Shielding film mounting method, shielding film mounting equipment, storage medium and product

Abstract

The invention discloses a shielding film installation method, shielding film installation equipment, a storage medium and a product, and relates to the technical field of electromagnetic interference, and the shielding film installation method specifically comprises the following steps: determining a shielding film material combination corresponding to a to-be-installed electronic component, the shielding film materials in the shielding film material combination are assembled to obtain a target shielding film; obtaining an electronic component size corresponding to the to-be-installed electronic component, and determining a copper exposure area corresponding to the to-be-installed electronic component according to the electronic component size; and fixing the target shielding film to the to-be-mounted electronic component based on the copper exposure area to obtain a target electronic component. According to the invention, it is ensured that the shielding film covering the electronic component can effectively absorb electromagnetic interference generated by the electronic component, so that the electromagnetic interference generated by the produced electronic component can be effectively suppressed, and the quality of the electronic component can meet user requirements.

Description

Technical Field

[0001] The present application relates to the field of electromagnetic interference technology, and in particular to a shielding film installation method, a shielding film installation device, a storage medium and a computer program product. Background Art

[0002] With the continuous development of electronic technology, electronic components such as CPU (Central Processing Unit), DDR (Double Data Rate Synchronous Dynamic Random Access Memory), EMMC (Embedded Multi Media Card), SSD (Solid-State Drive) have been widely integrated into electronic devices, significantly improving the data processing capabilities of electronic devices. However, these electronic components will generate strong electromagnetic radiation during operation, thereby interfering with other normally operating electronic components.

[0003] In related technologies, technicians usually install shielding covers of uniform specifications on electronic components during the production process, so as to absorb the electromagnetic interference generated by the electronic components through the shielding covers to ensure normal operation of different electronic components.

[0004] However, there are significant differences between the signal frequencies and intensities generated by different electronic components. Therefore, using shielding covers of uniform specifications is difficult to meet the shielding requirements of different components. As a result, the electromagnetic interference of some electronic components cannot be effectively suppressed, making the quality of the produced electronic components unable to meet user needs. Summary of the invention

[0005] The main purpose of this application is to provide a shielding film installation method, a shielding film installation device, a storage medium and a computer program product, aiming to solve the technical problem in the related art that the electromagnetic interference of some electronic components is difficult to be effectively suppressed when producing electronic components.

[0006] To achieve the above object, the present application proposes a shielding film installation method, the shielding film installation method comprising:

[0007] Determine a shielding film material combination corresponding to the electronic component to be installed, and assemble the shielding film materials in the shielding film material combination to obtain a target shielding film;

[0008] Acquire the electronic component size corresponding to the electronic component to be installed, and determine the copper exposed area corresponding to the electronic component to be installed according to the electronic component size;

[0009] The target shielding film is fixed to the electronic component to be mounted based on the copper exposed area to obtain a target electronic component.

[0010] In one embodiment, the step of determining the shielding film material combination corresponding to the electronic component to be installed includes:

[0011] Obtaining preset signal strength and preset configuration information corresponding to the electronic component to be installed;

[0012] Based on the preset signal strength and the preset configuration information, determining a preset signal type corresponding to the electronic component to be installed;

[0013] The shielding film material combination corresponding to the electronic component to be installed is determined according to the preset signal type.

[0014] In one embodiment, the step of determining the shielding film material combination corresponding to the electronic component to be installed according to the preset signal type includes at least one of the following:

[0015] In the case where it is determined that the preset signal type is a high-speed signal type, the preset first material combination is determined as a shielding film material combination that matches the electronic component to be installed, wherein the first material combination includes metal foil, non-woven fabric, and absorbing material;

[0016] In the case where it is determined that the preset signal type is a power signal type, the preset second material combination is determined as the shielding film material combination, wherein the second material combination includes gold plating and non-woven fabric;

[0017] In the case where it is determined that the preset signal type is a universal serial bus signal type, the preset third material combination is determined as the shielding film material combination, wherein the third material combination includes aluminum foil and non-woven fabric.

[0018] In one embodiment, the step of assembling the shielding film materials in the shielding film material combination to obtain the target shielding film comprises:

[0019] When it is detected that the shielding film material combination is the first material combination, the metal foil is covered on top of the non-woven fabric, and the absorbing material is covered on top of the metal foil to assemble and obtain a target shielding film.

[0020] In one embodiment, the step of fixing the target shielding film to the electronic component to be mounted based on the copper exposed area to obtain the target electronic component includes:

[0021] Determining a plurality of fixed hooks contained in the copper exposed area;

[0022] The target shielding film is fixed on the plurality of fixed hooks, and the target shielding film is pushed according to a preset thrust parameter to obtain a target electronic component.

[0023] In one embodiment, after the step of determining the shielding film material combination corresponding to the electronic component to be installed, the method includes:

[0024] Acquire the electronic component size corresponding to the electronic component to be installed, and determine the shielding frame configuration area matching the electronic component to be installed based on the electronic component size;

[0025] Adding a shielding frame in the shielding frame configuration area, and determining a shielding film size according to the shielding frame configuration area;

[0026] Cutting each shielding film material in the shielding film material combination according to the shielding film size, and assembling the cut shielding film materials to obtain a target shielding film;

[0027] The target shielding film is fixed to the copper exposed area to obtain a target electronic component.

[0028] In one embodiment, the method further comprises:

[0029] Determining the insulating glue coverage area contained in the electronic component to be installed based on the size of the electronic component;

[0030] Insulating glue is added to the insulating glue covered area, and the target shielding film is fixed to the shielding frame to be installed or the copper exposed area, so that the insulating glue fills between the target shielding film and the electronic element to be installed.

[0031] In addition, to achieve the above-mentioned purpose, the present application also proposes a shielding film installation device, which includes: a memory, a processor, and a computer program stored on the memory and executable on the processor, and the computer program is configured to implement the steps of the shielding film installation method described above.

