A high-precision computer motherboard automatic patch processing device

Abstract

The present invention belongs to the technical field of computer motherboard production, and specifically relates to a high-precision computer motherboard automatic patch processing device, the high-precision computer motherboard automatic patch processing device comprises a motherboard transport platform, the motherboard transport platform is provided with a jacking component, the jacking component is provided with a coating component, one side of the coating component is provided with an activation unit, one side of the activation unit is provided with a patch module, and the end of the motherboard transport platform away from the patch module is provided with a cleaning component; the coating component comprises a scraper moving unit and a solder paste replenishing unit, the scraper moving unit drives the ratchet and the angle wheel to rotate through the movement of the telescopic plate, so that the movable extrusion plates on both sides move and drive the scraper to move, and through the squeezing action of the scraper, it passes through the small holes on the silk screen template and is coated on the specified position of the circuit board, and at the same time drives the activation unit to regulate the temperature of the solder paste, to ensure that the solder paste enters the patch module at a suitable temperature for patching.

Description

Technical Field

[0001] The present invention belongs to the technical field of computer mainboard production, and in particular relates to a high-precision computer mainboard automatic patch processing device. Background Art

[0002] Currently, solder paste coating for computer motherboards mostly relies on manual labor or multi-step automated processes. These methods are inefficient when processing large numbers of motherboards. Manual coating is not only time-consuming and labor-intensive, but coating quality is significantly affected by the operator's skill level. While multi-step automated processes have improved efficiency to a certain extent, the connection and waiting time between each step are still long, resulting in limited overall efficiency gains.

[0003] In response to several significant defects in the current computer motherboard solder paste coating process, especially the inefficiency caused by the commonly used manual coating or multi-step automated coating methods, and the displacement of the motherboard due to unstable fixation or improper operation during the coating process, this application has developed a new coating mechanism that can accurately coat the computer motherboard while controlling the solder paste temperature and solder paste replenishment, greatly improving production efficiency. Summary of the Invention

[0004] The object of the present invention is to provide a high-precision computer motherboard automatic patch processing device to solve the problems raised in the above background technology.

[0005] In order to solve the problems of the above technology, the present invention provides the following technical solutions: a high-precision computer motherboard automatic patch processing device, including a motherboard transportation platform, the motherboard transportation platform is provided with a lifting component, the lifting component is provided with a coating component, one side of the coating component is provided with an activation unit, one side of the activation unit is provided with a patch module, and the end of the motherboard transportation platform away from the patch module is provided with a cleaning component; the coating component is composed of a scraper moving unit and a solder paste replenishing unit, the scraper moving unit includes a telescopic plate and a baffle, and the distance between the telescopic plate and the baffle is adjusted to control the The ratchet wheel moves back and forth, rotating through the engagement of the block, which in turn drives the rotating rod, which in turn drives the angle wheel. The rotation of the angle wheel transmits motion to the sliding rods and moving rods on either side of the telescopic plate, causing them to mate with the circular grooves on the rods. This motion is ultimately transmitted to the extrusion rod and moving scraper. The scraper's squeezing action forces solder paste through the small holes in the silk screen stencil. The solder paste replenishment unit dynamically replenishes the solder paste, while the extrusion rod drives the activation unit to control the solder paste temperature. After the patch is completed, the cleaning assembly activates, driving the rotating rod and circular blade via a drive motor. The circular blade strikes the vibrating plate, shaking off excess solder paste from the motherboard. When a computer motherboard needs to be patched, the motherboard transport platform is activated, and the motherboard is transferred via a conveyor belt to the lifting assembly, which then lifts and secures the motherboard to be processed. The coating assembly activates, and the scraper moving unit drives the scraper back and forth across the silk screen stencil, applying solder paste to the motherboard. The solder paste replenishment unit simultaneously replenishes the solder paste in the scraper according to the travel of the scraper moving unit. It also drives the activation unit to control the temperature of the solder paste on the computer motherboard, so that it enters the patch module for processing at the optimal temperature. Finally, the computer motherboard with completed patching is transported to the cleaning component by the conveyor belt. The rotating rod drives the arc piece to move the vibration plate up and down to shake off the excess solder paste and other impurities on the computer motherboard, thereby improving production efficiency.

