Phase change heat storage module with high heat conduction efficiency

Abstract

The invention belongs to the related field of phase change thermal control devices, and discloses a high-heat-conduction-efficiency phase change heat storage module which comprises a heat storage shell, a heat transfer plate assembly, a bottom plate and a flow channel cover plate, a heat storage inner cavity used for containing a phase change material is formed in the heat storage shell, and the heat storage shell comprises a liquid cooling interface, a liquid cooling flow channel and a heat transfer cavity; the heat transfer plate assembly is tightly attached to the heat transfer cavity and comprises a plurality of heat transfer plates which isolate the heat storage inner cavity into a plurality of small cavities, so that heat is quickly and uniformly diffused and transferred to the phase change material; the bottom plate and the flow channel changing part are arranged on the upper side and the lower side of the heat storage shell correspondingly. By means of the phase change heat storage module, the phase change heat storage module has the composite heat dissipation function of efficient heat transfer, efficient energy storage and heat absorption and liquid cooling heat dissipation, and the technical problems that in the prior art, heat dissipation is not uniform, the phase change material utilization rate is low, and the thermal transient response speed is low are effectively solved; therefore, the antenna is especially suitable for high-efficiency heat dissipation application occasions such as an active phased array antenna and the like.

Description

Technical Field

[0001] The present invention belongs to the field related to phase change thermal control devices, and more specifically, relates to a phase change heat storage module with high thermal conductivity efficiency. Background Art

[0002] Active phased array antennas have been widely used in many fields. With the development and progress of science and technology, the design and development of power amplifier chips for phased array antenna T / R components have a trend of high power and miniaturization, which also leads to increasingly severe heat dissipation problems for active phased array antennas.

[0003] Specifically, in some working conditions where the application space is strictly limited, the thermal environment is complex and heat is difficult to transfer to the outside, so structural heat sinks and phase change heat storage are usually selected for heat dissipation. However, the structural parts in the prior art, such as aluminum alloys, have small heat sinks and poor heat storage capacity. When the phased array antenna has high thermal power consumption, it is difficult to store heat and dissipate heat through the heat sink of the structural parts themselves. In addition, due to the low thermal conductivity of the phase change material itself, traditional phase change radiators have problems such as uneven heat dissipation, low utilization of phase change materials, and low thermal transient response speed. It is difficult to meet the heat dissipation requirements under high power heat consumption, and thus it is impossible to ensure the temperature environment for the normal operation of the phased array antenna. Summary of the invention

[0004] In response to one or more of the above defects or needs of the prior art, the present invention provides a phase change heat storage module with high thermal conductivity efficiency, wherein by studying and improving its internal structure composition, especially the specific structure and setting method of key components such as the heat transfer plate assembly and the heat storage shell, the phase change heat storage module can have the composite heat dissipation functions of efficient heat transfer, efficient energy storage heat absorption and liquid cooling, and effectively solves the technical problems of existing similar products such as uneven heat dissipation, low utilization rate of phase change materials, and low thermal transient response speed. Therefore, it is particularly suitable for high-efficiency heat dissipation applications such as active phased array antennas.

[0005] To achieve the above object, according to the present invention, a phase change heat storage module with high thermal conductivity is provided, characterized in that the phase change heat storage module comprises a heat storage shell, a heat transfer plate assembly, a bottom plate and a flow channel cover plate, wherein:

[0006] The interior of the heat storage shell constitutes a heat storage inner cavity for accommodating phase change materials, and includes a liquid cooling interface, a liquid cooling channel and a heat transfer cavity, wherein the external liquid cooling medium enters through one of the liquid cooling interfaces, flows through the heat transfer cavity via the liquid cooling channel to perform heat exchange, and then flows out from the other liquid cooling interface; the heat transfer cavity serves as the heat input area of ​​the entire phase change heat storage module, and its wall surface is in contact with the external heat transfer device, and a heat conduction area is formed in the heat storage shell and its interior;

[0007] The heat transfer plate assembly is embedded in the heat storage cavity and is closely attached to the heat transfer area formed by the heat transfer cavity. It includes a plurality of heat transfer plates that further isolate the heat storage cavity into a plurality of small cavities, thereby allowing heat to diffuse quickly and evenly in the heat storage cavity and transfer to the phase change material in the heat storage cavity.

