Connector and connector pair

Abstract

The conductive component comprises a body part, a substrate connecting part located at one end of the body part and a contact part located at the other end of the body part, and the body part, the substrate connecting part and the contact part each comprise an exposed face exposed out of the base. Each of the body part, the substrate connection part and the contact part comprises a metal base material and first to third layers formed on the metal base material, and the first layer is a nickel or nickel alloy plating layer, the second layer is a platinum group metal or platinum group metal alloy plating layer, the third layer is a gold or gold alloy plating layer, and the first to third layers are formed on the metal base material. The thickness of the second layer ranges from 2 nm to 200 nm, and the thickness of the third layer ranges from 0.2 nm to 15 nm.

Description

[0001] Related Applications

[0002] This application claims the benefit of priority from Japanese Patent Application No. 2022-136439 filed on August 30, 2022, the contents of which are incorporated herein in their entirety. Technical Field

[0003] The present disclosure relates to connectors and connector pairs. Background Art

[0004] Conventionally, substrate-to-substrate connectors have been used to electrically connect a pair of parallel circuit substrates to each other. This type of connector includes a plurality of terminals as conductive components, wherein a substrate connection portion of each terminal is connected to a wiring pattern or the like formed on the circuit substrate by solder, and when the two connectors are engaged and the contact portions of the corresponding terminals are in contact with each other, the corresponding wiring patterns of a pair of circuit substrates are connected to each other. In addition, a barrier is formed on each terminal to prevent molten solder from climbing from the substrate connection portion to the contact portion (for example, refer to Patent Document 1).

[0005] Fig.11A and Fig. 11B is a diagram showing a conventional terminal, wherein Fig.11A is a side view, and Fig. 11B It is a cross-sectional view.

[0006] In the figure, 861 is a terminal mounted on a base (not shown) of a connector, which is a component formed by bending a slender strip-shaped conductive metal plate, and includes: an elongated main body portion 861c; a contact portion 861a formed on one end side of the main body portion 861c, for contacting the mating terminal; and a substrate connecting portion 861b formed on the other end side of the main body portion 861c, connected to a wiring pattern formed on a circuit substrate (not shown) by solder.

[0007] In addition, if Fig. 11B As shown, the contact portion 861a and the substrate connection portion 861b have a plurality of plated layers formed thereon. In the figure, 862 is formed of a metal substrate of a copper alloy such as copper-beryllium alloy. In addition, 863a is a nickel plated layer formed on the metal substrate 862 as a base layer and has a thickness of about 2 μm. In addition, 863b is a palladium plated layer formed on the nickel plated layer 863a and is composed of a palladium alloy such as Pd-Ni alloy and preferably has a thickness of 0.1 μm or more. In addition, 863c is a gold plated layer formed on the palladium plated layer 863b and is composed of a gold alloy such as Au-Co alloy and preferably has a thickness of 0.3 μm or more.

[0008] As a result, for the contact portion 861a, the resistance can be reduced while the hardness and wear resistance can be improved, and good contact reliability can be obtained. In addition, for the substrate connection portion 861b, good corrosion resistance and solder wettability can be maintained while the hardness and wear resistance can be improved. In addition, the body portion 861c includes a nickel plating layer 863a and a palladium plating layer 863b formed on the nickel plating layer 863a, but there is no gold plating layer 863c.

[0009] In this manner, a palladium plated layer 863b having poor solder wettability relative to the gold plated layer 863c is formed on the surface, so that the main body portion 861c acts as a solder barrier layer, thereby preventing molten solder from climbing from the substrate connection portion 861b to the contact portion 861a.

[0010] [Prior art document]; Patent document; [Patent document 1] Japanese patent application publication number JP2006-294420 Summary of the invention

[0011] However, for this conventional connector, a barrier layer must be formed between the substrate connection portion 861b and the contact portion 861a and a solder barrier layer must be formed over a wide range to completely prevent solder from climbing from the substrate connection portion 861b to the contact portion 861a and this makes the distance from the substrate connection portion 861b to the contact portion 861a long, resulting in a large-scale terminal 861. In particular, in recent years, substrate-to-substrate connectors have become miniaturized and lower in profile, thereby making it difficult to make the terminal 861 large and to make the distance from the substrate connection portion 861b to the contact portion 861a long. Because, along with the miniaturization and lower in profile of the substrate-to-substrate connector, the terminal 861 is also miniaturized, it is very difficult to form a solder barrier layer itself between the substrate connection portion 861b and the contact portion 861a.

[0012] In this article, in order to solve the above-mentioned conventional problems, it is an object to provide a connector and a connector pair, which have a simple structure, low cost and high reliability without forming a solder barrier layer, can maintain suitable solder wettability, improve the connection strength with the substrate connection part, and reduce the contact resistance of the contact part.

[0013] [Methods of solving the problem]

[0014] To achieve this, the connector includes: a base and a conductive component, wherein the conductive component includes a main body, a substrate connection portion located at one end of the main body, and a contact portion located at the other end of the main body, the main body, the substrate connection portion and the contact portion each include an exposed surface exposed from the base, the main body, the substrate connection portion and the contact portion each include a metal substrate and first to third layers formed on the metal substrate, and the first layer is a nickel or nickel alloy plating layer, the second layer is a platinum group metal or a platinum group metal alloy plating layer, the third layer is a gold or gold alloy plating layer, the thickness of the second layer is 2-200nm, and the thickness of the third layer is 0.2-15nm.

[0015] In another connector, the third layer has a thickness of 0.5-8 nm.

[0016] In yet another connector, the platinum group metal is palladium or a palladium alloy.

[0017] In still another connector, the first to third layers are formed on an extended surface of the conductive member.

[0018] In still another connector, the respective exposed surfaces are formed continuously to form one exposed surface.

[0019] In yet another connector, the body portion, the substrate connecting portion, and the contact portion are located on the same cross-sectional plane extending in the mating direction.

[0020] In still another connector, the board connection portion and the contact portion are located on the same line extending in the mating direction.

[0021] In still another connector, the conductive member is a plate-shaped member, and the substrate connecting portion and the contact portion are formed on an extended surface of the plate-shaped member.

[0022] In still another connector, an area of ​​the substrate connection portion is wider than an area of ​​the contact portion.

[0023] In yet another connector, the conductive component is a shielding component surrounding a circumference of the connector.

[0024] In still another connector, the conductive member is a power terminal or a signal terminal.

[0025] In yet another connector, the conductive component is a reinforcement fitting.

[0026] The connector pair includes a connector according to the present disclosure and a mating connector mated with the connector.

[0027] The connector disclosed in the present invention can maintain appropriate solder wettability without forming a solder barrier layer, improve the connection strength of the substrate connection part, and reduce the contact resistance of the contact part. In addition, it can simplify the structure, reduce costs, and improve reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a perspective view showing a positional relationship before mating between the first connector and the second connector according to the first embodiment, as viewed from the first connector side.

[0029] Figure 2 is an exploded view of the second connector according to the first embodiment.

[0030] Figure 3 It is a cross-sectional view when the first connector and the second connector are released from mating.

[0031] Figure 4 1 is a schematic cross-sectional view showing the structure of a plating layer near the surface of the second terminal according to the present embodiment.

[0032] Figure 5 is a graph showing experimental results of solder wetting and spreading according to the first embodiment.

[0033] Figure 6 : is a table showing the experimental results for the changes in the thickness of the second layer and the third layer in the first embodiment.

[0034] Figure 7 is a perspective view of a first connector and a second connector before being mated with each other according to a second embodiment.

[0035] Figure 8 is a perspective view of a second connector according to a second embodiment.

[0036] Fig. 9 1 is a plan view of a first connector and a second connector in a mating state according to a second embodiment.

[0037] FIG. 10A to FIG. 10C is a cross-sectional view of a mating state of a first connector and a second connector according to a second embodiment, wherein: Fig. 10A For along Fig. 9 The cross-sectional view made by line AA, Fig. 10B For along Fig. 9 The cross-sectional view made by line BB, Fig. 10C For along Fig. 9 A cross-sectional view made along line CC.

[0038] Fig.11A and Fig. 11B is a diagram showing a conventional terminal, wherein Fig.11A is a side view, and Fig. 11BIt is a cross-sectional view. DETAILED DESCRIPTION

[0039] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings.

[0040] Figure 1 is a perspective view showing a positional relationship before mating between the first connector and the second connector according to the first embodiment, as viewed from the first connector side. Figure 2 is an exploded view of the second connector according to the first embodiment. Figure 3 It is a cross-sectional view when the first connector and the second connector are released from mating.

[0041] In the figure, 101 is a connector of the present embodiment and indicates a second connector as one of two substrate-to-substrate connectors of a connector pair. The second connector 101 is a surface-mounted connector mounted on the surface of a second substrate (not shown) as a mounting component, and is engaged with a first connector 1 as a mating connector. In addition, the first connector 1 is the other of a pair of substrate-to-substrate connectors and is a surface-mounted connector mounted on the surface of a first substrate (not shown) serving as a mounting component.

[0042] The first connector 1 and the second connector 101 according to the present embodiment are preferably used to electrically connect the first substrate and the second substrate, but can also be used to electrically connect other components. For example, the first substrate and the second substrate are each a printed circuit substrate, a flexible flat cable (FFC), a flexible circuit substrate (FPC), etc. used in electronic equipment, etc., but can be any type of substrate.

[0043] In addition, in the present embodiment, expressions indicating directions such as up, down, left, right, front, and rear, etc., used to explain the configuration and actions of the various parts of the first connector 1 and the second connector 101, are relative rather than absolute, and are appropriate when the various parts of the first connector 1 and the second connector 101 are in the postures shown in the figures. That is, when their postures change, these directions should be interpreted variably according to the change in posture.

