Manufacturing method of high-speed data transmission control circuit board

Abstract

The invention discloses a manufacturing method of a high-speed data transmission control circuit board, which comprises the following steps of: forming a to-be-drilled plate through processing in a previous process, and manufacturing a blind hole and a through hole in the to-be-drilled plate to form a to-be-plated plate; and electroplating the to-be-plated board, and performing post-process processing to form the circuit board. The to-be-plated plate swings in parallel relative to the left and right side walls of the electroplating cylinder and vertically swings relative to the front and rear side walls to form a swinging path; a swing path is designed for a to-be-plated plate, the diffusion speed of electroplating liquid is increased, the exchange rate and sufficiency of the electroplating liquid are guaranteed, the quality problem of an electroplated layer caused by bubbles or other defects is reduced, the effect of electroplating through holes and blind holes at the same time is achieved, and the phenomenon that a plate body expands or contracts due to secondary electroplating is effectively avoided; and the subsequent drilling and pattern processing precision is influenced. And the swing path design and the application of the fixed pulse current and the strong and weak alternating pulse current ensure that the coating is more uniform, and effective relevance is formed before and after the whole processing flow.

Description

Technical Field

[0001] The invention relates to the field of printed circuit board manufacturing, and in particular to a method for manufacturing a high-speed data transmission control circuit board. Background Art

[0002] With the rapid growth in demand for ultra-high data transmission rate equipment in the communications field and tertiary power system equipment in the field of intelligent connected vehicles, in order to meet the high standards of these fields, the design trend of related circuit boards is gradually developing towards high speed and high density, which poses new challenges to the design, development and manufacturing of circuit boards.

[0003] In order to meet the needs of high speed, high density and enhanced carrying capacity, modern circuit boards are usually designed to have thicker boards (thickness of more than 3mm) and fine through holes (minimum diameter of 0.2mm), that is, the aspect ratio (the ratio of board thickness to through hole diameter) is large, even reaching 10:1 to 20:1 or more. At the same time, this type of circuit board also adopts a high-density interconnected blind hole design. Therefore, during the electroplating process, not only the through holes need to be plated to form conductive holes, but also the blind holes need to be filled and plated, so as to smoothly realize the electroplating processing of the circuit board.

[0004] For this type of circuit board, the secondary electroplating method is usually adopted: first, the multilayer board is pressed together, then the blind holes are filled and plated, and then through holes are drilled, and then the whole board is plated (including through-hole plating).

[0005] However, the above-mentioned preparation method has the following defects: (1) After the blind hole filling and electroplating is completed, the board surface needs to be polished and then the whole board is electroplated for the second time. This process may cause the board to expand or shrink, affecting the accuracy of subsequent drilling and graphic processing; (2) The process is relatively complex and involves multiple steps, which increases material consumption and production costs, generates a large amount of pollutants, and increases pressure on environmental protection.

[0006] Therefore, in order to solve the above-mentioned problems, it is necessary to provide a method for manufacturing a high-speed data transmission control circuit board. Summary of the invention

[0007] The present invention aims to solve the problems of low processing precision and complex processing in the prior art of manufacturing a circuit board with a large aspect ratio and having both blind holes and through holes. A method for manufacturing a high-speed data transmission control circuit board is proposed. The electroplating processing device of the circuit board is an electroplating cylinder, and the electroplating cylinder includes an anode and a spray pipe group. The anode is arranged on the opposite left and right side walls of the electroplating cylinder, and the other two side walls are front and rear side walls. The manufacturing method includes the following steps: S10: forming a plate to be drilled after the previous process, making blind holes and through holes in the plate to be drilled, and forming a plate to be plated; S20: electroplating the plate to be plated, and then processing it through a post-process to form the circuit board; the plate to be plated swings parallel to the left and right side walls of the electroplating tank, and swings vertically relative to the front and rear side walls to form a swinging path.

[0008] Furthermore, the spray pipe group swings parallel to the left and right side walls of the electroplating cylinder, and is parallel to the plate to be plated and maintains a fixed distance.

[0009] Furthermore, the swing path is a straight path, and the plate to be plated moves back and forth along the straight path.

[0010] Furthermore, the swinging path is an arc path, the plate to be plated moves forward along the arc path, and then moves reversely along the arc path, and several times of the forward movement and several times of the reverse movement are repeatedly alternated.