[0008] The bottom plate is arranged at the bottom of the heat storage shell and is welded with the heat storage shell to form a sealed integrated structure;

[0009] The flow channel cover plate is arranged on the top of the heat storage shell and is welded so that the liquid cooling flow channel forms a sealed flow channel.

[0010] As a further preferred embodiment of the present invention, the heat transfer plate assembly preferably comprises a first heat transfer plate, a second heat transfer plate, a third heat transfer plate and a fourth heat transfer plate, wherein:

[0011] The first heat transfer plate and the second heat transfer plate are kept opposite to each other, and each of them comprises a heat conductive substrate, a plurality of straight heat pipes and a plurality of bent heat pipes, wherein the heat conductive substrate is a flat plate structure with a plurality of parallel ribs on the side, and a plurality of circular grooves are respectively opened in each of the parallel ribs along the vertical direction, thereby installing the plurality of straight heat pipes and enhancing the axial heat conduction; in addition, a plurality of grooves bent in different forms are arranged on the flat plate structure at intervals, thereby installing the plurality of bent heat pipes and enhancing the circumferential heat conduction and radial heat conduction at the same time;

[0012] The third heat transfer plate and the fourth heat transfer plate are arranged adjacent to each other between the first heat transfer plate and the second heat transfer plate. They are both flat plate structures, wherein a plurality of grooves bent in different forms are arranged on the flat plate structure at intervals, and bent heat pipes are installed correspondingly.

[0013] As a further preferred embodiment of the present invention, the first heat transfer plate comprises a first heat conductive substrate, a plurality of first straight heat pipes, a bent heat pipe I, a bent heat pipe II, a bent heat pipe III and a bent heat pipe IV, wherein a flat plate structure with a plurality of parallel ribs is provided on the side of the first heat conductive substrate, and a plurality of first circular grooves are respectively opened in each of the parallel ribs along the vertical direction, thereby installing the plurality of first straight heat pipes; in addition, a plurality of first grooves bent in different forms are arranged on the flat plate structure at intervals from each other, thereby installing the bent heat pipe I, the bent heat pipe II, the bent heat pipe III and the bent heat pipe IV, and playing the role of simultaneously enhancing circumferential heat conduction and radial heat conduction;

[0014] The second heat transfer plate is arranged front-to-back opposite to the first heat transfer plate and has a mirror image structure, and includes a corresponding second heat conductive substrate, a straight heat pipe and a bent heat pipe;

[0015] The third heat transfer plate comprises a third heat conductive substrate, a bent heat pipe V, a bent heat pipe VI and a bent heat pipe VII, wherein the third heat conductive substrate is a flat plate structure, and a plurality of grooves are arranged on the third heat conductive substrate at intervals, thereby installing the bent heat pipe V, the bent heat pipe VI and the bent heat pipe VII;

[0016] The fourth heat transfer plate includes a fourth heat conducting substrate and a bent heat pipe VIII, wherein the fourth heat conducting substrate is a flat plate structure, and a plurality of grooves are arranged on the fourth heat conducting substrate at intervals, thereby installing the bent heat pipe VIII.

[0017] As a further preferred embodiment of the present invention, the tops and bottoms of the first heat-conducting substrate, the second heat-conducting substrate, the third heat-conducting substrate, and the fourth heat-conducting substrate are preferably also provided with notches, respectively, and the notches are used to promote the phase change material in a molten state to flow in the heat storage cavity and fill the entire heat storage cavity.

[0018] As a further preferred embodiment of the present invention, the heat-conducting substrates of the first heat transfer plate, the second heat transfer plate, the third heat transfer plate and the fourth heat transfer plate are preferably welded to form a whole with the heat pipe by soldering.

[0019] As a further preferred embodiment of the present invention, the heat storage shell preferably further includes a reinforcing pillar and a limiting boss, wherein the reinforcing pillar is arranged in the inner cavity of the heat storage shell to enhance the overall structural rigidity, and at the same time enhance the connection between the heat storage shell and the bottom plate and the axial heat conduction performance; the limiting boss is used to provide a limit for the heat transfer plate assembly, and provide a welding area to ensure that the heat transfer plate assembly and the heat storage shell are fitted together as one.