[0044] In addition, the first connector 1 has: a first base 11, as a mating base, formed integrally from an insulating material such as a synthetic resin. As shown in the figure, the first base 11 is a substantially rectangular solid having a substantially rectangular thick plate-like shape, wherein a recessed portion that is a substantially rectangular recessed portion surrounded by the second base 111 of the second connector 101 is formed on the side where the second connector 101 is inserted (i.e., the side of the mating surface 11a (Z-axis positive direction side)). For example, the first connector 1 has a length of about 6 mm (dimension in the X-axis direction), a width of about 2 mm (dimension in the Y-axis direction), and a thickness of about 0.6 mm (dimension in the Z-axis direction). However, these dimensions can be appropriately changed. The first convex portion as the island that is fitted in the groove portion 113 of the second connector 101 is integrally formed in the concave portion of the first base 11, and the side wall portion extending parallel to the first convex portion is integrally formed on both sides of the first convex portion of the first base 11 (Y-axis positive direction side and Y-axis negative direction side).

[0045] The first terminal receiving inner cavity having a groove shape is formed on the side surfaces of both sides of the first convex portion. In addition, the first terminal receiving outer cavity having a groove shape is formed on the side surface of the inner side of the side wall portion. In addition, when the first terminal receiving inner cavity and the first terminal receiving outer cavity are described uniformly, they are described as the first terminal receiving cavity. It is noted that the first terminal receiving cavity is formed to penetrate the bottom plate 18 in the thickness direction (Z-axis direction).

[0046] In the present embodiment, the first terminal receiving cavities are formed on both sides of the width direction (Y-axis direction) of the first base 11 and are arranged in the length direction of the first base 11. Specifically, a plurality of first terminal receiving cavities (e.g., 10) are formed on both sides of the first protrusion at a predetermined spacing (e.g., about 0.35 mm). It is noted that the spacing and number of the first terminal receiving cavities can be appropriately varied. In addition, a plurality of first terminals 61 used as terminals, which are received in respective first terminal receiving cavities and assembled on the first base 11, are arranged on both sides of respective first protrusions at the same spacing.

[0047] The first terminal 61 is a component formed integrally by stamping, bending, etc. a conductive metal plate, and includes: a held portion 63 as a main body; a tail portion 62 as a substrate connection portion connected to the lower end of the held portion 63; an upper connection portion 67 connected to the upper end of the held portion 63; a second contact portion 66 as a second contact portion facing the held portion 63 and connected to the lower end of the upper connection portion 67; a lower connection portion 64 connected to the lower end of the second contact portion 66; and an inner connection portion 65 connected to the end of the lower connection portion 64 opposite to the end connected to the second contact portion 66. The first terminal 61 is inserted into the first terminal receiving cavity from the mounting surface 11b as the lower surface (Z-axis negative direction surface) of the first base 11, and the held portion 63 is fixed to the first base 11 by being clamped from both sides by the side walls of the first terminal receiving outer cavity formed on the inner side of the side wall portion.

[0048] Furthermore, a first contact portion 65a as a first contact portion that is bent upward by about 180 degrees to protrude toward the second contact portion 66 is connected to the upper end of the inner connection portion 65. In addition, the upper connection portion 67 includes: an inclined portion 67a that descends obliquely downward from the upper end in a straight line or a gently curved surface; and a protruding portion 67b that protrudes toward the inside of the width direction of the first base 11 at the lower end of the inclined portion 67a. In a state where the first terminal 61 is mounted on the first base 11, the first contact portion 65a and the second contact portion 66 are located on the left and right sides of the groove portion and face each other.

[0049] The first terminal 61 is a component formed integrally by processing a metal plate, and thus has a certain degree of elasticity. As is clear from the shape, the interval between the first contact portion 65a and the second contact portion 66 can be changed elastically. That is, when the second terminal 161 of the second connector 101 is inserted between the first contact portion 65a and the second contact portion 66, the interval between the first contact portion 65a and the second contact portion 66 will be elastically extended. In addition, the tail 62 is bent and connected to the retained portion 63, extends in the left and right direction (Y-axis direction) (i.e., to the outside of the width direction of the first base 11) and is connected to the connection pad connected to the conductive trace on the first substrate by welding. It is noted that the conductive trace is typically a signal line but can also be a power line. In other words, the first terminal 61 can be a signal terminal or a power terminal.

[0050] In addition, the first protruding end portion as the mating guide portion is provided at each end in the longitudinal direction of the first base 11. A mating recess is formed at each first protruding end portion. In addition, when the first connector 1 and the second connector 101 are mated together, the second protruding end portion 122 included in the second connector 101 is inserted into the mating recess.

[0051] In addition, a first reinforcing fitting 51 as a mating reinforcing fitting installed on the first base 11 is installed on the first protruding end. The first reinforcing fitting 51 includes a tail portion 57c extending outward in the length direction of the first base 11 and a contact arm portion. The contact arm portion contacts the second reinforcing fitting 151 of the second connector 101, and the tail portion 57c is connected to a connection pad connected to a conductive trace on the first substrate by welding. The conductive trace is typically a power line or a ground line.

[0052] Next, the configuration of the second connector 101 will be described.

[0053] The second connector 101 as a connector according to the present embodiment has: a second base 111 as a base, which is integrally formed of an insulating material such as a synthetic resin. As shown in the figure, the second base 111 has a substantially rectangular body in the shape of a thick plate that is substantially rectangular. An elongated groove portion 113 extending in the length direction (X-axis direction) of the second base 111 and a second convex portion 112 as an elongated convex portion that defines the outer side of the groove portion 113 and extends in the length direction of the second base 111 are integrally formed on the side of the second base 111 where the first connector 1 is embedded (i.e., the fitting surface 111a side (Z-axis negative direction side)). The second convex portion 112 is formed along both sides of the groove portion 113 and along both sides of the second base 111. For example, the second connector 101 has dimensions of about 5.2 mm in length, about 1.9 mm in width, and about 0.5 mm in thickness. However, these dimensions can be appropriately changed.

[0054] In addition, the second terminals 161 as terminals are installed as conductive members on each second protrusion 112. The same number of second terminals 161 as the first terminals 61 is arranged at a pitch corresponding to the first terminals 61. In the groove portion 113, the side mounted on the second substrate (i.e., the mounting surface 111b side (Z-axis positive direction side)) is closed by the bottom plate.

[0055] In addition, the second protruding end portion 122 as the mating guide portion is provided at both ends of the second base 111 in the longitudinal direction. The second protruding end portion 122 is a thick part extending in the width direction (Y-axis direction) of the second base 111, wherein both ends are connected to the corresponding ends of the length direction of the two second protruding portions 112, and its upper surface has a generally rectangular shape. In the state where the first connector 1 and the second connector 101 are mated together, the second protruding end portion 122 plays the role of an insertion protrusion inserted into the mating recess of the first protruding end portion provided in the first connector 1. In addition, the second reinforcement accessory 151 as a reinforcement accessory is attached to the second protruding end portion 122.

[0056] Note that the second terminal 161 and the second reinforcing fitting 151 are components that are integrated with the second base 111 by over-molding (insert molding) and thus are not separated from the second base 111, but for ease of explanation, Figure 2 In the figure, the second terminal 161 and the second reinforcing member 151 are drawn separately from the second base 111 .

[0057] The second terminal 161, which is a conductive component, is a component integrally formed by stamping, bending, etc. on a conductive metal plate. It is a component with an elongated curve extending in the mating direction of the second connector 101, so the surface of the second terminal 161 can be called an extended surface. In addition, the second terminal 161 includes: a contact portion 165 as a contact portion; a connecting portion 164 connected to the upper end of the contact portion 165; a retained portion 166 connected to the outer end of the connecting portion 164; and a tail portion 162 as a substrate connecting portion connected to the lower end of the retained portion 166. Note that when collectively described, the retained portion 166 and the connecting portion 164 are described as the main body.

[0058] The tail 162 extends toward the outside of the second base 111 and is connected to a connection pad connected to a conductive trace of the second substrate by welding or the like. Note that the conductive trace is typically a signal line but may also be a power line. In other words, the second terminal 161 may be a signal terminal or a power terminal.

[0059] The connection portion 164 has an inclined portion 164a formed on the contact portion 165 side, which descends obliquely from the end portion on the mating surface 111a side toward the mounting surface 111b side, thereby drawing a relatively long straight line or a gently curved surface. The protrusion 164b is formed on the held portion 166 side of the connection portion 164, and protrudes outward in the width direction of the second base 1115 at the junction with the held portion 166.

[0060] In addition, the surface of the tail portion 162, the surface of the contact portion 165, the surface of the connecting portion 164, and the surface of the held portion 166 are exposed on the side surfaces and the fitting surface 111a of the second convex portion 112. In other words, at least the tail portion 162 as the substrate connecting portion, the contact portion 165 as the contact point portion, and the protruding portion 164b and the held portion 166 as the main body portion all include exposed surfaces exposed from the second base 111, and these exposed surfaces are formed continuously with each other to form one exposed surface.

[0061] In addition, if Figure 3 As shown, the tail portion 162 as the substrate connection portion, the contact portion 165 as the contact portion, and the held portion 166 as the body portion are located on a cross-sectional plane extending in the mating direction of the first connector 1 and the second connector 101 .

[0062] The second reinforcing fitting 151 is a component integrally formed by stamping, bending, etc. a conductive metal plate, and includes: a central covering portion 157 as a main body covering the outer side of the second protruding end portion 122; and side covering portions 153 connected to the left and right ends of the central covering portion 157.

