Large-format marking method and system based on laser galvanometer

Abstract

The invention discloses a large-format marking method and system based on a laser galvanometer. The method comprises the steps that machining data are acquired; analyzing according to the processing data, and determining a continuous track in the processing data as a marking stack or a cutting stack; each marking stack and each cutting stack are respectively determined as a machining area, and each machining area is sequentially machined through a galvanometer system; in the machining process, the geometric error delta E of the adjacent machining areas is calculated based on the machining sequence, and the machining coordinates of all the machining areas are corrected through the geometric error delta E. The invention provides a dynamic optimization technology integrating error pre-compensation of forced splicing and intelligent splicing, and high precision, high efficiency and strong robustness of large-format laser processing are realized.

Description

Technical Field

[0001] The present application relates to the technical field of laser processing, and more specifically, to a large-format marking method and system based on a laser galvanometer. Background Art

[0002] Limited by the deflection angle of the galvanometer and the field of view of the field lens, the laser galvanometer system needs to use regional stitching marking when processing a large format. The traditional stitching method has the following problems: Block stitching: There is an accumulated error problem during large-format stitching. Relying on manual experience to set stitching parameters is prone to cumulative errors, resulting in overlap or gaps at the stitching locations.

[0003] Therefore, the existing technology has defects and urgent improvement is needed. Summary of the Invention

[0004] In view of the above problems, the purpose of the present invention is to provide a large-format marking method and system based on a laser galvanometer, providing a technology that combines error pre-compensation of forced stitching and dynamic optimization of intelligent stitching to achieve high precision, high efficiency, and strong robustness in large-format laser processing.

[0005] The first aspect of the present invention provides a large-format marking method based on a laser galvanometer, including: Obtain processing data; Analyze according to the processing data, and determine the continuous trajectory in the processing data as a marking stack or a cutting stack; Determine each marking stack and each cutting stack as a processing area respectively, and process each processing area in sequence through the galvanometer system; During the processing, calculate the geometric error ΔE between adjacent processing areas based on the processing sequence, and correct the processing coordinates of each processing area through the geometric error ΔE.

[0006] In this solution, the analyzing according to the processing data and determining the continuous trajectory in the processing data as a marking stack or a cutting stack includes: Compare the continuous trajectory in the processing data with the galvanometer amplitude M. If the outer frame of the continuous trajectory is smaller than the galvanometer amplitude M, determine the continuous trajectory as a processing stack; Adjust the galvanometer amplitude M with the processing stack as the center, and add other continuous trajectories whose inner and outer frames are smaller than the galvanometer amplitude M after adjustment to the processing stack to determine the marking stack; Determine the continuous trajectory whose outer frame exceeds the galvanometer amplitude M as the cutting stack.

[0007] This solution further includes: The galvanometer system is installed on the XY motion platform, and the XY motion platform drives the galvanometer system for motion processing.

[0008] In this solution, it further includes: Distinguish the marking stack and the cutting stack through layer parameters, set the marking stack as the first layer, and set the cutting stack as the second layer.

[0009] In this solution, determining each marking stack and each cutting stack as a processing area respectively, and processing each processing area sequentially through the galvanometer system includes: Move the galvanometer system according to the XY platform coordinates of the processing area corresponding to the marking stack; Based on the galvanometer center point coordinates of the galvanometer system, convert the XY platform coordinates of the processing area into galvanometer coordinates; Control the laser to process the marking stack according to the galvanometer coordinates; When all the marking stacks are processed, adjust the laser to the center of the galvanometer system, and control the XY motion platform to drive the galvanometer system to process the cutting stack based on the XY platform coordinates of the cutting stack.

[0010] In this solution, calculating the geometric error ΔE between adjacent processing areas based on the processing sequence includes: Taking the galvanometer amplitude M as the interval, make a cross coordinate at the center of each processing area, obtain the cross center point coordinates through the vision positioning module, and determine the center point coordinates of each processing area; Calculate the coordinate difference of the center point coordinates of adjacent processing areas based on the processing sequence, and determine the geometric error ΔE between adjacent processing areas.

[0011] In this solution, correcting the processing coordinates of each processing area through the geometric error ΔE includes: Obtain the geometric error ΔE between the nth processing area and the (n - 1)th processing area (n,n-1) , combined with the compensation value C of the (n - 1)th processing area n-1 Calculate the compensation value C of the nth processing area n ; ; According to the compensation value C n Correct the processing coordinates of the nth processing area.

