Glass-based AOP phased-array antenna unit and radar system

Abstract

The invention provides a glass-based AOP phased-array antenna unit and a radar system, and relates to the technical field of antennae, the glass-based AOP phased-array antenna unit comprises a T / R assembly module and an antenna module, the T / R assembly module comprises a first BGA ball array, a first glass-based adapter plate, a glass-based adapter cap, a transceiving multifunctional chip and a transceiving bidirectional amplification chip; the antenna module comprises a glass-based adapter plate 2, an antenna assembly and a BGA ball array 2. The first BGA ball array, the first glass-based adapter plate, the glass-based adapter cap, the second BGA ball array, the second glass-based adapter plate and the antenna assembly are sequentially stacked in a selected direction to form a multi-layer structure. A transceiving multifunctional chip and a retractable bidirectional amplification chip which are mounted on the glass-based adapter plate I and are connected with each other are arranged in the glass-based adapter cap; the vertical parts of the first glass-based adapter plate, the second glass-based adapter plate and the glass-based adapter cap are respectively provided with a TGV structure used for signal transmission. The antenna efficiency can be effectively improved.

Description

Technical Field

[0001] The present invention relates to the field of antenna technology, and in particular to a glass-based AOP phased array antenna unit. Background Art

[0002] Traditional AOP (Antennas-On-Package) phased array antenna units are usually composed of antenna modules and double-sided T / R component modules. Among them, the antenna module mostly uses a microwave composite dielectric plate as a substrate, and the double-sided T / R component module uses a silicon-based or ceramic substrate as a packaging material. In this type of solution, due to the high resistivity of the substrate material, the AOP antenna unit has a large transmission loss and the antenna unit is not efficient.

[0003] Therefore, in order to improve the efficiency of phased array radar systems, it is necessary to propose an active antenna solution that is more suitable for the application of phased array radar systems. Summary of the invention

[0004] 1. Technical issues to be solved

[0005] In view of the shortcomings of the prior art, the present invention provides a glass-based AOP phased array antenna unit and a radar system to solve the technical problem in the prior art that microwave composite dielectric plates as substrates have a large resistivity that affects the efficiency of the antenna unit.

[0006] (II) Technical solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] The present invention provides a glass-based AOP phased array antenna unit, comprising a T / R component module and an antenna module, wherein the T / R component module comprises a BGA ball array, a glass-based adapter plate, a glass-based adapter cap, a transceiver multifunctional chip and a transceiver bidirectional amplifier chip;

[0009] The antenna module includes a second glass-based adapter plate, an antenna assembly and a second BGA ball array;

[0010] The BGA ball array 1, the glass-based adapter plate 1, the glass-based adapter cap, the BGA ball array 2, the glass-based adapter plate 2 and the antenna assembly are stacked in sequence in a selected direction to form a multi-layer structure;

[0011] The glass-based adapter cap is provided with a transceiver multifunctional chip and a bidirectional amplification chip which are installed on a glass-based adapter plate and are connected to each other;

[0012] The vertical parts of the glass-based adapter plate 1, the glass-based adapter plate 2 and the glass-based adapter cap are all provided with a TGV structure for signal transmission.

[0013] Furthermore, there are four bidirectional amplification chips for transmitting and receiving;

[0014] Two transceiver bidirectional amplifier chips are respectively connected to the two ends of the transceiver multifunctional chip;

[0015] The two transceiver bidirectional amplifier chips on the same end of the transceiver multifunctional chip are symmetrically arranged about the midline of the two chips;

[0016] There are four antenna components, which correspond one-to-one to four bidirectional transmitting and receiving amplifier chips.

[0017] Furthermore, the antenna component is specifically a patch antenna or a slot antenna.

[0018] Furthermore, the BGA ball array 1 is connected to an external circuit.

[0019] Furthermore, the glass-based transfer plate 1 and the glass-based transfer cap are stacked and connected by wafer-level bonding technology.

[0020] Furthermore, the glass-based adapter plate is connected to the transceiver multifunctional chip through gold wire bonding.

[0021] A second aspect of the present invention further provides a radar system, comprising the above-mentioned glass-based AOP phased array antenna unit.