[0006] As a preferred solution, a telescopic plate is installed in the middle of the main board transport platform, and fixed blocks are provided on the front and rear sides of the telescopic plate, and wedge-shaped grooves are provided on the two fixed blocks, wherein a stop block and a moving rod are installed in the wedge-shaped groove, and a circular groove is provided on the side of the moving rod away from the wedge groove, and a spring groove is provided on the other side of the moving rod, and the spring groove and the telescopic plate are connected by a spring, and an angle wheel is rotatably installed at the center of the telescopic plate, and a rotating rod is installed through the center of the angle wheel, a ratchet is fixedly installed above the rotating rod, and a scraper is fixedly installed below the rotating rod, and a sliding rod is slidably installed at the coaxial position of the telescopic plate and the circular groove, and a spring rod and a contact circular rod are installed on the side of the sliding rod close to the angle wheel. When the lifting assembly is running, the telescopic plate starts to push the baffle, driving the ratchet to rotate, and the ratchet drives the angle wheel to rotate through the rotating rod. At this time, the angle wheel pushes the contact round rod on one side, and the contact round rod pushes the spring rod and the sliding rod toward the fixed block, so that the sliding rod is inserted into the circular groove. The sliding rod is used to drive the moving rod to slide in the wedge-shaped groove and squeeze the spring in the spring groove toward the baffle. At this time, the scraper follows the telescopic plate to move on the silk screen template. Through the extrusion action of the scraper, the solder paste passes through the small holes on the silk screen template and is evenly coated on the designated position of the computer motherboard. At the same time, the temperature of the solder paste is regulated by the extrusion rod driven by the moving rod.

[0007] As a preferred solution, the solder paste replenishing unit includes a solder paste tube, a clamping block, a short rod and a J-shaped rod; the J-shaped rod is fixedly installed on the fixed block on one side, and a clamping block is provided at the arc-shaped tail end of the J-shaped rod. The clamping block is rotatably installed on one end away from the J-shaped rod. The solder paste tube is arranged at the center of the ratchet and passes through the rotating rod to connect the scraper. Several small holes are provided on the scraper, and an induction switch is provided at the inner diameter of the angle wheel. When the contact round rod contacts the induction switch, the solder paste tube can replenish solder paste into the small holes of the scraper, so that the solder paste coating of the mainboard is more uniform. When the telescopic plate drives the scraper to move, it will also drive the ratchet to move synchronously. Under the limit of the J-shaped rod, the block will push the ratchet to rotate a certain angle. The ratchet drives the angle wheel to rotate through the rotating rod. At this time, the contact rods on both sides of the angle wheel will contact the inner diameter and outer diameter of the angle wheel respectively. When the contact rod contacts the inner diameter, the induction switch will be triggered, and the solder paste tube will replenish solder paste into the scraper. Because the rotation of the angle wheel is bound to the forward and return stroke of the telescopic plate, the solder paste can be replenished through the small holes on the scraper rod to ensure that the amount of solder paste passing through the small holes on the silk screen template is fixed, thereby achieving precise and quantitative coating.

[0008] As a preferred solution, the lifting assembly includes a telescopic rod and a negative pressure suction control plate. The telescopic rod is fixedly mounted below the middle portion of the motherboard transport platform, and the negative pressure suction control plate is fixedly mounted above the telescopic rod. After the computer motherboard is transported to the top of the lifting assembly via the motherboard transport platform, the telescopic rod is activated to position the negative pressure suction control plate below the computer motherboard. The negative pressure suction control plate firmly absorbs the computer motherboard to prevent displacement during the coating process and prevent coating misalignment. After coating is completed, the telescopic rod is retracted, and the negative pressure suction control plate places the computer motherboard in its initial position, after which it is transferred to the next processing step via a conveyor belt.

[0009] As a preferred solution, the activation unit includes an extrusion rod, an extrusion bin, an air bag, and an air pipe; an extrusion rod is fixedly installed on the side of the two moving rods facing away from the ratchet wheel, an extrusion bin is provided on the side of the fixed block close to the extrusion rod, an air bag is provided in the extrusion bin, the extrusion rod is fixedly connected to the air bag, the air bag input end is connected to the gas storage chamber, the two extrusion bins are connected by an air pipe, a plurality of rows of holes are evenly arranged on the air pipe, the air bag output end is connected to the air pipe, and a one-way valve is provided at both ends of the air pipe. When the moving rod moves, it drives the extrusion rod to exhaust and inhale the air bag in the extrusion bin. By providing two sets of extrusion bins, the gas with the appropriate temperature obtained through testing can be continuously blown to the solder paste on the computer motherboard through the rows of holes on the air pipe, ensuring that the solder paste enters the patch module at the most suitable temperature.

