Monitoring management system of low-power-consumption computer chip

Abstract

The invention discloses a monitoring management system of a low-power-consumption computer chip, and relates to the technical field of chip monitoring, and the monitoring management system comprises a data acquisition module, a data processing and analysis module and a display and alarm module. Whether the production quality of the low-power-consumption computer chip meets the test requirement or not is judged, meanwhile, early warning is conducted on the production quality of the low-power-consumption computer chip, and after the production quality meets the test requirement, the low-power-consumption computer chip is tested and analyzed to obtain the test quality coefficient of the low-power-consumption computer chip; early warning is carried out on the test quality of the low-power-consumption computer chips, and meanwhile the low-power-consumption computer chips are graded and stored.

Description

Technical Field

[0001] The present invention relates to the technical field of chip monitoring, and in particular to a monitoring and management system for low-power computer chips. Background Art

[0002] In today's digital age, the number of computer devices is huge, and low-power chips can significantly reduce the overall power demand. Low-power chips enable computer systems to work stably under low power input, which helps to achieve green computing and reduce dependence on traditional high-energy consumption power grids. In some application scenarios with extremely high requirements for system stability, such as aerospace, industrial control, etc., low-power chips can better meet the needs. Therefore, it is particularly important to invent a monitoring and management system for low-power computer chips.

[0003] Prior art, such as the invention application patent with announcement number: CN118656973A, discloses a thermal management monitoring and control system for an interface chip. The application relates to the field of chip thermal management technology, including a thermal management platform, an information collection unit, a potential thermal impact unit, a thermal treatment evaluation unit, a status evaluation unit, a verification and analysis unit, and a management response unit. The application analyzes from the perspective of potential factors, which helps to provide a reasonable comparison curve for the subsequent thermal supervision analysis of the interface chip to improve the accuracy of the analysis results. Under the premise that the operating temperature of the interface chip is abnormal, analysis is performed from the two points of cooling and front-end energy transmission of the interface chip to determine whether the abnormal operating temperature of the interface chip is caused by the abnormal cooling and front-end energy transmission of the interface chip, so as to reasonably and targetedly manage the cooling and front-end energy transmission of the interface chip according to the information feedback, so as to improve the operating safety and stability of the interface chip, and at the same time help to reasonably monitor and control the operating temperature of the interface chip.

[0004] The existing technology also has the following shortcomings, which are specifically reflected in: 1. Most of the existing technologies monitor the operation of low-power computer chips, but do not pay much attention to the production process of low-power computer chips, which will lead to uneven thickness of the conductive film and the thickness of the film insulation. The uneven thickness of the conductive film will generate more energy loss during signal transmission and power supply, increase the dynamic power consumption of the chip, and the uneven thickness of the insulating film will increase the capacitance, resulting in increased charging and discharging power consumption of the chip during operation.

[0005] 2. Existing technologies do not pay much attention to the grading of low-power computer chips, which results in a mismatch between chip performance and device functional requirements during the device manufacturing process. The use of chips that do not meet the requirements reduces user experience and reduces user enthusiasm for low-power computer chip products, thereby reducing the market competitiveness of chip manufacturers and increasing the blindness of chip manufacturers' research and development and production. Summary of the invention

[0006] The object of the present invention is to provide a monitoring and management system for a low-power computer chip, which solves the problems existing in the background technology.

[0007] To solve the above technical problems, the present invention adopts the following technical solutions: The present invention provides a monitoring and management system for a low-power computer chip, including: a data acquisition module, which is used to obtain data during the production process of the low-power computer chip.

[0008] A data processing and analysis module extracts the data during the production process of the low-power computer chip, analyzes the production quality of the low-power computer chip, obtains a production quality evaluation index of the low-power computer chip, determines whether the production quality of the low-power computer chip meets the test requirements, and at the same time gives an early warning of the production quality of the low-power computer chip. If the production quality of the low-power computer chip meets the test requirements, then the low-power computer chip is tested, data during the test process of the low-power computer chip is obtained, the stability of the low-power computer chip is analyzed, the durability of the low-power computer chip is analyzed, and the test quality of the low-power computer chip is analyzed, obtaining a test quality coefficient of the low-power computer chip.