[0020] As a further preferred embodiment of the present invention, the heat storage shell preferably further includes a welding step, which is provided at the welding position between the inner cavity side wall of the heat storage shell, the reinforcing pillar and the liquid cooling channel and the bottom plate and the channel cover plate, so as to ensure overlapping with a required gap. Accordingly, the heat storage shell and the bottom plate and the channel cover plate are preferably welded by a vacuum electron beam with local heating.

[0021] As a further preferred embodiment of the present invention, the heat storage shell is preferably made of aluminum alloy, and the heat transfer plate assembly is preferably made of copper alloy; accordingly, the heat storage shell and the heat transfer plate assembly are preferably welded by soldering.

[0022] As a further preferred embodiment of the present invention, the liquid cooling interface is preferably arranged on the outside of the bottom of the heat storage shell and isolated from the heat storage inner cavity; the liquid cooling channel is preferably arranged on the top surface of the heat storage shell and arranged around the heat transfer cavity.

[0023] As a further preferred embodiment of the present invention, the liquid cooling interface is preferably sealed using a double sealing ring structure.

[0024] As a further preferred embodiment of the present invention, the phase change material is preferably filled into the heat storage inner cavity by vacuum filling in a molten state.

[0025] As a further preferred embodiment of the present invention, the phase change heat storage module is used for efficient heat dissipation of products such as active phased array antennas.

[0026] In general, the above technical solution conceived by the present invention has the following technical advantages compared with the prior art:

[0027] (1) The present invention arranges a heat transfer plate assembly in the heat storage cavity and makes targeted improvements to the arrangement and working mechanism of the heat transfer plate assembly in the heat storage cavity, thereby effectively solving the problem that the phase change material has low thermal conductivity and heat is difficult to transfer quickly and be fully absorbed, and meets the heat dissipation requirements under instantaneous high power heat consumption;

[0028] (2) The present invention further optimizes the specific structure and material selection of the heat transfer plate. Many actual tests have shown that it has the characteristics of high heat dissipation efficiency, compact structure, and small contact thermal resistance, and can meet the heat dissipation requirements of high power, high heat flux density, and multiple heat sources;

[0029] (3) The present invention also makes a targeted design for the specific structural composition and setting method of the heat storage shell, which can not only realize the integrated design of liquid cooling and phase change heat storage, but also meet the heat dissipation requirements of the equipment during long-term ground joint adjustment, further improving the heat dissipation capacity of the heat storage module;

[0030] (4) The present invention uses a local heating vacuum electron beam welding method to perform cavity welding and flow channel welding, which can effectively solve the welding problems of incompatibility between copper alloy and thin-walled aluminum alloy brazing and heat pipe being unsuitable for vacuum brazing;

[0031] (5) In addition, the present invention adopts a vacuum filling method to ensure that no gas remains in the heat storage cavity and that the molten phase change material fills the entire heat storage cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is an overall exploded stereogram of the phase change heat storage module provided in this application;

[0033] Figure 2 is a cross-sectional view of the overall structure of the phase change heat storage module provided in this application;

[0034] Figure 3is a layout diagram of the heat transfer plate assembly in the heat storage cavity according to the preferred embodiment of the present application;

[0035] Figure 4 is a structural stereogram of a heat storage housing according to a preferred embodiment of the present application;

[0036] Figure 5 is another structural stereogram of the heat storage housing according to a preferred embodiment of the present application;

[0037] Figure 6 is a schematic diagram of the inner cavity of a heat storage shell according to a preferred embodiment of the present application;

[0038] Figure 7 is a schematic diagram of the flow channel arrangement of the heat storage shell according to the preferred embodiment of the present application;

[0039] Figure 8 is a schematic diagram of a double sealing structure of a liquid cooling interface according to a preferred embodiment of the present application;

[0040] Fig. 9 is a schematic structural diagram of a heat transfer plate assembly according to a preferred embodiment of the present application;

[0041] Fig.10 is a structural exploded view of a first heat transfer plate according to a preferred embodiment of the present application;

[0042] Fig.11 yes Fig.10 A schematic structural diagram of a heat-conducting substrate of a first heat transfer plate shown in FIG.

[0043] Fig.12 is a structural exploded view of a second heat transfer plate according to a preferred embodiment of the present application;

[0044] Fig.13 This is a schematic diagram of the structure of the third heat transfer plate according to the preferred embodiment of the present application.

