High-frequency high-speed circuit board

Abstract

A high-frequency and high-speed circuit board disclosed by the present invention comprises a circuit board body and a mounting frame, the circuit board body is matched with the mounting frame, four opposite corners of the circuit board body are provided with cushions, the mounting frame is provided with a plurality of dustproof mechanisms, the outer side wall of the mounting frame is fixedly connected with a driving motor, and the driving motor is fixedly connected with the circuit board body. The output end of the driving motor is fixedly connected with a driving shaft, the driving shaft is connected with a heat dissipation mechanism, the dustproof mechanism comprises a plurality of filter plates, the outer side walls of the filter plates are fixedly connected with two symmetrically-arranged fixing plates, a plurality of dustproof openings are formed in the mounting frame, electric energy is converted into mechanical energy through the driving motor, and the mechanical energy is stored in the mounting frame. When the circuit board runs, the driving shaft rotates to drive a fan or other heat dissipation devices in the heat dissipation mechanism to work, heat generated in the running process of the circuit board can be efficiently and rapidly dissipated, it is ensured that the circuit board is in a stable temperature environment all the time, the running efficiency of the circuit board is improved, and the service life of the circuit board is prolonged.

Description

Technical Field

[0001] The invention relates to the technical field of circuit boards, and in particular to a high-frequency and high-speed circuit board. Background Art

[0002] The production process of high-frequency and high-speed PCB boards is basically the same as that of ordinary PCB boards. The key to achieving high frequency and high speed lies in the properties of the raw materials, that is, the characteristic parameters of the raw materials. The main material of high-frequency and high-speed PCB boards is high-frequency and high-speed copper clad laminate. Its core lies in its ability to work stably at high frequencies and maintain low latency and high reliability.

[0003] However, this type of circuit board faces several major technical problems in actual use: first, due to the uneven heat dissipation of high-density integrated components in a high-temperature environment, local overheating and circuit performance degradation occur; second, high-frequency and high-speed circuit boards are prone to adsorb dust due to the magnetic field, causing blockage, and the dust is difficult to clean, which brings inconvenience to quick replacement; finally, the heat dissipation effect of existing components in a high-temperature environment is not satisfactory, and a single cooling method cannot effectively improve the overall heat dissipation effect, making temperature control a problem. These problems seriously restrict the performance and service life of the circuit board. Summary of the invention

[0004] The purpose of the present invention is to solve the problems existing in the prior art and to propose a high-frequency and high-speed circuit board.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A high-frequency and high-speed circuit board comprises a circuit board body and a mounting frame, wherein the circuit board body and the mounting frame fit together, buffer pads are arranged at four diagonal portions of the circuit board body, a plurality of dustproof mechanisms are arranged on the mounting frame, a drive motor is fixedly connected to an outer side wall of the mounting frame, a drive shaft is fixedly connected to an output end of the drive motor, and a heat dissipation mechanism is connected to the drive shaft.

[0007] Preferably, the dustproof mechanism includes a plurality of filter plates, the outer side walls of the filter plates are fixedly connected to two symmetrically arranged fixing plates, the mounting frame is provided with a plurality of dustproof ports, the dustproof ports are adapted to the filter plates, the mounting frame is provided with placement grooves and annular grooves connected to the dustproof ports, the placement grooves are adapted to the fixing plates, and the fixing plates are provided with a clamping mechanism.

[0008] Preferably, the clamping mechanism includes a fixing groove opened on the fixing plate, a telescopic rod is fixedly connected to the bottom of the fixing groove, a pressing head is fixedly connected to one end of the telescopic rod away from the bottom of the fixing groove, and a pressing port connected to the annular groove is provided on the mounting frame, and the pressing port is adapted to the size of the annular groove.

[0009] Preferably, a compression spring is sleeved on the outer side wall of the telescopic rod, and two ends of the compression spring are respectively fixedly connected to the outer side wall of the pressing head and the bottom of the fixing groove.

[0010] Preferably, the heat dissipation mechanism includes a water cooling cavity opened on the installation frame, the drive shaft passes through the water cooling cavity, the outer wall of the drive shaft located in the installation frame is fixedly connected to multiple groups of air-cooled fan blades, and the outer wall of the drive shaft located in the water cooling cavity is fixedly connected to multiple groups of stirring shafts.

