Optical interconnection structure based on optical chip

Abstract

The invention provides an optical interconnection structure based on an optical chip, and relates to the technical field of microwave photonics. The optical interconnection structure comprises an input optical fiber array used for inputting optical signals; the front-end optical chip is provided with a plurality of input ports and a plurality of output ports and is used for processing optical signals, and the input ports of the front-end optical chip are correspondingly connected with the input optical fiber array; one end of the interconnected optical fiber array is correspondingly connected with a plurality of output ports of the front-end optical chip, and the interconnected optical fiber array is used for transmitting the processed optical signals; the rear-end optical chip is provided with a plurality of input ports and a plurality of output ports and is used for carrying out secondary processing on the processed optical signals, and the input ports of the rear-end optical chip are correspondingly connected with one end, far away from the front-end optical chip, of the interconnected optical fiber array; and the output optical fiber array is correspondingly connected with a plurality of output ports of the rear-end optical chip and is used for outputting the secondarily processed optical signals.

Description

Technical Field

[0001] The present invention relates to the technical field of microwave photonics, and in particular to an optical interconnection structure based on an optical chip. Background Art

[0002] Integrated circuit-based electronic chip technology has become the cornerstone of the information society. In particular, the booming development of emerging industries such as artificial intelligence, autonomous driving, deep learning, and large-scale computing in recent years has rapidly increased the demand for real-time processing of massive amounts of information. Traditional electronic chips and interconnect technologies are limited by the resistance, capacitance, and time constants of copper wires, resulting in a rapid increase in power consumption with process technology advancements. Furthermore, crosstalk between electrical signals significantly restricts bandwidth expansion. Optical chips, as an emerging computing paradigm, have broken through the power and memory barriers of digital computing architectures. Their advantages of ultra-high bandwidth, low transmission loss, low latency, and low power consumption have led to rapid growth in recent years. Interconnected optical chip technology will play a key role in the construction of large-scale optical computers. Photonic information processing technology has emerged as a promising solution to overcome the bottlenecks faced by traditional von Neumann-based electronic computers. However, how to maximize the high bandwidth, low latency, and low power consumption of photonic information processing to enable optical chips to achieve sustained high-speed computing in the optical domain remains a pressing challenge. Summary of the Invention

[0003] In view of the above problems, the present invention provides an optical interconnection structure based on an optical chip.

[0004] According to the present invention, an optical interconnection structure based on an optical chip includes: an input optical fiber array for inputting optical signals; a front-end optical chip provided with multiple input ports and multiple output ports for processing optical signals, the multiple input ports of the front-end optical chip being correspondingly connected to the input optical fiber array; an interconnected optical fiber array, one end of which is correspondingly connected to the multiple output ports of the front-end optical chip for transmitting processed optical signals; a back-end optical chip provided with multiple input ports and multiple output ports for performing secondary processing on the processed optical signals, the input ports of the back-end optical chip being correspondingly connected to an end of the interconnected optical fiber array away from the front-end optical chip; and an output optical fiber array, which is correspondingly connected to the multiple output ports of the back-end optical chip for outputting the secondary processed optical signals.

[0005] According to an embodiment of the present invention, the interconnected optical fiber array includes a first interconnected optical fiber array and a second interconnected optical fiber array.

[0006] According to an embodiment of the present invention, a semiconductor optical amplifier array is provided between the first interconnected optical fiber array and the second interconnected optical fiber array for linearly amplifying the intensity of the optical signal processed by the front-end optical chip.

[0007] According to an embodiment of the present invention, an adjustable optical attenuator array is provided between the first interconnected optical fiber array and the second interconnected optical fiber array, for linearly reducing the intensity of the optical signal processed by the front-end optical chip.

[0008] According to an embodiment of the present invention, there are multiple front-end optical chips or multiple back-end optical chips, wherein the multiple front-end optical chips or the multiple back-end optical chips are connected in series.

[0009] According to an embodiment of the present invention, there are multiple front-end optical chips or multiple back-end optical chips, wherein the multiple front-end optical chips or the multiple back-end optical chips are connected in parallel.