[0045] Fig.14 is a schematic structural diagram of a fourth heat transfer plate according to a preferred embodiment of the present application;

[0046] Throughout the drawings, the same reference numerals are used to denote the same elements or structures, wherein:

[0047] 1. heat storage shell; 11. liquid cooling interface; 111. fluid connector; 112. sealing ring; 12. liquid cooling channel; 13. reinforcing pillar; 14. welding step; 15. limiting boss; 16. heat transfer cavity; 2. heat transfer plate assembly; 21. first heat transfer plate; 211. first heat conductive substrate; 2111. first circular groove; 2112. first groove; 2113. first notch; 212. first straight heat pipe; 213. bent heat pipe I ; 214, bent heat pipe II; 215, bent heat pipe III; 216, bent heat pipe IV; 22, second heat transfer plate; 221, second heat conductive substrate; 23, third heat transfer plate; 231, third heat conductive substrate; 232, bent heat pipe V; 233, bent heat pipe VI; 234, bent heat pipe VII; 24, fourth heat transfer plate; 241, fourth heat conductive substrate; 242, bent heat pipe VIII; 3, bottom plate; 4, flow channel cover plate; 5, phase change material. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0049] It should be understood that expressions such as "include" and "may include" used in this application indicate the existence of the disclosed functions, operations or constituent elements, and do not limit one or more additional functions, operations and constituent elements. In this application, terms such as "include" and / or "have" may be interpreted as indicating specific characteristics, numbers, operations, constituent elements, components or combinations thereof, but may not be interpreted as excluding the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components or combinations thereof.

[0050] It should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0051] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0052] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0053] Figure 1 is an overall exploded stereogram of the phase change heat storage module provided in this application, Figure 2 This is a cross-sectional view of the overall structure of the phase change heat storage module provided in this application. Figure 1 and Figure 2 To explain the present invention in more detail.

[0054] The present invention provides a phase-change heat storage module with high thermal conductivity, which mainly includes components such as a heat storage shell 1, a heat transfer plate assembly 2, a bottom plate 3 and a flow channel cover plate 4, and focuses on redesigning and optimizing key components such as the heat storage shell 1 and the heat transfer plate assembly 2.

[0055] like Figure 1 and Figure 2 As shown in , the heat storage shell 1 is the main body of the heat storage module, and the heat transfer plate assembly 2 is arranged in the inner cavity of the heat storage shell 1, and can be welded into one body by soldering, for example. The heat storage shell 1 and the bottom plate 3 can be welded into a sealed space by vacuum electron beam welding; the heat storage shell 1 and the flow channel cover plate 4 are combined to form a cooling flow channel, and after an external liquid cooling source is connected, liquid cooling heat dissipation is provided for the equipment. The phase change material 5 can be filled into the inner cavity of the heat storage shell 1 by vacuum filling in a molten state to ensure that the molten phase change material fills the entire heat storage inner cavity. The phase change material 5 is used to absorb the heat of the product. When it absorbs heat and the temperature reaches the melting point of the phase change material, the phase change material undergoes a phase change. During the phase change process, the latent heat of the phase change plays a role and can absorb a large amount of heat.

[0056] As one of the key components of the present invention, the interior of the heat storage shell 1 constitutes a heat storage cavity for accommodating the phase change material 5, and includes structures such as a liquid cooling interface 11, a liquid cooling channel 12 and a heat transfer cavity 16, wherein the external liquid cooling medium enters through one of the liquid cooling interfaces 11, flows through the heat transfer cavity 16 via the liquid cooling channel 12 to perform heat exchange, and then flows out from another of the liquid cooling interfaces 11; the heat transfer cavity 16 serves as the heat input area of ​​the entire phase change heat storage module, and its wall surface is in contact with the external heat transfer device, and constitutes a heat conduction area in the heat storage shell 1 and its interior.

[0057] More specifically, see also Figures 4 to 7 The heat storage shell 1 may specifically include components such as a liquid cooling interface 11, a liquid cooling channel 12, a reinforcing pillar 13, a welding step 14, a limiting boss 15, and a heat transfer cavity 16. The external heat is input into the heat storage shell 1 and its interior by heat conduction through the heat transfer cavity 16, and then the heat is quickly and evenly diffused in the heat storage cavity through the heat transfer plate assembly 2 fixed on the heat storage shell 1, and transferred to the phase change material 5. The reinforcing pillar 13, the welding step 14, the limiting boss 15, etc. are all structural features of the heat storage shell 1 that enhance the welding effect.

