An integrated quantum electrical measurement device
By providing appropriate magnetic field environments for the quantum voltage reference and quantum resistance reference respectively in the same low-temperature chamber, the problem that the quantum voltage reference and quantum resistance reference cannot be merged is solved, and the high-precision measurement device merger is achieved.
Patent Information
- Application Number
- CN202411993921.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-10-03
- Estimated Expiration
- 2044-12-31
AI Technical Summary
In the prior art, quantum voltage references and quantum resistance references cannot be combined, and each requires a different magnetic field environment, which makes it impossible to share a carrier device in the same low-temperature chamber.
An integrated quantum electrical metrology device is designed, which adopts vacuum insulation structure, electromagnetic shielding structure and superconducting coil magnet structure. In the same low-temperature chamber, a zero magnetic field space is provided for the quantum voltage reference and a strong magnetic field space is provided for the quantum resistance reference, and cooling is achieved through a cold conduction structure.
The quantum voltage standard and quantum resistance standard are combined in the same low-temperature chamber to meet the high-precision measurement requirements and provide a stable measurement environment.
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Figure CN119738642B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of metering device design, and in particular to the design of an integrated quantum electrical metering device. Background Art
[0002] The carrier device of the basic unit directly affects the accuracy of the preservation, reproduction and transmission of the basic unit. Because the quantum metrology standard is not affected by the external environment, it has high precision, high stability and good reproducibility. In the field of electrical metrology, the quantum voltage standard and quantum resistance standard based on the Josephson effect and quantum Hall effect have replaced the traditional physical standard.
[0003] The two electrical standards mentioned above can independently perform corresponding value transfer work, and under specific metrological conditions, they can also be combined into a more complex system. The normal operation of the two electrical standards requires a carrier device to provide a low-temperature environment for its core components, so they can share the same low-temperature chamber, which provides a basis for the merger of the carrier devices of the two electrical standards. However, the Josephson effect is extremely susceptible to magnetic fields, so the quantum voltage standard needs to be in a zero-magnetic field environment to work properly, while the quantum resistance standard requires a strong magnetic environment to be realized.
[0004] In response to the above problems, the prior art has not yet proposed to merge the quantum voltage reference and the quantum resistance reference, and further, there is no combined carrier device. Summary of the Invention
[0005] In order to overcome the above technical problems, the present application provides an integrated quantum electrical measurement device, which constructs a low-temperature chamber without a low-temperature medium, and simultaneously accommodates a zero magnetic field space and a strong magnetic field space in the low-temperature chamber.
[0006] The present invention adopts the following technical solutions:
[0007] An integrated quantum electrical metrology device, comprising:
[0008] Vacuum insulation structure;
[0009] A primary cold screen is arranged inside the vacuum insulation structure and is fixedly connected to the vacuum insulation structure;
[0010] An electromagnetic shielding structure, fixedly disposed in the first-level cold shield;
[0011] A quantum voltage module, wherein the quantum voltage module is fixed in the electromagnetic shielding structure;
[0012] A superconducting coil magnet structure is fixedly arranged in the first-level cold shield;
[0013] A Hall resistance module, which is disposed in the primary cold shield and fixedly connected to the superconducting coil magnet structure; and
[0014] A cold conduction structure is fixedly mounted on the vacuum insulation structure in a penetrating manner, wherein a portion of the cold conduction structure extending into the vacuum insulation structure is fixedly connected to the electromagnetic shielding structure, the quantum voltage module, and the superconducting coil magnet structure.
[0015] This invention proposes an integrated quantum electrical metrology device that provides a zero-magnetic field for a quantum voltage reference and a high-magnetic field for a quantum resistance reference within a single cryogenic chamber, without the use of a cryogenic medium (i.e., without the need for a cryogenic medium such as liquid nitrogen) and using only conduction cooling. This ultimately achieves the integration of the carrier devices for both the quantum voltage and resistance references.