[0063] The central covering portion 157 includes: a protruding end upper covering portion 157a, which extends in the width direction of the second base 111 and covers more than half of the upper surface of the second protruding end portion 122; a connecting covering portion 157b, which is connected to the protruding end upper covering portion 157a and is bent about 90 degrees at the outer edge of the second protruding end portion 122; and a tail portion 157c, which is a substrate connecting portion, is bent and connected to the lower end of the connecting covering portion 157b and extends toward the front-to-back direction (X-axis direction) (i.e., the length direction of the second base 111). The tail portion 157c is connected to a connection pad connected to a conductive trace of the second substrate by welding or the like. The conductive trace is typically a power line or a ground line. It is noted that the tail portion 157c may have an L-shape extending toward the outer side of the short side direction of the second base 111.

[0064] In addition, the side cover 153 includes: a connection cover 153a, which is connected to the left and right ends of the protruding upper cover 157a and is bent at about 90 degrees; and a side cover 153b, which extends downward from the lower end of the connection cover 153a. The side surface of the side cover 153b acts as a contact point and contacts the contact arm of the first reinforcing fitting 51. The lower end of the side cover 153b is connected to the connection pad of the second substrate by welding or the like. The connection pad is preferably connected to a conductive trace of the second substrate that acts as a power line or a ground line.

[0065] The second reinforcing fitting 151 as a conductive component is a component integrally formed by stamping, bending, etc. on a conductive metal plate, and is a component extending in the mating direction of the second connector 101, so the surface of the second reinforcing fitting 151 can be called an extended surface. In addition, the second reinforcing fitting 151 is provided with a side surface of a side covering portion 153b as a contact portion and a lower end of the side covering portion 153b as a substrate connecting portion. Note that when collectively described, the range of the side covering portion 153b from the portion in contact with the first reinforcing fitting 51 to its lower end is described as the main body.

[0066] Next, the operation of fitting together and the operation of releasing the fitting of the first connector 1 and the second connector 101 having the above-described configuration will be described.

[0067] First, when the first connector 1 and the second connector 101 are to be mated, the operator makes the mating surface 11a of the first base 11 of the first connector 1 and the mating surface 111a of the second base 111 of the second connector 101 face each other, aligns the position of the second convex portion 112 of the second connector 101 with the position of the corresponding groove portion of the first connector 1, and aligns the position of the second protruding end portion 122 of the second connector 101 with the position of the corresponding mating recessed portion of the first connector 1, so as to complete the alignment of the first connector 1 and the second connector 101.

[0068] In this state, when the first connector 1 and / or the second connector 101 moves in a direction approaching each other (i.e., in the mating direction (Z-axis direction), the second convex portion 112 and the second protruding end portion 122 of the second connector 101 are inserted into the groove portion and the mating recess of the first connector 1. As a result, when the mating between the first connector 1 and the second connector 101 is completed, the first terminal 61 and the second terminal 161 enter a conductive state.

[0069] Specifically, the second terminal 161 of the second connector 101 is inserted between the first contact portion 65a and the second contact portion 66 of the first terminal 61, so that the first contact portion 65a of the first terminal 61 is in contact with the contact portion 165 of the second terminal 161. As a result, the conductive trace connected to the connection pad of the first substrate connected to the tail portion 62 of the first terminal 61 and the conductive trace connected to the connection pad of the second substrate connected to the tail portion 162 of the second terminal 161 are connected. It is noted that the protrusion 67b of the first terminal 61 is engaged with the protrusion 164b of the second terminal 161, ensuring the combination between the first terminal 61 and the second terminal 161 and ensuring that the fitting state between the first connector 1 and the second connector 101 is maintained.

[0070] In addition, the second protruding end 122 is inserted into the fitting recess and the contact arm portion of the first reinforcing fitting 51 contacts the side cover portion 153b of the second reinforcing fitting 151 attached to the second protruding end 122. As a result, the conductive trace connected to the connection pad of the first substrate connected to the tail portion 57c of the first reinforcing fitting 51 and the conductive trace connected to the connection pad of the second substrate connected to the tail portion 157c of the second reinforcing fitting 151 are connected.

[0071] Next, when the first connector 1 and the second connector 101 are to be released from the mating state, the first terminals 61 arranged in two rows along both sides of the first convex portion of the first connector 1 and the second terminals 161 arranged in two rows along both sides of the concave groove 113 of the second connector 101 are ensured to be engaged with each other, thereby ensuring that the first connector 1 and the second connector 101 are mated with each other; Figure 3As shown, the second connector 101 should be tilted relative to the first connector 1 by rotating around the X axis so as to release the connection between the first terminal 61 and the second terminal 161 in one row. Figure 3 The cross-sectional plane extending in the mating direction of the first connector 1 and the second connector 101 is shown as a cross section and only one row ( Figure 3 The state where the connection between the first terminal 61 and the second terminal 161 (the left column) is released.

[0072] After the first terminals 61 and the second terminals 161 of one row are released from engagement, the second connector 101 is further rotated relative to the first connector 1 about the X-axis (in Figure 3 In the example shown, the clockwise rotation) makes the other column ( Figure 3 The second terminal 161 engaged with the protrusion 67b of the first terminal 61 (the right column in the figure) rotates around the protrusion 164b of the second terminal 161. Here, the portion of the contact portion 165 in the second terminal 161 connected to the connecting portion 164 presses the first contact portion 65a of the first terminal 61 protruding toward the second contact portion 66 and moves on an arc around the protrusion 164b. Since the inclined portion 164a has a relatively long straight line or a gentle curve formed in this portion, the movement is carried out smoothly with less resistance. As a result, the combination of the first terminal 61 and the second terminal 161 of the other column can be released by applying a force weaker than the combination of the first terminal 61 and the second terminal 161 of the one column.

[0073] In other words, the amount of force required to release the mating of the first connector 1 and the second connector 101 has a first peak value when the first terminal 61 and the second terminal 161 of the one row are released from the combination and a second peak value when the first terminal 61 and the second terminal 161 of the other row are released from the combination. In this embodiment, the second terminal 161 includes an inclined portion 164a having a relatively long straight line or a gentle curve, so the second peak value is low. As a result, the mating of the first connector 1 and the second connector 101 can be easily released.

[0074] Next, the configuration of the plating layer formed on the extended surface, which is the surface of the second terminal 161 and the second reinforcing fitting 151 as the conductive member, will be described.

[0075] Figure 4 is a schematic cross-sectional view showing the configuration of a plating layer near the surface of the second terminal according to the present embodiment; Figure 5 is a graph showing experimental results of solder wetting and spreading according to the first embodiment; and Figure 6 : is a table showing the experimental results for the changes in the thickness of the second layer and the third layer in the first embodiment.

[0076] In this embodiment, the second terminal 161 as a conductive member has a surface near the surface. Figure 4 The layer structure shown.

[0077] In the figure, reference numeral 91 denotes a conductive metal base material constituting the second terminal 161 and the second reinforcing fitting 151 as conductive members, and is made of, for example, copper (Cu) or a copper alloy.

[0078] In addition, 92 is a plating layer formed on the surface of the metal base material 91 and includes a first layer 92a, a second layer 92b, and a third layer 92c.

[0079] The first layer 92a is a nickel (Ni) or nickel alloy plated layer and its thickness is preferably 1-3 μm. Note that the first layer 92a has a function of preventing copper from diffusing from the metal base material 91 to the second layer 92b and the third layer 92c.

[0080] The second layer 92b is a platinum group metal or platinum group metal alloy plating layer and its thickness is preferably 2nm or more. Note that, from the perspective of cost, etc., the thickness is preferably 200nm or less, so the thickness can be said to be preferably 2-200nm. In addition, from the viewpoint of fully preventing the metal of the first layer 92a and the metal of the third layer 92c from diffusing each other, the thickness of the second layer 92b is more preferably 5-25nm. In addition, any one of ruthenium (Ru), rhodium (Rh), palladium (Pd), osmium (Os), iridium (Ir) or platinum (Pt) can be selected as the platinum group metal; however, palladium is most preferred. In addition, examples of platinum group metal alloys include any alloy containing 50% or more of ruthenium, rhodium, palladium, osmium, iridium or platinum; however, palladium alloys containing 50% or more of palladium (e.g., PdNi, etc.) are more preferred.

[0081] The third layer 92c is a gold or gold alloy plated layer and its thickness is preferably 0.2-15nm and more preferably 0.5-8nm. In addition, examples of gold alloys include gold alloys containing 90% or more gold (such as AuCo, AuCu, AuNi, AuFe, etc.). However, in the case of an alloy of gold and a platinum group metal, a gold alloy having 20% ​​or more gold (such as AuPd, AuPt, etc.) is sufficient.

[0082] In this embodiment, the numerical range of the thickness of the second layer 92b and the third layer 92c is based on Figure 6 The experimental results (test results) shown in the table are set. Figure 6, the horizontal axis represents the numerical value [nm] of the thickness of the second layer 92b and the vertical axis represents the numerical value [nm] of the thickness of the third layer 92c. In addition, each cell (square) of the table represents the test results of the contact resistance test, the mounting strength test, and the solder wettability test evaluated by one of the symbols O, Δ, and X. The symbol O means good, the symbol Δ means slightly good, and the symbol × means bad.

[0083] In the experiment, the plating layer 92 was formed on the surface of each test piece of a predetermined size composed of the metal base material 91 to obtain the second layer 92b and the third layer 92c having a thickness corresponding to the value of each unit cell. Then, each test piece was used to perform a contact resistance test, a mounting strength test, and a solder wettability test. Note that, as Figure 6 As shown, the thickness of the second layer 92b varies from 0 to 200 nm and the thickness of the third layer 92c varies from 0 to 20 nm.

