Method for recycling waste photovoltaic module

Abstract

The invention relates to a method for recycling a waste photovoltaic module, which adopts a tooth type milling cutter to perform glass removal treatment on a glass layer, adopts a honeycomb type milling cutter to perform grinding treatment on an EVA (Ethylene Vinyl Acetate)-silicon battery piece-EVA layer, and accurately removes the glass layer and the EVA-silicon battery piece-EVA layer on a back plate, so that on one hand, the pollution of glass to the recycling of other materials is reduced; the recovery rate and the purity of the recovered glass particles can be improved; and on the other hand, residues of the EVA material on the back plate are reduced, the clean back plate can be obtained, pollution of the back plate to the environment can be reduced, the difficulty of reusing the back plate can be reduced, and the recycling cost and the economic effect are reduced. In addition, due to the fact that the mixed powder is composed of the EVA material, the silicon powder and the solder strip particles, the difficulty and the separation effect of the mixed powder during separation treatment can be reduced, and the purity and the recovery rate of all the recycled materials are further improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of photovoltaic module recycling, and in particular, to a method for recycling waste photovoltaic modules. Background Art

[0002] With the rapid development of the global photovoltaic industry, the number of waste photovoltaic modules is also increasing year by year. At present, the average life of photovoltaic modules is 25-30 years. Therefore, the photovoltaic systems installed earlier have gradually entered the scrap period, which will bring huge pressure on waste disposal.

[0003] Photovoltaic modules are made of a variety of materials, mainly including junction boxes, aluminum frames, glass, silicon cells, ethylene-vinyl acetate copolymer (abbreviated as EVA) and backplanes. At present, the resource recycling of waste photovoltaic modules often adopts physical disassembly. However, the physical disassembly and recycling method faces the following problems: 1. Due to the close combination of various materials in photovoltaic modules, the existing physical disassembly methods are usually inefficient and easy to cause secondary contamination of materials. 2. The existing physical disassembly methods cannot accurately remove a certain layer or multiple layers of materials, resulting in low purity and recovery rate of recycled materials. In addition, photovoltaic modules contain precious metals such as silver, indium, and copper. The current physical disassembly technology cannot finely separate and purify these metals in the process of recycling these metals, resulting in low purity and recovery rate of these recycled metals. 3. The backplanes in existing waste photovoltaic modules generally use PTP fluorine-containing backplanes, which can be further utilized. When using physical disassembly methods, the backplanes will be made into broken materials. On the one hand, the fine powder in the broken materials will spread into the environment and cause environmental pollution. On the other hand, when the broken materials are recycled, they need to be further crushed. The cost and economic effect of recycling are not high. 4. The recycling cost of some materials is higher than their market value, which is an important factor hindering large-scale commercial recycling. Especially for the recycling of silicon wafers, due to the high purity requirements and complex and expensive processing process, the recycling rate is low. Summary of the invention

[0004] The purpose of the present invention is to provide a method for recycling waste photovoltaic modules to solve the problems of low disassembly efficiency, low purity of recycled materials, low recycling efficiency, low economic benefits and environmental pollution in the existing physical disassembly technology.

[0005] In order to achieve the above object, the present disclosure provides a method for recycling waste photovoltaic modules, the method comprising: S1. Provide scrapped photovoltaic modules with aluminum alloy frames and junction boxes removed; S2, subjecting the waste photovoltaic components to a first preheating treatment and then to deglazing treatment using a toothed milling cutter, to obtain glass particles and deglazed cell components; S3, subjecting the deglazed cell sheet assembly to a second preheating treatment and then grinding it with a honeycomb milling cutter to obtain a complete back sheet and mixed powder; S4, subjecting the mixed powder to powder separation treatment to obtain welding ribbon particles, EVA particles and silicon powder.

[0006] Optionally, the conditions of the first preheat treatment include: a temperature of 140-160° C. and a time of 1-15 min.

