Connector and connector pair

Abstract

The shielding piece comprises a body part, a substrate connecting part located at one end of the body part and a contact part located at the other end of the body part, and the shielding piece surrounds the periphery of the connector; each of the body part, the substrate connecting part and the contact part comprises an exposed surface exposed out of the base; the substrate connecting part is formed around the whole circumference of the connector; the body part, the substrate connecting part and the contact part respectively comprise a metal base material and first to third layers formed on the metal base material; the first layer is a nickel or nickel alloy plating layer, the second layer is a platinum group metal or platinum group metal alloy plating layer, the third layer is a gold or gold alloy plating layer, and the thickness of the third layer is 0.2-15 nm.

Description

[0001] Related Applications

[0002] This application claims the benefit of priority from Japanese Patent Application No. 2022-136460 filed on August 30, 2022, the contents of which are hereby incorporated by reference in their entirety. Technical Field

[0003] The present disclosure relates to connectors and connector pairs. Background Art

[0004] Conventionally, substrate-to-substrate connectors have been used to electrically connect a pair of parallel circuit substrates to each other. This type of connector includes a plurality of terminals as conductive components, wherein a substrate connection portion of each terminal is connected to a wiring pattern or the like formed on the circuit substrate by solder, and when the two connectors are engaged and the contact portions of the corresponding terminals are in contact with each other, the corresponding wiring patterns of a pair of circuit substrates are connected to each other. In addition, a barrier is formed on each terminal to prevent molten solder from climbing from the substrate connection portion to the contact portion (for example, refer to Patent Document 1).

[0005] Fig.16A and Fig. 16B is a diagram showing a conventional terminal, wherein Fig.16A is a side view, and Fig. 16B It is a cross-sectional view.

[0006] In the figure, 861 is a terminal mounted on a base (not shown) of a connector, which is a component formed by bending a slender strip-shaped conductive metal plate, and includes: an elongated main body portion 861c; a contact portion 861a formed on one end side of the main body portion 861c, for contacting the mating terminal; and a substrate connecting portion 861b formed on the other end side of the main body portion 861c, connected to a wiring pattern formed on a circuit substrate (not shown) by solder.

[0007] In addition, if Fig. 16B As shown, the contact portion 861a and the substrate connection portion 861b have a plurality of plated layers formed thereon. In the figure, 862 is formed of a metal substrate of a copper alloy such as copper-beryllium alloy. In addition, 863a is a nickel plated layer formed on the metal substrate 862 as a base layer and has a thickness of about 2 μm. In addition, 863b is a palladium plated layer formed on the nickel plated layer 863a and is composed of a palladium alloy such as Pd-Ni alloy and preferably has a thickness of 0.1 μm or more. In addition, 863c is a gold plated layer formed on the palladium plated layer 863b and is composed of a gold alloy such as Au-Co alloy and preferably has a thickness of 0.3 μm or more.

[0008] As a result, for the contact portion 861a, the resistance can be reduced while the hardness and wear resistance can be improved, and good contact reliability can be obtained. In addition, for the substrate connection portion 861b, good corrosion resistance and solder wettability can be maintained while the hardness and wear resistance can be improved. In addition, the body portion 861c includes a nickel plating layer 863a and a palladium plating layer 863b formed on the nickel plating layer 863a, but there is no gold plating layer 863c.

[0009] In this manner, a palladium plated layer 863b having poor solder wettability relative to the gold plated layer 863c is formed on the surface, so that the main body portion 861c acts as a solder barrier layer, thereby preventing molten solder from climbing from the substrate connection portion 861b to the contact portion 861a.

[0010] [Prior art document]; Patent document; [Patent document 1] Japanese Patent Application Publication No. JP2006-294420. Summary of the invention

[0011] However, for this conventional connector, a barrier layer must be formed between the substrate connection portion 861b and the contact portion 861a and a solder barrier layer must be formed over a wide range to completely prevent solder from climbing from the substrate connection portion 861b to the contact portion 861a and this makes the distance from the substrate connection portion 861b to the contact portion 861a long, resulting in a large-scale terminal 861. In particular, in recent years, substrate-to-substrate connectors have become miniaturized and lower in profile, thereby making it difficult to make the terminal 861 large and to make the distance from the substrate connection portion 861b to the contact portion 861a long. Because, along with the miniaturization and lower in profile of the substrate-to-substrate connector, the terminal 861 is also miniaturized, it is very difficult to form a solder barrier layer itself between the substrate connection portion 861b and the contact portion 861a.

[0012] In this article, in order to solve the above-mentioned conventional problems, it is an object to provide a connector and a connector pair, which have a simple structure, low cost and high reliability without forming a solder barrier layer, can maintain suitable solder wettability, improve the connection strength with the substrate connection part, and reduce the contact resistance of the contact part.

[0013] To achieve this, the connector includes: a base and a shielding member; the shielding member includes a main body, a substrate connection portion located at one end of the main body, and a contact portion located at the other end of the main body, and the shielding member surrounds the periphery of the connector; the main body, the substrate connection portion and the contact portion each include an exposed surface exposed to the base; the substrate connection portion is formed on the entire circumference of the connector; the main body, the substrate connection portion and the contact portion each include a metal substrate and first to third layers of plating formed on the metal substrate; and the first layer is a nickel or nickel alloy plating layer, the second layer is a platinum group metal or a platinum group metal alloy plating layer, the third layer is a gold or gold alloy plating layer, and the thickness of the third layer is 0.2-15nm.

[0014] In another connector, the base is integrally formed with the shield.

[0015] In still another connector, the substrate connection portion is soldered to the substrate over the entire circumference.

[0016] In yet another connector, the substrate connecting portion is a flange that is continuous around the entire circumference.

[0017] In still another connector, the contact portions can form four sides of the shielding member.

[0018] In still another connector, a bent portion bent toward an inner side of the connector can be formed at an upper end of the shield.

[0019] In still another connector, the plating layer is formed on the entirety of the shield.

[0020] In yet another connector, the third layer has a thickness of 0.5-8 nm.

[0021] In yet another connector, the platinum group metal is palladium or a palladium alloy, and the thickness of the second layer is 2-200 nm.

[0022] The connector pair includes a connector according to the present disclosure and a mating connector mated with the connector.

[0023] In another connector pair, the mating connector includes: a base and a shielding member; the shielding member includes a main body, a substrate connection portion located at one end of the main body, and a contact portion located at the other end of the main body, and the shielding member surrounds the periphery of the mating connector; the main body, the substrate connection portion and the contact portion each include an exposed surface exposed to the base; the substrate connection portion is formed on the entire circumference of the mating connector; the main body, the substrate connection portion and the contact portion each include a metal substrate and first to third layers of plating formed on the metal substrate; and the first layer is a nickel or nickel alloy plating layer, the second layer is a platinum group metal or a platinum group metal alloy plating layer, the third layer is a gold or gold alloy plating layer, and the thickness of the third layer is 0.2-15nm.

[0024] The connector disclosed in the present invention can maintain appropriate solder wettability without forming a solder barrier layer, improve the connection strength of the substrate connection part, and reduce the contact resistance of the contact part. In addition, it can simplify the structure, reduce costs, and improve reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is an exploded view of the first connector according to this embodiment.

[0026] Figure 2A and Figure 2B are two views of the first connector according to this embodiment, wherein: Figure 2A is a top view, and Figure 2B For along Figure 2A A cross-sectional view made along line AA.

[0027] Figure 3A and Figure 3B are two views of the first shielding member according to this embodiment, wherein: Figure 3A is a top view, and Figure 3B For along Figure 3A A cross-sectional view made along line BB.

[0028] Figure 4A and Figure 4B is a perspective view of the second connector according to this embodiment, wherein: Figure 4A is a view from obliquely above, and Figure 4B This is a view from obliquely below.

[0029] Figure 5A 5C are three views of the second connector according to this embodiment, wherein: Figure 5A It is a top view. Figure 5B is a side view, and FIG. 5C is a front view.

[0030] Figure 6 is a bottom view of the second connector according to this embodiment.

[0031] Figure 7 It is a plan view of a state at an early stage of fitting between the first connector and the second connector according to the present embodiment.

[0032] Fig. 8A and Figure 8B is a cross-sectional view of an initial state of engagement between the first connector and the second connector according to the present embodiment, wherein: Fig. 8A For along Figure 7 The cross-sectional view made by line CC, and Figure 8B For along Figure 7 A cross-sectional view made along line DD.

[0033] Fig. 9 1 is a perspective view of a state in which the first connector and the second connector according to the present embodiment are completely mated.

[0034] Fig.10 1 is a plan view of a state in which the first connector and the second connector according to the present embodiment are completely mated.

[0035] Fig.11A and Fig. 11B is a side sectional view of the mating completion state between the first connector and the second connector according to the present embodiment, wherein: Fig.11A For along Fig.10 The cross-sectional view is made by line EE, and Fig. 11B For along Fig.10 A cross-sectional view taken along line FF.

[0036] Fig. 12A and Fig. 12B is a cross-sectional view of the mating completion state between the first connector and the second connector according to the present embodiment, wherein: Fig. 12A For along Fig.10 The cross-sectional view made by line GG, and Fig. 12B For along Fig.10 A cross-sectional view made along line HH.

[0037] Fig.13 It is a schematic cross-sectional view showing the structure of a plating layer near the surface of the conductive member according to the present embodiment.

[0038] Fig.14 is a graph showing the experimental results of solder wetting and spreading according to the present embodiment.

[0039] Fig.15 TABLE 2 is a table showing the experimental results for changes in the thickness of the second layer and the third layer in this example.