[0032] In addition, to achieve the above-mentioned purpose, the present application also proposes a storage medium, which is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, the steps of the shielding film installation method described above are implemented.

[0033] In addition, to achieve the above-mentioned purpose, the present application also provides a computer program product, which includes a computer program, and when the computer program is executed by a processor, the steps of the shielding film installation method described above are implemented.

[0034] The shielding film installation method provided in the embodiment of the present application determines the shielding film material combination corresponding to the electronic component to be installed, and assembles the shielding film materials in the shielding film material combination to obtain the target shielding film; obtains the electronic component size corresponding to the electronic component to be installed, and determines the copper exposed area corresponding to the electronic component to be installed according to the electronic component size; and fixes the target shielding film to the electronic component to be installed based on the copper exposed area to obtain the target electronic component.

[0035] In this embodiment, when the shielding film installation equipment is in operation, it first detects the electronic component to be installed to determine the shielding film material combination that matches the electronic component to be installed, and the shielding film installation equipment assembles the shielding film materials contained in the shielding film material combination to obtain the target shielding film that matches the electronic component to be installed. Afterwards, the shielding film installation equipment obtains the electronic component size of the electronic component to be installed, and determines the exposed copper area around the electronic component to be installed based on the electronic component size. Finally, the shielding film installation equipment fixes the target shielding film through the exposed copper area to fix the target shielding film on the electronic component to be installed, thereby obtaining the target electronic component containing the shielding film.

[0036] In this way, the present application solves the technical problem in the related art that the electromagnetic interference of some electronic components is difficult to be effectively suppressed when producing electronic components. That is, the present application determines a shielding film material combination that matches the electronic components to be installed to obtain a target shielding film, and fixes the target shielding film based on the exposed copper area around the electronic components to be installed to obtain a target electronic component containing the shielding film. This ensures that the shielding film covering the electronic components can effectively absorb the electromagnetic interference generated by the electronic components, so that the electromagnetic interference generated by the produced electronic components can be effectively suppressed, thereby ensuring that the quality of the electronic components can meet user needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0038] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0039] Figure 1 A schematic diagram of a process flow provided for Embodiment 1 of the shielding film installation method of the present application;

[0040] Figure 2This is a schematic diagram of a first target electronic component involved in an embodiment of the shielding film installation method of the present application;

[0041] Figure 3 A schematic diagram of a second target electronic component involved in an embodiment of the shielding film installation method of the present application;

[0042] Figure 4 This is a schematic diagram of the module structure of the shielding film installation device according to an embodiment of the present application;

[0043] Figure 5 This is a schematic diagram of the equipment structure of the hardware operating environment involved in the shielding film installation method in the embodiment of the present application.

[0044] The purpose, features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0045] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of the present application and are not used to limit the present application.

[0046] In order to better understand the technical solution of the present application, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.

[0047] In this embodiment, for ease of description, the following description is made using the shielding film installation device, or a mobile terminal, a data storage control terminal, a PC or other terminal connected to an electronic control unit matching the shielding film installation device as the execution subject.

[0048] Based on the above-mentioned shielding film installation equipment, the overall concept of the shielding film installation method of the present application is proposed here.

[0049] With the continuous development of electronic technology, electronic components such as CPU, DDR, EMMC, SSD, etc. have been widely integrated into electronic devices, significantly improving the data processing capabilities of electronic devices. However, these electronic components will generate strong electromagnetic radiation during operation, thereby interfering with other normally operating electronic components. In the relevant technology, technicians usually install shielding covers of uniform specifications for electronic components during the production process to absorb the electromagnetic interference generated by the electronic components through the shielding covers to ensure that different electronic components can operate normally. However, there are significant differences in the frequency and intensity of the signals generated by different electronic components. Therefore, the use of shielding covers of uniform specifications is difficult to adapt to the shielding requirements generated by different components, and the electromagnetic interference of some electronic components is difficult to be effectively suppressed, making the quality of the produced electronic components unable to meet user needs.

[0050] In response to the above phenomenon, the present application provides a shielding film installation method, which includes: determining a shielding film material combination corresponding to an electronic component to be installed, and assembling each shielding film material in the shielding film material combination to obtain a target shielding film; obtaining an electronic component size corresponding to the electronic component to be installed, and determining a copper exposed area corresponding to the electronic component to be installed based on the electronic component size; and fixing the target shielding film to the electronic component to be installed based on the copper exposed area to obtain the target electronic component.

[0051] In this way, the present application solves the technical problem in the related art that the electromagnetic interference of some electronic components is difficult to be effectively suppressed when producing electronic components. That is, the present application determines a shielding film material combination that matches the electronic components to be installed to obtain a target shielding film, and fixes the target shielding film based on the exposed copper area around the electronic components to be installed to obtain a target electronic component containing the shielding film. This ensures that the shielding film covering the electronic components can effectively absorb the electromagnetic interference generated by the electronic components, so that the electromagnetic interference generated by the produced electronic components can be effectively suppressed, thereby ensuring that the quality of the electronic components can meet user needs.

[0052] Based on the overall concept of the shielding film installation method of the present application, the embodiment of the present application provides a shielding film installation method, referring to Figure 1 , Figure 1 This is a schematic flow chart of the first embodiment of the shielding film installation method of the present application. In this embodiment, the shielding film installation method includes steps S10 to S30:

[0053] Step S10: determining a shielding film material combination corresponding to the electronic component to be installed, and assembling each shielding film material in the shielding film material combination to obtain a target shielding film;

[0054] In this embodiment, during the operation of the shielding film installation equipment, the electronic components to be installed that require the shielding film to be installed are first detected to determine the shielding film material combination that matches the electronic components to be installed. The shielding film installation equipment then combines the shielding film materials contained in the shielding film material combination to obtain the target shielding film for application on the electronic components to be installed.