[0058] According to a preferred embodiment of the present invention, the reinforcing pillar 13 can be arranged at a place where the distance between the heat storage cavity and the side wall is large, so as to enhance the structural rigidity and ensure the compressive strength of the heat storage cavity, avoid bulging caused by the increase in the span of the welding area, and also enhance the connection with the bottom plate 3 and the axial heat conduction capacity. The welding step 14 can be arranged at the side wall of the cavity of the heat storage shell 1, the reinforcing pillar 13, the liquid cooling channel 12 and other places that need to be welded with the bottom plate 3 and the channel cover plate 4, to ensure that the cavity and the cover plate overlap and ensure the precise gap between the two, so as to ensure the welding effect of vacuum electron beam welding. In addition, the limiting boss 15 provides a limit for the heat transfer plate assembly 2, and provides a welding area that is soldered as one with the heat transfer plate assembly 2, so that the heat transfer plate assembly 2 and the heat storage shell 1 are fitted together, reducing the contact thermal resistance and improving the heat transfer efficiency.

[0059] According to another preferred embodiment of the present invention, the liquid cooling channel 12 and the liquid cooling interface 11 are both arranged on the outside of the heat storage shell, isolated from the heat storage inner cavity, and the channel cover plate 4 is welded to form a sealed channel. In order to avoid forming a multi-layer welding structure, the liquid cooling channel 12 is preferably arranged on the top surface of the heat storage shell 1, and is mainly arranged around the heat transfer cavity 16 to reduce the heat transfer path. The liquid cooling interface 11 is used to connect with the external fluid connector, and a double sealing ring structure can be adopted to increase the sealing reliability of the liquid cooling interface; when the heat storage module is connected to the external liquid cooling source through the external fluid connector, the liquid cooling medium enters from the liquid cooling interface 11 and flows through the heat transfer cavity 16 surrounded by the liquid cooling channel 12, and can take away a large amount of heat through heat exchange, and finally enter and exit from another liquid cooling interface 11. The heat transfer cavity 16 is the heat input area of ​​the heat storage module, and its wall surface is in contact with the external heat transfer device, and heat is transferred to the inside of the heat storage module through heat conduction.

[0060] As another key component of the present invention, the heat transfer plate assembly 2 is embedded in the heat storage cavity and is close to the heat transfer area formed by the heat transfer cavity 16. It includes multiple heat transfer plates to further isolate the heat storage cavity into multiple small cavities, so that the heat can be quickly and evenly diffused in the heat storage cavity and transferred to the phase change material 5 in the heat storage cavity.

[0061] More specifically, according to another preferred embodiment of the present invention, Fig. 9 As shown in , the heat transfer plate assembly 2 preferably includes a first heat transfer plate 21, a second heat transfer plate 22, a third heat transfer plate 23 and a fourth heat transfer plate 24, wherein the first heat transfer plate 21 and the second heat transfer plate 22 are kept opposite to each other, and each of them includes a heat conductive substrate, a plurality of straight heat pipes and a plurality of bent heat pipes, wherein the heat conductive substrate is a flat plate structure with a plurality of parallel ribs on the side, and a plurality of circular grooves are respectively opened in each of the parallel ribs along the vertical direction, thereby installing the plurality of straight heat pipes and enhancing the axial heat conduction; in addition, a plurality of grooves bent in different forms are arranged on the flat plate structure at intervals, thereby installing the plurality of bent heat pipes and enhancing the circumferential heat conduction and radial heat conduction at the same time. In addition, the third heat transfer plate 23 and the fourth heat transfer plate 24 are arranged adjacent to each other between the first heat transfer plate 21 and the second heat transfer plate 22, and they are both flat plate structures, wherein a plurality of grooves bent in different forms are arranged on the flat plate structure at intervals, and bent heat pipes are installed correspondingly.