[0040] Fig.16A and Fig. 16B is a diagram showing a conventional terminal, wherein Fig.16A is a side view, and Fig. 16B It is a cross-sectional view. DETAILED DESCRIPTION

[0041] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings.

[0042] Figure 1 is an exploded view of the first connector according to the present embodiment; Figure 2A and Figure 2B are two views of the first connector according to this embodiment; and Figure 3A and Figure 3B are two views of the first shielding member according to this embodiment. Figure 2A and Figure 2B middle, Figure 2A is a top view, and Figure 2B For along Figure 2A A cross-sectional view made by line AA. Figure 3A and Figure 3B middle, Figure 3A is a top view, and Figure 3B For along Figure 3A A cross-sectional view made along line BB.

[0043] In the figure, 10 is a connector of the present embodiment and represents a first connector as one of a pair of substrate-to-substrate connectors of a connector pair. The first connector 10 is a surface-mounted socket connector mounted on the surface of a first substrate (not shown) as a mounting member, and is mated with a second connector 101 as a mating connector described later. In addition, the second connector 101 is the other of a pair of substrate-to-substrate connectors and is a surface-mounted plug connector mounted on the surface of a second substrate (not shown) serving as a mounting member.

[0044] It is noted that the first connector 10 and the second connector 101 according to the present embodiment are preferably used to electrically connect the first substrate and the second substrate, but can also be used to electrically connect other components. For example, the first substrate and the second substrate are each a printed circuit substrate, a flexible flat cable (FFC), a flexible circuit substrate (FPC), etc. used in electronic equipment, etc., but can be any type of substrate.

[0045] In addition, in the present embodiment, expressions indicating directions such as up, down, left, right, front, and back, which are used to explain the configuration and actions of the various parts of the first connector 10 and the second connector 101 of the connector pair, are relative rather than absolute, and are appropriate when the various parts of the first connector 10 and the second connector 101 are in the postures shown in the figures. That is, when their postures change, these directions should be interpreted variably according to the change in posture.

[0046] In addition, the first connector 10 includes: a first shielding member 50 as a first outer shielding member, which is formed by stamping, drawing, etc. on a conductive metal plate; and a first base 11 as a base, which is integrally formed of an insulating material such as a synthetic resin. The first base 11 includes: a flat bottom plate 18; a first convex portion 13 as a convex portion, which protrudes upward from the upper surface of the bottom plate 18; and four corner portions 17, which protrude upward from the four corners of the bottom plate 18.

[0047] The corner portion 17 is a portion connected to the first shielding member 50 when the first shielding member 50 and the first base 11 are integrated by over-molding or insert molding. In the present embodiment, the first base 11 is integrally formed with the first shielding member 50. In other words, the first base 11 is formed by filling a mold in which the first shielding member 50 is pre-set with an insulating material such as a synthetic resin, and is integrally connected to the first shielding member 50 at the corner portion 17. Thus, there is no separation between the first base 11 and the first shielding member 50, however, for the sake of convenience in explanation, in Figure 1 In the figure, the first base 11 and the first shielding member 50 are drawn separately.

[0048] like Figure 1 As shown, each corner portion 17 includes: an upper wall portion 17a, which is in the shape of one of the four-divided cylindrical walls and has an arc shape with a central angle of about 90 degrees in a plan view; a cylindrical outer wall portion 17b, which extends downward (in the negative direction of the Z axis) from the outer edge of the upper wall portion 17a; a cylindrical inner wall portion 17c, which extends downward from the inner edge of the upper wall portion 17a; and a pair of planar side wall portions 17d, which extend downward from the edges of the upper wall 17a corresponding to the two ends of the arc with a central angle of about 90 degrees. Note that in Figure 1 In the illustrated example, a recessed concave portion 17d1 is formed in each side wall portion 17d except for the peripheral edge, but the recessed portion 17d1 can be omitted and the side wall portion 17d can be a flat surface.

[0049] In addition, the inner wall portion 17c has a shielding member receiving portion 17e that is recessed to receive the inner wall 51 at the corner portion 50c included in the fitting positioning portion 51b of the first shielding member 50. The lower end portion of the shielding member receiving portion 17e is formed to be substantially parallel to the upper surface of the connecting portion 18a of the bottom plate 18. Figure 1 and Figure 2B As shown, the locking projection 17h is preferably formed so as to project toward the inside of the housing portion 50d with respect to at least a portion of the vicinity of the lower end portion of the shield housing portion 17e.

[0050] The lower end of the corner portion 50c included in the fitting positioning portion 51b of the first shield 50 is formed substantially parallel to the upper surface of the flange portion 54. The fitting positioning portion 51b including the corner portion 50c has a gently inclined surface portion 51h near the upper end thereof, which gently slopes downward toward the inside of the housing portion 50d.

[0051] Note that the engagement positioning portion 51b includes a positioning lower portion 51j extending substantially vertically downward from the lower end of the gently inclined surface portion 51h. Figure 3B As shown, the inner wall surface of the positioning lower portion 51j (ie, at least a portion near the lower end of the wall surface facing the outer wall 52) preferably has a locking recess 51k formed by being recessed into the interior of the accommodation portion 50d.

[0052] Therefore, if Figure 2B As shown, when the first shielding member 50 is integrated with the first base 11 by overmolding or insert molding, a part of the constituent material of the first base 11 is filled into the inner side of the corner portion 50c and enters the locking recess 51k to form the locking protrusion 17h, and thus the locking protrusion 17h and the locking recess 51k are engaged together. As a result, the corner portion 50c and the corner portion 17 will be firmly integrated and will not separate. It is noted that the outer wall surface of the positioning lower portion 51j (i.e., the wall surface facing the inside of the receiving portion 50d) and the inner wall portion 17c of the corner portion 17 extend in the vertical direction substantially on the same plane.

[0053] The first convex portion 13 is a substantially rectangular parallelepiped component extending in the length direction (X-axis direction) of the first connector 10, and includes: a pair of outer convex portions 13a extending in the length direction of the first connector 10 on both sides in the width direction (Y-axis direction) of the first connector 10; an inner convex portion 13b extending in the length direction of the first connector 10 at the center in the width direction; and a pair of transverse convex portions 13c connecting the outer convex portion 13a and the inner convex portion 13b in the length direction. In addition, a pair of inner concave groove portions 12a extending in the length direction of the first connector 10 as a concave portion is formed between the left and right sides of the inner convex portion 13b and the two outer convex portions 13a as a part of the first concave portion 12.

[0054] Here, the first signal terminal accommodating cavity 15 is formed from the side surfaces on the left and right sides of the inner convex portion 13b, along the bottom surface of the inner concave portion 12a to the side surface of the outer convex portion 13a. In the example shown, the first signal terminal accommodating cavity 15 penetrates the bottom plate 18 in the plate thickness direction (Z-axis direction). Note that the groove-shaped portions of the first signal terminal accommodating cavity 15 formed on the side surfaces on the left and right sides of the inner convex portion 13b are referred to as the first signal terminal accommodating inner cavity 15a, and the groove-shaped portions of the first signal terminal accommodating cavity 15 formed on the side surface of the outer convex portion 13a facing the inner convex portion 13b are referred to as the first signal terminal accommodating outer cavity 15b.

[0055] A plurality of (three in the example shown in the figure) first signal terminal receiving cavities 15 are formed by arranging in the length direction at a predetermined pitch (e.g., 0.35 mm). It is noted that the pitch and number of the first signal terminal receiving cavities 15 can be appropriately changed. A plurality of first terminals 61 as terminals received in respective first signal terminal receiving cavities 15 and attached to the first base 11 are also arranged on both sides 13 of the first protrusion at the same pitch. In other words, the plurality of first terminals 61 are arranged along respective inner groove portions 12a to form a pair of parallel terminal groups.

[0056] In addition, second shielding member receiving slits 13d, which are slits into which the inner wall 151 of the second shielding member 150 of the second connector 101 described later enters, are formed on the outer sides of both ends in the longitudinal direction of the first protrusion 13 (i.e., on the outer sides of the lateral protrusion 13c). In the example shown in the figure, the second shielding member receiving slits 13d are formed to penetrate the bottom plate 18 in the plate thickness direction, but it is not necessary for the slits to penetrate the bottom plate 18 in the plate thickness direction.

[0057] The side recessed portion 18b is formed in the bottom plate 18 outside the first protruding portion 13 of the first connector 10 in the width direction, and as a result, the bottom plate 18 has a small size in the width direction of the first connector 10, that is, is formed to be narrow in width. In addition, the end recessed portions 18c are formed at both ends of the bottom plate 18 in the length direction of the first connector 10, and thus, the bottom plate 18 has a small size in the length direction of the first connector 10, that is, is formed to be short.

[0058] Furthermore, the first high-frequency terminal support portions 16 serving as a pair of support portions protruding upward from the upper surface of the bottom plate 18 are formed further outside the first protrusion 13 with respect to the length direction of the first connector 10. The first high-frequency terminal support portions 16 have a shape as shown in FIG. Figure 2A The columnar member shown in FIG. 1 is substantially U-shaped when viewed from above and has a first high-frequency terminal receiving groove 16a extending in the vertical direction and serving as a high-frequency terminal receiving groove. In addition, the two first high-frequency terminal support portions 16 are arranged so that the openings of the two first high-frequency terminal receiving grooves 16a face opposite directions, and as shown in FIG. Figure 2AAs shown, when viewed from above (i.e., in a plan view), the two first high-frequency terminal support portions 16 are arranged to be point-symmetrical about the center of the first connector 10 and to be offset from the center in the width direction of the first connector 10 and to the outside in the width direction. In addition, the first high-frequency terminal 71 used as a high-frequency terminal is accommodated in the first high-frequency terminal accommodation groove 16a. In addition, the first high-frequency terminal accommodation opening 16b used as an opening that passes through the bottom plate 18 in the plate thickness direction is formed below and in front of the first high-frequency terminal accommodation groove 16a.