[0010] As a preferred embodiment, the cleaning assembly includes a rotating rod, arc-shaped pieces, a drive motor, and a vibrating plate. A vibrating plate is installed at the end of the motherboard transport platform away from the activation unit. Two sets of rotating rods are located below the vibrating plate, with multiple arc-shaped pieces evenly mounted on each set of rotating rods. A drive motor is installed at the input end of the rotating rod, and a transmission belt is provided between the output end of the drive motor and the input end of the rotating rod. After the computer motherboard is patched, it is transported to the cleaning assembly via a conveyor belt. The drive motor, via the two sets of rotating rods, drives the multiple arc-shaped pieces to continuously tap the vibrating plate, causing the plate to vibrate and shake off excess solder paste and other impurities on the computer motherboard.

[0011] As a preferred solution, the initial angles of the plurality of arc pieces are different, so that during the rotation process, there is always an arc piece in contact with the vibration plate, thereby ensuring the vibration and impurity removal effect.

[0012] As a preferred solution, the motherboard transport platform is provided with two rows of bars on both sides of the middle portion, with a silk screen template positioned above the rows of bars. When the computer motherboard is transferred to the middle portion of the motherboard transport platform, the rows of bars support the motherboard, preventing it from falling directly onto the lifting assembly. This also ensures the motherboard's position is accurate, preventing it from deviating from the standard hole position of the silk screen template after being lifted by the lifting assembly.

[0013] Compared with the prior art, the beneficial effects achieved by the present invention are: 1. A coating assembly is provided, which drives the ratchet and the angle wheel to rotate through the telescopic plate. When the angle wheel rotates and pushes the contact round rod on one side, the contact round rod pushes the spring rod and the sliding rod toward the fixed block, so that the sliding rod is inserted into the circular groove. The sliding rod is used to drive the moving rod to slide in the wedge-shaped groove and squeeze the spring in the spring groove toward the baffle. At this time, the scraper follows the telescopic plate to move on the silk screen template. Through the extrusion action of the scraper, the solder paste passes through the small holes on the silk screen template and is evenly coated on the designated position of the computer motherboard. At the same time, the temperature of the solder paste is regulated by the extrusion rod driven by the moving rod.

[0014] 2. A cleaning component is provided, which drives the two sets of rotating rods to rotate through the driving motor, and drives multiple arc pieces to continuously beat the vibration plate, so that the vibration plate vibrates to shake off the excess solder paste and other impurities on the computer motherboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0016] Figure 1 is a schematic structural diagram of an embodiment of the present invention from a first perspective;

[0017] Figure 2 is a schematic structural diagram of a second viewing angle of an embodiment of the present invention;

[0018] Figure 3 is a schematic structural diagram from a third viewing angle of an embodiment of the present invention;

[0019] Figure 4 is a schematic structural diagram of a fourth viewing angle of an embodiment of the present invention;

[0020] Figure 5 This is a schematic structural diagram of a coating assembly according to an embodiment of the present invention from a first perspective;

[0021] Figure 6 This is a schematic diagram of the partial structure of the coating assembly stopper according to an embodiment of the present invention;

[0022] Figure 7 This is a schematic diagram of the partial structure of a cleaning component according to an embodiment of the present invention;

[0023] Figure 8 2 is a schematic structural diagram of a coating assembly according to an embodiment of the present invention from a second viewing angle;

[0024] Figure: 1. Motherboard transport platform; 2. Lifting assembly; 201. Telescopic rod; 202. Negative pressure suction control plate; 3. Coating assembly; 301. Ratchet; 302. Baffle; 303. Rotating rod; 304. Angle wheel; 305. Telescopic plate; 306. Moving rod; 307. Circular groove; 308. Sliding rod; 310. Contact rod; 311. Solder paste tube; 312. Block; 313. Short rod; 314 , J-shaped rod; 315, fixed block; 316, wedge-shaped groove; 317, stop block; 318, spring; 319, scraper; 4, activation unit; 401, extrusion rod; 402, extrusion chamber; 403, airbag; 404, trachea; 5, patch module; 6, cleaning component; 601, rotating rod; 602, arc piece; 603, drive motor; 604, vibration plate; 7, sliding rod; 8, silk screen template. DETAILED DESCRIPTION

