Epoxy resin multi-factor comprehensive aging simulation and test design method

Abstract

The invention relates to an epoxy resin multi-factor comprehensive aging simulation and test design method, which comprises the following steps: selecting electrical equipment parts with different operating years, establishing an orthogonal experiment table for physicochemical property testing, and performing the physicochemical property testing to obtain macroscopic aging characteristic quantity of each test content; constructing a molecular dynamics model of the cross-linked epoxy resin, introducing a macroscopic aging characteristic quantity to simulate the microstructure change of the epoxy resin in the aging process, and establishing a multi-factor coupling aging model under the comprehensive action of electricity, humidity and heat; adopting molecular dynamics simulation software in the multi-factor coupling aging model to simulate the aging behaviors of the epoxy resin under different aging conditions, and obtaining microscopic aging characteristic quantity; and designing a multi-factor coupled epoxy resin aging test based on the macroscopic aging characteristic quantity and the microcosmic aging characteristic quantity. According to the method, the accelerated aging test closer to actual natural aging can be rapidly and effectively designed, and the aging prediction accuracy of the epoxy resin can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of insulating material aging tests, and in particular to a multi-factor comprehensive aging simulation and test design method for epoxy resin. Background Art

[0002] As an important insulating material, epoxy resin is widely used in electronic packaging, coatings, composite materials and electrical insulation. However, in actual use, epoxy resin is often affected by various environmental factors, such as humidity, temperature and electric field, which can cause the material to gradually age, affecting its mechanical, electrical and chemical properties, and further leading to insulation failure. The aging performance of epoxy resin is directly related to the safe and reliable operation of electrical equipment. Therefore, accurately evaluating the aging behavior of epoxy resin is of great significance for its life prediction and improving the reliable operation of electrical equipment.

[0003] At present, the traditional methods for evaluating the aging performance of insulating materials mainly rely on single factors or separate multi-factor accelerated aging tests such as damp heat aging, electrical aging, and thermal oxidation aging. These tests usually accelerate the aging behavior of the material by exposing it to specific environmental conditions to observe the changes in the physical and electrical properties of the material. Common evaluation indicators include breakdown voltage, dielectric strength, volume resistivity, mechanical strength, water absorption, etc. Although these test methods can reflect the aging trend of the material to a certain extent, they also have some obvious limitations. For example: the test cycle is long and the cost is high, which limits the material development process; it is impossible to monitor the early changes in the microstructure of the material, and it is difficult to capture the degradation phenomenon in the early stage of aging; the accelerated aging test is generally not compatible with the actual natural aging. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a multi-factor comprehensive aging simulation and experimental design method for epoxy resin, which effectively combines molecular dynamics simulation with experiments to carry out aging tests, so as to improve the accuracy of epoxy resin aging tests and shorten the test time, and better predict the aging behavior of materials.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0006] A multi-factor comprehensive aging simulation and experimental design method for epoxy resin, comprising the steps of:

[0007] S1. Select electrical equipment components with different operating years, establish an orthogonal experimental table for physical and chemical property testing, conduct physical and chemical property testing, and obtain the macroscopic aging characteristic quantity of each test content;

[0008] S2. Constructing a molecular dynamics model of a cross-linked epoxy resin, and introducing the macroscopic aging characteristic quantity to simulate the microstructural changes of the epoxy resin during the aging process, and establishing a multi-factor coupling aging model under the combined effects of electricity, moisture and heat;

[0009] S3, using molecular dynamics simulation software in the multi-factor coupled aging model to simulate the aging behavior of epoxy resin under different aging conditions to obtain microscopic aging characteristic quantities;

[0010] S4. Design a multi-factor coupled epoxy resin aging test based on the macroscopic aging characteristic quantity and the microscopic aging characteristic quantity.

[0011] The beneficial effects of the present invention are as follows: providing a multi-factor comprehensive aging simulation and test design method for epoxy resin, obtaining aging characteristic quantities of different electrical equipment components with different operating years through physical and chemical property tests; constructing a cross-linked epoxy resin molecular dynamics model to introduce aging characteristic quantities to simulate the microstructural changes of epoxy resin during the aging process, thereby establishing a multi-factor coupled aging model under the comprehensive action of electricity, moisture and heat; and using molecular dynamics simulation software to simulate the aging behavior of epoxy resin under different aging conditions to obtain microscopic aging characteristic quantities; finally, through the analysis of physical and chemical property tests and molecular dynamics microscopic aging results, the combination of macroscopic testing and microscopic simulation is achieved, and a multi-factor comprehensive epoxy resin aging test scheme is jointly designed, which is conducive to quickly and effectively designing an accelerated aging test that is closer to actual natural aging, thereby improving the accuracy of the epoxy resin aging test and shortening the test time, and better predicting the aging behavior of the material. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is an overall flow chart of a multi-factor comprehensive aging simulation and test design method for epoxy resin according to an embodiment of the present invention;