[0059] The first shielding member 50 is a member formed integrally by stamping, stretching, or the like on a conductive metal plate, and is a curved member extending in the mating direction of the first connector 10, so the surface of the first shielding member 50 can be referred to as an extended surface. Figure 2A As shown and viewed from above (i.e., in a plan view), the first shield 50 is a substantially rectangular frame-shaped member surrounding the periphery of the first connector 10 and surrounding the periphery of the first base 11. In addition, the first shield 50 includes: an inclined surface portion 51d and a gently inclined surface portion 51h, as inclined portions, extending obliquely downward and formed on the inner peripheral edge at the upper end of the first shield 50. In addition, the first shield 50 includes: a plurality of (a pair in the example shown in the figure) long side portions 50a, as straight portions, extending straightly in the length direction of the first connector 10; a plurality of (a pair in the example shown in the figure) short side portions 50b, as straight portions, extending straightly in the width direction of the first connector 10; and a plurality of (four in the example shown in the figure) corner portions 50c, as bent portions, bent by about 90 degrees, connecting one end of the long side portion 50a and one end of the short side portion 50b.

[0060] In addition, the first shielding member 50 includes: an outer wall 52; an inner wall 51, which is substantially parallel to the outer wall 52 and is located inside the outer wall 52; and a connecting portion 53, which connects and integrates the upper end of the outer wall 52 with the upper end of the inner wall 51. The connecting portion 53 is a curved portion that is bent toward the inside of the first connector 10 at the upper end of the first shielding member 50. While the outer wall 52 is a wall that is continuous over the entire circumference, the inner wall 51 has a plurality of slits 53a formed near the corner portion 50c of the long side portion 50a and the short side portion 50b to separate the fitting spring portion 51a and the fitting positioning portion 51b. Note that the closed space surrounded by the corresponding portions of the long side portion 50a, the short side portion 50b and the corner portion 50c of the inner wall 51 is a receiving portion 50d for inserting and receiving the second connector 101 as a mating connector.

[0061] The fitting spring portion 51a is a portion that extends linearly within the range of each long side portion 50a and within the range of each short side portion 50b, and when the first connector 10 and the second connector 101 are in the fitted state, the fitting spring portion 51a elastically contacts the outer wall 152 of the second shielding member 150 of the second connector 101 described later, and functions as a grounding spring that maintains the conductive state between the first shielding member 50 and the second shielding member 150. In addition, the fitting positioning portion 51b is a portion where a part of the long side portion 50a and a part of the short side portion 50b are connected to both sides of the curved corner portion 50c, and when the first connector 10 and the second connector 101 are fitted, the second connector 101 is guided to be inserted into the receiving portion 50d. Specifically, the second connector 101 is inserted into the receiving portion 50d while the outer wall 152 of the second shielding member 150 contacts the fitting positioning portion 51b, thereby performing positioning between the second connector 101 and the first connector 10.

[0062] In addition, the upper end of the fitting spring portion 51a is connected to the lower end of the connecting portion 53, and includes: an inclined surface portion 51d extending obliquely downward toward the inside of the receiving portion 50d; an engaging protrusion 51c formed at the lower end of the inclined surface portion 51d and protruding toward the inside of the receiving portion 50d; and a lower portion 51e extending downward and substantially vertically from the lower end of the engaging protrusion 51c. When the first connector 10 and the second connector 101 are in the fitted state, the engaging protrusion 51c is a portion that engages and contacts the outer wall 152 of the second shielding member 150 of the second connector 101 or the engaging protrusion 152c formed on the outer wall 152 described later and functions as a contact portion. Note that the engaging protrusion 51c extends linearly in the length direction or the width direction of the first connector 10. The fitting spring portion 51a is not connected to the first base 11, but because both ends are separated from the other parts by the slit portion 53a, the fitting spring portion 51a is relatively flexible and can be elastically deformed in a direction close to or away from the outer wall 52.

[0063] The upper end of the mating positioning portion 51b is adjacent to the connection portion of the upper end of the inner wall 51 at the connection portion 53, and forms a gently inclined surface portion 51h that gently inclines obliquely downward toward the inside of the receiving portion 50d. Thus, when viewed in the length direction and the width direction of the first connector 10, the inclination angle (i.e., the taper angle) of the gently inclined surface portion 51h is gentler than the taper angle of the inclined surface portion 51d of the mating spring portion 51a, and when the first connector 10 and the second connector 101 are mated together, the gently inclined surface portion 51h contacts the second connector 101 inserted into the receiving portion 50d, and then the inclined surface portion 51d contacts the second connector 101 inserted into the receiving portion 50d. Thus, when the first connector 10 and the second connector 101 are mated, damage to the mating spring portion 51a can be reduced.

[0064] In addition, the corner portion 50c included in the fitting positioning portion 51b is a portion connected to the first base 11 when the first shield 50 and the first base 11 are integrated by overmolding or insert molding, and specifically, is a portion integrated with the corner portion 17. Note that the other portions of the first shield 50 are separated from the first base 11. Thus, when the first shield 50 and the first base 11 are integrated, the outer wall 52 and the connecting portion 53 at the corner portion 50c cover the outer wall portion 17b and the upper wall portion 17a at the corner portion 17. In addition, the inner wall 51 at the corner portion 50c is accommodated in the shield accommodating portion 17e formed in the inner wall portion 17c at the corner portion 17.

[0065] This ensures that the corner portion 50c and the corner portion 17 are firmly integrated and will not separate. In addition, the corner portion 50c is integrated with the corner portion 17 of the first base 11, and at least the space defined by the outer wall 52, the inner wall 51 and the connecting portion 53 is filled with the insulating material constituting the first base 11. In other words, the corner portion 50c is strong because the inner side is filled with the constituent material of the first base 11. In addition, the fitting positioning portion 51b including the corner portion 50c has high firmness, and thus, even if a portion near the fitting surface 101a of the second shielding member 150 of the second connector 101 described later contacts the fitting positioning portion 51b, the fitting positioning portion 51b will not be deformed or damaged.

[0066] The flange portion 54 serving as a flat surface portion extending to the outside is connected to the lower end of the outer wall 52 via a bent portion 52a bent at an angle of about 90 degrees. The bent portion 52a and the flange portion 54 are connected to the lower end of the outer wall 52 in a continuous manner over the entire circumference. Note that in the example shown in the figure, small notches 54a are formed at multiple locations of the flange portion 54, but the notches 54a can be appropriately omitted.

[0067] The flange portion 54 functions as a substrate connection portion, and the lower surface of the flange portion 54 is parallel to the surface of the first substrate and is a portion connected to the connection pad on the surface by welding or the like. Note that, in a unified description, the range including the connection portion 53, the outer wall 52, and the flange portion 54 as the substrate connection portion, starting from the joint protrusion 51c formed as a contact portion on the inner wall 51, is described as the main body. The connection pad is typically connected to a ground wire. In addition, the outer wall 52 is a wall that is continuous along its entire circumference, and the upper end of the outer wall 52 is a portion that is continuous with the connection portion 53, and the portion includes a portion that extends in a direction orthogonal to the outer wall 52 in a cross section; the lower end of the outer wall 52 is connected to a continuous component that is the same as the flange portion 54, and the component extends in a direction orthogonal to the outer wall 52 in a cross section; and thus, the rigidity of the outer wall 52 is relatively high, and deformation is not likely to occur.

[0068] Furthermore, when the first base 11 is connected to the first shielding member 50 in the housing portion 50d, the first recess 12 as a recess surrounded by the inner wall 51 and defined below by the bottom plate 18 to be engaged with the second connector 101 is formed in the housing portion 50d. Furthermore, as described above, the two inner recessed grooves 12a as elongated recesses extending in the length direction of the first connector 10 are formed between the inner convex portion 13b and the two outer convex portions 13a on the left and right sides with a portion of the first recessed groove 12. Furthermore, the outer recessed grooves 12c as elongated recesses extending in the length direction of the first connector 10 are formed between the outer convex portion 13a and the inner wall 51 with a portion of the first recessed groove 12. Furthermore, the two engaging recessed grooves 12b are formed outside the two ends of the first convex portion 13 with respect to the length direction of the first connector 10 with a portion of the first recessed groove 12.

[0069] In addition, the first terminal 61 is a component integrally formed by stamping, bending, etc. on a conductive metal plate, and is provided with: a held portion 63; a tail portion 62, which serves as a substrate connection portion and is connected to the lower end of the held portion 63; an outer connection portion 65; connected to the upper end of the held portion 63; and a lower connection portion 64, which is connected to the lower end of the outer connection portion 65 and has a substantially U-shaped side shape. A contact portion 65a that is bent to bulge inwardly in the width direction of the first connector 10 is formed near the lower end of the outer connection portion 65. In addition, the first terminal 61 is further provided with: an inner connection portion 66 that is connected to the end of the lower connection portion 64. The inner connection portion 66 is bent and connected to the lower connection portion 64 and extends upward (in the positive direction of the Z axis). A contact portion 66a that is bent to bulge outwardly in the width direction of the first connector 10 is formed near the upper end of the inner connection portion 66. Like the contact portion 65a of the outer connecting portion 65, the contact portion 66a is a portion that contacts the second terminal 161 provided in the second connector 101 described later. In other words, in the present embodiment, the first terminal 61 is provided with the contact portion 65a of the outer connecting portion 65 and the contact portion 66a of the inner connecting portion 66 that face each other, and form two-point contact with the second terminal 161. When the first terminal 61 is mounted on the first base 11, the contact portion 65a of the outer connecting portion 65 and the contact portion 66a of the inner connecting portion 66 protrude into the inner groove portion 12a to face each other.

