Multi-physics field simulation method, device and equipment for large-current connecting piece and storage medium

Abstract

The invention discloses a multi-physics field simulation method, device and equipment for a large-current connecting piece and a storage medium, and discloses the multi-physics field simulation method for the large-current connecting piece, and the method comprises the steps: carrying out the dynamic simulation of a contact process through a dynamic simulation model of the large-current connecting piece, and determining a dynamic simulation result; and determining a first state geometric model of the large-current connecting piece and a contact pressure function of each contact surface according to a dynamic simulation result, and further performing multi-physics field coupling simulation on the large-current connecting piece in a contact state to obtain a multi-physics field simulation result. According to the mode, when force-electricity-heat multi-physical field joint simulation is carried out on the large-current connector contact element, dynamic simulation is carried out firstly, electrothermal coupling simulation in a contact state is carried out based on a simulation result, and the simulation process is disassembled, so that the convergence and stability of simulation calculation are improved; and reliable information is provided for subsequent design optimization of the large-current connecting piece.

Description

Technical Field

[0001] The present application relates to the field of simulation technology, and particularly to a multi-physical field simulation method, device, equipment and storage medium for high-current connectors. Background Art

[0002] In an electrical system, a high-current connector is one of the key devices, and its performance directly affects the efficiency and safety of the entire system. The structure of a high-current connector mainly consists of contact parts, insulators, housings, and accessories. In engineering, the contact parts of a high-current connector are in a complex multi-physical field, where the mechanical field, electric field, temperature field, etc. are coupled with each other and jointly affect the service performance of the high-current connector. When analyzing the working process of the contact parts of a high-current connector, traditional analysis methods include experiments and simulations: The experimental method usually requires a long time and resources; the simulation model needs to consider the complex multi-physical field coupling process. Traditional simulation methods couple all physical fields simultaneously, and the stability of the entire simulation process is poor, and it is very easy to diverge or converge slowly.

[0003] The above content is only used to assist in understanding the technical solution of the present application, and does not represent an admission that the above content is prior art. Summary of the Invention

[0004] The main purpose of the present application is to provide a multi-physical field simulation method, device, equipment and storage medium for high-current connectors, aiming to solve the technical problems of poor stability and convergence in the multi-physical field simulation of the contact parts of high-current connectors in the prior art.

[0005] To achieve the above object, the present application proposes a multi-physical field simulation method for high-current connectors, and the method includes:

[0006] Performing dynamic simulation on the contact process of the high-current connector through a dynamic simulation model of the high-current connector to determine the dynamic simulation result of the high-current connector during the contact process;

[0007] Determining a first-state geometric model of the high-current connector and a contact pressure function of each contact surface in the high-current connector according to the dynamic simulation result;

[0008] Performing multi-physical field coupling simulation on the high-current connector in the contact state according to the first-state geometric model and the contact pressure function of each contact surface to obtain the multi-physical field simulation result of the high-current connector.

[0009] In one embodiment, the step of determining a first-state geometric model of the high-current connector and a contact pressure function of each contact surface in the high-current connector according to the dynamic simulation result includes:

[0010] Determine the node coordinates of the contact surface in the high-current connector and the contact pressure of each contact pair in the high-current connector according to the kinetic simulation results;

[0011] Modify the geometric model of the second state according to the node coordinates of the contact surface to obtain the geometric model of the first state of the high-current connector;

[0012] Perform fitting according to the node coordinates of the contact surface and the contact pressure of each contact pair to determine the contact pressure function of each contact surface.

[0013] In one embodiment, the step of performing multi-physics field coupling simulation of the high-current connector in the contact state according to the geometric model of the first state and the contact pressure function of each contact surface to obtain the multi-physics field simulation results of the high-current connector includes:

[0014] Determine the contact pair information according to the contact pressure function of each contact surface and the material information of the high-current connector;

[0015] Establish a multi-physics field coupling simulation model of the high-current connector in the contact state according to the contact pair information, the coupling simulation boundary conditions, and the geometric model of the first state;

[0016] Perform multi-physics field coupling simulation according to the multi-physics field coupling simulation model to obtain the multi-physics field simulation results of the high-current connector.

[0017] In one embodiment, the step of determining the contact pair information according to the contact pressure function of each contact surface and the material information of the high-current connector includes:

[0018] Determine the conductivity, average height, average slope, and material hardness corresponding to the plating material in the high-current connector according to the material information of the high-current connector;

[0019] Perform shrinkage conductivity calculation according to the conductivity, the average height, the average slope, the material hardness, and the contact pressure function of each contact surface to determine the shrinkage conductivity of each contact pair;

[0020] Determine the contact resistance of each contact pair according to the shrinkage conductivity of each contact pair, and determine the contact pair information of the high-current connector according to the contact resistance of each contact pair.

[0021] In one embodiment, before the step of performing kinetic simulation on the contact process of the high-current connector through the kinetic simulation model of the high-current connector to determine the kinetic simulation results of the high-current connector in the contact process, it further includes:

[0022] Obtain the design dimensions and kinetic simulation boundary conditions of the high-current connector;

[0023] Construct the geometric model of the second state of the high-current connector according to the described design dimensions;

[0024] Establish the dynamic simulation model of the high-current connector according to the geometric model of the second state, the dynamic simulation boundary conditions and the displacement pairs of the high-current connector.

[0025] In one embodiment, after the step of performing the multi-physics field coupling simulation of the high-current connector in the contact state according to the geometric model of the first state and the contact pressure function of each contact surface to obtain the multi-physics field simulation results of the high-current connector, the method further includes:

[0026] Determine the temperature field distribution information and electrical performance parameters of the high-current connector in the contact state according to the multi-physics field simulation results of the high-current connector;

[0027] Perform performance evaluation of the high-current connector according to the temperature distribution information and the electrical performance parameters to obtain the performance evaluation results of the high-current connector;

[0028] When the performance evaluation result of the high-current connector is a preset qualified result, determine the target design parameters of the high-current connector according to the current material information of the high-current connector.

[0029] In one embodiment, after the step of performing the performance evaluation of the high-current connector according to the temperature distribution information and the electrical performance parameters to obtain the performance evaluation results of the high-current connector, the method further includes:

[0030] When the performance evaluation result of the high-current connector is not a preset qualified result, obtain the optimized plating material and the optimized plating thickness;

[0031] Update the current material information of the high-current connector according to the optimized plating material and the optimized plating thickness to obtain updated material information;

[0032] Based on the updated material information, perform the step of performing the multi-physics field coupling simulation of the high-current connector in the contact state according to the geometric model of the first state and the contact pressure function of each contact surface to obtain the multi-physics field simulation results of the high-current connector.