[0009] A display and warning module gives an early warning of the test quality of the low-power computer chip based on the test quality coefficient of the low-power computer chip, and at the same time classifies and stores the low-power computer chip.

[0010] Preferably, the analysis of the production quality of the low-power computer chip is as follows: The data during the production process of the low-power computer chip includes the thickness of the conductive film and the thickness of the insulating film of each low-power computer chip. Substitute the thickness of the conductive film and the thickness of the insulating film of each low-power computer chip used for production quality analysis into the expression to obtain the production quality evaluation index of each low-power computer chip used for production quality analysis. The calculation formula is where α m represents the production quality evaluation index of the m-th low-power computer chip used for production quality analysis, b m represents the thickness of the conductive film of the m-th low-power computer chip used for production quality analysis, c m represents the thickness of the insulating film of the m-th low-power computer chip used for production quality analysis, b' represents the preset thickness of the conductive film of the low-power computer chip, c' represents the preset thickness of the insulating film of the low-power computer chip, m represents the number of each low-power computer chip used for production quality analysis, m = 1, 2,..., n, n is a positive integer greater than 2, and e represents the natural constant.

[0011] Preferably, the method for determining whether the production quality of the low-power computer chip meets the test requirements is as follows: extract the production quality evaluation index of each low-power computer chip, and compare it with the preset production quality evaluation index of the low-power computer chip. If the production quality evaluation index of a low-power computer chip is lower than the preset production quality evaluation index of the low-power computer chip, it is determined that the low-power computer chip does not meet the test requirements. If the production quality evaluation index of a low-power computer chip is higher than the preset production quality evaluation index of the low-power computer chip, it is determined that the low-power computer chip meets the test requirements.

[0012] Preferably, the method for warning about the production quality of the low-power computer chip is as follows:

[0013] Statistically analyze the total number of samples of low-power computer chips used for production quality analysis, and count the number of low-power computer chips that meet the test requirements. Compare the number of low-power computer chips that meet the test requirements with the total number of samples of low-power computer chips used for production quality analysis to obtain the production quality pass rate of the low-power computer chips. Compare the production quality pass rate of the low-power computer chips with the preset production quality pass rate of the low-power computer chips. If the production quality pass rate of the low-power computer chips is lower than the preset production quality pass rate of the low-power computer chips, it is determined that the production quality of this batch of low-power computer chips is unqualified, and a warning is issued for the production quality of this batch of low-power computer chips. If the production quality pass rate of the low-power computer chips is higher than the preset production quality pass rate of the low-power computer chips, it is determined that the production quality of this batch of low-power computer chips is qualified.

[0014] Preferably, the method for analyzing the stability of the low-power computer chip is as follows:

[0015] Set the voltage fluctuation coefficients to perform voltage tests on the low-power computer chips, and collect the data during the voltage tests of the low-power computer chips. The data during the voltage tests of the low-power computer chips include the power consumption, working frequency, instruction execution rate, and cache hit rate of each low-power computer chip. Substitute the power consumption, working frequency, instruction execution rate, and cache hit rate of each low-power computer chip used for testing into the expression to obtain the stability index of each low-power computer chip used for testing. The calculation formula is: where β i represents the stability index of the i-th low-power computer chip used for testing, d i 、f i 、g i 、h irespectively represent the power consumption, operating frequency, instruction execution rate, and cache hit rate of the i-th low-power computer chip used in the voltage test. d′, f′, g′, and h′ respectively represent the preset power consumption, operating frequency, instruction execution rate, and cache hit rate of the low-power computer chip. i represents the number of each low-power computer chip used for testing, i = 1, 2,..., j, and j is a positive integer greater than 2.