[0013] Figure 2 A specific flow chart of a multi-factor comprehensive aging simulation and test design method for epoxy resin according to an embodiment of the present invention;

[0014] Figure 3 A schematic diagram of a cross-linking script for a multi-factor comprehensive aging simulation and experimental design method for epoxy resin according to an embodiment of the present invention;

[0015] Figure 4 It is a schematic diagram of simulation calculation results of a multi-factor comprehensive aging simulation and experimental design method for epoxy resin according to an embodiment of the present invention;

[0016] Figure 5 A schematic diagram of a multi-factor coupling aging test platform for a multi-factor comprehensive aging simulation and test design method for epoxy resin according to an embodiment of the present invention;

[0017] Figure 6 The present invention is a schematic diagram of a multi-factor cyclic aging test process of an epoxy resin multi-factor comprehensive aging simulation and test design method in accordance with an embodiment of the present invention. DETAILED DESCRIPTION

[0018] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following is an explanation in combination with the implementation modes and the accompanying drawings.

[0019] Please refer to Figures 1 to 6 , a multi-factor comprehensive aging simulation and experimental design method for epoxy resin, comprising the steps of:

[0020] S1. Select electrical equipment components with different operating years, establish an orthogonal experimental table for physical and chemical property testing, conduct physical and chemical property testing, and obtain the macroscopic aging characteristic quantity of each test content;

[0021] S2. Constructing a molecular dynamics model of a cross-linked epoxy resin, and introducing the macroscopic aging characteristic quantity to simulate the microstructural changes of the epoxy resin during the aging process, and establishing a multi-factor coupling aging model under the combined effects of electricity, moisture and heat;

[0022] S3, using molecular dynamics simulation software in the multi-factor coupled aging model to simulate the aging behavior of epoxy resin under different aging conditions to obtain microscopic aging characteristic quantities;

[0023] S4. Design a multi-factor coupled epoxy resin aging test based on the macroscopic aging characteristic quantity and the microscopic aging characteristic quantity.

[0024] From the above description, it can be seen that the beneficial effects of the present invention are: providing a multi-factor comprehensive aging simulation and test design method for epoxy resin, obtaining the aging characteristic quantities of different electrical equipment components with different operating years through physical and chemical property tests; and constructing a cross-linked epoxy resin molecular dynamics model to introduce aging characteristic quantities to simulate the microstructural changes of epoxy resin during the aging process, thereby establishing a multi-factor coupled aging model under the comprehensive action of electricity, moisture and heat; and using molecular dynamics simulation software to simulate the aging behavior of epoxy resin under different aging conditions to obtain microscopic aging characteristic quantities; finally, through the analysis of physical and chemical property tests and molecular dynamics micro-aging results, the combination of macroscopic testing and microscopic simulation is realized, and a multi-factor comprehensive epoxy resin aging test plan is jointly designed, which is conducive to quickly and effectively designing accelerated aging tests that are closer to actual natural aging, thereby improving the accuracy of epoxy resin aging tests and shortening test time, and better predicting the aging behavior of materials.

[0025] Furthermore, the electrical equipment components with different operating years are selected in step S1, specifically:

[0026] AC transformers, contact boxes, busbars and supporting insulators with operating lives of 5, 10, 15 and 20 years were selected.

[0027] Furthermore, before establishing the orthogonal experimental table for physical and chemical property testing in step S1, the following steps may be further included:

[0028] Determine the main factors that affect the aging characteristics, including the type of electrical equipment, years of operation, ambient temperature and degree of contamination.

[0029] From the above description, it can be seen that by selecting different electrical equipment components of different ages, the main factors affecting the aging characteristic quantities can be effectively determined to ensure that the source of the aging test simulation data is reliable.

[0030] Furthermore, the test contents include cross-linking degree, glass transition temperature, water absorption and dielectric constant;

[0031] The cross-linking degree, the glass transition temperature and the water absorption rate are all obtained by differential scanning calorimetry, and the dielectric constant is obtained by high and low temperature dielectric properties tester;

[0032] The orthogonal experimental table is a four-factor four-level orthogonal table L 16 (4 4 ).