[0007] Optionally, the conditions of the second preheat treatment include: a temperature of 120-135° C. and a time of 1-15 min.

[0008] Optionally, the tooth number of the toothed milling cutter is 25-30, the blade length is 50-100 mm, and the blade diameter is 12-50 mm.

[0009] Optionally, the honeycomb milling cutter has a blade length of 37-70 mm and a blade diameter of 5-8 mm.

[0010] Optionally, the conditions for the devitrification treatment include: the linear speed of the toothed milling cutter is 130-160 m / min, the treatment thickness is 10-20 mm, and the feed speed is 10-40 mm / min.

[0011] Optionally, the grinding treatment conditions include: the rotation speed of the honeycomb milling cutter is 320-360 rpm, the processing thickness is 5-10 mm, and the feed speed is 10-20 mm / min.

[0012] Optionally, the powder separation process includes gravity separation process and electrostatic separation process; Step S4 includes: S41, subjecting the mixed powder to gravity separation to obtain the welding ribbon particles and silicon-EVA mixed material; S42, subjecting the silicon-EVA mixture to electrostatic separation to obtain the silicon powder and the EVA particles.

[0013] Optionally, the particle size of the glass particles is 50-100 μm; the particle size of the solder strip particles is 30-50 μm; the particle size of the silicon powder is 10-30 μm; and the particle size of the EVA particles is 30-50 μm.

[0014] Optionally, the purity of the EVA particles is 90-99% by weight, and the recovery rate of the EVA particles is 90-98%.

[0015] Through the above technical solution, a toothed milling cutter is used to remove the glass layer, and a honeycomb milling cutter is used to grind the EVA-silicon cell-EVA layer, so as to accurately remove the glass layer and the EVA-silicon cell-EVA layer on the backplane. On the one hand, the pollution of glass to other materials can be reduced, and the recovery rate and purity of the recycled glass particles can be improved; on the other hand, the residual EVA material on the backplane can be reduced, and a clean backplane can be obtained, which can not only reduce the pollution of the backplane to the environment, but also reduce the difficulty of the backplane reuse, and reduce the cost and economic effect of recycling. In addition, since the mixed powder is composed of EVA material, silicon powder and solder strip particles, the difficulty and separation effect of the mixed powder separation process can be reduced, and the purity and recovery rate of each recycled material can be further improved.

[0016] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings: Figure 1 The present invention discloses a flow chart of a method for recycling waste photovoltaic modules.

[0018] Figure 2 The present invention discloses a schematic diagram of a waste photovoltaic module with an aluminum alloy frame and a junction box removed.

[0019] Description of Reference Numerals 1. Glass layer; 2. EVA layer; 3. Silicon cell layer; 4. EVA layer; 5. Back panel. DETAILED DESCRIPTION

[0020] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0021] like Figure 1 As shown, the present disclosure provides a method for recycling waste photovoltaic components, the method comprising: S1. Provide scrapped photovoltaic modules with aluminum alloy frames and junction boxes removed; S2, subjecting the waste photovoltaic components to a first preheating treatment and then to deglazing treatment using a toothed milling cutter, to obtain glass particles and deglazed cell components; S3, subjecting the deglazed cell sheet assembly to a second preheating treatment and then grinding it with a honeycomb milling cutter to obtain a complete back sheet and mixed powder; S4, subjecting the mixed powder to powder separation treatment to obtain welding ribbon particles, EVA particles and silicon powder.

[0022] Through the above technical solution, a toothed milling cutter is used to remove the glass layer, and a honeycomb milling cutter is used to grind the EVA-silicon cell-EVA layer, so as to accurately remove the glass layer and the EVA-silicon cell-EVA layer on the backplane. On the one hand, the pollution of glass to other materials can be reduced, and the recovery rate and purity of the recycled glass particles can be improved; on the other hand, the residual EVA material on the backplane can be reduced, and a clean backplane can be obtained, which can not only reduce the pollution of the backplane to the environment, but also reduce the difficulty of the backplane reuse, and reduce the cost and economic effect of recycling. In addition, since the mixed powder is composed of EVA material, silicon powder and solder strip particles, the difficulty and separation effect of the mixed powder separation process can be reduced, and the purity and recovery rate of each recycled material can be further improved.