[0062] Also see Figures 10 to 14The first heat transfer plate 21 may specifically include a first heat conductive substrate 211, a plurality of first straight heat pipes 212, a bent heat pipe I 213, a bent heat pipe II 214, a bent heat pipe III 215 and a bent heat pipe IV 216, wherein a flat plate structure with a plurality of parallel ribs is provided on the side of the first heat conductive substrate 211, and a plurality of first circular grooves 2111 are respectively opened in each of the parallel ribs along the vertical direction, thereby installing the plurality of first straight heat pipes 212; in addition, a plurality of first grooves 2112 bent in different forms are arranged on the flat plate structure at intervals from each other, thereby installing the bent heat pipe I 213, the bent heat pipe II 214, the bent heat pipe III 215 and the bent heat pipe IV 216, and play a role in enhancing circumferential heat conduction and radial heat conduction at the same time. The second heat transfer plate 22 and the first heat transfer plate 21 are arranged front to back and are mirror images of each other, and include a corresponding second heat conductive substrate 221 and a straight heat pipe and a bent heat pipe.

[0063] The third heat transfer plate 23 includes a third heat transfer substrate 231, a bent heat pipe V 232, a bent heat pipe VI 233 and a bent heat pipe VII 234, wherein the third heat transfer substrate 231 is a flat plate structure, and a plurality of grooves are arranged on the third heat transfer substrate 231 at intervals, thereby installing the bent heat pipe V 232, the bent heat pipe VI 233 and the bent heat pipe VII 234. The fourth heat transfer plate 24 includes a fourth heat transfer substrate 241 and a bent heat pipe VIII 242, wherein the fourth heat transfer substrate 241 is a flat plate structure, and a plurality of grooves are arranged on the fourth heat transfer substrate 241 at intervals, thereby installing the bent heat pipe VIII 242. In addition, the top and bottom plates of the first heat transfer substrate 211, the second heat transfer substrate 221, the third heat transfer substrate 231 and the fourth heat transfer substrate 241 are preferably also provided with notches.

[0064] Through the above design, the straight pipe plays a role in enhancing the axial heat conduction of the heat storage module, and the bent pipe plays a role in enhancing the axial heat conduction of the heat storage module. At the same time, it can also play a role in enhancing the radial heat conduction of the heat storage module, thereby enhancing the overall heat conduction efficiency in the heat storage module, making the temperature distribution more uniform, and improving the overall utilization rate of the phase change material. In addition, since the heat transfer plate assembly 2 isolates the inner cavity of the heat storage shell 1 into multiple small cavities, the notches 2113 set at the top and bottom of the heat conductive substrate are conducive to the flow of the molten phase change material 5 in the heat storage inner cavity, ensuring that the phase change material 5 fills the entire heat storage inner cavity.

[0065] Re-read Figure 1 and Figure 2The bottom plate 3 is arranged at the bottom of the heat storage shell 1 and is welded with the heat storage shell 1 to form a sealed integrated structure; the flow channel cover plate 4 is arranged at the top of the heat storage shell 1 and is welded so that the liquid cooling flow channel 12 constitutes a sealed flow channel.

[0066] According to another preferred embodiment of the present invention, the liquid cooling interface 11 is preferably arranged on the outside of the bottom of the heat storage shell 1 and is isolated from the heat storage inner cavity; the liquid cooling channel 12 is preferably arranged on the top surface of the heat storage shell 1 and is arranged around the heat transfer cavity 16. In this way, not only can the integrated design of liquid cooling and phase change heat storage be realized, but also the heat dissipation requirements of the equipment during long-term ground joint commissioning can be met, further improving the heat dissipation capacity of the heat storage module.

[0067] According to another preferred embodiment of the present invention, the heat storage shell 1 is preferably made of aluminum alloy, and the heat transfer plate assembly 2 is preferably made of copper alloy; accordingly, the heat storage cavity is welded by vacuum electron beam with local heating. In this way, the welding problems of copper alloy and thin-walled aluminum alloy brazing being incompatible and heat pipe being unsuitable for vacuum brazing can be effectively solved.

