Evaporation device and evaporation equipment

Abstract

The invention discloses an evaporation device and evaporation equipment. The evaporation device is used for depositing an evaporation material on a to-be-evaporated surface of a substrate, and comprises a lifting mechanism; the evaporation mechanism is arranged on the lifting mechanism and comprises a heating assembly, an evaporation source and a nozzle assembly; the evaporation source is used for storing evaporation materials, and the heating assembly is used for heating and gasifying the evaporation materials. The nozzle assembly is connected to one end of the evaporation source and comprises a plurality of nozzles arranged at intervals in the horizontal direction. The lifting mechanism is used for driving the evaporation mechanism to move back and forth in the vertical direction so as to spray an evaporation material to the to-be-evaporated surface; the evaporation source at least comprises a first area, a second area and a third area which are distributed in the horizontal direction, the heating assembly at least comprises a first heating piece, a second heating piece and a third heating piece, and the first heating piece, the second heating piece and the third heating piece are arranged in one-to-one correspondence with the first area, the second area and the third area. Through the arrangement, the problem that the film thickness uniformity is poor in the evaporation process of the evaporation equipment can be solved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to an evaporation device and an evaporation equipment. Background Art

[0002] Evaporation is the process of placing the evaporation material in a heating container and heating it to evaporate or sublime it, so that the evaporation material adheres to the surface where the coating is required to form a film.

[0003] The widely used OLED (Organic Light-Emitting Diode) evaporation mode is horizontal evaporation, where the substrate is placed horizontally and the evaporation source sprays gaseous molecules vertically upward to deposit them on the substrate surface. However, during horizontal evaporation, the substrate will collapse downward in the middle of the substrate due to its own gravity, resulting in abnormal bonding between the FMM (Fine Metal Mask) and the substrate during coating, thereby causing many defects such as color mixing and PPA (Patterned Photoresist Alignment) offset. In order to solve the bonding problem caused by the collapse of the substrate, a evaporation device has appeared in the industry, in which the substrate is perpendicular to the ground, the nozzles are arranged vertically, and the evaporation material is sprayed horizontally.

[0004] However, the evaporation device has the problem of poor uniformity of the film thickness of the evaporation material during the evaporation process. Summary of the invention

[0005] The present application mainly provides an evaporation device and an evaporation equipment to solve the problem of poor uniformity of film thickness of the evaporation material in the evaporation process of the evaporation equipment in the related art.

[0006] In order to solve the above technical problems, a technical solution adopted by the present application is: to provide an evaporation device for depositing an evaporation material on a surface to be evaporated of a substrate received in an evaporation chamber, wherein the surface to be evaporated is arranged perpendicular to the ground; comprising:

[0007] Lifting mechanism;

[0008] The evaporation mechanism is arranged on the lifting mechanism; the evaporation mechanism includes a heating component, an evaporation source and a nozzle component; the evaporation source is used to store the evaporation material, and the heating component is arranged on one side of the evaporation source to heat and vaporize the evaporation material stored in the evaporation source; the evaporation source extends in the horizontal direction, and the nozzle component is connected to one end of the evaporation source and is in fluid communication with the evaporation source; the nozzle component includes a plurality of nozzles arranged in the horizontal direction and spaced from each other, and the spraying direction of the nozzle is perpendicular to the surface to be evaporated;

[0009] Wherein, the lifting mechanism is used to drive the evaporation mechanism to move back and forth in the vertical direction to spray the evaporation material onto the surface to be evaporated;

[0010] The evaporation source includes at least a first region, a second region and a third region distributed in a horizontal direction, and the heating assembly includes at least a first heating element, a second heating element and a third heating element arranged in a horizontal direction, and the first heating element, the second heating element and the third heating element are arranged in a one-to-one correspondence with the first region, the second region and the third region.

[0011] In some embodiments, in the horizontal direction, the surface to be evaporated has a first area to be evaporated, a second area to be evaporated, and a third area to be evaporated, which are arranged in a one-to-one correspondence with the first area, the second area, and the third area;

[0012] The evaporation device includes a controller, and the controller is electrically connected to the heating component;

[0013] The controller is configured to adjust the heating power of at least one of the first heating element, the second heating element and the third heating element when it is detected that the film thickness difference of the vapor deposition material sprayed to any two of the first vapor deposition area, the second vapor deposition area and the third vapor deposition area exceeds a preset value.

[0014] In some embodiments, the controller is configured to, when it is detected that the film thickness difference of the vapor deposition material sprayed to any two of the first area to be vapor deposited, the second area to be vapor deposited, and the third area to be vapor deposited exceeds a preset value, increase the heating power of the heating element corresponding to the area to be vapor deposited with the smallest film thickness, so as to increase the spraying amount of the vapor deposition material in the area corresponding to the area to be vapor deposited with the smallest film thickness among the first area, the second area, and the third area;

[0015] And / or, reducing the heating power of the heating element corresponding to the area to be evaporated with the largest film thickness, so as to reduce the spraying amount of the evaporation material in the area corresponding to the area to be evaporated with the largest film thickness in the first area, the second area and the third area.

[0016] In some embodiments, the first heating element heats the first region by means of resistance heating; and / or,

[0017] The second heating element heats the second region by means of resistance heating; and / or,

[0018] The third heating element heats the third region by means of resistance heating.

[0019] In some embodiments, the lifting mechanism includes a lifting rail and a tray, the lifting rail extends in a vertical direction, the tray is slidably connected to the lifting rail, and the evaporation mechanism is disposed on the tray; the lifting rail has a first end and a second end opposite to each other, and the tray is configured to move back and forth between the first end and the second end in a vertical direction;

[0020] The evaporation device includes a controller, which is electrically connected to the lifting mechanism; the controller is configured to control the movement speed of the tray within a stroke between the first end and the second end to be variable.

[0021] In some embodiments, along the vertical direction, the second end is located on a side of the first end away from the ground; the travel between the first end and the second end includes a first travel segment, a second travel segment and a third travel segment arranged in sequence; the first travel segment is close to the first end, and the third travel segment is close to the second end;

[0022] In the first stroke section and the third stroke section, the evaporation material sprayed by the nozzle assembly does not contact the surface to be evaporated, and in the second stroke section, the evaporation material sprayed by the nozzle assembly contacts the surface to be evaporated;

[0023] The controller is configured to control the movement speeds of the tray in the first travel section, the second travel section and the third travel section to be different.

