Quality detection method and device of integrated circuit, electronic equipment and storage medium

Abstract

The invention provides an integrated circuit quality detection method and device, electronic equipment and a storage medium. The method comprises the following steps: acquiring a plurality of integrated circuits; for each integrated circuit, carrying out various rapid detection tests on the integrated circuit according to a predetermined test condition; in response to determining that the plurality of integrated circuits all pass the plurality of rapid detection tests, performing a plurality of sampling detection tests on the plurality of integrated circuits; and in response to determining that the plurality of integrated circuits pass the plurality of sampling detection tests, determining that the plurality of integrated circuits pass the quality detection, thereby solving the technical problem that the quality detection result of the integrated circuit is not accurate in the prior art, and improving the accuracy of determining the quality detection result of the integrated circuit.

Description

Technical Field

[0001] The present application relates to the technical field of quality inspection, and in particular to a quality inspection method, device, electronic device and storage medium for integrated circuits. Background Art

[0002] In the 1970s, in order to strengthen the quality control of the production process, improve the inherent reliability of integrated circuits, and ensure the quality of integrated circuits used in the system, seven special quality control measures were implemented in the production process to address the problems existing in integrated circuits, namely "special personnel, special machines, special materials, special approvals, special inspections, special skills, and special cards." Integrated circuit assurance is a quality assurance measure that takes various quality assurance measures on the integrated circuits selected for the system, eliminates defective ones or those that may cause early failures, or selects integrated circuit products with certain characteristics, so that the integrated circuits meet the functional, performance, environmental, safety, quality and reliability requirements throughout the life cycle of the system. If integrated circuits that fail early are used, the early failure rate of the entire machine using the integrated circuits will be greatly increased.

[0003] At present, it is impossible to achieve "special personnel, special machines, special materials, special approval, special inspection, special technology, and special cards" for integrated circuits that meet the seven special quality control measures. The equipment is outdated, and the detection and testing methods are poor. On the one hand, the quality of the product has declined due to the decline in the quality of the workforce, and it cannot even meet the system requirements. On the other hand, for the whole machine with higher requirements, each system has formulated its own "stricter" screening conditions, redundant and unguaranteed quality assurance measures, and there is no unified standard for the quality inspection of integrated circuits. The above reasons lead to inaccurate quality inspection results for integrated circuits. Summary of the invention

[0004] In view of this, the purpose of the present application is to provide a quality detection method, device, electronic device and storage medium for integrated circuits to overcome all or part of the deficiencies in the prior art.

[0005] Based on the above-mentioned purpose, the present application provides a quality inspection method for integrated circuits, including: obtaining multiple integrated circuits; for each integrated circuit, performing multiple rapid inspection tests on the integrated circuit according to predetermined test conditions; in response to determining that the multiple integrated circuits all pass the multiple rapid inspection tests, performing multiple sampling inspection tests on the multiple integrated circuits; in response to determining that the multiple integrated circuits pass the multiple sampling inspection tests, determining that the multiple integrated circuits pass the quality inspection.

[0006] Optionally, before performing a plurality of rapid detection tests on each integrated circuit according to predetermined test conditions, the method includes: performing a qualified test on the production environment of the plurality of integrated circuits.

[0007] Optionally, the performing of multiple sampling inspection tests on the multiple integrated circuits includes: for each sampling inspection test, sampling the multiple integrated circuits according to predetermined test requirements to obtain some integrated circuits among the multiple integrated circuits, grouping the some integrated circuits to obtain multiple groups of integrated circuits, and performing the sampling inspection test on each group of integrated circuits.

[0008] Optionally, the integrated circuit is subjected to multiple quick detection tests according to predetermined test conditions, including: for each quick detection test, in response to determining that the predetermined test conditions include factory test conditions and supplementary test conditions, the integrated circuit is subjected to the quick detection test according to the factory test conditions and the supplementary test conditions; in response to determining that the predetermined test conditions only include the factory test conditions, the integrated circuit is subjected to the quick detection test according to the factory test conditions.

[0009] Optionally, the multiple rapid detection tests include internal microscopic inspection test, temperature cycle test, constant acceleration test, noise test, pre-aging test, aging test, post-aging test, high temperature test, low temperature test, leak detection test, external inspection test and electrical parameter test.

[0010] Optionally, the multiple sampling inspection tests include three-temperature test, performance test, life test, physical test and radiation test.

[0011] Optionally, in response to determining that the plurality of integrated circuits pass the plurality of sampling inspection tests and after determining that the plurality of integrated circuits pass the quality inspection, the method includes: generating quality inspection reports corresponding to the plurality of integrated circuits.

[0012] Based on the same inventive concept, the present application also provides an integrated circuit quality inspection device, including: an acquisition module, configured to acquire multiple integrated circuits; a rapid detection test module, configured to perform multiple rapid detection tests on the integrated circuit according to predetermined test conditions for each integrated circuit; a sampling detection test module, configured to perform multiple sampling detection tests on the multiple integrated circuits in response to determining that the multiple integrated circuits all pass the multiple rapid detection tests; a determination module, configured to determine that the multiple integrated circuits pass the quality inspection in response to determining that the multiple integrated circuits pass the multiple sampling detection tests.

[0013] Based on the same inventive concept, the present application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable by the processor, wherein the processor implements the method as described above when executing the computer program.

[0014] Based on the same inventive concept, the present application also provides a non-transitory computer-readable storage medium, which stores computer instructions, and the computer instructions are used to enable a computer to execute the method as described above.

[0015] From the above, it can be seen that the quality detection method, device, electronic device and storage medium of integrated circuits provided by the present application include obtaining multiple integrated circuits. For each integrated circuit, multiple rapid detection tests are performed on the integrated circuit according to predetermined test conditions, which not only improves the efficiency of the detection test of the integrated circuit, but also ensures the comprehensiveness of the detection test of the integrated circuit. In response to determining that all of the multiple integrated circuits have passed the multiple rapid detection tests, multiple sampling detection tests are performed on the multiple integrated circuits, which, on the one hand, further ensures the accuracy of the quality detection of the integrated circuit, and on the other hand, improves the efficiency of quality detection of multiple integrated circuits and saves detection resources. In response to determining that the multiple integrated circuits have passed the multiple sampling detection tests, it is determined that the multiple integrated circuits have passed the quality detection, ensuring the accuracy of the detection test results of multiple integrated circuits. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 A schematic diagram of a flow chart of a quality inspection method for integrated circuits according to an embodiment of the present application;