[0023] In one embodiment, the waste photovoltaic components with the aluminum alloy frame and junction box removed as described in the present disclosure can be removed using precision disassembly equipment. The specific precision disassembly equipment and removal method are conventionally selected in the art and are not specifically required in this application.

[0024] In one embodiment, if Figure 2 As shown, the waste photovoltaic module with the aluminum alloy frame and junction box removed from the present disclosure includes, from top to bottom, a glass layer 1, an EVA layer 2, a silicon cell layer 3, an EVA layer 4, and a back plate 5. Among them, a metal welding strip is also provided between the EVA layer 2 and the silicon cell layer 3, which is not shown in the figure.

[0025] In one embodiment, the thickness of the glass layer 1 is 10-15 mm, the total thickness of the EVA layer 2, the silicon cell layer 3 and the EVA layer 4 is 5-10 mm, and the thickness of the backplane 5 is 3-5 mm.

[0026] In one embodiment, the material of the metal welding strip described in the present disclosure is conventionally selected in the art, and this application does not make special requirements. For example, the material of the metal welding strip described in the present disclosure is copper.

[0027] In one embodiment, the backplane described in the present disclosure is a conventional choice in the art, and this application does not make any special requirements. For example, the backplane described in the present disclosure is a TPT backplane.

[0028] In one embodiment, the temperature of the first preheating treatment described in step S2 is 140-160°C, and the treatment time is 1-15 minutes. In this embodiment, after the waste photovoltaic components with the aluminum alloy frame and junction box removed are subjected to the first preheating treatment, the EVA layer softens, and the bonding strength between the EVA material and the lower surface of the glass layer is low. In other words, the amount of EVA material attached to the lower surface of the glass layer is small, which can further improve the purity of the recycled glass particles; in addition, when the EVA layer is softened and a toothed milling cutter is used for processing, the softened EVA layer will absorb the force acting on the glass, avoiding glass breakage during the processing of the toothed milling cutter, causing processing accidents and processing difficulties.

[0029] In a preferred embodiment, the temperature and time of the first preheat treatment can be flexibly adjusted according to the size of the component to be treated. For example, the temperature of the first preheat treatment can be any one of 140°C, 145°C, 150°C, 155°C and 160°C or any two of the range, and the treatment time can be any one of 2min, 4min, 6min, 8min, 10min, 12min and 14min or any two of the range.

[0030] In one embodiment, step S2 further includes cooling the photovoltaic module after the first preheating treatment to 110-150° C. before performing the devitrification treatment. In this embodiment, the temperature of the photovoltaic module is reduced to a suitable temperature to ensure that the EVA layer is at a suitable softening degree, which can not only absorb the cutting force, but also avoid the phenomenon of increased processing difficulty caused by the movement of the glass layer during the cutting process.

[0031] In one embodiment, the toothed milling cutter used in the present disclosure is a conventional choice in the art, and this application does not make any special requirements. The toothed milling cutter used in the present disclosure has 25 to 30 teeth, a blade length of 50 to 100 mm, and a blade diameter of 12 to 50 mm.

[0032] In a preferred embodiment, the number of teeth, blade length and blade diameter of the toothed milling cutter used in the present invention can be flexibly adjusted according to the processing method and actual usage. For example, the number of teeth of the toothed milling cutter can be 25, 26, 27, 28, 29 or 30; the blade length of the toothed milling cutter can be any one of 50mm, 55mm, 60mm, 65mm, 70mm, 75mm, 80mm and 85mm or a range composed of any two of them; the blade diameter of the toothed milling cutter can be any one of 12mm, 14mm, 20mm, 25mm, 30mm, 35mm, 40mm and 50mm or a range composed of any two of them.