[0011] Furthermore, the anode is an insoluble anode, and the insoluble anode is wrapped with a selective permeable membrane.

[0012] Furthermore, the insoluble anode is composed of a plurality of unit insoluble anodes arranged side by side and parallel to the plate to be plated; the unit insoluble anodes are each individually wrapped with the selective permeable membrane.

[0013] Furthermore, mesh plastic films are provided on both sides of the selective permeable membrane.

[0014] Furthermore, the number of blind holes on the first side of the plate to be plated is greater than that on the second side, and the electroplating is pulse plating.

[0015] Furthermore, the current corresponding to the pulse plating of the first surface is a fixed pulse current; the current corresponding to the pulse plating of the second surface is composed of several strong pulse currents and several weak pulse currents continuously alternating, and the strong pulse circuit value is equal to the fixed pulse current.

[0016] Furthermore, the frequency of continuous alternation of several strong pulse currents and one weak pulse current is ≥10:1.

[0017] The technical solution of the present invention accelerates the diffusion rate of the electroplating solution by designing a swing path for the plate to be plated during the electroplating process, ensures the exchange rate and sufficiency of the electroplating solution in the through holes and blind holes, reduces the quality problems of the electroplating layer caused by bubbles or other defects, and forms the effect of electroplating the through holes and blind holes at the same time, effectively avoiding the problems of the prior art of separately electroplating the through holes and blind holes, and the secondary electroplating causing the plate body to expand or shrink, affecting the accuracy of subsequent drilling and graphic processing; further, the spray pipe group is set to swing parallel to the left and right side walls of the electroplating cylinder, and is parallel to the plate to be plated and maintains a fixed distance, that is, the spray pipe group and the plate to be plated swing synchronously during the swinging process, which helps to break the liquid boundary layer and ensure the fluidity of the electroplating solution. and sufficient exchange process, further promoting the uniformity and consistency of the electroplating layer; by wrapping the anode with a selective permeable membrane, the light agent in the plating solution is prevented from contacting the anode and being decomposed, the stability of the plating solution components is improved, while reducing the influence of impurities such as anode mud on the electroplating effect, thereby improving the quality of the coating and surface smoothness; simultaneous electroplating of blind holes and through holes is achieved, thereby simplifying the processing flow, and the swing path design in the electroplating process is coordinated with the formation of fixed pulse current and strong and weak alternating pulse current to ensure a more uniform coating, which solves the problems of complex electroplating process, high material consumption, high production cost, and generation of a large amount of pollutants, increasing environmental protection pressure, etc. in the prior art; effective synergy and correlation are formed before and after the entire processing flow. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0019] Figure 1 Schematic diagram of the process flow of an embodiment of the present invention; Figure 2 is a top cross-sectional schematic diagram of an electroplating process according to an embodiment of the present invention; Figure 3 A schematic top view of a swing path according to an embodiment of the present invention; Figure 4 A schematic front cross-sectional view of an embodiment of the present invention using insoluble anode electroplating; Figure 5 is a schematic cross-sectional view of an insoluble anode according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the cross-sectional structure of a plate to be plated according to an embodiment of the present invention; Figure 7 The pulse plating waveform diagram of the embodiment of the present invention; Figure 8 This is a physical picture of a micro-slice of a circuit board made according to an embodiment of the present invention.

[0020] Explanation of the accompanying drawings: 100, electroplating cylinder; 200a, first anode; 200b, second anode; 2010, selective permeable membrane; 2020, mesh plastic film; 2020a, outer mesh plastic film; 2020b, inner mesh plastic film; 300a, first spray pipe group; 300b, second spray pipe group; 10, board to be plated; 1010, blind hole; 1020, through hole; 1030, swing path; 400, pulse plating waveform; DY, first side current waveform; DR, second side current waveform.

[0021] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, inside, outside...) are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0024] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0025] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0026] See also Figure 1 , Figure 1 Schematic diagram of the process flow of an embodiment of the present invention.

[0027] The manufacturing process of the embodiment of the present invention includes using Figure 1 The following will implement the various steps in the process Figure 1 Each step in the process is further explained step by step.

