Water temperature estimation method and device, electronic equipment, storage medium and vehicle

By calculating the steady-state heat transfer ratio of electronic devices and estimating heat dissipation, the problem of inaccurate estimation of water temperature at the end of the waterway in the steady-state stage of electronic devices in the prior art is solved, and higher estimation accuracy is achieved.

CN119714597AActive Publication Date: 2025-03-28BEIJING CO WHEELS TECH CO LTD
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Patent Information

Application Number
CN202311255857.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-09-26
Publication Date
2025-03-28
Estimated Expiration
2043-09-26

AI Technical Summary

Technical Problem

In the steady-state stage of electronic devices, the water temperature estimation at the end of the waterway is inaccurate, and the heat transfer situation of the electronic devices under different working conditions cannot be effectively considered.

Method used

By obtaining the heating power of the electronic device and the circuit board temperature, calculating the steady-state heat transfer ratio, and then calculating the heat dissipation amount of the electronic device to the heat dissipation element and the circuit board, and finally estimating the water temperature at the end of the water circuit of the heat dissipation element.

Benefits of technology

The accuracy of estimation of water temperature at the end of the electronic device during the steady state stage is improved, and the heat transfer situation of the electronic device in different states can be more accurately reflected.

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Abstract

The invention discloses a water temperature estimation method and device, electronic equipment, a storage medium and a vehicle. The method comprises the following steps: acquiring heating electric power and circuit board temperature of an electronic device; the electronic device is fixed on the circuit board and is connected with a heat dissipation element which is in contact with the water path; when the current stage of the electronic device is a steady-state stage, calculating a steady-state heat transfer proportion at the current temperature sampling moment according to a first temperature difference between the current temperature sampling moment and the circuit board temperature at the previous temperature sampling moment; according to the steady-state heat transfer proportion, calculating a first heat dissipation amount of the electronic device for dissipating heat to the heat dissipation element under the heating electric power and a second heat dissipation amount of the electronic device for dissipating heat to the circuit board; and estimating the waterway end water temperature of the heat dissipation element according to the first heat dissipation capacity and the second heat dissipation capacity. According to the method, the steady-state heat transfer proportion is calculated, and the fact that the proportions of outward heat transfer of the electronic device under different conditions are different is considered, so that the estimation of the water temperature of the end part of the waterway when the electronic device is in the steady-state stage is more accurate.
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