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] Example: Figure 1As shown, the high-precision computer motherboard automatic patch processing device includes a motherboard transportation platform 1, the motherboard transportation platform 1 is provided with a jacking component 2, the jacking component 2 is provided with a coating component 3, the coating component 3 is composed of a scraper moving unit 3-1 and a solder paste replenishing unit 3-2, the scraper moving unit 3-1 includes a telescopic plate 305 and a baffle 302, and the forward and backward movement of the ratchet 301 is controlled by adjusting the distance between the telescopic plate 305 and the baffle 302. The ratchet 301 is rotated by the cooperation of the clamping block 312, thereby driving the rotating rod 303 to drive the angle wheel 304 to rotate; the rotation of the angle wheel 304 The motion is then transferred to the sliding rods 308 and moving rods 306 on both sides of the telescopic plate 305, so that they dock with the circular grooves 307 on the rods, and finally the motion is transferred to the extrusion rods 401 and scrapers 319. The extrusion of the scrapers 319 allows the solder paste to pass through the small holes on the silk screen template 8. The solder paste can be dynamically replenished by the solder paste replenishing unit 3-2. At the same time, the extrusion rods 401 drive the activation unit 4 to control the temperature of the solder paste. After the patch is completed, the cleaning component is started, and the rotating rods 601 and the arc piece 602 are driven by the driving motor 603. The arc piece 602 hits the vibration plate 604 to shake off the excess solder paste on the motherboard. When the computer motherboard needs to be patched, the motherboard transport platform 1 is started, and the computer motherboard is transported to the lifting component 2 via the conveyor belt. At this time, the lifting component 2 lifts and fixes the computer motherboard to be processed. The coating assembly 3 is activated, and the scraper moving unit 3-1 drives the scraper 319 to move back and forth across the screen printing stencil 8, printing solder paste onto the computer motherboard. Simultaneously, the solder paste replenishing unit 3-2 uses the travel of the scraper moving unit 3-1 to replenish the solder paste within the scraper 319. This unit also drives the activation unit 4 to control the temperature of the solder paste on the computer motherboard, ensuring that it enters the SMT module 5 at the optimal temperature for processing. Finally, the SMT-finished computer motherboard is conveyed by a conveyor belt to the cleaning assembly 6. The rotating rod 601 drives the arc plate 602 to move, causing the vibrating plate 604 to reciprocate up and down, shaking off excess solder paste and other impurities on the computer motherboard, thereby improving production efficiency.

[0027] like Figures 1-6 Shown and Figure 8A telescopic plate 305 is installed in the middle of the mainboard transport platform 1, and a baffle 302 is provided on one side of the telescopic plate 305. Fixed blocks 315 are provided on the front and rear sides of the telescopic plate 305. A wedge-shaped groove 316 is provided on each of the two fixed blocks 315, wherein a baffle 317 and a moving rod 306 are installed in the wedge-shaped groove 316. A circular groove 307 is provided on the side of the moving rod 306 away from the wedge-shaped groove, and a spring groove is provided on the other side of the moving rod 306. The retractable plate 305 is connected by a spring 318. A corner wheel 304 is rotatably mounted at the center of the retractable plate 305. A rotating rod 303 is installed through the center of the corner wheel 304. A ratchet 301 is fixedly mounted above the rotating rod 303. A scraper 319 is fixedly mounted below the rotating rod 303. A sliding rod 308 is slidably mounted coaxially with the circular groove 307 on the retractable plate 305. A spring rod patch module and a contact rod 310 are installed on the side of the sliding rod 308 near the corner wheel 304. When the lifting assembly 2 is in operation, the retractable plate 305 activates the jacking baffle 302, driving the ratchet 301 to rotate. The ratchet 301 then drives the corner wheel 304 to rotate via the rotating rod 303. At this time, the angle wheel 304 pushes the contact round rod 310 on one side, and the contact round rod 310 pushes the spring rod patch module and the sliding rod 308 toward the fixed block 315, so that the sliding rod 308 is inserted into the circular groove 307. The sliding rod 308 drives the moving rod 306 to slide in the wedge-shaped groove 316 and squeezes the spring 318 in the spring groove toward the stop block 317. At this time, the scraper 319 follows the telescopic plate 305 to move on the silk screen template 8. Through the squeezing action of the scraper 319, the solder paste passes through the small holes on the silk screen template 8 and is evenly coated on the designated position of the computer motherboard. At the same time, the temperature of the solder paste is controlled by the extrusion rod 401 driven by the moving rod 306.

