Manufacturing method of flexible circuit board product and flexible circuit board product

By preparing adhesive layer and isolation groove on the reinforcement substrate, combined with laser deep-controlled milling and mechanical milling, the problems of alignment difficulties and burrs in the manufacturing of flexible circuit boards are solved, and product quality and production efficiency are improved.

CN120264601APending Publication Date: 2025-07-04WUXI SHENNAN CIRCUITS CO LTD
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Patent Information

Application Number
CN202510437569.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-08
Publication Date
2025-07-04

AI Technical Summary

Technical Problem

During the manufacturing process of flexible circuit boards, it is difficult to precisely align the reinforcement substrate with flexible circuit boards, and burrs are easily generated during processing, affecting product quality.

Method used

The adhesive layer is prepared on the target reinforcement substrate and the isolation groove is processed thereon. By combining laser deep-controlled milling and mechanical milling, the precise alignment of the reinforcement substrate and the flexible circuit board is ensured and burrs are avoided.

Benefits of technology

The precise alignment between the reinforcement substrate and the flexible circuit board is achieved, the product quality and yield rate is improved, the processing cost and time is reduced, the production process is optimized, and the overall production efficiency is improved.

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Abstract

The invention discloses a manufacturing method of a flexible circuit board product and the flexible circuit board product, and relates to the field of printed circuit board manufacturing, and the method comprises the steps: preparing a bonding glue layer on a bonding surface of a target reinforcing substrate, and enabling a coverage area of the bonding glue layer to correspond to a reinforcing area of a target flexible circuit board; an isolation groove is machined in the target reinforcing substrate, the processed target reinforcing substrate is obtained, and the position of the isolation groove corresponds to the boundary between the reinforcing area and the non-reinforcing area of the target flexible circuit board; pressing and curing the processed target reinforcing substrate and the target flexible circuit board; performing laser controlled depth milling on the contour edge of the reinforcing area of the target flexible circuit board along the isolation groove to form a milling contour; and performing mechanical milling on the target reinforcing substrate along the milling contour, and performing laser cutting on the contour edge of the target flexible circuit board in the non-reinforcing area to obtain a flexible circuit board product. Accurate alignment of the reinforcing substrate and the flexible circuit board is ensured, and burrs generated during processing are reduced.
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