Macro-microstructure integrated design method for skull patch with bionic vibration isolation function

Abstract

The invention provides a skull patch macro-microstructure integrated design method with a bionic vibration isolation function. The skull patch macro-microstructure integrated design method comprises the steps that a skull three-dimensional model is reconstructed based on CT data; designing the geometrical shape of a skull patch according to a defect area in the skull three-dimensional model; establishing a finite element analysis model, and designing the overall structure of the skull patch based on a topological optimization method to obtain overall truss structures of the skull patch and through holes between the truss structures; the through holes between the truss structures are filled with bionic vibration isolation structures; and filling the bionic vibration isolation structure by using a lattice structure to obtain the skull patch macro-micro structure with the bionic vibration isolation function. After the skull patch designed by the invention is implanted into a body, the skull patch has a good vibration isolation function, so that internal tissues of the brain are protected.

Description

Technical Field

[0001] The present invention relates to the technical field of medical devices, and in particular to a method for integrating macro- and micro-structure design of a skull patch with bionic vibration isolation function. Background Art

[0002] The skull is an important bony structure of the human body. When the skull is damaged or missing, the patient may face problems such as exposure of the brain to the external environment, imbalance of intracranial pressure, and aesthetic problems. Therefore, the integrity of the skull is of vital importance. However, the skull may be partially or completely missing after trauma, tumor resection, congenital defects, infection, or decompressive craniectomy. In these cases, doctors usually use cranioplasty to repair the integrity of the skull by implanting a skull patch. The skull patch can not only restore the structure and function of the skull, protect the soft tissue of the brain, avoid the risk of trauma and infection, and improve the metabolism and neurological function of the head; it can also improve the appearance of the patient's head, reduce the psychological burden, and improve their quality of life.

[0003] Skull patch materials usually include autologous bone, allogeneic bone and synthetic materials. Although autologous bone has good biocompatibility, there are many restrictions on the shape and size of the bone, and it may have adverse effects on the bone harvesting site; and the use of allogeneic and heterogeneous bones is gradually decreasing due to the high risk of infection, rejection and absorption reaction. Existing skull patches are mostly made of engineering materials with excellent biocompatibility and mechanical strength, such as the most widely used titanium alloy and polyetheretherketone (PEEK).

[0004] However, titanium alloy and polyetheretherketone still have some disadvantages in practical applications. As a metal material, titanium alloy will produce artifacts during CT and MRI imaging, affecting the clarity and accuracy of postoperative imaging examinations; in addition, titanium alloy has strong thermal conductivity, which can easily cause discomfort to patients when the ambient temperature changes. As a polymer material, PEEK is closer to the elastic modulus of bones, does not produce artifacts during imaging, and makes up for the disadvantages of titanium alloy in thermal conductivity. However, due to the lack of biomechanical analysis of PEEK patches in existing designs, PEEK patches lack the design of lattice structures in macro and micro structures compared to titanium alloy patches, resulting in a larger volume, and poor bone integration ability and soft tissue adhesion ability on the patch, leading to the generation of subcutaneous effusion. At the same time, due to the high crystallinity of PEEK materials, during the fused deposition modeling (FDM) printing process, the newly deposited layer will quickly cool and shrink, resulting in residual stress and warping.

[0005] The existing skull patch design lacks consideration of vibration isolation structure, and one of the main functions of the skull is to protect the brain from external impact or vibration. Therefore, in order to restore the skull's vibration isolation function when filling the skull defect, reduce the impact of external vibration on brain tissue, and enable patients to better face the risk of external physical vibration after surgery, the skull patch should have a certain vibration isolation ability.

[0006] In summary, optimizing the macroscopic structure of the skull patch while maintaining strength and structural integrity, realizing the design of the vibration isolation lattice structure in the microstructure, improving the growth and fusion ability of the skull patch with the skull and soft tissue, and using materials with higher printing controllability to manufacture the skull patch have become issues that need to be urgently addressed. Summary of the invention

[0007] In view of this, the present invention provides a method for integrated macro-microstructure design of a skull patch with bionic vibration isolation function to solve the above problems.