[0070] In addition, the first terminal 61 is pressed into the first signal terminal receiving cavity 15 from the mounting surface 10b side which is the lower surface (Z-axis negative direction surface) of the first connector 10, and the first terminal 61 is fixed to the first base 11 based on the fact that the held portion 63 is clamped from both sides by the side surface inside the first signal terminal receiving outer cavity 15b. Note that the first terminal 61 is not necessarily attached to the first base 11 by pressing, but can be integrated with the first base 11 by overmolding or insert molding. Here, for the sake of convenience, the case where the held portion 63 is pressed into the first signal terminal receiving outer cavity 15b and is held by the first signal terminal receiving outer cavity 15b is described.

[0071] The tail portion 62 is bent and connected to the retained portion 63, extends in the left-right direction (Y-axis direction) (i.e., to the outside in the width direction of the first connector 10), and is connected to a connection pad connected to the conductive trace of the first substrate by welding or the like. Note that the conductive trace may be a power line for supplying power, but is typically a signal line. In addition, the signal line is described assuming that the signal line does not transmit a high-frequency signal but transmits a signal of a normal frequency (e.g., a frequency less than 10 GHz) that is lower than the frequency of the high-frequency signal. Note that the tail portion 62 is visible when viewed from the mating direction of the first connector 10 (i.e., from the mating surface 10a side).

[0072] The first high-frequency terminal 71 is a component integrally formed by stamping, bending, etc. a conductive metal plate, and has: a retained portion 73; a tail portion 72 serving as a substrate connecting portion connected to the lower end of the retained portion 73; and an upper connecting portion 75 connected to the upper end of the retained portion 73.

[0073] In addition, the retained portion 73 extends in the up-down direction (Z-axis direction) and is a portion that is pressed into and retained in the first high-frequency terminal receiving groove 16a. As described above, the two first high-frequency terminal support portions 16 are arranged so that the openings of the two first high-frequency terminal receiving grooves 16a face opposite directions, respectively, and thus, the two first high-frequency terminals 71 retained in the two first high-frequency terminal receiving grooves 16a by the two retained portions 73 also face opposite directions in posture to each other. It is to be noted that the first high-frequency terminal 71 does not have to be attached to the first base 11 by being pressed into, but can be integrated with the first base 11 by overmolding or insert molding. In this article, for the sake of convenience of explanation, the case where the retained portion 73 is pressed into the first high-frequency terminal receiving groove 16a and retained by the first high-frequency terminal receiving groove 16a is explained.

[0074] The tail portion 72 is bent and connected to the held portion 73, extends in the left-right direction (Y-axis direction) (i.e., toward the center of the width direction of the first connector 10), and is connected to the connection pad connected to the conductive trace of the first substrate by welding, etc. Note that the conductive trace is a signal line, and the signal line is typically described as a high-frequency signal that transmits a high-frequency (e.g., a frequency of 10 GHz or more) RF signal.

[0075] The upper connecting portion 75 is bent in a substantially S-shape when viewed in the longitudinal direction of the first connector 10, and the portion bent to bulge toward the center in the width direction of the first connector 10 functions as a contact portion 75a. The contact portion 75a is a portion that contacts a second high-frequency terminal 171 provided in the second connector 101 described later.

[0076] The first high-frequency terminal 71 is pressed into the first high-frequency terminal receiving groove 16a of the first high-frequency terminal support portion 16 located in the fitting recess 12b from the mounting surface 10b side, and the first high-frequency terminal 71 is fixed to the first base 11 based on the fact that the held portion 73 is clamped from both sides by the inner side of the first high-frequency terminal receiving groove 16a. In this state (i.e., in the state where the first high-frequency terminal 71 is assembled to the first base 11), the contact portions 75a of the pair of first high-frequency terminals 71 face opposite directions to each other.

[0077] In addition, the first connector 10 is placed on the surface of the first substrate using a first solder sheet (not shown) used as a solder sheet provided on the mounting surface 10b side and fixed and mounted on the surface of the first substrate by heating and melting the first solder sheet using a heating furnace, etc. Note that the means for connecting the first shield 50, the first terminal 61, the first high-frequency terminal 71, etc. to the connection pad of the first substrate, etc., does not necessarily require the application of a solder sheet, but may be the application of solder paste, transfer of cream solder, dipping, jet soldering, etc.; however, for ease of explanation, the case of using a solder sheet will be described.

[0078] The first solder sheet includes: a pair of elongated long side portions in a strip shape, extending straight and continuously in the length direction of the first connector 10; a pair of elongated short side portions in a strip shape, extending straight and continuously in the width direction of the first connector 10; and a plurality of rectangular short-dimension portions, wherein the long side extends in the width direction of the first connector 10 and the short side extends in the length direction of the first connector 10. Note that both ends of each short side portion are preferably connected to the long side portion. In addition, the long side portion and the short side portion do not necessarily extend continuously but may be discontinuous, but are described here as extending continuously.

[0079] Furthermore, a pair of long side portions are provided on the lower surface of the flange portion 54 corresponding to the long side portions 50a of the first shield 50. A pair of short side portions are provided on the lower surface of the flange portion 54 corresponding to the short side portions 50b of the first shield 50. Furthermore, respective short-sized portions are provided on the lower surface of the tail portion 62 of each first terminal 61 and the lower surface of the tail portion 72 of each first high-frequency terminal 71.

[0080] When the first solder sheet arranged in this manner is heated and melted and the first connector 10 is mounted on the surface of the first substrate, the flange portion 54 continuously connected to the lower end of the outer wall 52 continuous on the entire circumference of the first shielding member 50 is connected to the connection pad on the surface of the first substrate without a gap. Therefore, the strength of the first shielding member 50 connected to the connection pad on the surface of the first substrate is high, and as a result, the strength of the entire first connector 10 surrounded by the first shielding member 50 is high. In addition, the electromagnetic shielding effect achieved by the first shielding member 50 connected to the connection pad on the surface of the first substrate without a gap is very high, and the first connector 10 surrounded by the first shielding member 50 is very effectively electromagnetically shielded. In particular, the smoothness of the lower surface of the flange portion 54 is high. Therefore, the strength of the first shielding member 50 connected to the connection pad on the surface of the first substrate can be made extremely high. In addition, since there is no gap between the connection pad on the surface of the first substrate, the electromagnetic shielding effect can also be very high.

[0081] Thus, due to the high strength and electromagnetic shielding effect, the first connector 10 can transmit high-frequency signals even in a small and low-profile state. For example, even if the dimensions of the first connector 10 in the length direction, width direction, and height direction are set to 3.3 mm or less, 2.3 mm or less, and 0.7 mm or less, the first high-frequency terminal 71 can transmit a high-frequency signal of about 60 GHz.

[0082] Next, the configuration of the second connector 101 will be described.

[0083] Figure 4A and Figure 4B is a perspective view of a second connector according to the present embodiment; Figure 5A 5C are three views of the second connector according to this embodiment; and Figure 6 is a bottom view of the second connector according to this embodiment. Figure 4A and Figure 4B middle, Figure 4A is a view from obliquely above, and Figure 4B is a view from obliquely below; Figure 5A To Figure 5C, Figure 5A It is a top view. Figure 5B is a side view, and FIG. 5C is a front view.

[0084] According to the present embodiment, the second connector 101 includes: a second shielding member 150, which is a second outer shielding member and is formed by stamping, drawing, etc. on a conductive metal plate; and a second base 111, which is a base and is integrally formed using an insulating material such as synthetic resin. The second base 111 has: a flat bottom plate 118; a second protrusion 112, which is a protrusion and protrudes upward from the upper surface of the bottom plate 118 at the center of the length direction of the second connector 101; and a pair of protruding end portions 122, which protrude upward from the upper surface of the bottom plate 118 at both ends in the length direction (X-axis direction) of the second connector 101. The second protrusion 112 is narrower than the protruding end portions 122 and is located on the inner side of the width direction (Y-axis direction) of the second connector 101 than both side ends of the protruding end portions 122.

[0085] The second protrusion 112 is a generally rectangular parallelepiped component extending in the length direction of the second connector 101. A groove-shaped central groove 112b that is recessed downward from the upper surface is formed in the center of the width direction, and the left and right sides of the central groove 112b are two terminal support walls 112a that support the second terminals 161 used as mating terminals. The second terminals 161 are arranged in a number corresponding to the first terminals and at a spacing corresponding to the first terminals 61, so that at least a portion of the second terminals 161 is exposed on the surface of the terminal support wall 112a. In other words, a plurality of second terminals 161 are arranged along their respective terminal support walls 112a to form a pair of parallel terminal groups (mating terminal groups).