[0028] The electroplating processing device for manufacturing a circuit board in this embodiment is an electroplating cylinder 100, which includes an anode and a spray pipe group. The anode is arranged on the left and right side walls opposite to each other of the electroplating cylinder 100, and the other two side walls are the front and rear side walls. The manufacturing method includes the following steps: Step S10: After the previous process, a plate to be drilled is formed, blind holes 1010 and through holes 1020 are made on the plate to be drilled, and a plate to be plated 10 is formed, providing a plate material basis for the subsequent process.

[0029] Please refer to Figure 2 and Figure 3 , Figure 2 is a top cross-sectional schematic diagram of an electroplating process according to an embodiment of the present invention; Figure 3 It is a schematic top view of the swing path of an embodiment of the present invention.

[0030] Step S20: electroplating the plate 10 to be plated, and then processing it through a post-process to form a circuit board; the plate 10 to be plated swings parallel to the left and right side walls of the electroplating tank 100, and swings vertically relative to the front and rear side walls to form a swing path 1030.

[0031] The plate 10 to be plated is immersed in the electroplating tank 100, and is swung along the swinging path 1030 during electroplating. The mechanical shaking generated by the swinging accelerates the diffusion rate of the plating solution, so that the plating solution can reach various parts of the plate 10 to be plated more quickly, thereby improving the exchange rate and sufficiency of the plating solution, and the old plating solution is discharged in time and the new plating solution is quickly replenished, thereby ensuring the continuity and efficiency of the electroplating process. In addition, for the plate 10 to be plated with a large aspect ratio and a blind hole 1010 on the surface, the swinging can also enable the plating solution to flow better to smaller and deeper through holes 1020 and blind holes 1010, thereby ensuring the uniformity and consistency of the electroplated copper layer.

[0032] Furthermore, continuous shaking can effectively expel bubbles hidden inside the through hole 1020, eliminate the quality problems of the electroplating layer caused by bubbles or other defects, and improve the processing quality of the circuit board.

[0033] As an optional embodiment, the swing frequency can be 10s / time to 20s / time (relatively fast) for 2min to 6min from the first anode 200a wall to the second anode 200b, and then switch to 15s / time to 30s / time (relatively slow) for 2min to 6min.

[0034] First, swing quickly and then switch to slow swing. Use a faster swing frequency with a shorter period to promote rapid solution exchange in the initial stage of the electroplating process to ensure that the plating solution can quickly fill all areas of the board 10 to be plated, especially the through holes 1020 and the blind holes 1010. Then switch to a slower swing frequency with a longer period to help the plating solution have enough time to fully react with the surface of the board 10 to be plated, thereby forming a more uniform and dense electroplating layer.

[0035] It is worth noting that in order to avoid problems such as poor electroplating effect of through hole 1020 due to mismatch of electroplating parameters, it is necessary to reasonably control the difference between the two swinging frequencies, that is, the transition from fast swinging to slow swinging is smooth and gradual, which is conducive to maintaining the stability of the entire electroplating process and avoiding problems such as uneven electroplating due to sudden changes in rate.

[0036] Furthermore, in order to ensure that the plating liquid can fully cover all parts of the plate 10 to be plated, especially the through hole 1020 and the blind hole 1010, the total path range and length of the swing of the plate 10 to be plated in the plating cylinder 100 should not be too small, otherwise it will be difficult to form the promoting effect of the swing on the electroplating process.

[0037] In this embodiment, the spray pipe group (including the first spray pipe group 300a and the second spray pipe group 300b) swings parallel to the left and right side walls of the electroplating tank 100, and is parallel to the plated plate 10 and maintains a fixed distance.

[0038] Since the blind hole 1010 does not have a liquid medicine circulation channel like the through hole 1020, the spray pressure of the spray pipe group needs to be used during the electroplating process to "shoot" the liquid medicine to the bottom of the blind hole 1010 to achieve sufficient contact and exchange of the liquid medicine. Therefore, if the plate 10 to be plated in the prior art is swung and the spray pipe group does not sway, when the blind hole 1010 is close to the spray pipe group, the liquid medicine pressure at the bottom of the blind hole 1010 is relatively large and the exchange is sufficient, while when it is far away from the spray pipe group, the pressure is relatively small and the exchange is insufficient, resulting in the problem of fluctuating electroplating of the blind hole 1010, which is not conducive to the uniform growth of copper plating inside the blind hole 1010 and may seriously cause problems such as electroplating voids in the blind hole 1010. Therefore, according to the Bernoulli equation, the spray pipe group is set to maintain a fixed distance from the plate 10 to be plated, that is, the spray pipe group and the plate 10 to be plated sway synchronously during the swinging process, which can effectively ensure the stability of the spray pressure at the bottom of the blind hole 1010 and improve the effect of sufficient exchange of the liquid medicine.

