Continuous nickel plating device for nickel-plated copper wire

Abstract

The invention discloses a nickel-plated copper wire continuous nickel plating device, and relates to the technical field of nickel-plated copper wire processing, the nickel-plated copper wire continuous nickel plating device comprises a mounting plate, winding assemblies are arranged at the positions, close to the edges of the two sides, of the top of the mounting plate, and a purification assembly is arranged at the position, close to one winding assembly, of the top of the mounting plate. According to the continuous nickel plating device for the nickel-plated copper wire, when the copper wire needs to be subjected to nickel plating treatment, firstly, the copper wire penetrates through a nickel plating pool, and a driving pump is started, so that a nickel plating solution enters a temporary storage barrel through an output pipe; firstly, a conductivity sensor and a laser-induced breakdown spectrometer are used for detecting whether the content of each substance in the nickel liquid meets the standard or not, when it is detected that the content of a certain substance in the nickel plating liquid is reduced, a signal is transmitted to a controller, and an electromagnetic valve on the surface of a storage tank storing the substance is opened through the controller; therefore, the stability of the content of the nickel liquid is ensured.

Description

Technical Field

[0001] The invention relates to the technical field of nickel-plated copper wire processing, in particular to a continuous nickel-plating device for nickel-plated copper wire. Background Art

[0002] The continuous nickel plating device for nickel-plated copper wire is an automated equipment used to continuously deposit a layer of nickel plating on the copper wire. It continuously passes the bare copper wire through a tank containing a nickel plating solution, and deposits a uniform nickel layer on the surface of the copper wire through the electroplating process. The whole process is carried out continuously, and the copper wire passes through the device at a constant speed, thereby realizing large-scale and efficient nickel plating production. This is different from the batch nickel plating method, which requires the copper wire to be placed in the plating tank in sections, which is less efficient.

[0003] In the existing process of nickel plating copper wire, various organic and inorganic additives, such as brightener, leveler, and buffer, are added to the nickel plating solution. These additives are prone to decomposition and oxidation reactions during use, generating some impurities or precipitates. The decomposition rate of the additives is related to the temperature, pH value, and use time of the plating solution. Some impurities and precipitates will be generated. These impurities will affect the stability of the nickel solution and the quality of the plating layer. Therefore, the nickel solution needs to be filtered and purified regularly to remove impurities and precipitates before it is used. However, during the filtering process of the nickel solution, the continuous nickel plating device for the nickel-plated copper wire needs to be suspended, thereby reducing the working efficiency of the continuous nickel plating device for the nickel-plated copper wire.

[0004] Therefore, we propose a nickel-plated copper wire continuous nickel plating device to solve the above-mentioned problems. Summary of the invention

[0005] The object of the present invention is to provide a continuous nickel plating device for nickel-plated copper wire to solve the problem that when the nickel plating liquid needs to be replaced during the nickel plating process of the copper wire, the nickel plating of the copper wire needs to be suspended, which reduces the working efficiency of the nickel plating of the copper wire.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a continuous nickel plating device for nickel-plated copper wire, comprising a mounting plate, a winding assembly is arranged at the top of the mounting plate near the edges on both sides, a purification assembly is arranged at the top of the mounting plate near the position of one of the winding assemblies, a stabilizing assembly for maintaining the balance of nickel liquid is arranged at one end of the purification assembly, the stabilizing assembly comprises a temporary storage barrel, a servo motor is fixedly installed on the outer surface of the temporary storage barrel by screws, a stirring rod is fixedly connected to the output shaft of the servo motor, a conductivity sensor is arranged at the inner wall of the temporary storage barrel near one side edge, a laser induced breakdown spectrometer is arranged at the inner wall of the temporary storage barrel near the other side edge, a plurality of storage tanks are fixedly connected to the outer surface of the temporary storage barrel near the top, solenoid valves are arranged on the outer surfaces of the plurality of storage tanks, a temperature sensor is arranged on the outer surface of the temporary storage barrel, and semiconductor refrigeration plates for controlling the temperature of nickel liquid are arranged on opposite outer surfaces of the temporary storage barrel.