[0033] In addition, to achieve the above object, the present application also proposes a multi-physics field simulation device for a high-current connector. The multi-physics field simulation device for the high-current connector includes: a simulation module, configured to perform dynamic simulation on the contact process of the high-current connector through the dynamic simulation model of the high-current connector to determine the dynamic simulation results of the high-current connector in the contact process;

[0034] A processing module, configured to determine a first-state geometric model of the high-current connector and a contact pressure function of each contact surface in the high-current connector according to the dynamic simulation result;

[0035] The simulation module is further configured to perform a multi-physics field coupling simulation of the high-current connector in the contact state according to the first-state geometric model and the contact pressure function of each contact surface, so as to obtain a multi-physics field simulation result of the high-current connector.

[0036] In addition, to achieve the above object, the present application further provides a multi-physics field simulation device for a high-current connector, where the device includes: a memory, a processor, and a computer program stored on the memory and executable on the processor, and the computer program is configured to implement the steps of the multi-physics field simulation method for a high-current connector as described above.

[0037] In addition, to achieve the above object, the present application further provides a storage medium, where the storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium, and when the computer program is executed by a processor, the steps of the multi-physics field simulation method for a high-current connector as described above are implemented.

[0038] In addition, to achieve the above object, the present application further provides a computer program product, where the computer program product includes a computer program, and when the computer program is executed by a processor, the steps of the multi-physics field simulation method for a high-current connector as described above are implemented.

[0039] The present application provides a multi-physics field simulation method for a high-current connector. The present application performs a dynamic simulation on the contact process of the high-current connector through a dynamic simulation model of the high-current connector to determine a dynamic simulation result of the high-current connector in the contact process; determines a first-state geometric model of the high-current connector and a contact pressure function of each contact surface in the high-current connector according to the dynamic simulation result; performs a multi-physics field coupling simulation of the high-current connector in the contact state according to the first-state geometric model and the contact pressure function of each contact surface to obtain a multi-physics field simulation result of the high-current connector. By the above method, when performing a multi-physics field joint simulation of force - electricity - heat on the high-current connector contact, first perform a dynamic simulation on the high-current contact during the contact process, and perform an electro-thermal coupling simulation in the contact state based on the simulation result, disassembling the simulation process, improving the convergence and stability of the simulation calculation, providing reliable information for the subsequent design optimization of the high-current connector, reducing the product development cost, and shortening the development cycle. Description of the Drawings

[0040] The accompanying drawings here are incorporated into the description and form a part of this description, showing embodiments consistent with the present application and, together with the description, are used to explain the principles of the present application.

[0041] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the accompanying drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0042] Figure 1 It is a schematic flowchart provided for the first embodiment of the multi-physical field simulation method of the high-current connector of the present application;

[0043] Figure 2 It is a schematic diagram of the geometric model in the non-contact state provided for the first embodiment of the present application;

[0044] Figure 3 It is a schematic cross-sectional view in the non-contact state provided for the first embodiment of the present application;

[0045] Figure 4 It is a schematic cross-sectional view in the contact state provided for the first embodiment of the present application;

[0046] Figure 5 It is a schematic diagram of the contact pressure in the contact state provided for the first embodiment of the present application;

[0047] Figure 6 It is a schematic flowchart provided for the second embodiment of the multi-physical field simulation method of the high-current connector of the present application;

[0048] Figure 7 It is a schematic flowchart provided for the third embodiment of the multi-physical field simulation method of the high-current connector of the present application;

[0049] Figure 8 It is a schematic brief flowchart of the multi-physical field simulation method of the high-current connector provided for the third embodiment of the present application;

[0050] Figure 9 It is a schematic diagram of the residual convergence of the optimized simulation provided for the first embodiment of the present application;

[0051] Figure 10 It is a schematic diagram of the residual convergence of the traditional simulation provided for the first embodiment of the present application;

[0052] Figure 11 It is a schematic diagram of the module structure of the multi-physical field simulation device of the high-current connector for the embodiment of the present application;

[0053] Figure 12It is a schematic diagram of the device structure of the hardware operating environment involved in the multi-physical field simulation method of the high-current connector in the embodiment of the present application.

[0054] The implementation, functional features, and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. Specific embodiments

[0055] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of the present application and are not used to limit the present application.

[0056] To better understand the technical solutions of the present application, the following will be described in detail in combination with the accompanying drawings of the specification and specific embodiments.

[0057] The main solution of the embodiment of the present application is: performing dynamic simulation on the contact process of the high-current connector through the dynamic simulation model of the high-current connector to determine the dynamic simulation results of the high-current connector during the contact process; determining the first-state geometric model of the high-current connector and the contact pressure function of each contact surface in the high-current connector according to the dynamic simulation results; performing multi-physical field coupling simulation on the high-current connector in the contact state according to the first-state geometric model and the contact pressure function of each contact surface to obtain the multi-physical field simulation results of the high-current connector.

[0058] The structure of the high-current connector mainly consists of contact parts, insulators, housings, and accessories. Among them, the contact part is the core part for completing electrical connection, mainly including male terminals, female terminals, reed pieces, etc., and is responsible for realizing current transmission. In engineering, the contact parts of high-current connectors are in a complex multi-physical field, where the mechanical field, electric field, temperature field, etc. are coupled with each other, jointly affecting the service performance of high-current connectors, resulting in problems such as plugging loosening, poor contact, coating damage, cable heating, and reduced safety.

[0059] To better analyze the working process of the contact parts of high-current connectors, it is necessary to evaluate and predict the performance of the contact parts of high-current connectors more comprehensively and accurately. Traditional analysis methods include two types: experiments and simulations. The experimental method usually requires a long time and resources. In order to reduce the contact resistance, the surface of the contact parts of high-current connectors usually has a coating, and studying coatings of different materials and thicknesses further increases the time cost. The simulation model needs to consider the complex multi-physical field coupling process. Traditional simulation methods couple all physical fields at the same time, and the stability of the entire simulation process is poor, and it is very easy to diverge or converge slowly.

[0060] Among existing commercial simulation software, ANSYS software and COMSOL software can better achieve multi-field coupling. Among them, although the force, electrothermal field simulation of ANSYS software is highly stable, it lacks variable settings related to contact surface properties. After changing the coating material properties, there is no obvious difference in temperature rise. COMSOL has settings for contact surface properties, but the calculation convergence is very poor when coupling three physical fields simultaneously, and it takes a long time.

[0061] In this application, when performing a multi-physics field coupling simulation of the large-current connector contact, the dynamic simulation of the large-current contact during the contact process is first carried out, and the electrothermal coupling simulation under the contact state is carried out based on the simulation results. The simulation process is disassembled, which improves the convergence and stability of the simulation calculation, provides reliable information for the subsequent design optimization of the large-current connector, reduces the product development cost, and shortens the development cycle.

