Manufacturing method of large-size flexible circuit board capable of replacing wire harness

By using the combination technology of panel structure and punching mold in the production process of flexible circuit boards, the problems in the adhesion and molding of the cover film are solved, and high-precision circuit board processing is achieved.

CN119855054AActive Publication Date: 2025-04-18深せん市実锐泰科技有限公司
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Patent Information

Application Number
CN202510340750.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-21
Publication Date
2025-04-18
Estimated Expiration
2045-03-21

AI Technical Summary

Technical Problem

When making large-size flexible circuit boards of alternative harnesses, there are problems such as difficulty in attaching a covering film and milling and molding, which are prone to burrs and wire drawing.

Method used

The plate structure is used for processing, and the covering film core plate is punched and cut by a punching mold to form a groove body and a flexible plate connection bridge. The misalignment distribution of the reinforcement plate connection bridge and a flexible plate connection bridge is designed, combining the molding processing of milling and laser cutting.

Benefits of technology

It solves the problem of scattering and difficult to attach to the film forming, improves the alignment accuracy of reinforced attachment, avoids the problems of material in molding and milling and cutting burrs, and realizes high-precision processing of the circuit board.

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Abstract

The invention discloses a manufacturing method of a large-size flexible circuit board capable of replacing a wire harness. The manufacturing method comprises the following steps: manufacturing a covering film core board through previous procedures; manufacturing a punching die, performing alignment punching on the covering film core plate to form a groove body, forming a flexible plate connecting bridge in the groove body, forming a punching plate on the whole plate, windowing a reinforcing sheet corresponding to the groove body to form a reinforcing groove body, arranging a plurality of reinforcing connecting bridges on the reinforcing groove body, and forming a reinforcing plate on the whole plate; the reinforcing connecting bridges and the flexible plate connecting bridges are distributed in a staggered manner; attaching a reinforcing plate to the punching plate, and forming the circuit board; the cover film is attached in a jointed board structure mode, and a punching grinding tool is matched for punching, so that the problems that cover films attached in batches are easy to scatter and difficult to attach are solved; through the staggered design of the flexible plate connecting bridge and the reinforcing plate connecting bridge, selective machining can be carried out during final forming, and the problems that materials are prone to being rolled in during milling, chips are difficult to discharge smoothly, milling burrs and wiredrawing are generated and the like are solved; effective cooperation is formed before and after the whole processing flow.
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