[0055] Exemplarily, for example, during the operation of the shielding film installation device, the shielding film installation device first detects the electronic components to be installed on which the shielding film needs to be installed. When the shielding film detects that the electronic components to be installed are DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory) and other electronic components that can emit high-intensity memory signals, or when the shielding film detects that the electronic components to be installed are quartz crystal oscillators, RC (Resistance & Capacitance Oscillator), 555 timers, FPGA (Field Programmable Gate Array) and other electronic components that can emit high-intensity clock signals, it is determined that the shielding film material combination that matches the electronic components to be installed is metal foil, non-woven fabric, and absorbing material, and the shielding film installation device combines the metal foil, non-woven fabric, and absorbing material to obtain a target shielding film that matches the electronic components to be installed;

[0056] Similarly, when the shielding film installation device detects that the electronic component to be installed is an electronic component that can send a power signal, it determines that the shielding film material combination that matches the electronic component to be installed is aluminum foil and non-woven fabric, and combines the aluminum foil and non-woven fabric to obtain a target shielding film that matches the electronic component to be installed;

[0057] Similarly, when the shielding film installation equipment detects that the electronic component to be installed is an electronic component that includes a USB (Universal Serial Bus) 3.0 interface, it determines that the shielding film material combination that matches the electronic component to be installed is gold plating and non-woven fabric, and combines the gold plating and non-woven fabric to obtain the target shielding film that matches the electronic component to be installed.

[0058] It should be noted that different electronic components have certain differences in the signal types and signal strengths generated during operation. Among them, high-speed signal types such as memory signals and clock signals have higher strengths than other types of signals. That is, when technicians use memory signal laptops to detect electronic components that emit high-speed signals, the memory signal laptops will interact in a normal state, while when other electronic components are detected, the memory signal laptops may not interact in a normal state. The shielding film required for electronic components that can emit high-speed signals needs to have a stronger shielding material such as absorbing material; similarly, for electronic components that emit power signal types and USB signal types, the shielding film used usually does not need to be configured with a stronger shielding material such as absorbing material. In this way, the shielding film installation equipment can determine the shielding film material combination that is more matched with the electronic components to be installed and can completely absorb the electromagnetic interference generated by the electronic components by detecting the electronic components to be installed.

[0059] In addition, it is understandable that the price of absorbing materials is expensive compared to materials such as aluminum foil and gold plating. Therefore, if shielding films containing absorbing materials are configured for different electronic components, the cost of the electronic components will be higher. In this way, the present application can determine the electronic components to be installed that are more matched with the electronic components to be installed by detecting the electronic components to be installed, so as to configure shielding films that do not contain absorbing materials on electronic components that can emit power signal types and USB signal types, thereby reducing the production cost of electronic components.

[0060] In a feasible implementation manner, the step of "determining the shielding film material combination corresponding to the electronic component to be installed" in the above step S10 may specifically include steps S101 to S103:

[0061] Step S101: obtaining preset signal strength and preset configuration information corresponding to the electronic component to be installed;

[0062] Step S102: determining a preset signal type corresponding to the electronic component to be installed based on the preset signal strength and the preset configuration information;

[0063] Step S103: determining a shielding film material combination corresponding to the electronic component to be installed according to the preset signal type.

[0064] In this embodiment, during operation, the shielding film installation device first reads the storage module configured with itself to obtain the preset configuration information of the electronic component to be installed on which the shielding film needs to be installed, and determines the preset signal strength of the electronic component to be installed according to the preset configuration information. After that, the shielding film installation device determines the preset signal type of the electromagnetic signal to be emitted by the electronic component to be installed based on the preset configuration information and the preset signal strength. Finally, the shielding film installation device screens multiple shielding film material combinations based on the preset signal type to determine the shielding film material combination that matches the electronic component to be installed.

[0065] Exemplarily, for example, during operation, the shielding film installation device first reads the storage module configured by itself to obtain the preset configuration information of the electronic component to be installed, and determines the transmission circuit existing in the electronic component to be installed and the expected transmission signal strength of the electronic component to be installed according to the preset configuration information. After that, the shielding film installation device compares the transmission signal strength with the preset signal strength threshold, and thus, when it is detected that the transmission signal strength reaches the signal strength threshold, it is determined that the electronic component to be installed is a memory component such as DRAM, SRAM, ROM, etc. that can emit a high-intensity memory signal, or it is determined that the electronic component to be installed is a clock electronic component such as a quartz crystal oscillator, RC, 555 timer and FPGA that emits a high-intensity clock signal. The shielding film installation device further determines that the preset signal type emitted by the electronic component to be installed is a high-speed signal type. Finally, the shielding film installation device selects the shielding film material combination that matches the electronic component to be installed as metal foil, non-woven fabric, and wave-absorbing material based on the high-speed signal type;

[0066] Similarly, after the shielding film installation device determines that the transmission circuit exists in the electronic component to be installed, if it is detected that the transmission circuit in the electronic component to be installed is a power circuit, the electronic component to be installed is determined to be a power component, and the shielding film installation device further determines that the preset signal type emitted by the electronic component to be installed is a power signal type. Finally, the shielding film installation device selects the shielding film material combination that matches the electronic component to be installed as aluminum foil and non-woven fabric based on the power signal type;

[0067] Similarly, when the shielding film installation device determines that there is a USB3.0 interface in the electronic component to be installed, it determines that the electronic component to be installed is a USB interface component. The shielding film installation device further determines that the preset signal type emitted by the electronic component to be installed is a universal serial bus signal type. Finally, the shielding film installation device selects the shielding film material combination that matches the electronic component to be installed based on the universal serial bus signal type, which is gold plating and non-woven fabric.