[0086] Each protruding end portion 122 includes: an outer wall surface, which faces the outer side in the length direction and both sides in the width direction of the second connector 101; an upper surface 122b, which faces the mating surface 101a side of the second connector 101; and an inner wall surface 122c, which faces the inner side in the length direction of the second connector 101. Note that each protruding end portion 122 is separated from both ends of the second protrusion 112 in the length direction. In addition, a second high-frequency terminal support portion 116 serving as a support portion is formed on each protruding end portion 122. The second high-frequency terminal support portion 116 has: a second high-frequency terminal receiving groove 116a, which serves as a high-frequency terminal receiving groove, extends in the up-down direction, and has a generally U-shaped shape when viewed from above. In addition, the two second high-frequency terminal support portions 116 are arranged so that the openings of the two second high-frequency terminal receiving grooves 116a face opposite directions, respectively, and as Figure 5AAs shown, it is arranged to be point-symmetrical about the center of the second connector 101 when viewed from above (i.e., in a plan view), and to be away from the width center of the second connector 101 and offset to the outside in the width direction. In addition, the second high-frequency terminal 171 used as a high-frequency terminal is accommodated in the second high-frequency terminal accommodating groove 116a. In addition, a second high-frequency terminal accommodating opening 116b used as an opening that passes through the bottom plate 118 in the plate thickness direction is formed below and in front of the second high-frequency terminal accommodating groove 116a. In addition, on each protruding end 122, a first high-frequency terminal accommodating recess 116c used as a mating terminal accommodating recess that opens from the second high-frequency terminal accommodating opening 116b to the upper surface 122b is formed in front of the second high-frequency terminal accommodating groove 116a.

[0087] The second shielding member 150 is a component integrally formed by stamping, stretching, etc. on a conductive metal plate, and is a curved component extending in the mating direction of the second connector 101, so the surface of the second shielding member 150 can be called an extended surface. In addition, in a plan view, the second shielding member 150 is a substantially rectangular frame-shaped component, and surrounds the periphery of the second connector 101 and the periphery of the second base 111. In addition, the second shielding member 150 includes: a pair of long sides 150a extending linearly in the longitudinal direction of the second connector 101; a pair of short sides 150b extending linearly in the width direction of the second connector 101; and four corner portions 150c bent at about 90 degrees to connect one end of the long side 150a and one end of the short side 150b.

[0088] In addition, the second shielding member 150 includes: an outer wall 152; an inner wall 151, which serves as a second inner shielding member; and an upper wall 153. In addition, the outer wall 152 is a wall that is continuous over the entire circumference. In addition, the upper wall 153 is connected to the upper end of the outer wall 152 at each short side portion 150b, at the corner portions 150c at both ends of the short side portion 150b, and near both ends of each long side portion 150a, and is formed to cover at least a portion, preferably more than half, of the upper surface 122b of the protruding end portion 122. Note that a first high-frequency terminal accommodating opening 153a is formed in the upper wall 153, serving as an opening, corresponding to the first high-frequency terminal accommodating recess 116c. In addition, the inner wall 151 extends downward, and its upper end is connected to the inner end of the second connector 101 in the longitudinal direction of the upper wall 153, and is formed to cover at least a portion, preferably substantially the entirety, of the inner wall surface 122c of the protruding end portion 122. Note that the upper end of the inner wall 151 has a curved upper wall connection portion 151a connected to the upper wall 153, and the lower end of the inner wall 151 has a tail portion 151b, which is used as a substrate connection portion and is bent so that the end faces the inner side in the length direction of the second connector 101. The tail portion 151b is parallel to the surface of the second substrate and is a portion of the connection pad connected to the surface by welding or the like. The connection pad is typically connected to a ground line. In addition, the space surrounded by the outer wall 152 corresponding to the pair of long sides 150a and the pair of inner walls 151 is a second recess 113 for inserting and accommodating the first protrusion 13 of the first connector 10.

[0089] The flange portion 154 serving as a flat surface portion is connected to the lower end of the outer wall 152 via a bent portion 152a bent at an angle of about 90 degrees. The bent portion 152a and the flange portion 154 are connected to the lower end of the outer wall 152 in a continuous manner around the entire circumference. Note that in the example shown in the figure, small notches 154a are formed at multiple locations of the flange portion 154, but the notches 154a can be appropriately omitted.

[0090] The flange portion 154 serves as a substrate connection portion, and the lower surface of the flange portion 154 is parallel to the surface of the second substrate and is a portion connected to the connection pad on the surface by welding or the like. The connection pad is typically connected to a ground wire. In addition, in addition to being a continuous wall around the entire circumference, the outer wall 152 is also connected to a component whose lower end is continuous with the flange portion 154, and the component is a component that extends in a direction orthogonal to the outer wall 152 in a cross section. As a result, the outer wall 152 is relatively rigid and resistant to deformation. In the present embodiment, the flange portion 154 is continuously connected to the lower end of the outer wall 152 around the entire circumference for illustration, but if relatively high rigidity is not required, the flange portion 154 may be connected to only a portion.

[0091] In addition, the outer wall 152 may include an outwardly protruding engagement protrusion 152c corresponding to the long side 150a and the short side 150b. The engagement protrusion 152c is a portion that engages and contacts the engagement protrusion 51c formed on the inner wall 51 of the first shielding member 50 provided in the first connector 10 when the first connector 10 and the second connector 101 are fitted with each other, and serves as a contact portion, and extends linearly in the length direction and the width direction of the second connector 101. In addition, when collectively described, the range from the portion where the engagement protrusion 152c as the contact portion is formed on the outer wall 152 to the flange portion 154 as the substrate connection portion is described as the main body portion.

[0092] Note that the second shield 150 is integrated with the second base 111 by overmolding or insert molding. In the present embodiment, the second base 111 is integrally formed with the second shield 150. In other words, the second base 111 is formed by filling a cavity of a mold in which the second shield 150 is previously set with an insulating material such as a synthetic resin, and is integrally connected to the second shield 150 at the protruding end 122.

[0093] The second terminal 161 is a component integrally formed by stamping, bending, etc., a conductive metal plate, and includes: an outer connection portion 165 extending in the up-down direction (Z-axis direction); a tail portion 162, as a substrate connection portion, connected to the lower end of the outer connection portion 165; an upper connection portion 164 connected to the upper end of the outer connection portion 165; and an inner connection portion 166 connected to the lower end of the upper connection portion 164 and facing the outer connection portion 165. The second terminal 161 can be integrated with the second base 111 by overmolding or insert molding. That is, the second base 111 is formed by filling a cavity of a mold in which the second terminal 161 is preliminarily set with an insulating material such as a synthetic resin.

[0094] As a result, the second terminal 161 is integrally attached to the terminal support wall 112a, so that at least a portion of the second terminal 161 is buried in the terminal support wall 112a of the second protrusion 112 of the second base 111, and at least a portion of the surface of the outer connecting portion 165, the upper connecting portion 164, and the inner connecting portion 166 is exposed on the outer side, upper surface, and inner side of the terminal support wall 112a. Note that the surface of the outer connecting portion 165 and the surface of the inner connecting portion 166 function as a contact portion and contact the first terminal 61 provided in the first connector 10. In addition, the tail portion 162 extends from the terminal support wall 112a to the outer side in the width direction of the second base 111 and is connected to the connection pad connected to the conductive trace of the second substrate by welding or the like. The tail portion 162 is provided at a position overlapping with the tail portion 151b of the inner wall 151 when viewed from the length direction (X-axis direction) of the second connector 101. Note that the conductive trace may be a power line for supplying power, but is typically a signal line. In addition, the signal line is described assuming that the signal line transmits a signal having a normal frequency (for example, a frequency lower than 10 GHz) lower than the frequency of the high-frequency signal instead of the high-frequency signal.

[0095] In addition, the second terminal 161 is not necessarily integrated with the second base 111 by overmolding or insert molding, but may be attached to the second base 111 by press-fitting, etc. Herein, for convenience of description, the case of being integrated with the second base 111 by overmolding or insert molding will be described.

[0096] The second high-frequency terminal 171 is a component integrally formed by stamping, bending, etc. a conductive metal plate, and comprises: a retained portion 173; a tail portion 172 serving as a substrate connecting portion connected to the lower end of the retained portion 173; and an upper connecting portion 175 connected to the upper end of the retained portion 173.

[0097] The retained portion 173 extends in the up-down direction and is a portion that is pressed into and retained in the second high-frequency terminal receiving groove 116a. As described above, the two second high-frequency terminal support portions 116 are configured so that the openings of the two second high-frequency terminal receiving grooves 116a face opposite directions, and thus the two second high-frequency terminals 171 retained in the two second high-frequency terminal receiving grooves 116a by the two retained portions 173 are also in a posture facing opposite directions. It is to be noted that the second high-frequency terminal 171 is not necessarily attached to the second base 111 by being pressed into, but can be integrated with the second base 111 by overmolding or insert molding. In this article, for ease of explanation, the case where the retained portion 173 is pressed into the second high-frequency terminal receiving groove 116a and retained by the second high-frequency terminal receiving groove 116a will be described.

[0098] The tail portion 172 is bent and connected to the held portion 173, extends in the left-right direction (Y-axis direction) (i.e., toward the center of the width direction of the second connector 101), and is connected to a connection pad connected to a conductive trace of the second substrate by welding, etc. Note that the conductive trace is a signal line, and the signal line is typically described as a high-frequency signal that transmits a high-frequency (e.g., a frequency of 10 GHz or more) RF signal.

[0099] The upper connecting portion 175 is bent in a substantially S-shape when viewed in the longitudinal direction of the second connector 101, and the portion bent to bulge toward the center in the width direction of the second connector 101 functions as a contact portion 175a. The contact portion 175a is a portion that contacts the first high-frequency terminal 71 provided in the first connector 10.