[0024] In some embodiments, the controller is configured to control the tray to perform accelerated motion in the first travel section; and / or,

[0025] Controlling the tray to move at a uniform speed in the second travel section; and / or,

[0026] The tray is controlled to perform deceleration movement in the third travel section.

[0027] In some embodiments, the controller is configured to adjust the movement speed of the tray when it is detected in the vertical direction that the film thickness difference of the vapor deposition material sprayed onto any two positions of the surface to be vapor deposited exceeds a preset value.

[0028] In some embodiments, the controller is configured to reduce the movement speed of the tray at the position corresponding to the smallest film thickness when it is detected in the vertical direction that the film thickness difference of the vapor deposition material sprayed onto the surface to be evaporated at any two positions exceeds a preset value; and / or increase the movement speed of the tray at the position corresponding to the largest film thickness.

[0029] In order to solve the above technical problems, another technical solution adopted by the present application is to provide a vapor deposition device, comprising:

[0030] Any evaporation device as described above;

[0031] An evaporation chamber, wherein a substrate is accommodated in the evaporation chamber; the substrate has a surface to be evaporated, and the surface to be evaporated is arranged perpendicular to the ground;

[0032] Wherein, the evaporation device is used to deposit evaporation material onto the surface to be evaporated.

[0033] The beneficial effect of the present application is that, different from the prior art, the present application discloses a vapor deposition device and a vapor deposition equipment. The evaporation device is used to deposit evaporation material on the surface to be evaporated of the substrate in the evaporation chamber, and the surface to be evaporated is arranged perpendicular to the ground; the evaporation device includes: a lifting mechanism; an evaporation mechanism, which is arranged on the lifting mechanism, and the evaporation mechanism includes a heating component, an evaporation source and a nozzle component; the evaporation source is used to store the evaporation material, and the heating component is arranged on one side of the evaporation source, and is used to heat and vaporize the evaporation material stored in the evaporation source; the evaporation source extends in the horizontal direction, and the nozzle component is connected to one end of the evaporation source and is in fluid communication with the evaporation source; the nozzle component includes a plurality of nozzles arranged in the horizontal direction and spaced from each other, and the spraying direction of the nozzle is perpendicular to the surface to be evaporated; wherein the lifting mechanism is used to drive the evaporation mechanism to move back and forth in the vertical direction to spray the evaporation material onto the surface to be evaporated; the evaporation source at least includes a first area, a second area and a third area distributed in the horizontal direction, and the heating component at least includes a first heating element, a second heating element and a third heating element arranged in the horizontal direction, and the first heating element, the second heating element and the third heating element are arranged in a one-to-one correspondence with the first area, the second area and the third area. By arranging multiple nozzles in the horizontal direction and driving the evaporation mechanism to move back and forth in the vertical direction by the lifting mechanism, the problem of uneven film thickness in the vertical direction caused by the influence of gravity during the horizontal movement of the evaporation material in the evaporation equipment in the related technology can be solved. At the same time, the heating component is set to a first heating element, a second heating element and a third heating element arranged in the horizontal direction, so that the first area, the second area and the third area of ​​the evaporation source can be heated respectively, so as to control the spraying amount of the evaporation material in different areas, which is beneficial to improve the uniformity of the film thickness in the horizontal direction, solve the problem of poor uniformity of the film thickness of the evaporation material in the evaporation equipment in the related technology during the evaporation process, improve the evaporation effect, reduce the problem of optical color coordinate deviation caused by abnormal film thickness, and improve the overall product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0035] Figure 1 is a schematic structural diagram of an evaporation device provided in one embodiment of the present application;

[0036] Figure 2 yes Figure 1 A side view structural schematic diagram of a vapor deposition device of a provided vapor deposition device;

[0037] Figure 3 yes Figure 2 A schematic diagram of the top view of the structure of the evaporation device is provided.

[0038] Figure Number:

[0039] 400, evaporation equipment; 300, evaporation chamber; 301, shell; 200, substrate; 201, surface to be evaporated; 202, first area to be evaporated; 203, second area to be evaporated; 204, third area to be evaporated; 100, evaporation device; 1, lifting mechanism; 11, lifting guide rail; 111, first end; 112, second end; 113, first stroke section; 114, second stroke section; 115, third stroke section; 12, tray; 2, evaporation mechanism; 21, heating assembly; 211, first heating element; 212, second heating element; 213, third heating element; 22, evaporation source; 221, first area; 222, second area; 223, third area; 23, nozzle assembly; 231, nozzle. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0041] The terms "first", "second", "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0042] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0043] See also Figures 1 to 3 , Figure 1 is a schematic diagram of the structure of a vapor deposition device provided in one embodiment of the present application, Figure 2 yes Figure 1 A side view structural diagram of a vapor deposition device of a vapor deposition device provided, Figure 3 yes Figure 2 A schematic diagram of the top view of the structure of the evaporation device is provided.

[0044] See also Figures 1 to 3 The embodiment of the present application provides an evaporation device 400, which includes an evaporation device 100 and an evaporation chamber 300. The evaporation chamber 300 contains a substrate 200, and the substrate 200 has a surface to be evaporated 201, which is arranged perpendicular to the ground. The evaporation device 100 is used to deposit evaporation material on the surface to be evaporated 201.

[0045] Specifically, the evaporation chamber 300 is formed by a shell 301, and the substrate 200 is disposed in the evaporation chamber 300. In some embodiments, the evaporation device 100 is disposed in the evaporation chamber 300 and is spaced apart on one side of the substrate 200 to facilitate evaporation on the surface 201 to be evaporated of the substrate 200 in the evaporation chamber 300 to complete the evaporation process.

[0046] In other embodiments, the evaporation device 100 may also be partially or completely located outside the evaporation chamber 300, as long as the evaporation material sprayed by the evaporation device 100 onto the surface 201 to be evaporated of the substrate 200 can be deposited on the surface 201 to be evaporated of the substrate 200 accommodated in the evaporation chamber 300, evaporation on the surface 201 to be evaporated can be achieved.