[0022] (III) Beneficial effects

[0023] The glass-based AOP phased array antenna unit and radar system provided by the present invention have the following beneficial effects compared with the prior art:

[0024] (1) Compared with traditional board-level circuits, high-density three-dimensional integration makes the antenna unit smaller in size and weight. At the same time, the use of TGV process and wafer-level bonding process improves the consistency of the AOP antenna unit.

[0025] (2) Compared with AIP (packaged antenna), there is no need to apply PI glue on the upper surface of the RF chip, which effectively ensures the RF performance of the chip.

[0026] (3) The use of glass-based transfer caps can be used for vertical interconnection of signals and can also make the T / R component module airtight.

[0027] (4) Compared with the patch antenna in the form of microwave composite dielectric plate, the glass-based patch antenna has higher efficiency.

[0028] (5) Compared with silicon-based or ceramic-based T / R component modules, glass-based T / R component modules have lower resistivity, making the AOP antenna module more efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 is a circuit principle block diagram of a glass-based AOP phased array antenna unit in an embodiment;

[0031] Figure 2 Schematic diagram of the assembly structure of the glass-based AOP phased array antenna unit in the embodiment;

[0032] Figure 3 is a schematic diagram of the device layout of the T / R component module in the glass-based AOP phased array antenna unit in the embodiment;

[0033] Figure 4 Schematic diagram of the layout of antenna components in the antenna module of the glass-based AOP phased array antenna unit in the embodiment. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] In order to solve the technical problem in the prior art that microwave composite dielectric plates as substrates have a large resistivity that affects the efficiency of antenna units, the present invention provides a glass-based AOP phased array antenna unit that can effectively reduce the resistivity and improve the efficiency of the antenna unit.

[0036] In order to facilitate a clear understanding of the technical solution of the present application, the technical solution of the present application will be described in detail below in conjunction with specific embodiments and the drawings in the specification.

[0037] Example

[0038] Combined with Figure 1-4 This embodiment provides a glass-based AOP phased array antenna unit, including a T / R component module 1 and an antenna module 2.

[0039] in:

[0040] The T / R component module 1 includes a BGA ball array 101, a glass-based adapter plate 102, a glass-based adapter cap 103, a transceiver multifunctional chip 104, and a transceiver bidirectional amplifier chip 105;

[0041] The antenna module 2 includes a second glass-based adapter plate 201 , an antenna assembly 202 and a second BGA ball array 203 .

[0042] Combined with Figure 1 and 3 In this embodiment, there are four bidirectional transceiver amplifier chips 105 , and there are also four corresponding antenna components 202 , which correspond one-to-one to the four bidirectional transceiver amplifier chips 105 .

[0043] The four antenna components 202 are divided into two groups, which are respectively mounted on two ends of the transceiver multifunctional chip 104 , and the two antenna components 202 in the same group are symmetrically arranged about the midline therebetween.

[0044] The four bidirectional transceiver amplifier chips 105 are connected to the transceiver multifunctional chip 104 respectively, and the four antenna components 202 are connected to the four bidirectional transceiver amplifier chips 105 in a one-to-one correspondence.

[0045] Through the above connection relationship, the working principle of the glass-based AOP phased array antenna unit is:

[0046] The circuit works in time-sharing mode. In the transmitting state, the transceiver multifunctional chip 104 and the transceiver bidirectional amplifier chip 105 are switched to the transmitting channel through digital signals. The RF signal enters from the COM port of the transceiver multifunctional chip 104, and then is divided into four paths and enters the four transceiver bidirectional amplifier chips 105. The four transceiver bidirectional amplifier chips 105 transmit the corresponding RF signals through the corresponding antenna components 202 respectively.

[0047] In the receiving state, the transceiver multifunctional core 104 and the transceiver bidirectional amplifier chip 105 are switched to the receiving channel through digital signals, and the RF signal is received by the antenna assembly 202 and then given to the corresponding transceiver bidirectional amplifier chip 105 for low-noise amplification. Each transceiver bidirectional amplifier chip 105 sends the processed signal to the transceiver multifunctional chip 104, and the transceiver multifunctional chip 104 synthesizes the received four signals and outputs them through its COM port.