[0062] It should be noted that the execution subject of this embodiment can be a computing service device with data processing, network communication, and program running functions, such as a tablet computer, a personal computer, a mobile phone, etc., or an electronic device capable of implementing the above functions, a multi-physics field simulation device for large-current connectors, etc. Hereinafter, a multi-physics field simulation device for large-current connectors will be taken as an example to illustrate this embodiment and the following embodiments.

[0063] Based on this, the embodiment of this application provides a multi-physics field simulation method for large-current connectors, referring to Figure 1 , Figure 1 is a schematic flowchart of the first embodiment of the multi-physics field simulation method for large-current connectors of this application.

[0064] In this embodiment, the multi-physics field simulation method for large-current connectors includes steps S10 to S30:

[0065] Step S10, perform a dynamic simulation of the contact process of the large-current connector through the dynamic simulation model of the large-current connector, and determine the dynamic simulation results of the large-current connector during the contact process.

[0066] It should be noted that in this embodiment, the large-current connector refers to a large-current connector contact that needs to perform a multi-physics field coupling simulation of force, electricity, and heat, an electrical connection device or component that can carry a large current, such as a new energy charging plug or other large-current connectors. The dynamic simulation model is a numerical model established based on the three-dimensional geometric model of the large-current connector in the non-contact state and used to simulate the mechanical behavior during the contact process.

[0067] It can be understood that the three-dimensional geometric model in the non-contact state includes a male terminal, a female terminal, and a reed. At this time, the male terminal is not inserted into the female terminal at all. The three-dimensional geometric model in the non-contact state is as shown in Figure 2 . The numbers 1, 2, and 3 respectively refer to the female terminal, the reed, and the male terminal. The cross-sectional view in the non-contact state is as shown in Figure 3 .

[0068] In a specific implementation, after establishing the dynamic simulation model of the high-current connector, the dynamic simulation model of the high-current connector is used to simulate the contact process of the high-current connector. The contact process includes the dynamic process from the male terminal not being inserted into the female terminal at all to the male terminal being completely inserted into the female terminal, as well as the interaction between the two, such as the processes of frictional force and reed deformation. After the simulation is completed, a series of data regarding the contact process will be obtained, including but not limited to the change information of the node coordinates of the contact surface, the contact pressure distribution between each contact pair, the stress and strain conditions, etc. In this embodiment, the dynamic simulation results include but not limited to the change information of the node coordinates of the contact surface, the contact pressure distribution between each contact pair, the stress and strain conditions, etc. The contact pairs include: the bonded contact pair between the male terminal and the reed, and the frictional contact pair between the female terminal and the reed. Among them, the friction coefficient of the frictional contact pair is determined by the specific material. In this embodiment, the friction coefficient is set to 0.2, and it can also be adjusted according to actual needs.

[0069] The dynamic simulation process involved in this embodiment can be carried out through dynamic simulation software, such as ANSYS software, ABAQUS software, etc. ANSYS is a comprehensive engineering simulation software that provides a wide range of simulation functions and supports the analysis of multiple physical fields such as structural mechanics, fluid mechanics, heat conduction, electromagnetic fields, and acoustics. ABAQUS is a high-end finite element analysis software. ABAQUS is famous for its excellent nonlinear analysis ability and is particularly suitable for solving complex engineering problems, such as highly nonlinear material behavior, large deformations, contact problems, etc.

[0070] In a feasible implementation manner, before step S10, steps A11 to A13 may be included:

[0071] Step A11, obtaining the design dimensions and dynamic simulation boundary conditions of the high-current connector.

[0072] It should be noted that the design dimensions include several key parameters of the high-current connector, including but not limited to the length, width, thickness, and curvature radius of the male terminal, female terminal, and reed.

[0073] It can be understood that the dynamic simulation boundary conditions refer to the physical conditions that restrict the movement of components or apply external loads in dynamic simulation, including but not limited to that the male terminal housing is a fixed support, the base material is copper, the plating material and the plating thickness. For example, the plating material is silver and the plating thickness is 5 μm.

[0074] Step A12, construct the geometric model of the second state of the high-current connector according to the design dimensions.

[0075] It should be noted that the geometric model of the second state refers to the three-dimensional geometric model of the high-current connector in the non-contact state. When there are multiple contact holes in the high-current connector, select the largest contact in the connector, that is, a pair of power contacts (female terminal + reed + male terminal) with the largest size and the strongest current-carrying capacity among all conductive contact components.

[0076] It can be understood that a three-dimensional geometric model of the high-current connector in the non-contact state is established by using modeling software, laying a foundation for subsequent dynamic simulation and multi-physics field analysis, so as to obtain the geometric model of the second state of the high-current connector.

[0077] Step A13, establish the dynamic simulation model of the high-current connector according to the geometric model of the second state, the dynamic simulation boundary conditions and the displacement pair of the high-current connector.

[0078] It should be noted that the displacement pair refers to the constraint condition that defines the relative movement mode between components. In this embodiment, it is composed of the female terminal and the reed. After obtaining the geometric model of the second state, import the geometric model of the second state into the dynamic simulation software, and set the dynamic simulation boundary conditions, the bonded contact pair between the male terminal and the reed, the friction contact pair between the female terminal and the reed, and the displacement pair on the basis of the geometric model of the second state, so as to establish the dynamic simulation model of the high-current connector.

[0079] Step S20, determine the geometric model of the first state of the high-current connector and the contact pressure function of each contact surface in the high-current connector according to the dynamic simulation results.

[0080] It should be noted that the geometric model of the first state refers to the three-dimensional geometric model of the high-current connector in the contact state. At this time, the male terminal is completely inserted into the female terminal, and the cross-sectional view in the contact state is as Figure 4 shown.

[0081] It can be understood that, based on the node coordinates of the contact surface in the dynamic simulation results, the three-dimensional geometric model in the non-contact state is corrected to obtain the geometric model of the first state of the high-current connector. Based on the node coordinates of the contact surface and the contact pressure distribution between each contact pair in the dynamic simulation results, fitting is performed to obtain the contact pressure function corresponding to each contact surface. In this embodiment, there are two contact surfaces, namely the bonded contact surface between the reed and the male terminal, and the frictional contact surface between the reed and the female terminal.

[0082] In a feasible implementation manner, step S20 may include steps B11 to B13:

[0083] Step B11, determining the node coordinates of the contact surface in the high-current connector and the contact pressure of each contact pair in the high-current connector according to the dynamic simulation results.