[0033] In this embodiment, a toothed milling cutter with a suitable number of teeth is used for processing, so that the particle size of the recovered glass particles can be as fine as possible. For example, the particle size of the recovered glass particles in the present disclosure is 50-100 μm.

[0034] In one embodiment, the toothed milling cutter disclosed in the present invention may be in the form of a face milling cutter, an end milling cutter, a roughing cutter, a peripheral milling cutter, and a side milling cutter.

[0035] In a preferred embodiment, the toothed milling cutter disclosed in the present disclosure is in the form of a peripheral milling cutter or a side milling cutter. In this embodiment, a suitable type of toothed milling cutter and a suitable processing method are used to accurately remove a material layer of a suitable thickness, thereby improving the purity and recovery rate of the recovered material.

[0036] In one embodiment, the linear speed of the toothed milling cutter during the deglazing process is 130-160 m / min.

[0037] In a preferred embodiment, the linear speed of the gear milling cutter used in the present invention can be flexibly adjusted according to the processing method and actual usage. For example, the linear speed can be in the range of any one or any two of 130m / min, 135m / min, 140m / min, 145m / min, 150m / min, 155m / min and 160m / min.

[0038] In one embodiment, the feed speed of the toothed milling cutter used in the present disclosure is 10-40 mm / min.

[0039] In a preferred embodiment, the feed speed of the toothed milling cutter used in the present invention can be in the range of any one or any two of 10 mm / min, 15 mm / min, 20 mm / min, 25 mm / min, 30 mm / min, 35 mm / min and 40 mm / min.

[0040] In this embodiment, when performing the deglazing process, with the coordination of the linear speed and feed speed of the appropriate toothed milling cutter, it is possible to improve the efficiency of the deglazing process while ensuring a good deglazing process effect.

[0041] In one embodiment, the treatment thickness during the devitrification process is 10-15 mm.

[0042] In a preferred embodiment, the processing thickness described in the present disclosure can be flexibly adjusted according to the thickness of the glass layer. For example, the processing thickness can be in the range of any one or any two of 10 mm, 11 mm, 12 mm, 13 mm, 14 mm and 15 mm.

[0043] In one embodiment, the ratio of the treatment thickness of the devitrification treatment to the thickness of the glass layer is (0.90~1.01):1.

[0044] In a preferred embodiment, the ratio of the treatment thickness of the devitrification treatment to the thickness of the glass layer is (0.98-1):1.

[0045] In this embodiment, by selecting a suitable treatment thickness of the devitrification treatment, as much glass material of the glass layer as possible can be recovered, thereby increasing the purity and recovery rate of the recovered glass particles as much as possible. In addition, according to actual recycling standards, if the purity of the recovered glass particles is not required to be high, the ratio of the treatment thickness of the devitrification treatment to the thickness of the glass layer can be set to be greater than 1.

[0046] In one embodiment, before performing step S3, the glass particles generated by the devitrification process can be collected. The device and method for collecting the glass particles are conventionally selected in the art and are not specifically required in this application.

[0047] In one embodiment, the honeycomb milling cutter used in the present disclosure has a blade length of 37-70 mm and a blade diameter of 5-8 mm.

[0048] In a preferred embodiment, the blade length and blade diameter of the honeycomb milling cutter used in the present invention can be flexibly adjusted according to the processing method and actual usage. For example, the blade length of the honeycomb milling cutter can be any one of 37mm, 40mm, 45mm, 50mm, 55mm, 60mm, 65mm and 70mm or any two of the range; the blade diameter of the honeycomb milling cutter can be any one of 5mm, 5.5mm, 6mm, 6.5mm, 7mm, 7.5mm and 8mm or any two of the range.

[0049] In this embodiment, a honeycomb milling cutter with appropriate parameters is used for processing according to the total thickness of the EVA layer 2, the silicon cell layer 3 and the EVA layer 4, so that the EVA-silicon cell-EVA layer on the backplane can be processed, avoiding the replacement of the milling cutter head during the grinding process, which affects the efficiency of the recycling process.

