Wafer bearing equipment and wafer conveying system

Abstract

The embodiment of the invention provides wafer bearing equipment and a wafer conveying system, and the wafer bearing equipment comprises a bearing platform which is provided with a bearing plane for bearing wafers, and the bearing plane is provided with a plurality of guide grooves in the radial direction; the limiting pieces are matched with the guide grooves, the matched limiting pieces are in sliding fit with the guide grooves, and the number of the limiting pieces is multiple; and the driving device is connected with the limiting pieces and drives the limiting pieces to slide along the matched guide grooves so as to enable the limiting pieces to abut against the wafer. By adopting the technical scheme, the probability that the wafer is thrown out in the rotating process can be reduced.

Description

Technical Field

[0001] The embodiments of the present specification relate to the field of semiconductor manufacturing technology, and more particularly to a wafer carrying device and a wafer transfer system. Background Art

[0002] In the semiconductor manufacturing process, a robotic arm is usually required to place the wafer on a carrier for cleaning, pre-alignment and other processes.

[0003] During the rotation of the carrier, centrifugal force will be generated, and there is a probability that the wafer will be thrown out, which will lead to wafer fragments. In this context, how to provide a technical solution to reduce the probability of the wafer being thrown out during the rotation process has become a technical problem that technicians in this field need to solve urgently. Summary of the invention

[0004] In view of this, the embodiments of the present specification provide a wafer carrying device and a wafer transfer system, which can reduce the probability of the wafer being thrown out during the rotation process.

[0005] First, an embodiment of this specification provides a wafer carrying device, including:

[0006] A carrying platform, the carrying platform having a carrying plane for carrying the wafer, and a plurality of guide grooves are arranged radially on the carrying plane;

[0007] A stopper matched with the guide groove, wherein the matched stopper and the guide groove are slidably matched, and the number of the stopper is multiple;

[0008] A driving device is connected to each stopper and drives each stopper to slide along the corresponding guide groove so that the stopper contacts the wafer.

[0009] Optionally, the limiting member includes: a first limiting rod, which is slidably matched with a matching guide groove, and a first end of the first limiting rod is connected to the driving device.

[0010] Optionally, the limiting member further includes: a second limiting rod, a first end of the second limiting rod is connected to a second end of the first limiting rod, and the second end of the second limiting rod faces a central area of ​​the bearing plane.

[0011] Optionally, the first end of the second limiting rod is vertically connected to the second end of the first limiting rod.

[0012] Optionally, the plurality of guide grooves are symmetrically distributed along the center of the bearing plane.

[0013] Optionally, the driving device comprises:

[0014] case;

[0015] A sliding member contacts the inner wall of the housing to form a driving chamber;

[0016] an elastic member, elastically matched with the sliding member, and suitable for resetting the sliding member;

[0017] The driving rod is penetrated through the housing and is connected to the sliding member and the limiting member respectively.

[0018] Optionally, the housing is provided with a driving port for providing an air source to the driving chamber to drive the sliding member to move;

[0019] The driving device further includes: an air source channel, which is arranged in the supporting platform and communicated with the driving port.

[0020] Optionally, the driving device further comprises a guide member, and the guide member limits the deformation direction of the elastic member.

[0021] Optionally, the carrying platform further includes:

[0022] A first area is located on the surface of the carrying plane;

[0023] The channel is located inside the supporting platform and is connected with the first area.

[0024] Accordingly, the embodiment of the present specification also provides a wafer transfer system, characterized in that it includes:

[0025] The wafer carrying device as described in any of the above embodiments is suitable for carrying wafers;

[0026] A robotic arm is used for taking and placing the wafer.

[0027] By using the wafer carrying device provided in the embodiment of this specification, during the rotation of the carrying platform, the driving device can drive each limit member to slide along the corresponding guide groove, so that the limit member can interfere with the wafer to confine the wafer within the clamping space formed by the limit members, so that the carrying platform can stably carry the wafer, thereby reducing the probability of the wafer being thrown out during rotation. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments of the present invention or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 A schematic diagram of the structure of a wafer carrying device according to an embodiment of this specification is shown;

[0030] Figure 2 for Figure 1 A schematic top view of a wafer carrier device is shown;

[0031] Figure 3 for Figure 1 A schematic cross-sectional view of a wafer carrying device is shown;

[0032] Figure 4 A schematic structural diagram of a driving device in an embodiment of this specification is shown. DETAILED DESCRIPTION

[0033] As described in the background art, during the rotation of the carrier, the centrifugal force generated may throw the wafer out of the carrier, thereby causing wafer fragments.