[0047] Specifically, Figure 2 and Figure 3 As shown, the evaporation device 100 includes a lifting mechanism 1 and an evaporation mechanism 2, and the evaporation mechanism 2 is arranged on the lifting mechanism 1. The evaporation mechanism 2 includes a heating component 21, an evaporation source 22 and a nozzle component 23. The evaporation source 22 is used to store the evaporation material. The heating component 21 is arranged on one side of the evaporation source 22 and is used to heat and gasify the evaporation material stored in the evaporation source 22 to evaporate or sublimate it to form gaseous molecules. Specifically, as Figure 2 and Figure 3As shown, the evaporation source 22 extends in the horizontal direction, the nozzle assembly 23 is connected to one end of the evaporation source 22 and is in fluid communication with the evaporation source 22, the nozzle assembly 23 includes a plurality of nozzles 231, the plurality of nozzles 231 are arranged in the horizontal direction and spaced apart from each other, and the spraying direction of the nozzle 231 is perpendicular to the surface 201 to be evaporated.

[0048] The lifting mechanism 1 is used to drive the evaporation mechanism 2 to move back and forth in the vertical direction to spray the evaporation material onto the surface 201 to be evaporated of the substrate 200. That is, the evaporation material stored in the evaporation source 22 is heated and vaporized by the heating component 21 to form gaseous molecules and then sprayed onto the surface 201 to be evaporated through the nozzle 231. The lifting mechanism 1 drives the evaporation mechanism 2 to move up and down in the vertical direction perpendicular to the ground, so that the nozzle component 23 can move back and forth in the vertical direction, thereby being able to spray the evaporation material onto the entire surface 201 to be evaporated, so that the evaporation material can be deposited on the surface 201 to be evaporated.

[0049] In some embodiments, Figure 3 As shown, the evaporation source 22 at least includes a first region 221, a second region 222 and a third region 223 distributed in the horizontal direction, and the heating assembly 21 at least includes a first heating element 211, a second heating element 212 and a third heating element 213 arranged in the horizontal direction, and the first heating element 211, the second heating element 212 and the third heating element 213 are arranged in a one-to-one correspondence with the first region 221, the second region 222 and the third region 223. That is, the first heating element 211 is arranged in correspondence with the first region 221, and is used to heat the evaporation material stored in the first region 221 of the evaporation source 22; the second heating element 212 is arranged in correspondence with the second region 222, and is used to heat the evaporation material stored in the second region 222 of the evaporation source 22; the third heating element 213 is arranged in correspondence with the third region 223, and is used to heat the evaporation material stored in the third region 223 of the evaporation source 22.

[0050] It can be understood that in the embodiment of the present application, by setting the surface 201 of the substrate 200 to be evaporated vertically to the ground, and the multiple nozzles 231 of the nozzle assembly 23 are arranged in the horizontal direction, the evaporation device 100 adopts vertical evaporation (the substrate 200 is set vertically to the ground, and the nozzle assembly 23 sprays the evaporation material horizontally) to perform evaporation, and the lifting mechanism 1 drives the evaporation mechanism 2 to move back and forth in the vertical direction, and the nozzle assembly 23 is movable in the vertical direction, so that the evaporation material is uniformly deposited on different positions of the surface 201 of the substrate 200 to be evaporated in the vertical direction, so that in the vertical direction, the amount of evaporation material attached to different positions of the surface 201 to be evaporated is basically the same, which is beneficial to improve the uniformity of the film thickness of the evaporation material on the surface 201 to be evaporated, and can solve the problem that the evaporation device 400 in the related art is arranged to arrange the nozzles 231 vertically, and the evaporation material is sprayed toward the surface 201 to be evaporated by the nozzles 231. The evaporation material is sprayed horizontally. In the process of moving to the surface 201 to be evaporated, the film thickness of the evaporated material evaporated on the surface 201 to be evaporated is uneven in the vertical direction due to the influence of the gravity of the evaporated material; at the same time, the heating component 21 is set to the first heating element 211, the second heating element 212 and the third heating element 213 arranged in the horizontal direction, and the first area 221, the second area 222 and the third area 223 in the horizontal direction of the evaporation source 22 can be heated respectively, so that the spraying amount of the evaporated material in different areas of the evaporation source 22 in the horizontal direction can be adjusted and controlled, so that even if the film thickness uniformity in the horizontal direction is not good, the first heating element 211, the second heating element 212 and the third heating element 213 can be adjusted online, and then the spraying amount of the evaporated material in the first area 221, the second area 222 and the third area 223 is adjusted, which is beneficial to improve the film thickness uniformity of the evaporated material on the surface 201 to be evaporated in the horizontal direction.

[0051] The above arrangement can reduce or even eliminate the influence of gravity on the evaporation material during the eruption process during vertical evaporation, and can adjust the film thickness uniformity of the evaporation material on the surface 201 to be evaporated online, providing online adjustment space for the film thickness uniformity of the product production process, solving the problem of poor film thickness uniformity and reduced product yield in the evaporation equipment 400 in the related technology during the evaporation process, improving the evaporation effect, reducing the problem of optical color coordinate offset caused by abnormal film thickness, and helping to improve the overall product yield. Through the above structure, an adjustable range is provided for adjusting the film thickness of the evaporation material, avoiding the situation that the evaporation equipment 400 of the current vertical evaporation method cannot adjust the film thickness uniformity online.

[0052] Specifically, in some embodiments, Figure 2 and Figure 3As shown, the heating component 21 is sleeved on the bottom of the evaporation source 22 and partially wraps the side of the evaporation source 22 to heat the evaporation material stored in the evaporation source 22 to vaporize it. In some embodiments, the heating component 21 uses resistance heating to heat the evaporation source 22 using the heat generated by the current passing through the resistance material.

[0053] Specifically, the first heating element 211 heats the first region 221 by resistive heating, and / or the second heating element 212 heats the second region 222 by resistive heating, and / or the third heating element 213 heats the third region 223 by resistive heating. For example, the first heating element 211 and / or the second heating element 212 and / or the third heating element 213 can be any one of a resistance wire, a resistance plate, a resistance film, and a resistance coating. The materials of the first heating element 211, the second heating element 212, and the third heating element 213 can be the same or different, and can be designed as needed. By energizing the first heating element 211 and / or the second heating element 212 and / or the third heating element 213, it can heat the evaporation material of the first region 221 and / or the second region 222 and / or the third region 223 in the energized state.