[0068] In this way, the shielding film installation equipment can determine the shielding film material combination that is more matched with the electronic components to be installed and can completely absorb the electromagnetic interference generated by the electronic components by detecting the electronic components to be installed. At the same time, it can also configure shielding films that do not contain absorbing materials on electronic components that emit power signal types and USB signal types, thereby reducing the production cost of electronic components.

[0069] In a feasible implementation manner, the above step S103 may include at least one of steps S1031 to S1033:

[0070] Step S1031: when it is determined that the preset signal type is a high-speed signal type, the preset first material combination is determined as a shielding film material combination matching the electronic component to be installed, wherein the first material combination includes metal foil, non-woven fabric, and absorbing material;

[0071] Step S1032: when it is determined that the preset signal type is a power signal type, determining a preset second material combination as the shielding film material combination, wherein the second material combination includes gold plating and non-woven fabric;

[0072] Step S1033: when it is determined that the preset signal type is a universal serial bus signal type, a preset third material combination is determined as the shielding film material combination, wherein the third material combination includes aluminum foil and non-woven fabric.

[0073] In this embodiment, after the shielding film installation device determines the preset signal type corresponding to the electronic component to be installed, if it is detected that the preset signal type is a high-speed signal type, then based on the high-speed signal type, a first material combination consisting of metal foil, non-woven fabric, and absorbing material is determined as the shielding film material combination that matches the electronic component to be installed among the preset multiple shielding film material combinations to be screened; similarly, if the shielding film installation device detects that the preset signal type is a power signal type, then based on the power signal type, among the preset multiple shielding film material combinations to be screened, the second material combination consisting of gold plating and non-woven fabric is determined as the shielding film material combination that matches the electronic component to be installed; similarly, if the shielding film installation device detects that the preset signal type is a universal serial bus signal type, then based on the universal serial bus signal type, among the preset multiple shielding film material combinations to be screened, the third material combination consisting of aluminum foil and non-woven fabric is determined as the shielding film material combination that matches the electronic component to be installed.

[0074] Exemplarily, for example, after the shielding film installation device determines the preset signal type corresponding to the electronic component to be installed, if it detects that the preset signal type is a high-speed signal type, the shielding film installation device first reads the above-mentioned storage module to obtain a material mapping table containing multiple preset signal types and preset material combinations matching the multiple preset signal types, and the shielding film installation device queries the material mapping table based on the high-speed signal type, and determines that the first material combination matching the high-speed signal type is a combination of metal foil, non-woven fabric, and absorbing material, and the shielding film installation device further determines the combination of metal foil, non-woven fabric, and absorbing material as a shielding film material combination matching the electronic component to be installed;

[0075] Similarly, if the shielding film installation device detects that the preset signal type is a power signal type, the storage module is read to obtain a material mapping table containing multiple preset signal types and preset material combinations matching the multiple preset signal types. The shielding film installation device queries the material mapping table based on the power signal type, and determines that the second material combination matching the power signal type is a gold-plated, non-woven fabric combination. The shielding film installation device then determines the gold-plated, non-woven fabric combination as a shielding film material combination matching the electronic component to be installed.

[0076] Similarly, if the shielding film installation device detects that the preset signal type is a USB signal type, it reads the storage module to obtain a material mapping table containing multiple preset signal types and preset material combinations that match the multiple preset signal types. The shielding film installation device queries the material mapping table based on the USB signal type, and determines that the third material combination that matches the USB signal type is an aluminum foil and non-woven fabric combination. The shielding film installation device then determines the aluminum foil and non-woven fabric combination as a shielding film material combination that matches the electronic components to be installed.

[0077] In this way, the shielding film installation equipment can determine the shielding film material combination that is more matched with the electronic components to be installed and can completely absorb the electromagnetic interference generated by the electronic components by detecting the electronic components to be installed. At the same time, it can also configure shielding films that do not contain absorbing materials on electronic components that emit power signal types and USB signal types, thereby reducing the production cost of electronic components.

[0078] In a feasible implementation manner, the step of "assembling the shielding film materials in the shielding film material combination to obtain the target shielding film" in the above step S10 may specifically include step S104:

[0079] Step S104: when it is detected that the shielding film material combination is the first material combination, the metal foil is covered on top of the non-woven fabric, and the absorbing material is covered on top of the metal foil, so as to assemble and obtain a target shielding film.

[0080] In this embodiment, after the shielding film installation equipment determines the shielding film material combination, if it is detected that the shielding film material combination is the above-mentioned first material combination including metal foil, non-woven fabric, and absorbing material, the metal foil is directly covered on top of the non-woven fabric, and the metal foil and non-woven fabric are wrapped with the absorbing material to assemble the target shielding film.

[0081] In this way, the shielding film installation equipment can assemble a target shielding film that matches the electronic components, and enable the target shielding film to absorb the high-intensity electromagnetic signals generated by the electronic components during operation through its own absorbing materials. At the same time, the shielding film installation equipment can avoid the situation where the metal foil directly contacts the electronic components and causes a short circuit in the electronic components by covering the non-woven fabric with the metal foil.

[0082] In addition, in this embodiment and another embodiment, during the process of assembling the first material combination, the shielding film installation equipment may also add foam on the metal foil and ground the foam before covering the metal foil with the absorbing material. Thereafter, the shielding film installation equipment covers the metal foil with the absorbing material, thereby further reducing the risk of contact between electronic components and the metal foil through the foam and non-woven fabric.

[0083] Step S20: obtaining the electronic component size corresponding to the electronic component to be installed, and determining the copper exposed area corresponding to the electronic component to be installed according to the electronic component size;

[0084] Step S30: fixing the target shielding film to the electronic component to be mounted based on the copper exposed area to obtain a target electronic component;

[0085] In this embodiment, after the shielding film installation equipment assembles the target shielding film, it can also determine the electronic component size corresponding to the electronic component to be installed, thereby determining the exposed copper area around the electronic component to be installed according to the electronic component size. Finally, the shielding film installation equipment determines the exposed copper area as the shielding film fixing area, and fixes the target shielding film according to the shielding film fixing area, so that the target shielding film is fixed on the electronic component to be installed, thereby obtaining the target electronic component including the shielding film.