[0007] Preferably, both ends of the stirring rod are movably inserted into opposite exteriors of the temporary storage barrel, and one end of the temporary storage barrel is fixedly connected to a circulation pipe.

[0008] Preferably, the purification component includes a nickel plating pool, the bottom end of the circulation pipe is fixedly penetrated into the interior of the nickel plating pool, the bottom of the nickel plating pool is fixedly connected to the top of the mounting plate, and a controller is arranged on the outer surface of the nickel plating pool.

[0009] Preferably, limit rods are fixedly installed between the relative inner walls of the nickel plating pool near the edges on both sides, a driving pump is arranged on the top of the mounting plate, the input end of the driving pump is fixedly connected to a liquid inlet pipe, and one end of the liquid inlet pipe is fixedly passed through the interior of the nickel plating pool.

[0010] Preferably, the output end of the driving pump is fixedly connected to a liquid outlet pipe, one end of the liquid outlet pipe is fixedly connected to a purification chamber, a leak barrel is arranged inside the purification chamber, and one end of the purification chamber is fixedly connected to an output pipe.

[0011] Preferably, one end of the output pipe is fixedly inserted into the interior of the temporary storage barrel, the bottom of the temporary storage barrel is fixedly connected to the top of the nickel plating pool, and a pressure sensor is arranged on the outer surface of the purification chamber.

[0012] Preferably, the two winding assemblies each include a support frame, and a driving motor is fixedly mounted on the outer surface of the two support frames by screws.

[0013] Preferably, the output shafts of the two driving motors are both provided with winding rollers for retracting and releasing the copper wire, and clamping blocks are movably embedded between the opposite inner walls of the two supporting frames near the edges on both sides.

[0014] Preferably, a cleaning device for cleaning oil stains on the surface of the copper wire is provided on the top of the mounting plate, and the bottom of the cleaning device is fixedly connected to the top of the mounting plate by screws.

[0015] Preferably, a driving device for positioning the copper wire is arranged near the center of the top of the mounting plate, and the bottom of the driving device is fixedly connected to the top of the mounting plate by screws.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. When the copper wire needs to be nickel-plated, firstly, the copper wire is passed through the inside of the nickel plating pool, and the driving pump is started to allow the nickel plating solution to enter the inside of the temporary storage barrel through the output pipe. Firstly, the conductivity sensor and the laser induced breakdown spectrometer are used to detect whether the content of each substance in the nickel plating solution meets the standard. When it is detected that the content of a certain substance in the nickel plating solution is reduced, firstly a signal is transmitted to the controller, and the solenoid valve on the surface of the storage tank storing the substance is opened by the controller until the content of the substance in the nickel plating solution reaches the standard, thereby ensuring the stability of the nickel liquid content, and solving the problem that when the nickel plating solution needs to be replaced during the nickel plating process of the copper wire in the prior art, the nickel plating of the copper wire needs to be suspended, which reduces the working efficiency of the nickel plating of the copper wire.

[0018] 2. When the nickel plating liquid enters the purification chamber through the liquid outlet pipe, it enters the leak barrel through the small round hole on the surface of the leak barrel, and then the metal ion impurities in the solution are removed by the ion exchange resin placed in the leak barrel to purify the nickel liquid and prevent the nickel liquid in the nickel plating pool from containing too much sediment and affecting the nickel plating effect on the copper wire.