[0100] The second high-frequency terminal 171 is pressed into the second high-frequency terminal receiving groove 116a of the second high-frequency terminal support portion 116 located on the protruding end portion 122 from the mounting surface 101b side, and the second high-frequency terminal 171 is fixed to the second base 111 based on the fact that the held portion 173 is clamped from both sides by the side surfaces inside the second high-frequency terminal receiving groove 116a. In this state (i.e., in the state where the second high-frequency terminal 171 is assembled to the second base 111), the contact portions 175a of the pair of second high-frequency terminals 171 face opposite directions to each other.

[0101] Note that, in the example shown in the figure, the second high-frequency terminal 171 is formed to have the same size and shape as the first high-frequency terminal 71. Thus, the first high-frequency terminal 71 can be used as the second high-frequency terminal 171.

[0102] In addition, the second connector 101 is fixed and mounted on the surface of the second substrate by placing a second solder sheet (not shown) as a solder sheet applied to the mounting surface 101b side on the surface of the second substrate and heating and melting the second solder sheet using a heating furnace or the like. Note that the means for connecting the second shielding member 150, the second terminal 161, the second high-frequency terminal 171, etc. to the connection pads of the second substrate, etc., is not necessarily by applying a solder sheet, but may be applying solder paste, transferring paste solder, dipping, spray soldering, etc. However, for ease of explanation, the case of using a solder sheet will be described.

[0103] The second solder sheet includes: a pair of elongated long side portions in a strip shape, extending straight and continuously in the length direction of the second connector 101; a pair of elongated short side portions in a strip shape, extending straight and continuously in the width direction of the second connector 101; and a plurality of rectangular short-dimension portions, wherein the long side extends in the width direction of the second connector 101 and the short side extends in the length direction of the second connector 101. Note that both ends of each short side portion are preferably connected to the long side portion. In addition, the long side portion and the short side portion do not necessarily have to extend continuously but may be discontinuous, but are described herein as extending continuously.

[0104] Furthermore, a pair of long side portions corresponding to the long side portions 150a of the second shield 150 are provided on the lower surface of the flange portion 154, a pair of short side portions corresponding to the short side portions 150b of the second shield 150 are provided on the lower surface of the flange portion 154, and another pair of short side portions are provided on the lower surface of the tail portion 151b of the inner wall 151. Furthermore, respective short-sized portions are provided on the lower surface of the tail portion 162 of each second terminal 161 and the lower surface of the tail portion 172 of each second high-frequency terminal 171.

[0105] When the second solder sheet arranged in this manner is heated and melted and the second connector 101 is mounted on the surface of the second substrate, the bent portion 152a and the flange portion 154 connected continuously to the lower end of the outer wall 152 continuous on the entire circumference in the second shield 150 are connected to the connection pad on the surface of the second substrate without a gap. Therefore, the strength of the second shield 150 connected to the connection pad on the surface of the second substrate is high, and as a result, the strength of the entire second connector 101 surrounded by the second shield 150 is high. In addition, the electromagnetic shielding effect achieved by the second shield 150 connected to the connection pad on the surface of the second substrate without a gap is very high, and the second connector 101 surrounded by the second shield 150 is very effectively electromagnetically shielded. In particular, the smoothness of the lower surface of the flange portion 154 is high. Therefore, the strength of the second shield 150 connected to the connection pad on the surface of the second substrate can be made extremely high. In addition, since there is no gap between the connection pad on the surface of the second substrate, the electromagnetic shielding effect can also be very high.

[0106] Furthermore, the protruding end portions 122 at both ends of the second connector 101 in the longitudinal direction are covered by the outer wall 152 of the second shielding member 150 on the outer wall surfaces of the second connector 101 facing the outer side in the longitudinal direction and both sides in the width direction, the upper surface 122b of the fitting surface 101a facing the second connector 101 is covered by the upper wall 153 of the second shielding member 150, and the inner wall surface 122c facing the inner side in the longitudinal direction of the second connector 101 is covered by the inner wall 151 of the second shielding member 150. Therefore, the entire surroundings are shielded, and the second high-frequency terminal 171 supported by the second high-frequency terminal support portion 116 formed on the protruding end portion 122 is very effectively electromagnetically shielded.

[0107] Therefore, due to the high strength and electromagnetic shielding effect, the second connector 101 can transmit high-frequency signals even in a small and low-profile case. For example, even if the dimensions of the second connector 101 in the length direction, width direction, and height direction are set to be less than 2.9 mm, less than 1.9 mm, and less than 0.7 mm, the second high-frequency terminal 171 can transmit a high-frequency signal of about 60 GHz.

[0108] Next, the operation of fitting the first connector 1 and the second connector 101 having the above-described configuration together will be described.

[0109] Figure 7 It is a plan view of a state at an early stage of fitting between the first connector and the second connector according to the present embodiment. Fig. 8A and Figure 8B It is a cross-sectional view of a state at an early stage of fitting between the first connector and the second connector according to the present embodiment. Fig. 9 1 is a perspective view of a state in which the first connector and the second connector according to the present embodiment are completely mated. Fig.10 1 is a plan view of a state in which the first connector and the second connector according to the present embodiment are completely mated. Fig.11A and Fig. 11B 1 is a side sectional view of a state in which the fitting between the first connector and the second connector according to the present embodiment is completed. Fig. 12A and Fig. 12B is a cross-sectional view of the mating completion state between the first connector and the second connector according to this embodiment. Fig. 8A and Figure 8B middle, Fig. 8A For along Figure 7 The cross-sectional view made by line CC, and Figure 8B For along Figure 7 The cross-sectional view is made by line DD; Fig.11A and Fig. 11B middle, Fig.11A For along Fig.10 The cross-sectional view is made by line EE, and Fig. 11BFor along Fig.10 A cross-sectional view is made along line FF. Fig. 12A and Fig. 12B middle, Fig. 12A For along Fig.10 The cross-sectional view made by line GG, and Fig. 12B For along Fig.10 A cross-sectional view made along line HH.

[0110] In order to mate the first connector 10 with the second connector 101, first, the operator places the mating surface 10a of the first connector 10 and the mating surface 101a of the second connector 101 such that Figure 7 As shown, facing each other, and when the position of the first protrusion 13 of the first connector 10 matches the position of the second recess 113 of the second connector 101 and the position of the protruding end 122 of the second connector 101 matches the position of the corresponding engaging recess 12b of the first connector 10, the alignment of the first connector 10 and the second connector 101 is completed.

[0111] In this state, when the first connector 10 and / or the second connector 101 moves in a direction approaching the other side (i.e., in the mating direction), the second shielding member 150 of the second connector 101 is inserted into the accommodating portion 50d of the first shielding member 50 of the first connector 10, the first protrusion 13 of the first connector 10 is inserted into the second recess 113 of the second connector 101, and the protruding end 122 of the second connector 101 is inserted into the mating recess 12b of the first connector 10.

[0112] Note that the connecting portion 53 of the first shield 50 exists on the mating surface 10a of the first connector 10 so as to surround the circumference of the mating surface 10a, and the outer wall 152 and the upper wall 153 of the second shield 150 exist on the mating surface 101a of the second connector 101. Thus, the mating surface 10a of the first connector 10 and the mating surface 101a of the second connector 101 are not damaged or broken even though they are in contact with each other.

[0113] In addition, Figure 7 and Fig. 8A and Figure 8B In the initial state of mating shown in FIG. 1 (i.e., in the state in which the portion near the mating surface 101a of the second shielding member 150 of the second connector 101 slightly enters the housing portion 50d of the first shielding member 50 of the first connector 10), the portion near the mating surface 101a of the outer wall 152 at the corner portion 150c of the second shielding member 150 contacts the gently inclined surface portion 51h near the upper end of the mating positioning portion 51b in the corner portion 50c of the first shielding member 50 (near the mating surface 10a), and is inserted into the housing portion 50d while contacting and being guided by the gently inclined surface portion 51h, as shown in FIG. Fig. 8A and Figure 8B As shown. Thus, the second connector 101 is positioned relative to the first connector 10. Note that the corner portion 50c included in the fitting positioning portion 51b is integrated with the corner portion 17 of the first base 11 and is filled with the insulating material constituting the first base 11 on the inner side, and thus the corner portion 50c is strong. Thus, the fitting positioning portion 51b has high strength, and even if a portion near the fitting surface 101a of the second shielding member 150 of the second connector 101 contacts the fitting positioning portion 51b, the fitting positioning portion 51b will not be deformed or damaged.

[0114] Furthermore, a portion of the outer wall 152 near the fitting surface 101a at the corner portion 150c of the second shield 150 contacts the inclined surface portion 51d of the fitting spring portion 51a of the first shield 50 after contacting the gently inclined surface portion 51h. As a result, damage to the fitting spring portion 51a can be reduced.

[0115] Therefore, if Figures 9 to 12B As shown, when the fitting of the first connector 10 and the second connector 101 is completed, the first terminal 61 and the second terminal 161 are conductively connected, and the first high-frequency terminal 71 and the second high-frequency terminal 171 are conductively connected.

[0116] Specifically, the pair of terminal support walls 112a of the second protrusion 112 of the second base 111 are inserted into the pair of inner grooves 12a of the first base 11, and as shown in FIG. Fig. 12B As shown, the contact portion 65a of the outer connecting portion 65 and the contact portion 66a of the inner connecting portion 66 of the first terminal 61, which protrude into the inner recessed portion 12a and face each other, contact the outer connecting portion 165 and the inner connecting portion 166 of the second terminal 161 exposed on the outer and inner sides of the terminal support wall 112a.