[0028] like Figure 2-Figure 6 Shown and Figure 8A J-shaped rod 314 is fixedly installed on the fixed block 315 on one side, and a clamping block 312 is provided at the arc-shaped tail end of the J-shaped rod 314. The clamping block 312 is rotatably installed on the end of the J-shaped rod 314 away from the J-shaped rod 314. The solder paste tube 311 is arranged at the center of the ratchet 301 and passes through the rotating rod 303 to connect the scraper 319. Several small holes are opened on the scraper 319, and an induction switch is provided at the inner diameter of the angle wheel 304. When the contact round rod 310 contacts the induction switch, the solder paste tube 311 can replenish solder paste into the small hole of the scraper 319, so that the solder paste coating of the motherboard is more uniform. When the telescopic plate 305 drives the scraper 319 to move, it will synchronously drive the ratchet 301 to move. The block 312 will push the ratchet 301 to rotate a certain angle under the limit of the J-shaped rod 314. The ratchet 301 drives the angle wheel 304 to rotate through the rotating rod 303. At this time, the contact rods 310 on both sides of the angle wheel 304 will contact the inner diameter and outer diameter of the angle wheel 304 respectively. When the contact rod 310 contacts the inner diameter, the induction switch will be triggered, and the solder paste tube 311 will replenish solder paste into the scraper 319. Because the rotation of the angle wheel 304 is bound to the forward and return stroke of the telescopic plate 305, the solder paste can be replenished through the small holes opened on the scraper 319 to ensure that the amount of solder paste passing through the small holes on the silk screen template 8 is fixed, thereby achieving precise and quantitative coating.

[0029] like Figure 4 and Figure 5 As shown, the lifting assembly 2 includes a telescopic rod 201 and a negative pressure suction control plate 202. The telescopic rod 201 is fixedly mounted below the middle portion of the motherboard transport platform 1, and the negative pressure suction control plate 202 is fixedly mounted above the telescopic rod 201. After the computer motherboard is transported to the top of the lifting assembly 2 via the motherboard transport platform 1, the telescopic rod 201 is activated to position the negative pressure suction control plate 202 below the computer motherboard. The negative pressure suction control plate 202 firmly absorbs the computer motherboard to prevent displacement during the coating process and prevent misalignment of the coating. After coating is completed, the telescopic rod 201 retracts, and the negative pressure suction control plate 202 places the computer motherboard in its initial position, after which it is transferred to the next processing step via a conveyor belt.

[0030] like Figure 2-Figure 3As shown, the activation unit 4 includes an extrusion rod 401, an extrusion bin 402, an air bag 403 and an air pipe 404; the two moving rods 306 are fixedly installed with an extrusion rod 401 on the side away from the ratchet 301, and the fixed block 315 is provided with an extrusion bin 402 on the side close to the extrusion rod 401, and an air bag 403 is provided in the extrusion bin 402, the extrusion rod 401 is fixedly connected to the air bag 403, the input end of the air bag 403 is connected to the gas storage chamber, the two extrusion bins 402 are connected through the air pipe 404, a number of rows of holes are evenly opened on the air pipe 404, the output end of the air bag 403 is connected to the air pipe 404, and a one-way valve is provided at both ends of the air pipe 404. When the moving rod 306 moves, it will drive the squeezing rod 401 to exhaust and inhale the air bag 403 in the squeezing chamber 402. By setting up two groups of squeezing chambers 402, the gas with suitable temperature obtained through testing can be continuously blown to the solder paste on the computer motherboard through the discharge holes on the air pipe 404, ensuring that the solder paste enters the patch module 5 at the most suitable temperature.