[0039] In this embodiment, the swing path 1030 is an arc path, and the plate 10 to be plated moves forward along the arc path, and then moves reversely along the arc path, and several forward movements and several reverse movements are repeatedly alternated.

[0040] Under the dual swinging action of left and right swinging and front and back swinging, the swinging path 1030 of the plate 10 to be plated forms an (approximately) elliptical path. Considering that the thickness-diameter ratio of the plate 10 to be plated is relatively large, if the plate 10 to be plated always maintains an elliptical path for swinging, it will be easy to hide air in the holes, and "dead corners" for the exchange of chemicals will appear in the swinging electroplating process, causing these holes to be unable to fully exchange the chemicals smoothly, resulting in problems such as no copper in the holes, thin copper in the holes, and uneven copper thickness in the holes after electroplating.

[0041] Therefore, in order to optimize the flow pattern of the solution, an arc path is designed to increase the flow changes of the solution on the board surface and in the holes, further promote the full exchange effect of the solution in the "dead corner" area, reduce the problems of no copper in the hole, thin copper in the hole, and improve the consistency and uniformity of the electroplating layer.

[0042] Furthermore, the frequency of repeated alternation of several forward movements and several reverse movements is ≥5:1. By adjusting the forward and reverse path ratio, the deposition rate of the electroplating layer in different areas can be controlled to improve the overall electroplating uniformity.

[0043] Optionally, the swing path 1030 is a straight path, and the plate 10 to be plated moves back and forth along the straight path.

[0044] Optionally, the several forward movements and the several reverse movements are repeated and alternated for a time period of 1 min to 10 min.

[0045] Optionally, according to the types of the plate 10 to be plated, the adaptability of the electroplating line by the electroplating equipment manufacturer, and the research and development test results of the specific electroplating effect, the swinging process can be set to be adjustable, or to a fixed straight line reciprocating, square reciprocating, circular reciprocating, or other types of paths.

[0046] See also Figure 4 and Figure 5 , Figure 4 A schematic front cross-sectional view of an embodiment of the present invention using insoluble anode electroplating; Figure 5 Schematic cross-sectional view of an insoluble anode according to an embodiment of the present invention.

[0047] In this embodiment, the anode is an insoluble anode, and the insoluble anode is wrapped with a selective permeable membrane 2010. Since the electroplating solution contains brighteners to improve the smoothness of the coating surface, but the brighteners are generally organic compounds, when the brighteners are close to the anodes, they are easily decomposed by the current generated by the anodes, which leads to the brighteners in the electroplating solution in the cylinder being consumed too quickly or unstable, which in turn affects the copper electroplating process, resulting in problems such as uneven copper electroplating or copper nodules.

[0048] Therefore, by wrapping the selective permeable membrane 2010, the anode and the brightener can be effectively isolated, thereby preventing the brightener from being decomposed by the anode, significantly reducing the consumption rate of the brightener, maintaining the stability of the plating solution composition, and also improving the smoothness and brightness of the coating.

[0049] Optionally, the insoluble anode is composed of a plurality of unit insoluble anodes arranged side by side and parallel to the plate 10 to be plated; each unit insoluble anode is individually wrapped with a selective permeable membrane 2010 .

[0050] Generally, the insoluble anode is a plurality of unit insoluble anodes arranged in a row and parallel to the plate 10 to be plated. During the processing, the brightener and the anode are effectively isolated by wrapping each unit insoluble anode with a selective permeable membrane 2010, which can effectively improve the processing quality and efficiency.

[0051] Optionally, the selective permeable membrane 2010 is a cation exchange membrane, and further optionally, a perfluorosulfonic acid cation exchange membrane or a sulfonated polyetheretherketone cation exchange membrane, which can provide higher selectivity and only allow specific types of cations to pass through, thereby greatly improving the stability of the plating solution components, while reducing the impact of impurity ions on the electroplating effect, and improving the quality and surface smoothness of the coating.