[0084] In the contact resistance test, the contact resistance of each test piece on the surface of the plating layer 92 is measured. Test pieces with a contact resistance less than a first threshold value are evaluated as good, test pieces with a contact resistance greater than the first threshold value but less than a second threshold value are evaluated as slightly good, and test pieces with a contact resistance greater than the second threshold value are evaluated as poor.

[0085] In addition, in the mounting strength test, another test piece is welded to the surface of the plating layer 92 of each test piece. Tension is applied to these independent test pieces and the tension that causes the welded portion to break is measured. Test pieces with a tension above the first threshold are evaluated as good, test pieces with a tension below the first threshold but greater than the second threshold are evaluated as slightly good, and test pieces with a tension less than the second threshold are evaluated as poor.

[0086] In addition, if Figure 5 As shown, in the solder wettability test, several solder balls (e.g., with a particle size of about 0.6 mm) are placed on the surface of the plating layer 92 of each test piece and a heating device (e.g., a solder reflow oven) is used, and the expanded diameter after heating is measured. Test pieces whose expanded diameter is less than a first threshold value are evaluated as good, test pieces whose expanded diameter is greater than the first threshold value but less than a second threshold value are evaluated as slightly good, and test pieces whose expanded diameter is greater than the second threshold value are evaluated as poor.

[0087] like Figure 6As shown, in the experimental results, for the thickness of the second layer 92b in the range of 2-200nm and the thickness of the third layer 92c in the range of 0.2-15nm, the test results evaluated that there was no badness, and thus the second terminal 161 as a conductive component could be used. In addition, when the thickness of the third layer 92c was limited to the range of 0.5-8nm, the test results did not include bad or slightly good evaluations, in other words, all the test results were evaluated as good; thus, this is considered to be more ideal. Note that, from Figure 6 It is estimated that all test results will be evaluated as good for a thickness of the second layer 92b greater than 200 nm, but when cost etc. are taken into consideration, a value greater than 200 nm is not realistic, and thus the upper limit of the thickness of the second layer 92b is set to 200 nm.

[0088] like Figure 5 As shown, if the thickness of the third layer 92c, which is a gold or gold alloy plating layer, is thin, the diameter of the expansion of the solder is reduced, in other words, the wettability of the solder is reduced, which suppresses the diffusion of the solder and prevents the solder from climbing to the contact portion 165 as the contact portion. On the other hand, when the wettability is reduced, it is difficult to solder the tail 162, and the strength of the soldered portion is reduced, which leads to a reduction in the mounting strength of the tail 162 on the second substrate surface. In addition, if the thickness of the third layer 92c, which is a gold or gold alloy plating layer, is thin, the contact resistance increases, and in addition, the third layer 92c is more easily worn. However, forming the second layer 92b, which is a platinum group metal or platinum group metal alloy plating layer below the third layer 92c, to have a thickness of more than a predetermined value can reduce the contact resistance of the third layer 92c and also prevent wear.

[0089] In this way, without forming a solder barrier layer, by setting the thickness of the third layer 92c to 0.2-15nm and the thickness of the second layer 92b below the third layer 92c to 2-200nm, the solder wettability can be properly maintained, the connection strength of the tail 162 can be improved, and at the same time, solder climbing can be suppressed and the contact resistance of the contact portion 165 can be reduced.

[0090] Note that, in this embodiment, the thickness of the second layer 92b and the thickness of the third layer 92c are measured using X-ray photoelectron spectroscopy, commonly known as XPS. XPS is a method for measuring the composition of the surface layer of a sample and can generally measure the depth of a substance from the surface layer to about 0.2-6nm. In addition, the surface layer of the sample is removed by ion sputtering (using ion sputtering etching). Ion sputtering can be used to remove about 0.2-1nm. Note that the amount of removal can be adjusted.

[0091] In this embodiment, the measurement is performed by repeating the operations of measuring the surface material of the sample by XPS, scraping off the surface layer of the sample by ion sputtering, and measuring the material of the surface layer of the sample by XPS. For example, after measuring the third layer 92c as the surface layer by XPS and detecting gold or a gold alloy, only 0.2nm of the third layer 92c as the surface layer is scraped off by ion sputtering; then, in the measurement by XPS, if gold or a gold alloy can be detected, the thickness of the third layer 92c composed of gold or a gold alloy can be determined to be more than 0.2nm.

[0092] In this manner, in the present embodiment, the second connector 101 includes a second base 111 and a second terminal 161 . In addition, the second terminal 161 includes: a retained portion 166 and a connecting portion 164; a tail portion 162, located at one end of the retained portion 166; and a contact portion 165, located at the other end of the connecting portion 164; wherein the retained portion 166 and the connecting portion 164, the tail portion 162 and the contact portion 165 each include an exposed surface exposed from the second base 111; the retained portion 166 and the connecting portion 164, the tail portion 162 and the contact portion 165 each include a metal substrate 91 and a first layer 92a, a second layer 92b and a third layer 92c formed on the metal substrate 91; the first layer 92a is a nickel or nickel alloy plating layer, the second layer 92b is a platinum group metal or a platinum group metal alloy plating layer, the third layer 92c is a gold or gold alloy plating layer, the thickness of the second layer 92b is 2-200nm, and the thickness of the third layer 92c is 0.2-15nm.

[0093] Thus, without forming a barrier layer between the tail portion 162 and the contact portion 165, it is possible to appropriately maintain solder wettability, improve the connection strength of the tail portion 162, prevent solder climbing, and reduce the contact resistance of the contact portion 165. Thus, for the tiny second terminal 161 used in the extremely small and low-profile second connector 101, it is no longer necessary to form a solder barrier layer, which can simplify the structure of the second connector 101, reduce costs, and improve reliability.

[0094] In addition, the thickness of the third layer 92c is preferably 0.5-8nm. In addition, the platinum group metal is preferably palladium or a palladium alloy. In addition, the first layer 92a, the second layer 92b and the third layer 92c are formed on the extension surface of the second terminal 161. In addition, the respective exposed surfaces are formed continuously to form an exposed surface. In addition, the retained portion 166 and the connecting portion 164, the tail portion 162 and the contact portion 165 are located on the same cross-sectional plane extending in the mating direction. In addition, the side and lower end of the lateral covering portion 153b of the second reinforcing accessory 151 are located on the same straight line extending in the mating direction.

[0095] Next, the second embodiment will be described below. Note that for parts having the same configuration as the first embodiment, description thereof is omitted by giving them the same reference numerals. In addition, description of the same actions and effects as the first embodiment will be omitted.

[0096] Figure 7 is a perspective view of a first connector and a second connector before being mated with each other according to a second embodiment. Figure 8 is a perspective view of a second connector according to a second embodiment. Fig. 9 1 is a plan view of a first connector and a second connector in a mating state according to a second embodiment. FIG. 10A to FIG. 10C is a cross-sectional view of the mating state of the first connector and the second connector according to the second embodiment. FIG. 10A to FIG. 10C middle, Fig. 10A For along Fig. 9 The cross-sectional view made by line AA, Fig. 10B For along Fig. 9 The cross-sectional view made by line BB, Fig. 10C For along Fig. 9 A cross-sectional view made along line CC.

[0097] In the figure, 201 denotes a first connector of one of a pair of substrate-to-substrate connectors as a connector pair in the present embodiment. The first connector 201 is a surface-mounted receptacle connector mounted on the surface of a first substrate (not shown) serving as a mounting member, and is engaged with a second connector 301 serving as a mating connector. In addition, the second connector 301 is the other of a pair of substrate-to-substrate connectors and is a surface-mounted plug connector mounted on the surface of a second substrate (not shown) serving as a mounting member.

[0098] Note that the first connector 201 and the second connector 301 of the connector pair according to the present embodiment are preferably used to electrically connect the first substrate and the second substrate, but may also be used to electrically connect other components. For example, the first substrate and the second substrate are each a printed circuit substrate, a flexible flat cable, a flexible circuit substrate, etc. used in electronic equipment, etc., but may be any type of substrate.

[0099] In addition, in the present embodiment, expressions indicating directions such as up, down, left, right, front, and back, which are used to explain the configuration and actions of the various parts of the first connector 201 and the second connector 301 of the connector pair, are relative rather than absolute, and are appropriate when the various parts of the first connector 201 and the second connector 301 are in the postures shown in the figures. However, when their postures are changed, these directions should be interpreted variably according to the change in posture.

[0100] In addition, the first connector 201 includes: a first shield 250, which is a first outer shield and is a socket shield formed by stamping, drawing, etc. on a conductive metal plate; and a first base 211, which is a mating base and is integrally formed of an insulating material such as a synthetic resin. The first base 211 includes: a flat bottom plate 218; and two first protrusions 213, which are a pair of protrusions and protrude upward from the upper surface of the bottom plate 218. The two first protrusions 213 are located on the inner side of the width direction (Y-axis direction) of the first connector 201 relative to both side ends of the bottom plate 218.

[0101] Each first protrusion 213 is a generally rectangular component extending in the length direction (X-axis direction) of the first connector 201, and a plurality of first terminal receiving cavities 215 (three in the example shown in the figure) arranged in the length direction are formed from the inner side surfaces facing each other to the upper surface at a predetermined spacing (e.g., 0.35 mm). It is noted that the spacing and number of the first terminal receiving cavities 215 can be appropriately changed. In addition, a plurality of first terminals 261 used as terminals, which are accommodated in respective first terminal receiving cavities 215 and assembled on the first base 211, are arranged on both sides of respective first protrusions 213 at the same spacing. In other words, a plurality of first terminals 261 are arranged along each first protrusion 213 to form a pair of parallel terminal groups. It is noted that the first terminal receiving cavities 215 are formed to penetrate the bottom plate 218 in the plate thickness direction (Z-axis direction).