[0033] From the above description, it can be seen that the differential scanning calorimeter and the high and low temperature dielectric properties tester are used to accurately and efficiently obtain the crosslinking degree, glass transition temperature, water absorption rate and dielectric constant, so as to realize the physical and chemical properties test as different test contents.

[0034] Furthermore, the molecular dynamics simulation software is Materials Studio software or Lammps software.

[0035] From the above description, it can be seen that molecular dynamics simulation technology is widely used in the field of materials science. It can simulate the behavior of materials in complex environments at the molecular level, and provide new ideas for studying the aging mechanism of epoxy resin under the combined action of moisture, heat and electricity. Materials Studio software and Lammps software are both open source software widely used in molecular dynamics simulation. They have multi-scale simulation capabilities, high performance and parallel computing capabilities, and can effectively realize the simulation of epoxy resin aging, so as to improve the accuracy of aging tests, shorten test time, and better predict the aging behavior of materials.

[0036] Furthermore, in step S2, a molecular dynamics model of a cross-linked epoxy resin is constructed, specifically:

[0037] The reaction site of the bisphenol A epoxy resin is set as R1, and the reaction site of the triethylenetetramine curing agent is set as R2. After the bisphenol A epoxy resin and the triethylenetetramine curing agent are subjected to a cyclic crosslinking reaction using a Perl crosslinking script to achieve an ideal crosslinking degree, a molecular dynamics model of the crosslinked epoxy resin is obtained.

[0038] From the above description, it can be seen that the ideal cross-linking degree can be achieved by using the Perl cross-linking script to perform a cyclic cross-linking reaction.

[0039] Furthermore, the microscopic aging characteristic quantities include the free volume fraction of the epoxy resin model, the mean square displacement of the doped water molecules and the cross-linked polymer, the interaction energy of the doped water molecules and the cross-linked polymer, the cohesive energy density and the energy of the system.

[0040] Furthermore, the aging behavior of the epoxy resin in step S3 includes:

[0041] Diffusion behavior of water molecules in cross-linked polymers and the electrical-humidity-thermal integrated aging behavior of epoxy resin polymers.

[0042] Furthermore, the step S4 also includes:

[0043] The aging environment in actual use is simulated according to different conditions of electric field, humidity and temperature, and an accelerated aging test program is set. The temperature range is -10°C-180°C, the humidity range is 20%-98%, and the voltage range of the electric field is 0-40.5kV.

[0044] It can be seen from the above description that the temperature range, humidity range and voltage range are limited, so as to further effectively simulate the real aging environment.

[0045] Furthermore, the step S4 further includes the following steps:

[0046] S5. Verify the simulation accuracy of the multi-factor coupling aging model based on the accelerated aging test results.

[0047] From the above description, it can be seen that according to the results of the accelerated aging test, the accuracy of the simulation model can be verified and the test conditions can be further optimized. Subsequently, the accelerated aging test scheme can be improved by adjusting the simulation parameters and experimental conditions, and finally fast and effective aging prediction and testing can be achieved.

[0048] The present invention provides a multi-factor comprehensive aging simulation and test design method for epoxy resin, which is mainly used in the scenario of evaluating the aging performance of insulating materials, and is specifically described below in conjunction with specific embodiments:

[0049] Please refer to Figure 1 , Embodiment 1 of the present invention is:

[0050] A multi-factor comprehensive aging simulation and experimental design method for epoxy resin, such as Figure 1 As shown, the steps include:

[0051] S1. Select electrical equipment components with different operating years, where the operating years can be 5 years, 10 years, 15 years and 20 years. The electrical equipment components include AC transformers, contact boxes, busbars and supporting insulators, etc. Then, establish an orthogonal experimental table for physical and chemical property tests, conduct physical and chemical property tests, and obtain the macroscopic aging characteristic quantities of each test content.

[0052] That is to say, different electrical equipment components of different ages are selected to effectively determine the main factors affecting the aging characteristic quantities and ensure that the source of the aging test simulation data is reliable.

[0053] S2. Construct a molecular dynamics model of cross-linked epoxy resin, introduce macroscopic aging characteristic quantities to simulate the microstructural changes of epoxy resin during the aging process, and establish a multi-factor coupling aging model under the combined effects of electricity, moisture and heat.

[0054] S3. Molecular dynamics simulation software is used in the multi-factor coupled aging model to simulate the aging behavior of epoxy resin under different aging conditions and obtain the microscopic aging characteristic quantities.