[0034] In order to solve the above technical problems, the embodiment of this specification provides a wafer carrying device. During the rotation of the carrying platform, the driving device can drive each limit member to slide along the corresponding guide groove, so that the limit member can interfere with the wafer to limit the wafer within the clamping space formed by the limit members, so that the carrying platform can stably carry the wafer, thereby reducing the probability of the wafer being thrown out during rotation.

[0035] In order to enable those skilled in the art to have a clearer understanding of the technical concepts, technical principles, advantages, etc. contained in the embodiments of this specification, the following is a detailed introduction through specific embodiments and in combination with specific application scenarios with reference to the accompanying drawings.

[0036] Combined with reference Figures 1 to 3 , Figure 1 A schematic diagram of the structure of a wafer carrier device provided in an embodiment of this specification, Figure 2 for Figure 1 The schematic top view of the wafer carrier shown in FIG. Figure 3 for Figure 1 A cross-sectional schematic diagram of a wafer carrying device is shown.

[0037] like Figures 1 to 3 As shown, the wafer carrier device 100 may include:

[0038] The carrier 110 may have a carrier wafer ( Figures 1 to 3 A bearing plane A (not shown), wherein a plurality of guide grooves may be provided in the radial direction of the bearing plane A;

[0039] A stopper matched with the guide groove, and the matched stopper can be slidably matched with the guide groove, and the number of the stopper can be multiple;

[0040] A driving device is connected to each stopper and drives each stopper to slide along the corresponding guide groove so that the stopper contacts the wafer.

[0041] Combination Figures 1 to 3 The bearing plane A is radially provided with guide grooves CH1 to CH4, and a limit member 121 that slides with the guide groove CH1, a limit member 122 that slides with the guide groove CH2, a limit member 123 that slides with the guide groove CH3, and a limit member 124 that slides with the guide groove CH4, wherein the limit member 121 can be connected to the driving rod G1 in the driving device, the limit member 122 can be connected to the driving rod G2 in the driving device, the limit member 123 can be connected to the driving rod G3 in the driving device, and the limit member 124 can be connected to the driving rod G4 in the driving device, that is, the guide grooves, the limit members and the driving rods in the driving device are in a one-to-one correspondence.

[0042] Specifically, in the initial state, Figure 2 As shown, the limiting members 121 to 124 are located at the circumferential edge of the carrying plane A (i.e., away from the central area of ​​the carrying plane A). The space formed by the limiting members 121 to 124 allows the wafer to pass through, and then the wafer can be placed on the top of the carrying plane A.

[0043] When the carrier 110 rotates, under the action of the driving device, the limit member 121 can slide along the guide groove CH1 to the central area of ​​the carrier plane A, the limit member 122 can slide along the guide groove CH2 to the central area of ​​the carrier plane A, the limit member 123 can slide along the guide groove CH3 to the central area of ​​the carrier plane A, and the limit member 124 can slide along the guide groove CH4 to the central area of ​​the carrier plane A. During this process, the clamping space formed by the limit members 121 to 124 gradually becomes smaller until the limit members 121 to 124 conflict with the edge of the wafer. In this way, the wafer can be confined in the clamping space formed by the limit members 121 to 124, so that the carrier can stably carry the wafer, thereby reducing the probability of the wafer being thrown out during rotation.

[0044] When the corresponding processing technology is completed, the carrier 110 stops rotating, and under the action of the driving device, the limit members 121 to 124 are reset to the initial position. The space formed by the limit members 121 to 124 allows the wafer to pass through, and then the wafer can be taken out from the carrying plane A.

[0045] It should be noted that Figures 1 to 3The shapes, numbers, and distribution positions of the guide grooves and limit members shown in the figure are merely examples, and are used to illustrate that when the carrier table rotates, by setting limit members and guide grooves that slide together, the limit members can come into contact with the wafer, so as to confine the wafer to the clamping space formed by the limit members. It should not be understood as a restriction on the wafer carrying device.

[0046] For example, the carrying plane can be provided with a larger number of guide grooves, such as 6 guide grooves, and correspondingly, the wafer carrying device is provided with limit members with the same number as the guide grooves; for another example, the shape of the guide groove can be a regular-shaped bar hole such as an elliptical or circular shape, or it can be an irregular shape. The embodiments of this specification do not impose any restrictions on this, as long as the sliding fit between the limit member and the guide groove can be achieved.