[0102] In addition, the shielding plate receiving slit is formed as a slit near both ends in the length direction of the first protrusion 213, and the shielding plate 256 is received in the shielding plate receiving slit as a first inner shield. In the example shown in the figure, the shielding plate receiving slit extends continuously from the upper surface of the first protrusion 213 to the inner side surface and the outer side surface, and is also formed to penetrate the bottom plate 218 from the inner side surface and the outer side surface in the plate thickness direction. It is noted that the bottom plate 218 between the two first protrusions 213 is a thick-walled portion having a thickness (dimension in the Z-axis direction) thicker than other portions, and an opening penetrating in the plate thickness direction is formed at a position corresponding to the shielding plate receiving slit and in the vicinity thereof with respect to the length direction of the first connector 201.

[0103] In addition, the first protrusion 213 forms an outer recess 213a that is recessed inward in a range closer to the center in the longitudinal direction than the shield plate receiving slit on the outer side in the width direction of the first connector 201. The outer recess 213a is formed to extend from the upper surface of the first protrusion 213 to the lower surface of the bottom plate 218 in the up-down direction (Z-axis direction), so that the bottom plate 218 does not exist on the outer side in the width direction of the first connector 201 relative to the outer recess 213a.

[0104] In addition, two first high-frequency terminal support portions 216 protruding upward from the upper surface of the bottom plate 218 serving as a pair of support portions are formed on the outside relative to the shield plate receiving slit in the length direction of the first connector 201. The first high-frequency terminal support portion 216 includes a first high-frequency terminal receiving groove extending in the up-down direction as a high-frequency terminal receiving groove. In addition, the first high-frequency terminal 271 is received in the first high-frequency terminal receiving groove as a high-frequency terminal. In addition, the first high-frequency terminal receiving opening that passes through the bottom plate 218 in the plate thickness direction as an opening is formed below and in front of the first high-frequency terminal receiving groove.

[0105] In addition, the bottom plate 218 has a connection end connected to the first shielding member 250 at the outermost end with respect to the length direction and the width direction of the first connector 201. The first shielding member 250 is integrated with the first base 211 by overmolding or insert molding. In other words, the first base 211 is formed by filling a mold in which the first shielding member 250 is preliminarily set with an insulating material such as a synthetic resin, and is integrally connected to the first shielding member 250 at the connection end.

[0106] The first shielding member 250 is a member formed integrally by stamping, drawing, or the like on a conductive metal plate, and is a member having a substantially rectangular frame shape when viewed from above (i.e., in a plan view) and surrounding the entire periphery of the first base 211. In addition, with respect to the present embodiment, the first shielding member 250 is a member functioning as a conductive member, and includes: a pair of long sides 250a extending linearly in the length direction of the first connector 201; a pair of short sides 250b extending linearly in the width direction of the first connector 201; and four corner portions 250c bent at approximately 90 degrees to connect one end of the long side 250a to one end of the short side 250b.

[0107] In addition, the first shielding member 250 includes: an outer wall 252; an inner wall 251, which is substantially parallel to the outer wall 252 and is on the inner side of the outer wall 252; and a connecting portion 253, which connects and integrates the upper end of the outer wall 252 with the upper end of the inner wall 251. Meanwhile, the outer wall 252 is a wall that is continuous over the entire circumference, and the inner wall 251 is separated into a straight portion 251a and a curved portion 251b by a slit portion 253a formed at both ends of each corner portion 250c. The straight portion 251a is a straight portion in a plan view and corresponds to the long side portion 250a and the short side portion 250b. In addition, the curved portion 251b is a curved portion in a plan view and corresponds to the corner portion 250c. Note that the slit portion 253a is a notch that starts at the upper end of the connecting portion 253, extends downward through the inner wall 251, and opens at the lower end of the inner wall 251. Thus, in the connection portion 253, the portion adjacent to the outer wall 252 is continuous over the entire circumference, while the portion adjacent to the inner wall 251 is separated by the slit portion 253a into a portion corresponding to the long side portion 250a and the short side portion 250b and a portion corresponding to the corner portion 250c. Note that the closed space surrounded by the portions corresponding to the long side portion 250a, the short side portion 250b, and the corner portion 250c of the inner wall 251 is a receiving portion 250d into which the second connector 301 as a plug connector is inserted and received.

[0108] In addition, the straight portion 251a of the inner wall 251 has: a curved end portion 251d connected to the lower end of the straight portion 251a; and a joint recess 251c formed above the curved end portion 251d. The curved end portion 251d is a portion that is curved so that its tip is inclined downward toward the inside of the receiving portion 250d, and a part of the curved end portion 251d is connected to the connection end of the bottom plate 218. In other words, the straight portion 251a is connected to the first base 211. In contrast, the curved portion 251b does not have the curved end portion 251d and is not connected to the first base 211.

[0109] The engaging recess 251c functions as a contact portion, and is a portion that engages and contacts the engaging protrusion 352c formed on the outer wall 352 of the second shielding member 350 provided in the second connector 301 when the first connector 201 and the second connector 301 are fitted together, and extends linearly in the length direction or width direction of the first connector 201. As described above, each straight portion 251a is relatively flexible and can be elastically deformed in a direction approaching or moving away from the outer wall 252 because both ends are separated from the other portions by the slit portion 253a. Note that the engaging recess 251c is formed in a concave shape so as to be able to engage with the engaging protrusion 352c; however, the lower end of the straight portion 251a of the inner wall 251 may extend to the upper end of the bent end portion 251d and the extended area may function as a contact portion with the engaging protrusion 352c. On the contrary, in the case where the outer wall 352 of the second shielding member 350 is not provided with the engaging protrusion 352 c , the engaging protrusion may be formed on the inner wall 251 to replace the engaging recess 251 c and function as a contact portion with the outer wall 352 .

[0110] The flange portion 254 serving as a flat surface portion extending outward is connected to the lower end of the outer wall 252 through a bent portion bent at an angle of about 90 degrees. The bent portion and the flange portion 254 are connected to the lower end of the outer wall 252 in a continuous manner over the entire circumference.

[0111] The flange portion 254 serves as a substrate connection portion, and the lower surface of the flange portion 254 is parallel to the surface of the first substrate and is connected to the connection pad on the surface by welding or the like. The connection pad is typically connected to a ground line. In addition, in addition to being continuous around the entire circumference, the outer wall 252 also has its upper end connected to the connecting portion 253 and its lower end connected to the flange portion 254, and thus the outer wall 252 has a relatively high rigidity and is not easily deformed. In the present embodiment, the flange portion 254 is continuously connected to the lower end of the outer wall 252 around the entire circumference for illustration, but if relatively high rigidity is not necessary, the flange portion may be connected only on a portion.

[0112] The first shield 250 as a conductive component is a component integrally formed by stamping, drawing, etc. on a conductive metal plate, and is a curved component extending in the mating direction of the first connector 201, so the surface of the first shield 250 can be called an extended surface. In addition, the first shield 250 includes: a joint recess 251c as a contact portion; a connecting portion 253 connected to the upper end of the inner wall 251 to form the joint recess 251c; an outer wall 252, the upper end of which is connected to the connecting portion 253; and a flange portion 254 connected to the lower end of the outer wall 252 as a substrate connecting portion. Note that in the unified description, the range of the inner wall 251 from the joint recess 251c to the lower end of the outer wall 252 including the connecting portion 253 is described as the main body. In this embodiment, the plating layer 92 includes the first, second and third layers 92a, 92b, 92c formed on the extended surface of the first shield 250 as a conductive component.

[0113] Furthermore, in a state where the first base 211 is connected to the first shielding member 250 in the housing portion 250d, a first recessed portion 212 is formed in the housing portion 250d as a recessed portion surrounded by the inner wall 251 and defined below by the bottom plate 218 to be engaged with the second connector 301. Furthermore, an inner recessed portion 212a extending in the length direction of the first connector 201 as an elongated recessed portion is formed between a pair of first protruding portions 213 as a part of the first recessed portion 212. Furthermore, an outer recessed portion 212c extending in the length direction of the first connector 201 as an elongated recessed portion is formed between the two first protruding portions 213 and the inner wall 251 as a part of the first recessed portion 212. Furthermore, two engaging recessed portions 212b are formed on the outer sides of both ends of the first protruding portion 213 as a part of the first recessed portion 212 with respect to the length direction of the first connector 201.

[0114] The first terminal 261 is a component integrally formed by stamping, bending, etc. on a conductive metal plate, and has: a held portion; a tail portion, which serves as a substrate connection portion and is connected to the lower end of the held portion; an upper connection portion, which is connected to the upper end of the held portion; and a lower connection portion, which is connected to the lower end of the upper connection portion. In addition, a curved contact portion 265a is formed near the lower end of the upper connection portion so as to bulge inwardly in the width direction of the first connector 201. The contact portion 265a functions as a contact point portion and is a portion that contacts the second terminal 361 provided in the second connector 301.

[0115] Note that the first terminal 261 is not necessarily attached to the first base 211 by pressing, but can be integrated with the first base 211 by overmolding or insert molding. In this article, for ease of description, the case where the holding portion is pressed into the first terminal receiving cavity 215 and held by the first terminal receiving cavity 215 is described.

[0116] In addition, the tail is connected to a connection pad connected to the conductive trace of the first substrate by welding or the like. Note that the conductive trace may be a power line for supplying power, but is typically a signal line. In addition, the signal line is described assuming that the signal line does not transmit a high-frequency signal but transmits a signal of a normal frequency (e.g., a frequency less than 10 GHz) lower than the frequency of the high-frequency signal.