[0016] Preferably, the durability of the low-power computer chip is analyzed as follows:

[0017] Collect the data during the durability test of the low-power computer chip. The data during the durability test of the low-power computer chip includes the power consumption, operating frequency, instruction execution rate, and cache hit rate of each low-power computer chip. Substitute the power consumption, operating frequency, instruction execution rate, and cache hit rate of each low-power computer chip used for testing into the expression to obtain the durability of each low-power computer chip used for testing. The calculation formula is: where χ i represents the durability of the i-th low-power computer chip used for testing, and d i ″, f i ″, g i ″, h i ″ respectively represent the power consumption, operating frequency, instruction execution rate, and cache hit rate of the i-th low-power computer chip used for testing during the durability test.

[0018] Preferably, the test quality of the low-power computer chip is analyzed as follows: Extract the stability index of each low-power computer chip used for testing and the durability of each low-power computer chip, and substitute them into the expression to obtain the test quality coefficient of each low-power computer chip used for testing. The calculation formula is: δ i =β i *γ 1 +χ i *γ 2 , where δ i represents the test quality coefficient of the i-th low-power computer chip used for testing, β i represents the stability index of the i-th low-power computer chip used for testing, χ i represents the durability of the i-th low-power computer chip used for testing, γ 1 and γ 2 respectively represent the voltage test weight factor and the durability test weight factor, γ 1 >0, γ 2 >0, γ 1 +γ 2 =1.

[0019] Preferably, the warning of the test quality of the low-power computer chip is as follows: The total number of samples of the low-power computer chips used for testing is counted, and the test quality coefficients of each sample low-power computer chip used for testing are extracted. They are respectively compared with the test quality coefficients of the preset standard low-power computer chips. If the test quality coefficient of a certain sample low-power computer chip used for testing is lower than the test quality coefficient of the preset standard low-power computer chip, it is determined that the test quality of the sample low-power computer chip used for testing is unqualified. The number of samples of the low-power computer chips with unqualified tests is counted and compared with the total number of samples of the low-power computer chips used for testing to obtain the unqualified rate of the samples of the low-power computer chips used for testing. The unqualified rate of the samples of the low-power computer chips used for testing is compared with the preset unqualified rate. If the unqualified rate of the samples of the low-power computer chips used for testing is higher than the preset unqualified rate, a warning is given for the test quality of this batch of low-power computer chips.

[0020] Preferably, the grading of the low-power computer chips is as follows: The test quality coefficients of each low-power computer chip used for testing are obtained and averaged. The calculation formula is: where μ represents the average test quality coefficient of this batch of low-power computer chips, j represents the number of each low-power computer chip used for testing. The average test quality coefficient of this batch of low-power computer chips is extracted and compared with the range of the test quality coefficients of the low-power computer chips corresponding to the grades of each low-power computer chip stored in the database. If the average test quality coefficient of this batch of low-power computer chips is within the range of the test quality coefficients of the low-power computer chips corresponding to a certain grade of the low-power computer chips stored in the database, the grade of the low-power computer chips corresponding to the range of the test quality coefficients is extracted and used as the grade of this batch of low-power computer chips.

[0021] Preferably, the storage of the low-power computer chips is as follows: The grade of the low-power computer chips is extracted, and the grades of the low-power computer chips corresponding to each storage method stored in the database are obtained. The grade of the low-power computer chips is compared with the grades of the low-power computer chips corresponding to each storage method stored in the database. If the grade of the low-power computer chips is consistent with the grade of the low-power computer chips corresponding to a certain storage method stored in the database, the storage method corresponding to the grade of the low-power computer chips is extracted and used as the storage method of this batch of low-power computer chips.

[0022] The beneficial effects of the present invention are as follows:

[0023] 1. In the present invention, the attention to the production process of low-power computer chips is increased, and the uniformity of the thickness of the conductive film and the insulating film is improved. The uniform conductive film can reduce the film resistance and the energy loss during signal transmission and power supply, thereby reducing the dynamic power consumption of the chip. The uniform insulating film reduces the capacitance and further reduces the charging and discharging power consumption of the chip during operation.