[0068] More specifically, since a heat transfer plate is provided in the inner cavity of the heat storage shell, but the specific heat capacity of the heat transfer plate (copper alloy) and the heat storage shell (aluminum alloy) is quite different and the expansion coefficient is inconsistent, brazing is difficult in the multi-layer structure, and it is easy to form perforations in the thin-walled aluminum alloy shell, resulting in welding failure. For this reason, the inside of the heat storage module (between the heat-conducting substrate and the heat pipe, between the heat transfer component and the heat storage shell) is welded by soldering; the outside of the heat storage module (between the heat storage shell and the bottom plate, between the heat storage shell and the flow channel cover plate) is welded by vacuum electron beam welding. Vacuum electron beam welding can achieve precise control and high-quality welding during the welding process through electron beam emission, focusing, molten pool control and adjustment of the welding process. At the same time, vacuum electron beam welding belongs to the local heating welding method, which can effectively solve the welding problem that the built-in heat pipe assembly cannot withstand high temperature (<200°C) and is not suitable for vacuum brazing.

[0069] According to another preferred embodiment of the present invention, the phase change material 5 is preferably filled into the heat storage cavity by vacuum filling in a molten state. In this way, it can be ensured that there is no residual gas in the heat storage cavity, and the molten phase change material fills the entire heat storage cavity. In addition, it is also preferred to seal the filling port by a seamless sealing method of stir friction welding to ensure sealing.

[0070] In summary, the phase change heat storage module according to the present invention can have the composite heat dissipation functions of efficient heat transfer, efficient energy storage heat absorption and liquid cooling heat dissipation, which effectively solves the technical problems of uneven heat dissipation, low utilization rate of phase change materials, low thermal transient response speed and the like existing in similar products. Therefore, it is particularly suitable for high-efficiency heat dissipation applications such as active phased array antennas, and has good practical value and application prospects.

[0071] It will be easily understood by those skilled in the art that the above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A phase change heat storage module with high thermal conductivity, characterized in that: The phase-change heat storage module comprises a heat storage housing (1), a heat transfer plate assembly (2), a bottom plate (3) and a flow channel cover plate (4), wherein: The interior of the heat storage shell (1) constitutes a heat storage inner cavity for accommodating the phase change material (5), and comprises a liquid cooling interface (11), a liquid cooling channel (12) and a heat transfer cavity (16), wherein an external liquid cooling medium enters through one of the liquid cooling interfaces (11), flows through the heat transfer cavity (16) via the liquid cooling channel (12) to perform heat exchange, and then flows out from another of the liquid cooling interfaces (11); the heat transfer cavity (16) serves as a heat input area for the entire phase change heat storage module, and its wall surface is in contact with an external heat transfer device, and a heat conduction area is formed in the heat storage shell (1) and its interior; The heat transfer plate assembly (2) is embedded in the heat storage inner cavity and closely attached to the heat transfer area formed by the heat transfer cavity (16), and comprises a plurality of heat transfer plates which further separate the heat storage inner cavity into a plurality of small cavities, thereby allowing heat to diffuse quickly and evenly in the heat storage inner cavity and be transferred to the phase change material (5) in the heat storage inner cavity; The bottom plate (3) is arranged at the bottom of the heat storage shell (1) and is welded with the heat storage shell (1) to form a sealed integrated structure; The flow channel cover plate (4) is arranged on the top of the heat storage shell (1) and is welded so that the liquid cooling flow channel (12) forms a sealed flow channel.

2. The phase change heat storage module according to claim 1, characterized in that: As for the heat transfer plate assembly (2), it preferably comprises a first heat transfer plate (21), a second heat transfer plate (22), a third heat transfer plate (23) and a fourth heat transfer plate (24), wherein: The first heat transfer plate (21) and the second heat transfer plate (22) are kept opposite to each other, and each of them comprises a heat conductive substrate, a plurality of straight heat pipes and a plurality of bent heat pipes, wherein the heat conductive substrate is a flat plate structure with a plurality of parallel ribs on the side, and a plurality of circular grooves are respectively opened in each of the parallel ribs along the vertical direction, thereby installing the plurality of straight heat pipes and enhancing the axial heat conduction; in addition, a plurality of grooves bent in different forms are arranged on the flat plate structure at intervals, thereby installing the plurality of bent heat pipes and enhancing the circumferential heat conduction and radial heat conduction at the same time; The third heat transfer plate (23) and the fourth heat transfer plate (24) are arranged adjacent to each other between the first heat transfer plate (21) and the second heat transfer plate (22), and both are flat plate structures, wherein a plurality of grooves bent in different forms are arranged on the flat plate structure at intervals, and bent heat pipes are installed correspondingly.