[0055] S4. Design a multi-factor coupled epoxy resin aging test based on macro-aging characteristic quantities and micro-aging characteristic quantities.

[0056] That is, in this embodiment, the aging characteristic quantities of different electrical equipment components with different operating years are obtained through physical and chemical property tests; and a cross-linked epoxy resin molecular dynamics model is constructed to introduce aging characteristic quantities to simulate the microstructural changes of epoxy resin during the aging process, thereby establishing a multi-factor coupled aging model under the comprehensive action of electricity, moisture and heat; and molecular dynamics simulation software is used to simulate the aging behavior of epoxy resin under different aging conditions to obtain microscopic aging characteristic quantities; finally, through the analysis of physical and chemical property tests and molecular dynamics micro-aging results, the combination of macroscopic testing and microscopic simulation is realized, and a multi-factor comprehensive epoxy resin aging test plan is jointly designed, which is conducive to quickly and effectively designing accelerated aging tests that are closer to actual natural aging, thereby improving the accuracy of epoxy resin aging tests and shortening test time, and better predicting the aging behavior of materials.

[0057] Please refer to Figures 2 to 6 , Embodiment 2 of the present invention is:

[0058] A multi-factor comprehensive aging simulation and test design method for epoxy resin, based on the above-mentioned embodiment 1, in this embodiment, as Figure 2 As shown, the test contents in step S1 include cross-linking degree, glass transition temperature, water absorption and dielectric constant.

[0059] In this embodiment, the degree of crosslinking, glass transition temperature and water absorption are obtained by differential scanning calorimetry, and the dielectric constant is obtained by high and low temperature dielectric performance tester. That is, the degree of crosslinking, glass transition temperature, water absorption and dielectric constant are obtained accurately and efficiently by using differential scanning calorimeter and high and low temperature dielectric performance tester, so as to realize the physical and chemical property test as different test contents.

[0060] At the same time, before establishing the orthogonal experimental table for physical and chemical properties testing, it is necessary to determine the main factors affecting the aging characteristic quantity, including electrical equipment type, operating years, ambient temperature and degree of contamination, and each influencing factor has four levels. The table header design is shown in Table 1, thus establishing the orthogonal experimental table L with four factors and four levels. 16 (4 4 ), and establish a test data set for aging physical and chemical properties.

[0061] Table 1 Header Design

[0062] level Type A Operation life T Ambient temperature Degree of filth Z 1 <![CDATA[A1]]> <![CDATA[T1]]> <![CDATA[W1]]> <![CDATA[Z1]]> 2 <![CDATA[A2]]> <![CDATA[T2]]> <![CDATA[W2]]> <![CDATA[Z2]]> 3 <![CDATA[A3]]> <![CDATA[T3]]> <![CDATA[W3]]> <![CDATA[Z3]]> 4 <![CDATA[A4]]> <![CDATA[T4]]> <![CDATA[W4]]> <![CDATA[Z4]]>

[0063] Table 2 Orthogonal experiment table

[0064]

[0065]

[0066] That is, a differential scanning calorimeter is used to test the degree of crosslinking and the glass transition temperature, an electronic balance is used to test the water absorption, and a high and low temperature dielectric properties tester is used to test the dielectric constant, which are respectively listed as the 5th, 6th, 7th and 8th columns of Table 2.

[0067] At the same time, in this embodiment, molecular dynamics simulation technology is widely used in the field of materials science. It can simulate the behavior of materials in complex environments from a molecular level, and provide new ideas for studying the aging mechanism of epoxy resin under the combined action of moisture, heat and electricity. The molecular dynamics simulation software used in this embodiment is Materials Studio software or Lammps software, which are open source software widely used in molecular dynamics simulation. They have multi-scale simulation capabilities, high performance and parallel computing capabilities, and can effectively realize the simulation of epoxy resin aging, so as to improve the accuracy of aging tests, shorten test time, and better predict the aging behavior of materials.

[0068] Since the time scale of molecular dynamics simulation is very small, only at the level of femtoseconds or picoseconds, and the spatial scale is also very small, usually at the level of nanometers, in order to accelerate the aging speed of the simulation model and improve the accuracy, the average value of the cross-linking degree in Table 2 above is used as the ideal cross-linking degree. min As a lower limit, the maximum value W maxAs the upper limit, six groups were equally divided to construct six cross-linked epoxy resin models with different water contents.