[0024] 2. In the present invention, the attention to the classification of low-power computer chips is increased. Consumers can select appropriate chips according to the specific functional requirements of the device, which improves the user experience, increases the enthusiasm of users for low-power computer chip products, and further increases the market competitiveness of chip manufacturers. At the same time, the accuracy of chip manufacturers' R & D and production is increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0026] Figure 1 It is a schematic diagram of the system structure connection of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0028] Refer to Figure 1 As shown, the present invention provides a monitoring and management system for low-power computer chips, including: a data acquisition module for acquiring data during the production process of low-power computer chips.

[0029] The data processing and analysis module extracts data during the production process of low-power computer chips, analyzes the production quality of low-power computer chips, obtains the production quality evaluation index of low-power computer chips, determines whether the production quality of low-power computer chips meets the test requirements, and at the same time issues a warning for the production quality of low-power computer chips. If the production quality of low-power computer chips meets the test requirements, then the low-power computer chips are tested, data during the testing process of the low-power computer chips is obtained, the stability of the low-power computer chips is analyzed, the durability of the low-power computer chips is analyzed, and the test quality of the low-power computer chips is analyzed to obtain the test quality coefficient of the low-power computer chips.

[0030] In a specific embodiment, the analysis of the production quality of low-power computer chips is as follows: The data during the production process of low-power computer chips includes the thickness of the conductive film and the thickness of the insulating film of each low-power computer chip. Substitute the thickness of the conductive film and the thickness of the insulating film of each low-power computer chip used for production quality analysis into the expression to obtain the production quality evaluation index of each low-power computer chip used for production quality analysis. The calculation formula where α m represents the production quality evaluation index of the m-th low-power computer chip used for production quality analysis, b m represents the thickness of the conductive film of the m-th low-power computer chip used for production quality analysis, c m represents the thickness of the insulating film of the m-th low-power computer chip used for production quality analysis, b′ represents the preset thickness of the conductive film of the low-power computer chip, c′ represents the preset thickness of the insulating film of the low-power computer chip, m represents the number of each low-power computer chip used for production quality analysis, m = 1, 2,..., n, n is a positive integer greater than 2, and e represents the natural constant.

[0031] It should be noted that the preset thicknesses of the conductive film and the insulating film of the low-power computer chip are set by professionals.

[0032] In the present invention, the attention to the production process of low-power computer chips is increased, and the uniformity of the thickness of the conductive film and the insulating film is improved. A uniform conductive film can reduce the film resistance and reduce the energy loss during signal transmission and power supply, thereby reducing the dynamic power consumption of the chip. A uniform insulating film reduces the capacitance and further reduces the charging and discharging power consumption of the chip during operation.

[0033] In a specific embodiment, to determine whether the production quality of the low-power computer chip meets the test requirements, the specific analysis method is as follows: Extract the production quality evaluation index of each low-power computer chip, and compare it with the preset production quality evaluation index of the low-power computer chip. If the production quality evaluation index of a certain low-power computer chip is lower than the preset production quality evaluation index of the low-power computer chip, it is determined that the low-power computer chip does not meet the test requirements. If the production quality evaluation index of a certain low-power computer chip is higher than the preset production quality evaluation index of the low-power computer chip, it is determined that the low-power computer chip meets the test requirements.

[0034] It should be noted that the preset production quality evaluation index of the low-power computer chip is set by professionals.

[0035] In a specific embodiment, to give a warning about the production quality of the low-power computer chip, the specific analysis method is as follows: Count the total number of samples of low-power computer chips used for production quality analysis, count the number of low-power computer chips that meet the test requirements, compare the number of low-power computer chips that meet the test requirements with the total number of samples of low-power computer chips used for production quality analysis to obtain the production quality pass rate of the low-power computer chip, and compare the production quality pass rate of the low-power computer chip with the preset production quality pass rate of the low-power computer chip. If the production quality pass rate of the low-power computer chip is lower than the preset production quality pass rate of the low-power computer chip, it is determined that the production quality of this batch of low-power computer chips is unqualified, and a warning is given about the production quality of this batch of low-power computer chips. If the production quality pass rate of the low-power computer chip is higher than the preset production quality pass rate of the low-power computer chip, it is determined that the production quality of this batch of low-power computer chips is qualified.