[0086] For example, see Figure 2 , Figure 2 Schematic diagram of a first target electronic component involved in an embodiment of the shielding film installation method of the present application, such as Figure 2As shown, after assembling the target shielding film, the shielding film installation device can also read the above-mentioned preset configuration information to determine the electronic component size corresponding to the electronic component to be installed. The shielding film installation device then determines the 5mm exposed copper area around the electronic component to be installed according to the electronic component size. Finally, the shielding film installation device determines the exposed copper area as the shielding film fixing area, and then fixes the target shielding film in the shielding film fixing area, so that the target shielding film and the exposed copper area are in contact and applied to the electronic component to be installed, thereby obtaining the first target electronic component including the shielding film.

[0087] In a feasible implementation manner, the above step S30 may specifically include steps S301 to S302:

[0088] Step S301: determining a plurality of fixed hooks contained in the copper exposed area;

[0089] Step S302: fix the target shielding film on the plurality of fixed hooks, and push the target shielding film according to a preset thrust parameter to obtain a target electronic component.

[0090] In this embodiment, after determining the exposed copper area, the shielding film installation equipment first determines a plurality of fixed hooks set on the exposed copper area. Then, the shielding film installation equipment fixes the four corners of the target shielding film on the fixed hooks respectively, and then pushes the target shielding film according to the preset thrust parameters to make the target shielding film adhere to the electronic component to be installed to obtain the target electronic component.

[0091] For example, for example, Figure 2 As shown, after determining the 5mm exposed copper area around the electronic component to be installed, the shielding film installation equipment first determines the reserved fixing hooks at the four vertices of the exposed copper area. Then, the shielding film installation equipment fixes the target shielding film on the four reserved fixing hooks and pushes the target shielding film according to the preset thrust parameter of 15N, so that the target shielding film is attached to the electronic component to be installed, thereby forming the target electronic component.

[0092] In this embodiment, during the operation of the shielding film installation device, the electronic component to be installed on which the shielding film needs to be installed is first detected, so as to determine the shielding film material combination that matches the electronic component to be installed, and the shielding film installation device then combines the shielding film materials contained in the shielding film material combination to obtain a target shielding film for affixing to the electronic component to be installed. Afterwards, the shielding film installation device can also determine the electronic component size corresponding to the electronic component to be installed, so as to determine the exposed copper area around the electronic component to be installed according to the electronic component size. Finally, the shielding film installation device determines the exposed copper area as the shielding film fixing area, and fixes the target shielding film according to the shielding film fixing area, so that the target shielding film is fixed on the electronic component to be installed, so as to obtain the target electronic component containing the shielding film.

[0093] In this way, the present application solves the technical problem in the related art that the electromagnetic interference of some electronic components is difficult to be effectively suppressed when producing electronic components. That is, the present application determines a shielding film material combination that matches the electronic components to be installed to obtain a target shielding film, and fixes the target shielding film based on the exposed copper area around the electronic components to be installed to obtain a target electronic component containing the shielding film. This ensures that the shielding film covering the electronic components can effectively absorb the electromagnetic interference generated by the electronic components, so that the electromagnetic interference generated by the produced electronic components can be effectively suppressed, thereby ensuring that the quality of the electronic components can meet user needs.

[0094] Based on the first embodiment of the present application, the second embodiment of the present application is proposed here. In the second embodiment of the present application, the same or similar contents as the above embodiments can be referred to the above description and will not be repeated later. On this basis, after the step of "determining the shielding film material combination corresponding to the electronic component to be installed" in the above step S10, the shielding film installation method of the present application can also include steps A10 to A40:

[0095] Step A10: obtaining the electronic component size corresponding to the electronic component to be installed, and determining the shielding frame configuration area matching the electronic component to be installed based on the electronic component size;

[0096] Step A20: adding a shielding frame in the shielding frame configuration area, and determining the shielding film size according to the shielding frame configuration area;

[0097] Step A30: cutting each shielding film material in the shielding film material combination according to the shielding film size, and assembling the cut shielding film materials to obtain a target shielding film;

[0098] Step A40: Fixing the target shielding film to the copper exposed area to obtain a target electronic component.

[0099] In this embodiment, after determining the shielding film material combination, the shielding film installation device may also first read the above-mentioned storage module to obtain the electronic component size corresponding to the electronic component to be installed, and determine the shielding frame adjustment parameters matching the electronic component to be installed according to the electronic component size. The shielding film installation device determines the shielding frame configuration area corresponding to the electronic component to be installed according to the shielding frame adjustment parameters and the electronic component size. After that, the shielding film installation device adds a shielding frame in the shielding frame configuration area, and determines the shielding film size according to the shielding frame. After that, the shielding film installation device cuts each shielding film material in the shielding film combination material according to the shielding film size to cut the size of each shielding film material to a size matching the shielding frame. The shielding film installation device then combines the cut shielding film materials to obtain a target shielding film for application on the electronic component to be installed. Finally, the shielding film installation device determines each fixed point on the shielding frame, fixes the target shielding film at each fixed point, and then pushes the target shielding film according to the preset thrust parameters to make the target shielding film applied to the shielding frame and the electronic component to be installed to obtain the target electronic component.