[0117] At this time, the lower connecting portion 64 of the first terminal 61 and its vicinity have a substantially U-shaped shape and can be elastically deformed, so that the gap between the contact portion 65a of the outer connecting portion 65 and the contact portion 66a of the inner connecting portion 66 facing each other can be elastically expanded. As a result, the gap between the contact portion 65a of the outer connecting portion 65 and the contact portion 66a of the inner connecting portion 66 is elastically pushed by the second terminal 161 inserted therebetween, and due to the reaction thereof, the second terminal 161 is elastically clamped from both sides by the contact portion 65a of the outer connecting portion 65 and the contact portion 66a of the inner connecting portion 66. As a result, the contact portion 65a of the outer connecting portion 65 of the first terminal 61 and the outer connecting portion 165 of the second terminal 161, as well as the contact portion 66a of the inner connecting portion 66 of the first terminal 61 and the inner connecting portion 166 of the second terminal 161, will maintain contact and will not separate even if subjected to impact or vibration, and thus can maintain a stable conductive state. Furthermore, the first terminal 61 and the second terminal 161 corresponding to each other are in contact at two locations (so-called two-location contact), and even if the contact at one location is released, the contact at the other location is maintained, thereby stably maintaining the contact state.

[0118] In addition, the first high-frequency terminal support portion 16 located in the fitting recess 12b is inserted into the first high-frequency terminal receiving recess 116c of the protruding end portion 122, and the contact portion 75a of the first high-frequency terminal 71 and the contact portion 175a of the second high-frequency terminal 171 are in contact with each other, as shown in FIG. Fig. 12B As shown. At this time, the contact portion 75a of the first high-frequency terminal 71 and the contact portion 175a of the second high-frequency terminal 171 can be elastically displaced in the width direction of the first connector 10 and the second connector 101 because the curved upper connecting portion 75, 175 itself can be elastically deformed. As a result, the contact portion 75a of the first high-frequency terminal 71 and the contact portion 175a of the second high-frequency terminal 171 corresponding to each other will maintain contact and will not separate even if they are subjected to impact or vibration, and thus a stable conduction state can be maintained. It is noted that the first high-frequency terminal 71 and the second high-frequency terminal 171 corresponding to each other are in contact with each other only at one position (the so-called single contact position), so that no unintentional stub or divided circuit is formed in the signal transmission line from the tail 72 of the first high-frequency terminal 71 to the tail 172 of the second high-frequency terminal 171. Therefore, the impedance of the transmission line can be stabilized, and good SI characteristics can be obtained.

[0119] In this manner, the first high-frequency terminal 71 and the second high-frequency terminal 171 that are in contact with each other are continuously surrounded by the inner wall 51 and the outer wall 52 of the first shielding member 50 and the inner wall 151 and the outer wall 152 of the second shielding member 150, thereby being shielded very effectively. Therefore, the impedance of the transmission path of the signal from the tail portion 72 of the first high-frequency terminal 71 to the tail portion 172 of the second high-frequency terminal 171 is stable, and a good SI characteristic can be obtained.

[0120] Furthermore, when the second shielding member 150 of the second connector 101 is inserted into the receiving portion 50d of the first shielding member 50 of the first connector 10, the outer surface of the outer wall 152 of the second shielding member 150 contacts or approaches the inner surface of the inner wall 51 of the first shielding member 50, and as shown in FIG. Fig.11A and Fig. 12A As shown, the engaging protrusion 152c formed on the outer wall 152 of the second shielding member 150 or the outer wall 152 and the engaging protrusion 51c formed on the inner wall 51 of the first shielding member 50 are engaged and contacted. It is noted that the engaging spring portion 51a of the inner wall 51 forming the engaging protrusion 51c is separated from other parts by the slit portions 53a at both ends of the engaging spring portion 51a and is relatively flexible; and can reliably maintain the state of engagement with the engaging protrusion 152c of the outer wall 152 of the second shielding member 150. As a result, the first shielding member 50 and the second shielding member 150 are locked and the release of the engaging state between the first connector 10 and the second connector 101 is prevented. In addition, the first shielding member 50 and the second shielding member 150 are in contact with each other and are conductive and at the same potential, and thereby the electromagnetic shielding is improved. It is noted that the joining protrusion 51c is the portion that joins and contacts the joining protrusion 152c; however, when the joining protrusion 152c is not provided on the outer wall 152 and the surface of the outer wall 152 is made to play the same role as the contact portion of the joining protrusion 152c, the electromagnetic shielding performance can also be improved in the same manner.

[0121] Next, the configuration of the plating layer formed on the extension surface which is the surface of the first shield 50 and the second shield 150 as the conductive members in this embodiment will be described.

[0122] Fig.13 is a schematic cross-sectional view showing the configuration of a plating layer near the surface of a conductive member according to the present embodiment; Fig.14 is a graph showing experimental results of solder wetting and spreading according to an embodiment; and Fig.15 TABLE 2 is a table showing the experimental results for changes in the thickness of the second layer and the third layer in this example.

[0123] In this embodiment, the first shield 50 and the second shield 150 as conductive members have a surface near the surface. Fig.13 The layer structure shown.

[0124] In the figure, reference numeral 91 denotes a conductive metal base material constituting the first shield 50 and the second shield 150 as conductive members, and is made of, for example, copper (Cu) or a copper alloy.

[0125] In addition, 92 is a plating layer formed on the surface of the metal base material 91 and includes a first layer 92a, a second layer 92b, and a third layer 92c.

[0126] The first layer 92a is a nickel (Ni) or nickel alloy plated layer and its thickness is preferably 1-3 μm. Note that the first layer 92a has a function of preventing copper from diffusing from the metal base material 91 to the second layer 92b and the third layer 92c.

[0127] The second layer 92b is a platinum group metal or platinum group metal alloy plating layer and its thickness is preferably 2nm or more. Note that, from the perspective of cost, etc., the thickness is preferably 200nm or less, so the thickness can be said to be preferably 2-200nm. In addition, from the viewpoint of fully preventing the metal of the first layer 92a and the metal of the third layer 92c from diffusing each other, the thickness of the second layer 92b is more preferably 5-25nm. In addition, any one of ruthenium (Ru), rhodium (Rh), palladium (Pd), osmium (Os), iridium (Ir) or platinum (Pt) can be selected as the platinum group metal; however, palladium is most preferred. In addition, examples of platinum group metal alloys include any alloy containing 50% or more of ruthenium, rhodium, palladium, osmium, iridium or platinum; however, palladium alloys containing 50% or more of palladium (e.g., PdNi, etc.) are more preferred.

[0128] The third layer 92c is a gold or gold alloy plated layer and its thickness is preferably 0.2-15 nm and more preferably 0.5-8 nm. In addition, examples of gold alloys include gold alloys containing 90% or more gold (e.g., AuCo, AuCu, AuNi, AuFe, etc.). However, in the case of an alloy of gold and a platinum group metal, a gold alloy having 20% ​​or more gold (e.g., AuPd, AuPt, etc.) is sufficient.

[0129] In this embodiment, the numerical range of the thickness of the second layer 92b and the third layer 92c is based on Fig.15 The experimental results (test results) shown in the table are set. Fig.15 , the horizontal axis represents the numerical value [nm] of the thickness of the second layer 92b and the vertical axis represents the numerical value [nm] of the thickness of the third layer 92c. In addition, each cell (square) of the table represents the test results of the contact resistance test, the mounting strength test, and the solder wettability test evaluated by one of the symbols O, Δ, and X. The symbol O means good, the symbol Δ means slightly good, and the symbol × means bad.

[0130] In the experiment, the plating layer 92 was formed on the surface of each test piece of a predetermined size composed of the metal base material 91 to obtain the second layer 92b and the third layer 92c having a thickness corresponding to the value of each unit cell. Then, each test piece was used to perform a contact resistance test, a mounting strength test, and a solder wettability test. Note that, as Fig.15 As shown, the thickness of the second layer 92b varies from 0 to 200 nm and the thickness of the third layer 92c varies from 0 to 20 nm.

[0131] In the contact resistance test, the contact resistance of each test piece on the surface of the plating layer 92 is measured. Test pieces with a contact resistance less than a first threshold value are evaluated as good, test pieces with a contact resistance greater than the first threshold value but less than a second threshold value are evaluated as slightly good, and test pieces with a contact resistance greater than the second threshold value are evaluated as poor.

[0132] In addition, in the mounting strength test, another test piece is welded to the surface of the plating layer 92 of each test piece. Tension is applied to these independent test pieces and the tension that causes the welded portion to break is measured. Test pieces with a tension above the first threshold are evaluated as good, test pieces with a tension below the first threshold but greater than the second threshold are evaluated as slightly good, and test pieces with a tension less than the second threshold are evaluated as poor.

[0133] In addition, if Fig.14 As shown, in the solder wettability test, several solder balls (e.g., with a particle size of about 0.6 mm) are placed on the surface of the plating layer 92 of each test piece and a heating device (e.g., a solder reflow oven) is used, and the expanded diameter after heating is measured. Test pieces whose expanded diameter is less than a first threshold value are evaluated as good, test pieces whose expanded diameter is greater than the first threshold value but less than a second threshold value are evaluated as slightly good, and test pieces whose expanded diameter is greater than the second threshold value are evaluated as poor.