[0018] Figure 2 A schematic diagram of performing qualified testing on a production environment of an integrated circuit according to an embodiment of the present application;

[0019] Figure 3 A schematic diagram of the structure of a quality detection device for integrated circuits according to an embodiment of the present application;

[0020] Figure 4 This is a schematic diagram of the hardware structure of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0021] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0022] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0023] As mentioned in the background technology section, in the 1970s, in order to strengthen the quality control of the production process, improve the inherent reliability of integrated circuits, and ensure the quality of integrated circuits used in systems, seven special quality control measures were implemented in the production process to address problems with integrated circuits, namely "special personnel, special machines, special materials, special approvals, special inspections, special techniques, and special cards". In 1984, based on the "seven special measures", stricter requirements were proposed in four aspects:

[0024] 1) Tighten the control of the production process (users go to the factory to supervise production and assist manufacturers in strengthening the control of the production process);

[0025] 2) Stricter screening (specifying the allowable parameter change rate and the allowable defective product rate);

[0026] 3) Stricter assessment (sample the reported devices for 1000h high temperature storage test at LTPD=7, and sample for 1000h power aging at LTPD=10);

[0027] 4) Tighten the acceptance inspection (in addition to the acceptance inspection according to the requirements of the "Seven Special" 7905 technical agreement, add open-cap microscopic inspection for semiconductor sealed devices).

[0028] Since 1993, the Commission of Science, Technology and Industry for National Defense has focused its main efforts on the development of integrated circuits to implement national military standards, and no longer invested heavily in the "Seven Specialties". The quality control of the "Seven Specialties" has become a mere name.

[0029] Integrated circuit assurance is to take various quality assurance measures on the integrated circuits selected for the system, eliminate those with defects or that may cause early failure, or select integrated circuit products with certain characteristics to ensure that the integrated circuits meet the functional, performance, environmental, safety, quality and reliability requirements throughout the life cycle of the system. If integrated circuits that fail early are used, the early failure rate of the entire machine will be greatly increased. In the existing technology, for integrated circuits that meet the "seven special" level requirements, manufacturers produce them in the following two situations:

[0030] a) Prepare the detailed specifications of the seventh-level specialization according to QZJ8406XX, and organize production, testing and supply according to the technical conditions of the seventh-level specialization;

[0031] b) Prepare seven-level detailed specifications based on the general specifications of the national military standards, and organize production, testing and supply in accordance with the detailed specifications.

[0032] In accordance with the principle of "comprehensive sorting, checking for omissions and gaps, hierarchical management and control, and continuous optimization", the quality certification documents of semiconductor integrated circuits and hybrid integrated circuits (including power modules) in a selected catalog were reviewed. During the process, the following problems were found for integrated circuits that meet the "seven special" level requirements:

[0033] a) QZJ8406XX standard requirements cannot meet model requirements.

[0034] b) Some of the seven special levels cannot meet the "seven special" control requirements. The traditional "special personnel, special machines, special materials, special approvals, special inspections, special skills, and special cards" are no longer able to meet the requirements. Some manufacturers prepare detailed specifications for the seven special levels based on the general specifications, and organize production, testing and supply. The test items and conditions are cut and adjusted in different procedures, and there is no unified inspection standard, resulting in unreliable inspection results.

[0035] At present, most domestic integrated circuit manufacturers are design companies, and wafer preparation, packaging and testing are mostly outsourced. With the change of quality control concepts in system construction, facing the new situation and new requirements of research and production tasks, on the basis of learning from and integrating domestic and foreign quality, combined with the current situation of my country's manufacturers, the quality control of integrated circuits is moved forward, emphasizing the risk identification and control of integrated circuit production and manufacturing processes and capabilities, and building a production line certification system with "manufacturing capability as the guide and product verification as the auxiliary", focusing on the certification of integrated circuit manufacturing capabilities. By establishing a special committee for the assessment of electronic integrated circuit production line certification agencies, a matrix certification system supported by professional certification agencies is formed. Based on a certain range or multiple ranges of design capabilities, wafer preparation capabilities, packaging capabilities, and testing capabilities applied by manufacturers, production line certification emphasizing the manufacturing process is carried out, and quality certification based on manufacturing capabilities is achieved with a differentiated working model. At present, it is impossible to achieve "special personnel, special machines, special materials, special approval, special inspection, special technology, and special cards" for integrated circuits that meet the requirements of the seven special levels. The equipment is outdated, and the detection and testing methods are insufficient. On the one hand, the decline in the quality of the workforce has caused product quality to decline, and even cannot meet system requirements. The high quality and reliability requirements of the system cannot be met. On the other hand, for the whole machine with higher requirements, each system has formulated its own "stricter" screening conditions. The redundant and unguaranteed quality assurance measures cannot meet the system's needs for both quality and progress. There is no unified standard for the quality inspection of integrated circuits. The above reasons lead to inaccurate quality inspection results for integrated circuits.

[0036] In addition, it should be added that in the existing technology, according to the requirements of "QZJ840614 Technical Conditions for Seven Specialized Semiconductor Integrated Circuits", integrated circuits with seven special quality control measures should pass routine tests before leaving the factory. After passing the screening, they should be stored for 1 to 12 months and submitted for acceptance tests. The acceptance test should be carried out after the screening report and routine test report are qualified, and the acceptance test should be carried out before leaving the factory. However, the above routine tests are not comprehensive, resulting in inaccurate quality test results.

[0037] The routine tests of integrated circuits with seven special quality control measures include: high temperature storage test, high temperature power load test, mechanical and environmental test, as shown in the following table. When all three tests are passed, the routine test is passed, otherwise it is not passed. Mechanical and environmental tests are divided into groups one, two, and three. When all group tests are passed, the mechanical and environmental tests are passed, otherwise they are not passed. The inspection batches that fail can be re-screened and submitted for testing again, but only one repetition is allowed. The re-submitted inspection batches will only undergo the group tests that failed.

[0038] Table 1 Routine test table for integrated circuits with seven special quality control measures and level requirements

[0039]

[0040]

[0041]

[0042] According to the standard, the manufacturer should conduct 100% effective screening of integrated circuits that meet seven special quality control measures before and after capping.