[0012] The second aspect of the present invention provides a large-format marking system based on a laser galvanometer, including: A data acquisition module for acquiring processing data; A data analysis module for analyzing according to the processing data and determining the continuous trajectory in the processing data as a marking stack or a cutting stack; A data processing module, configured to determine each marking stack and each cutting stack as a processing area respectively, and sequentially process each processing area through a galvanometer system; A data correction module, configured to calculate a geometric error ΔE between adjacent processing areas based on the processing sequence during the processing, and correct the processing coordinates of each processing area through the geometric error ΔE.

[0013] A third aspect of the present invention provides a computer-readable storage medium, which includes a program for a large-format marking method based on a laser galvanometer. When the program for the large-format marking method based on a laser galvanometer is executed by a processor, the steps of the large-format marking method based on a laser galvanometer as described above are implemented.

[0014] The present invention discloses a large-format marking method and system based on a laser galvanometer. The method includes: obtaining processing data; analyzing the processing data, and determining continuous trajectories in the processing data as marking stacks or cutting stacks; determining each marking stack and each cutting stack as a processing area respectively, and sequentially processing each processing area through a galvanometer system; during the processing, calculating a geometric error ΔE between adjacent processing areas based on the processing sequence, and correcting the processing coordinates of each processing area through the geometric error ΔE. The present invention provides a technology that combines error pre-compensation of forced splicing and dynamic optimization of intelligent splicing to achieve high precision, high efficiency, and strong robustness in large-format laser processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Shows a flowchart of a large-format marking method based on a laser galvanometer provided by the present invention; Figure 2 Shows a flowchart of a method for determining a marking stack and a cutting stack provided by the present invention; Figure 3 Shows a flowchart of a method for processing a processing area provided by the present invention; Figure 4 Shows a block diagram of a large-format marking system based on a laser galvanometer provided by the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] In order to more clearly understand the above objects, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments may be combined with each other.

[0017] In the following description, numerous specific details are set forth to provide a thorough understanding of the present invention. However, the present invention may be practiced in other ways than those specifically described herein. Therefore, the scope of protection of the present invention is not limited by the specific embodiments disclosed below.

[0018] Figure 1 The flowchart of a large-format marking method based on a galvanometer provided by the present invention is shown.

[0019] As Figure 1 shown, the present invention discloses a large-format marking method based on a galvanometer, including: S102, obtaining processing data; S104, analyzing the processing data, and determining the continuous trajectories in the processing data as marking stacks or cutting stacks; S106, respectively determining each marking stack and each cutting stack as a processing area, and sequentially processing each processing area through a galvanometer system; S108, during the processing, calculating the geometric error ΔE between adjacent processing areas based on the processing sequence, and correcting the processing coordinates of each processing area through the geometric error ΔE.

[0020] According to the embodiments of the present invention, marking of large-format processing data is achieved through a galvanometer system (including a laser for emitting laser), an XY motion platform, and a vision positioning module. First, the large-format processing data is analyzed. Based on the galvanometer amplitude M of the galvanometer system (the processing amplitude of the galvanometer system), the processing data is analyzed. The size of the outer border of each continuous trajectory is respectively compared with the specifications of the galvanometer amplitude to determine multiple marking stacks and / or cutting stacks, and the processing data is divided into multiple processing areas. The marking stacks and cutting stacks are distinguished by establishing different layers, and a processing path is generated in the order of processing the marking stacks first and then the cutting stacks, and each processing area is processed in sequence. During the processing of the marking stack, the galvanometer system is driven by the XY motion platform to move to the corresponding position of the marking stack. Taking the galvanometer center point coordinates of the galvanometer system as the 0-point coordinates, the marking stack is converted from the XY platform coordinates to the galvanometer coordinates, and the laser of the galvanometer system is controlled to emit laser according to the galvanometer coordinates of the marking stack to complete the processing of the marking stack; during the processing of the cutting stack, the galvanometer system stops swinging, so that the laser is at the center of the galvanometer system, and the XY motion platform is controlled to drive the galvanometer system to perform the cutting motion according to the XY platform coordinates of the corresponding processing area of the cutting stack to complete the processing of the cutting stack. Through the work of the above two processing modes, the processing of large-format processing data is completed. Since the processing data of the continuous trajectory is not segmented, the entire processing trajectory is very smooth, without any misalignment, gap, and color difference caused by the size of the head and tail laser cutting.