[0048] The five-chip architecture consisting of one transceiver multifunctional chip 104 and four transceiver bidirectional amplifier chips 105 in the above arrangement has a high circuit integration and a compact overall structure layout, and is more than 75% smaller in size than a traditional brick-type T / R assembly.

[0049] In this embodiment, the antenna component 202 is in the form of a patch antenna, and patch antennas or slot antennas of different shapes and sizes can be used according to actual usage requirements.

[0050] The multifunctional chip 104 can also determine the number of power dividers / combiners, phase shifters, attenuators, driver amplifiers, low noise amplifiers and single-pole double-throw switches according to actual usage; the bidirectional amplifier chip 105 can also determine the number of power amplifiers, low noise amplifiers and single-pole double-throw switches according to actual usage.

[0051] Combined with Figure 2 In the vertically upward direction, the BGA ball array 101, the glass-based adapter plate 102, the glass-based adapter cap 103, the BGA ball array 203, the glass-based adapter plate 201 and the antenna assembly 202 are stacked to form a multi-layer structure through three-dimensional integration technology.

[0052] Among them, the components in the T / R component module 1 are adhered to the glass-based adapter plate 102 by conductive adhesive, and the signal interconnection between the components and the glass-based adapter plate 102 is realized by gold wire bonding technology, and the components are all arranged in the glass-based adapter cap 103, and the glass-based adapter cap 103 and the glass-based adapter plate 102 are stacked and connected by wafer-level bonding technology.

[0053] That is, the multifunctional chip for transmitting and receiving 104 and the bidirectional chip for receiving and releasing 105 are attached to the glass-based adapter plate 102 by conductive adhesive and are located in the inner cavity of the glass-based adapter cap 103, and the multifunctional chip for transmitting and receiving 104 and the like are interconnected with the glass-based adapter plate 102 for signal transmission by gold wire bonding technology.

[0054] Through the above arrangement, the glass-based transfer cap 103 not only achieves airtightness of the components in the T / R assembly module 1, but also provides installation space for each component.

[0055] In order to facilitate the connection of various signal unit components, a TGV structure for signal transmission is also provided on the vertical parts of the glass-based adapter plate 1 102 , the glass-based adapter plate 2 201 and the glass-based adapter cap 103 .

[0056] Among them, the TGV structure includes a quasi-coaxial structure for transmitting radio frequency signals.

[0057] The ground signal of the T / R component module 1 and the ground signal of the antenna module 2 are shared by the TGV structure; and the radio frequency signal generated in the device is transmitted through a quasi-coaxial structure.

[0058] Reference Figure 2In this embodiment, the T / R component module 1 is formed into a double-sided ball-planting form through high-density three-dimensional integration technology, so that the transmission path between the T / R component module 1 and the antenna module 2 is effectively shortened, and the radio frequency signal loss can be effectively reduced by means of the low-resistivity glass substrate, so that the efficiency of the entire AOP phased array antenna unit can be effectively improved.

[0059] The glass-based AOP phased array antenna unit provided in this embodiment completes the interconnection and transmission of external cable signals through the BGA ball array 101.

[0060] Combined with Figure 1-4 , the signal path of the glass-based AOP phased array antenna unit in this embodiment is:

[0061] In the transmitting state, the external circuit inputs the signal through the BGA ball array 101 at the bottom of the T / R component module 1, and transmits the signal vertically to the bonding area on the top layer of the glass-based adapter board 102 through the TGV structure on the glass-based adapter board 102. The signal is transmitted to the components in the glass-based adapter cap 103 through the bonding gold wire. The components transmit the output signal to the glass-based adapter board 102 through the gold wire. The glass-based adapter board 102 vertically transmits the signal to the top of the glass-based adapter cap 103 through the TGV structure on the glass-based adapter cap 102. The top of the glass-based adapter cap 103 inputs the signal into the BGA ball array 203 thereon. The BGA ball array 203 transmits the signal to the antenna component 202 through the TGV structure on the glass-based adapter board 201, thereby feeding the antenna component 202.