[0117] The first terminal 261 is pressed into the first terminal receiving cavity 215 from the mounting surface 201b which is the lower surface (negative surface in the Z-axis direction) of the first connector 201 and fixed to the first base 211. In this state (i.e., when the first terminal 261 is assembled to the first base 211), the contact portion 265a protrudes from the inner side surfaces of the two first protrusions 213 into the inner groove portion 212a and faces each other.

[0118] The first high-frequency terminal 271 is a component integrally formed by stamping, bending, etc. on a conductive metal plate, and is a component with an elongated curve extending in the mating direction of the first connector 201, so the surface of the first high-frequency terminal 271 can be called an extended surface. In addition, the first high-frequency terminal 271 includes: a held portion; a tail portion connected to the lower end of the held portion as a substrate connection portion; and an upper side connection portion connected to the upper end of the held portion. In addition, the upper side connection portion is bent in a substantially S-shaped shape when viewed from the length direction of the first connector 201, and the portion that is bent to bulge toward the center of the width direction of the first connector 201 is a contact portion 275a. The contact portion 275a serves as a contact point portion and is a portion that contacts the second high-frequency terminal 371 provided in the second connector 301.

[0119] Note that the first high-frequency terminal 271 is not necessarily attached to the first base 211 by pressing, but can be integrated with the first base 211 by overmolding or insert molding. In this article, for the sake of convenience, the case where the holding portion is pressed into the first high-frequency terminal receiving groove of the first high-frequency terminal support portion 216 and is held by the first high-frequency terminal receiving groove of the first high-frequency terminal support portion 216 will be described.

[0120] In addition, the tail is connected to a connection pad connected to the conductive trace of the first substrate by soldering, etc. Note that the conductive trace is a signal line, which is typically described as a high-frequency signal that transmits a high-frequency RF signal (eg, a frequency above 10 GHz).

[0121] The first high-frequency terminal 271 is pressed into the first high-frequency terminal receiving groove of the first high-frequency terminal support portion 216 located in the fitting recess 212b from the mounting surface 201b side and fixed to the first base 211. In this state (i.e., in the state where the first high-frequency terminal 271 is assembled to the first base 211), the contact portions 275a of the pair of first high-frequency terminals 271 face opposite directions.

[0122] The shielding plate 256 is a component integrally formed by stamping, bending, etc. a conductive metal plate, and includes: a central portion 258; and a pair of side portions connected to both sides of the central portion 258. The central portion 258 bulges outward in the length direction of the first connector 201, and the end of the central portion 258 bulges outward in the length direction of the first connector 201 and includes a contact portion 258c on the outer surface. The contact portion 258c serves as a contact portion and contacts the inner wall 351 of the second shielding member 350 provided in the second connector 301. In addition, the lower end of the side portion serves as a tail portion as a substrate connection portion, and is a portion connected to a connection pad of the first substrate by welding or the like. The connection pad is typically connected to a ground line.

[0123] Note that the shielding plate 256 is not necessarily attached to the first base 211 by press-fitting, but may be integrated with the first base 211 by overmolding or insert molding. Herein, for convenience of description, the shielding plate 256 will be described as being held by being pressed into the shielding plate receiving slit.

[0124] The shielding plate 256, which is a conductive component, is a component that is integrally formed by stamping, bending, or the like on a conductive metal plate. It is a component that extends in the mating direction of the second connector 301, so the surface of the shielding plate 256 can be called an extended surface. In addition, the shielding plate 256 includes: a contact portion 258c, which serves as a contact portion; and a lower end, which serves as a substrate connection portion. Note that when collectively described, the range from the contact portion 258c to the lower end of the shielding plate 256 is described as the main body. In this embodiment, the plating layer 92, which is a conductive component, includes first, second, and third layers 92a, 92b, and 92c formed on the extended surface of the shielding plate 256.

[0125] In addition, the first connector 201 is placed on the surface of the first substrate using a first solder sheet (not shown) used as a solder sheet provided on the mounting surface 201b side and fixed and mounted on the surface of the first substrate by heating and melting the first solder sheet using a heating furnace, etc. Note that the means for connecting the first shielding member 250, the first terminal 261, the first high-frequency terminal 271, the shielding plate 256, etc. to the connection pad of the first substrate, etc., does not necessarily require the application of a solder sheet, but may be the application of solder paste, transfer of cream solder, dipping, jet soldering, etc.; however, for ease of explanation, the case of using a solder sheet will be described.

[0126] The solder sheet includes: a pair of elongated long side portions, which extend straight and continuously in the length direction of the first connector 201; and a pair of elongated short side portions, which extend straight and continuously in the width direction of the first connector 201. In addition, a pair of long side portions are provided on the lower surface of the flange portion 254 corresponding to the long side portions 250a of the first shielding member 250, and a pair of short side portions are provided on the lower surface of the flange portion 254 corresponding to the short side portions 250b of the first shielding member 250. Note that specific details on the soldering of the first terminal 261, the first high-frequency terminal 271, and the shielding plate 256 are omitted.

[0127] When the first solder sheet arranged in this manner is heated and melted and the first connector 201 is mounted on the surface of the first substrate, the flange portion 254 continuously connected to the lower end of the outer wall 252 continuous on the entire circumference of the first shield 250 as a conductive member is connected to the connection pad on the surface of the first substrate without a gap. Therefore, the strength of the first shield 250 connected to the connection pad on the surface of the first substrate is high, and as a result, the strength of the entire first connector 201 surrounded by the first shield 250 is high. In addition, the electromagnetic shielding effect achieved by the first shield 250 connected to the connection pad on the surface of the first substrate without a gap is very high, and the first connector 201 surrounded by the first shield 250 is very effectively electromagnetically shielded. In particular, the smoothness of the lower surface of the flange portion 254 is high. Therefore, the strength of the first shield 250 connected to the connection pad on the surface of the first substrate can be made extremely high. In addition, since there is no gap between the connection pad on the surface of the first substrate, the electromagnetic shielding effect can also be very high. In addition, the area of ​​the flange portion 254 is set wider than the area of ​​the engaging recessed portion 251 c as a contact portion to fully ensure the welding connection.

[0128] Thus, due to the high strength and electromagnetic shielding effect, the first connector 201 can transmit high-frequency signals even in a small and low-profile state. For example, even if the dimensions of the first connector 201 in the length direction, width direction, and height direction are set to 3.3 mm or less, 2.3 mm or less, and 0.6 mm or less, the first high-frequency terminal 271 can transmit a high-frequency signal of about 60 GHz.

[0129] Next, the configuration of the second connector 301 will be described.

[0130] The second connector 301 according to the present embodiment comprises: a second shield 350 as a second outer shield, which is a plug shield formed by stamping, drawing, etc., on a conductive metal plate; and a second base 311 as a mating base, which is integrally formed of an insulating material such as synthetic resin. The second base 311 comprises: a flat bottom plate 318; a second protrusion 312 as a protrusion protruding upward from the upper surface of the bottom plate 318 at the center in the longitudinal direction of the second connector 301; and a pair of protruding ends 322 protruding upward from the upper surface of the bottom plate 318 at both ends in the longitudinal direction (X-axis direction) of the second connector 301. The second protrusion 312 is narrower than the protruding end 322 and is located on the inner side of the width direction (Y-axis direction) of the second connector 301 than both ends of the protruding end 322.

[0131] The second protrusion 312 is a substantially rectangular component extending in the length direction of the second connector 301. A slender groove-shaped central slit 312b that is recessed downward from the upper surface is formed in the center in the width direction, and the left and right sides of the central slit 312b are terminal support walls that support the second terminals 361 that serve as mating terminals. The second terminals 361 are arranged on the outer side of the terminal support wall at a spacing and number corresponding to the first terminals 161. In other words, a plurality of second terminals 361 are arranged along both sides of the terminal support wall to form a pair of parallel terminal groups (mating terminal groups).

[0132] Each protruding end 322 is separated from both ends of the second convex portion 312 in the length direction. In addition, a second high-frequency terminal support portion 316 as a support portion is formed on each protruding end 322. The second high-frequency terminal support portion 316 has a second high-frequency terminal receiving groove as a high-frequency terminal receiving groove extending in the up-down direction, and the second high-frequency terminal support portion 316 has a substantially U-shaped shape when viewed from above. The two second high-frequency terminal support portions 316 are arranged so that the openings of the two second high-frequency terminal receiving grooves face opposite directions respectively, and the two second high-frequency terminal support portions 316 are arranged to be point-symmetrical about the center of the second connector 301 when viewed from above (i.e., in a plan view), and are spaced from the center of the width direction of the second connector 301 and offset to the outside in the width direction. In addition, the second high-frequency terminal 371 as a high-frequency terminal is received in the second high-frequency terminal receiving groove. In addition, a second high-frequency terminal receiving opening as an opening that penetrates the bottom plate 318 in the plate thickness direction is formed below and in front of the second high-frequency terminal receiving groove. Furthermore, on each protruding end portion 322 , a first high-frequency terminal accommodating recess portion serving as a mating terminal accommodating recess portion extending from the second high-frequency terminal accommodating opening to the upper surface and opening on the upper surface is formed in front of the second high-frequency terminal accommodating groove.

[0133] The second shield 350 is a member formed integrally by stamping, drawing, or the like on a conductive metal plate, and is a member having a substantially rectangular frame shape in a plan view and surrounding the periphery of the second base 311. The second shield 350 includes, as a member functioning as a conductive member, a pair of long sides 350a extending linearly in the longitudinal direction of the second connector 301, a pair of short sides 350b extending linearly in the width direction of the second connector 301, and four corner portions 350c bent at approximately 90 degrees and connecting one end of the long side 350a and one end of the short side 350b.