[0084] It should be noted that during the dynamic simulation process, the contact surface will be discretized into multiple nodes. In the dynamic simulation results, the node coordinates of the contact surface refer to the final position coordinates of the discretized nodes after displacement under the action of force, reflecting the actual morphological changes of the contact surface.

[0085] It can be understood that the contact pressure of each contact pair in the high-current connector refers to the pressure values at each point on each contact surface, indicating the intensity of the interaction force between the contact pairs. The contact pressure nephogram is as Figure 5 shown. Information extraction is performed on the dynamic simulation results of the high-current connector to obtain the node coordinates of the contact surface in the high-current connector and the contact pressure of each contact pair.

[0086] Step B12, correcting the geometric model of the second state according to the node coordinates of the contact surface to obtain the geometric model of the first state of the high-current connector.

[0087] It should be noted that the node coordinates of the contact surface are used to replace the node coordinates in the geometric model of the second state, and the deformed geometric part in the three-dimensional geometric model in the non-contact state is corrected to obtain the geometric model of the first state. In this embodiment, the deformed geometric part is the reed part, and there may also be other parts, which are not limited in this embodiment.

[0088] Step B13, performing fitting according to the node coordinates of the contact surface and the contact pressure of each contact pair to determine the contact pressure function of each contact surface.

[0089] It should be noted that by using a data processing tool (such as Matlab) and selecting an appropriate fitting function, the node coordinates of the contact surface and the contact pressure of each contact pair are fitted, so that the contact pressure function P = f(x, y, z) of each contact surface can be obtained, where x, y, and z are the coordinate values of the nodes of the contact surface in the three directions of the coordinate axes respectively. In this embodiment, the specific calculation formula of the contact pressure function is: where z is the coordinate of the contact surface along the central axis of the reed, and a, b, and c are preset fitting parameters. In this embodiment, they are respectively 1.267e7, 6.451, and 0.9976, and can also be replaced according to actual needs. This embodiment does not limit this.

[0090] Step S30, perform multi-physics field coupling simulation of the high-current connector in the contact state according to the first-state geometric model and the contact pressure functions of each contact surface, and obtain the multi-physics field simulation results of the high-current connector.

[0091] It should be noted that in the multi-physics field coupling simulation software, by using the first-state geometric model and the contact pressure functions of each contact surface, a multi-physics field coupling simulation model of the high-current connector is established to realize the multi-physics field coupling simulation. In this embodiment, the multi-physics field coupling refers to the coupling of the electro-thermal physics field, and the multi-physics field simulation results include but are not limited to the temperature field distribution information, electrical performance parameters, and electro-thermal coupling effect data of the high-current connector in the contact state.

[0092] In this embodiment, the multi-physics field coupling simulation software can be COMSOL software, or other software can also be selected. This embodiment does not limit this. COMSOL software is a powerful multi-physics field simulation software, which is widely used in scientific research and engineering fields to simulate problems involving the interaction of various physical phenomena.

[0093] In specific implementation, taking a new energy charging gun as an example, in the actual work of the charging gun, most of the charging stage occurs when the pin is fully inserted into the jack, and the actual time of the plugging and unplugging process is very short. Therefore, in this embodiment, the calculation process of a single software (pin insertion → crown spring deformation → current loop formation → temperature rise) is disassembled into a combined simulation process of ANSYS (pin insertion → crown spring deformation) and COMSOL (current loop formation → temperature rise), thereby improving the convergence of the simulation calculation.

[0094] This embodiment provides a multi - physical - field simulation method for high - current connectors. In this embodiment, a dynamic simulation model of the high - current connector is used to perform a dynamic simulation on the contact process of the high - current connector to determine the dynamic simulation results during the contact process of the high - current connector; according to the dynamic simulation results, the first - state geometric model of the high - current connector and the contact pressure function of each contact surface in the high - current connector are determined; according to the first - state geometric model and the contact pressure function of each contact surface, a multi - physical - field coupling simulation of the high - current connector in the contact state is performed to obtain the multi - physical - field simulation results of the high - current connector. By the above method, when performing a multi - physical - field joint simulation of force - electricity - heat on the high - current connector contacts, first perform a dynamic simulation on the contact process of the high - current contacts, and perform an electro - thermal coupling simulation in the contact state based on the simulation results. Decompose the simulation process, which improves the convergence and stability of the simulation calculation, provides reliable information for the subsequent design optimization of the high - current connector, reduces the product development cost, and shortens the development cycle.

[0095] Based on the first embodiment of the present application, in the second embodiment of the present application, the same or similar content as in the above - mentioned first embodiment can be referred to the above introduction and will not be repeated hereinafter. On this basis, please refer to Figure 6 , step S30, the multi - physical - field simulation method of the high - current connector further includes steps S31 to S33:

[0096] Step S31, determine the contact pair information according to the contact pressure function of each contact surface and the material information of the high - current connector.

[0097] It should be noted that the material information includes but is not limited to the material quality, properties, and plating thickness of various materials used in the high - current connector, especially the properties of the plating material. The properties of the plating material include but are not limited to the conductivity, average roughness height, average roughness slope, and material hardness corresponding to the plating material.

[0098] It can be understood that the contact pair information includes but is not limited to the electrical contact pairs between the male terminals and the reeds, the electrical contact pairs between the female terminals and the reeds, the contact resistance of each contact pair, and the conductivity of each contact pair. The main parameters of the electrical contact pair are the contact resistance. Through the contact pressure function of each contact surface and the material information of the high - current connector, the contraction conductivity of the rough contact surface can be calculated, and thus the contact resistance of the electrical contact pair can be obtained.

[0099] In a feasible implementation manner, step S31 may include steps C11 to C13:

[0100] Step C11, determine the conductivity, average height, average slope, and material hardness corresponding to the plating material in the high - current connector according to the material information of the high - current connector.

[0101] It should be noted that for the material information, information extraction is carried out to determine the conductivity, average roughness height, average roughness slope, and material hardness corresponding to the plating material. If there is no plating material on one side of the contact surface of the contact pair, the conductivity corresponding to the material on that side needs to be obtained.

[0102] Step C12, calculate the contracted conductivity according to the conductivity, the average height, the average slope, the material hardness, and the contact pressure function of each contact surface, and determine the contracted conductivity of each contact pair.

[0103] It should be noted that for each contact pair, the contracted conductivity needs to be calculated to obtain the contracted conductivity of the contact pair. According to the Cooper-Mikic-Yovanovich relationship, the specific calculation formula for the contracted conductivity is where σ u and σ d are the conductivities of the materials on both sides of the contact surface respectively, σ asp is the average roughness height, m asp is the average roughness slope, H c is the material hardness of the softer material, and P is the contact pressure function of the contact surface.