[0052] Optionally, the upper opening of the selective permeable membrane 2010 is fixed to the anode by means of binding with a band, sewing or clamping with a clamp.

[0053] In this embodiment, mesh plastic films 2020 are disposed on both sides of the selective permeable membrane 2010 .

[0054] Since the selective permeable membrane 2010 is generally thin and relatively fragile, a mesh plastic film 2020 is wrapped around both sides of the selective permeable membrane 2010 to form a three-layer structure of an inner mesh plastic film 2020b, a middle layer selective permeable membrane 2010, and an outer mesh plastic film 2020a. This provides good protection for the selective permeable membrane 2010 while still being able to efficiently perform its ion screening task and ensure the consistency of the electroplating layer.

[0055] Optionally, the mesh plastic film 2020 is made of PP, PET, PTFE, PVC or PI.

[0056] Optionally, the mesh size of the mesh plastic film 2020 is 20 to 200 meshes, preferably 60 meshes, 100 meshes, or 120 meshes.

[0057] See also Figure 6 and Figure 7 , Figure 6 This is a schematic diagram of the cross-sectional structure of a plate to be plated according to an embodiment of the present invention; Figure 7 This is a pulse plating waveform diagram of an embodiment of the present invention.

[0058] In this embodiment, the number of blind holes 1010 on the first side of the plated board 10 is greater than that on the second side, and the electroplating is pulse plating; optionally, no blind holes 1010 are distributed on the second side.

[0059] Since the first side (high-density blind hole side) of the plated board 10 has a larger total area to be plated, the demand for copper ions is relatively high. If the same current parameters are always used for the anodes on both sides, it is actually equivalent to lowering the current parameters of the first side, causing the electroplating process on the first side to be slower, which may cause the problem of insufficient electroplating.

[0060] Specifically, in the pulse plating waveform diagram 400, the first surface of the board 10 to be plated corresponds to the first surface current waveform diagram DY, and the second surface corresponds to the second surface current waveform diagram DR; the current corresponding to the pulse plating of the first surface is a fixed pulse current; the current corresponding to the pulse plating of the second surface is composed of several strong pulse currents and several weak pulse currents continuously alternating, and the strong pulse circuit value is equal to the fixed pulse current.

[0061] The above method allows the first side (high-density blind hole side) to always maintain a higher current density plating effect, making the deposition and adhesion of copper ions stronger, and can effectively achieve electroplating of a larger area. The second side (low-density blind hole side) alternates between strong and weak currents, and uses lower-intensity currents to optimize details, helping to obtain a more uniform copper thickness inside the through hole 1020, and can balance the actual plating effects on both sides, avoiding the local over-thickness or under-thickness that may occur in traditional methods. In addition, blind holes 1010 of different densities have different requirements for electroplating, and the method of alternating strong and weak pulses can flexibly cope with these differences.

[0062] Furthermore, the frequency of continuous alternation of several strong pulse currents and one weak pulse current is ≥10:1, and the frequency of alternation of strong and weak pulses should not be too frequent, otherwise the overall difference in current intensity on the two sides will be too large, resulting in the problem that the thickness of the electroplated copper on one side is much greater than that on the other side; a higher frequency of strong pulses can complete the electroplating process of a large area more quickly, thereby improving production efficiency. At the same time, an appropriate increase in point-like weak pulses can ensure the quality of the details and avoid problems such as edge effects or uneven deposition due to excessive electroplating.

[0063] In actual production applications, the anodes on the left and right side walls of the electroplating cylinder 100 can be controlled separately using power supplies or rectifiers, and the current density and switching mode on each side can be accurately adjusted as needed. This can not only improve the flexibility of the process, but also optimize the electroplating effect according to different design requirements and improve the consistency of the electroplating layer thickness in different areas.

[0064] See also Figure 8 , Figure 8This is a physical picture of a micro-slice of a circuit board made according to an embodiment of the present invention.

[0065] As shown in the figure, the circuit board manufactured by the present embodiment has good electroplating effects on the through hole 1020 and the blind hole 1010. The through hole 1020 has no problems such as no copper in the hole, copper nodules, uneven copper in the hole, and the blind hole 1010 has no problems such as voids, cracks, and incomplete filling.