[0043] Table 2 Screening test table for integrated circuits with seven special quality control measures level requirements

[0044]

[0045]

[0046] Integrated circuits that meet the requirements of the seven special quality control measures should undergo acceptance tests before leaving the factory. Acceptance tests should be conducted after the inspection screening report and routine test report are qualified. The integrated circuits submitted for testing should be stored for 1-12 months (starting from screening) and pass routine tests. During the test, 100% of the submitted integrated circuits should be tested for room temperature electrical performance. If the parameter deviation is less than 5%, the deviation circuit will be eliminated. If the parameter deviation circuit is greater than 5% or the serious failure circuit is greater than 0.5%, the batch of integrated circuits shall not be submitted for acceptance testing. The acceptance test is conducted by sampling. The acceptance test is shown in the following table. When all group tests are passed, the acceptance test is passed, otherwise it is not passed. The inspection batch that fails the acceptance test can be re-screened and submitted for testing again, but only one repetition is allowed. The resubmitted inspection batch will only undergo the group tests that failed.

[0047] Table 3 Acceptance test table for integrated circuits with seven special quality control measures

[0048]

[0049] In view of this, the present application embodiment proposes a quality detection method for integrated circuits, referring to Figure 1 , including the following steps:

[0050] Step 101, obtaining a plurality of integrated circuits.

[0051] In this step, an integrated circuit (IC) is a microelectronic device or component that uses a certain process to interconnect the transistors, diodes, resistors, capacitors, inductors and other components and wiring required in the circuit, and is made on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a tube shell to become a microstructure with the required circuit function. Before the integrated circuit leaves the factory, it is usually necessary to conduct quality inspection on the integrated circuit. Although the production line with the seven special quality control measures level requirements is now in name only, the quality inspection of the seven special quality control measures level requirements for integrated circuits is still necessary. First, obtain a plurality of integrated circuits, wherein the above-mentioned multiple integrated circuits can be integrated circuits of the same batch, or can be integrated circuits produced by the factory within a predetermined time period.

[0052] Step 102: For each integrated circuit, perform a variety of rapid detection tests on the integrated circuit according to predetermined test conditions.

[0053] In this step, a relatively large number of integrated circuits are obtained. If a long test is performed on each integrated circuit, the test efficiency will be relatively low. Therefore, it is necessary to improve the detection efficiency of each integrated circuit and control the time of the detection test. In addition, when performing quality inspection on integrated circuits, only one test cannot fully detect whether the integrated circuit has defects. It is necessary to perform multiple rapid detection tests on each integrated circuit according to predetermined test conditions, wherein the predetermined test conditions are determined according to demand. By performing multiple rapid detection tests on integrated circuits, the efficiency of the detection test on the integrated circuit is improved, and the comprehensiveness of the detection test on the integrated circuit is ensured.

[0054] Step 103 , in response to determining that all of the plurality of integrated circuits pass the plurality of rapid detection tests, performing a plurality of sampling detection tests on the plurality of integrated circuits.

[0055] In this step, when all the multiple integrated circuits pass the multiple rapid detection tests, it means that the quality detection of the multiple integrated circuits is preliminarily qualified. In order to further ensure the accuracy of the quality detection of the integrated circuits, it is necessary to perform multiple sampling detection tests on the multiple integrated circuits. Since it has been preliminarily determined that the quality of the integrated circuits is qualified when the integrated circuits are subjected to rapid detection tests. Therefore, in order to improve the efficiency of the quality detection of the integrated circuits, multiple sampling detection tests are performed on the multiple integrated circuits, and there is no need to perform detection tests on all the integrated circuits again. By performing multiple sampling detection tests on the multiple integrated circuits, on the one hand, the accuracy of the quality detection of the integrated circuits is further ensured, and on the other hand, the efficiency of the quality detection of the multiple integrated circuits is improved, saving detection resources.

[0056] It should be noted that when there are integrated circuits that fail to pass multiple rapid detection tests among multiple integrated circuits, in the case of user demand, multiple sampling detection tests can continue to be performed on the integrated circuits that pass multiple rapid detection tests among the multiple integrated circuits. The specific steps are: based on user demand, in response to determining that there are integrated circuits that pass multiple rapid detection tests among the multiple integrated circuits, multiple sampling detection tests are performed on the integrated circuits that pass multiple rapid detection tests. For each integrated circuit that passes multiple rapid detection tests, in response to determining that the integrated circuit passes multiple sampling detection tests, it is determined that the integrated circuit passes the quality inspection.

[0057] Step 104 , in response to determining that the plurality of integrated circuits pass the plurality of sampling inspection tests, determining that the plurality of integrated circuits pass the quality inspection.

[0058] In this step, if multiple integrated circuits pass multiple sampling inspection tests, it is further ensured that the quality of the integrated circuits is qualified, and it is determined that the multiple integrated circuits pass the quality inspection. Multiple integrated circuits are subjected to multiple rapid inspection tests and multiple sampling inspection tests in batches to ensure the accuracy of the inspection test results of multiple integrated circuits.

[0059] Under the requirement of controllable risks within the system life cycle, based on the actual status of integrated circuit production with seven special quality control measures, taking into account the characteristics of product structure, packaging form, production status, etc., flexibly master the standards, integrate relevant quality assurance measures into the new model, and classify them in combination with the stricter technical conditions of each system to form a unified control baseline that can meet both device standard requirements and system requirements, establish a "good, more, faster" integrated circuit quality assurance work model, and help the system develop rapidly and with high quality. In order to ensure the long-term stable supply of domestic integrated circuits and the reliability of system applications, it is necessary to seek an integrated circuit quality assurance model that meets system requirements to help the system develop rapidly and with high quality.

[0060] For integrated circuits with seven special quality control measures, the overall idea is to cancel the "seven special" and "seven special strict" standards, and integrate the relevant standard requirements into the production line certification and rapid inspection mode. On the basis of the production line review requirements being transferred to the production line certification, for example, the quality assurance requirements of the "840611 seven special technical conditions" are integrated into the product supplementary screening, and the original "7905" technical conditions are cancelled; the stricter parts of the "seven special strict" technical conditions of various systems are classified to form a unified control baseline that can meet the standard requirements of various devices and the system requirements. Through the above measures, the devices have distinct quality levels and meet the needs of various users at the same time; a lot of manpower and material resources are saved in the test, and the productivity resources of the manufacturer are greatly released.