[0104] Step C13, determine the contact resistance of each contact pair according to the contracted conductivity of each contact pair, and determine the contact pair information of the large current connector according to the contact resistance of each contact pair.

[0105] It should be noted that the contact resistance of each contact pair is determined by the contracted conductivity and geometric factors of each contact pair. Based on the contact resistance of each contact pair, the electrical contact pair can be obtained. After summarizing the relevant information, the contact pair information of the large current connector is obtained.

[0106] Step S32, establish a multi-physics field coupling simulation model of the large current connector in the contact state according to the contact pair information, the coupling simulation boundary conditions, and the first state geometric model.

[0107] It should be noted that the coupling simulation boundary conditions define the boundary conditions in the electro-thermal coupling simulation environment, including but not limited to the fixed support of the male terminal housing, the normal current density at the end of the female terminal, the grounding of the end of the male terminal, the plating material, the heat transfer coefficient, and the contact pressure function of each base surface. In this embodiment, the normal current density at the end of the female terminal is set to 250 A, the plating material is silver, and the heat transfer coefficient is 10 W / (K·m 2 ), which can also be adjusted according to requirements, and this embodiment does not limit this.

[0108] It can be understood that the contact pair information includes, but is not limited to, the electrical contact pairs between the male terminals and the reeds, the electrical contact pairs between the female terminals and the reeds, the contact resistances of the respective contact pairs, and the conductivities of the respective contact pairs. The geometric model in the first state is imported into the multi-physics coupling simulation software, and the contact pair information and the coupling simulation boundary conditions are set based on the geometric model in the first state, thereby establishing a multi-physics coupling simulation model of the high-current connector in the contact state for evaluating the comprehensive performance of the high-current connector. In this embodiment, the multi-physics coupling simulation model is specifically an electro-thermal coupling simulation model.

[0109] Step S33: Perform multi-physics coupling simulation according to the multi-physics coupling simulation model to obtain the multi-physics simulation results of the high-current connector.

[0110] It should be noted that in the multi-physics coupling simulation software, through the established multi-physics coupling simulation model, the full-coupling process of current conduction - Joule heat generation - temperature distribution - thermal stress feedback of the high-current connector under the actual working state is simulated, thereby obtaining multi-physics simulation results including, but not limited to, temperature field distribution information, electrical performance parameters, and electro-thermal coupling effect data. In this embodiment, the temperature field distribution information is the spatial temperature distribution data of the high-current connector obtained through electro-thermal coupling simulation under the actual working state, which reflects the temperature change process during the working process, and specifically includes the highest temperature value and its position, the temperature change rates of different parts, and the temperature curves varying with time or current, etc. The electrical performance parameters reflect the electrical characteristics of the high-current connector under the actual working state, including, but not limited to, contact resistance, current density distribution, and potential distribution, etc. The electro-thermal coupling effect data is used to quantify the interaction between electric energy and heat energy, including, but not limited to, Joule heat power density, material property degradation feedback, and thermal stress analysis, etc.

[0111] This embodiment provides a multi-physics simulation method for a high-current connector. In this embodiment, the contact pair information is determined according to the contact pressure function of each contact surface and the material information of the high-current connector; a multi-physics coupling simulation model of the high-current connector in the contact state is established according to the contact pair information, the coupling simulation boundary conditions, and the geometric model in the first state; and multi-physics coupling simulation is performed according to the multi-physics coupling simulation model to obtain the multi-physics simulation results of the high-current connector. By the above method, the accuracy of the multi-physics coupling simulation is ensured, and the simulation efficiency is improved at the same time.

[0112] Based on the first embodiment and / or the second embodiment of the present application, in the third embodiment of the present application, the same or similar content as that in the above-mentioned first embodiment and second embodiment can be referred to the above introduction and will not be repeated hereinafter. On this basis, please refer to Figure 7, after step S30, the multi-physical field simulation method of the high-current connector further includes steps S01 to S03:

[0113] Step S01, determine the temperature field distribution information and electrical performance parameters of the high-current connector in the contact state according to the multi-physical field simulation results of the high-current connector.

[0114] It should be noted that information extraction is performed on the multi-physical field simulation results of the high-current connector, so as to obtain the temperature field distribution information, electrical performance parameters and electro-thermal coupling effect data of the high-current connector in the contact state.

[0115] Step S02, perform performance evaluation on the high-current connector according to the temperature distribution information and the electrical performance parameters, and obtain the performance evaluation result of the high-current connector.

[0116] It should be noted that according to the temperature distribution information, determine whether the temperature distribution is within the safe operating range of the material, and based on the electrical performance parameters, determine whether the contact resistance is within the safe operating range of the material. If both the temperature distribution and the contact resistance are within the safe operating range of the material, then determine that the performance evaluation result of the high-current connector is a qualified result. If any one of the temperature distribution and the contact resistance is not within the safe operating range of the material, then determine that the performance evaluation result of the high-current connector is an unqualified result.

[0117] Step S03, when the performance evaluation result of the high-current connector is a preset qualified result, determine the target design parameters of the high-current connector according to the current material information of the high-current connector.

[0118] It should be noted that when the performance evaluation result of the high-current connector is a preset qualified result, it is determined that the design of the high-current connector is considered to meet all predetermined standards and requirements. At this time, the detailed information of all materials included in the current material information and the geometric design dimensions of the high-current connector can be used as the target design parameters of the high-current connector.

[0119] In a feasible implementation manner, after step S02, steps D11 to D13 can be included:

[0120] Step D11, when the performance evaluation result of the high-current connector is not a preset qualified result, obtain the optimized plating material and the optimized plating thickness.

[0121] Step D12, update the current material information of the high-current connector according to the optimized plating material and the optimized plating thickness, and obtain the updated material information.

[0122] It should be noted that when the performance evaluation result of the high-current connector is not the preset qualified result, or when the performance evaluation result of the high-current connector is the preset qualified result but design optimization is still required, the current plating material and plating thickness are adjusted to obtain an optimized plating material and an optimized plating thickness, and the information included in the current material information is updated using the optimized plating material and the optimized plating thickness to obtain updated material information.

[0123] Step D13: Based on the updated material information, perform multi-physics field coupling simulation of the high-current connector in the contact state according to the first-state geometric model and the contact pressure function of each contact surface to obtain the multi-physics field simulation result of the high-current connector.

[0124] It should be noted that during the dynamic simulation process, the contact pressure is mainly affected by material properties such as the overall elastic modulus and Poisson's ratio of the reed. The plating thickness can be ignored compared to the overall thickness of the reed. Therefore, the plating material has little effect on the mechanical properties of the contact. Thus, under the same base material, after obtaining the updated material information by only changing the plating material and the plating thickness, the step of performing multi-physics field coupling simulation of the high-current connector in the contact state according to the first-state geometric model and the contact pressure function of each contact surface to obtain the multi-physics field simulation result of the high-current connector is re-executed, and the electro-thermal coupling simulation calculation is repeated without repeating the dynamic simulation calculation process. By the above method, the calculation process under the same base material is simplified.