[0011] Preferably, the outer side wall of the installation frame is fixedly connected to multiple groups of vertically arranged heat dissipating fins, the multiple groups of heat dissipating fins penetrate the installation frame and extend into the water cooling cavity, and the multiple groups of heat dissipating fins are connected by horizontally arranged connecting plates.

[0012] Preferably, sealing gaskets are provided at the connections between the plurality of groups of heat dissipation fins and the mounting frame.

[0013] Compared with the prior art, the present invention has the following advantages:

[0014] 1. The present invention converts electrical energy into mechanical energy by driving a motor to rotate the drive shaft, thereby driving a fan or other heat dissipation device in the heat dissipation mechanism to work, which can efficiently dissipate the heat generated during the operation of the circuit board, ensure that the circuit board is always in a stable temperature environment, and improve the operation efficiency and life of the circuit board.

[0015] 2. The present invention also provides a filter screen, a dust cover, etc. on the installation frame, which can effectively block external dust and impurities from entering the interior of the installation frame, thereby avoiding potential dangers such as short circuit and burning of the circuit board caused by these debris. At the same time, the filter screen can be quickly replaced and installed through the setting of the clamping mechanism, so that the high-frequency and high-speed circuit board can maintain internal cleanliness while dissipating heat efficiently, ensuring its long-term stable and reliable working performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A three-dimensional diagram of a high-frequency and high-speed circuit board proposed by the present invention;

[0017] Figure 2 A schematic diagram of the dust prevention mechanism structure of a high-frequency and high-speed circuit board proposed by the present invention;

[0018] Figure 3 A schematic diagram of the structure of a clamping mechanism for a high-frequency and high-speed circuit board proposed by the present invention;

[0019] Figure 4 This is a schematic diagram of the connection structure between a filter plate and a fixing plate of a high-frequency and high-speed circuit board proposed by the present invention;

[0020] Figure 5A schematic diagram of the dust prevention mechanism structure of a high-frequency and high-speed circuit board proposed by the present invention;

[0021] Figure 6 A schematic diagram of the structure of a clamping mechanism for a high-frequency and high-speed circuit board proposed by the present invention;

[0022] Figure 7 The present invention provides a schematic diagram of the heat dissipation mechanism of a high-frequency and high-speed circuit board.

[0023] In the figure: 1. circuit board body; 2. mounting frame; 3. buffer pad; 4. dustproof mechanism; 401. filter plate; 402. fixing plate; 403. fixing groove; 404. telescopic rod; 405. pressing head; 406. compression spring; 407. dustproof port; 408. placement groove; 409. annular groove; 410. pressing port; 5. driving motor; 6. driving shaft; 7. air-cooling fan blades; 8. water-cooling chamber; 9. stirring shaft; 10. heat dissipation fins; 11. connecting plate. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0025] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0026] Reference Figure 1-Figure 7The present embodiment provides a high-frequency and high-speed circuit board, which includes a circuit board body 1 and a mounting frame 2. The circuit board body 1 is used to carry various high-frequency and high-speed electronic components, and is combined with the mounting frame 2 to ensure the stability and reliability of the overall structure. The circuit board body 1 is a high-performance substrate with high conductivity and low signal loss. The substrate adopts a multi-layer stacking design and can integrate more circuit functions in a limited space. The circuit board body 1 and the mounting frame 2 are matched. Buffer pads 3 are provided at the four diagonal portions of the circuit board body 1 to reduce the impact of external vibration on the circuit board and improve the shock resistance and life of the circuit board. The buffer pads 3 are made of soft and elastic materials, such as silicone or rubber. They are installed at the four diagonal portions of the circuit board body 1 to absorb external vibration through pre-compression force to reduce mechanical damage to the circuit board. A plurality of dustproof mechanisms 4 are provided on the mounting frame 2. These mechanisms can effectively prevent dust from entering the working area of ​​the circuit board to avoid affecting the circuit performance due to dust accumulation. A drive motor 5 is fixedly connected to the outer wall of the mounting frame 2, and a drive shaft 6 is fixedly connected to the output end of the drive motor 5. The drive shaft 6 is connected to a heat dissipation mechanism, thereby achieving effective heat dissipation of the circuit board.