[0016] The present invention has the following beneficial effects:
[0017] The present invention sets up a cold shield tube to construct a single low-temperature chamber, and sets up a shielding tube group and a superconducting coil inside the cold shield tube at the same time, thereby achieving the simultaneous setting of a zero magnetic field space and a strong magnetic field space in the same low-temperature chamber, providing a device platform for the merging of quantum voltage reference and quantum resistance reference. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 Schematic diagram of an integrated quantum electrical metrology device according to an embodiment of the present invention;
[0019] Figure 2 for Figure 1 Schematic cross-section diagram, wherein 100-vacuum insulation structure, 110-first-stage cold shield, 120-electromagnetic shielding structure, 130-quantum voltage module, 140-superconducting coil magnet structure, 150-Hall resistance module, 160-cold conduction structure;
[0020] Figure 3 Schematic diagram of an exploded structure of a vacuum insulation structure 100, wherein 101 is a Dewar sealing cylinder, 102 is a Dewar sealing cover, 103 is a sealing gasket, 104 is a long pull rod, 105 is an external interface, and 161 is a refrigerator;
[0021] Figure 4 This is a schematic diagram of the decomposed structure of a first-level cold shield, wherein 111 is the cold shield end cover, and 112 is the cold shield tube;
[0022] Figure 5Schematic cross-section of an electromagnetic shielding structure, wherein 121 is a lifting block, 122 is an outer shielding tube, 123 is a middle shielding tube, 124 is an inner shielding tube, 125 is a superconducting shielding tube, 126 is a common connector, and 127 is a pull rod.
[0023] Figure 6 This is a schematic diagram of a connection structure of a quantum voltage module, where 125 is a superconducting shielding tube, 131 is a voltage chip, 132 is a chip cold plate, 133 is a short suspension rod, and 163 is a cooling block.
[0024] Figure 7 Schematic diagram of a connection structure of a superconducting coil magnet structure, wherein 141 is a skeleton, 142 is a superconducting coil, 143 is a hanging flange, 150 is a Hall resistor module, and 163 is a cooling block;
[0025] Figure 8 Schematic diagram of a connection structure of a Hall resistor module, wherein 151 is a sample stage, 152 is a mounting plate, and 153 is a Hall resistor;
[0026] Figure 9 This is a schematic diagram of a connection structure of a cold conduction structure, where 102 is the Dewar sealing cover, 111 is the cold screen end cover, 132 is the chip cold plate, 133 is the short suspension rod, 141 is the skeleton, 161 is the refrigerator, 162 is the cold conduction belt, 163 is the cold conduction block, 1611 is the mounting flange; 1612 is the first-level cold head; 1613 is the second-level cold head. DETAILED DESCRIPTION
[0027] In order to enable readers to better understand the design purpose of the present method, the following specific embodiments are provided so that readers can vividly understand the structure, structural composition, working principle and technical effect involved in the present method. However, it should be noted that the following embodiments are not limitations on the technical solution of the present method. While analyzing and understanding the various embodiments, those skilled in the art can make a series of deformations and equivalent substitutions to the technical solution provided by the present method in combination with existing knowledge. The new technical solution obtained by the deformation and equivalent substitution is also included in the present method. It should be understood that the specific embodiments described here are only used to explain the present invention and are not used to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0028] like Figure 1-9As shown, an integrated quantum electrical measurement device is used to simplify voltage and resistance measurement equipment and facilitate the transmission of measurement values. The integrated quantum electrical measurement device includes: a vacuum insulation structure 100, a first-stage cold shield 110, an electromagnetic shielding structure 120, a quantum voltage module 130, a superconducting coil magnet structure 140, a Hall resistance module 150, and a cold conduction structure 160. The cold shield end cover 111 of the first-stage cold shield 110 is suspended under the Dewar sealing cover 102 of the vacuum insulation structure 100 using a long tie rod 104 with bolts at both ends. The electromagnetic shielding structure 120 and the superconducting coil magnet structure 140 are both fastened to the cold shield end cover 111 by bolts. The quantum voltage module 130 is suspended in the superconducting shielding tube of the electromagnetic shielding structure 120 using a short suspension rod 133 with bolts at both ends. The Hall resistance module 150 and the superconducting coil magnet are connected. The skeleton 141 of the structure 140 is connected by threaded fastening, and the cold conduction structure 160 is fastened to the Dewar sealing cover 102 by bolts through the mounting flange 1611 of the refrigerator 161. The first-level cold head 1612 of the refrigerator 161 is fastened to the cold screen end cover 111 by bolts, and the second-level cold head 1613 extends into the first-level cold screen 110. In actual use, the size of the vacuum insulation structure and the internal installation arrangement can be set according to the use requirements, and they will not be described one by one in this embodiment.