[0061] After the factory completes production, it directly submits it to the testing agency for quality assurance, ensuring the mutual recognition and data sharing of the results of domestic integrated circuits in the quality control links such as identification and inspection, factory screening, quality consistency inspection, evaluation and assessment, hospital re-inspection or supplementary screening, and realizing the "one-stop" pilot implementation of the technical status identification and inspection process of domestic integrated circuits, and building a seven-special integrated circuit quality assurance system with stability, efficiency, flexibility, consistency and traceability. For the current status of the production of seven-special integrated circuits, flexibly grasp the standards, carry out the design of integrated circuit quality assurance methods based on production line certification + rapid inspection mode, and form a unified control baseline that can meet both standard requirements and system requirements, so that integrated circuits have a distinct quality level, save a lot of manpower and material resources in testing, and greatly release the productivity of manufacturers.

[0062] Through the above scheme, multiple integrated circuits are obtained. For each integrated circuit, multiple rapid detection tests are performed on the integrated circuit according to predetermined test conditions, which not only improves the efficiency of the detection test of the integrated circuit, but also ensures the comprehensiveness of the detection test of the integrated circuit. In response to determining that all of the multiple integrated circuits have passed the multiple rapid detection tests, multiple sampling detection tests are performed on the multiple integrated circuits, which, on the one hand, further ensures the accuracy of the quality detection of the integrated circuits, and on the other hand, improves the efficiency of quality detection of the multiple integrated circuits and saves detection resources. In response to determining that the multiple integrated circuits have passed the multiple sampling detection tests, it is determined that the multiple integrated circuits have passed the quality detection, which ensures the accuracy of the detection test results of the multiple integrated circuits.

[0063] In some embodiments, before performing a plurality of rapid detection tests on each integrated circuit according to predetermined test conditions, the method includes: performing a qualification test on a production environment of the plurality of integrated circuits.

[0064] In this embodiment, the production environment of the integrated circuit also affects the quality of the integrated circuit. Therefore, it is necessary to conduct a qualified inspection on the production environment of the integrated circuit, wherein the qualified inspection is conducted from two aspects: document review and on-site review. Conducting a qualified inspection on the production environment of the integrated circuit is also of great reference significance to the quality inspection results of the integrated circuit. If the production environment of the integrated circuit fails to pass the qualified inspection, it is foreseeable that the quality of the produced integrated circuit will be relatively poor. The specific qualified inspection process is as follows: Figure 2As shown, it includes: formulating an annual plan; supplier survey, in which the supplier survey includes the distribution and collection of supplier questionnaires, and the scoring and confirmation of supplier questionnaires; establishing a production line certification group, in which the establishment of a production line certification group includes: confirming the production line on-site audit time, inviting on-site audit experts, and confirming on-site audit group members; improving or supplementing certification elements; production line on-site audit, in which the production line on-site audit includes proposing production line audit suggestions; production line certification scoring and conclusions, in which the production line certification scoring and conclusions include supplier confirmation and clarification of improvement measures; forming a production line certification summary report; and inspection of the implementation of improvement measures. Obtain the above inspection results, and based on the above inspection results, test the production environment of integrated circuits. Document review is to confirm and review the questionnaires and other relevant documents provided by the supplier, and only after they are qualified can the on-site review be carried out; the on-site review is to conduct on-site certification activities for the supplier's production line based on the certification requirements and the relevant contents of the certification element table.

[0065] Integrated circuits are miniaturized circuits that use semiconductor crystal materials as substrates, and are processed and manufactured to integrate components, active devices, and interconnects inside, on, or on substrates to perform certain electronic functions. According to the industrial chain, production line certification is divided into design stage, wafer preparation stage, packaging and assembly stage, and test stage. The design stage focuses on product design principles, application environment demand planning, reliability and life design indicators, and historical quality problems. Taking digital circuit design as an example, it mainly includes logical design and physical design such as design input, logic synthesis, system division, simulation, layout design, layout and wiring, and parameter extraction. In the certification process, four aspects can be considered, namely model verification, layout verification, performance verification, testability and fault coverage verification. When conducting certification, relevant simulation reports, performance test comparison reports, and other reports need to be provided for review. The packaging design includes the base / housing, cover (cap), packaging materials and structural dimensions, internal electrical connections, etc., and the electrical and thermal characteristics should be fully considered. The thermal resistance of thermal characteristics can be obtained through simulation and actual measurement; manufacturers should provide data on ground and power supply impedance, cross-coupling effects, and high-voltage effects. During the wafer preparation and packaging assembly process, key quality control points can be confirmed from the six aspects of "people, machines, materials, methods, environment, and measurement", and the process capabilities can be monitored to determine whether the production process is in a stable and controlled state.

[0066] The integrated circuit testing and reliability tests at each stage require process monitoring, timely status feedback, and status control of integrated circuit testing and test equipment. The integrated circuit production line certification and evaluation system is shown in the following table.

[0067] Table 4 Production line certification assessment system

[0068]

[0069]

[0070] For manufacturers who outsource both wafers and packaging, pay attention to the stability of the selected outsourced manufacturer, whether its contracts or agreements and other documents have appropriate quality requirements and control measures, whether the relevant content meets the requirements of process stability and test effectiveness; whether the matching of design and production process can meet the requirements, whether it can ensure that the product meets the required yield rate, CPK indicators and other requirements, clarify the statistical process control (SPC) procedures and process parameters that need to be controlled; and evaluate whether the products delivered by outsourcing are accepted as required.

[0071] In some embodiments, the multiple sampling inspection tests are performed on the multiple integrated circuits, including: for each sampling inspection test, sampling the multiple integrated circuits according to predetermined test requirements to obtain some integrated circuits among the multiple integrated circuits, grouping the some integrated circuits to obtain multiple groups of integrated circuits, and performing the sampling inspection test on each group of integrated circuits.

[0072] In this embodiment, since a rapid detection test has been conducted on each integrated circuit, it is preliminarily determined that the quality of the integrated circuit is qualified. In order to improve the detection test efficiency of the integrated circuit, for each sampling detection test, multiple integrated circuits are sampled according to the predetermined experimental requirements. Exemplarily, when the sampling detection test is a three-temperature test, the predetermined test requirement is to perform a three-temperature test on all integrated circuits, so all integrated circuits in the multiple integrated circuits are sampled; when the sampling detection test is a performance test, the predetermined test requirement is to perform a performance test on some of the integrated circuits in the multiple integrated circuits, for example, some of the integrated circuits are forty-eight, so some of the integrated circuits in the multiple integrated circuits are sampled. Since each sampling detection test includes a control test, some of the integrated circuits are grouped to obtain multiple groups of integrated circuits. Exemplarily, when the sampling detection test is a three-temperature test, some of the integrated circuits are divided into eight groups; when the sampling detection test is a performance test, some of the integrated circuits are divided into five groups. A sampling detection test is performed on each group of integrated circuits, wherein, for the same sampling detection test, each group of integrated circuits is subjected to the sub-detection test included in the sampling detection test, thereby improving the efficiency of the sampling detection test.