[0010] According to an embodiment of the present invention, a beam splitting device is further provided between the first interconnected optical fiber array and the second interconnected optical fiber array, for splitting the optical signal processed by the front-end optical chip into multiple optical signals, so that the multiple optical signals can be processed secondary in multiple back-end optical chips.

[0011] According to an embodiment of the present invention, a beam combining device is further provided between the first interconnected optical fiber array and the second interconnected optical fiber array, for combining the optical signals processed by multiple front-end optical chips into one optical signal, so that the one optical signal can be processed secondary in one back-end optical chip.

[0012] According to an embodiment of the present invention, the type of optical fiber in the interconnected optical fiber array includes one of: a single-mode optical fiber, a multi-mode optical fiber, and an erbium-doped fiber amplifier.

[0013] According to an embodiment of the present invention, the type of the front-end optical chip or the back-end optical chip includes: an optical convolution operator based on a Mach-Zehnder interferometer, an optical convolution operator based on a microring filter, an optical convolution operator based on a multimode interference coupler, a convolution operator based on diffraction optics, a convolution operator based on interference optics, an optical convolution operator based on wavelength division multiplexing, and an optical convolution operator based on an adjustable optical attenuator.

[0014] According to the optical interconnection structure based on optical chips provided by the present invention, information transmission is achieved between optical chips through interconnected optical fibers. The optical signal enters the front-end optical chip through the input optical fiber array. After the front-end optical chip completes processing of the optical signal, it is transmitted to the back-end optical chip through the interconnected optical fiber array. The back-end optical chip processes the data again and outputs it through the output optical fiber array. Since the optical chips are directly optically interconnected, the requirements of chip computing power and bandwidth for large-scale model calculations can be better met. Compared with electrical interconnection, it maximizes the use of the large bandwidth, low latency, and low power consumption characteristics of photonic information processing, enabling optical chips to continuously achieve high-speed computing in the optical domain.

[0015] The optical interconnect structure based on optical chips provided by the present invention uses an SOA semiconductor optical amplifier array to linearly amplify the intensity of the optical signal processed by the front-end optical chip, thereby avoiding the attenuation of the light intensity after the optical chip is scaled up, and has the advantage of scale.

[0016] According to the optical chip-based optical interconnect structure provided by the present invention, an adjustable optical attenuator array is used to linearly reduce the intensity of the optical signal processed by the front-end optical chip, and the optical signal output by the front-end optical chip is weighted and then input into the back-end optical chip, thereby expanding the functionality of the optical interconnect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above contents and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0018] Figure 1 Schematically shows a structural diagram of an optical interconnect structure based on an optical chip according to a first embodiment of the present invention;

[0019] Figure 2 A schematic diagram of a second embodiment of an optical interconnect structure based on an optical chip according to an embodiment of the present invention is shown;

[0020] Figure 3 A schematic diagram of a structure of an optical interconnection structure based on an optical chip according to a third embodiment of the present invention is shown;

[0021] Figure 4 A schematic diagram of a fourth embodiment of an optical interconnect structure based on an optical chip according to an embodiment of the present invention is shown;

[0022] Figure 5 A schematic diagram shows a structure diagram of an optical interconnect structure based on an optical chip according to an embodiment of the present invention according to a beam splitting process in a fourth embodiment;

[0023] Figure 6 The structure diagram of the optical interconnect structure based on the optical chip according to the embodiment of the present invention according to the beam combining process in the fourth embodiment is schematically shown.

[0024] Reference numerals

[0025] 1- Input fiber array;

[0026] 2-Front-end optical chip;

[0027] 3-interconnected optical fiber array; 31-first interconnected optical fiber array; 32-second interconnected optical fiber array;

[0028] 4-Backend optical chip;

[0029] 5-output fiber array;

[0030] 6-SOA semiconductor optical amplifier array;

[0031] 7-Adjustable optical attenuator array;

[0032] 8-beam splitting / combining device; 81-beam splitting device; 82-beam combining device. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings. Obviously, the embodiments described are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. The terms used herein are only for describing specific embodiments and are not intended to limit the present invention. The terms "including", "comprising", etc. used herein indicate the existence of the features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

[0034] In the present invention, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to fixed or detachable connections, or integration; mechanical or electrical connections, or communication; direct or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0035] In the description of the present invention, it should be understood that the terms "longitudinal", "length", "circumferential", "front", "rear", "left", "right", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the subsystem or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0036] Throughout the drawings, identical elements are represented by identical or similar reference numerals. Conventional structures or configurations may be omitted when they may obscure the understanding of the present invention. Furthermore, the shapes, sizes, and positional relationships of components in the drawings do not reflect actual size, proportion, or actual positional relationships.