[0029] like Figure 3 As shown, the vacuum insulation structure 100 includes a Dewar sealing cylinder 101, a Dewar sealing cover 102, a sealing gasket 103, a long pull rod 104, and a first-level external interface 105. The Dewar sealing cylinder 101 and the Dewar sealing cover 102 are fastened with bolts, and the sealing gasket 103 is embedded in the connection surface for sealing. The first-level external interface 105 welded on the Dewar sealing cover 102 can be used as an exhaust port, and the interior of the vacuum insulation structure 100 is vacuumed by exhausting the gas. In addition, the first-level external interface 105 can also be connected to transmit signals, which is used to introduce external signal leads into the quantum voltage module 130 and the Hall resistance module 150.
[0030] like Figure 4 As shown, the first-level cold shield 110 includes a cold shield end cover 111 and a cold shield tube 112, which are fastened together by bolts. The first-level cold head 1612 of the refrigerator 161 is fastened together with the cold shield end cover 111 by bolts. Under the cooling action of the first-level cold head 1612, the first-level cold shield 110 constructs a low-temperature space required for the work of the quantum voltage module 130, the Hall resistance module 150 and the superconducting coil magnet structure 140. In addition, the first-level cold shield 110 provides a support point for the fixed installation of the electromagnetic shielding structure 120 and the superconducting coil magnet structure 140.
[0031] like Figure 5-6 As shown, the electromagnetic shielding structure 120 includes a hoisting block 121, an outer shielding tube 122, a middle shielding tube 123, an inner shielding tube 124, a superconducting shielding tube 125, a common connector 126 and a pull rod 127; the quantum voltage module 130 includes a voltage chip 131, a chip cold plate 132 and a short suspension rod 133; the electromagnetic shielding structure 120 is fixedly connected to the cold shield end cover 111 by means of a hoisting block 121, and the outer shielding tube 122, the middle shielding tube 123 and the inner shielding tube 124 are nested layer by layer, and adopt a The module 130 is fastened to the common connector 126 by a threaded connection. The common connector 126 is fixedly connected to the lifting block 121 by threads. The innermost superconducting shielding tube 125 is suspended on the inner shielding tube 124 by a pull rod 127. The quantum voltage module 130 is suspended in the superconducting shielding tube 125 by a short suspension rod 133 with bolts at both ends. The voltage chip 131 is fastened to the chip cold plate 132 by threads. The upper end of the short suspension rod 133 is bolted to the superconducting shielding tube 125, and the chip cold plate 132 is fixed to the lower end bolt. In this embodiment, the electromagnetic shielding structure 120 creates a zero magnetic field space for the quantum voltage module 130 by using a nested shielding tube made of three layers of high magnetic permeability material and one layer of superconducting material. This shielding can shield both the Earth's magnetic field and the strong magnetic field generated by the superconducting coil magnet structure 140. This structure can be replaced with other structures that can achieve magnetic shielding according to actual application requirements.
[0032] like Figure 7-8 As shown, the superconducting coil magnet structure 140 includes a skeleton 141, a superconducting coil 142 and a hanging flange 143; the Hall resistor module 150 includes a sample table 151, a mounting plate 152 and a Hall resistor 153, the Hall resistor 153 is fixedly mounted on the sample table 151, the sample table 151 is fixedly mounted on the mounting plate 152, and the mounting plate 152 is fixedly connected to the skeleton 141 of the superconducting coil magnet structure 140; the superconducting coil magnet structure 140 is connected to the superconducting coil magnet structure 140. The frame 141 is fastened to the hanging flange 143 by bolts and fixedly installed under the cold screen end cover 111. The frame 141 is fastened to the hanging flange by bolts. The superconducting coil 142 is tightly wound on the frame 141. The frame 141 is provided with a magnetic hole. The sample stage 151 of the Hall resistance module 150 can be inserted into the magnetic hole, and the devices on the sample stage 151 are placed in the preset strong magnetic field of the superconducting coil magnet structure 140. The Hall resistance module 150 is fixedly mounted on the frame 141 through the mounting plate.