[0100] For example, see Figure 3 , Figure 3 Schematic diagram of a second target electronic component involved in an embodiment of the shielding film installation method of the present application, such as Figure 3 As shown, after determining the shielding film material combination, the shielding film installation device can also read the above-mentioned storage module to obtain the preset configuration information of the electronic component to be installed, and determine the electronic component size of the electronic component to be installed according to the preset configuration information. The shielding film installation device determines the shielding frame size according to the electronic component size, and determines the shielding frame configuration area of ​​the electronic component to be installed based on the shielding frame size. Afterwards, the shielding film installation device adds a shielding frame in the shielding frame configuration area to surround the electronic component to be installed with the shielding frame. At the same time, the shielding film installation device obtains the preset shielding frame adjustment parameter of 2mm, and determines the shielding film size based on the shielding frame adjustment parameter. Afterwards, if the shielding film installation device determines that the shielding film material combination includes metal foil, non-woven fabric, For the first material combination of the absorbing material, the metal foil, non-woven fabric and absorbing material are cut according to the size of the shielding film, so that the sizes of the cut metal foil, non-woven fabric and absorbing material are all larger than the shielding frame by 2 mm. The shielding film installation equipment combines the cut metal foil, non-woven fabric and absorbing material, so as to wrap the metal foil on the non-woven fabric, and wrap the cut absorbing material on the metal foil to assemble the shielding film. Finally, the shielding film installation equipment determines the Mark points on the four corners of the shielding frame and fixes the target shielding film on the four Mark points. The shielding film installation equipment pushes the target shielding film according to the preset thrust parameter of 15N, so that the target shielding film is attached to the shielding frame and the electronic components to be installed to form the second target electronic components.

[0101] It should be noted that, in this embodiment and another embodiment, after the shielding film installation device fixes the target shielding film on the shielding frame, it can also add hems around the shielding frame and bury the grounding wire in the hems. It is understandable that the width of the hems can be set based on the layout of the electronic components to be installed on the circuit board. Similarly, the width of the grounding wire can be set based on the width of the hems. There are many ways to set the width of the hems and the grounding wire, and this application does not limit this.

[0102] In this way, by adding a shielding frame, the shielding film can be better fixed above the electronic component, and the horizontal electromagnetic interference signal emitted by the electronic component can be shielded by the shielding frame, thereby further improving the product quality of the electronic component.

[0103] Based on the first embodiment and / or the second embodiment of the present application, the third embodiment of the present application is proposed here. In the third embodiment of the present application, the same or similar contents as the above embodiments can be referred to the above introduction and will not be repeated later. On this basis, after the above step S10, the shielding film installation method of the present application can also include steps B10 to B20:

[0104] Step B10: determining the insulating adhesive coverage area contained in the electronic component to be installed based on the size of the electronic component;

[0105] Step B20: adding insulating glue in the insulating glue covered area, and fixing the target shielding film to the shielding frame to be installed or the copper exposed area, so that the insulating glue fills between the target shielding film and the electronic element to be installed.

[0106] In this embodiment, after assembling the target shielding film, the shielding film installation device can also first read the above-mentioned storage module to obtain the size of the electronic component. The shielding film installation device determines the contact portion between the electronic component to be installed and the target shielding film according to the size of the electronic component, and determines the contact portion as the insulating glue covering area. Thereafter, the shielding film installation device adds insulating glue to the insulating glue covering area to cover the electronic component to be installed, and then applies the target shielding film to the above-mentioned shielding frame or the above-mentioned copper exposed area, so that the insulating glue is filled between the target shielding film and the electronic component to be installed.

[0107] For example, for example, Figure 2 and Figure 3As shown, after assembling the target shielding film, the shielding film installation device can also first read the above-mentioned storage module to obtain the size of the electronic component. The shielding film installation device determines the overlapping area between the electronic component and the shielding film according to the size of the electronic component and the above-mentioned shielding film size, and determines the overlapping area as the insulating glue adding area where insulating glue needs to be added. After that, the shielding film installation device adds insulating glue to the insulating glue adding area, and makes the insulating glue cover the top of the electronic component to be installed. Finally, the shielding film installation device fixes the target shielding film in the shielding frame / exposed copper area, so that the target shielding film is applied to the insulating glue, so that the insulating glue fills the space between the target shielding film and the electronic component to be installed, forming the target electronic component.

[0108] In this way, by adding insulating glue, direct contact between the shielding film and the electronic components can be further avoided, thereby ensuring that the electronic components will not be short-circuited due to contact with the technical materials in the shielding film, thereby further improving the quality of the electronic components.

[0109] This application also provides a shielding film installation device, please refer to Figure 4 , the shielding film installation device comprises:

[0110] A material combination module 10 is used to determine a shielding film material combination corresponding to the electronic component to be installed, and assemble the shielding film materials in the shielding film material combination to obtain a target shielding film;

[0111] The area determination module 20 is used to obtain the electronic component size corresponding to the electronic component to be installed, and determine the copper exposed area corresponding to the electronic component to be installed according to the electronic component size;

[0112] The component assembly module 30 is used to fix the target shielding film to the electronic component to be mounted based on the copper exposed area to obtain a target electronic component.

[0113] In a feasible implementation manner, the material combination module 10 is further used for:

[0114] Obtaining preset signal strength and preset configuration information corresponding to the electronic component to be installed;

[0115] Based on the preset signal strength and the preset configuration information, determining a preset signal type corresponding to the electronic component to be installed;

[0116] The shielding film material combination corresponding to the electronic component to be installed is determined according to the preset signal type.

[0117] In a feasible implementation manner, the material combination module 10 is further used for:

[0118] In the case where it is determined that the preset signal type is a high-speed signal type, the preset first material combination is determined as a shielding film material combination that matches the electronic component to be installed, wherein the first material combination includes metal foil, non-woven fabric, and absorbing material;

[0119] In the case where it is determined that the preset signal type is a power signal type, the preset second material combination is determined as the shielding film material combination, wherein the second material combination includes gold plating and non-woven fabric;

[0120] In the case where it is determined that the preset signal type is a universal serial bus signal type, the preset third material combination is determined as the shielding film material combination, wherein the third material combination includes aluminum foil and non-woven fabric.