[0125] This embodiment provides a multi-physics field simulation method for a high-current connector. In this embodiment, the temperature field distribution information and electrical performance parameters of the high-current connector in the contact state are determined according to the multi-physics field simulation result of the high-current connector; the performance of the high-current connector is evaluated according to the temperature distribution information and the electrical performance parameters to obtain the performance evaluation result of the high-current connector; when the performance evaluation result of the high-current connector is the preset qualified result, the target design parameters of the high-current connector are determined according to the current material information of the high-current connector. Through the above steps, the reliability and safety of the product are ensured, the product development cost is reduced, and the development cycle is shortened.

[0126] Exemplarily, to help understand the implementation process of the multi-physics field simulation method for the high-current connector obtained by combining the above Embodiment 1 and Embodiment 2 in this embodiment, please refer to Figure 8 , Figure 8A schematic diagram of the brief process of a multi-physics field simulation method for high-current connectors is provided. Specifically: S1. Establish a geometric model and a dynamic simulation model of the non-contact state of the contact member of the high-current connector, conduct a dynamic analysis of the contact process of the contact member of the high-current connector, and export the dynamic simulation result data including the node coordinates of the contact surface and the contact pressure between the two contact pairs. S2. Process the dynamic simulation result data of the non-contact state of the contact member, establish a geometric model of the contact state of the contact member of the high-current connector, and fit to obtain the contact pressure distribution function of the contact surface of the reed. S3. Based on the geometric model of the contact state of the contact member and the contact pressure distribution function, establish an electro-thermal coupling simulation model of the contact member of the high-current connector to achieve a multi-physics field joint simulation of force - electricity - heat. S4. Change the plating material and plating thickness, and repeat the electro-thermal coupling simulation calculation in step S3, omitting the dynamic simulation calculation process.

[0127] Among them, the boundary conditions of the contact member dynamic simulation model include: the male terminal housing is fixedly supported, the base material, the plating material, and the plating thickness. The contact pairs include: the bonded contact pair between the male terminal and the reed and the frictional contact pair between the female terminal and the reed. Among them, the friction coefficient of the frictional contact pair is determined by the specific material. The moving pair consists of the female terminal and the reed.

[0128] The steps of establishing the geometric model of the contact state in S2 are specifically as follows: Replace the original node coordinates with the node coordinates of the contact surface, and correct the deformed geometric part in the geometric model of the non-contact state of the contact member of the high-current connector to obtain the geometric model of the contact state of the contact member of the high-current connector.

[0129] The boundary conditions during electro-thermal coupling are the contact surface contact pressure function, the male terminal housing is fixedly supported, the normal current density at the end of the female terminal, the male terminal end is grounded, the plating material, and the heat transfer coefficient. The contact pairs include: the electrical contact pairs between the male terminal and the reed and between the female terminal and the reed.

[0130] Through the joint simulation method of this embodiment, the calculation process under the same base material is simplified, and the stability and convergence of the calculation are significantly improved. Figure 9 This is the residual convergence graph for using the method of this embodiment. Figure 10 This is the residual convergence graph for the traditional force - electricity - heat physical field coupling simulation. The multi-physics field joint simulation method of the contact member of the high-current connector provided by this embodiment significantly improves the stability and convergence of the simulation calculation.

[0131] It should be noted that the above examples are only for understanding this application and do not constitute a limitation on the multi-physics field simulation method of the high-current connector of this application. Based on this technical concept, more forms of simple transformations are within the protection scope of this application.

[0132] The present application also provides a multi-physical field simulation device for a high-current connector. Please refer to Figure 11 The multi-physical field simulation device for the high-current connector includes:

[0133] A simulation module 10, configured to perform a dynamic simulation on the contact process of the high-current connector through a dynamic simulation model of the high-current connector, and determine the dynamic simulation results of the high-current connector during the contact process.

[0134] A processing module 20, configured to determine a first-state geometric model of the high-current connector and a contact pressure function of each contact surface in the high-current connector according to the dynamic simulation results.

[0135] The simulation module 10 is further configured to perform a multi-physical field coupling simulation on the high-current connector in the contact state according to the first-state geometric model and the contact pressure function of each contact surface, and obtain the multi-physical field simulation results of the high-current connector.

[0136] Optionally, the processing module 20 is further configured to:

[0137] Determine the node coordinates of the contact surface in the high-current connector and the contact pressure of each contact pair in the high-current connector according to the dynamic simulation results; correct a second-state geometric model according to the node coordinates of the contact surface to obtain the first-state geometric model of the high-current connector; perform fitting according to the node coordinates of the contact surface and the contact pressure of each contact pair to determine the contact pressure function of each contact surface.

[0138] Optionally, the simulation module 10 is further configured to:

[0139] Determine contact pair information according to the contact pressure function of each contact surface and the material information of the high-current connector; establish a multi-physical field coupling simulation model of the high-current connector in the contact state according to the contact pair information, the coupling simulation boundary conditions, and the first-state geometric model; perform a multi-physical field coupling simulation according to the multi-physical field coupling simulation model to obtain the multi-physical field simulation results of the high-current connector.

[0140] Optionally, the simulation module 10 is further configured to:

[0141] Determine the conductivity, average height, average slope, and material hardness of the plating material in the high-current connector according to the material information of the high-current connector; perform shrinkage conductivity calculation according to the conductivity, the average height, the average slope, the material hardness, and the contact pressure function of each contact surface to determine the shrinkage conductivity of each contact pair; determine the contact resistance of each contact pair according to the shrinkage conductivity of each contact pair, and determine the contact pair information of the high-current connector according to the contact resistance of each contact pair.

[0142] Optionally, the simulation module 10 is further configured to:

[0143] Obtain the design dimensions and dynamic simulation boundary conditions of the high-current connector; construct a geometric model of the second state of the high-current connector according to the design dimensions; establish a dynamic simulation model of the high-current connector according to the geometric model of the second state, the dynamic simulation boundary conditions, and the displacement pairs of the high-current connector.

[0144] Optionally, the simulation module 10 is further configured to:

[0145] Determine the temperature field distribution information and electrical performance parameters of the high-current connector in the contact state according to the multi-physical field simulation results of the high-current connector; perform performance evaluation of the high-current connector according to the temperature distribution information and the electrical performance parameters to obtain the performance evaluation result of the high-current connector; when the performance evaluation result of the high-current connector is a preset qualified result, determine the target design parameters of the high-current connector according to the current material information of the high-current connector.