[0134] like Fig.15 As shown, in the experimental results, for the thickness of the second layer 92b in the range of 2-200nm and the thickness of the third layer 92c in the range of 0.2-15nm, the test results evaluated that there was no badness, and thus the second terminal 161 as a conductive component could be used. In addition, when the thickness of the third layer 92c was limited to the range of 0.5-8nm, the test results did not include bad or slightly good evaluations, in other words, all the test results were evaluated as good; thus, this is considered to be more ideal. Note that, from Fig.15 It is estimated that all test results will be evaluated as good for a thickness of the second layer 92b greater than 200 nm, but when cost etc. are taken into consideration, a value greater than 200 nm is not realistic, and thus the upper limit of the thickness of the second layer 92b is set to 200 nm.

[0135] like Fig.14As shown, if the thickness of the third layer 92c, which is a gold or gold alloy plated layer, is thin, the diameter of the expansion of the solder is reduced, and the wettability of the solder is reduced. In other words, the expansion and wetting of the solder are not easy to occur, and the solder climbing is suppressed. Therefore, the solder climbing to the engaging protrusion 51c of the first shield 50 as a contact portion and the outer wall 152 of the second shield 150 as a contact portion or the engaging protrusion 152c formed on the outer wall 152 is suppressed. On the other hand, when the wettability is reduced, it is difficult to weld the flange portion 54 as a substrate connecting portion of the first shield 50 and the flange portion 154 as a substrate connecting portion of the second shield 150, and the strength of the welded portion is reduced, which leads to a reduction in the mounting strength of the flange portion 54 on the second substrate surface and the mounting strength of the flange portion 154 on the second substrate surface. In addition, if the thickness of the third layer 92c, which is a gold or gold alloy plated layer, is thin, the contact resistance increases, and in addition, the third layer 92c is more easily worn. However, forming the second layer 92b which is a platinum group metal or platinum group metal alloy plated layer below the third layer 92c to have a thickness of a predetermined value or more can reduce the contact resistance of the third layer 92c and also prevent wear.

[0136] In this way, without forming a solder barrier layer, by setting the thickness of the third layer 92c to 0.2-15nm and the thickness of the second layer 92b below the third layer 92c to 2-200nm, the solder wettability can be properly maintained, the connection strength between the flange portion 54 of the first shielding member 50 and the flange portion 154 of the second shielding member 150 can be improved, and at the same time, solder climbing can be suppressed and the contact resistance of the joining protrusion 51c of the first shielding member 50 and the joining protrusion 152c of the second shielding member 150 can be reduced.

[0137] Note that, in this embodiment, the thickness of the second layer 92b and the thickness of the third layer 92c are measured using X-ray photoelectron spectroscopy, commonly known as XPS. XPS is a method for measuring the composition of the surface layer of a sample and can generally measure the depth of a substance from the surface layer to about 0.2-6nm. In addition, the surface layer of the sample is removed by ion sputtering (using ion sputtering etching). Ion sputtering can be used to remove about 0.2-1nm. Note that the amount of removal can be adjusted.

[0138] In this embodiment, the measurement is performed by repeating the operations of measuring the surface material of the sample by XPS, scraping off the surface layer of the sample by ion sputtering, and measuring the material of the surface layer of the sample by XPS. For example, after measuring the third layer 92c as the surface layer by XPS and detecting gold or a gold alloy, only 0.2nm of the third layer 92c as the surface layer is scraped off by ion sputtering; then, in the measurement by XPS, if gold or a gold alloy can be detected, the thickness of the third layer 92c composed of gold or a gold alloy can be determined to be more than 0.2nm.

[0139] In this manner, in the present embodiment, the first connector 10 includes the first base 11 and the first shielding member 50. In addition, the first shielding member 50 includes: a body portion including a range including a connection portion 53 and an outer wall 52 from a portion where a joint protrusion 51c as a contact portion is formed on the inner wall 51 to a flange portion 54 as a substrate connection portion; the flange portion 54 is located at one end of the body portion; and the joint protrusion 51c is located at the other end of the body portion. The first shielding member 50 surrounds the periphery of the first connector 10. The body portion, the flange portion 54, and the joint protrusion 51c each include an exposed surface exposed to the first base 11. The flange portion 54 is formed along the entire circumference of the first connector 10. The body portion, the flange portion 54, and the joint protrusion 51c each include a metal substrate 91 and a first layer 92a, a second layer 92b, and a third layer 92c formed on the metal substrate 91. The first layer 92a is a nickel or nickel alloy plating layer, the second layer 92b is a platinum group metal or platinum group metal alloy plating layer, the third layer 92c is a gold or gold alloy plating layer, and the thickness of the third layer 92c is 0.2-15nm.

[0140] In addition, in the present embodiment, the second connector 101 includes a second base 111 and a second shielding member 150. In addition, the second shielding member 150 includes: a body portion including a range from a portion where a joint protrusion 152c as a contact portion is formed on the outer wall 152 to a flange portion 154 as a substrate connection portion; the flange portion 154 is located at one end of the body portion; and the joint protrusion 152c is located at the other end of the body portion. The second shielding member 150 surrounds the periphery of the second connector 101. The body portion, the flange portion 154, and the joint protrusion 152c each include an exposed surface exposed to the second base 111. The flange portion 154 is formed along the entire circumference of the second connector 101. The body portion, the flange portion 154, and the joint protrusion 152c each include a metal substrate 91 and a first layer 92a, a second layer 92b, and a third layer 92c formed on the metal substrate 91. The first layer 92a is a nickel or nickel alloy plating layer, the second layer 92b is a platinum group metal or platinum group metal alloy plating layer, the third layer 92c is a gold or gold alloy plating layer, and the thickness of the third layer 92c is 0.2-15nm.

[0141] As a result, without forming a solder barrier layer between the flange portions 54, 154 and the joint protrusions 51c, 152c, the solder wettability is properly maintained, the connection strength of the flange portions 54, 154 can be improved, solder climbing can be prevented, and the contact resistance of the joint protrusions 51c, 152c can be reduced. As a result, it is no longer necessary to form a solder barrier layer for the first shielding member 50 and the second shielding member 150 of a very small size used for the first connector 10 and the second connector 101 of a very small and low profile. As a result, the structure of the first connector 10 and the second connector 1011 can be simplified, the cost can be reduced, and the reliability can be improved.

[0142] In addition, the first base 11 is formed integrally with the first shielding member 50, and the second base 111 is formed integrally with the second shielding member 150. In addition, the flange portion 54 is welded to the first substrate over the entire circumference, and the flange portion 154 is welded to the second substrate over the entire circumference. In addition, both flange portions 54 and 154 are continuous over the entire circumference. In addition, the engaging protrusion 51c can be formed on the four sides of the first shielding member 50, and the engaging protrusion 152c can be formed on the four sides of the second shielding member 150. In addition, the connecting portion 53 bent toward the inner side of the first connector 10 can be formed at the upper end of the first shielding member 50. In addition, the plating layer 92 is formed on the entire first shielding member 50 and the entire second shielding member 150. In addition, the thickness of the third layer 92c is preferably 0.5-8nm. In addition, the platinum group metal is preferably palladium or a palladium alloy, and the thickness of the second layer 92b is 2-200nm.

[0143] It is noted that the disclosure herein describes features associated with suitable typical embodiments. After reading the disclosure herein, those skilled in the art will naturally think of various other embodiments, modifications and variations within the scope and spirit of the appended patent claims.

[0144] The present disclosure can be applicable to connectors as well as connector pairs.

Claims

1. A connector, comprising: Pedestal; as well as Shielding parts; in The shielding member includes a body portion, a substrate connection portion located at one end of the body portion, and a contact portion located at the other end of the body portion, and the shielding member surrounds the periphery of the connector; The main body portion, the substrate connection portion, and the contact portion each include an exposed surface exposed from the base; The substrate connection portion is formed on the entire circumference of the connector; The main body, the substrate connection portion, and the contact portion each include a metal substrate and first to third plating layers formed on the metal substrate; and The first layer is a nickel or nickel alloy plating layer, the second layer is a platinum group metal or a platinum group metal alloy plating layer, the third layer is a gold or gold alloy plating layer, and the thickness of the third layer is 0.2-15 nm.

2. The connector according to claim 1, wherein: The base is integrally formed with the shield.

3. The connector according to claim 1, wherein: The substrate connection portion is welded to the substrate over the entire circumference.

4. The connector according to claim 1, wherein: The substrate connecting portion is a flange that is continuous around the entire circumference.

5. The connector according to claim 1, wherein: The contact portions can form four sides of the shielding member.

6. The connector according to claim 1, wherein: A bent portion bent toward an inner side of the connector can be formed at an upper end of the shield.

7. The connector according to claim 1, wherein: The plating layer is formed on the entirety of the shield.

8. The connector according to claim 1, wherein: The thickness of the third layer is 0.5-8 nm.

9. The connector according to claim 1, wherein: The platinum group metal is palladium or a palladium alloy, and the thickness of the second layer is 2-200 nm. 10 . A connector pair, comprising the connector according to claim 1 and a mating connector mated with the connector.

11. The connector pair according to claim 10, wherein: The mating connector includes a base and a shielding member; The shielding member includes a body portion, a substrate connection portion located at one end of the body portion, and a contact portion located at the other end of the body portion, and the shielding member surrounds the periphery of the mating connector; The main body portion, the substrate connection portion and the contact portion each include an exposed surface exposed from the base; The substrate connection portion is formed on the entire circumference of the mating connector; The main body, the substrate connection portion and the contact portion each include a metal substrate and first to third plating layers formed on the metal substrate; and The first layer is a nickel or nickel alloy plating layer, the second layer is a platinum group metal or a platinum group metal alloy plating layer, the third layer is a gold or gold alloy plating layer, and the thickness of the third layer is 0.2-15 nm.

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