[0047] In a specific implementation, in order to improve the clamping effect of each limiting member on the wafer, when the guide grooves are provided in the radial direction of the bearing plane, the plurality of guide grooves are symmetrically distributed along the center of the bearing plane.

[0048] As a specific implementation example, refer to Figure 2 , the guide grooves CH1 to CH4 can be symmetrically distributed along the center of the bearing plane A. By making the guide grooves CH1 to CH4 symmetrically distributed along the center of the bearing plane A, under the same other conditions, in the same time period, the sliding distance of the limiter 121 along the guide groove CH1, the sliding distance of the limiter 122 along the guide groove CH2, the sliding distance of the limiter 123 along the guide groove CH3, and the sliding distance of the limiter 124 along the guide groove CH4 can be the same, and the limiters 121 to 124 can contact the wafer at the same time, which can prevent the wafer from tilting, thereby improving the parallelism between the wafer and the bearing plane A.

[0049] It can be understood that in some other optional implementation examples, a plurality of guide grooves may be unevenly distributed on the bearing plane, and the embodiments of this specification do not impose any limitation on the distribution positions of the guide grooves.

[0050] In some specific implementation examples of this specification, each limiting member can adopt the same structure to achieve the clamping effect on the wafer.

[0051] For ease of understanding and explanation, the structure of one of the limiters is used as an example for explanation below.

[0052] As an optional implementation example, continue to refer to Figures 1 to 3 The limiting member 121 may include a first limiting rod 1211, the first limiting rod 1211 may be slidably matched with the corresponding guide groove CH1, and the first end of the first limiting rod 1211 may be connected to the driving device (specifically, it may be Figure 2 Schematic diagram of the drive rod G1) connection.

[0053] Specifically, the first end of the first limiting rod 1211 can pass through the guide groove CH1 and be connected to the driving device. Then, under the action of the driving device (such as the driving rod G1), the first limiting rod 1211 can slide back and forth along the guide groove CH1 to change the size of the clamping space formed by the first limiting rod 1211 and other limiting rods.

[0054] It is understandable that the stoppers 122 to 124 may have the same structure as the stopper 121. Figure 1 and Figure 3 As shown, the limiting member 122 may include a first limiting rod 1221 .

[0055] During the rotation of the carrier, considering that relative movement may occur between the wafer and the conflicting stoppers, scratches may appear on the edge of the wafer, resulting in a decrease in the yield of subsequently formed devices.

[0056] In some optional implementation examples, the first limiting rod may be made of a material having chemical corrosion resistance, high temperature resistance, and oxidation resistance. For example, the material of the first limiting rod may be a fluorine-containing polymer material.

[0057] During the actual working process, the inventor further discovered that since the support platform will generate considerable centrifugal force during its rotation, long-term operation will cause wear at the contact point between the first limit rod and the wafer, or deformation and skewness of the first limit rod. The clamping space formed by multiple limit members may not be able to firmly clamp the wafer. When some of the first limit rods are severely deformed and skewed, the wafer is still at risk of being thrown out.

[0058] Based on this, continue to refer to Figures 1 to 3 The limiting member 121 may further include a second limiting rod 1212, the first end of the second limiting rod 1212 may be connected to the second end of the first limiting rod 1211, and the second end of the second limiting rod 1212 may face the central area of ​​the bearing plane A.

[0059] Specifically, when the first limit rod 1211 is deformed and skewed, the wafer is at risk of being thrown out. Since the second end of the second limit rod 1212 can be directed toward the central area of ​​the supporting plane A, the clamping space formed by the second limit rods of different limit members in the direction perpendicular to the supporting plane A can limit the movement range of the wafer to between the supporting plane A and each second limit rod. In this way, even if the first limit rod is deformed and skewed, the second limit rod can play a limiting role, so that the wafer is still located in the clamping space formed by the first limit rods and the second limit rods, and the supporting table can still stably carry the wafer.

[0060] It should be noted that, for the limiting member with a second limiting rod, the second limiting rod needs to meet the following conditions: 1) When each first limiting rod conflicts with the wafer, there are at least two second limiting rods whose axial projections overlap partially with the wafer; 2) When each limiting member is in other positions that do not conflict with the wafer, the space formed by the second limiting rod of each limiting member should be able to allow the wafer to pass through.