[0121] In a feasible implementation manner, the material combination module 10 is further used for:

[0122] When it is detected that the shielding film material combination is the first material combination, the metal foil is covered on top of the non-woven fabric, and the absorbing material is covered on top of the metal foil to assemble and obtain a target shielding film.

[0123] In a feasible implementation manner, the component assembly module 30 is further used for:

[0124] Determining a plurality of fixed hooks contained in the copper exposed area;

[0125] The target shielding film is fixed on the plurality of fixed hooks, and the target shielding film is pushed according to a preset thrust parameter to obtain a target electronic component.

[0126] In a feasible implementation manner, the material combination module 10 is further used for:

[0127] Acquire the electronic component size corresponding to the electronic component to be installed, and determine the shielding frame configuration area matching the electronic component to be installed based on the electronic component size;

[0128] Adding a shielding frame in the shielding frame configuration area, and determining a shielding film size according to the shielding frame configuration area;

[0129] Cutting each shielding film material in the shielding film material combination according to the shielding film size, and assembling the cut shielding film materials to obtain a target shielding film;

[0130] The target shielding film is fixed to the copper exposed area to obtain a target electronic component.

[0131] In a feasible implementation manner, the component assembly module 30 is further used for:

[0132] Determining the insulating glue coverage area contained in the electronic component to be installed based on the size of the electronic component;

[0133] Insulating glue is added to the insulating glue covered area, and the target shielding film is fixed to the shielding frame to be installed or the copper exposed area, so that the insulating glue fills between the target shielding film and the electronic element to be installed.

[0134] The shielding film installation device provided by the present application adopts the shielding film installation method in the above embodiment, which can solve the technical problem in the related art that the electromagnetic interference of some electronic components is difficult to be effectively suppressed when producing electronic components. Compared with the prior art, the beneficial effects of the shielding film installation device provided by the present application are the same as the beneficial effects of the shielding film installation method provided by the above embodiment, and the other technical features of the shielding film installation device are the same as the features disclosed in the above embodiment method, which will not be repeated here.

[0135] The present application provides a shielding film installation device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the shielding film installation method in the above-mentioned embodiment one.

[0136] Reference below Figure 5 , which shows a schematic diagram of the structure of a shielding film installation device suitable for implementing the embodiment of the present application. The shielding film installation device in the embodiment of the present application may include but is not limited to a mobile terminal, a data storage control terminal, a PC, etc. connected to the shielding film installation device or an electronic control unit supporting the shielding film installation device. Figure 5 The shielding film installation device shown is merely an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0137] like Figure 5As shown, the shielding film installation device may include a processing device 1001 (such as a central processing unit, a graphics processor, etc.), which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM: Read Only Memory) 1002 or a program loaded from a storage device 1003 to a random access memory (RAM: Random Access Memory) 1004. In RAM1004, various programs and data required for the operation of the shielding film installation device are also stored. The processing device 1001, ROM1002 and RAM1004 are connected to each other through a bus 1005. An input / output (I / O) interface 1006 is also connected to the bus. Generally, the following systems can be connected to the I / O interface 1006: an input device 1007 including, for example, a touch screen, a touchpad, a keyboard, a mouse, an image sensor, a microphone, an accelerometer, a gyroscope, etc.; an output device 1008 including, for example, a liquid crystal display (LCD: Liquid Crystal Display), a speaker, a vibrator, etc.; a storage device 1003 including, for example, a magnetic tape, a hard disk, etc.; and a communication device 1009. The communication device 1009 can allow the shielding film installation device to communicate wirelessly or wired with other devices to exchange data. Although the shielding film installation device with various systems is shown in the figure, it should be understood that it is not required to implement or have all the systems shown. More or fewer systems can be implemented or provided alternatively.

[0138] In particular, according to the embodiments disclosed in the present application, the process described above with reference to the flowchart can be implemented as a computer software program. For example, the embodiments disclosed in the present application include a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program includes a program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network through a communication device, or installed from a storage device 1003, or installed from a ROM 1002. When the computer program is executed by the processing device 1001, the above-mentioned functions defined in the method of the embodiment disclosed in the present application are executed.

[0139] The shielding film installation device provided by the present application adopts the shielding film installation method in the above embodiment, which can solve the technical problem in the related art that the electromagnetic interference of some electronic components is difficult to be effectively suppressed when producing electronic components. Compared with the prior art, the beneficial effects of the shielding film installation device provided by the present application are the same as the beneficial effects of the shielding film installation method provided by the above embodiment, and the other technical features of the shielding film installation device are the same as the features disclosed in the method of the previous embodiment, which will not be repeated here.

[0140] It should be understood that the various parts disclosed in this application can be implemented by hardware, software, firmware or a combination thereof. In the description of the above embodiments, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0141] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

[0142] The present application provides a computer-readable storage medium having computer-readable program instructions (ie, computer programs) stored thereon, and the computer-readable program instructions are used to execute the shielding film installation method in the above-mentioned embodiment.

[0143] The computer-readable storage medium provided in the present application may be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems or devices, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM: Random Access Memory), a read-only memory (ROM: Read Only Memory), an erasable programmable read-only memory (EPROM: Erasable Programmable Read Only Memory or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM: CD-Read Only Memory), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system or device. The program code contained on the computer-readable storage medium may be transmitted using any appropriate medium, including but not limited to: wires, optical cables, RF (Radio Frequency: Radio Frequency), etc., or any suitable combination of the above.

[0144] The above-mentioned computer-readable storage medium may be included in the shielding film installation device; or it may exist independently without being assembled into the shielding film installation device.