[0146] Optionally, the simulation module 10 is further configured to:

[0147] When the performance evaluation result of the high-current connector is not a preset qualified result, obtain the optimized plating material and the optimized plating thickness; update the current material information of the high-current connector according to the optimized plating material and the optimized plating thickness to obtain the updated material information; based on the updated material information, perform multi-physical field coupling simulation of the high-current connector in the contact state according to the geometric model of the first state and the contact pressure function of each contact surface to obtain the multi-physical field simulation results of the high-current connector.

[0148] The multi-physical field simulation device for high-current connectors provided by this application adopts the multi-physical field simulation method for high-current connectors in the above-mentioned embodiment, and can solve the technical problems of poor stability and convergence in the multi-physical field simulation of high-current connector contacts in the prior art. Compared with the prior art, the beneficial effects of the multi-physical field simulation device for high-current connectors provided by this application are the same as those of the multi-physical field simulation method for high-current connectors provided by the above-mentioned embodiment, and other technical features in the multi-physical field simulation device for high-current connectors are the same as the features disclosed in the method of the above-mentioned embodiment, which will not be elaborated here.

[0149] This application provides a multi-physical field simulation device for high-current connectors. The multi-physical field simulation device for high-current connectors includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the multi-physical field simulation method for high-current connectors in the first embodiment above.

[0150] The following refers to Figure 12 , which shows a schematic structural diagram of a multi-physical field simulation device for high-current connectors suitable for implementing the embodiments of this application. The multi-physical field simulation device for high-current connectors in the embodiments of this application may include, but is not limited to, mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Descriptions), PMPs (Portable Media Players), in-vehicle terminals (such as in-vehicle navigation terminals), etc., and fixed terminals such as digital TVs, desktop computers, etc. Figure 12 The multi-physical field simulation device for high-current connectors shown is merely an example and should not impose any limitations on the functions and usage scope of the embodiments of this application.

[0151] As Figure 12As shown, the multi-physical field simulation device for high-current connectors may include a processing device 1001 (such as a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes according to the program stored in the read-only memory (ROM: Read Only Memory) 1002 or the program loaded from the storage device 1003 into the random access memory (RAM: Random Access Memory) 1004. In the RAM 1004, various programs and data required for the operation of the multi-physical field simulation device for high-current connectors are also stored. The processing device 1001, the ROM 1002, and the RAM 1004 are connected to each other through a bus 1005. An input / output (I / O) interface 1006 is also connected to the bus. Generally, the following systems may be connected to the I / O interface 1006: an input device 1007 including, for example, a touch screen, a touchpad, a keyboard, a mouse, an image sensor, a microphone, an accelerometer, a gyroscope, etc.; an output device 1008 including, for example, a liquid crystal display (LCD: Liquid Crystal Display), a speaker, a vibrator, etc.; a storage device 1003 including, for example, a magnetic tape, a hard disk, etc.; and a communication device 1009. The communication device 1009 can allow the multi-physical field simulation device for high-current connectors to communicate with other devices wirelessly or wiredly to exchange data. Although the figure shows a multi-physical field simulation device for high-current connectors having various systems, it should be understood that it is not required to implement or have all the shown systems. More or fewer systems may be implemented or had alternatively.

[0152] In particular, according to the embodiments disclosed in the present application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, the embodiments disclosed in the present application include a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program contains program codes for performing the methods shown in the flowcharts. In such an embodiment, the computer program can be downloaded and installed from the network through the communication device, or installed from the storage device 1003, or installed from the ROM 1002. When the computer program is executed by the processing device 1001, the above functions defined in the methods of the embodiments disclosed in the present application are executed.

[0153] The multi-physical field simulation device for high-current connectors provided by this application adopts the multi-physical field simulation method for high-current connectors in the above-mentioned embodiments, and can solve the technical problems of poor stability and convergence in the prior art when performing multi-physical field simulation on high-current connector contacts. Compared with the prior art, the beneficial effects of the multi-physical field simulation device for high-current connectors provided by this application are the same as those of the multi-physical field simulation method for high-current connectors provided in the above-mentioned embodiments, and other technical features in the multi-physical field simulation device for high-current connectors are the same as those disclosed in the method of the previous embodiment, and will not be elaborated here.

[0154] It should be understood that the various parts disclosed in this application can be implemented by hardware, software, firmware or a combination thereof. In the description of the above embodiments, specific features, structures, materials or characteristics can be combined in a suitable manner in any one or more embodiments or examples.

[0155] The above is only the specific implementation manner of this application, but the protection scope of this application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in this application, and all should be covered by the protection scope of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

[0156] This application provides a computer-readable storage medium with computer-readable program instructions (i.e., computer programs) stored thereon, and the computer-readable program instructions are used to execute the multi-physical field simulation method for high-current connectors in the above-mentioned embodiments.

[0157] The computer-readable storage medium provided by this application can be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or components, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: electrical connections with one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM) or flash memory, optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the above. In this embodiment, the computer-readable storage medium can be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, device, or component. The program code contained on the computer-readable storage medium can be transmitted using any appropriate medium, including but not limited to: wires, optical cables, RF (radio frequency), etc., or any suitable combination of the above.

[0158] The above computer-readable storage medium can be included in a multi-physics simulation device of a high-current connector; it can also exist independently and not be assembled into a multi-physics simulation device of a high-current connector.

[0159] The above computer-readable storage medium carries one or more programs. When the one or more programs are executed by a multi-physics simulation device of a high-current connector, the multi-physics simulation device of the high-current connector is caused to: perform a dynamic simulation of the contact process of the high-current connector through a dynamic simulation model of the high-current connector to determine the dynamic simulation results of the high-current connector during the contact process; determine the first-state geometric model of the high-current connector and the contact pressure function of each contact surface in the high-current connector according to the dynamic simulation results; perform a multi-physics coupling simulation of the high-current connector in the contact state according to the first-state geometric model and the contact pressure function of each contact surface to obtain the multi-physics simulation results of the high-current connector.

[0160] Computer program code for performing the operations of this application can be written in one or more programming languages or combinations thereof. The above-mentioned programming languages include object-oriented programming languages such as Java, Smalltalk, C++, and also include conventional procedural programming languages such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, executed as an independent software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer can be connected to the user's computer through any kind of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computer (for example, by connecting through the Internet using an Internet service provider).

[0161] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in the flowchart or block diagram may represent a module, a program segment, or a part of code that contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than that marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, as well as the combination of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.

[0162] The modules involved in the embodiments described in this application can be implemented in software or in hardware. Among them, the name of the module does not constitute a limitation on the unit itself in some cases.