[0036] It should be noted that the preset production quality pass rate of the low-power computer chip is set by professionals.

[0037] In a specific embodiment, to analyze the stability of the low-power computer chip, the specific analysis method is as follows: Set each voltage fluctuation coefficient to perform a voltage test on the low-power computer chip, and collect the data during the voltage test of the low-power computer chip. The data during the voltage test of the low-power computer chip includes the power consumption, working frequency, instruction execution rate, and cache hit rate of each low-power computer chip. Substitute the power consumption, working frequency, instruction execution rate, and cache hit rate of each low-power computer chip used for testing into the expression to obtain the stability index of each low-power computer chip used for testing. The calculation formula is: where β i represents the stability index of the i-th low-power computer chip used for testing, di , f i , g i , h i respectively represent the power consumption, operating frequency, instruction execution rate, and cache hit rate of the i-th low-power computer chip used in the voltage test. d′, f′, g′, h′ respectively represent the power consumption, operating frequency, instruction execution rate, and cache hit rate of the preset low-power computer chip. i represents the number of each low-power computer chip used for testing, i = 1, 2,..., j, where j is a positive integer greater than 2. The voltage fluctuation coefficient represents the ratio of the peak-to-peak value of voltage fluctuation, that is, the difference between the maximum voltage and the minimum voltage, to the rated voltage or normal operating voltage over a period of time. A programmable variable power supply is used to set each voltage fluctuation coefficient, and this power supply can precisely control the amplitude and change pattern of the output voltage.

[0038] It should be noted that the power consumption of the low-power computer chip is obtained through a power analyzer, the operating frequency is obtained through an oscilloscope, and the instruction execution rate and cache hit rate are obtained through a performance counter. The power consumption, operating frequency, instruction execution rate, and cache hit rate of the preset low-power computer chip are set by professionals.

[0039] In a specific embodiment, the analysis of the durability of the low-power computer chip is as follows: Collect the data during the durability test of the low-power computer chip. The data during the durability test of the low-power computer chip includes the power consumption, operating frequency, instruction execution rate, and cache hit rate of each low-power computer chip. Substitute the power consumption, operating frequency, instruction execution rate, and cache hit rate of each low-power computer chip used for testing into the expression to obtain the durability of each low-power computer chip used for testing. The calculation formula is: where χ i represents the durability of the i-th low-power computer chip used for testing, and d i ″, f i ″, g i ″, h i ″ respectively represent the power consumption, operating frequency, instruction execution rate, and cache hit rate of the i-th low-power computer chip used for testing during the durability test.

[0040] It should be noted that the durability test is to keep the chip continuously powered on and running under normal indoor environmental temperature and stable power supply, and the test time can be several hundred hours or even thousands of hours.

[0041] In a specific embodiment, the analysis of the test quality of the low-power computer chip is as follows: Extract the stability index and durability of each low-power computer chip for testing, and substitute them into the expression to obtain the test quality coefficient of each low-power computer chip for testing. The calculation formula is: δ i = β i *γ 1 + χ i *γ 2 , where δ i represents the test quality coefficient of the i-th low-power computer chip for testing, β i represents the stability index of the i-th low-power computer chip for testing, χ i represents the durability of the i-th low-power computer chip for testing, γ 1 and γ 2 respectively represent the voltage test weight factor and the durability test weight factor, γ 1 > 0, γ 2 > 0, γ 1 + γ 2 = 1.

[0042] The display and warning module warns about the test quality of the low-power computer chip based on the test quality coefficient of the low-power computer chip, and at the same time classifies and stores the low-power computer chip.

[0043] In a specific embodiment, the warning about the test quality of the low-power computer chip is as follows: Count the total number of samples of the low-power computer chips for testing, extract the test quality coefficients of each sample low-power computer chip for testing, and compare them with the test quality coefficient of the preset standard low-power computer chip respectively. If the test quality coefficient of a certain sample low-power computer chip for testing is lower than the test quality coefficient of the preset standard low-power computer chip, it is determined that the test quality of the sample low-power computer chip for testing is unqualified. Count the number of samples of the low-power computer chips with unqualified tests, compare it with the total number of samples of the low-power computer chips for testing, obtain the unqualified rate of the samples of the low-power computer chips for testing, and compare the unqualified rate of the samples of the low-power computer chips for testing with the preset unqualified rate. If the unqualified rate of the samples of the low-power computer chips for testing is higher than the preset unqualified rate, a warning about the test quality of this batch of low-power computer chips is given.