[0037] Similarly, in order to streamline the present invention and aid in understanding one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, the various features of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. Descriptions with reference to the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples" and the like mean that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in an appropriate manner.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the technical features being referred to. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0039] When expressions such as "at least one of A, B and C, etc." are used, they should generally be interpreted in accordance with the meaning of the expression commonly understood by those skilled in the art (for example, "a system having at least one of A, B and C" should include but is not limited to a system having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, C, etc.).

[0040] In the technical solution of the present invention, the collection, storage, use, processing, transmission, provision, disclosure and application of the data involved (including but not limited to user personal information) comply with the provisions of relevant laws and regulations, take necessary confidentiality measures, and do not violate public order and good morals.

[0041] Figure 1 The structure diagram of the optical interconnection structure based on the optical chip according to the first embodiment of the present invention is schematically shown.

[0042] like Figure 1 As shown, the optical chip-based optical interconnection structure of this embodiment includes: an input optical fiber array 1, a front-end optical chip 2, an interconnected optical fiber array 3, a back-end optical chip 4 and an output optical fiber array 5.

[0043] In this embodiment, an optical carrier is used to carry data and data operations are implemented in the front-end optical chip 2 and the back-end optical chip 4 .

[0044] The input optical fiber array 1 is used to input optical signals.

[0045] Seen from the direction shown in the figure, the front-end optical chip 2 and the back-end optical chip 4 are placed horizontally. The front-end optical chip 1 is provided with multiple input ports and multiple output ports for processing the optical signal. The multiple input ports of the front-end optical chip 1 are correspondingly connected to the input optical fiber array 1.

[0046] One end of the interconnected optical fiber array 3 is connected to a plurality of output ports of the front-end optical chip 2 for transmitting processed optical signals.

[0047] The back-end optical chip 4 is provided with multiple input ports and multiple output ports for secondary processing of the optical signal processed by the front-end optical chip 2. The input port of the back-end optical chip 4 is correspondingly connected to the end of the interconnected optical fiber array 3 away from the front-end optical chip 2.

[0048] The output optical fiber array 5 is correspondingly connected to the multiple output ports of the back-end optical chip 4 and is used to output the optical signal after secondary processing.

[0049] According to the optical interconnection structure based on optical chips provided by the present invention, information transmission is achieved between the front-end and back-end optical chips through the interconnected optical fiber array 3. The optical signal enters the front-end optical chip 2 through the input optical fiber array 1. After the front-end optical chip 2 completes processing of the optical signal, it is passed to the back-end optical chip 4 through the interconnected optical fiber array 3. After the back-end optical chip 4 processes the data again, it is output through the output optical fiber array 5. Since the front-end and back-end optical chips are directly optically interconnected, the requirements of chip computing power and bandwidth for large-scale model calculations can be better met. Compared with electrical interconnection, it maximizes the use of the characteristics of large bandwidth, low latency, and low power consumption of photon information processing, so that the optical chip can continuously achieve high-speed computing in the optical domain.

[0050] Figure 2 The structure diagram of the optical interconnection structure based on the optical chip according to the second embodiment of the present invention is schematically shown.

[0051] In this embodiment, the interconnected optical fiber array 3 includes a first interconnected optical fiber array 31 and a second interconnected optical fiber array 32, wherein an SOA semiconductor optical amplifier array 6 is provided between the first interconnected optical fiber array 31 and the second interconnected optical fiber array 32 for linearly amplifying the intensity of the optical signal processed by the front-end optical chip 2.