[0062] In the receiving state, the antenna component 202 receives the RF signal and vertically transmits it to the BGA ball array 202 under the glass-based adapter board 201 through the TGV structure in the glass-based adapter board 201. The BGA ball array 202 transmits it to the top of the glass-based adapter cap 103. The top of the glass-based adapter cap 103 transmits the signal to the glass-based adapter board 1 102 through the TGV structure in the glass-based adapter cap 103. The glass-based adapter board 102 transmits the signal to the corresponding components through the gold wire. After being processed, the components are transmitted out of the glass-based adapter board 102 again through the gold wire. The glass-based adapter board 102 vertically transmits the signal to the BGA ball array 101 below it through the TGV structure thereon. The BGA ball array 101 transfers the signal to the external circuit for processing.

[0063] In combination with the above, the glass-based transfer plate 1 101 , the glass-based transfer cap 103 , the glass-based transfer plate 201 and the TGV structure play a role in signal transmission.

[0064] That is, in the transmitting state, the external circuit sequentially transmits the signal to the transceiver multifunctional chip 104 through the BGA ball array 101, the TGV structure on the glass-based adapter board 102, the glass-based adapter board 102 and the gold wire via the COM port of the transceiver multifunctional chip 104. After processing, the transceiver multifunctional chip 104 sends the four signals to the four transceiver bidirectional amplifier chips 105 respectively. The signal emitted by each transceiver bidirectional amplifier chip 105 sequentially passes through the gold wire, the glass-based adapter board 102, the TGV structure on the glass-based adapter cap 102, the top of the glass-based adapter cap 103, the BGA ball array 203 and the TGV structure on the glass-based adapter board 201, and is then transmitted to the corresponding antenna component 202 to realize the feeding of the antenna component 202. In the receiving state, the opposite is true, which will not be repeated here.

[0065] This embodiment also provides a radar system, including the above-mentioned glass-based AOP phased array antenna unit, which will not be described in detail here.

[0066] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0067] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A glass-based AOP phased array antenna unit, comprising a T / R component module and an antenna module, characterized in that: The T / R component module includes a BGA ball array, a glass-based adapter plate, a glass-based adapter cap, a transceiver multifunctional chip and a transceiver bidirectional amplifier chip; The antenna module includes a second glass-based adapter plate, an antenna assembly and a second BGA ball array; The BGA ball array 1, the glass-based adapter plate 1, the glass-based adapter cap, the BGA ball array 2, the glass-based adapter plate 2 and the antenna assembly are stacked in sequence in a selected direction to form a multi-layer structure; The glass-based adapter cap is provided with a transceiver multifunctional chip and a bidirectional amplification chip which are installed on a glass-based adapter plate and are connected to each other; The vertical parts of the glass-based adapter plate 1, the glass-based adapter plate 2 and the glass-based adapter cap are all provided with a TGV structure for signal transmission.

2. The glass-based AOP phased array antenna unit according to claim 1, characterized in that: There are four bidirectional transmitting and receiving amplifier chips; Two transceiver bidirectional amplifier chips are respectively connected to the two ends of the transceiver multifunctional chip; The two transceiver bidirectional amplifier chips on the same end of the transceiver multifunctional chip are symmetrically arranged about the midline of the two chips; There are four antenna components, which correspond one-to-one to four bidirectional transmitting and receiving amplifier chips.

3. The glass-based AOP phased array antenna unit according to claim 1, characterized in that: The antenna component is specifically a patch antenna or a slot antenna.

4. The glass-based AOP phased array antenna unit according to claim 1, characterized in that: The BGA ball array is connected to an external circuit.

5. The glass-based AOP phased array antenna unit according to claim 1, characterized in that: The glass-based transfer plate 1 and the glass-based transfer cap are stacked and connected by wafer-level bonding technology.

6. The glass-based AOP phased array antenna unit according to claim 1, characterized in that: The glass-based adapter plate is connected to the transceiver multifunctional chip through gold wire bonding.

7. A radar system, characterized in that: It comprises a glass-based AOP phased array antenna unit as described in any one of claims 1 to 6.

Images