3. The phase change heat storage module according to claim 2, characterized in that: The first heat transfer plate (21) comprises a first heat conductive substrate (211), a plurality of first straight heat pipes (212), a bent heat pipe I (213), a bent heat pipe II (214), a bent heat pipe III (215) and a bent heat pipe IV (216), wherein a flat plate structure with a plurality of parallel ribs is provided on the side surface of the first heat conductive substrate (211), and a plurality of first circular grooves (2111) are respectively opened in each of the parallel ribs along the vertical direction, thereby installing the plurality of first straight heat pipes (212); in addition, a plurality of first grooves (2112) bent in different forms are arranged on the flat plate structure at intervals from each other, thereby installing the bent heat pipe I (213), the bent heat pipe II (214), the bent heat pipe III (215) and the bent heat pipe IV (216), and playing the role of simultaneously enhancing circumferential heat conduction and radial heat conduction; The second heat transfer plate (22) and the first heat transfer plate (21) are arranged front to back and are mirror images of each other, and include a corresponding second heat conductive substrate (221) and a straight heat pipe and a bent heat pipe; The third heat transfer plate (23) comprises a third heat conducting substrate (231), a bent heat pipe V (232), a bent heat pipe VI (233) and a bent heat pipe VII (234), wherein the third heat conducting substrate (231) is a flat plate structure, and a plurality of grooves are arranged on the third heat conducting substrate (231) at intervals from each other, thereby installing the bent heat pipe V (232), the bent heat pipe VI (233) and the bent heat pipe VII (234); The fourth heat transfer plate (24) comprises a fourth heat conducting substrate (241) and a bent heat pipe VIII (242), wherein the fourth heat conducting substrate (241) is a flat plate structure, and a plurality of grooves are arranged on the fourth heat conducting substrate (241) at intervals from each other, thereby installing the bent heat pipe VIII (242).

4. The phase change heat storage module according to claim 3, characterized in that: The top and bottom plates of the first heat-conducting substrate (211), the second heat-conducting substrate (221), the third heat-conducting substrate (231), and the fourth heat-conducting substrate (241) are preferably also provided with notches, respectively, and the notches are used to promote the phase change material (5) in a molten state to flow in the heat storage cavity and fill the entire heat storage cavity.

5. The phase change heat storage module according to any one of claims 1 to 4, characterized in that: The heat storage shell (1) preferably further comprises a reinforcing pillar (13) and a limiting boss (15), wherein the reinforcing pillar (13) is arranged in the inner cavity of the heat storage shell (1) to enhance the overall structural rigidity and enhance the connection and axial heat conduction performance between the heat storage shell (1) and the bottom plate (3); the limiting boss (15) is used to provide a limit for the heat transfer plate assembly (2) and to provide a welding area to ensure that the heat transfer plate assembly (2) and the heat storage shell (1) are fitted together as one.

6. The phase change heat storage module according to claim 5, characterized in that: The heat storage shell (1) preferably further comprises a welding step (14), which is arranged at the welding position between the inner cavity side wall of the heat storage shell (1), the reinforcing pillar (13) and the liquid cooling channel (12) and the bottom plate (3) and the channel cover plate (4), so as to ensure overlapping with a required gap; accordingly, the heat storage shell (1) and the bottom plate (3) and the channel cover plate (4) are preferably welded by means of a locally heated vacuum electron beam.

7. The phase change heat storage module according to any one of claims 1 to 6, characterized in that: The heat storage shell (1) is preferably made of aluminum alloy, and the heat transfer plate assembly (2) is preferably made of copper alloy; accordingly, the heat storage shell (1) and the heat transfer plate assembly (2) are preferably welded by soldering.

8. The phase change heat storage module according to any one of claims 1 to 7, characterized in that: The liquid cooling interface (11) is preferably arranged on the outside of the bottom of the heat storage shell (1) and is isolated from the heat storage inner cavity; the liquid cooling channel (12) is preferably arranged on the top surface of the heat storage shell (1) and is arranged around the heat transfer cavity (16).

9. The phase change heat storage module according to any one of claims 1 to 8, characterized in that: The phase change material (5) is preferably filled into the heat storage inner cavity in a molten state by means of vacuum filling.

10. The phase change heat storage module according to any one of claims 1 to 9, characterized in that: The above-mentioned phase change heat storage module is used for efficient heat dissipation of products such as active phased array antennas.

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