[0054] In a specific embodiment, the first heating element 211, the second heating element 212, and the third heating element 213 all use resistance heating to heat the evaporation source 22. The first heating element 211, the second heating element 212, and the third heating element 213 are all resistance wires, and the materials and shapes of the first heating element 211, the second heating element 212, and the third heating element 213 are the same. It can be understood that setting the first heating element 211, the second heating element 212, and the third heating element 213 to the same material and structure can make the first area 221, the second area 222, and the third area 223 more uniformly heated in the horizontal direction, thereby improving the consistency of the ejection amount of the evaporation material in the horizontal direction, which is conducive to improving the uniformity of the film thickness in the horizontal direction of the surface 201 to be evaporated.

[0055] In other embodiments, the first heating element 211, the second heating element 212, and the third heating element 213 may also be made of different materials and structures, for example, the first heating element 211 is made of a resistance wire, the second heating element 212 is made of a resistance film, and the third heating element 213 is made of a resistance paint; or, the first heating element 211, the second heating element 212, and the third heating element 213 may also be heated by different heating methods to heat the evaporation source 22, for example, electromagnetic induction heating, infrared heating, and other heating methods. The specific materials, structures, and heating methods of the first heating element 211, the second heating element 212, and the third heating element 213 may be designed as needed, as long as the first heating element 211, the second heating element 212, and the third heating element 213 can heat the first region 221, the second region 222, and the third region 223 of the evaporation source 22, respectively, so as to facilitate the control of the amount of the evaporation material sprayed from different regions of the evaporation source 22.

[0056] Specifically, in some embodiments, Figure 3 As shown, in the horizontal direction, the surface to be evaporated 201 of the substrate 200 has a first area to be evaporated 202, a second area to be evaporated 203 and a third area to be evaporated 204 which are arranged in a one-to-one correspondence with the first area 221, the second area 222 and the third area 223 of the evaporation source 22, that is, in the horizontal direction, the first area to be evaporated 202 of the surface to be evaporated 201 is arranged corresponding to the first area 221 of the evaporation source 22, the second area to be evaporated 203 of the surface to be evaporated 201 is arranged corresponding to the second area 222 of the evaporation source 22, and the third area to be evaporated 204 of the surface to be evaporated 201 is arranged corresponding to the third area 223 of the evaporation source 22.

[0057] The evaporation device 100 also includes a controller (not shown), which is electrically connected to the heating assembly 21. Specifically, the controller is electrically connected to the first heating element 211, the second heating element 212 and the third heating element 213 of the heating assembly 21. The controller is configured to adjust the heating power of at least one of the first heating element 211, the second heating element 212 and the third heating element 213 when it is detected that the film thickness difference of the evaporation material sprayed to any two of the first evaporation area 202, the second evaporation area 203 and the third evaporation area 204 exceeds a preset value. Specifically, in some embodiments, the preset value can be a specific value or a range of values, which can be designed as needed. The specific value or range of the preset value can be set based on experience, or can also be set according to the evaporation accuracy requirements of the surface 201 to be evaporated.

[0058] It can be understood that the heating power of the first heating element 211, the second heating element 212 and the third heating element 213 affects the heating effect on the evaporated material stored in the first area 221, the second area 222 and the third area 223 of the evaporation source 22, which in turn affects the ejection amount of the evaporated material in the first area 221, the second area 222 and the third area 223 of the evaporation source 22 corresponding to the first heating element 211, the second heating element 212 and the third heating element 213 respectively. By controlling the heating power of the first heating element 211, the second heating element 212 and the third heating element 213 by the controller, when it is detected that the film thickness difference of the vapor deposition material sprayed to any two of the first vapor deposition area 202, the second vapor deposition area 203 and the third vapor deposition area 204 exceeds a preset value, the heating power of the first heating element 211, the second heating element 212 and the third heating element 213 can be adjusted in time, so that the film thickness difference of the first vapor deposition area 202, the second vapor deposition area 203 and the third vapor deposition area 204 in the horizontal direction does not exceed the preset value, and the film thickness difference of the vapor deposition material in the horizontal direction of the vapor deposition device 100 during the vapor deposition process is online regulated to improve the film thickness uniformity of the vapor deposition material in the horizontal direction.

[0059] Specifically, in some embodiments, the controller is configured to increase the heating power of the heating element corresponding to the area to be evaporated with the smallest film thickness when it is detected that the difference in film thickness of the evaporation material sprayed to any two areas to be evaporated among the first area to be evaporated 202, the second area to be evaporated 203 and the third area to be evaporated 204 exceeds a preset value, so as to increase the spraying amount of the evaporation material in the area corresponding to the area to be evaporated with the smallest film thickness among the first area 221, the second area 222 and the third area 223, thereby increasing the film thickness of the evaporation material in the area to be evaporated with the smallest film thickness, so that the difference in film thickness of the evaporation material between the area to be evaporated with the largest film thickness and the area to be evaporated with the smallest film thickness does not exceed the preset value.

[0060] For example, when it is detected that the film thickness of the vapor deposition material in the second area to be vapor deposited 203 is the largest and the film thickness of the vapor deposition material in the first area to be vapor deposited 202 is the smallest, and the difference in film thickness between the first area to be vapor deposited 202 and the second area to be vapor deposited 203 exceeds a preset value, the heating power of the first heating element 211 corresponding to the first area to be vapor deposited 202 with the smallest film thickness is increased to increase the spraying amount of the vapor deposition material in the first area 221 corresponding to the first area to be vapor deposited 202 with the smallest film thickness, thereby increasing the film thickness of the vapor deposition material in the first area to be vapor deposited 202, so that the difference in film thickness between the vapor deposition material sprayed to the first area to be vapor deposited 202 and the second area to be vapor deposited 203 does not exceed the preset value. That is, in the first area to be evaporated 202, the second area to be evaporated 203 and the third area to be evaporated 204, the difference in film thickness of the evaporated materials in the area to be evaporated with the largest film thickness and the area to be evaporated with the smallest film thickness does not exceed the preset value, that is, the difference in film thickness of the evaporated materials in any two areas to be evaporated does not exceed the preset value, thereby improving the uniformity of the film thickness of the evaporated material on the surface to be evaporated 201 of the substrate 200 in the horizontal direction, so that the film thickness of the evaporated material deposited on the surface to be evaporated 201 of the substrate 200 reaches the required thickness, thereby improving the evaporation effect.

