging from 0.2mm to 0.3mm. At room temperature, the edge positioning holes of the strip are easily damaged when driven by gears, thus affecting the positioning accuracy of the product. After heating, the embrittlement of the substrate will be accelerated, increasing the risk of damage; therefore, the conventional single-gear mechanism is changed to a multi-gear linkage mechanism, thereby reducing the torque of a single gear and reducing the risk of damage to the edge positioning holes.

[0039] Specifically, the heating device heats the temperature of the substrate to more than 150 degrees. When DAF glue is applied to the patch, the temperature of the substrate needs to be more than 150 degrees, which is consistent with the heat resistance limit of the substrate. According to the traditional patch area heating module, the substrate is directly in contact with the substrate. During the gear-driven process, the substrate softens after being heated, and scratches on the substrate will occur when it contacts the heating module. Therefore, in the present invention, the substrate of the strip is suspended and non-contacted; at the same time, the heating module includes an automatic lifting mechanism. When the chip is placed, the heating module rises and contacts the substrate. When the patch finishes moving, the heating module automatically descends; in this way, when driven by the gears, scratches will not be caused and the flatness of the patch can be guaranteed.

[0040] Please refer to Figure 2 The present invention also discloses a strip packaging chip system, which comprises:

[0041] The strip module 1 comprises a strip 11, a metal clamp (not shown) for clamping the strip, and a multi-gear linkage mechanism (not shown) for driving the strip to move;

[0042] The chip module 2 has a gap disposed on the upper side of the strip 11, and the chip module 2 includes a chip 22 with a DAF adhesive 21, and a patch mechanism (not shown) mounted and used to press down the chip 22;

[0043] The heating module 3 has a gap disposed at the lower side of the strip 11 . The heating module 3 includes a heating mechanism 31 and a lifting mechanism (not shown) for driving the heating mechanism 31 to rise and fall.

[0044] The thickness of DAF glue can be selected as 10μm, 20μm or 25μm, with good thickness consistency, and DAF glue has the advantages of being flat, small, and overflow-free. Strip 11 is a soft strip, and a nano-anti-scratch coating is added to the surface of the metal clamp, which not only solves the problem of clamp positioning accuracy, but also solves the problem of clamp temperature resistance. Strip 11 adopts a multi-gear linkage mechanism to reduce the torque of a single gear and reduce the risk of damage to the edge positioning holes of strip 11. Strip 11 is suspended between the heating module 3 and the chip module 2 to prevent the strip 11 from being scratched, and the heating module 3 is provided with a lifting mechanism. After heating is completed, when the chip is mounted, the lifting mechanism drives the heating mechanism 31 to rise, and the mounting mechanism presses down the chip; after the mounting is completed, the lifting mechanism drives the heating mechanism 31 to automatically descend.

[0045] The method and system for manufacturing a strip-packaged chip of the present invention uses DAF glue to attach the chip to the strip, which has the following advantages:

[0046] (1) After the chip is bonded to the strip, it forms a chip module. Taking the SIM card module as an example, the most important technical indicator is the three-round pressure resistance test. The upper limit of the traditional process is 12N. After using DAF glue, its lower limit is increased to 15N.

[0047] (2) DAF glue has good thickness consistency, and DAF glue has the advantages of being flat, small, and without overflow. There will be no height difference around the chip, and the chip will not tilt.

[0048] (3) The process of baking and curing in a tunnel furnace after patching has been eliminated, saving energy and speeding up the production process. The energy consumption of patching has been reduced by 80% and the efficiency has been improved by 20%.

[0049] (4) As long as the chip with DAF is properly stored, its service life exceeds 6 months, and its performance is stable, its environmental requirements are low, and it has zero pollution and zero emissions.

[0050] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0051] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. A method for manufacturing a strip package chip, characterized in that: It includes: Cover the bottom of the chip with DAF glue, where the DAF glue is an elastic epoxy glue; The strip is suspended between the chip and the heating module, and the heating module is heated; The chip is pressed down, while the heating module rises, and the chip is attached to the strip by DAF glue.

2. The method for manufacturing a strip package chip according to claim 1, characterized in that: Also includes: The heating module descends and resets, and the gear mechanism drives the strip to move.

3. The method for manufacturing a strip package chip according to claim 1, characterized in that: The DAF glue comprises a UV glue layer for bonding the chip and an epoxy resin layer for bonding the strip.

4. The method for manufacturing a strip package chip according to claim 1, characterized in that: The strip adopts a fiber cloth substrate, the thickness of the substrate ranges from 0.2 mm to 0.3 mm, and the heating module heats the temperature of the substrate to more than 150 degrees.

5. The method for manufacturing a strip package chip according to claim 1, characterized in that: The strip is a soft strip, and the soft strip is positioned by a metal clamping claw, and the surface of the metal clamping claw is provided with a nano anti-scratch coating.

6. The method for manufacturing a strip package chip according to claim 1, characterized in that: The gear mechanism is a multi-gear linkage mechanism, and the heating module includes an automatic lifting mechanism.

7. The method for manufacturing a strip package chip according to claim 1, characterized in that: The material mass percentages of the DAF glue are as follows: 35%-65% of resin matrix, 10%-30% of filler, 2%-10% of additive, 4%-10% of low dielectric constant material, and 4%-10% of thermal interface material.

8. The method for manufacturing a strip package chip according to claim 2, characterized in that: The resin matrix includes 20%-40% UV resin and 15%-25% epoxy resin; the hardener includes 1%-6% UV initiator and 1%-4% epoxy curing agent; the filler is an inorganic filler; the low dielectric constant material is nanoparticles; and the thermal interface material is a rubber elastomer.

9. The method for manufacturing a strip package chip according to claim 1, characterized in that: The elastic modulus of the DAF glue at room temperature ranges from 700 to 1500 MPa, the elastic modulus of the DAF glue at a heating temperature of ≥120 degrees ranges from 5 to 100 MPa, the material yield strength of the DAF glue ranges from 8 MPa to 18 MPa, and the material Poisson's ratio of the DAF glue is less than or equal to 0.

35.

10. A chip-on-strip packaging system, characterized in that: It includes: A strip module, comprising a strip, a metal clamp for clamping the strip, and a multi-gear linkage mechanism for driving the strip to move; A chip module, the gap of which is arranged on the upper side of the strip, the chip module comprising a chip with DAF glue, and a patch mechanism for mounting and pressing down the chip; The heating module has a gap arranged at the lower side of the strip, and the heating module comprises a heating mechanism and a lifting mechanism for driving the heating mechanism to rise and fall.

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