[0044] It should be noted that the test quality coefficient of the preset standard low-power computer chip and the preset unqualified rate are set by professionals.

[0045] In a specific embodiment, the grading of the low-power computer chips is as follows. The specific analysis process is as follows: Obtain the test quality coefficients of each low-power computer chip for testing, and perform mean processing. The calculation formula is: where μ represents the average test quality coefficient of the low-power computer chips in this batch, j represents the number of each low-power computer chip for testing. Extract the average test quality coefficient of the low-power computer chips in this batch, and compare it with the range of test quality coefficients of the low-power computer chips corresponding to the grades of the low-power computer chips stored in the database. If the average test quality coefficient of the low-power computer chips in this batch is within the range of the test quality coefficients of the low-power computer chips corresponding to a certain grade of the low-power computer chips stored in the database, then extract the grade of the low-power computer chips corresponding to the range of the test quality coefficients, and use it as the grade of the low-power computer chips in this batch.

[0046] It should be noted that the range of test quality coefficients of the low-power computer chips corresponding to the grades of the low-power computer chips stored in the database is set by professionals.

[0047] In the present invention, the attention to the grading of the low-power computer chips is increased. Consumers can select appropriate chips according to the specific functional requirements of the device, which improves the user experience, increases the enthusiasm of users for low-power computer chip products, thereby increasing the market competitiveness of chip manufacturers, and at the same time increasing the accuracy of research and development and production of chip manufacturers.

[0048] In a specific embodiment, the storage of the low-power computer chips is as follows. The specific analysis process is as follows: Extract the grade of the low-power computer chips, obtain the grades of the low-power computer chips corresponding to each storage method stored in the database, and compare the grade of the low-power computer chips with the grades of the low-power computer chips corresponding to each storage method stored in the database. If the grade of the low-power computer chips is consistent with the grade of the low-power computer chips corresponding to a certain storage method stored in the database, then extract the storage method corresponding to the grade of the low-power computer chips, and use it as the storage method of the low-power computer chips in this batch.

[0049] It should be noted that the grades of the low-power computer chips corresponding to each storage method are set by professionals.

[0050] It should be noted that the present invention also includes a database, which mainly includes the thickness of the conductive film and the thickness of the insulating film of the preset low-power computer chip, the production quality evaluation index of the preset low-power computer chip, the production quality qualification rate of the preset low-power computer chip, the power consumption, operating frequency, instruction execution rate, and cache hit rate of the preset low-power computer chip, the test quality coefficient of the preset standard low-power computer chip, the preset unqualified rate, the range of the test quality coefficient of the low-power computer chip corresponding to each level of the low-power computer chip, and the level of the low-power computer chip corresponding to each storage method.

[0051] It should be noted that the data acquisition module is connected to the data processing and analysis module, the data processing and analysis module is connected to the display and alarm module, and the data processing and analysis module and the display and alarm module are both connected to the database.

[0052] The above content is only an example and explanation of the concept of the present invention. Those skilled in the art of the present technology can make various modifications or supplements to the described specific embodiments or use similar methods to replace them. As long as they do not deviate from the concept of the invention or exceed the scope defined by the present invention, they should all fall within the protection scope of the present invention.