[0061] In other embodiments, the controller is configured to reduce the heating power of the heating element corresponding to the area to be evaporated with the largest film thickness when it detects that the difference in film thickness of the evaporation material sprayed to any two areas to be evaporated among the first area to be evaporated 202, the second area to be evaporated 203 and the third area to be evaporated 204 exceeds a preset value, so as to reduce the spraying amount of the evaporation material in the areas corresponding to the areas to be evaporated with the largest film thickness among the first area 221, the second area 222 and the third area 223, thereby reducing the film thickness of the evaporation material in the area to be evaporated with the largest film thickness, so that the difference in film thickness of the evaporation material in the area to be evaporated with the largest film thickness and the area to be evaporated with the smallest film thickness does not exceed the preset value.

[0062] For example, it is detected that the film thickness of the vapor deposition material in the third area to be vapor deposited 204 is the largest, the film thickness of the vapor deposition material in the first area to be vapor deposited 202 is the smallest, and the difference in film thickness sprayed to the first area to be vapor deposited 202 and the third area to be vapor deposited 204 exceeds a preset value, and the heating power of the third heating element 213 corresponding to the third area to be vapor deposited 204 with the largest film thickness is reduced to reduce the spraying amount of the vapor deposition material in the third area 223 corresponding to the third area to be vapor deposited 204 with the largest film thickness, thereby reducing the film thickness of the vapor deposition material in the third area to be vapor deposited 204, so that the difference in film thickness of the vapor deposition material sprayed to the first area to be vapor deposited 202 and the third area to be vapor deposited 204 does not exceed a preset value, thereby improving the uniformity of the film thickness of the vapor deposition material on the vapor deposition surface 201 of the substrate 200 in the horizontal direction, thereby improving the vapor deposition effect.

[0063] In other embodiments, the heating power of the heating element corresponding to the area to be evaporated with the smallest film thickness can be increased, and at the same time, the heating power of the heating element corresponding to the area to be evaporated with the largest film thickness can be reduced, so as to increase the spraying amount of the evaporation material in the area corresponding to the area to be evaporated with the smallest film thickness among the first area 221, the second area 222 and the third area 223, and at the same time, reduce the spraying amount of the evaporation material in the area corresponding to the area to be evaporated with the largest film thickness among the first area 221, the second area 222 and the third area 223, so as to more efficiently ensure that the difference in film thickness of the evaporation material sprayed to any two areas to be evaporated among the first area 202, the second area 203 and the third area 204 does not exceed a preset value, so as to more efficiently improve the uniformity of the film thickness of the evaporation material on the surface 201 of the substrate 200 to be evaporated in the horizontal direction, thereby improving the evaporation effect.

[0064] In other embodiments, in the horizontal direction, the evaporation source 22 may be distributed with other number of regions, for example, the evaporation source 22 may include any number of regions such as two, four, five, six, etc., and the heating assembly 21 may also be provided with other number of heating elements corresponding to the regions of the evaporation source 22, so as to heat different regions of the evaporation source 22 respectively by using different heating elements. For example, the evaporation source 22 may only include the first region 221 and the second region 222 distributed in the horizontal direction, and the heating assembly 21 may only include the first heating element 211 and the second heating element 212 arranged in the horizontal direction and arranged one-to-one with the first region 221 and the second region 222; or, the evaporation source 22 may also include the fourth region or the fifth region, and the heating assembly 21 may also include the fourth heating element arranged corresponding to the fourth region of the evaporation source 22 or the fifth heating element arranged corresponding to the fifth region of the evaporation source 22. In the horizontal direction, the division of the regions of the evaporation source 22 and the specific number of the heating elements of the heating assembly 21 may be designed as needed, and the present application does not limit this. It can be understood that in the horizontal direction, the more areas of the evaporation source 22 there are, the more corresponding heating elements in the heating assembly 21 are, which is more conducive to more precise control of the ejection amount of the evaporation material in different areas of the evaporation source 22 in the horizontal direction, thereby being more conducive to achieving the regulation of the uniformity of the film thickness on the to-be-evaporated surface 201 of the substrate 200 in the horizontal direction, and more conducive to improving the uniformity of the film thickness in the horizontal direction.

[0065] See also Figure 2 and Figure 3In some embodiments, the lifting mechanism 1 includes a lifting rail 11 and a tray 12, the lifting rail 11 extends in the vertical direction, specifically, the lifting rail 11 is arranged perpendicular to the ground, the tray 12 is slidably connected to the lifting rail 11, and the evaporation mechanism 2 is arranged on the tray 12. The lifting rail 11 has a first end 111 and a second end 112 opposite to each other in the vertical direction, and the tray 12 is configured to move back and forth between the first end 111 and the second end 112 of the lifting rail 11 in the vertical direction, thereby driving the evaporation mechanism 2 to move back and forth in the vertical direction, and then spraying the evaporation material back and forth on the to-be-evaporated surface 201 of the substrate 200 in the vertical direction. It can be understood that since the multiple nozzles 231 of the nozzle assembly 23 are arranged horizontally, the evaporation mechanism 2 is driven to move back and forth in the vertical direction by the tray 12, and the nozzle assembly 23 can move back and forth in the vertical direction, so as to evenly deposit the evaporation material back and forth on different positions of the surface 201 to be evaporated of the substrate 200 in the vertical direction, so that in the vertical direction, the amount of evaporation material attached to different positions of the surface 201 to be evaporated is basically the same, which is beneficial to improving the uniformity of the film thickness of the evaporation material on the surface 201 to be evaporated in the vertical direction, and solves the problem of uneven film thickness of the evaporation material evaporated onto the surface 201 to be evaporated in the vertical direction due to the influence of the gravity of the evaporation material in the evaporation equipment 400 in the related art because the nozzles 231 are set to be arranged vertically.