[0061] It is understandable that the limiting members 122 to 124 may also have a second limiting rod. Figure 1 and Figure 3 As shown, the limiting member 122 may have a second limiting rod 1222 .

[0062] In some optional implementation examples, the second limiting rod may be made of an elastic material, wherein the elastic material may include one or more of rubber, latex, polyurethane or other elastic materials.

[0063] In some optional embodiments of the present specification, when the limiting member includes a first limiting rod and a second limiting rod at the same time, the first end of the second limiting rod may be vertically connected to the second end of the first limiting rod.

[0064] By vertically connecting the first end of the second limiting rod to the second end of the first limiting rod, the contact area between the second limiting rod and the wafer can be increased while the size parameters of the second limiting rod are the same, thereby improving the clamping effect of the limiting member on the wafer.

[0065] For example, Figure 1 As shown, the first end of the second limiting rod 1212 can be vertically connected to the second end of the first limiting rod 1211 , and the first end of the second limiting rod 1222 can be vertically connected to the second end of the first limiting rod 1221 .

[0066] In some optional embodiments, the first limiting rod and the second limiting rod may be formed integrally, or may be formed separately, and the embodiments of this specification do not impose any limitation on this.

[0067] By using a limiting member having a first limiting rod and a second limiting rod, the movement range of the wafer can be limited to the space formed by the bearing plane, the first limiting rod and the second limiting rod, and the probability of the wafer being thrown out is greatly reduced.

[0068] In some optional embodiments of the present specification, according to actual needs, the sliding distance of the first limiting rod on the guide groove can be flexibly controlled by a corresponding driving device.

[0069] In some embodiments, a driving device may be configured for each limiting member to control the sliding distance of the limiting member respectively; or the sliding distance of each limiting member may be controlled simultaneously by the same driving device.

[0070] When a driving device is configured for each position limiting member, each driving device can adopt the same structure.

[0071] As an optional implementation example, refer to Figure 4 The schematic diagram of the structure of a driving device in the embodiment of this specification is shown in FIG. Figure 4 As shown, the driving device 130 can control the sliding distance of the limiting member 121, and the driving device 130 may include:

[0072] Housing 131;

[0073] The sliding member 132 contacts the inner wall of the housing 131 to form a driving chamber;

[0074] The elastic member 133 elastically cooperates with the sliding member 132 and is suitable for resetting the sliding member 132;

[0075] The driving rod G1 penetrates the housing 131 and is connected to the sliding member 132 and the limiting member 121 respectively.

[0076] Specifically, combined Figures 1 to 4 When the carrier 110 rotates, by driving the sliding member 132 to move along the first direction, the elastic member 133 can be compressed, and at the same time, the driving rod G1 can be driven to move along the inner wall of the shell 131, and then the limiting member 121 connected to the driving rod G1 can be driven to move along the guide groove CH1 toward the central area of ​​the carrying plane A, and then the size of the clamping space formed by the limiting member 121 and other limiting members can be changed until each limiting member conflicts with the wafer.

[0077] During the corresponding processing technology (such as wafer cleaning process), the current state of the sliding member 132 is maintained, that is, the driving rod G1 no longer moves along the inner wall of the shell 131, and the limiting member 121 connected to the driving rod G1 remains stationary.

[0078] When the carrier 110 stops rotating, the driving of the sliding member 132 stops, and the elastic member 133 is reset from the compressed state to the natural state. Under the elastic force of the elastic member 133 itself, the sliding member 132 can be driven to move in a second direction opposite to the first direction. Accordingly, the sliding member 132 can drive the driving rod G1 to move in the second direction, and then drive the limiting member 121 to move along the guide groove CH1 toward the direction away from the central area of ​​the carrying plane A, so that the space formed between the limiting members is convenient for taking out the wafer.

[0079] In a specific implementation example, in order to better control the movement process of the limiter, the structure of the driving device can be further expanded.

[0080] Continue to refer to Figure 4The driving device 130 may further include: a mounting plate 134 , which is fixedly connected to the inner wall of the shell 131 and connected to one end of the elastic member 133 .

[0081] When the sliding member 132 moves to the position of the mounting plate 134, the sliding member 132 stops moving, and the elastic member 133 is compressed to the surface of the mounting plate 134. Thus, the stroke of the elastic member 133 during compression or extension can be shortened, and the service life of the elastic member 133 can be increased.

[0082] Continue to refer to Figure 4 When the driving device 130 includes a mounting plate 134 , in order to realize the function of the driving rod G1 driving the limiting member 121 to move, the mounting plate 134 also has a through hole that allows the driving rod G1 to pass through.