[0021] In addition, when the device is installed, the xy axes are not absolutely vertical and there will be an angular error. When the xy plane is relatively large, there will definitely be a positional error between the starting point and the ending point of the machining. For example, the starting point position is (0, 0); the machining ending point at the same level may be (0, 0.05 mm), and the positional error may be positive or negative. Since the continuous trajectories are not stitched in this solution and the phenomenon of seams cannot be seen, the positional error still exists, so compensation is required. By calculating the center point coordinates of each machining area and combining with the machining sequence of each machining area in the machining data, the geometric error between adjacent machining areas is determined, and the compensation value of the current machining area is determined in combination with the compensation value of the previous machining area, and the machining coordinates of the current machining area are corrected, so as to eliminate the positional error to the greatest extent and ensure the machining effect of the machining data.

[0022] Figure 2 The flowchart of the method for determining the marking stack and the cutting stack provided by the present invention is shown.

[0023] As Figure 2 shown, according to an embodiment of the present invention, by analyzing the machining data, the continuous trajectories in the machining data are determined as the marking stack or the cutting stack, including: S202, comparing the continuous trajectories in the machining data with the galvanometer amplitude M. If the outer frame of the continuous trajectory is smaller than the galvanometer amplitude M, the continuous trajectory is determined as the machining stack; S204, adjusting the galvanometer amplitude M with the machining stack as the center, and adding other continuous trajectories whose inner and outer frames are smaller than the galvanometer amplitude M after adjustment to the machining stack to determine the marking stack; S206, determining the continuous trajectories whose outer frames exceed the galvanometer amplitude M as the cutting stack.

[0024] It should be noted that with the XY motion platform as the reference coordinate system, the machining amplitude of the galvanometer system is determined as the galvanometer amplitude M. First, control the galvanometer system to return to the coordinate zero point of the XY platform coordinates, analyze the machining data (large amplitude data), and classify it according to the characteristic of trajectory continuity. If the outer frame of the continuous trajectory is smaller than the galvanometer amplitude M, it is stored separately as a machining stack. With this stack as the center, if there are other continuous trajectories that meet this condition within the area of the galvanometer amplitude size, they are also added to this stack, and so on. After calculation and planning, all the data with outer frames smaller than the galvanometer amplitude M have been sorted into stacks, and each machining stack is determined as a marking stack. The remaining data larger than the galvanometer amplitude M are separately listed as a stack and determined as the cutting stack.

[0025] According to an embodiment of the present invention, it further includes: The galvanometer system is installed on the XY motion platform, and the XY motion platform drives the galvanometer system to perform motion machining.

[0026] It should be noted that the galvanometer system is installed on the XY motion platform and can be driven by the XY motion platform to achieve two processing modes: (1) The XY motion platform moves to a certain position and stops. The galvanometer system controls the laser to start marking. After the marking is completed, the XY motion platform continues to move to other positions. This method can achieve data processing of sizes within the galvanometer scanning area, and for data exceeding the galvanometer processing area, the second processing mode is adopted. (2) The laser returns to the center of the galvanometer system. The two-axis galvanometer of the galvanometer system does not move, and the laser outputs from the galvanometer. The XY motion platform drives the galvanometer head to move, forming a processing system with the galvanometer head as the cutting head. This method can achieve arbitrary continuous trajectory processing of large areas.

[0027] According to an embodiment of the present invention, it further includes: The marking stack and the cutting stack are distinguished by layer parameters. The marking stack is set as the first layer, and the cutting stack is set as the second layer.

[0028] It should be noted that the parameters of the cutting stack and the marking stack are different. Therefore, by creating different layers, the layer parameters are used for distinction.

[0029] Figure 3 The flowchart of the processing method for the processing area provided by the present invention is shown.

[0030] As Figure 3 shown, according to an embodiment of the present invention, each marking stack and each cutting stack are respectively determined as a processing area, and the galvanometer system is used to process each processing area in sequence, including: S302, moving the galvanometer system according to the XY platform coordinates of the processing area corresponding to the marking stack; S304, converting the XY platform coordinates of the processing area into galvanometer coordinates based on the galvanometer center point coordinates of the galvanometer system; S306, controlling the laser to process the marking stack according to the galvanometer coordinates; S308, when all the marking stacks are processed, adjusting the laser to the center of the galvanometer system, and controlling the XY motion platform to drive the galvanometer system to process the cutting stack based on the XY platform coordinates of the cutting stack.