[0033] like Figure 9As shown, the cold conduction structure 160 includes a refrigerator 161, a cold conduction belt 162 and a cold conduction block 163. The refrigerator 161 includes a mounting flange 1611, a first-level cold head 1612 and a second-level cold head 1613. The refrigerator 161 uses the mounting flange 1611 and the first-level cold head 1612 as fixed mounting points to determine the positioning of the refrigerator 161 in the overall device. Three cold conduction belts 162 are fastened to the second-level cold head 1613 by threads. The other end of each cold conduction belt 162 is welded with a cold conduction block 163. When the device is in working condition, the superconducting shielding tube 125, the quantum voltage module 130, and the superconducting coil are connected to the cooling tube 125. Both the magnet structure 140 and the Hall resistance module 150 need to be in a low-temperature environment. Therefore, the three cooling blocks 163 led out from the secondary cold head 1613 through the cooling belt 162 are respectively connected to the superconducting shielding tube 125, the chip cold plate 132 of the quantum voltage module 130 and the skeleton 141 of the superconducting coil magnet structure 140 by means of threaded fastening. Among them, the Hall resistance module 150 is fastened to the skeleton 141 through the mounting plate 152. Therefore, the superconducting coil magnet structure 140 and the Hall resistance module 150 share a cooling block 163, which can be replaced by other cold conduction cooling structures in actual use.
[0034] During use, the air inside the vacuum insulation structure 100 is first extracted through the first-level external interface 105 to form a vacuum environment inside the device. The refrigerator 161 is started in the vacuum environment, and the first-level cold shield 110 is cooled to 30K through the first-level cold head 1612. The second-level cold head 1613 cools the superconducting shielding tube 125, the quantum voltage module 130, the superconducting coil magnet structure 140 and the Hall resistance module 150 to a low temperature of 4K. In the low-temperature environment, the superconducting coil 142 of the superconducting coil magnet structure 140 is excited to form a target magnetic field, and a driving signal is input to the quantum voltage module 130 and the Hall resistance module 150. The voltage signal output by the quantum voltage module 130 and the Hall resistance module 150 can be used as a signal for storing, reproducing and transmitting the basic unit.
[0035] In summary, the technical effects of the present invention are:
[0036] The electromagnetic shielding structure 120 provides electromagnetic shielding protection for the quantum voltage module 130 in a low-temperature environment, while the superconducting coil magnet structure 140 provides the magnetic field required for the Hall resistance module 150. Furthermore, the vacuum insulation structure 100 and the cold conduction structure 160 provide a vacuum, thermally insulated, and low-temperature environment for both structures. By placing the quantum voltage module and the Hall resistance module together in a vacuum, thermally insulated, and low-temperature environment and implementing targeted shielding measures, the present invention establishes a device that can simultaneously store, reproduce, and transmit quantum voltage and quantum resistance references.
[0037] Since this method cannot enumerate all embodiments, some preferred technical features and preferred technical solutions can be reasonably replaced or combined with each other, and the new technical solutions obtained thereby are also included in this method.
[0038] It should be understood that for those skilled in the art, improvements or changes can be made based on the above description, and all such improvements and changes should fall within the scope of protection of the claims attached to the present invention. The drawings corresponding to the specific implementation plans exist in the form of auxiliary understanding, which can facilitate readers to fully understand the abstract higher-level concepts of the technical concepts involved in this method through immediately concrete and vivid lower-level concepts. When understanding the overall method and comparing it with other technical solutions other than the technical solutions provided by this method, the appearance of the drawings should not be used as the only reference basis. After understanding the concept of this method, a series of deformations, equivalent substitutions, combinations of characteristic elements, deletion and reorganization of non-essential technical characteristic element values, and reasonable addition and reorganization of non-essential technical characteristic elements commonly used in the prior art should be understood as being included in the spirit of this method.