[0008] The present invention provides a method for integrated design of a skull patch macro-micro structure with a bionic vibration isolation function, comprising: reconstructing a three-dimensional skull model based on CT data; designing the geometric shape of the skull patch according to the defect area in the three-dimensional skull model; establishing a finite element analysis model, and designing the overall structure of the skull patch based on a topological optimization method to obtain an overall truss structure of the skull patch and through holes between the truss structures; filling the through holes between the truss structures with a bionic vibration isolation structure; and filling the bionic vibration isolation structure with a lattice structure to obtain a skull patch macro-micro structure with a bionic vibration isolation function.

[0009] Another aspect of the present invention also includes: with the goal of minimizing the strain energy of the skull patch, and with the volume fraction of the optimized skull patch volume relative to the original skull patch volume as a constraint condition, the skull patch is lightweight designed; the overall truss structure formed by the optimized skull patch is distributed along the direction of the load transfer force line of the skull patch, and through holes are formed between the truss structures.

[0010] In another aspect of the present invention, the volume fraction of the optimized skull patch volume relative to the original patch volume is between 50% and 90%.

[0011] In another aspect of the present invention, the minimum width of the overall truss structure is between 10 and 30 mm; and the distance between the through holes between the truss structures and the edge of the skull patch is between 10 and 15 mm.

[0012] In another aspect of the present invention, the bionic vibration isolation structure is a polygonal hole, which includes one or more regular polygons or irregular polygons, with a side length between 5 and 15 mm and a minimum distance between the sides between 2 and 5 mm.

[0013] In another aspect of the present invention, the aperture of the lattice structure is between 600 and 1000 μm; the wire diameter of the lattice structure is adjusted according to the printing capacity and is greater than 0.1 mm.

[0014] Another aspect of the present invention also includes: exporting the macro-microstructure of the skull patch with bionic vibration isolation function in a stereolithography format; according to the file in the stereolithography format, using polyetherketoneketone as the raw material, using fused deposition molding or powder bed-based laser selective sintering process to manufacture, to obtain a skull patch with bionic vibration isolation function.

[0015] Another aspect of the present invention also includes: the skull patch is implanted by an embedded method, and screws or connecting pieces are used to connect the skull patch to the surrounding corresponding bone tissue.

[0016] In the macro-microstructure integrated design method of a skull patch with bionic vibration isolation function of the present invention, the designed skull patch has a bionic vibration isolation structure. By imitating the vein arrangement of the wings of a bionic dragonfly, polygonal holes with vibration isolation effect are designed to effectively reduce the impact of external vibration on intracranial tissues. The skull patch can provide better shock absorption and protection when subjected to external impacts or daily activities, reduce the impact on the brain, help improve postoperative comfort and safety, and reduce the risk of postoperative complications. At the same time, the macro-microstructure integrated design can ensure sufficient mechanical strength in the macrostructure, achieve lightweight design, and protect the internal tissues of the skull. The design of the microstructure promotes the integration of the skull and soft tissue with the skull patch, which helps shorten the patient's recovery time. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the prior art descriptions. By reading the detailed description of the following implementations, the advantages and benefits of the solutions become clear to those skilled in the art. The drawings are only used to illustrate the preferred implementations and are not to be considered as limiting the present invention.

[0018] In the attached picture:

[0019] Figure 1 The present invention is a schematic flow chart of a method for integrated macro- and micro-structure design of a skull patch with bionic vibration isolation function according to an embodiment of the present invention.

[0020] Figure 2 FIG. 1 is a schematic diagram of a skull patch in steps S102 to S104 according to an embodiment of the present invention.

[0021] Figure 3 A schematic diagram of a lattice structure design according to an embodiment of the present invention.

[0022] Figure 4 It is a schematic diagram of an embodiment 1 of the present invention.

[0023] Figure 5 This is a schematic diagram of embodiment 2 of the present invention. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be described clearly and in detail below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in the field based on the embodiments in the embodiments of the present invention should fall within the scope of protection of the embodiments of the present invention.