[0019] 3. In order to ensure that the temperature of the nickel liquid remains constant during the nickel plating process of the copper wire, when the nickel liquid enters the temporary storage barrel, the temperature in the temporary storage barrel is first detected by a temperature sensor. When the temperature in the temporary storage barrel is low, the semiconductor refrigeration sheet with the hot surface facing the inner wall of the temporary storage barrel can be electrically connected to the external power supply to heat the nickel liquid in the temporary storage barrel until the temperature of the nickel liquid in the temporary storage barrel reaches the required value, so that the nickel liquid is always in a constant temperature state. The quality of the nickel plating of the copper wire is further guaranteed by controlling the temperature of the nickel liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a front perspective view of a device for continuous nickel plating of nickel-plated copper wire according to the present invention;

[0021] Figure 2 It is a perspective view of the unfolded structure of a winding component of a continuous nickel plating device for nickel-plated copper wire of the present invention;

[0022] Figure 3 It is a partial three-dimensional diagram of a driving device of a continuous nickel plating device for nickel-plated copper wire of the present invention;

[0023] Figure 4 A partial three-dimensional diagram of a storage tank of a device for continuous nickel plating of nickel-plated copper wire according to the present invention;

[0024] Figure 5 It is a partial three-dimensional diagram of a purification component of a continuous nickel plating device for nickel-plated copper wire according to the present invention;

[0025] Figure 6 It is a perspective view of the partial structure of a nickel plating pool of a continuous nickel plating device for nickel-plated copper wire of the present invention;

[0026] Figure 7 It is a three-dimensional diagram of the structure of the purification chamber of a continuous nickel plating device for nickel-plated copper wire according to the present invention;

[0027] Figure 8 The present invention is a partially cutaway stereoscopic view of a stabilizing component of a device for continuous nickel plating of nickel-plated copper wire.

[0028] In the figure:

[0029] 1. Mounting plate; 2. Winding assembly; 201. Support frame; 202. Drive motor; 203. Winding roller; 204. Block; 3. Cleaning device; 4. Drive device; 5. Purification assembly; 501. Nickel plating pool; 502. Controller; 503. Limit rod; 504. Drive pump; 505. Liquid inlet pipe; 506. Liquid outlet pipe; 507. Purification chamber; 508. Leak barrel; 509. Pressure sensor; 510. Output pipe; 6. Stabilization assembly; 601. Temporary storage barrel; 602. Servo motor; 603. Stirring rod; 604. Conductivity sensor; 605. Laser induced breakdown spectrometer; 606. Storage tank; 607. Solenoid valve; 608. Temperature sensor; 609. Semiconductor refrigeration sheet; 7. Circulation pipe. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] See also Figure 1-8The present invention provides a technical solution: a device for continuous nickel plating of nickel-plated copper wire, comprising a mounting plate 1, a winding assembly 2 is arranged at the top of the mounting plate 1 near the edges of both sides, a purification assembly 5 is arranged at the top of the mounting plate 1 near the position of one of the winding assemblies 2, a stabilizing assembly 6 for maintaining the balance of nickel liquid is arranged at one end of the purification assembly 5, the stabilizing assembly 6 comprises a temporary storage barrel 601, a servo motor 602 is fixedly installed on the outer surface of the temporary storage barrel 601 by screws, a stirring rod 603 is fixedly connected to the output shaft of the servo motor 602, a conductivity sensor 604 is arranged at the inner wall of the temporary storage barrel 601 near one side edge, a laser induced breakdown spectrometer 605 is arranged at the inner wall of the temporary storage barrel 601 near the edge of the other side, a plurality of storage tanks 606 are fixedly connected at the outer surface of the temporary storage barrel 601 near the top, solenoid valves 607 are arranged on the outer surfaces of the plurality of storage tanks 606, a temperature sensor 608 is arranged on the outer surface of the temporary storage barrel 601, and semiconductor refrigeration sheets 6 for controlling the temperature of nickel liquid are arranged on the opposite outer surfaces of the temporary storage barrel 601 09, the two ends of the stirring rod 603 are respectively movably penetrated to the opposite outside of the temporary storage barrel 601, one end of the temporary storage barrel 601 is fixedly connected with the circulation pipe 7, one end of the output pipe 510 is fixedly penetrated to the interior of the temporary storage barrel 601, the bottom of the temporary storage barrel 601 is fixedly connected to the top of the nickel plating pool 501, and the outer surface of the purification warehouse 507 is provided with a pressure sensor 509, and the two winding components 2 include a support frame 201, and the outer surfaces of the two support frames 201 are fixedly installed with drive motors 202 by screws. The output shafts of the two drive motors 202 are both provided with winding rollers 203 for retracting and releasing copper wires, and blocks 204 are movably embedded near the edges on both sides between the relative inner walls of the two support frames 201. A cleaning device 3 for cleaning oil stains on the surface of the copper wire is provided on the top of the mounting plate 1, and the bottom of the cleaning device 3 is fixedly connected to the top of the mounting plate 1 by screws. A driving device 4 for positioning the copper wire is provided near the center of the top of the mounting plate 1, and the bottom of the driving device 4 is fixedly connected to the top of the mounting plate 1 by screws.