Claims
1. An integrated quantum electrical metrology device, characterized in that: include: Vacuum insulation structure (100); A primary cold shield (110) is disposed inside the vacuum insulation structure (100) and is fixedly connected to the vacuum insulation structure (100); An electromagnetic shielding structure (120) is fixedly disposed in the primary cold shield (110); A quantum voltage module (130), wherein the quantum voltage module (130) is fixed in the electromagnetic shielding structure (120); A superconducting coil magnet structure (140) is fixedly disposed in the first-level cold shield (110); a Hall resistance module (150), the Hall resistance module being disposed in the primary cold shield (110) and fixedly connected to the superconducting coil magnet structure (140); and a cold conduction structure (160), the cold conduction structure (160) being fixedly mounted on the vacuum insulation structure (100) in a penetrating manner, wherein a portion of the cold conduction structure (160) extending into the vacuum insulation structure (100) is fixedly connected to the electromagnetic shielding structure (120), the quantum voltage module (130), and the superconducting coil magnet structure (140); The vacuum insulation structure (100) comprises a sealing cylinder, a long pull rod (104) and an external interface (105), wherein the external interface (105) is welded to the sealing cylinder, and the long pull rod (104) is suspended in the sealing cylinder; The electromagnetic shielding structure (120) is placed in the cold shield tube (112) and is hoisted under the cold shield end cover (111); the superconducting coil magnet structure (140) is placed in the cold shield tube (112) and is hoisted under the cold shield end cover (111); The electromagnetic shielding structure (120) comprises a hanging block (121) and a shielding cylinder group, wherein the shielding cylinder group is fixedly connected to the hanging block (121); The quantum voltage module (130) is suspended in the shielding cylinder group; The sealing cylinder comprises a Dewar sealing cylinder (101), a Dewar sealing cover (102), and a sealing gasket (103); the Dewar sealing cover (102) is fixedly mounted on the Dewar sealing cylinder (101), and the sealing gasket (103) is embedded between the Dewar sealing cover (102) and the Dewar sealing cylinder (101); The shielding tube group comprises an outer shielding tube (122), a middle shielding tube (123), an inner shielding tube (124), a superconducting shielding tube (125), a common connecting piece (126) and a pull rod (127); the outer shielding tube (122), the middle shielding tube (123) and the inner shielding tube (124) are nested layer by layer and fixedly connected to the common connecting piece (126); the common connecting piece (126) is suspended under the hanging block (121); the superconducting shielding tube (125) is fixedly hung in the inner shielding tube (124) through the pull rod (127); The quantum voltage module (130) comprises a voltage chip (131), a chip cold plate (132), and a short suspension rod (133); the voltage chip (131) is fixedly mounted on the chip cold plate (132), and the chip cold plate (132) is fixedly suspended in the superconducting shielding tube (125) via the short suspension rod (133); The Hall resistor module (150) comprises a sample stage (151), a mounting plate (152), and a Hall resistor (153); the Hall resistor (153) is fixedly mounted on the sample stage (151); the sample stage (151) is fixedly mounted on the mounting plate (152); and the mounting plate (152) is fixedly connected to the skeleton (141) of the superconducting coil magnet structure (140).
2. The integrated quantum electrical metrology device according to claim 1, characterized in that: The first-level cold screen (110) includes a cold screen end cover (111) and a cold screen tube (112), wherein the cold screen end cover (111) is fixedly mounted on the cold screen tube (112), and the cold screen end cover (111) of the first-level cold screen (110) is fixedly connected to the long pull rod (104).
3. The integrated quantum electrical metrology device according to claim 2, characterized in that: The superconducting coil magnet structure (140) comprises a skeleton (141), a superconducting coil (142) and a hanging flange (143); the skeleton (141) is fixedly mounted to the cold shield end cover (111) via the hanging flange (143); and the superconducting coil (142) is wound on the skeleton (141).
4. The integrated quantum electrical metrology device according to claim 3, characterized in that: The cold conduction structure (160) includes: a plurality of cold conduction belts (162) and a plurality of cold conduction blocks (163) of a refrigerator (161); the cold conduction belts (162) are fixedly installed with the refrigerator (161); the cold conduction blocks (163) are respectively welded on the plurality of cold conduction belts (162); the superconducting shielding tube (125) of the shielding tube group, the chip cold plate (132) of the quantum voltage module (130), and the skeleton (141) of the superconducting coil magnet structure (140) are respectively fixedly connected to one of the cold conduction blocks (163); and the superconducting shielding tube (125), the chip cold plate (132) and the skeleton (141) are not in contact with each other.
5. The integrated quantum electrical metrology device according to claim 4, characterized in that: The refrigerator (161) comprises a mounting flange (1611), a first-stage cold head (1612) and a second-stage cold head (1613); the mounting flange (1611) is fixedly connected to the Dewar sealing cover (102), the first-stage cold head (1612) is fixedly connected to the cold screen end cover (111), and the second-stage cold head (1613) is fixedly connected to the cooling belt (162).
Citation Information
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