[0083] During the process of driving the limit member to move, the elastic member 133 may not move along the set path (for example, straight up or straight down). When the elastic member 133 is restored from the compressed state to the natural state, the limit member may not move smoothly; or the elastic member 133 may be twisted when being compressed.

[0084] Based on this, continue to refer to Figure 4 The driving device 130 may further include a guide member 135 , and the guide member 135 may limit the deformation direction of the elastic member 133 .

[0085] Specifically, the elastic member 133 can be spirally wound on the surface of the guide member 135, and since one end of the guide member 135 can be connected to the sliding member 132, when the sliding member 132 moves up and down along the inside of the shell 131, the elastic member 133 can be compressed along the path defined by the guide member 135, or restored to a natural state.

[0086] It should be noted that if Figure 4 As shown, when the driving device 130 includes both the mounting plate 134 and the guide member 135 , the mounting plate 134 also has a through hole through which the guide member 135 can pass.

[0087] In practical applications, the sliding member 132 can be driven to move in a variety of ways to compress the elastic member 133 and drive the sliding member 132 to move.

[0088] As an optional implementation example, the sliding member 132 may be driven by ventilating air into the driving chamber.

[0089] For example, refer to Figure 4 The housing 131 may be provided with a driving port K1 for providing an air source to the driving chamber to drive the sliding member 132 to move.

[0090] Accordingly, the driving device 130 may also include an air source channel ( Figure 4 (not shown), is disposed in the supporting platform and communicated with the driving port K1.

[0091] Specifically, when in use, an air source (such as high-pressure gas) is introduced through the drive port K1, which will apply pressure to the sliding member 132, thereby driving the drive rod G1 to move downward and compressing the elastic member 133; when the air source is stopped, the sliding member 132 is not affected by the air force, so under the elastic force of the elastic member 133 itself, the sliding member 132 is bounced upward, thereby driving the drive rod G1 to move upward.

[0092] It can be understood that the driving devices respectively connected to the limiting members 122 to 124 can adopt the structure of the driving device 130 described in the above example, which will not be described in detail here.

[0093] In a specific implementation, when the corresponding processing is completed, the wafer needs to be transferred to the next processing equipment for processing. To facilitate the removal of the wafer, the carrier in the embodiment of this specification may also include a first area located on the surface of the carrier plane; a channel located inside the carrier and connected to the first area.

[0094] Specifically, gas can be provided to the first area through the channel, and under the action of the gas, the wafer can be lifted up so that the wafer can be suspended above the supporting plane, and then the wafer can be transferred to the next processing equipment through the corresponding grasping component (such as a robotic arm).

[0095] To facilitate understanding of the working principle of the wafer carrier device provided in the embodiments of this specification, the following Figures 1 to 4 , which is explained in detail through a specific example.

[0096] In the initial state, the limiting members 121 to 124 are located at the edge area of ​​the bearing plane A in the circumferential direction. The space formed by the limiting members 121 to 124 allows the wafer to pass through, and the wafer can be placed on the bearing plane A.

[0097] When the supporting platform 110 rotates, air can be ventilated to the driving port K1 through the air source channel, and then under the action of gas pressure, the sliding member 132 can move downward along the inner wall of the shell 131, and then the elastic member 133 can be compressed along the path defined by the guide member 135, and the driving rod G1 can be driven to move downward, and then the limit member 121 can slide along the guide groove CH1 toward the central area of ​​the supporting plane A; similarly, the limit members 122 to 124 can slide along the corresponding guide grooves toward the central area of ​​the supporting plane A, and the clamping space formed by each limit member becomes smaller until it conflicts with the edge of the wafer.

[0098] During the processing process, air is continuously ventilated into the driving chamber through the driving port K1. Under the action of air pressure, the sliding member 132 maintains the current state, the elastic member 133 is no longer compressed, the driving rod G1 stops moving downward, and the clamping space formed by the limit members remains unchanged and continues to interfere with the edge of the wafer.

[0099] When the processing technology is completed, the ventilation into the driving chamber is stopped, and the elastic member 133 is restored from the compressed state to the natural state. During this process, under the action of the elastic force of the elastic member 133 itself, the sliding member 132 can move upward along the inner wall of the shell 131, and drive the driving rod G1 to move upward, and then the limit member 121 can slide along the guide groove CH1 toward the center area away from the bearing plane A; similarly, the limit members 122 to 124 can slide along the corresponding guide grooves toward the center area away from the bearing plane A, and the space formed by each limit member becomes larger.