[0073] It should be noted that when sampling inspection is performed on some integrated circuits, when the number of some integrated circuits is less than the number of all integrated circuits, a relatively long sampling inspection can be performed. For example, when the sampling inspection test is a life test, the life test can be performed every three months, which not only ensures that the defects of the integrated circuits can be accurately detected, but also reduces the resources required for the inspection test.

[0074] In some embodiments, the integrated circuit is subjected to multiple rapid detection tests according to predetermined test conditions, including: for each rapid detection test, in response to determining that the predetermined test conditions include factory test conditions and supplementary test conditions, the integrated circuit is subjected to the rapid detection test according to the factory test conditions and the supplementary test conditions; in response to determining that the predetermined test conditions only include the factory test conditions, the integrated circuit is subjected to the rapid detection test according to the factory test conditions.

[0075] In this embodiment, when the user has no special requirements, the manufacturer usually performs a rapid detection test on the integrated circuit according to the factory test conditions. However, the user may have special requirements. At this time, it is necessary to perform a rapid detection test on the integrated circuit according to the user's special requirements and the factory test conditions, wherein the user's special requirements are regarded as supplementary test conditions. In summary, for each rapid detection test, when the predetermined test conditions include the factory test conditions and the supplementary test conditions, the integrated circuit is subjected to a rapid detection test according to the factory test conditions and the supplementary test conditions; when the predetermined experimental conditions only include the factory test conditions, the integrated circuit is subjected to a rapid detection test according to the factory test conditions. Exemplarily, when the rapid detection test is a temperature cycle test, the factory test conditions are "-55±3℃~125±3℃, maintained for 30min, conversion time <1min, cycle 20 times", and the supplementary test conditions are "high temperature storage optimization deletion, the number of temperature cycles increased from 5 times to 20 times". In the case where the rapid detection test is an electrical parameter test, it only includes the factory test conditions, which are "tested under standard atmospheric conditions, the electrical parameters should meet the requirements of the product standards, the standard atmospheric conditions are: temperature 25±5℃; relative humidity 45%~75%; air pressure 86~106KPa". By performing a variety of rapid detection tests on the integrated circuit according to the predetermined test conditions, it is ensured that the integrated circuit that passes the quality inspection meets the user's needs.

[0076] In some embodiments, the multiple rapid detection tests include internal microscopy test, temperature cycle test, constant acceleration test, noise test, pre-aging test, aging test, post-aging test, high temperature test, low temperature test, leak detection test, external inspection test and electrical parameter test.

[0077] In this embodiment, the various rapid detection tests include internal microscopic test, temperature cycle test, constant acceleration test, noise test, pre-aging test, aging test, post-aging test, high temperature test, low temperature test, leak test, external inspection test and electrical parameter test. Through various rapid detection tests, both the detection efficiency and the comprehensiveness of the integrated circuit detection are ensured.

[0078] (I) The main purpose of internal microscopic inspection tests for integrated circuits is to ensure the quality and reliability of integrated circuits. Through internal microscopic inspection tests, defects that may exist in the manufacturing process of integrated circuits can be detected to ensure that their performance meets the design requirements, thereby improving the overall quality and reliability of the product. The factory test conditions for internal microscopic inspection tests are "inspection of the internal quality of the device, such as metallization, oxide layer, dicing, bonding, inner leads, chip surface, diffusion, purification, etc.", and the supplementary test conditions are "providing relevant reports and data after the manufacturer completes the requirements."

[0079] (II) The core purpose of temperature cycle test for integrated circuits is to verify the mechanical and electrical properties of integrated circuits in an environment of alternating temperature changes, and to ensure the stability and reliability of integrated circuits in various environments. The temperature cycle test simulates an environment of alternating extreme high and low temperatures to evaluate the ability of integrated circuits to withstand repeated temperature changes in a short period of time, thereby discovering potential manufacturing defects and material defects and improving the overall reliability of the product. The factory test conditions for the temperature cycle test are "-55±3℃~125±3℃, hold for 30min, conversion time <1min, 20 cycles", and the supplementary test conditions are "high-temperature storage optimization deleted, and the number of temperature cycles increased from 5 times to 20 times".

[0080] (III) The core purpose of the constant acceleration test of integrated circuits is to detect and evaluate the performance and structural integrity of integrated circuits under specific acceleration environments. This test helps identify and prevent potential failure modes by simulating the acceleration conditions that may be encountered in actual use, thereby improving the reliability and service life of integrated circuits. The factory test conditions for the constant acceleration test are "acceleration: mass m < 10g 20000g; m is 10-100g 5000g; m > 100g 500g. 1 minute each in the three directions of X, Y, and Z", and the supplementary test conditions are "100% screening, no cavity. (The conditions retain the seven special quality control measures and grade requirements)".

[0081] (IV) The core purpose of noise testing of integrated circuits is to evaluate the performance stability and reliability of integrated circuits in different environments. Through noise testing, the response of integrated circuits when subjected to random voltage or current interference can be detected to ensure that they can operate stably in actual use and avoid misoperation or data loss caused by noise. The necessity of noise testing lies in the fact that integrated circuits are affected by various electromagnetic interferences and random signals in actual work, which may come from power supply fluctuations, electromagnetic radiation or interference from other electronic devices. If noise testing is not carried out, these potential problems may only appear after the product is delivered, resulting in product recalls or user complaints, and increasing development and maintenance costs. The factory test conditions for noise testing are "Condition A of Method 2020 of GJB548 is executed", and the supplementary test conditions are "There is a demand for PIND in some models, and the conditions refer to 511".

[0082] (V) The main purpose of testing integrated circuits before aging is to eliminate devices with quality defects and avoid occupying aging equipment and resources. Through basic electrical parameter and functional tests, devices with obvious quality problems can be preliminarily screened out to ensure that the aging process focuses on those devices that need to be further verified through aging. The factory test conditions for pre-aging tests are "according to detailed specification requirements", and the supplementary test conditions are "when the serious failure circuit is greater than 5%, it is allowed to analyze the cause, eliminate the failure factor, and test again. If the serious failure circuit is still greater than 5%, the batch of circuits shall not be shipped."