[0134] In addition, the second shielding member 350 includes: an outer wall 352; an inner wall 351 as a second inner shielding member; and an upper wall 353. In addition, the outer wall 352 is a wall that is continuous over the entire circumference. In addition, the upper wall 353 is connected to the upper end of the outer wall 352 at each short side 350b, at the corners 350c at both ends of the short side 350b, and near both ends of each long side 350a, and the upper wall 353 is formed to cover at least a portion of the upper surface of the protruding end 322, preferably more than half. Note that the upper wall 353 has an opening corresponding to the first high-frequency terminal accommodating recess 316c. In addition, the inner wall 351 extends downward, the upper end of the inner wall 351 is connected to the inner end of the second connector 301 on the upper wall 353 in the longitudinal direction, and the inner wall 351 is formed to cover at least a portion of the inner wall surface of the protruding end 322, preferably substantially the entirety.

[0135] Note that the inner wall 351 functions as a contact portion and contacts the contact portion 258c of the shielding plate 256 provided in the first connector 201. In addition, the upper end of the inner wall 351 has a curved upper wall connection portion connected to the upper wall 353, and the lower end of the inner wall 351 has a tail portion 351b, which serves as a substrate connection portion and is bent so that the end faces the inner side in the length direction of the second connector 301. The tail portion 351b is parallel to the surface of the second substrate and is a portion of a connection pad connected to the surface by welding or the like. The connection pad is typically connected to a ground wire. In addition, the space surrounded by the outer wall 352 corresponding to the pair of long sides 350a and the pair of inner walls 351 is a second recess 313, and the first protrusion 213 of the first connector 201 is inserted into and accommodated in the second recess 313.

[0136] The flange portion 354, which is a flat surface portion, is connected to the lower end of the outer wall 352 via a bent portion bent at an angle of about 90 degrees. The bent portion and the flange portion 354 are connected to the lower end of the outer wall 352 in a continuous manner around the entire circumference.

[0137] The flange portion 354 is used as a substrate connection portion, and its lower surface is parallel to the surface of the second substrate and is a portion of a connection pad connected to the surface by welding or the like. The connection pad is typically connected to a ground wire. In addition, in addition to being a continuous wall over its entire circumference, the outer wall 352 is also connected at its lower end to a part that is continuous with the flange portion 354 (the flange portion 354 is a part extending in a direction orthogonal to the outer wall 352). Therefore, the outer wall 352 is relatively rigid and resistant to deformation. In the present embodiment, the flange portion 354 is continuously connected to the lower end of the outer wall 352 over the entire circumference for illustration, but if a relatively high rigidity is not required, the flange portion 354 may be connected only to a portion.

[0138] In addition, the outer wall 352 corresponding to the long side portion 350a and the short side portion 350b has an engagement protrusion 352c protruding outward. The engagement protrusion 352c serving as a contact portion is a portion that engages with the engagement recess 251c formed on the inner wall 251 of the first shielding member 250 provided in the first connector 201 when the first connector 201 and the second connector 301 are fitted with each other and extends linearly in the length direction or width direction of the second connector 301. As described above, the outer wall 352 can be made flat by omitting the engagement protrusion 352c.

[0139] Note that the second shield 350 is integrated with the second base 311 by overmolding or insert molding. In other words, the second base 311 is formed by filling the cavity of a mold in which the second shield 350 is preliminarily disposed with an insulating material such as synthetic resin and is integrally connected to the second shield 350 at the protruding end 322.

[0140] The second shield 350 as a conductive member is a member formed integrally by stamping, drawing, etc. on a conductive metal plate, and is a member with a curved line extending in the mating direction of the second connector 301, so the surface of the second shield 350 can be called an extended surface. In addition, the second shield 350 includes: a joint protrusion 352c as a contact portion; and a flange portion 354 as a substrate connection portion connected to the lower end of the outer wall 352, and the joint protrusion 352c is formed on the lower end of the outer wall 352. Note that when collectively described, the range from the joint protrusion 352c to the lower end of the outer wall 352 is described as the main body. In addition, the second shield 350 has an inner wall 351 as a contact portion and a tail portion 351b as a substrate connection portion. Note that when collectively described, the range from the portion of the inner wall 351 that contacts the contact portion 258c of the shield plate 256 of the first connector 201 to the lower end of the inner wall 351 is described as the main body. Furthermore, in the present embodiment, the plated layer 92 as the conductive member includes first, second, and third layers 92 a , 92 b , and 92 c formed on the extended surface of the second shield 350 .

[0141] The second terminal 161 is a component formed integrally by stamping, bending, etc. a conductive metal plate, and has: a held portion; a tail portion, as a substrate connection portion, connected to one end of the held portion; a lower connection portion, connected to the other end of the held portion and extending in the up-down direction (Z-axis direction); and an upper connection portion, connected to the upper end of the lower connection portion. Note that the surface of the lower connection portion is a contact portion 365a, which functions as a contact point portion and contacts the first terminal 261 provided in the first connector 201.

[0142] In addition, the second terminal 361 may be integrated with the second base 311 by overmolding or insert molding. That is, the second base 311 is formed by filling a cavity of a mold in which the second terminal 361 is preliminarily disposed with an insulating material such as synthetic resin.

[0143] In addition, the tail is connected to a connection pad connected to the conductive trace of the second substrate by welding or the like. Note that the conductive trace may be a power line for supplying power, but is typically a signal line. In addition, the signal line is described assuming that the signal line does not transmit a high-frequency signal but transmits a signal of a normal frequency (e.g., a frequency less than 10 GHz) lower than the frequency of the high-frequency signal.

[0144] The second high-frequency terminal 371 is a component formed integrally by stamping, bending, etc. a conductive metal plate, and is a component with an elongated curve extending in the mating direction of the second connector 301, so the surface of the second high-frequency terminal 371 can be called an extended surface. In addition, the second high-frequency terminal 371 includes: a held portion; a tail portion connected to the lower end of the held portion as a substrate connection portion; and an upper side connection portion connected to the upper end of the held portion. In addition, the upper side connection portion is bent in an approximately S-shaped shape when viewed from the length direction of the second connector 301, and the portion that is bent to bulge toward the center in the width direction of the second connector 301 is a contact portion 375a. The contact portion 375a serves as a contact point portion and is a portion that contacts the first high-frequency terminal 271 provided in the first connector 201.

[0145] Note that the second high-frequency terminal 371 is not necessarily attached to the second base 311 by pressing, but can be integrated with the second base 311 by overmolding or insert molding. In this article, for ease of description, the case where the holding portion is pressed into the second high-frequency terminal receiving groove of the second high-frequency terminal supporting portion 316 and is held by the second high-frequency terminal receiving groove of the second high-frequency terminal supporting portion 316 will be described.

[0146] In addition, the tail is connected to a connection pad connected to a conductive trace of the second substrate by soldering, etc. Note that the conductive trace is a signal line, and the signal line is typically described as a high-frequency signal that transmits a high-frequency RF signal (eg, a frequency above 10 GHz).

[0147] The second high-frequency terminal 371 is pressed into the second high-frequency terminal receiving groove of the second high-frequency terminal support portion 316 from the mounting surface 301b side which is the lower surface (Z-axis positive direction surface) of the second connector 301, and is fixed to the second base 311. In this state (i.e., in the state where the second high-frequency terminal 371 is assembled to the second base 311), the contact portions 375a of the pair of second high-frequency terminals 371 face opposite directions to each other.

[0148] Note that in the example shown in the figure, the second high-frequency terminal 371 is formed to have the same size and shape as the first high-frequency terminal 271. Thus, the first high-frequency terminal 271 can be used as the second high-frequency terminal 371. Note that the tail and contact portion 275a of the first high-frequency terminal 271 or the tail and contact portion 375a of the second high-frequency terminal 371 may include an exposed surface exposed to the first base 211 or the second base 311, wherein these exposed surfaces can form an exposed surface continuous with each other. In addition, each of the tail and the contact portion can be formed on the extension surface of each high-frequency terminal, and as in the first embodiment, the plating layer 92 can be formed on the extension surface.

[0149] In addition, the second connector 301 is fixed and mounted on the surface of the second substrate by placing a second solder sheet (not shown) as a solder sheet applied to the mounting surface 301b side on the surface of the second substrate and heating and melting the second solder sheet using a heating furnace or the like. Note that the means for connecting the second shielding member 350, the second terminal 361, the second high-frequency terminal 371, etc. to the connection pads of the second substrate, etc., is not necessarily by applying a solder sheet, but may be applying solder paste, transferring paste solder, dipping, spray soldering, etc. Here, for the sake of convenience, the case of using a solder sheet will be described.

[0150] The solder sheet includes: a pair of elongated long side portions in a strip shape extending straight and continuously in the length direction of the second connector 301; a pair of elongated short side portions in a strip shape extending straight and continuously in the width direction of the second connector 301; and a plurality of rectangular short-dimension portions, wherein the long sides extend in the width direction of the second connector 301 and the short sides extend in the length direction of the second connector 301. In addition, a pair of long side portions are provided on the lower surface of the flange portion 354 corresponding to the long side portions 350a of the second shield 350, a pair of short side portions are provided on the lower surface of the flange portion 354 corresponding to the short side portions 350b of the second shield 350, and a short side portion is provided on the lower surface of each tail portion 351b of the inner wall 351.