[0069] In this embodiment, a molecular dynamics model of a cross-linked epoxy resin is constructed in step S2, such as Figure 3 As shown, specifically:

[0070] The reaction site of bisphenol A epoxy resin is set as R1, and the reaction site of triethylenetetramine curing agent is set as R2. After the bisphenol A epoxy resin and triethylenetetramine curing agent are subjected to cyclic cross-linking reaction to achieve the ideal cross-linking degree using Perl cross-linking script, the molecular dynamics model of the cross-linked epoxy resin is obtained.

[0071] That is, the ideal cross-linking degree is achieved by performing a cyclic cross-linking reaction using a Perl cross-linking script.

[0072] At the same time, the microscopic aging characteristic quantities in this embodiment include the free volume fraction (FFV) of the epoxy resin model, the mean square displacement (MSD) of the doped water molecules and the cross-linked polymer, the interaction energy (E-ec) of the doped water molecules and the cross-linked polymer, and the cohesive energy density and the energy of the system. According to the microscopic aging characteristic quantities, the movement behavior of water molecules and epoxy resin cross-linked products under multi-factor aging factors is analyzed, and the priority order of electricity, moisture, and heat for the degree of aging is analyzed. At the same time, the aging characteristic quantities at both the microscopic and macroscopic levels are combined to verify the accuracy of the simulation. In this embodiment, Figure 3 The figure is a schematic diagram of a simulation calculation result of this embodiment.

[0073] The aging behavior of the epoxy resin in step S3 includes the diffusion behavior of water molecules in the cross-linked polymer and the electrical-humidity-thermal comprehensive aging behavior of the epoxy resin polymer.

[0074] At the same time, step S4 also includes:

[0075] According to different conditions of electric field, humidity and temperature, the aging environment in actual use is simulated, and an accelerated aging test program is set up with a temperature range of -10℃-180℃, a humidity range of 20%-98%, and an electric field voltage range of 0-40.5kV.

[0076] That is, the temperature range, humidity range and voltage range are limited, so as to further effectively simulate the real aging environment.

[0077] Specific test plans such as Figure 6 As shown, the following can be used Figure 5 The multi-factor coupling aging test platform shown is executed, and its specific steps are as follows:

[0078] (1) The temperature of the climate test chamber rises from 15°C to 85°C within 2 hours, and is maintained at 85°C for 1 hour. Then the temperature drops from 85°C to 15°C within 2 hours, and is maintained at 15°C for another 1 hour. During this period, factors such as electricity (40.5 kV), humidity (relative humidity greater than 95%), pollution (salt spray), and mechanical stress (busbar) are applied simultaneously. The previous temperature alternation cycle is 6 hours, and 20 cycles are carried out continuously, for a total of 120 hours (5 days). This is cycle A.

[0079] (2) After the A cycle is completed, stop the temperature alternation and allow the temperature in the climate chamber to gradually return from 15°C to room temperature for 48 hours (2 days). During this period, the influencing factors such as electricity (40.5 kV), humidity (relative humidity greater than 95%), pollution (salt spray), and mechanical stress (busbar) are applied at the same time. This is the B cycle.

[0080] (3) After the B cycle is completed, the sample is tested for partial discharge, withstand voltage, etc. at room temperature within 24 hours (1 day). This is the C test.

[0081] The above A cycle + B cycle + C test is a test cycle, which takes 8 days in total.

[0082] (4) Repeat the aging test for 5 test cycles in the above manner, which takes a total of 40 days.

[0083] (5) After the fifth aging test cycle, the test piece shall be subjected to partial discharge and power frequency withstand voltage tests in accordance with the requirements of 2.4 and 2.5.

[0084] In addition, in this embodiment, step S4 further includes the following steps:

[0085] S5. Based on the results of accelerated aging tests, verify the simulation accuracy of the multi-factor coupled aging model.

[0086] That is, based on the results of the accelerated aging test, the accuracy of the simulation model is verified and the test conditions are further optimized. Subsequently, the accelerated aging test scheme can be improved by adjusting the simulation parameters and experimental conditions, ultimately achieving fast and effective aging prediction and testing.

[0087] In summary, the present invention provides a multi-factor comprehensive aging simulation and test design method for epoxy resin. Through physical and chemical property tests, the aging characteristic quantities of different electrical equipment components with different operating years are obtained; and a cross-linked epoxy resin molecular dynamics model is constructed to introduce aging characteristic quantities to simulate the microstructural changes of epoxy resin during the aging process, thereby establishing a multi-factor coupled aging model under the comprehensive action of electricity, moisture and heat; and molecular dynamics simulation software is used to simulate the aging behavior of epoxy resin under different aging conditions to obtain microscopic aging characteristic quantities; finally, through the analysis of physical and chemical property tests and molecular dynamics micro-aging results, the combination of macroscopic testing and microscopic simulation is realized, and a multi-factor comprehensive epoxy resin aging test scheme is jointly designed, which is conducive to quickly and effectively designing an accelerated aging test that is closer to actual natural aging, thereby improving the accuracy of the epoxy resin aging test and shortening the test time, and better predicting the aging behavior of the material.