[0050] In one embodiment, the honeycomb milling cutter described in the present disclosure may be in the form of a face milling cutter, an end milling cutter, a roughing milling cutter, a peripheral milling cutter, and a side milling cutter.

[0051] In a preferred embodiment, the honeycomb milling cutter described in the present disclosure is in the form of a peripheral milling cutter or a side milling cutter. In this embodiment, by using a suitable type of honeycomb milling cutter and a suitable processing method, the material layer on the back plate can be accurately removed to obtain a mixed powder containing EVA, silicon powder and solder strip particles and a complete and clean back plate. After the back plate is recycled, it can continue to be used as a new back plate of a photovoltaic module, which can not only reduce the pollution of the back plate material to the environment, but also save the production cost of the photovoltaic module.

[0052] In one embodiment, the rotation speed of the honeycomb milling cutter during the deglazing process is 320-360 rpm.

[0053] In a preferred embodiment, the rotational speed of the honeycomb milling cutter used in the present invention can be flexibly adjusted according to the processing method and actual usage. For example, the rotational speed can be in the range of any one or any two of 320 rpm, 325 rpm, 330 rpm, 335 rpm, 340 rpm, 345 rpm, 350 rpm, 355 rpm and 360 rpm.

[0054] In one embodiment, the feed speed of the honeycomb milling cutter used in the present disclosure is 10-20 mm / min.

[0055] In a preferred embodiment, the feed speed of the honeycomb milling cutter used in the present invention can be in the range of any one or any two of 10mm / min, 11mm / min, 12mm / min, 13mm / min, 14mm / min, 15mm / min, 16mm / min, 17mm / min, 18mm / min, 19mm / min and 20mm / min.

[0056] In this embodiment, when performing the grinding process, with the coordination of appropriate milling cutter rotation speed and feed speed, the efficiency of the grinding process can be improved while ensuring the removal effect of the remaining EVA-silicon cell-EVA layer on the backplane.

[0057] In one embodiment, the processing thickness during the grinding process is 5 to 10 mm.

[0058] In a preferred embodiment, the processing thickness described in the present disclosure can be flexibly adjusted according to the thickness of the EVA-silicon cell-EVA layer. For example, the processing thickness can be in the range of any one or any two of 5 mm, 6 mm, 7 mm, 8 mm, 9 mm and 10 mm.

[0059] In one embodiment, the ratio of the processing thickness of the grinding process to the total thickness of the EVA layer 2, the silicon battery layer 3 and the EVA layer 4 is (0.90~1.01):1.

[0060] In a preferred embodiment, the ratio of the grinding thickness to the total thickness of the EVA layer 2 , the silicon cell layer 3 and the EVA layer 4 is (0.98-1):1.

[0061] In this embodiment, by selecting a suitable grinding thickness, the material on the back plate can be removed as much as possible, thereby increasing the purity and recovery rate of the recycled EVA material as much as possible. In addition, according to the actual recycling standard, if the purity of the recycled EVA material is not required to be high, the grinding thickness can be slightly greater than the total thickness of the EVA layer 2, the silicon cell layer 3 and the EVA layer 4.

[0062] In one embodiment, the purity of the EVA particles is 90-99% by weight, and the recovery rate of the EVA particles is 90-98%.

[0063] In a preferred embodiment, the purity of the EVA particles is 95-98% by weight, and the recovery rate of the EVA particles is 95-97%.

[0064] In one embodiment, the separation process includes gravity sorting and electrostatic sorting. In this embodiment, the gravity sorting process is to use the differences in specific gravity, friction coefficient and suspension speed between materials to separate, and has a better separation effect for materials with similar particle sizes but large differences in specific gravity, friction coefficient and suspension speed. The electrostatic sorting process is a method of achieving sorting by using the differences in electrical properties of each component in the solid material in the electrostatic field.