[0032] In this embodiment, when the copper wire needs to be nickel-plated, a certain amount of nickel-plating liquid is first placed in the nickel-plating pool 501, and then the winding roller 203 wound with the copper wire is set on the support frame 201 near the cleaning device 3, and then one end of the copper wire is passed through the cleaning device 3 to clean the copper wire, wherein the cleaning device 3 uses electrolysis to remove dirt on the surface of the copper wire. The copper wire serves as an anode. In the alkaline electrolyte, the grease and oxide on the surface of the copper wire will be oxidized and decomposed, and then dissolved in the electrolyte and precipitated. This is an efficient cleaning method that can effectively remove stubborn dirt. Its working principle is based on electrochemical reaction, and the cleaning purpose is achieved through the oxidation-reduction effect generated by the electrode reaction. The outer surface of the cleaned copper wire is embedded in Figure 3The driving device 4 is then started to drive the copper wire to continue moving forward, and at the same time, one end of the copper wire is passed through the arc groove at the center of the driving device 4 shown in FIG. Figure 4The circular hole shown in the surface of the nickel plating pool 501 is inserted into the interior of the nickel plating pool 501, and then passes through the bottom of the two limiting rods 503 to limit the steel wire, so that the copper wire is parallel to the nickel plating pool 501, and finally the surface of the copper wire is completely in contact with the nickel liquid in the nickel plating pool 501, and then passes through another circular hole in the nickel plating pool 501, and finally is wound around the surface of the winding roller 203 close to the nickel plating pool 501, and then the driving motor 202 in the winding assembly 2 close to the nickel plating pool 501 can be started to drive the winding roller 203 connected thereto to rotate, so as to wind up the copper wire passing through the nickel plating pool 501, thereby completing the nickel plating of the copper wire. During the nickel plating process, the copper wire serving as the anode will undergo oxidation and dissolution to generate copper ions. And enter the nickel plating solution, thereby increasing the concentration of copper ions in the nickel plating solution. In addition, the nickel plating solution contains various additives, such as brighteners, buffers, and wetting agents. These additives are easy to react with dissolved copper ions to generate insoluble compounds, thereby forming precipitates, which in turn lead to the generation of precipitates in the nickel plating solution and the decrease in the content of a certain substance in the nickel plating solution, thereby causing the quality of the nickel solution to decrease. In order to prevent this phenomenon from occurring, first start the drive pump 504 to drive the liquid inlet pipe 505 to extract the nickel plating solution into the nickel plating pool 501. The nickel plating solution enters the interior of the purification bin 507 through the liquid outlet pipe 506, and then enters the interior of the temporary storage barrel 601 through the output pipe 510. First, it passes through the conductivity sensor 604 and the laser induced breakdown spectrometer 605. Detect whether the content of each substance in the nickel solution meets the standard. The conductivity sensor 604 is used as a fast and preliminary monitoring method to detect the overall change of the conductivity of the nickel solution. If the conductivity changes significantly, it indicates that the composition of the nickel solution has changed. The laser induced breakdown spectrometer 605 is a plasma spectrum generated based on the interaction between laser and matter. It uses high-energy laser pulses to instantly ablate the sample surface to generate high-temperature and high-pressure plasma. This plasma contains atoms and ions of the ablated substance, which will emit characteristic spectra in the process of returning to the ground state. By analyzing the characteristic spectral line intensities of different elements in these spectra, the content of each substance in the sample can be determined. When it is detected that the content of a certain substance in the nickel plating solution is reduced, First, a signal is transmitted to the controller 502, and the solenoid valve 607 on the surface of the storage tank 606 storing the substance is opened by the controller 502, so that a small amount of the substance is continuously transported to the inside of the temporary storage barrel 601 until the conductivity sensor 604 and the laser induced breakdown spectrometer 605 detect that the content of the substance in the nickel plating solution reaches the standard. In order to achieve timely and sufficient mixing of the substance added to the nickel liquid with the nickel liquid, the servo motor 602 is started to drive the stirring rod 603 to rotate, thereby stirring the nickel liquid flowing into the temporary storage barrel 601 to achieve sufficient mixing between the additive and the nickel liquid. The mixed nickel liquid is then refluxed to the inside of the nickel plating pool 501 through the circulation pipe 7. By circulating the nickel liquid in the nickel plating pool 501 and performing material addition processing,Thus, the nickel liquid content is ensured to be stable, and there is no need to suspend the nickel-plating copper wire continuous nickel plating device, which solves the problem in the prior art that the nickel plating of the copper wire needs to be suspended when the nickel plating liquid needs to be replaced during the nickel plating process of the copper wire, thereby reducing the efficiency of the nickel plating of the copper wire.