[0025] Figure 1 A schematic flow chart of a method for integrated macro-microstructure design of a skull patch with bionic vibration isolation function provided by an embodiment of the present invention is shown in FIG. Figure 1 As shown, this embodiment mainly includes the following steps:

[0026] S101. Reconstruct a three-dimensional skull model based on CT data.

[0027] S102. Designing the geometric shape of the skull patch according to the defect area in the three-dimensional skull model.

[0028] For example, Figure 2 As shown, the skull patch has a thickness of 2 to 5 mm, has inner and outer curved surfaces, and the inner and outer curved surfaces have physiological curvatures, the curvature of the curved surface is between 0 and 180 degrees, and the edge of the skull patch fits well with the defect area.

[0029] S103. Establish a finite element analysis model, design the overall structure of the skull patch based on a topological optimization method, and obtain the overall truss structure of the skull patch and the through holes between the truss structures.

[0030] For example, the topology optimization design method comprehensively considers the stress conditions of the skull under various working conditions, such as intracranial pressure, impact loads in different directions, etc.

[0031] S104, using a bionic vibration isolation structure to fill the through holes between the truss structures.

[0032] S105. Fill the bionic vibration isolation structure with the lattice structure to obtain a skull patch macro-micro structure with bionic vibration isolation function.

[0033] Exemplarily, when the polygonal hole is filled with a lattice structure, an interval filling method or a complete filling method may be adopted. The lattice structure completely fills the polygonal hole, that is, it occupies the entire internal space of the polygonal hole.

[0034] In the macro-microstructure integrated design method of a skull patch with bionic vibration isolation function of the present invention, the designed skull patch has a bionic vibration isolation structure. By imitating the vein arrangement of the wings of a bionic dragonfly, polygonal holes with vibration isolation effect are designed to effectively reduce the impact of external vibration on intracranial tissues. The skull patch can provide better shock absorption and protection when subjected to external impacts or daily activities, reduce the impact on the brain, help improve postoperative comfort and safety, and reduce the risk of postoperative complications. At the same time, the macro-microstructure integrated design can ensure sufficient mechanical strength in the macrostructure, achieve lightweight design, and protect the internal tissues of the skull. The design of the microstructure promotes the integration of the skull and soft tissue with the skull patch, which helps shorten the patient's recovery time.

[0035] Another aspect of the present invention also includes: with the goal of minimizing the strain energy of the skull patch, and with the volume fraction of the optimized skull patch volume relative to the original skull patch volume as a constraint condition, the skull patch is lightweight designed; the overall truss structure formed by the optimized skull patch is distributed along the direction of the load transfer force line of the skull patch, and through holes are formed between the truss structures.

[0036] In another aspect of the present invention, the volume fraction of the optimized skull patch volume relative to the original patch volume is between 50% and 90%.

[0037] In another aspect of the present invention, the minimum width of the overall truss structure is between 10 and 30 mm; and the distance between the through holes between the truss structures and the edge of the skull patch is between 10 and 15 mm.

[0038] In another aspect of the present invention, the bionic vibration isolation structure is a polygonal hole, which includes one or more regular polygons or irregular polygons, with a side length between 5 and 15 mm and a minimum distance between the sides between 2 and 5 mm.

[0039] Exemplarily, regular polygons include quadrilaterals, pentagons, hexagons, and the like.

[0040] In another aspect of the present invention, the aperture of the lattice structure is between 600 and 1000 μm; the wire diameter of the lattice structure is adjusted according to the printing capacity and is greater than 0.1 mm.

[0041] Preferably, if Figure 3As shown, the microscopic lattice structure can be defined and changed according to size requirements and strength requirements. The lattice structure includes but is not limited to a three-dimensional periodic minimum surface structure, such as a Gyroid structure, a crystal structure, including a simple cubic structure, a body-centered cubic structure, a face-centered cubic structure, a complex geometric structure, including a diamond structure, a fluorite structure, and a Wilferan structure, a polyhedral structure, including a truncated cube and a truncated octahedron, a honeycomb structure, and a truss structure, including an equiaxed truss structure, an octahedral truss structure, a back-entry structure, and a Voronoi filling structure.