[0031] like Figure 2 and Figure 7 As shown, the cleaning assembly 6 includes a rotating rod 601, an arc piece 602, a driving motor 603 and a vibration plate 604; a vibration plate 604 is provided at the end of the motherboard transport platform 1 away from the activation unit 4, two groups of rotating rods 601 are provided below the vibration plate 604, and a plurality of arc pieces 602 are evenly mounted on the two groups of rotating rods 601, wherein the input end of the rotating rod 601 is provided with a driving motor 603, and a transmission belt is provided on the output end of the driving motor 603 and the input end of the rotating rod 601. When the computer motherboard is finished with the patch, it is transported to the cleaning assembly 6 via the conveyor belt. The driving motor 603 drives the plurality of arc pieces 602 through the two groups of rotating rods 601 to continuously beat the vibration plate 604, causing the vibration plate 604 to vibrate and shake off the excess solder paste and other impurities on the computer motherboard.

[0032] like Figure 7 As shown, the initial angles of the plurality of arc pieces 602 are different, so that there is always an arc piece 602 in contact with the vibration plate 604 during the rotation process, thereby ensuring the effect of vibration and impurity removal.

[0033] like Figure 3 As shown, the motherboard transport platform 1 is provided with two rows of bars 7 on both sides of the middle portion, and a silk screen template 8 is provided above the rows of bars 7. When the computer motherboard is transported to the middle portion of the motherboard transport platform 1, the rows of bars 7 support the computer motherboard to prevent it from falling directly onto the lifting assembly 2. At the same time, the accuracy of its position is also ensured to prevent the lifting assembly 2 from lifting the computer motherboard and deviating from the standard hole position of the silk screen template 8.

[0034] The working principle of the present invention is as follows: First, when it is necessary to patch the computer motherboard, the motherboard transport platform 1 is started, and the computer motherboard is transported to the lifting assembly 2 via the conveyor belt. At this time, the lifting assembly 2 lifts and fixes the computer motherboard to be processed. The coating assembly 3 is started, and the telescopic plate 305 starts to push the baffle 302, driving the ratchet 301 to rotate, and the ratchet 301 drives the angle wheel 304 to rotate through the rotating rod 303. At this time, the angle wheel 304 pushes the contact round rod 310 on one side, and the contact round rod 310 pushes the spring rod patch module and the sliding rod 308 toward the fixed block 315, so that the sliding rod 308 is inserted into the circular groove 307, and the sliding rod 308 is used to drive the moving rod 306 to slide in the wedge groove 316, and squeeze the spring 318 in the spring groove toward the stop block 317. At this time, the scraper 319 follows the telescopic plate 305 to move on the silk screen template 8. When the telescopic plate 305 drives the scraper 319 to move, it will also drive the ratchet 301 to move synchronously. The block 312, under the limit of the J-shaped rod 314, will push the ratchet 301 to rotate a certain angle, and the ratchet 301 will drive the angle wheel 304 to rotate through the rotating rod 303. At this time, the contact rods 310 on both sides of the angle wheel 304 will contact the inner diameter and outer diameter of the angle wheel 304 respectively. When the contact rods 310 contact the inner diameter, the induction switch will be triggered, and the solder paste tube 311 will replenish solder paste into the scraper 319. Because the rotation of the angle wheel 304 is bound to the forward and return strokes of the telescopic plate 305, solder paste can be replenished through the small holes opened on the scraper rod 319 to ensure that the amount of solder paste passing through the small holes on the silk screen template 8 is fixed, achieving precise and quantitative coating. The scraper 319 squeezes the solder paste through the small holes on the screen printing template 8 and is evenly coated on the designated position of the computer motherboard. At the same time, the moving rod 306 drives the squeezing rod 401 to control the temperature of the solder paste.

[0035] Secondly, when the moving rod 306 moves, it will drive the squeezing rod 401 to exhaust and inhale the air bag 403 in the squeezing chamber 402. By setting up two groups of squeezing chambers 402, the gas with suitable temperature obtained through testing can be continuously blown through the holes on the air pipe 404 to blow the solder paste on the computer motherboard, ensuring that the solder paste enters the patch module 5 at the most suitable temperature.

[0036] Finally, when the computer motherboard is finished with the patch, it is transported to the cleaning component 6 via the conveyor belt. The driving motor 603 drives multiple arc pieces 602 through two sets of rotating rods 601 to continuously beat the vibration plate 604, causing the vibration plate 604 to vibrate and shake off the excess solder paste and other impurities on the computer motherboard.