[0033] like Figure 1 and Figure 5-Figure 8 As shown, the purification component 5 includes a nickel plating pool 501, the bottom end of the circulation pipe 7 is fixedly passed through the interior of the nickel plating pool 501, the bottom of the nickel plating pool 501 is fixedly connected to the top of the mounting plate 1, a controller 502 is arranged on the outer surface of the nickel plating pool 501, and limiting rods 503 are fixedly installed between the relative inner walls of the nickel plating pool 501 near the edges on both sides, a driving pump 504 is arranged on the top of the mounting plate 1, the input end of the driving pump 504 is fixedly connected with a liquid inlet pipe 505, one end of the liquid inlet pipe 505 is fixedly passed through the interior of the nickel plating pool 501, the output end of the driving pump 504 is fixedly connected with a liquid outlet pipe 506, one end of the liquid outlet pipe 506 is fixedly connected with a purification bin 507, a leak barrel 508 is arranged inside the purification bin 507, and one end of the purification bin 507 is fixedly connected with an output pipe 510.

[0034] In this embodiment, when the nickel plating solution enters the interior of the purification chamber 507 through the liquid outlet pipe 506, it enters the interior of the leak barrel 508 through the small circular hole on the surface of the leak barrel 508, and then the metal ion impurities in the solution are removed by the ion exchange resin placed in the leak barrel 508. Among them, the ion exchange resin is an insoluble high molecular polymer, and its structure contains many charged active groups. These active groups can undergo reversible exchange reactions with ions in the solution, thereby achieving the purpose of separation and purification, including some heavy metal ions that may affect the quality of nickel plating, thereby achieving the purification of the nickel plating solution. When the pressure sensor 509 detects that the pressure in the purification chamber 507 is too high, it indicates that there are many metal impurities in the ion exchange resin, and the metal impurities can be removed. Figure 4 The protective cover on the top of the purification chamber 507 is taken out, so that the leak barrel 508 in the purification chamber 507 is replaced. By purifying the nickel plating liquid, the nickel liquid in the nickel plating pool 501 is prevented from containing too much sediment to affect the nickel plating effect on the copper wire.