Claims

1. A monitoring and management system for low-power computer chips, characterized in that: include: A data acquisition module for acquiring data during the production of low-power computer chips; A data processing and analysis module extracts data from the production process of low-power computer chips, analyzes the production quality of low-power computer chips, obtains a production quality evaluation index of low-power computer chips, determines whether the production quality of low-power computer chips meets the test requirements, and issues an early warning of the production quality of low-power computer chips. If the production quality of low-power computer chips meets the test requirements, the low-power computer chips are tested, data from the testing process of low-power computer chips are obtained, the stability of low-power computer chips is analyzed, the durability of low-power computer chips is analyzed, and the test quality of low-power computer chips is analyzed to obtain a test quality coefficient of low-power computer chips. The display and alarm module issues an early warning on the test quality of the low-power computer chip based on the test quality coefficient of the low-power computer chip, and also grades and stores the low-power computer chips.

2. A monitoring and management system for low-power computer chips according to claim 1, characterized in that: The production quality of low-power computer chips is analyzed, and the specific analysis process is as follows: The data in the production process of low-power computer chips include the thickness of the conductive film and the thickness of the insulating film of each low-power computer chip. The thickness of the conductive film and the thickness of the insulating film of each low-power computer chip used for production quality analysis are substituted into the expression to obtain the production quality evaluation index of each low-power computer chip used for production quality analysis. The calculation formula is: where α m represents the production quality assessment index of the mth low-power computer chip for production quality analysis, b m represents the thickness of the conductive film used for production quality analysis of the mth low-power computer chip, c m represents the thickness of the insulating film of the mth low-power computer chip used for production quality analysis, b′ represents the thickness of the conductive film of the preset low-power computer chip, c′ represents the thickness of the insulating film of the preset low-power computer chip, m represents the number of each low-power computer chip used for production quality analysis, m=1,2,...,n, n is a positive integer greater than 2, and e represents a natural constant.

3. A monitoring and management system for low-power computer chips according to claim 2, characterized in that: The specific analysis method for judging whether the production quality of the low-power computer chip meets the test requirements is as follows: The production quality assessment index of each low-power computer chip is extracted and compared with the production quality assessment index of the preset low-power computer chip. If the production quality assessment index of a low-power computer chip is lower than the production quality assessment index of the preset low-power computer chip, it is determined that the low-power computer chip does not meet the test requirements. If the production quality assessment index of a low-power computer chip is higher than the production quality assessment index of the preset low-power computer chip, it is determined that the low-power computer chip meets the test requirements.

4. A monitoring and management system for low-power computer chips according to claim 3, characterized in that: The specific analysis method for early warning of the production quality of low-power computer chips is as follows: The total number of samples of low-power computer chips used for production quality analysis is counted, the number of low-power computer chips that meet the test requirements is counted, the number of low-power computer chips that meet the test requirements is compared with the total number of samples of low-power computer chips used for production quality analysis to obtain the production quality pass rate of low-power computer chips, the production quality pass rate of low-power computer chips is compared with the preset production quality pass rate of low-power computer chips, if the production quality pass rate of low-power computer chips is lower than the preset production quality pass rate of low-power computer chips, then the production quality of this batch of low-power computer chips is determined to be unqualified, and an early warning is issued for the production quality of this batch of low-power computer chips; if the production quality pass rate of low-power computer chips is higher than the preset production quality pass rate of low-power computer chips, then the production quality of this batch of low-power computer chips is determined to be qualified.

5. A monitoring and management system for low-power computer chips according to claim 4, characterized in that: The stability of the low-power computer chip is analyzed, and the specific analysis method is as follows: The voltage fluctuation coefficients are set to perform voltage tests on low-power computer chips, and data during the voltage test of low-power computer chips is collected. The data during the voltage test of low-power computer chips includes the power consumption, operating frequency, instruction execution rate, and cache hit rate of each low-power computer chip. The power consumption, operating frequency, instruction execution rate, and cache hit rate of each low-power computer chip used for testing are brought into the expression to obtain the stability index of each low-power computer chip used for testing. The calculation formula is: where β i represents the stability index of the i-th low-power computer chip used for testing, d i 、f i , g i 、h i They respectively represent the power consumption, operating frequency, instruction execution rate, and cache hit rate of the i-th low-power computer chip used for testing during the voltage test. d′, f′, g′, and h′ respectively represent the power consumption, operating frequency, instruction execution rate, and cache hit rate of the preset low-power computer chip. i represents the number of each low-power computer chip used for testing. i=1,2,...,j, where j is a positive integer greater than 2.