[0083] (VI) The main purpose of the burn-in test for integrated circuits is to evaluate their long-term reliability, identify potential failure modes, verify the suitability of designs and materials, and provide data support for developing warranty and maintenance strategies. By simulating long-term use conditions, the burn-in test can discover potential failure mechanisms of the chip during use, such as thermal failure, material aging, etc., to ensure that improvements can be made during the design phase. In addition, the burn-in test can also ensure that the materials and designs used can withstand environmental changes (such as temperature, humidity, etc.) and remain stable in actual applications. The factory test conditions for the burn-in test are "at the rated power supply voltage specified in the product standard, 125±8℃, 168h", and the supplementary test conditions are "monitoring at least once every 8 hours during the burn-in process; the burn-in temperature must not exceed the maximum operating temperature of the device, and the burn-in time is benchmarked against the seven special high-temperature power aging requirements."

[0084] (VII) The main purpose of post-aging test for integrated circuits is to ensure the stability and reliability of integrated circuits, reduce early failures, and improve the overall quality of the product. Aging tests accelerate the exposure of potential defects by applying external stress (such as temperature, voltage, current, etc.), thereby screening out devices with early failures. This method helps to ensure that the devices are more stable and reliable within their expected lifespan. The factory test conditions for post-aging tests are "as required by detailed specifications", and the supplementary test conditions are "when the number of serious failure circuits is greater than 5%, it is allowed to analyze the causes, eliminate the failure factors, and test again. If the number of serious failure circuits is still greater than 5%, the batch of circuits shall not be shipped."

[0085] (VIII) The core purpose of high temperature testing of integrated circuits is to ensure their stability and reliability in high temperature environments and improve product quality. Through high temperature testing, potential problems can be discovered and prevented in advance, reducing later repairs. The factory test conditions for high temperature testing are "testing after the temperature is constant in a high temperature box for 30 minutes, and the electrical parameters should meet the requirements of the product standards", and the supplementary test conditions are "the high temperature test temperature shall not exceed the maximum operating temperature of the device".

[0086] (IX) The core purpose of low-temperature testing of integrated circuits is to ensure their stability and reliability in low-temperature environments. Through low-temperature testing, the advantages and disadvantages of integrated circuits under low-temperature conditions can be discovered, providing a basis for subsequent product design and optimization, ensuring their stability and reliability in various harsh environments, and preventing potential problems. The factory test conditions for low-temperature testing are "testing after 30 minutes of constant temperature in a low-temperature box, the electrical parameters should comply with the provisions of the product standard, the temperature is: -55±3℃", and the supplementary test conditions are "the low-temperature test temperature shall not exceed the maximum operating temperature of the device".

[0087] (X) The core purpose of leak detection test for integrated circuits is to detect tiny leaks that may occur during chip packaging to ensure the sealing and reliability of the chip. The leak detection test detects these leaks through specific methods to prevent impurities such as water vapor from entering the chip, thereby affecting the performance and life of the chip. The factory test conditions for leak detection test are "fine leak detection: in accordance with GJB548 test condition A1; coarse leak detection: in accordance with GJB548 test condition C1", and the supplementary test conditions are "no leak detection test for integrated circuits without cavities".

[0088] (XI) The core purpose of the external inspection test of integrated circuits is to test the packaging quality of integrated circuits, ensure that they meet the use requirements, avoid product failure due to packaging defects, and also ensure that the shell of the integrated circuit has the corresponding mark. The factory test conditions for the external inspection test are "the surface should not have stains, rust, blistering and peeling of the coating, and damage, use a 10x magnifying glass; the shell should have clear and firm marks, which include "manufacturer's trademark, model, category, batch number, seven special marks"".

[0089] (XII) The core purpose of the electrical parameter test of integrated circuits is to ensure that their electrical performance meets the design requirements and to ensure the quality and reliability of the product. Through electrical parameter testing, physical defects that may occur in the integrated circuit during the manufacturing process can be detected to ensure its stability and safety in practical applications. The factory test conditions for the external inspection test are "tested under standard atmospheric conditions, and the electrical parameters should meet the requirements of the product standards. The standard atmospheric conditions are: temperature 25±5℃; relative humidity 45%~75%; air pressure 86~106KPa".

[0090] As summarized in the following table, there are various rapid detection test tables.

[0091] Table 5 Various rapid detection test tables

[0092]

[0093] In some embodiments, the plurality of sampling inspection tests include three-temperature test, performance test, life test, physical test and radiation test.

[0094] In this embodiment, the multiple sampling inspection tests include three-temperature test, performance test, life test, physical test and radiation test. Multiple sampling inspection tests are performed on multiple integrated circuits. The above multiple sampling inspection tests are used to perform quality consistency detection of integrated circuits. For each sampling inspection test, multiple integrated circuits are screened and the sampling inspection test is performed. For all sampling inspection tests, all screened integrated circuits pass the sampling inspection test, indicating that multiple integrated circuits meet the quality consistency test, and it is determined that multiple integrated circuits pass the quality inspection. Through multiple sampling inspection tests, the accuracy of integrated circuit quality detection is ensured, and the corresponding quality inspection resources are saved.

[0095] (I) Through the three-temperature test, we can fully understand the performance of integrated circuits in three different temperature environments: high temperature, normal temperature and low temperature, find out their advantages and disadvantages, and provide a basis for subsequent product design and optimization. At the same time, the three-temperature test can also test the adaptability and reliability of integrated circuits to prevent them from malfunctioning or being damaged in subsequent applications. The specific three-temperature test is as follows:

[0096] Table 6 Group A three-temperature test

[0097]

[0098] (II) The core purpose of performance testing of integrated circuits is to ensure that the integrated circuits can meet the design requirements and performance indicators in actual applications and improve the reliability and stability of the integrated circuits. Through performance testing, the functions, performance and reliability of the integrated circuits can be verified to ensure that they can still work normally in harsh environments. The specific performance tests are as follows:

[0099] Table 7 Group B performance test

[0100]

[0101]

[0102] (III) The core purpose of life testing of integrated circuits is to evaluate their reliability and service life, and to ensure that they can operate stably and reliably under predetermined working conditions. Through life testing, various extreme conditions that integrated circuits may encounter in actual use can be simulated, so as to predict their performance and potential failure risks in long-term use. It should be noted that it is conducted every 3 months. The specific life test is as follows:

[0103] Table 8 Life test of group C

[0104]

[0105] (IV) The core purpose of physical experiments on integrated circuits is to verify their functions and performance and ensure their quality and reliability. They are conducted every three months. The specific physical tests are as follows:

[0106] Table 9 Physical test of group D

[0107]

[0108]

[0109] (V) The core reason for conducting radiation tests on integrated circuits is to evaluate their performance and reliability in a specific radiation environment to ensure that the integrated circuits can still work normally when facing electromagnetic interference and high-energy particle radiation. Radiation reinforcement assurance tests include neutron radiation, steady-state total dose radiation, transient ionizing radiation, radiation lock-in, single-event effect and other test items. Necessary test items shall be carried out in accordance with regulations or needs.