[0031] It should be noted that the processing area includes the marking stack and the cutting stack. The processing system preferentially processes the marking stack. According to the XY platform coordinates of the processing area corresponding to the marking stack, the XY moving platform is controlled to drive the galvanometer system to move to the processing area corresponding to the marking stack, and the coordinate conversion of the marking data corresponding to the marking stack is performed. Taking the galvanometer center point coordinates of the galvanometer system as the 0-point coordinates, the XY platform coordinates are converted into galvanometer coordinates, and galvanometer marking is performed on this marking stack. After completion, the next marking stack is continued to be searched, and the above operations are repeated for galvanometer marking until all marking stacks are processed. The system switches to the cutting stack for processing. The galvanometer system stops swinging, so that the laser is at the center of the galvanometer system. According to the XY platform coordinates of the processing area corresponding to the cutting stack, the XY moving platform is controlled to drive the galvanometer system to perform the movement of the cutting action, and the processing of the cutting stack is completed.

[0032] According to the embodiment of the present invention, calculating the geometric error ΔE between adjacent processing areas based on the processing sequence includes: Taking the galvanometer amplitude M as the interval, a cross coordinate is marked at the center of each processing area, and the cross center point coordinates are obtained through the vision positioning module to determine the center point coordinates of each processing area; Based on the processing sequence, calculate the coordinate difference of the center point coordinates of adjacent processing areas to determine the geometric error ΔE between adjacent processing areas.

[0033] It should be noted that during the movement of the XY moving platform, from left to right and from top to bottom, there are cumulative errors. Because the xy two axes are not absolutely perpendicular (high-end equipment will perform laser interferometer measurement and then compensation, and general equipment does not have this condition), the vision positioning module can be used for measurement and compensation. After controlling the XY moving platform to return to the coordinate zero point of the XY platform coordinates, taking the galvanometer amplitude M as the interval, in the order from left to right and from top to bottom, a cross coordinate is marked at the center of each processing area. At most, R rows and C columns of crosses can be marked in the entire processing area. Use the vision positioning module to test the positions of the center points of each cross, obtain the cross center point coordinates, and determine the center point coordinates of each processing area.

[0034] Among them, the processing sequence is usually from left to right and from top to bottom. Subtract the abscissa difference of the standard center point coordinates of adjacent processing areas from the abscissa difference of the actual center point coordinates of adjacent processing areas to determine the abscissa geometric error Δx of adjacent processing areas. Subtract the ordinate difference of the standard center point coordinates of adjacent processing areas from the ordinate difference of the actual center point coordinates of adjacent processing areas to determine the ordinate geometric error Δy of adjacent processing areas. Determine the geometric error ΔE(Δx, Δy) of the adjacent processing area by the abscissa geometric error Δx and the ordinate geometric error Δy of the adjacent processing area. The abscissa difference and ordinate difference of the standard center point coordinates of adjacent processing areas are determined according to the number of galvanometer mirror surfaces M between them. The abscissa difference is the number of galvanometer mirror surfaces M in the x-axis direction × the length of the galvanometer mirror surface M, and the ordinate difference is the number of galvanometer mirror surfaces M in the y-axis direction × the width of the galvanometer mirror surface M.

[0035] In addition, the accuracy of the vision positioning module directly affects the accuracy of error detection. Therefore, it is necessary to select an industrial camera with high resolution.

[0036] According to the embodiments of the present invention, the processing coordinates of each processing area are corrected by the geometric error ΔE, including: Obtain the geometric error ΔE of the nth processing area and the (n - 1)th processing area (n,n-1) , combined with the compensation value C of the (n - 1)th processing area n-1 Calculate the compensation value C of the nth processing area n ; ; According to the compensation value C n Correct the processing coordinates of the nth processing area.

[0037] It should be noted that the stitching error has an accumulation characteristic and needs to be corrected by stitching error chain compensation. The core idea is to correct the error of the stitching area step by step to avoid the accumulation of errors. During the processing, according to the geometric error of the current processing area and the previous processing area, and the compensation value of the previous processing area, calculate the compensation value of the current processing area. The compensation value includes the abscissa compensation value and the ordinate compensation value. Add the abscissa geometric error Δx to the abscissa compensation value of the (n - 1)th processing area (n,n-1) Determine the abscissa compensation value of the nth processing area, and add the ordinate geometric error Δy to the ordinate compensation value of the (n - 1)th processing area (n,n-1)Determine the vertical coordinate compensation value of the nth processing area. Add this abscissa compensation value to the abscissa of the processing coordinates of the current processing area, and add this vertical coordinate compensation value to the vertical coordinate of the processing coordinates of the current processing area to determine the corrected processing coordinates, and process the current processing area through the corrected processing coordinates. Among them, the compensation value of the first processing area is (0, 0).