6. A monitoring and management system for low-power computer chips according to claim 5, characterized in that: The durability of the low-power computer chip is analyzed, and the specific analysis process is as follows: Collect data during the endurance test of low-power computer chips. The data during the endurance test of low-power computer chips include the power consumption, operating frequency, instruction execution rate, and cache hit rate of each low-power computer chip. Substitute the power consumption, operating frequency, instruction execution rate, and cache hit rate of each low-power computer chip used for testing into the expression to obtain the endurance of each low-power computer chip used for testing. The calculation formula is: where χ i represents the durability of the i-th low-power computer chip used for testing, d i ″、f i ″、g i ″、h i ″ respectively represent the power consumption, operating frequency, instruction execution rate, and cache hit rate of the i-th low-power computer chip used for testing during the endurance test.

7. The monitoring and management system for low-power computer chips according to claim 1, characterized in that: The test quality of the low-power computer chip is analyzed, and the specific analysis process is as follows: Extract the stability index and durability of each low-power computer chip used for testing, and put them into the expression to obtain the test quality coefficient of each low-power computer chip used for testing. The calculation formula is: δ i =β i *γ1+χ i *γ2, where δ i represents the test quality factor of the i-th low-power computer chip used for testing, β i represents the stability index of the i-th low-power computer chip used for testing, χ i represents the endurance of the i-th low-power computer chip used for testing, γ1 and γ2 represent the voltage test weight factor and the endurance test weight factor respectively, γ1>0, γ2>0, γ1+γ2=1.

8. A monitoring and management system for low-power computer chips according to claim 7, characterized in that: The specific analysis process of the early warning of the test quality of the low-power computer chip is as follows: The total number of samples of low-power computer chips used for testing is counted, and the test quality coefficient of each sample low-power computer chip used for testing is extracted, and the test quality coefficients are compared with the preset test quality coefficients of standard low-power computer chips respectively; if the test quality coefficient of a sample low-power computer chip used for testing is lower than the test quality coefficient of the preset standard low-power computer chip, the test quality of the sample low-power computer chip used for testing is determined to be unqualified; the number of samples of low-power computer chips that fail the test is obtained by counting, and the unqualified rate of the samples of low-power computer chips used for testing is obtained by comparing it with the total number of samples of low-power computer chips used for testing; the unqualified rate of the samples of low-power computer chips used for testing is compared with the preset unqualified rate; if the unqualified rate of the samples of low-power computer chips used for testing is higher than the preset unqualified rate, an early warning is issued for the test quality of this batch of low-power computer chips.

9. A monitoring and management system for low-power computer chips according to claim 7, characterized in that: The specific analysis process of grading low-power computer chips is as follows: The test quality coefficient of each low-power computer chip used for testing is obtained and averaged. The calculation formula is: Wherein μ represents the average test quality coefficient of this batch of low-power computer chips, j represents the number of each low-power computer chip used for testing, the average test quality coefficient of this batch of low-power computer chips is extracted, and it is compared with the test quality coefficient range of low-power computer chips corresponding to the grade of each low-power computer chip stored in the database. If the average test quality coefficient of this batch of low-power computer chips is within the test quality coefficient range of low-power computer chips corresponding to the grade of a certain low-power computer chip stored in the database, then the grade of the low-power computer chip corresponding to the test quality coefficient range of the low-power computer chip is extracted and used as the grade of this batch of low-power computer chips.

10. A monitoring and management system for low-power computer chips according to claim 9, characterized in that: The specific analysis process of storing the low-power computer chip is as follows: Extract the level of the low-power computer chip, obtain the level of the low-power computer chip corresponding to each storage method stored in the database, compare the level of the low-power computer chip with the level of the low-power computer chip corresponding to each storage method stored in the database, if the level of the low-power computer chip is consistent with the level of the low-power computer chip corresponding to a certain storage method stored in the database, extract the storage method corresponding to the level of the low-power computer chip, and use it as the storage method of this batch of low-power computer chips.

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