[0110] In some embodiments, in response to determining that the plurality of integrated circuits pass the plurality of sampling inspection tests, after determining that the plurality of integrated circuits pass the quality inspection, the method includes: generating quality inspection reports corresponding to the plurality of integrated circuits.

[0111] In this embodiment, after determining that multiple integrated circuits have passed quality inspection, quality inspection reports corresponding to the multiple integrated circuits are generated so that users can promptly and accurately know what kind of inspection tests the integrated circuits have undergone to determine whether the quality of the integrated circuits is qualified.

[0112] It should be noted that the method of the embodiment of the present application can be performed by a single device, such as a computer or server. The method of this embodiment can also be applied to a distributed scenario and completed by multiple devices cooperating with each other. In the case of such a distributed scenario, one of the multiple devices can only perform one or more steps in the method of the embodiment of the present application, and the multiple devices will interact with each other to complete the described method.

[0113] It should be noted that the above describes some embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0114] Based on the same inventive concept, corresponding to any of the above-mentioned embodiment methods, the present application also provides a quality detection device for integrated circuits.

[0115] refer to Figure 3 , the integrated circuit quality detection device comprises:

[0116] The acquisition module 10 is configured to acquire a plurality of integrated circuits.

[0117] The rapid detection test module 20 is configured to perform a variety of rapid detection tests on each integrated circuit according to predetermined test conditions.

[0118] The sampling detection test module 30 is configured to perform a plurality of sampling detection tests on the plurality of integrated circuits in response to determining that the plurality of integrated circuits all pass the plurality of rapid detection tests.

[0119] The determination module 40 is configured to determine that the plurality of integrated circuits pass the quality inspection in response to determining that the plurality of integrated circuits pass the plurality of sampling inspection tests.

[0120] Through the above-mentioned device, multiple integrated circuits are obtained. For each integrated circuit, multiple rapid detection tests are performed on the integrated circuit according to predetermined test conditions, which not only improves the efficiency of the detection test of the integrated circuit, but also ensures the comprehensiveness of the detection test of the integrated circuit. In response to determining that all of the multiple integrated circuits have passed the multiple rapid detection tests, multiple sampling detection tests are performed on the multiple integrated circuits, which, on the one hand, further ensures the accuracy of the quality detection of the integrated circuits, and on the other hand, improves the efficiency of quality detection of the multiple integrated circuits and saves detection resources. In response to determining that the multiple integrated circuits have passed the multiple sampling detection tests, it is determined that the multiple integrated circuits have passed the quality detection, which ensures the accuracy of the detection test results of the multiple integrated circuits.

[0121] In some embodiments, a qualified detection module is also included, and the qualified detection module is configured to perform a qualified detection on the production environment of the plurality of integrated circuits before performing a plurality of rapid detection tests on the integrated circuits according to predetermined test conditions for each integrated circuit.

[0122] In some embodiments, the sampling detection test module 30 is also configured to sample the multiple integrated circuits according to predetermined test requirements for each sampling detection test, obtain some integrated circuits among the multiple integrated circuits, group the some integrated circuits to obtain multiple groups of integrated circuits, and perform the sampling detection test on each group of integrated circuits.

[0123] In some embodiments, the rapid detection test module 20 is further configured to, for each rapid detection test, in response to determining that the predetermined test conditions include factory test conditions and supplementary test conditions, perform the rapid detection test on the integrated circuit according to the factory test conditions and the supplementary test conditions; in response to determining that the predetermined test conditions only include the factory test conditions, perform the rapid detection test on the integrated circuit according to the factory test conditions.

[0124] In some embodiments, the rapid detection test module 20 is also configured to perform the multiple rapid detection tests including internal microscopic inspection test, temperature cycle test, constant acceleration test, noise test, pre-aging test, aging test, post-aging test, high temperature test, low temperature test, leak detection test, external inspection test and electrical parameter test.

[0125] In some embodiments, the sampling inspection test module 30 is further configured so that the multiple sampling inspection tests include three-temperature test, performance test, life test, physical test and radiation test.

[0126] In some embodiments, a generation module is also included, and the generation module is configured to generate quality inspection reports corresponding to the multiple integrated circuits in response to determining that the multiple integrated circuits pass the multiple sampling inspection tests and after determining that the multiple integrated circuits pass the quality inspection.

[0127] For the convenience of description, the above device is described in terms of functions divided into various modules. Of course, when implementing the present application, the functions of each module can be implemented in the same or multiple software and / or hardware.

[0128] The device of the above embodiment is used to implement the quality detection method of the integrated circuit corresponding to any of the above embodiments, and has the beneficial effects of the corresponding method embodiment, which will not be described in detail here.

[0129] Based on the same inventive concept, corresponding to any of the above-mentioned embodiments and methods, the present application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the quality detection method for the integrated circuit as described in any of the above embodiments is implemented.

[0130] Figure 4 A more specific schematic diagram of the hardware structure of an electronic device provided in this embodiment is shown, and the device may include: a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040, and a bus 1050. The processor 1010, the memory 1020, the input / output interface 1030, and the communication interface 1040 are connected to each other through the bus 1050 in the device.

[0131] The processor 1010 can be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.

[0132] The memory 1020 may be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 1020 may store an operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program codes are stored in the memory 1020 and are called and executed by the processor 1010.

[0133] The input / output interface 1030 is used to connect the input / output module to realize information input and output. The input / output module can be configured in the device as a component (not shown in the figure), or it can be externally connected to the device to provide corresponding functions. The input device may include a keyboard, a mouse, a touch screen, a microphone, various sensors, etc., and the output device may include a display, a speaker, a vibrator, an indicator light, etc.

[0134] The communication interface 1040 is used to connect a communication module (not shown) to realize communication interaction between the device and other devices. The communication module can realize communication through a wired mode (such as USB, network cable, etc.) or a wireless mode (such as mobile network, WIFI, Bluetooth, etc.).

[0135] The bus 1050 includes a path that transmits information between the various components of the device (eg, the processor 1010, the memory 1020, the input / output interface 1030, and the communication interface 1040).