[0065] In one implementation, step S4 includes: S41, subjecting the mixed powder to gravity separation to obtain the welding ribbon particles and silicon-EVA mixed material; S42, subjecting the silicon-EVA mixture to electrostatic separation to obtain the silicon powder and the EVA particles.

[0066] In one embodiment, the gravity separation process described in the present disclosure is carried out in a 5XZ-6 wind-driven gravity separator, and the electrostatic separation process described in the present disclosure is carried out in an HB-1500 electrostatic separator.

[0067] In one embodiment, the particle size of the solder strip particles is 30-50 μm; the particle size of the silicon powder is 10-30 μm; and the particle size of the EVA particles is 30-50 μm.

[0068] In one embodiment, if Figure 1 As shown, the methods for recycling waste photovoltaic modules include: S1. Provide scrapped photovoltaic modules with aluminum alloy frames and junction boxes removed; S2, subjecting the waste photovoltaic assembly to a first preheating treatment and then to a devitrification treatment using a toothed milling cutter, to obtain glass particles with a particle size of 50-100 μm and a devitrified solar cell assembly; wherein the conditions of the first preheating treatment include: a temperature of 140-160° C. and a time of 1-15 min; the number of teeth of the toothed milling cutter is 25-30, the blade length is 50-100 mm, and the blade diameter is 12-50 mm; the linear speed of the toothed milling cutter is 130-160 m / min, the treatment thickness is 10-15 mm, and the feed speed is 10-40 mm / min; S3, subjecting the deglazed cell sheet assembly to a second preheating treatment and then grinding it with a honeycomb milling cutter to obtain a completed backplane and mixed powder; the conditions of the second preheating treatment include: a temperature of 120-135°C, a time of 1-15 min; a blade length of the honeycomb milling cutter of 37-70 mm, a blade diameter of 5-8 mm, a rotation speed of the honeycomb milling cutter of 320-360 rpm, a processing thickness of 5-10 mm, and a feed speed of 10-20 mm / min; S41, subjecting the mixed powder to gravity separation to obtain the solder strip particles and silicon-EVA mixed material with a particle size of 30-50 μm; S42, subjecting the silicon-EVA mixture to electrostatic separation to obtain the silicon powder with a particle size of 10-30 μm and the EVA particles with a particle size of 30-50 μm.

[0069] The present disclosure is further illustrated below by way of examples, but the present disclosure is not limited thereby.

[0070] Example 1 Methods for recycling used PV panels include: S1. Provide a waste photovoltaic module with an aluminum alloy frame and a junction box removed; the thickness of the glass layer 1 of the photovoltaic module is 12 mm, the total thickness of the EVA layer 2, the silicon cell layer 3 and the EVA layer 4 is 8 mm, and the thickness of the back plate 5 is 5 mm; S2, subjecting the waste photovoltaic assembly to a first preheating treatment and then performing a devitrification treatment with a toothed milling cutter to obtain glass particles with a particle size of 80 μm and a devitrified solar cell assembly; wherein the conditions of the first preheating treatment include: a temperature of 145° C. and a time of 8 min; the number of teeth of the toothed milling cutter is 28, the blade length is 80 mm, and the blade diameter is 30 mm; the linear speed of the toothed milling cutter is 150 m / min, the processing thickness is 12 mm, and the feed speed is 20 mm / min; S3, subjecting the deglazed cell sheet assembly to a second preheating treatment and then grinding it with a honeycomb milling cutter to obtain a completed backplane and mixed powder; the conditions of the second preheating treatment include: a temperature of 130° C. and a time of 8 min; a blade length of 50 mm and a blade diameter of 6 mm, a rotation speed of 350 rpm, a processing thickness of 8 mm, and a feed speed of 15 mm / min; S41, subjecting the mixed powder to gravity separation to obtain the copper particles and silicon-EVA mixture with a particle size of 40 μm; S42, subjecting the silicon-EVA mixture to electrostatic separation to obtain the silicon powder with a particle size of 20 μm and the EVA particles with a particle size of 40 μm.