[0066] In summary, the technical solution of the present invention designs a swing path 1030 for the plate 10 to be plated during the electroplating process to form mechanical shaking, accelerate the diffusion rate of the electroplating solution, ensure the exchange rate and sufficiency of the electroplating solution in the through hole 1020 and the blind hole 1010, reduce the quality problems of the electroplating layer caused by bubbles or other defects, and form the effect of simultaneous electroplating of the through hole 1020 and the blind hole 1010, effectively avoiding the problems of the secondary electroplating in the prior art that may cause the plate body to expand or shrink, affecting the accuracy of subsequent drilling and graphic processing; further, the spray pipe group is set to swing parallel to the left and right side walls of the electroplating cylinder 100, and is parallel to the plate 10 to be plated and maintains a fixed distance, which helps to break the liquid boundary layer and ensure the freshness and fluidity of the electroplating solution. Further promote the uniformity and consistency of the electroplating layer; by wrapping the selective permeable membrane 2010 on the anode, the stability of the electroplating solution components is improved, while reducing the influence of impurity ions on the electroplating effect, thereby improving the quality and surface smoothness of the coating; by realizing the simultaneous electroplating of the blind hole 1010 and the through hole 1020, the processing flow is simplified, and the swing path 1030 design during the electroplating process is coordinated with the fixed pulse current and the strong and weak alternating pulse current to ensure that the coating is more uniform, and solve the problems of the existing technology of complex electroplating process, large material consumption, high production cost, and the generation of a large amount of pollutants, increasing environmental protection pressure, etc.; the entire processing flow forms effective synergy and correlation before and after, optimizes the electroplating process, and manufactures the required high-speed data transmission control circuit board.

[0067] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a high-speed data transmission control circuit board, wherein the electroplating processing device of the circuit board is an electroplating cylinder, the electroplating cylinder includes an anode and a spray pipe group, the anode is arranged on the opposite left and right side walls of the electroplating cylinder, and the other two side walls are front and rear side walls, characterized in that: The production method comprises the following steps: S10: forming a plate to be drilled after the previous process, making blind holes and through holes in the plate to be drilled, and forming a plate to be plated; S20: electroplating the plate to be plated, and then performing post-processing to form the circuit board; The plate to be plated swings parallel to the left and right side walls of the electroplating tank, and swings vertically relative to the front and rear side walls to form a swinging path.

2. The method for manufacturing a high-speed data transmission control circuit board according to claim 1, characterized in that: The spray pipe group swings parallel to the left and right side walls of the electroplating cylinder, and is parallel to the plate to be plated and maintains a fixed distance.

3. The method for manufacturing a high-speed data transmission control circuit board according to claim 1, characterized in that: The swing path is a straight path, and the plate to be plated moves back and forth along the straight path.

4. The method for manufacturing a high-speed data transmission control circuit board according to claim 1, characterized in that: The swinging path is an arc path, the plate to be plated moves forward along the arc path, and then moves reversely along the arc path, and several times of the forward movement and several times of the reverse movement are repeatedly alternated.

5. The method for manufacturing a high-speed data transmission control circuit board according to claim 1, characterized in that: The anode is an insoluble anode, and the insoluble anode is wrapped with a selective permeable membrane.

6. The method for manufacturing a high-speed data transmission control circuit board according to claim 5, characterized in that: The insoluble anode is composed of a plurality of unit insoluble anodes arranged side by side and parallel to the plate to be plated; The unit insoluble anodes each individually wrap the selective permeable membrane.

7. A method for manufacturing a high-speed data transmission control circuit board as claimed in claim 5 or 6, characterized in that: Both sides of the selective permeable membrane are provided with mesh plastic films.

8. The method for manufacturing a high-speed data transmission control circuit board according to claim 1, characterized in that: The number of blind holes on the first side of the plate to be plated is greater than that on the second side, and the electroplating is pulse plating.

9. The method for manufacturing a high-speed data transmission control circuit board according to claim 8, characterized in that: The current of the pulse electroplating corresponding to the first surface is a fixed pulse current; The current of the pulse electroplating corresponding to the second surface is composed of a number of strong pulse currents and a number of weak pulse currents continuously alternating, and the strong pulse circuit value is equal to the fixed pulse current.

10. The method for manufacturing a high-speed data transmission control circuit board according to claim 9, characterized in that: The frequency of continuous alternation of several strong pulse currents and one weak pulse current is ≥10:1.

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