[0136] It should be noted that, although the above device only shows the processor 1010, the memory 1020, the input / output interface 1030, the communication interface 1040 and the bus 1050, in the specific implementation process, the device may also include other components necessary for normal operation. In addition, it can be understood by those skilled in the art that the above device may also only include the components necessary for implementing the embodiments of the present specification, and does not necessarily include all the components shown in the figure.

[0137] The electronic device of the above embodiment is used to implement the quality detection method of the corresponding integrated circuit in any of the above embodiments, and has the beneficial effects of the corresponding method embodiment, which will not be described in detail here.

[0138] Based on the same inventive concept, corresponding to any of the above-mentioned embodiment methods, the present application also provides a non-transitory computer-readable storage medium, wherein the non-transitory computer-readable storage medium stores computer instructions, and the computer instructions are used to enable the computer to execute the integrated circuit quality detection method as described in any of the above embodiments.

[0139] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be achieved by any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, tape disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device.

[0140] The computer instructions stored in the storage medium of the above embodiment are used to enable the computer to execute the quality detection method of the integrated circuit as described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiment, which will not be repeated here.

[0141] Based on the same concept, corresponding to any of the above-mentioned embodiments, the present application also provides a computer program product, including computer program instructions. When the computer program instructions are run on a computer, the computer executes the quality inspection method for integrated circuits as described in any of the above embodiments, which has the beneficial effects of the corresponding method embodiments and will not be repeated here.

[0142] It should be noted that the embodiments of the present application can be further described in the following manner:

[0143] It is understandable that before using the technical solutions of each embodiment of the present disclosure, the type, scope of use, usage scenarios, etc. of the personal information involved will be informed to the user in an appropriate manner, and the user's authorization will be obtained.

[0144] For example, in response to receiving an active request from a user, a prompt message is sent to the user to clearly remind the user that the operation requested to be performed will require obtaining and using the user's personal information. Thus, the user can independently choose whether to provide personal information to software or hardware such as an electronic device, application, server, or storage medium that performs the operation of the technical solution of the present disclosure according to the prompt message.

[0145] As an optional but non-limiting implementation, in response to receiving the user's active request, the prompt information may be sent to the user in the form of a pop-up window, in which the prompt information may be presented in text form. In addition, the pop-up window may also carry a selection control for the user to choose "agree" or "disagree" to provide personal information to the electronic device.

[0146] It is understandable that the above notification and the process of obtaining user authorization are merely illustrative and do not constitute a limitation on the implementation of the present disclosure. Other methods that meet relevant laws and regulations may also be applied to the implementation of the present disclosure.

[0147] A person skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0148] In addition, to simplify the description and discussion, and in order not to make the embodiments of the present application difficult to understand, the known power supply / ground connection with the integrated circuit (IC) chip and other components may or may not be shown in the provided drawings. In addition, the device can be shown in the form of a block diagram to avoid making the embodiments of the present application difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform to be implemented in the embodiments of the present application (that is, these details should be fully within the scope of understanding of those skilled in the art). In the case of elaborating specific details (e.g., circuits) to describe exemplary embodiments of the present application, it is obvious to those skilled in the art that the embodiments of the present application can be implemented without these specific details or when these specific details are changed. Therefore, these descriptions should be considered to be illustrative rather than restrictive.

[0149] Although the present application has been described in conjunction with specific embodiments of the present application, many replacements, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.

[0150] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the present application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the protection scope of the present application.

Claims

1. A quality inspection method for an integrated circuit, characterized in that: include: obtaining a plurality of integrated circuits; For each integrated circuit, performing a plurality of rapid detection tests on the integrated circuit according to predetermined test conditions; In response to determining that all of the plurality of integrated circuits pass the plurality of rapid detection tests, performing a plurality of sampling detection tests on the plurality of integrated circuits; In response to determining that the plurality of integrated circuits pass the plurality of sampling inspection tests, the plurality of integrated circuits are determined to pass the quality inspection.

2. The method according to claim 1, characterized in that Before performing multiple rapid detection tests on each integrated circuit according to predetermined test conditions, the method includes: A production environment of the plurality of integrated circuits is subjected to a qualification test.

3. The method according to claim 1, characterized in that The performing of a plurality of sampling inspection tests on the plurality of integrated circuits comprises: For each sampling inspection test, the multiple integrated circuits are sampled according to predetermined test requirements to obtain some integrated circuits among the multiple integrated circuits, the some integrated circuits are grouped to obtain multiple groups of integrated circuits, and the sampling inspection test is performed on each group of integrated circuits.

4. The method according to claim 1, characterized in that: The integrated circuit is subjected to a variety of rapid detection tests according to predetermined test conditions, including: For each quick detection test, in response to determining that the predetermined test conditions include factory test conditions and supplementary test conditions, the quick detection test is performed on the integrated circuit according to the factory test conditions and the supplementary test conditions; in response to determining that the predetermined test conditions only include the factory test conditions, the quick detection test is performed on the integrated circuit according to the factory test conditions.

5. The method according to claim 1, characterized in that The various rapid detection tests include internal microscopic inspection test, temperature cycle test, constant acceleration test, noise test, pre-aging test, aging test, post-aging test, high temperature test, low temperature test, leak detection test, external inspection test and electrical parameter test.

6. The method according to claim 1, characterized in that The various sampling inspection tests include three-temperature test, performance test, life test, physical test and radiation test.

7. The method according to claim 1, characterized in that After determining that the plurality of integrated circuits pass the quality inspection in response to determining that the plurality of integrated circuits pass the plurality of sampling inspection tests, the method includes: Generating quality inspection reports corresponding to the plurality of integrated circuits.

8. An integrated circuit quality detection device, characterized in that: include: An acquisition module configured to acquire a plurality of integrated circuits; A rapid detection test module is configured to perform a plurality of rapid detection tests on each integrated circuit according to predetermined test conditions; a sampling detection test module, configured to perform a plurality of sampling detection tests on the plurality of integrated circuits in response to determining that the plurality of integrated circuits all pass the plurality of rapid detection tests; The determination module is configured to determine that the plurality of integrated circuits pass the quality inspection in response to determining that the plurality of integrated circuits pass the plurality of sampling inspection tests.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and running on the processor, characterized in that: When the processor executes the program, the method according to any one of claims 1 to 7 is implemented.

10. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: The computer instructions are used to enable a computer to execute the method according to any one of claims 1 to 7.

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