[0088] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent transformations made using the contents of the present invention's specification and drawings, or directly or indirectly applied in related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A multi-factor comprehensive aging simulation and experimental design method for epoxy resin, characterized in that: Includes steps: S1. Select electrical equipment components with different operating years, establish an orthogonal experimental table for physical and chemical property testing, conduct physical and chemical property testing, and obtain the macroscopic aging characteristic quantity of each test content; S2. Constructing a molecular dynamics model of a cross-linked epoxy resin, and introducing the macroscopic aging characteristic quantity to simulate the microstructural changes of the epoxy resin during the aging process, and establishing a multi-factor coupling aging model under the combined effects of electricity, moisture and heat; S3, using molecular dynamics simulation software in the multi-factor coupled aging model to simulate the aging behavior of epoxy resin under different aging conditions to obtain microscopic aging characteristic quantities; S4. Design a multi-factor coupled epoxy resin aging test based on the macroscopic aging characteristic quantity and the microscopic aging characteristic quantity.

2. The epoxy resin multi-factor comprehensive aging simulation and test design method according to claim 1, characterized in that: The electrical equipment components with different operating years are selected in step S1, specifically: AC transformers, contact boxes, busbars and supporting insulators with operating lives of 5, 10, 15 and 20 years were selected.

3. The epoxy resin multi-factor comprehensive aging simulation and test design method according to claim 1, characterized in that: Before establishing the orthogonal experimental table for physical and chemical property testing in step S1, the step also includes: Determine the main factors that affect the aging characteristics, including the type of electrical equipment, years of operation, ambient temperature and degree of contamination.

4. The epoxy resin multi-factor comprehensive aging simulation and test design method according to claim 1, characterized in that: The test contents include cross-linking degree, glass transition temperature, water absorption and dielectric constant; The cross-linking degree, the glass transition temperature and the water absorption rate are all obtained by differential scanning calorimetry, and the dielectric constant is obtained by high and low temperature dielectric properties tester; The orthogonal experimental table is a four-factor four-level orthogonal table L 16 (4 4 ).

5. The epoxy resin multi-factor comprehensive aging simulation and test design method according to claim 1, characterized in that: The molecular dynamics simulation software is Materials Studio software or Lammps software.

6. The epoxy resin multi-factor comprehensive aging simulation and test design method according to claim 1, characterized in that: The molecular dynamics model of the cross-linked epoxy resin is constructed in step S2, specifically: The reaction site of the bisphenol A epoxy resin is set as R1, and the reaction site of the triethylenetetramine curing agent is set as R2. After the bisphenol A epoxy resin and the triethylenetetramine curing agent are subjected to a cyclic crosslinking reaction using a Perl crosslinking script to achieve an ideal crosslinking degree, a molecular dynamics model of the crosslinked epoxy resin is obtained.

7. The epoxy resin multi-factor comprehensive aging simulation and test design method according to claim 1, characterized in that: The microscopic aging characteristic quantities include the free volume fraction of the epoxy resin model, the mean square displacement of the doped water molecules and the cross-linked polymer, the interaction energy of the doped water molecules and the cross-linked polymer, the cohesive energy density and the energy of the system.

8. The epoxy resin multi-factor comprehensive aging simulation and test design method according to claim 1, characterized in that: The epoxy resin aging behavior in step S3 includes: Diffusion behavior of water molecules in cross-linked polymers and the electrical-humidity-thermal integrated aging behavior of epoxy resin polymers.

9. The epoxy resin multi-factor comprehensive aging simulation and test design method according to claim 1, characterized in that: The step S4 also includes: The aging environment in actual use is simulated according to different conditions of electric field, humidity and temperature, and an accelerated aging test program is set. The temperature range is -10°C-180°C, the humidity range is 20%-98%, and the voltage range of the electric field is 0-40.5kV.

10. The epoxy resin multi-factor comprehensive aging simulation and test design method according to claim 9, characterized in that: The step S4 further includes the following steps: S5. Verify the simulation accuracy of the multi-factor coupling aging model based on the accelerated aging test results.

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