Copper alloy wire with excellent heat dissipation performance and application thereof
By using specific formula smelting, multi-stage cold drawing, argon protective annealing, nano-oxide coating and low friction stranding during the preparation process of copper alloy wires, multiple technical problems in copper alloy wires in high-speed drawing, annealing, coating and stranding are solved, and excellent heat dissipation performance and long-term stable conductivity are achieved.
Patent Information
- Application Number
- CN202411836777.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-13
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2044-12-13
AI Technical Summary
Copper alloy wires are prone to microcracks during high-speed drawing. During high-temperature annealing, the segregation of alloy elements leads to uneven grains and uneven surface coating. The wire is severely damaged during strands of twisting, and it is prone to oxidation and corrosion in high-temperature environments, resulting in a decrease in conductivity.
Copper and trace alloy elements are melted into a uniform alloy liquid through a specific formula, and multi-stage continuous cold drawing is performed to control material stress. Argon protection is used to accurately control the temperature to eliminate segregation during high-temperature annealing. The surface is coated with a nano-oxide stable coating, a low-friction coating is applied and twisted to reduce friction.
It effectively avoids the occurrence of microcracks, ensures the uniformity of grains, improves the uniformity and corrosion resistance of the surface coating, reduces wire damage, extends the service life of copper alloy wires in high temperature environments, and improves the conductive properties.
Abstract
Citation Information
Patent Citations
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