[0035] like Figure 1-Figure 2 and Figure 4-Figure 8As shown, a device for continuous nickel plating of nickel-plated copper wire comprises a mounting plate 1, a winding assembly 2 is arranged at the top of the mounting plate 1 near the edges on both sides, a purification assembly 5 is arranged at the top of the mounting plate 1 near the position of one of the winding assemblies 2, a stabilizing assembly 6 for maintaining the balance of nickel liquid is arranged at one end of the purification assembly 5, the stabilizing assembly 6 comprises a temporary storage barrel 601, a servo motor 602 is fixedly installed on the outer surface of the temporary storage barrel 601 by screws, a stirring rod 603 is fixedly connected to the output shaft of the servo motor 602, a conductivity sensor 604 is arranged at the inner wall of the temporary storage barrel 601 near one edge, a laser induced breakdown spectrometer 605 is arranged at the inner wall of the temporary storage barrel 601 near the edge of the other side, a plurality of storage tanks 606 are fixedly connected at the outer surface of the temporary storage barrel 601 near the top, solenoid valves 607 are arranged on the outer surfaces of the plurality of storage tanks 606, a temperature sensor 608 is arranged on the outer surface of the temporary storage barrel 601, and semiconductor cooling sheets 609 for controlling the temperature of the nickel liquid are arranged on the opposite outer surfaces of the temporary storage barrel 601.

[0036] In this embodiment, in order to ensure that the temperature of the nickel liquid remains constant during the nickel plating process of the copper wire, when the nickel liquid enters the temporary storage barrel 601, the temperature inside the temporary storage barrel 601 is first detected by the temperature sensor 608, wherein the cold surface of one semiconductor refrigeration plate 609 faces the interior of the temporary storage barrel 601, and the hot surface of the other semiconductor refrigeration plate 609 faces the interior of the temporary storage barrel 601. When the temperature inside the temporary storage barrel 601 is low, the semiconductor refrigeration plate 609 with the hot surface facing the inner wall of the temporary storage barrel 601 can be electrically connected to an external power supply to heat the nickel liquid in the temporary storage barrel 601. The working principle of the semiconductor refrigeration plate 609 is an existing mature technology and will not be introduced in detail here. Until the temperature of the nickel liquid in the temporary storage barrel 601 reaches the required value, the nickel liquid is always in a constant temperature state, and the quality of the nickel plating of the copper wire is further guaranteed by controlling the temperature of the nickel liquid.