[0100] At this time, air can be ventilated to the first area through the channel so that the wafer is suspended in the air, making it easier to remove the wafer from the carrying plane A.

[0101] It should be noted that the supporting platform provided in the embodiments of this specification may actually include other components, such as a fixed bracket, a driving component (such as an air pump), etc. In order to facilitate the description of the technical solution of this specification and highlight the innovative part of this specification, in this specification, the components of the supporting platform that can be realized by the existing technology are omitted.

[0102] It is understandable that the above examples are only for illustrative purposes. In actual applications, those skilled in the art can adaptively select and / or deform the wafer carrier provided in the embodiments of this specification according to actual needs and application scenarios. For example, the number of some components in the wafer carrier can be changed; for another example, some components in the wafer carrier can be replaced equally. Based on this, more implementation plans of the wafer carrier can be extended, and the embodiments of this specification do not limit these extended plans.

[0103] This specification also provides a wafer transfer system corresponding to the wafer carrier device described in any of the above embodiments, which is introduced below. It should be noted that the content of the wafer transfer system described below can be referenced to the content of the wafer carrier device described above.

[0104] In a specific implementation, the wafer transfer system provided in the embodiments of this specification may include:

[0105] The wafer carrying device described in any of the above embodiments is used to carry a wafer;

[0106] A robotic arm is used for taking and placing the wafer.

[0107] Among them, the specific contents such as the structure, connection relationship, function, working principle, etc. of the wafer carrying equipment can be referred to the description and drawings of the relevant parts above, and will not be repeated here.

[0108] It is understood that the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined by the terms "first", "second", etc. may explicitly or implicitly include one or more of the features. Moreover, the terms "first", "second", etc. are used to distinguish similar objects and are not necessarily used to describe a specific order or indicate importance. It is understood that the terms used in this way are interchangeable where appropriate so that the embodiments of the present specification described herein can be implemented in an order other than those illustrated or described herein.

[0109] Although the embodiments of this specification are disclosed as above, the invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention, so the protection scope of the invention shall be subject to the scope defined by the claims.

Claims

1. A wafer carrying device, characterized in that: include: A carrying platform, the carrying platform having a carrying plane for carrying the wafer, and a plurality of guide grooves are arranged radially on the carrying plane; A stopper matched with the guide groove, wherein the matched stopper and the guide groove are slidably matched, and the number of the stopper is multiple; A driving device is connected to each stopper and drives each stopper to slide along the corresponding guide groove so that the stopper contacts the wafer.

2. The wafer carrier device according to claim 1, characterized in that: The limiting member comprises: The first limiting rod is slidably matched with the matching guide groove, and the first end of the first limiting rod is connected to the driving device.

3. The wafer carrying device according to claim 2, characterized in that: The limiting member also includes: A second limiting rod, wherein the first end of the second limiting rod is connected to the second end of the first limiting rod, and the second end of the second limiting rod faces the central area of ​​the bearing plane.

4. The wafer carrying device according to claim 3, characterized in that: The first end of the second limiting rod is vertically connected to the second end of the first limiting rod.

5. The wafer carrying device according to claim 1, characterized in that: The plurality of guide grooves are symmetrically distributed along the center of the bearing plane.

6. The wafer carrying device according to claim 1, characterized in that: The driving device comprises: case; A sliding member contacts the inner wall of the housing to form a driving chamber; an elastic member, elastically matched with the sliding member, and suitable for resetting the sliding member; The driving rod is penetrated through the housing and is connected to the sliding member and the limiting member respectively.

7. The wafer carrying device according to claim 6, characterized in that: The housing is provided with a driving port for providing an air source to the driving chamber to drive the sliding member to move; The driving device further includes: an air source channel, which is arranged in the supporting platform and communicated with the driving port.

8. The wafer carrying device according to claim 6, characterized in that: The driving device further comprises a guide member, which limits the deformation direction of the elastic member.

9. The wafer carrying device according to claim 1, characterized in that: The carrying platform further includes: a first area located on the surface of the carrying plane; The channel is located inside the supporting platform and is connected with the first area.

10. A wafer transfer system, characterized in that: include: The wafer carrier device according to any one of claims 1 to 9, suitable for carrying wafers; A robotic arm is used for taking and placing the wafer.

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