[0052] A semiconductor optical amplifier (SOA) uses a PN junction device with a strained quantum well structure. An external forward bias creates a population inversion, which causes stimulated radiation when external light enters, amplifying the optical signal. Its amplification characteristics depend primarily on the dielectric properties of the active layer and the characteristics of the laser cavity. SOAs offer the advantages of high speed, high bandwidth, low power consumption, high gain, miniaturization, and ease of integration.

[0053] According to the optical chip-based optical interconnection structure provided by the present invention, the SOA semiconductor optical amplifier array 6 is used to linearly amplify the intensity of the optical signal processed by the front-end optical chip 2, thereby avoiding the attenuation of the light intensity after the optical chip is scaled up, and having the advantage of scale.

[0054] Figure 3 The structure diagram of the optical interconnection structure based on the optical chip according to the third embodiment of the present invention is schematically shown.

[0055] In this embodiment, the interconnected optical fiber array 3 includes a first interconnected optical fiber array 31 and a second interconnected optical fiber array 32, wherein an adjustable optical attenuator array 7 is provided between the first interconnected optical fiber array 31 and the second interconnected optical fiber array 32 for linearly reducing the intensity of the optical signal processed by the front-end optical chip 2.

[0056] Variable Optical Attenuator (VOA) is an important optical passive component in fiber optic communications. It achieves real-time control of signals by attenuating the transmitted optical power.

[0057] According to the optical chip-based optical interconnection structure provided by the present invention, the optical signal intensity processed by the front-end optical chip 2 is linearly reduced by using an adjustable optical attenuator array 7, and the optical signal output by the front-end optical chip 2 is weighted and then input into the back-end optical chip 4, thereby expanding the functionality of the optical interconnection.

[0058] Figure 4 The structure diagram of the fourth embodiment of the optical interconnection structure based on the optical chip according to the embodiment of the present invention is schematically shown.

[0059] In this embodiment, a beam splitting / combining device 8 is further provided between the first interconnected optical fiber array 31 and the second interconnected optical fiber array 32 for performing beam splitting / combining processing on the input optical signal according to the wavelength.

[0060] The beam splitting device 81 splits the optical signal processed by the front-end optical chip 2 into multiple optical signals, so that the multiple optical signals can be processed secondary in multiple back-end optical chips 4 .

[0061] The beam combining device 82 combines the optical signals processed by the multiple front-end optical chips 2 into one optical signal beam, so that the optical signal beam can be processed secondary in one back-end optical chip 4 .

[0062] Figure 5 The structure of the optical interconnection structure based on the optical chip according to the embodiment of the present invention is schematically shown according to the beam splitting processing in the fourth embodiment.

[0063] In this embodiment, the beam splitting device 81 is arranged after the SOA semiconductor optical amplifier array 6, which splits the optical signal processed by the front-end optical chip 2 into multiple optical signals, so that the multiple optical signals can be secondary processed in multiple back-end optical chips 4.

[0064] Figure 6 The structure diagram of the optical interconnect structure based on the optical chip according to the embodiment of the present invention according to the beam combining process in the fourth embodiment is schematically shown.

[0065] In this embodiment, the beam combining device 82 is provided before the SOA semiconductor optical amplifier array 6 to combine the optical signals processed by the front-end optical chip 2 into one optical signal beam, so that the optical signal beam can be processed secondary in a back-end optical chip 4.

[0066] Based on the above embodiment, there may be multiple front-end optical chips 2 or multiple back-end optical chips 4, wherein the multiple front-end optical chips 2 or the multiple back-end optical chips 4 are connected in series.

[0067] Based on the above embodiment, there may be multiple front-end optical chips 2 or multiple back-end optical chips 4, wherein the multiple front-end optical chips 2 or the multiple back-end optical chips 4 are connected in parallel.

[0068] Based on the above embodiment, the type of optical fiber in the interconnected optical fiber array 3 includes: one of a single-mode optical fiber, a multi-mode optical fiber and an erbium-doped fiber amplifier.