[0066] In some embodiments, the controller is electrically connected to the lifting mechanism 1, and the controller is configured to control the movement speed of the tray 12 within the stroke between the first end 111 and the second end 112 to be variable, that is, the movement speed of the tray 12 within the stroke between the first end 111 and the second end 112 is not constant, so as to spray the evaporation material to the surface 201 to be evaporated of the substrate 200 more efficiently and evenly, thereby improving the evaporation efficiency.

[0067] Specifically, along the vertical direction, the second end 112 is located on the side of the first end 111 away from the ground, that is, the second end 112 is located on the top of the first end 111. In some embodiments, the stroke between the first end 111 and the second end 112 includes a first stroke section 113, a second stroke section 114, and a third stroke section 115, which are sequentially arranged. The first stroke section 113 is close to the first end 111, the third stroke section 115 is close to the second end 112, and the second stroke section 114 is located between the first stroke section 113 and the third stroke section 115. In the first stroke section 113 and the third stroke section 115, the evaporation material sprayed by the nozzle assembly 23 does not contact the surface 201 to be evaporated, and in the second stroke section 114, the evaporation material sprayed by the nozzle assembly 23 contacts the surface 201 to be evaporated. That is, when the tray 12 moves in the first stroke section 113 and the third stroke section 115, the evaporation material sprayed by the nozzle assembly 23 of the evaporation mechanism 2 located on the tray 12 will not be sprayed onto the surface 201 to be evaporated. Only when the tray 12 moves in the second stroke section 114, the evaporation material sprayed by the nozzle assembly 23 of the evaporation mechanism 2 located on the tray 12 will be sprayed onto the surface 201 to be evaporated of the substrate 200. That is, the surface 201 to be evaporated of the substrate 200 is located within the spraying range of the nozzle assembly 23 when the tray 12 moves in the second stroke section 114.

[0068] In a specific embodiment, Figure 2 and Figure 3 As shown, the size of the substrate 200 in the horizontal direction is substantially consistent with the width of the nozzle assembly 23, ensuring that the evaporation material sprayed by the nozzle assembly 23 can cover the surface 201 to be evaporated of the substrate 200 in the horizontal direction. The nozzle assembly 23 of the evaporation mechanism 2 is connected to the end of the evaporation source 22 away from the tray 12. The evaporation source 22 itself has a height, so there is a height difference between the tray 12 and the nozzle assembly 23. In the vertical direction, the height of the bottom end of the substrate 200 is higher than the height of the end of the second stroke section 114 close to the first stroke section 113, and the height of the top end of the substrate 200 is higher than the height of the end of the second stroke section 114 close to the third stroke section 115, so as to ensure that when the tray 12 moves in the second stroke section 114 in the vertical direction, the surface 201 to be evaporated of the substrate 200 can be located within the spraying range of the nozzle assembly 23.

[0069] In some embodiments, the controller is configured to control the tray 12 to move at different speeds in the first travel section 113, the second travel section 114, and the third travel section 115. Specifically, in some embodiments, the controller is configured to control the tray 12 to move at an accelerated speed in the first travel section 113; and / or, in some embodiments, the controller is configured to control the tray 12 to move at a uniform speed in the second travel section 114; and / or, in some embodiments, the controller is configured to control the tray 12 to move at a decelerated speed in the third travel section 115.

[0070] It can be understood that after the substrate 200 enters the evaporation chamber 300, the lifting mechanism 1 drives the evaporation source 22 and the nozzle assembly 23 to perform lifting and lowering movements perpendicular to the ground. When the tray 12 moves in the first stroke section 113 and the third stroke section 115, the evaporation material sprayed by the nozzle assembly 23 does not contact the surface 201 of the substrate 200 to be evaporated. Controlling the tray 12 to perform accelerated movement in the first stroke section 113 can enable the nozzle assembly 23 to reach the second stroke section 114 position as soon as possible, so that the evaporation material sprayed by the nozzle assembly 23 can contact the surface 201 of the substrate 200 to be evaporated as soon as possible, thereby helping to improve the evaporation efficiency of the evaporation device 100. Controlling the tray 12 to perform deceleration movement in the third stroke section 115 can prevent the tray 12 from moving too fast in the third stroke section 115, causing the tray 12 to collide with the second end 112 of the lifting guide rail 11, thereby affecting the stability of the tray 12 in the third stroke section 115, and further affecting the stability of the evaporation mechanism 2, so that the nozzle assembly 23 can be stably returned to the second stroke section 114 to re-spray the evaporation material on the evaporation surface 201. When the second stroke section 114 moves, the evaporation material sprayed by the nozzle assembly 23 contacts the evaporation surface 201 of the substrate 200. The speed of the tray 12 in the second stroke section 114 is set to a uniform speed. Since the movement speed of the tray 12 does not change, it is more conducive to uniformly spraying the evaporation material on the evaporation surface 201 of the substrate 200. Therefore, the film thickness of the evaporation material attached to the upper and lower sides of the evaporation surface 201 of the substrate 200 is theoretically consistent, which is more conducive to improving the uniformity of the film thickness of the evaporation material on the evaporation surface 201.

[0071] In some embodiments, the controller is configured to adjust the movement speed of the tray 12 when it is detected that the film thickness difference of the evaporation material sprayed to any two positions of the surface to be evaporated 201 exceeds a preset value in the vertical direction. By adjusting the movement speed of the tray 12, the speed of the nozzle assembly 23 passing through the surface to be evaporated 201 of the substrate 200 is adjusted, and then the film thickness at different positions of the surface to be evaporated 201 of the substrate 200 is adjusted, so that in the vertical direction, the film thickness difference of the evaporation material sprayed to any two positions of the surface to be evaporated 201 does not exceed the preset value, so that the film thickness of the evaporation material at different positions of the surface to be evaporated 201 of the substrate 200 is more uniform, and the uniformity of the film thickness of the evaporation material on the surface to be evaporated 201 of the substrate 200 in the vertical direction is improved.