[0027] The dustproof mechanism 4 includes multiple filter plates 401, which filter the particles and dust that may be carried in the air layer by layer. The outer wall of the filter plate 401 is fixedly connected to two symmetrically arranged fixing plates 402. The mounting frame 2 is provided with multiple dustproof ports 407, which are adapted to the filter plate 401 to ensure that the air will not short-circuit or directly enter the circuit board without being filtered when passing through the filter plate 401. The mounting frame 2 is provided with a placement groove 408 and an annular groove 409 connected to the dustproof port 407, which is adapted to the fixing plate 402. The fixing plate 402 is provided with a clamping mechanism, and the clamping mechanism on the fixing plate 402 can further lock the filter plate 401 so that it can maintain a stable connection even in a high vibration and high frequency working environment.

[0028] The clamping mechanism includes a fixing groove 403 provided on the fixing plate 402, a telescopic rod 404 is fixedly connected to the bottom of the fixing groove 403, a pressing head 405 is fixedly connected to one end of the telescopic rod 404 away from the bottom of the fixing groove 403, and a pressing port 410 connected to the annular groove 409 is provided on the mounting frame 2. The pressing port 410 is adapted to the size of the annular groove 409, so that the pressing head 405 can smoothly pass through the pressing port 410 and act in the annular groove 409, thereby completing the clamping and fixing of the circuit board.

[0029] A compression spring 406 is sleeved on the outer wall of the telescopic rod 404, and the two ends of the compression spring 406 are respectively fixedly connected to the outer wall of the pressing head 405 and the inner bottom of the fixing groove 403. This design ensures that the pressing head 405 can move smoothly along the axial direction of the telescopic rod 404 when subjected to force. At the same time, after the external force is removed, the compression spring 406 can reset the pressing head 405 to its initial position.

[0030] The heat dissipation mechanism includes a water-cooling chamber 8 opened on the mounting frame 2, the driving shaft 6 passes through the water-cooling chamber 8 and is tightly matched with the mounting frame 2 to ensure sealing, and the outer wall of the driving shaft 6 located in the mounting frame 2 is fixedly connected with a plurality of groups of air-cooling blades 7, which can generate airflow when the driving shaft 6 rotates, and effectively take away the heat on the circuit board, and the outer wall of the driving shaft 6 located in the water-cooling chamber 8 is fixedly connected with a plurality of groups of stirring shafts 9, which can stir the coolant in the water-cooling chamber 8 to make the coolant flow, thereby further improving the heat dissipation efficiency. Through this design, the heat dissipation mechanism not only utilizes the advantages of air cooling, but also combines the advantages of water cooling, thereby achieving a better heat dissipation effect.

[0031] The outer wall of the mounting frame 2 is fixedly connected with a plurality of groups of vertically arranged heat dissipating fins 10. The heat dissipating fins 10 can be fixed to the outer wall of the mounting frame 2 by welding or fasteners. The plurality of groups of heat dissipating fins 10 penetrate the mounting frame 2 and extend into the water-cooling cavity 8 to ensure that heat can be effectively transferred to the coolant. In order to enhance the stability and heat dissipation effect of the heat dissipating fins 10, the plurality of groups of heat dissipating fins 10 are interconnected by horizontally arranged connecting plates 11 to form a strong and efficient heat conduction network. The connecting plates 11 between the heat dissipating fins 10 not only increase the stability of the structure, but also improve the overall heat conduction efficiency, thereby ensuring the reliable operation of the system.

[0032] Sealing gaskets are provided at the connections between the multiple groups of heat sink fins 10 and the mounting frame 2. These sealing gaskets can not only ensure the tightness of the connection between the heat sink fins 10 and the mounting frame 2, but also effectively prevent the influence of external dust, moisture, etc. on the internal components of the circuit board, thereby improving the overall reliability and stability.

[0033] The specific working principle of the present invention is as follows:

[0034] In actual operation, when this device is used, the high-frequency and high-speed circuit board is installed in a dedicated mounting frame 2. First, the circuit board fits with the mounting frame 2 to ensure the stability and safety of the overall structure. The buffer pads 3 arranged at the four diagonal points of the mounting frame 2 can effectively reduce the impact of external vibrations on the circuit board, thereby protecting the precision components inside the circuit board from damage.