[0069] Single-mode fiber (Single Mode Fiber) has a very thin central glass core (core diameter is generally 9 or 10μm), and there is only one transmission mode of fiber. The transmission loss and transmission dispersion of single-mode fiber are relatively small. The small transmission loss can make the signal transmit farther in the fiber, and the small transmission dispersion is conducive to the transmission of high-speed and large-capacity data. Therefore, in communication systems, especially large-capacity communication systems, most use single-mode fiber. Compared with multi-mode fiber, single-mode fiber can support longer transmission distances. In 100Mbps Ethernet and even 1G Gigabit Network, single-mode fiber can support transmission distances of more than 5000m.

[0070] Multimode fiber, defined as a fiber that transmits multiple modes at a given operating wavelength, is categorized as either step-index or graded-index based on its refractive index distribution. Common multimode fiber has a numerical aperture of 0.2±0.02 and a core diameter / outer diameter ratio of 50μm / 125μm. Its transmission parameters are bandwidth and loss. Because multimode fiber transmits hundreds of modes, each with different propagation constants and group velocities, it exhibits narrow bandwidth, high dispersion, and high loss, making it suitable only for short- to medium-distance, low-capacity fiber-optic communication systems. Multimode fiber allows different modes of light to be transmitted on a single fiber. Its larger core diameter allows for the use of less expensive couplers and connectors. The core diameter of multimode fiber ranges from 50μm to 100μm.

[0071] An erbium-doped fiber amplifier (EDFA, Erbium Doped Fiber Application Amplifier) ​​is an optical signal amplifier that has erbium ions (Er3+) doped into the fiber core through which the signal passes. Erbium-doped fiber is a quartz fiber doped with a small amount of erbium (Er) ions. It is the core of the erbium-doped fiber amplifier, a device that amplifies weak input optical signals without converting them into electrical signals.

[0072] Based on the above embodiments, the types of the front-end optical chip 2 or the back-end optical chip 4 include: an optical convolution operator based on a Mach-Zehnder interferometer, an optical convolution operator based on a microring filter, an optical convolution operator based on a multimode interference coupler, a convolution operator based on diffraction optics, a convolution operator based on interference optics, an optical convolution operator based on wavelength division multiplexing, and an optical convolution operator based on an adjustable optical attenuator.

[0073] In addition, the type of the front-end optical chip 2 or the back-end optical chip 4 may also include: an optical matrix operator based on a Mach-Zehnder interferometer, an optical matrix operator based on a microring filter, an optical matrix operator based on a multimode interference coupler, a matrix operator based on diffraction optics, a matrix operator based on interference optics, an optical matrix operator based on wavelength division multiplexing, and an optical matrix operator based on an adjustable optical attenuator.

[0074] A Mach-Zehnder interferometer is an interferometer that can be used to observe the relative phase shift changes caused by a light beam emitted from a single light source being split into two collimated beams and then passing through different paths and media.

[0075] Multimode interference coupler (MMI coupler) utilizes the principle of light self-imaging and has the advantages of compact structure, easy production, low loss, good production tolerance, and low polarization dependence.

[0076] In addition, it should be noted that the solutions in the above embodiments can be used in combination with each other in any manner. For example, the beam splitting device 81 can also be arranged after the adjustable optical attenuator array 7, the beam combining device 82 can also be arranged before the adjustable optical attenuator array 7, and so on.

[0077] According to the optical interconnection structure based on optical chips provided by the present invention, information transmission is achieved between the front-end and back-end optical chips through the interconnected optical fiber array 3. The optical signal enters the front-end optical chip 2 through the input optical fiber array 1. After the front-end optical chip 2 completes processing of the optical signal, it is passed to the back-end optical chip 4 through the interconnected optical fiber array 3. After the back-end optical chip 4 processes the data again, it is output through the output optical fiber array 5. Since the front-end and back-end optical chips are directly optically interconnected, the requirements of chip computing power and bandwidth for large-scale model calculations can be better met. Compared with electrical interconnection, it maximizes the use of the characteristics of large bandwidth, low latency, and low power consumption of photon information processing, so that the optical chip can continuously achieve high-speed computing in the optical domain.