[0042] Among them, the length and width of the three-dimensional periodic minimum surface structure unit are between 600 and 3000 μm, the height is between 2 and 15 mm, and the wire diameter is between 0.4 and 1.4 mm.

[0043] The point spacing of the Voronoi filling structure unit is between 0.6 and 5 mm, and the wire diameter is between 0.3 and 1 mm.

[0044] The length and width of other structural units are between 0.6 and 10 mm, the height is between 1 and 5 mm, and the wire diameter is between 0.5 and 1.5 mm.

[0045] Another aspect of the present invention also includes: exporting the macro-microstructure of the skull patch with bionic vibration isolation function in a stereolithography format; according to the stereolithography format (.STL) file, using polyetherketoneketone as the raw material, using fused deposition molding or powder bed-based laser selective sintering process to manufacture, to obtain a skull patch with bionic vibration isolation function.

[0046] Preferably, polyetherketoneketone (PEKK) and PEEK belong to the same class of polyaryletherketone materials, and have the advantages and characteristics of PEEK materials; however, the crystallinity of PEKK is lower than that of PEEK, and the crystallization speed is slower during the printing process, and the printing is more uniform, thus having better interlayer bonding strength, and there is no obvious anisotropy in the Y and Z directions caused by printing stacking.

[0047] The present invention is made of polyetherketoneketone material, which provides the patch with excellent mechanical properties and biocompatibility; the elastic modulus is similar to that of bone tissue, which can reduce the stress shielding effect and promote the natural growth and healing of bone tissue; it makes up for the disadvantages of titanium alloy material patches with high thermal conductivity and artifacts in medical imaging, and compared with polyetheretherketone of the same family, it has stronger interlayer bonding force during FDM printing and is not prone to warping during the printing process, thereby improving the controllability of the printing process and the quality of the printed parts; it is integrated by 3D printing and directly produces complex geometric shapes without the need for additional processing or assembly, ensuring that the patch fits the patient's skull perfectly and reducing production cycle and cost.

[0048] Another aspect of the present invention also includes: the skull patch is implanted by an embedded method, and screws or connecting pieces are used to connect the skull patch to the surrounding corresponding bone tissue.

[0049] Embodiment 1, as Figure 4 As shown:

[0050] S1. The patient's skull defect is located in the frontal bone. The skull 3D model is reconstructed based on CT data, and the shape of the skull patch is designed at the defect position so that the edge of the skull patch fits well with the defect. The designed patch is 3mm thick and has inner and outer curved surfaces with physiological curvature, and the curvature of the surface is between 0 and 180°.

[0051] S2. Establish a finite element analysis model for the frontal part of the skull and the skull patch to simulate the stress of the skull patch under intracranial pressure or impact load. And with the goal of minimizing the strain energy of the skull patch, the volume of the optimized skull patch is 80% of the volume fraction of the original patch volume, and the macroscopic structure of the skull patch is optimized. The formed truss structure is distributed along the direction of the load transmission force line of the skull patch, and through holes are formed between the truss structures. The minimum width of the truss structure is 15.6mm, and the through hole is 10.6mm away from the edge of the skull patch.

[0052] S3. The through holes between the truss structures are filled with pentagonal holes, so that the skull patch has a bionic vibration isolation function. The side length of the pentagon is 5.8 mm, and the minimum spacing between the pentagons is 2 mm.

[0053] S4. The above-mentioned through-hole area is filled with a face-centered cubic lattice structure; the length, width and height of the structural unit are 3 mm respectively, and the wire diameter is 0.5 mm, so that the skull patch can be better integrated with the surrounding bones and soft tissues after implantation.

[0054] The macro-microstructure integrated design of the skull patch with bionic vibration isolation function was completed, the design file was exported in .STL format, polyetherketoneketone was used as the raw material, and the skull patch was manufactured using the fused deposition modeling 3D printing process. The skull patch was implanted into the corresponding position using an embedded method, and connected to the surrounding bone tissue using a connecting piece.