[0035] A driving motor 5 is fixed to the outer wall of the mounting frame 2. After the motor is started, it is connected through the driving shaft 6 and drives the stirring shaft 9 and the air-cooling blades 7 to rotate, thereby driving the water flow in the water-cooling chamber 8. The water flow can accelerate the heat dissipation fins 10 to take away the internal heat. At the same time, the rotation of the air-cooling blades 7 will generate airflow, thereby accelerating the cooling effect. The heat dissipation mechanism can efficiently and quickly dissipate the heat generated during the operation of the circuit board, ensuring that the circuit board is always in a stable temperature environment, thereby improving the operation efficiency and life of the circuit board.

[0036] When the filter plate 401 needs to be replaced, it is only necessary to press the pressing head 405 into the pressing port 410, rotate the filter plate 401, so that the fixing plate 402 enters the placement slot 408, thereby facilitating the removal of the filter plate 401. When the filter plate 401 needs to be installed, it is only necessary to press the pressing head 405 into the fixing slot 403 again, rotate the filter plate 401, and under the action of the compression spring 406, the pressing head 405 enters the placement slot 408, thereby realizing the installation of the filter plate 401 and realizing the quick disassembly and installation of the filter plate 401.

[0037] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A high-frequency and high-speed circuit board, comprising a circuit board body (1) and a mounting frame (2), characterized in that: The circuit board body (1) and the mounting frame (2) are matched with each other, buffer pads (3) are provided at four diagonal positions of the circuit board body (1), a plurality of dustproof mechanisms (4) are provided on the mounting frame (2), a drive motor (5) is fixedly connected to the outer wall of the mounting frame (2), a drive shaft (6) is fixedly connected to the output end of the drive motor (5), and the drive shaft (6) is connected to a heat dissipation mechanism.

2. A high-frequency and high-speed circuit board according to claim 1, characterized in that: The dustproof mechanism (4) comprises a plurality of filter plates (401), the outer side walls of the filter plates (401) are fixedly connected to two symmetrically arranged fixing plates (402), the installation frame (2) is provided with a plurality of dustproof ports (407), the dustproof ports (407) are adapted to the filter plates (401), the installation frame (2) is provided with a placement groove (408) and an annular groove (409) which are connected to the dustproof ports (407), the placement groove (408) is adapted to the fixing plates (402), and the fixing plates (402) are provided with a clamping mechanism.

3. A high-frequency and high-speed circuit board according to claim 2, characterized in that: The clamping mechanism comprises a fixing groove (403) provided on the fixing plate (402), a telescopic rod (404) being fixedly connected to the bottom of the fixing groove (403), a pressing head (405) being fixedly connected to one end of the telescopic rod (404) away from the bottom of the fixing groove (403), and a pressing opening (410) being connected to the annular groove (409) being provided on the installation frame (2), and the pressing opening (410) and the annular groove (409) are adapted in size.

4. A high-frequency and high-speed circuit board according to claim 3, characterized in that: The outer wall of the telescopic rod (404) is sleeved with a compression spring (406), and the two ends of the compression spring (406) are respectively fixedly connected to the outer wall of the pressing head (405) and the inner bottom of the fixing groove (403).

5. A high-frequency and high-speed circuit board according to claim 1, characterized in that: The heat dissipation mechanism comprises a water cooling chamber (8) provided on the mounting frame (2), the drive shaft (6) passing through the water cooling chamber (8), a plurality of groups of air cooling blades (7) being fixedly connected to the outer wall of the drive shaft (6) located in the mounting frame (2), and a plurality of groups of stirring shafts (9) being fixedly connected to the outer wall of the drive shaft (6) located in the water cooling chamber (8).

6. A high-frequency and high-speed circuit board according to claim 5, characterized in that: The outer wall of the installation frame (2) is fixedly connected to a plurality of groups of vertically arranged heat dissipation fins (10); the plurality of groups of heat dissipation fins (10) penetrate the installation frame (2) and extend into the water cooling chamber (8); the plurality of groups of heat dissipation fins (10) are connected to each other via a horizontally arranged connecting plate (11).

7. A high-frequency and high-speed circuit board according to claim 6, characterized in that: Sealing gaskets are provided at the connection points between the plurality of groups of heat dissipation fins (10) and the installation frame (2).

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