[0037] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A high-precision computer motherboard automatic patch processing device, characterized by: It comprises a motherboard transport platform, the motherboard transport platform is provided with a jacking component, the jacking component is provided on the coating component, a high-precision computer motherboard automatic patch processing device is provided on one side of the coating component, an activation unit is provided, a patch module is provided on one side of the activation unit, and a cleaning component is provided on the end of the motherboard transport platform away from the patch module; a telescopic plate is installed in the middle of the motherboard transport platform, a baffle is provided on one side of the telescopic plate, and fixed blocks are provided on the front and rear sides of the telescopic plate, and wedge-shaped grooves are provided on the two fixed blocks, wherein the wedge-shaped grooves are provided with baffles and moving rods, a circular groove is provided on the side of the moving rod away from the wedge-shaped groove, and a spring groove is provided on the other side of the moving rod, and the spring groove and the telescopic plate are connected by a spring The cam is fixedly mounted on the center of the telescopic plate, and a rotating rod is installed through the center of the corner wheel. A ratchet is fixedly installed above the rotating rod, and a scraper is fixedly installed below the rotating rod. The telescopic plate is slidably installed with a sliding rod coaxial with the circular groove, and a spring rod and a contact round rod are installed on one side of the sliding rod close to the corner wheel; a J-shaped rod is fixedly installed on the fixed block on one side, and a clamping block is provided at the arc-shaped tail end of the J-shaped rod, and a short rod is rotatably installed on one end of the clamping block away from the J-shaped rod. The solder paste tube is arranged at the center of the ratchet and passes through the rotating rod to connect the scraper, and a number of small holes are opened on the scraper, and an induction switch is provided at the inner diameter of the corner wheel. When the contact round rod contacts the induction switch, the solder paste tube can replenish solder paste into the small holes of the scraper, so that the solder paste coating of the mainboard is more uniform; The coating assembly is composed of a scraper moving unit and a solder paste replenishing unit. The scraper moving unit includes a telescopic plate and a baffle. By adjusting the distance between the telescopic plate and the baffle, the forward and backward movement of the ratchet is controlled. The ratchet is rotated by the cooperation of the clamping block, and then drives the rotating rod to drive the angle wheel to rotate; the rotation of the angle wheel transmits the motion to the sliding rod and the moving rod on both sides of the telescopic plate, so that they dock with the circular grooves provided on the rods, and finally transmits the motion to the extrusion rod and the moving scraper. The extrusion effect of the scraper is used to make the solder paste pass through the small holes on the silk screen template. The solder paste can be dynamically replenished through the solder paste replenishing unit. At the same time, the extrusion rod drives the activation unit to control the temperature of the solder paste. After the patch is completed, the cleaning component is started, and the rotating rod and arc piece are driven by the driving motor. The arc piece beats the vibration plate to shake off the excess solder paste on the motherboard.

2. A high-precision computer motherboard automatic patch processing device according to claim 1, characterized in that: The lifting assembly includes a telescopic rod and a negative pressure suction control plate. The telescopic rod is fixedly installed below the middle part of the mainboard transport platform, and the negative pressure suction control plate is fixedly installed above the telescopic rod.

3. A high-precision computer motherboard automatic patch processing device according to claim 2, characterized in that: The activation unit includes an extrusion rod, an extrusion bin, an air bag and an air tube; an extrusion rod is fixedly installed on the side of the two moving rods away from the ratchet, a extrusion bin is provided on the side of the fixed block close to the extrusion rod, an air bag is provided in the extrusion bin, the extrusion rod is fixedly connected to the air bag, the air bag input end is connected to the gas storage chamber, the two extrusion bins are connected by an air tube, a plurality of rows of holes are evenly opened on the air tube, the air bag output end is connected to the air tube, and a one-way valve is provided at both ends of the air tube.

4. The high-precision computer motherboard automatic patch processing device according to claim 3, characterized in that: The cleaning assembly includes a rotating rod, an arc piece, a driving motor and a vibration plate; a vibration plate is provided at the end of the mainboard transport platform away from the activation unit, two groups of rotating rods are provided under the vibration plate, and multiple arc pieces are evenly installed on the two groups of rotating rods, wherein the input end of the rotating rod is provided with a driving motor, and a transmission belt is provided on the output end of the driving motor and the input end of the rotating rod.

5. The high-precision computer motherboard automatic patch processing device according to claim 4, characterized in that: The initial angles of the plurality of arc segments are different.

6. The high-precision computer motherboard automatic patch processing device according to claim 1, characterized in that: Sliding rods are provided on both sides of the middle part of the mainboard transport platform, and a silk screen template is provided above the sliding rods.

Images