[0037] The use method and working principle of the device: When the copper wire needs to be nickel-plated, firstly, a certain amount of nickel-plating liquid is put into the nickel-plating pool 501, and then the winding roller 203 with the copper wire wound is set on the support frame 201 near the cleaning device 3, and then one end of the copper wire is passed through the cleaning device 3 to clean the copper wire. The copper wire is embedded in the nickel-plating pool 501. Figure 3 The driving device 4 is then started to drive the copper wire to continue moving forward, and at the same time, one end of the copper wire is passed through the arc groove at the center of the driving device 4 shown in FIG. Figure 4The circular hole shown in the figure provided on the surface of the nickel plating pool 501 is inserted into the interior of the nickel plating pool 501, and then the steel wire is limited through two limiting rods 503, so that the surface of the copper wire contacts the nickel liquid in the nickel plating pool 501, and then passes through another circular hole in the nickel plating pool 501, and finally is wound on the surface of the winding roller 203 close to the nickel plating pool 501, and then the driving motor 202 in the winding assembly 2 close to the nickel plating pool 501 can be started to drive the winding roller 203 connected thereto to rotate, so as to wind up the copper wire passing through the nickel plating pool 501, thereby completing the nickel plating of the copper wire. During the nickel plating process of the copper wire, the nickel liquid will change. The driving pump 504 is started to drive the liquid inlet pipe 505 to extract the nickel plating liquid into the nickel plating pool 501. The nickel plating liquid enters the purification chamber 507 through the liquid outlet pipe 506, and then enters the leakage barrel 508 through the small round holes on the surface of the leakage barrel 508. Then, the metal ion impurities in the solution are removed by the ion exchange resin placed in the leakage barrel 508, thereby purifying the nickel plating liquid. When the pressure sensor 509 detects that the pressure in the purification chamber 507 is too high, it indicates that there are too many metal impurities in the ion exchange resin, and the nickel plating liquid can be purified. Figure 4 The protective cover on the upper part of the purification bin 507 shown is taken out, so as to replace the leak barrel 508 in the purification bin 507. By purifying the nickel plating solution, the nickel plating solution in the nickel plating pool 501 is prevented from containing too much sediment and affecting the nickel plating effect on the copper wire. The purified nickel plating solution enters the temporary storage barrel 601 through the output pipe 510. First, the conductivity sensor 604 and the laser induced breakdown spectrometer 605 are used to detect whether the content of each substance in the nickel plating solution meets the standard. When it is detected that the content of a certain substance in the nickel plating solution is reduced, a signal is first transmitted to the controller 502, and the solenoid valve 607 on the surface of the storage tank 606 storing the substance is opened by the controller 502, so that a small amount of the substance is continuously transported to the interior of the temporary storage barrel 601 until the conductivity sensor 604 and the laser induced breakdown spectrometer 605 detect that the content of the substance in the nickel plating solution meets the standard. In order to achieve the nickel plating solution, The added substance is mixed with the nickel liquid in time and fully, the servo motor 602 is started, and the stirring rod 603 is driven to rotate, so that the nickel liquid flowing into the temporary storage barrel 601 is stirred to achieve full mixing between the additive and the nickel liquid. The mixed nickel liquid is refluxed to the inside of the nickel plating pool 501 through the circulation pipe 7. By circulating the nickel liquid in the nickel plating pool 501 and adding the material, the stability of the nickel liquid content is guaranteed, and there is no need to suspend the nickel-plated copper wire continuous nickel plating device. When the nickel plating solution enters the inside of the purification bin 507 through the liquid outlet pipe 506, it enters the inside of the leakage barrel 508 through the small circular hole on the surface of the leakage barrel 508, and then the metal ion impurities in the solution are removed by the ion exchange resin placed in the leakage barrel 508. When the pressure sensor 509 detects that the pressure in the purification bin 507 is too high, it indicates that there are many metal impurities in the ion exchange resin, and the like can be removed. Figure 4 The protective cover on the upper part of the purification chamber 507 is taken out, so that the leak barrel 508 in the purification chamber 507 can be replaced.

[0038] The wiring diagram of the drive motor 202, controller 502, drive pump 504, pressure sensor 509, servo motor 602, conductivity sensor 604, laser induced breakdown spectrometer 605, solenoid valve 607, temperature sensor 608 and semiconductor cooling sheet 609 in the present invention belongs to the common knowledge in the field, and its working principle is a well-known technology, and its model is selected according to the actual use. Therefore, the drive motor 202, controller 502, drive pump 504, pressure sensor 509, servo motor 602, conductivity sensor 604, laser induced breakdown spectrometer 605, solenoid valve 607, temperature sensor 608 and semiconductor cooling sheet 609. The control method and wiring arrangement are not explained in detail.