[0038] Figure 4 The block diagram of a large-format marking system based on a galvanometer is shown, which is provided by the present invention.

[0039] As Figure 4 shown, the second aspect of the present invention provides a large-format marking system based on a galvanometer, including: A data acquisition module, configured to acquire processing data; A data analysis module, configured to analyze according to the processing data and determine the continuous trajectory in the processing data as a marking stack or a cutting stack; A data processing module, configured to respectively determine each marking stack and each cutting stack as a processing area, and sequentially process each processing area through a galvanometer system; A data correction module, configured to calculate the geometric error ΔE between adjacent processing areas based on the processing sequence during the processing process, and correct the processing coordinates of each processing area through the geometric error ΔE.

[0040] The third aspect of the present invention provides a computer-readable storage medium, which includes a program for a large-format marking method based on a galvanometer. When the program for the large-format marking method based on a galvanometer is executed by a processor, the steps of a large-format marking method as described above are implemented.

[0041] The information (including but not limited to user equipment information, user personal information, etc.), data (including but not limited to data for analysis, stored data, displayed data, etc.) and signals (including but not limited to signals transmitted between user terminals and other devices) involved in this application are all authorized by users or fully authorized by all parties, and the collection, use and processing of relevant data need to comply with relevant laws, regulations and standards of relevant countries and regions. For example, the "processing data", "geometric error between adjacent processing areas" and the like involved in this disclosure are all obtained under full authorization.

[0042] The present invention discloses a large-format marking method and system based on a galvanometer scanner. The method includes: obtaining processing data; analyzing the processing data to determine continuous trajectories in the processing data as marking stacks or cutting stacks; determining each marking stack and each cutting stack as a processing area respectively, and sequentially processing each processing area through the galvanometer system; during the processing, calculating the geometric error ΔE between adjacent processing areas based on the processing order, and correcting the processing coordinates of each processing area through the geometric error ΔE. The present invention provides a technology that combines error pre-compensation of forced stitching and dynamic optimization of intelligent stitching to achieve high precision, high efficiency, and strong robustness in large-format laser processing.

[0043] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are only illustrative. For example, the division of the units is only a logical function division, and there may be other division methods in actual implementation. For example, multiple units or components can be combined, or can be integrated into another system, or some features can be ignored, or not executed. In addition, the coupling, direct coupling, or communication connection between the various components shown or discussed can be through some interfaces. The indirect coupling or communication connection of devices or units can be electrical, mechanical, or other forms.

[0044] The units described above as separate components may or may not be physically separated. The components shown as units may or may not be physical units; they can be located in one place or distributed to multiple network units; some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0045] In addition, in each embodiment of the present invention, the functional units can all be integrated in one processing unit, or each unit can be separately used as a unit, or two or more units can be integrated in one unit; the above integrated units can be implemented in the form of hardware, or in the form of a combination of hardware and software functional units.

[0046] Those of ordinary skill in the art can understand that all or part of the steps to implement the above method embodiments can be completed by hardware related to program instructions. The foregoing program can be stored in a computer-readable storage medium. When the program is executed, it executes the steps including the above method embodiments; and the foregoing storage medium includes: removable storage devices, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disks, or optical disks and other various media that can store program codes.

[0047] Alternatively, if the above integrated units of the present invention are implemented in the form of software functional modules and sold or used as independent products, they can also be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the embodiments of the present invention, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as removable storage devices, ROM, RAM, magnetic disks, or optical discs.

Claims

1. A large-format marking method based on a galvanometer scanner, characterized in that, Including: Obtain processing data; Analyze according to the processing data, and determine the continuous trajectory in the processing data as a marking stack or a cutting stack; Determine each marking stack and each cutting stack as a processing area respectively, and process each processing area in sequence through a galvanometer system; During the processing, calculate the geometric error ΔE between adjacent processing areas based on the processing sequence, and correct the processing coordinates of each processing area through the geometric error ΔE.