[0163] The readable storage medium provided in this application is a computer-readable storage medium. The computer-readable storage medium stores computer-readable program instructions (i.e., computer programs) for performing the multi-physical field simulation method of the above-mentioned high-current connector, and can solve the technical problems of poor stability and convergence in the multi-physical field simulation of high-current connector contacts in the prior art. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided in this application are the same as those of the multi-physical field simulation method of the high-current connector provided in the above embodiments, and will not be elaborated here.

[0164] The present application also provides a computer program product, including a computer program, and when the computer program is executed by a processor, the steps of the multi-physical field simulation method of the high-current connector as described above are implemented.

[0165] The computer program product provided by the present application can solve the technical problems of poor stability and convergence in the multi-physical field simulation of the contact of the high-current connector in the prior art. Compared with the prior art, the beneficial effects of the computer program product provided by the present application are the same as those of the multi-physical field simulation method of the high-current connector provided in the above embodiments, and will not be elaborated here.

[0166] The above are only partial embodiments of the present application, and do not limit the patent scope of the present application accordingly. Any equivalent structural transformation made under the technical concept of the present application by using the content of the specification and drawings of the present application, or direct / indirect application in other related technical fields, is included in the patent protection scope of the present application.

Claims

1. A multi-physics field simulation method for a high current connector, characterized in that: The method comprises: Performing dynamic simulation on the contact process of the high-current connector through a dynamic simulation model of the high-current connector to determine the dynamic simulation result of the high-current connector during the contact process; Determine a first state geometric model of the high current connector and a contact pressure function of each contact surface in the high current connector according to the dynamic simulation result; A multi-physical field coupling simulation of the high-current connector in the contact state is performed according to the first state geometric model and the contact pressure function of each contact surface to obtain a multi-physical field simulation result of the high-current connector.

2. The method according to claim 1, characterized in that The step of determining the first state geometric model of the high current connector and the contact pressure function of each contact surface in the high current connector according to the dynamic simulation result comprises: Determining the node coordinates of the contact surface in the high-current connector and the contact pressure of each contact pair in the high-current connector according to the dynamic simulation results; Correcting the second state geometric model according to the node coordinates of the contact surface to obtain the first state geometric model of the high current connector; Fitting is performed based on the node coordinates of the contact surface and the contact pressure of each contact pair to determine the contact pressure function of each contact surface.

3. The method according to claim 1, characterized in that The step of performing a multi-physical field coupling simulation of the high-current connector in a contact state according to the first state geometric model and the contact pressure function of each contact surface to obtain a multi-physical field simulation result of the high-current connector comprises: Determining contact pair information according to a contact pressure function of each contact surface and material information of the high current connection piece; Establishing a multi-physics field coupling simulation model of a high-current connector in a contact state according to the contact pair information, the coupling simulation boundary conditions and the first state geometric model; A multi-physical field coupling simulation is performed according to the multi-physical field coupling simulation model to obtain a multi-physical field simulation result of the high-current connector.

4. The method according to claim 3, characterized in that The step of determining the contact pair information according to the contact pressure function of each contact surface and the material information of the high current connection member comprises: Determining the conductivity, average height, average slope and material hardness corresponding to the plating material in the high-current connector according to the material information of the high-current connector; Calculating the shrinkage conductivity according to the conductivity, the average height, the average slope, the material hardness, and the contact pressure function of each contact surface to determine the shrinkage conductivity of each contact pair; The contact resistance of each contact pair is determined according to the contraction conductivity of each contact pair, and the contact pair information of the high-current connector is determined according to the contact resistance of each contact pair.

5. The method according to any one of claims 1 to 4, characterized in that Before the step of performing dynamic simulation on the contact process of the high-current connector by using the dynamic simulation model of the high-current connector to determine the dynamic simulation result of the high-current connector during the contact process, the method further includes: Obtaining the design dimensions and dynamic simulation boundary conditions of the high-current connector; Constructing a second state geometric model of the high current connecting piece according to the design dimensions; A dynamic simulation model of the high-current connecting member is established according to the second state geometric model, the dynamic simulation boundary conditions and the displacement pair of the high-current connecting member.

6. The method according to any one of claims 1 to 4, characterized in that After the step of performing a multi-physics field coupling simulation of the high-current connector in the contact state according to the first state geometric model and the contact pressure function of each contact surface to obtain a multi-physics field simulation result of the high-current connector, the method further includes: Determining temperature field distribution information and electrical performance parameters of the high-current connector in a contact state according to a multi-physics field simulation result of the high-current connector; Performing a performance evaluation of the high-current connector according to the temperature distribution information and the electrical performance parameters to obtain a performance evaluation result of the high-current connector; When the performance evaluation result of the high-current connecting component is a preset qualified result, the target design parameters of the high-current connecting component are determined according to the current material information of the high-current connecting component.

7. The method according to claim 6, characterized in that After the step of performing performance evaluation of the high current connector according to the temperature distribution information and the electrical performance parameters to obtain the performance evaluation result of the high current connector, the method further includes: When the performance evaluation result of the high-current connector is not a preset qualified result, obtaining an optimized coating material and an optimized coating thickness; Updating the current material information of the high-current connector according to the optimized coating material and the optimized coating thickness to obtain updated material information; The step of performing a multi-physics field coupling simulation of the high-current connector in a contact state according to the first state geometric model and the contact pressure function of each contact surface based on the updated material information to obtain a multi-physics field simulation result of the high-current connector.

8. A multi-physics field simulation device for a high current connector, characterized in that: The multi-physics field simulation device of the high current connector comprises: A simulation module, used to perform dynamic simulation on the contact process of the high-current connector through a dynamic simulation model of the high-current connector, and determine the dynamic simulation result of the high-current connector during the contact process; A processing module, used for determining a first state geometric model of the high current connector and a contact pressure function of each contact surface in the high current connector according to the dynamic simulation result; The simulation module is further used to perform a multi-physical field coupling simulation of the high-current connector in a contact state according to the first state geometric model and the contact pressure function of each contact surface, so as to obtain a multi-physical field simulation result of the high-current connector.

9. A multi-physics field simulation device for a high current connector, characterized in that: The device comprises: a memory, a processor, and a multi-physics field simulation program for high-current connectors stored in the memory and executable on the processor, wherein the multi-physics field simulation program for high-current connectors is configured to implement the steps of the multi-physics field simulation method for high-current connectors as described in any one of claims 1 to 7.

10. A storage medium, characterized in that: The storage medium stores a multi-physics field simulation program for a high-current connector, which, when executed by a processor, implements the steps of the multi-physics field simulation method for a high-current connector according to any one of claims 1 to 7.

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