[0039] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A device for continuous nickel plating of nickel-plated copper wire, comprising a mounting plate (1), a winding assembly (2) being arranged at the top of the mounting plate (1) near both side edges, a purification assembly (5) being arranged at the top of the mounting plate (1) near one of the winding assemblies (2), and characterized in that: A stabilizing component (6) for maintaining the balance of the nickel liquid is arranged at one end of the purification component (5), the stabilizing component (6) comprising a temporary storage barrel (601), a servo motor (602) being fixedly mounted on the outer surface of the temporary storage barrel (601) by means of screws, the output shaft of the servo motor (602) being fixedly connected to a stirring rod (603), a conductivity sensor (604) being arranged near one edge of the inner wall of the temporary storage barrel (601), a laser induced breakdown spectrometer (605) being arranged near the other edge of the inner wall of the temporary storage barrel (601), a plurality of storage tanks (606) being fixedly connected near the top of the outer surface of the temporary storage barrel (601), the outer surfaces of the plurality of storage tanks (606) being all provided with solenoid valves (607), a temperature sensor (608) being arranged on the outer surface of the temporary storage barrel (601), and semiconductor cooling plates (609) for controlling the temperature of the nickel liquid being all arranged on opposite outer surfaces of the temporary storage barrel (601).

2. The continuous nickel plating device for nickel-plated copper wire according to claim 1, characterized in that: The two ends of the stirring rod (603) are respectively movably penetrated to the opposite exterior of the temporary storage barrel (601), and one end of the temporary storage barrel (601) is fixedly connected to a circulation pipe (7).

3. The continuous nickel plating device for nickel-plated copper wire according to claim 2, characterized in that: The purification component (5) includes a nickel plating pool (501), the bottom end of the circulation pipe (7) is fixedly connected to the inside of the nickel plating pool (501), the bottom of the nickel plating pool (501) is fixedly connected to the top of the mounting plate (1), and a controller (502) is arranged on the outer surface of the nickel plating pool (501).

4. The continuous nickel plating device for nickel-plated copper wire according to claim 3, characterized in that: Limit rods (503) are fixedly installed between the opposite inner walls of the nickel plating pool (501) near the edges on both sides, a driving pump (504) is arranged on the top of the mounting plate (1), an input end of the driving pump (504) is fixedly connected to a liquid inlet pipe (505), and one end of the liquid inlet pipe (505) is fixedly passed through the interior of the nickel plating pool (501).

5. The continuous nickel plating device for nickel-plated copper wire according to claim 4, characterized in that: The output end of the driving pump (504) is fixedly connected to a liquid outlet pipe (506), one end of the liquid outlet pipe (506) is fixedly connected to a purification chamber (507), a leak barrel (508) is arranged inside the purification chamber (507), and one end of the purification chamber (507) is fixedly connected to an output pipe (510).

6. The continuous nickel plating device for nickel-plated copper wire according to claim 5, characterized in that: One end of the output tube (510) is fixedly connected to the interior of the temporary storage barrel (601), the bottom of the temporary storage barrel (601) is fixedly connected to the top of the nickel plating pool (501), and a pressure sensor (509) is arranged on the outer surface of the purification chamber (507).

7. The continuous nickel plating device for nickel-plated copper wire according to claim 6, characterized in that: The two winding assemblies (2) each comprise a support frame (201), and a driving motor (202) is fixedly mounted on the outer surface of the two support frames (201) by means of screws.

8. The nickel-plated copper wire continuous nickel plating device according to claim 7, characterized in that: The output shafts of the two driving motors (202) are both provided with winding rollers (203) for retracting and releasing the copper wire, and clamping blocks (204) are movably embedded between the opposite inner walls of the two support frames (201) near the edges on both sides.

9. The continuous nickel plating device for nickel-plated copper wire according to claim 8, characterized in that: A cleaning device (3) for cleaning oil stains on the surface of the copper wire is arranged on the top of the mounting plate (1), and the bottom of the cleaning device (3) is fixedly connected to the top of the mounting plate (1) by means of screws.

10. The continuous nickel plating device for nickel-plated copper wire according to claim 9, characterized in that: A driving device (4) for positioning the copper wire is arranged near the center of the top of the mounting plate (1), and the bottom of the driving device (4) is fixedly connected to the top of the mounting plate (1) by means of screws.

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