[0072] Specifically, in some embodiments, the controller is configured to reduce the movement speed of the tray 12 at the position corresponding to the minimum film thickness when it is detected that the film thickness difference of the evaporation material sprayed to any two positions of the surface to be evaporated 201 exceeds a preset value in the vertical direction. Specifically, when the nozzle 231 of the nozzle assembly 23 passes the position with the minimum film thickness, the movement speed of the tray 12 is reduced, so that the nozzle assembly 23 slowly passes the position with the minimum film thickness, so that the time required for the nozzle assembly 23 to pass the position is increased, and more evaporation material can be sprayed to the position with the minimum film thickness of the surface to be evaporated 201 to increase the amount of evaporation material at this position, thereby increasing the thickness of the evaporation material at the position with the minimum film thickness, and then in the vertical direction, the film thickness difference of the evaporation material sprayed to any two positions of the surface to be evaporated 201 does not exceed the preset value, that is, the film thickness difference between the position with the maximum film thickness and the position with the minimum film thickness of the surface to be evaporated 201 does not exceed the preset value, thereby improving the uniformity of the film thickness in the vertical direction.

[0073] In some embodiments, the controller is configured to increase the movement speed of the tray 12 at the position corresponding to the maximum film thickness when it is detected that the film thickness difference of the evaporation material sprayed to any two positions of the surface to be evaporated 201 exceeds a preset value in the vertical direction. Specifically, when the nozzle 231 of the nozzle assembly 23 passes the position with the maximum film thickness, the movement speed of the tray 12 is increased, so that the nozzle assembly 23 quickly passes the position with the maximum film thickness, so that the time required for the nozzle assembly 23 to pass the position is reduced, and less evaporation material can be sprayed to the position with the maximum film thickness of the surface to be evaporated 201 to reduce the amount of evaporation material at this position, thereby reducing the thickness of the evaporation material at the position with the maximum film thickness, and then in the vertical direction, the film thickness difference of the evaporation material sprayed to any two positions of the surface to be evaporated 201 does not exceed the preset value, that is, the film thickness difference between the position with the maximum film thickness and the position with the minimum film thickness of the surface to be evaporated 201 does not exceed the preset value, thereby improving the uniformity of the film thickness in the vertical direction.

[0074] In other embodiments, the lifting mechanism 1 may also be configured as other structures, for example, the lifting mechanism 1 may adopt other structures such as a spiral lifting mechanism, a hydraulic lifting mechanism, a ball screw lifting mechanism, etc., to achieve the lifting mechanism 1 driving the evaporation mechanism 2 to move back and forth in the vertical direction, thereby spraying the evaporation material on the to-be-evaporated surface 201 of the substrate 200. The specific structure of the lifting mechanism 1 may be selected or designed as needed, and this application does not limit this.

[0075] In some embodiments, the controller can also be configured to, when it is detected in the vertical direction that the difference in film thickness of the evaporation material sprayed to any two positions of the surface 201 to be evaporated exceeds a preset value, reduce the movement speed of the tray 12 at the position corresponding to the smallest film thickness, and at the same time, increase the movement speed of the tray 12 at the position corresponding to the largest film thickness, so as to increase the amount of evaporation material sprayed when the nozzle 231 of the nozzle assembly 23 passes through the position with the smallest film thickness, increase the thickness of the evaporation material at the position with the smallest film thickness, and at the same time, reduce the amount of evaporation material sprayed when the nozzle 231 of the nozzle assembly 23 passes through the position with the largest film thickness, and reduce the thickness of the evaporation material at the position with the largest film thickness, so that the difference in film thickness of the evaporation material sprayed to any two positions of the surface 201 to be evaporated does not exceed the preset value, thereby more efficiently improving the uniformity of the film thickness in the vertical direction, so that in the vertical direction, the film thickness of the evaporation material at each position of the surface 201 to be evaporated of the substrate 200 can reach the required thickness value, thereby improving the evaporation effect and thereby improving the product yield.

[0076] Specifically, in some embodiments, a film thickness detection device (not shown) can be provided in the evaporation device 100, so that the film thickness of the evaporation material on the surface to be evaporated 201 can be detected by the film thickness detection device in real time during the evaporation process, so as to facilitate real-time regulation of the vertical movement speed of the tray 12 and / or real-time regulation of the heating power of the first heating element 211, the second heating element 212 and the third heating element 213 when it is detected that the film thickness difference of the evaporation material sprayed to different positions of the surface to be evaporated 201 exceeds a preset value, so as to regulate the film thickness difference of the evaporation material on the surface to be evaporated 201 in the horizontal and vertical directions in real time online, which is beneficial to improving the evaporation accuracy, thereby ensuring that the evaporation material on the surface to be evaporated 201 of the substrate 200 has good film thickness uniformity in both the horizontal and vertical directions.

[0077] In other embodiments, the film thickness detection device may not be provided in the evaporation device 100, and the evaporation material may be evaporated on the surface 201 of the substrate 200 by the evaporation device 100, that is, after the evaporation is completed, other detection mechanisms in the later stage of the process may be used to detect the film thickness of the evaporation material on the surface 201 of the substrate 200. When the detection mechanism detects that the uniformity difference of the film thickness of the evaporation material in the horizontal direction becomes larger, for example, when the film thickness difference of the evaporation material in any two of the first evaporation area 202, the second evaporation area 203 and the third evaporation area 204 of the surface 201 to be evaporated exceeds a preset value, the amount of the evaporation material sprayed at the corresponding parts is adjusted by adjusting the heating power of the first heating element 211, the second heating element 212 and the third heating element 213, so as to ensure the uniformity of the film thickness in the horizontal direction. When the detection mechanism detects that the uniformity difference of the film thickness of the evaporation material in the vertical direction becomes larger, for example, when the film thickness difference of the evaporation material at any two positions of the surface to be evaporated 201 detected in the vertical direction exceeds the preset value, the film thickness of the evaporation material on the surface to be evaporated 201 is regulated by adjusting the movement speed of the tray 12 and adjusting the movement speed of the nozzle assembly 23 passing through different positions of the surface to be evaporated 201. Specifically, when passing through a position with a larger film thickness, the movement speed of the tray 12 can be increased, so that the nozzle assembly 23 passes through the position quickly to reduce the amount of the evaporation material at the position, and / or, when passing through a position with a smaller film thickness, the movement speed of the tray 12 can be reduced, so that the nozzle assembly 23 passes through the position slowly to increase the amount of the evaporation material at the position, thereby ensuring the uniformity of the film thickness in the vertical direction.