[0071] The purity and recovery rate of each material are shown in Table 1.

[0072] Comparative Example 1 The method for recycling waste photovoltaic modules is the same as that in Example 1, except that the waste photovoltaic modules are processed by traditional physical disassembly. The specific physical disassembly method includes: directly crushing, grinding and screening the waste photovoltaic modules. The purity and recovery rate of each material are shown in Table 1.

[0073] Table 1 Purity and recovery of each material in the examples and comparative examples

[0074] As shown in Table 1, according to the comparison of the data in Example 1 and Comparative Example 1, the glass layer is deglazed by using a toothed milling cutter, and the EVA-silicon cell-EVA layer is ground by using a honeycomb milling cutter to accurately remove the glass layer and the EVA-silicon cell-EVA layer on the backplane. On the one hand, the pollution of glass to other materials can be reduced, and the recovery rate and purity of the recycled glass particles can be improved; on the other hand, the residual EVA material on the backplane can be reduced to obtain a clean backplane, which can not only reduce the pollution of the backplane to the environment, but also reduce the difficulty of recycling and reusing the backplane, and reduce the cost and economic effect of recycling. In addition, since the mixed powder is composed of EVA material, silicon powder and solder strip particles, the difficulty and separation effect of the mixed powder separation process can be reduced, and the purity and recovery rate of each recycled material can be further improved.

[0075] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0076] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0077] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A method for recycling waste photovoltaic modules, characterized in that: The method includes: S1. Provide scrapped photovoltaic modules with aluminum alloy frames and junction boxes removed; S2, subjecting the waste photovoltaic components to a first preheating treatment and then to deglazing treatment using a toothed milling cutter, to obtain glass particles and deglazed cell components; S3, subjecting the deglazed cell sheet assembly to a second preheating treatment and then grinding it with a honeycomb milling cutter to obtain a complete back sheet and mixed powder; S4, subjecting the mixed powder to powder separation treatment to obtain welding strip particles, EVA particles and silicon powder.

2. The method according to claim 1, characterized in that: The conditions of the first preheating treatment include: a temperature of 140-160° C. and a time of 1-15 min.

3. The method according to claim 1, characterized in that The conditions of the second preheating treatment include: a temperature of 120-135° C. and a time of 1-15 min.

4. The method according to claim 1, characterized in that The tooth number of the toothed milling cutter is 25-30, the blade length is 50-100 mm, and the blade diameter is 12-50 mm.

5. The method according to claim 1, characterized in that The honeycomb milling cutter has a blade length of 37-70 mm and a blade diameter of 5-8 mm.

6. The method according to claim 1, characterized in that The conditions for the devitrification treatment include: the linear speed of the toothed milling cutter is 130-160 m / min, the treatment thickness is 10-15 mm, and the feed speed is 10-40 mm / min.

7. The method according to claim 1, characterized in that The grinding treatment conditions include: the rotation speed of the honeycomb milling cutter is 320-360 rpm, the processing thickness is 5-10 mm, and the feed speed is 10-20 mm / min.

8. The method according to claim 1, characterized in that The powder separation process includes gravity separation and electrostatic separation; Step S4 includes: S41, subjecting the mixed powder to gravity separation to obtain the welding ribbon particles and silicon-EVA mixed material; S42, subjecting the silicon-EVA mixture to electrostatic separation to obtain the silicon powder and the EVA particles.

9. The method according to claim 1, characterized in that: The particle size of the glass particles is 50-100 μm; The particle size of the solder strip particles is 30-50 μm; The particle size of the silicon powder is 10-30 μm; The particle size of the EVA particles is 30-50 μm.

10. The method according to claim 1, characterized in that The purity of the EVA particles is 90-99% by weight, and the recovery rate of the EVA particles is 90-98%.

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