2. The large-format marking method based on a laser galvanometer according to claim 1, wherein The analyzing according to the processing data and determining the continuous trajectory in the processing data as a marking stack or a cutting stack includes: Compare the continuous trajectory in the processing data with the galvanometer amplitude M. If the outer frame of the continuous trajectory is smaller than the galvanometer amplitude M, determine the continuous trajectory as a processing stack; Adjust the galvanometer amplitude M with the processing stack as the center, and add other continuous trajectories whose inner and outer frames are smaller than the galvanometer amplitude M after adjustment to the processing stack to determine the marking stack; Determine the continuous trajectory with an outer frame exceeding the galvanometer amplitude M as the cutting stack.

3. The large-format marking method based on a laser galvanometer according to claim 1, characterized in that, Also including: The galvanometer system is installed on an XY motion platform, and the XY motion platform drives the galvanometer system to perform motion processing.

4. The large-format marking method based on a galvanometer according to claim 2, characterized in that Also including: Distinguish the marking stack and the cutting stack through layer parameters, set the marking stack as the first layer, and set the cutting stack as the second layer.

5. The large-format marking method based on a laser galvanometer according to claim 1, characterized in that, The determining each marking stack and each cutting stack as a processing area respectively and processing each processing area in sequence through a galvanometer system includes: Move the galvanometer system according to the XY platform coordinates of the processing area corresponding to the marking stack; Convert the XY platform coordinates of the processing area into galvanometer coordinates based on the galvanometer center point coordinates of the galvanometer system; Control the laser to process the marking stack according to the galvanometer coordinates; When all the marking stacks are processed, adjust the laser to the center of the galvanometer system, and control the XY motion platform to drive the galvanometer system to process the cutting stack based on the XY platform coordinates of the cutting stack.

6. The large-format marking method based on a galvanometer according to claim 1, characterized in that The calculating the geometric error ΔE between adjacent processing areas based on the processing sequence includes: Taking the galvanometer amplitude M as the interval, make a cross coordinate at the center of each processing area, obtain the cross center point coordinates through a vision positioning module, and determine the center point coordinates of each processing area; Calculate the coordinate difference of the center point coordinates of adjacent processing areas based on the processing sequence, and determine the geometric error ΔE between adjacent processing areas.

7. The large-format marking method based on a galvanometer according to claim 1, characterized in that The correcting the processing coordinates of each processing area through the geometric error ΔE includes: Obtain the geometric error ΔE of the nth machining area and the (n - 1)th machining area (n,n-1) , and combine with the compensation value C of the (n - 1)th machining area n-1 Calculate the compensation value C of the nth machining area n ; ； According to the compensation value C n correct the machining coordinates of the nth machining area.

8. A large-format marking system based on a galvanometer scanner, which is used to implement the large-format marking method based on a galvanometer scanner according to any one of claims 1-7, and is characterized in that, Including: A data acquisition module for obtaining processing data; A data analysis module for analyzing according to the processing data and determining the continuous trajectory in the processing data as a marking stack or a cutting stack; A data processing module for determining each marking stack and each cutting stack as a processing area respectively and processing each processing area in sequence through a galvanometer system; A data correction module for calculating the geometric error ΔE between adjacent processing areas based on the processing sequence during the processing and correcting the processing coordinates of each processing area through the geometric error ΔE.

9. The large-format marking system based on a galvanometer according to claim 8, characterized in that, Analyzing according to the processing data and determining the continuous trajectory in the processing data as a marking stack or a cutting stack includes: Comparing the continuous trajectory in the processing data with the galvanometer amplitude M. If the outer frame of the continuous trajectory is smaller than the galvanometer amplitude M, the continuous trajectory is determined as a processing stack; Adjusting the galvanometer amplitude M with the processing stack as the center, and adding other continuous trajectories whose inner and outer frames are smaller than the galvanometer amplitude M after adjustment to the processing stack to determine the marking stack; Determining the continuous trajectory with the outer frame exceeding the galvanometer amplitude M as the cutting stack.

10. The large-format marking system based on a galvanometer according to claim 8, characterized in that, Determining each marking stack and each cutting stack as a processing area respectively, and processing each processing area sequentially through the galvanometer system includes: Moving the galvanometer system according to the XY platform coordinates of the processing area corresponding to the marking stack; Converting the XY platform coordinates of the processing area into galvanometer coordinates based on the galvanometer center point coordinates of the galvanometer system; Controlling the laser to process the marking stack according to the galvanometer coordinates; After all the marking stacks are processed, adjusting the laser to the center of the galvanometer system, and controlling the XY moving platform to drive the galvanometer system to process the cutting stack based on the XY platform coordinates of the cutting stack.

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