[0078] That is, in this embodiment, after the evaporation is completed on one substrate 200, the movement speed of the tray 12 of the evaporation device 100 and / or the heating power of different heating elements of the heating assembly 21 can be adjusted online through the film thickness difference of the evaporation material detected by the detection mechanism in the later stage of the process, so that when the evaporation device 100 evaporates the next substrate 200, the film thickness difference can be eliminated by online regulation, so as to ensure that the amount of evaporation material attached to each position of the surface 201 to be evaporated of the next substrate 200 is consistent, and the film thickness uniformity of the evaporation material of the next substrate 200 is improved. In this embodiment, the evaporation device 100 does not need to be provided with a separate film thickness detection device, which can reduce the cost of the evaporation device 100, and there is no need to detect the film thickness of the evaporation material on the surface 201 to be evaporated of the current substrate 200 in real time during the evaporation process, which is conducive to improving the evaporation efficiency.

[0079] Specifically, whether to set up a separate film thickness detection device in the evaporation device 100 can be selected and designed according to needs, and this application does not limit this.

[0080] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A vapor deposition device, used for depositing vapor deposition material on a surface to be vapor deposited of a substrate received in a vapor deposition chamber, wherein the surface to be vapor deposited is arranged perpendicular to the ground; characterized in that: include: Lifting mechanism; A vapor deposition mechanism, arranged on the lifting mechanism; The evaporation mechanism includes a heating component, an evaporation source and a nozzle component; the evaporation source is used to store evaporation materials, and the heating component is arranged on one side of the evaporation source to heat and vaporize the evaporation materials stored in the evaporation source; The evaporation source extends in a horizontal direction, the nozzle assembly is connected to one end of the evaporation source and is in fluid communication with the evaporation source; the nozzle assembly comprises a plurality of nozzles arranged in a horizontal direction and spaced apart from each other, and the spraying direction of the nozzles is perpendicular to the surface to be evaporated; Wherein, the lifting mechanism is used to drive the evaporation mechanism to move back and forth in the vertical direction to spray the evaporation material onto the surface to be evaporated; The evaporation source includes at least a first region, a second region and a third region distributed in a horizontal direction, and the heating assembly includes at least a first heating element, a second heating element and a third heating element arranged in a horizontal direction, and the first heating element, the second heating element and the third heating element are arranged in a one-to-one correspondence with the first region, the second region and the third region.

2. The evaporation device according to claim 1, characterized in that: In the horizontal direction, the surface to be evaporated has a first area to be evaporated, a second area to be evaporated, and a third area to be evaporated, which are arranged in a one-to-one correspondence with the first area, the second area, and the third area; The evaporation device includes a controller, and the controller is electrically connected to the heating component; The controller is configured to adjust the heating power of at least one of the first heating element, the second heating element and the third heating element when it is detected that the film thickness difference of the vapor deposition material sprayed to any two of the first vapor deposition area, the second vapor deposition area and the third vapor deposition area exceeds a preset value.

3. The evaporation device according to claim 2, characterized in that: The controller is configured to, when it is detected that the film thickness difference of the vapor deposition material sprayed to any two of the first area to be vapor deposited, the second area to be vapor deposited, and the third area to be vapor deposited exceeds a preset value, increase the heating power of the heating element corresponding to the area to be vapor deposited with the smallest film thickness, so as to increase the spraying amount of the vapor deposition material in the area corresponding to the area to be vapor deposited with the smallest film thickness among the first area, the second area, and the third area; And / or, reducing the heating power of the heating element corresponding to the area to be evaporated with the largest film thickness, so as to reduce the spraying amount of the evaporation material in the area corresponding to the area to be evaporated with the largest film thickness in the first area, the second area and the third area.

4. The evaporation device according to claim 1, characterized in that: The first heating element heats the first region by means of resistance heating; and / or, The second heating element heats the second region by means of resistance heating; and / or, The third heating element heats the third region by means of resistance heating.

5. The evaporation device according to claim 1, characterized in that: The lifting mechanism comprises a lifting rail and a tray, wherein the lifting rail extends in a vertical direction, the tray is slidably connected to the lifting rail, and the evaporation mechanism is arranged on the tray; the lifting rail has a first end and a second end opposite to each other, and the tray is configured to move back and forth between the first end and the second end in a vertical direction; The evaporation device includes a controller, which is electrically connected to the lifting mechanism; the controller is configured to control the movement speed of the tray within a stroke between the first end and the second end to be variable.

6. The evaporation device according to claim 5, characterized in that: In the vertical direction, the second end is located on a side of the first end away from the ground; the travel between the first end and the second end includes a first travel segment, a second travel segment and a third travel segment arranged in sequence; the first travel segment is close to the first end, and the third travel segment is close to the second end; In the first stroke section and the third stroke section, the evaporation material sprayed by the nozzle assembly does not contact the surface to be evaporated, and in the second stroke section, the evaporation material sprayed by the nozzle assembly contacts the surface to be evaporated; The controller is configured to control the movement speeds of the tray in the first travel section, the second travel section and the third travel section to be different.

7. The evaporation device according to claim 6, characterized in that: The controller is configured to control the tray to perform accelerated motion in the first travel section; and / or, Controlling the tray to move at a uniform speed in the second travel section; and / or, The tray is controlled to perform deceleration movement in the third travel section.

8. The evaporation device according to claim 5, characterized in that: The controller is configured to adjust the movement speed of the tray when it is detected in the vertical direction that a film thickness difference of the vapor deposition material sprayed onto any two positions of the surface to be vapor deposited exceeds a preset value.

9. The evaporation device according to claim 8, characterized in that: The controller is configured to, when it is detected in the vertical direction that the film thickness difference of the vapor deposition material sprayed onto any two positions of the vapor deposition surface exceeds a preset value, reduce the movement speed of the tray at the position corresponding to the smallest film thickness; and / or increase the movement speed of the tray at the position corresponding to the largest film thickness.

10. A vapor deposition device, characterized in that: include: The evaporation device according to any one of claims 1 to 9; An evaporation chamber, wherein a substrate is accommodated in the evaporation chamber; The substrate has a surface to be evaporated, and the surface to be evaporated is arranged perpendicular to the ground; Wherein, the evaporation device is used to deposit evaporation material onto the surface to be evaporated.

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