[0078] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functions and operations that may be implemented according to the systems and methods of various embodiments of the present invention. In this regard, each box in the flowchart or block diagram can represent a module, program segment, or a part of code, and the above-mentioned module, program segment, or a part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram or flowchart, and the combination of boxes in the block diagram or flowchart, can be implemented with a dedicated hardware-based system that performs the specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0079] Those skilled in the art will appreciate that the features described in the various embodiments of the present invention may be combined and / or coupled in various ways, even if such combinations and / or couplings are not explicitly described in the present invention. In particular, the features described in the various embodiments of the present invention may be combined and / or coupled in various ways without departing from the spirit and teachings of the present invention. All such combinations and / or couplings fall within the scope of the present invention.

[0080] The above describes embodiments of the present invention. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of the present invention. Although each embodiment has been described separately above, this does not mean that the measures in each embodiment cannot be advantageously used in combination. Without departing from the scope of the present invention, those skilled in the art may make various substitutions and modifications, which should all fall within the scope of the present invention.

Claims

1. An optical interconnect structure based on an optical chip, characterized in that: include: An input optical fiber array, used for inputting optical signals; A front-end optical chip is provided with a plurality of input ports and a plurality of output ports for processing the optical signal, wherein the plurality of input ports of the front-end optical chip are correspondingly connected to the input optical fiber array; An interconnected optical fiber array, one end of which is connected to the multiple output ports of the front-end optical chip for transmitting processed optical signals; A back-end optical chip is provided with a plurality of input ports and a plurality of output ports for performing secondary processing on the processed optical signals, wherein the input ports of the back-end optical chip are correspondingly connected to an end of the interconnected optical fiber array away from the front-end optical chip; The output optical fiber array is connected to the multiple output ports of the back-end optical chip and is used to output the optical signal after secondary processing.

2. The optical interconnect structure based on an optical chip according to claim 1, characterized in that: The interconnected optical fiber array includes a first interconnected optical fiber array and a second interconnected optical fiber array.

3. The optical interconnect structure based on an optical chip according to claim 2, characterized in that: A semiconductor optical amplifier array is provided between the first interconnected optical fiber array and the second interconnected optical fiber array, for linearly amplifying the intensity of the optical signal processed by the front-end optical chip.

4. The optical interconnect structure based on an optical chip according to claim 2, characterized in that: An adjustable optical attenuator array is provided between the first interconnected optical fiber array and the second interconnected optical fiber array, for linearly reducing the intensity of the optical signal processed by the front-end optical chip.

5. The optical interconnect structure based on an optical chip according to claim 1, characterized in that: There are multiple front-end optical chips or multiple back-end optical chips, and the multiple front-end optical chips or the multiple back-end optical chips are connected in series.

6. The optical interconnect structure based on an optical chip according to claim 1, characterized in that: There are multiple front-end optical chips or multiple back-end optical chips, and the multiple front-end optical chips or the multiple back-end optical chips are connected in parallel.

7. The optical interconnect structure based on an optical chip according to claim 3, characterized in that: A beam splitter is also provided between the first interconnected optical fiber array and the second interconnected optical fiber array for splitting the optical signal processed by the front-end optical chip into multiple optical signals, so that the multiple optical signals can be processed secondary in multiple back-end optical chips.

8. The optical interconnect structure based on an optical chip according to claim 3, characterized in that: A beam combining device is also provided between the first interconnected optical fiber array and the second interconnected optical fiber array for combining optical signals processed by a plurality of front-end optical chips into one optical signal so that the one optical signal can be processed secondary in one back-end optical chip.

9. The optical interconnect structure based on an optical chip according to claim 1, characterized in that: The type of optical fiber in the interconnected optical fiber array includes: one of single-mode optical fiber, multi-mode optical fiber and erbium-doped optical fiber amplifier.

10. The optical interconnect structure based on an optical chip according to claim 1, characterized in that: The types of the front-end optical chip or the back-end optical chip include: an optical convolution operator based on a Mach-Zehnder interferometer, an optical convolution operator based on a microring filter, an optical convolution operator based on a multimode interference coupler, a convolution operator based on diffraction optics, a convolution operator based on interference optics, an optical convolution operator based on wavelength division multiplexing, and an optical convolution operator based on an adjustable optical attenuator.

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