[0151] When the solder sheet arranged in this way is heated and melted and the second connector 301 is mounted on the surface of the second substrate, the flange portion 354 continuously connected to the lower end of the outer wall 352 continuous on the entire circumference in the second shielding member 350 as a conductive member is connected to the connection pad on the surface of the second substrate without a gap. Therefore, the strength of the second shielding member 350 connected to the connection pad on the surface of the second substrate is high, and as a result, the strength of the entire second connector 301 surrounded by the second shielding member 350 is high. In addition, the electromagnetic shielding effect achieved by the second shielding member 350 connected to the connection pad on the surface of the second substrate without a gap is very high, and the second connector 301 surrounded by the second shielding member 350 is very effectively electromagnetically shielded. In particular, the smoothness of the lower surface of the flange portion 354 is high. Therefore, the strength of the second shielding member 350 connected to the connection pad on the surface of the second substrate can be made extremely high. In addition, since there is no gap between the connection pad on the surface of the second substrate, the electromagnetic shielding effect can also be very high. Furthermore, the area of ​​the flange portion 354 is set wider than the area of ​​the engaging protrusion 352c as the contact point portion to fully ensure the welding connection.

[0152] In addition, the protruding end portions 322 at both ends of the second connector 301 in the longitudinal direction are covered by the outer wall 352 of the second shielding member 350 on the outer wall surfaces of the second connector 301 facing the outer side in the longitudinal direction and both sides in the width direction, the upper surface of the fitting surface 301a facing the second connector 301 is covered by the upper wall 353 of the second shielding member 350, and the inner wall surface facing the inner side in the longitudinal direction of the second connector 301 is covered by the inner wall 351 of the second shielding member 350. Therefore, the entire surroundings are shielded, and the second high-frequency terminal 371 supported by the second high-frequency terminal support portion 316 formed on the protruding end portion 322 is very effectively electromagnetically shielded.

[0153] Therefore, due to the high strength and electromagnetic shielding effect, the second connector 301 can transmit high-frequency signals even in a small and low-profile state. For example, even if the dimensions of the second connector 301 in the length direction, width direction, and height direction are set to be less than 2.9 mm, less than 1.9 mm, and less than 0.6 mm, the second high-frequency terminal 371 can transmit a high-frequency signal of about 60 GHz.

[0154] Next, an operation of fitting the first connector 201 and the second connector 301 having the above-described configuration together will be described.

[0155] In order to mate the first connector 201 with the second connector 301, the operator first places the mating surface 201a (Z-axis positive direction surface) of the first connector 201 and the mating surface 301a (Z-axis negative direction surface) of the second connector 301 such that Figure 7 As shown, facing each other, and when the position of the first protrusion 213 of the first connector 201 matches the position of the second recess 313 of the second connector 301 and the position of the protruding end 322 of the second connector 301 matches the position of the mating recess 212b corresponding to the first connector 201, the alignment of the first connector 201 and the second connector 301 is completed.

[0156] In this state, when the first connector 201 and / or the second connector 301 moves in a direction approaching the other side (i.e., in a mating direction), the second shielding member 350 of the second connector 301 is inserted into the receiving portion 250d of the first shielding member 250 of the first connector 201, the first convex portion 213 of the first connector 201 is inserted into the second concave portion 313 of the second connector 301, and the protruding end portion 322 of the second connector 301 is inserted into the mating concave portion 212b of the first connector 201. Therefore, when the mating of the first connector 201 and the second connector 301 is completed, the first terminal 261 and the second terminal 361 are conducted, and the first high-frequency terminal 271 and the second high-frequency terminal 371 reach a conducting state.

[0157] Specifically, the second protrusion 312 of the second base 311 is inserted into the inner groove portion 312a of the first base 211, and Fig. 10B As shown, the contact portion 265a of the first terminal 261 protruding from the inner side surface of the first protrusion 213 into the inner groove portion 212a contacts the contact portion 365a of the second terminal 361 exposed on the outer side surface of the second protrusion 312. As a result, the conductive trace connected to the connection pad of the first substrate to which the tail of the first terminal 261 is connected and the conductive trace connected to the connection pad of the second substrate to which the tail of the second terminal 361 is connected are connected.

[0158] In addition, the first high-frequency terminal support portion 216 located in the fitting recess 212b is inserted into the first high-frequency terminal receiving recess 316c of the protruding end portion 322, and the contact portion 275a of the first high-frequency terminal 271 and the contact portion 375a of the second high-frequency terminal 371 contact each other, as shown in FIG. Fig. 10C As a result, the conductive trace connected to the connection pad of the first substrate to which the tail of the first high-frequency terminal 271 is connected is conductively connected to the conductive trace connected to the connection pad of the second substrate to which the tail of the second high-frequency terminal 371 is connected.

[0159] In addition, when the second shielding member 350 of the second connector 301 is inserted into the receiving portion 250d of the first shielding member 250 of the first connector 201, as shown in FIG. Fig. 10A and Fig. 10B As shown, the engaging protrusion 352c formed on the outer wall 352 of the second shielding member 350 engages and contacts the engaging recess 251c formed on the inner wall 251 of the first shielding member 250. Note that the straight portion 251a of the inner wall 251 forming the engaging recess 251c is separated from the other parts by the slit portions 253a at both ends of the straight portion 251a and is relatively flexible; the state of engaging with the engaging protrusion 352c of the outer wall 352 of the second shielding member 350 can be reliably maintained. As a result, the first shielding member 250 and the second shielding member 350 are locked and the release of the fitting state between the first connector 201 and the second connector 301 is prevented. In addition, the state in which the first shielding member 250 and the second shielding member 350 are in contact with each other can be maintained, and the equipotential can be maintained, thereby improving the electromagnetic shielding performance.

[0160] Furthermore, when the protruding end portion 322 is inserted into the fitting recess 212b, the contact portion 258c of the central portion 258 of the shield plate 256 that protrudes into the fitting recess 212b contacts the inner wall surface of the inner wall 351 of the second shielding member 350 that covers the protruding end portion 322, as shown in FIG. Fig. 10A In this manner, the contact between the contact portion 258c of the shielding plate 256 and the inner wall 351 of the second shielding member 350 is maintained, and a stable equipotential can be maintained and the shielding performance can be improved.

[0161] In this manner, the first high-frequency terminal 271 and the second high-frequency terminal 371 that are in contact with each other are continuously surrounded by the inner wall 251 and the outer wall 252 of the first shielding member 250 and the shielding plate 256 and the inner wall 351 and the outer wall 352 of the second shielding member 350 on the entire circumference and are in a double-surrounded state, thereby being shielded very effectively. Therefore, the impedance of the signal transmission path from the tail of the first high-frequency terminal 271 to the tail of the second high-frequency terminal 371 is stable, and a good SI characteristic can be obtained.

[0162] Note that the first and second shields 250 and 350 do not necessarily have to continuously surround the first and second connectors 201 and 301 without interruption and can be either substantially continuously surrounding the first and second connectors 201 and 301 or provide a degree of surrounding that is considered continuous.

[0163] In addition, as in the first embodiment, the extended surfaces of the surfaces of the first shield 250, the shield plate 256, and the second shield 350, which are all conductive members, have the plating layer 92 formed thereon. In addition, the configuration of the plating layer 92 formed on the extended surfaces of the surfaces of the first shield 250, the shield plate 256, and the second shield 350 is the same as in the first embodiment, and thus the description thereof is omitted.

[0164] In this manner, in the present embodiment, the lower end of the shielding plate 256 of the first connector 201 and the contact portion 258c are located on the same straight line extending in the mating direction, or the engaging protrusion 352c and the flange portion 354 and the inner wall 351 and the tail portion 351b of the second connector 301 are located on the same straight line extending in the mating direction. In addition, the first shielding member 250 is at least one shielding component surrounding the periphery of the first connector 201, and the second shielding member 350 is a shielding component surrounding the periphery of the second connector 301.

[0165] Note that the other aspects of the configuration and operation of the first connector 201 and the second connector 301 of this embodiment are the same as those of the first embodiment, and the description thereof will be omitted.

[0166] Furthermore, the disclosure herein describes features associated with suitable typical embodiments. After reading the disclosure herein, those skilled in the art will naturally think of various other embodiments, modifications and variations within the scope and spirit of the appended patent claims.

[0167] The present disclosure can be applicable to connectors as well as connector pairs.

Claims

1. A connector, comprising: Pedestal; as well as Conductive parts, in, The conductive component includes a main body, a substrate connecting portion located at one end of the main body, and a contact portion located at the other end of the main body. The main body, the substrate connection portion, and the contact portion each include an exposed surface exposed from the base. The main body, the substrate connection part, and the contact part each include a metal substrate and first to third layers formed on the metal substrate, and The first layer is a nickel or nickel alloy plating layer, the second layer is a platinum group metal or a platinum group metal alloy plating layer, the third layer is a gold or gold alloy plating layer, the second layer has a thickness of 2-200nm, and the third layer has a thickness of 0.2-15nm.

2. The connector according to claim 1, wherein: The thickness of the third layer is 0.5-8 nm.

3. The connector according to claim 1, wherein: The platinum group metal is palladium or a palladium alloy.

4. The connector according to claim 1, wherein: The first to third layers are formed on the extended surface of the conductive member.

5. The connector according to claim 1, wherein: The respective exposed surfaces are formed continuously to form one exposed surface.

6. The connector according to claim 1, wherein: The main body portion, the substrate connecting portion, and the contact portion are located on a same cross-sectional plane extending in the mating direction.

7. The connector according to claim 1, wherein: The substrate connection portion and the contact point portion are located on the same line extending in the mating direction.

8. The connector according to claim 1, wherein: The conductive member is a plate-shaped member, and the substrate connecting portion and the contact portion are formed on an extended surface of the plate-shaped member.

9. The connector according to claim 1, wherein: The substrate connection portion has a wider area than the contact portion.

10. The connector according to claim 1, wherein: The conductive member is a shielding member surrounding the circumference of the connector.

11. The connector according to claim 1, wherein: The conductive component is a power terminal or a signal terminal.

12. The connector according to claim 1, wherein: The conductive component is a reinforcing accessory.

13. A connector pair, comprising the connector according to claim 1 and a mating connector mated with the connector.

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