[0145] The above-mentioned computer-readable storage medium carries one or more programs. When the above-mentioned one or more programs are executed by the shielding film installation device, the shielding film installation device: determines the shielding film material combination corresponding to the electronic component to be installed, and assembles the shielding film materials in the shielding film material combination to obtain the target shielding film; obtains the electronic component size corresponding to the electronic component to be installed, and determines the copper exposed area corresponding to the electronic component to be installed according to the electronic component size; fixes the target shielding film to the electronic component to be installed based on the copper exposed area to obtain the target electronic component.

[0146] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0147] The flow chart and block diagram in the accompanying drawings illustrate the possible architecture, function and operation of the system, method and computer program product according to various embodiments of the present application. In this regard, each square box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the square box can also occur in a sequence different from that marked in the accompanying drawings. For example, two square boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each square box in the block diagram and / or flow chart, and the combination of the square boxes in the block diagram and / or flow chart can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0148] The modules involved in the embodiments described in this application may be implemented by software or hardware, wherein the name of the module does not constitute a limitation on the unit itself in some cases.

[0149] The readable storage medium provided by the present application is a computer-readable storage medium, which stores computer-readable program instructions (i.e., computer programs) for executing the above-mentioned shielding film installation method, and can solve the technical problem in the related art that the electromagnetic interference of some electronic components is difficult to be effectively suppressed when producing electronic components. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided by the present application are the same as the beneficial effects of the shielding film installation method provided by the above-mentioned embodiment, and will not be repeated here.

[0150] The present application also provides a computer program product, including a computer program, which implements the steps of the shielding film installation method as described above when executed by a processor.

[0151] The computer program product provided by this application can solve the technical problem in the related art that the electromagnetic interference of some electronic components is difficult to be effectively suppressed when producing electronic components. Compared with the prior art, the beneficial effects of the computer program product provided by this application are the same as the beneficial effects of the shielding film installation method provided by the above embodiment, which will not be repeated here.

[0152] The above descriptions are only some embodiments of the present application, and are not intended to limit the patent scope of the present application. All equivalent structural changes made using the contents of the present application specification and drawings under the technical concept of the present application, or direct / indirect applications in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A shielding film installation method, characterized in that: The shielding film installation method comprises: Determine a shielding film material combination corresponding to the electronic component to be installed, and assemble the shielding film materials in the shielding film material combination to obtain a target shielding film; Acquire the electronic component size corresponding to the electronic component to be installed, and determine the copper exposed area corresponding to the electronic component to be installed according to the electronic component size; The target shielding film is fixed to the electronic component to be mounted based on the copper exposed area to obtain a target electronic component.

2. The shielding film installation method according to claim 1, characterized in that: The step of determining the shielding film material combination corresponding to the electronic component to be installed comprises: Obtaining preset signal strength and preset configuration information corresponding to the electronic component to be installed; Based on the preset signal strength and the preset configuration information, determining a preset signal type corresponding to the electronic component to be installed; The shielding film material combination corresponding to the electronic component to be installed is determined according to the preset signal type.

3. The shielding film installation method according to claim 2, characterized in that: The step of determining the shielding film material combination corresponding to the electronic component to be installed according to the preset signal type includes at least one of the following: In the case where it is determined that the preset signal type is a high-speed signal type, the preset first material combination is determined as a shielding film material combination that matches the electronic component to be installed, wherein the first material combination includes metal foil, non-woven fabric, and absorbing material; In the case where it is determined that the preset signal type is a power signal type, the preset second material combination is determined as the shielding film material combination, wherein the second material combination includes gold plating and non-woven fabric; In the case where it is determined that the preset signal type is a universal serial bus signal type, the preset third material combination is determined as the shielding film material combination, wherein the third material combination includes aluminum foil and non-woven fabric.

4. The shielding film installation method according to claim 3, characterized in that: The step of assembling the shielding film materials in the shielding film material combination to obtain the target shielding film comprises: When it is detected that the shielding film material combination is the first material combination, the metal foil is covered on top of the non-woven fabric, and the absorbing material is covered on top of the metal foil to assemble and obtain a target shielding film.

5. The shielding film installation method according to claim 1, characterized in that: The step of fixing the target shielding film to the electronic component to be mounted based on the copper exposed area to obtain the target electronic component includes: Determining a plurality of fixed hooks contained in the copper exposed area; The target shielding film is fixed on the plurality of fixed hooks, and the target shielding film is pushed according to a preset thrust parameter to obtain a target electronic component.

6. The shielding film installation method according to claim 1, characterized in that: After the step of determining the shielding film material combination corresponding to the electronic component to be installed, the method includes: Acquire the electronic component size corresponding to the electronic component to be installed, and determine the shielding frame configuration area matching the electronic component to be installed based on the electronic component size; Adding a shielding frame in the shielding frame configuration area, and determining a shielding film size according to the shielding frame configuration area; Cutting each shielding film material in the shielding film material combination according to the shielding film size, and assembling the cut shielding film materials to obtain a target shielding film; The target shielding film is fixed to the copper exposed area to obtain a target electronic component.

7. The shielding film installation method according to any one of claims 1 to 6, characterized in that: The method further comprises: Determining the insulating glue coverage area contained in the electronic component to be installed based on the size of the electronic component; Insulating glue is added to the insulating glue covered area, and the target shielding film is fixed to the shielding frame to be installed or the copper exposed area, so that the insulating glue fills between the target shielding film and the electronic element to be installed.

8. A shielding film installation device, characterized in that: The device comprises: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program is configured to implement the steps of the shielding film installation method according to any one of claims 1 to 7.

9. A storage medium, characterized in that: The storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, the steps of the shielding film installation method according to any one of claims 1 to 7 are implemented.

10. A computer program product, characterized in that The computer program product comprises a computer program, which, when executed by a processor, implements the steps of the shielding film installation method according to any one of claims 1 to 7.

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