[0055] Embodiment 2, as Figure 5 As shown:

[0056] S1. The patient's skull defect is located in the upper parietal bone. The skull 3D model is reconstructed based on CT data, and the shape of the skull patch is designed at the defect position so that the edge of the skull patch fits well with the defect. The designed patch is 3mm thick and has inner and outer curved surfaces with physiological curvature, and the curvature of the surface is between 0 and 180°.

[0057] S2. A finite element analysis model was established for the parietal bone above the skull and the skull patch to simulate the stress of the skull patch under intracranial pressure or impact load. The macroscopic structure of the skull patch was optimized with the goal of minimizing the strain energy of the skull patch, making the volume of the optimized skull patch 70% of the volume fraction of the original patch volume. The truss structure formed was distributed along the direction of the load transmission force line of the skull patch, and through holes were formed between the truss structures. The minimum width of the truss structure was 10.8 mm, and the through hole was 10 mm away from the edge of the skull patch.

[0058] S3. Hexagonal holes are used to fill the through holes between the truss structures, so that the skull patch has a bionic vibration isolation function. The side length of the hexagon is 5 mm, and the minimum spacing between the hexagons is 2 mm.

[0059] S4. The above-mentioned through-hole area is filled with intervals using a Voronoi lattice structure; the point spacing of the structural unit is 1.5 mm, and the wire diameter is 0.5 mm, so that the skull patch can be better integrated with the surrounding bones and soft tissues after implantation.

[0060] The macro-microstructure integrated design of the skull patch with bionic vibration isolation function was completed, the design file was exported in .STL format, polyetherketoneketone was used as the raw material, and the skull patch was manufactured using a powder bed-based laser selective sintering process. The skull patch was implanted in the corresponding position using an embedded method and connected to the surrounding bone tissue using screws.

[0061] The skull patch designed by the present invention has the characteristics of personalization, integration and lightweight under the premise of ensuring mechanical properties; after being implanted in the body, the designed skull patch has good vibration isolation function, thereby protecting the internal tissues of the brain; it can be better integrated with autologous bones and soft tissues, thereby achieving the effect of reducing the occurrence of subcutaneous effusion; the manufacturing process is simpler, and the PEKK material makes the 3D printed patch shape more precise and controllable, and the patch has better interlayer bonding force.

[0062] In another aspect of the present invention, an electronic device includes: a processor, a memory, a communication bus, and a communication interface.

[0063] in:

[0064] The processor, memory and communication interface communicate with each other through a communication bus.

[0065] Communication interface, used to communicate with other electronic devices or servers.

[0066] The processor is used to execute the program, and specifically can execute the steps of any one of the above-mentioned embodiments of the method for integrated design of macro-microstructure of skull patch with bionic vibration isolation function.

[0067] Specifically, the program may include program codes including computer operation instructions.

[0068] The processor may be a central processing unit (CPU), or an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present application. The one or more processors included in the smart device may be processors of the same type, such as one or more CPUs; or processors of different types, such as one or more CPUs and one or more ASICs.

[0069] The memory is used to store programs. The memory may include a high-speed RAM memory, and may also include a non-volatile memory, such as at least one disk memory.

[0070] The program can be specifically used to enable the processor to execute the steps of any one of the methods for integrated design of macro-microstructures of skull patches with bionic vibration isolation functions described in the embodiments. The specific implementation of each step in the program can refer to the corresponding descriptions in the steps and units executed by any one of the methods for integrated design of macro-microstructures of skull patches with bionic vibration isolation functions in the above steps, which will not be repeated here. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the above-described equipment and modules can refer to the corresponding process description in the aforementioned method embodiment.

[0071] The exemplary embodiments of the present application also provide a non-transitory computer-readable storage medium storing computer instructions, wherein the computer instructions are used to enable a computer to execute the methods of the various embodiments of the present application.

[0072] The above-described method according to an embodiment of the present invention may be implemented in hardware, firmware, or as software or computer code that may be stored in a recording medium (such as a CD ROM, RAM, floppy disk, hard disk, or magneto-optical disk), or as computer code that is originally stored in a remote recording medium or a non-temporary machine-readable medium downloaded over a network and will be stored in a local recording medium, so that the method described herein may be stored in such software processing on a recording medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware (such as an ASIC or FPGA). It is understood that a computer, processor, microprocessor controller, or programmable hardware includes a storage component (e.g., RAM, ROM, flash memory, etc.) that can store or receive software or computer code, and when the software or computer code is accessed and executed by a computer, processor, or hardware, the method described herein is implemented. In addition, when a general-purpose computer accesses the code for implementing the method shown herein, the execution of the code converts the general-purpose computer into a dedicated computer for executing the method shown herein.

[0073] Thus far, specific embodiments of the present invention have been described. Other embodiments are within the scope of the appended claims. In some cases, the actions recited in the claims may be performed in a different order and still achieve the desired results. Additionally, the processes depicted in the accompanying drawings do not necessarily require the specific order or sequential order shown to achieve the desired results. In some embodiments, multitasking and parallel processing may be advantageous.

[0074] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0075] In the description of the present invention, the terms "first" and "second" are only used to facilitate the description of different components or names, and cannot be understood as indicating or implying a sequential relationship, relative importance, or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features.

[0076] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0077] It should be noted that although the specific embodiments of the present invention are described in detail in conjunction with the accompanying drawings, it should not be understood as limiting the scope of protection of the present invention. Within the scope described in the claims, various modifications and variations that can be made by those skilled in the art without creative work still belong to the scope of protection of the present invention.

[0078] The examples of the embodiments of the present invention are intended to concisely illustrate the technical features of the embodiments of the present invention so that those skilled in the art can intuitively understand the technical features of the embodiments of the present invention, and are not intended to be improper limitations of the embodiments of the present invention.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for integrated macro-microstructure design of a skull patch with bionic vibration isolation function, characterized in that: include: Reconstruct a three-dimensional skull model based on CT data; Designing the geometric shape of the skull patch according to the defect area in the three-dimensional skull model; Establishing a finite element analysis model, designing the overall structure of the skull patch based on a topology optimization method, and obtaining an overall truss structure of the skull patch and through holes between the truss structures; Filling the through holes between the truss structures with a bionic vibration isolation structure; The bionic vibration isolation structure is filled with a lattice structure to obtain a skull patch macro-microstructure with bionic vibration isolation function.

2. The method according to claim 1, characterized in that Also includes: With the goal of minimizing the strain energy of the skull patch and with the volume fraction of the optimized skull patch volume relative to the original skull patch volume as a constraint, the skull patch is lightweight designed; The overall truss structure formed by the optimized skull patch is distributed along the direction of the load transmission force line on the skull patch, and through holes are formed between the truss structures.

3. The method according to claim 2, characterized in that The volume fraction of the optimized skull patch volume relative to the original patch volume is between 50% and 90%.

4. The method according to claim 2, characterized in that: The minimum width of the overall truss structure is between 10 and 30 mm; The through holes between the truss structures are located 10 to 15 mm away from the edge of the skull patch.

5. The method according to claim 1, characterized in that The bionic vibration isolation structure is a polygonal hole, which includes one or more regular polygons or irregular polygons, with a side length between 5 and 15 mm and a minimum distance between the sides between 2 and 5 mm.

6. The method according to claim 1, characterized in that The pore size of the lattice structure is between 600 and 1000 μm; The wire diameter of the lattice structure is adjusted according to the printing capacity and is greater than 0.1 mm.

7. The method according to claim 1, characterized in that Also includes: Exporting the macro-microstructure of the skull patch with bionic vibration isolation function in a stereolithography format; According to the stereolithography format file, polyetherketoneketone is used as the raw material and manufactured using fused deposition molding or powder bed-based laser selective sintering process to obtain a skull patch with bionic vibration isolation function.

8. The method according to claim 7, characterized in that Also includes: The skull patch is implanted by an embedded method, and screws or connecting pieces are used to connect the skull patch to the surrounding corresponding bone tissue.

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