Immersed liquid cooling device, control method and system

Abstract

The invention provides an immersed liquid cooling device, a control method and a system, and relates to the technical field of heat dissipation, the temperature of an inlet and an outlet of a chip-level evaporator at a chip and the highest temperature of the chip are obtained in real time through a preset sensor, and the corresponding relation between the inlet and outlet temperature difference and a preset threshold value is determined; if the outlet temperature difference is smaller than the preset threshold value, the valve opening degree of a pipeline valve corresponding to the outlet temperature difference is controlled to be reduced along with increasing of the outlet temperature difference according to a preset adjusting method, and the valve opening degree is determined in real time; when the valve opening degree reaches the minimum value and the outlet temperature is still smaller than the preset threshold value, the target fan rotating speed is determined through a first preset formula according to the chip highest temperature and the chip heating power; and if the outlet temperature difference is equal to the preset threshold value, the target fan rotating speed is determined according to the chip highest temperature and the chip heating power. According to the invention, the problem that an immersed liquid cooling device, a control method and a system which are controllable in cooling object and cooling effect and wide in application range are lacked in the prior art is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation, and particularly to an immersion liquid cooling device, a control method and a system thereof. Background Art

[0002] With the development of electronic devices towards high performance and high density, the heat generated by them has increased sharply, and the traditional air-cooled heat dissipation method is difficult to meet the heat dissipation requirements. As an efficient heat dissipation method, immersion liquid cooling technology has received extensive attention in recent years. This technology directly immerses electronic devices in insulating coolant, and utilizes the high heat capacity and high thermal conductivity of the coolant to achieve efficient cooling of the devices.

[0003] However, traditional immersion liquid cooling systems usually adopt a single coolant circulation, which is difficult to achieve precise temperature control of different heating elements. For devices with large differences in heat generation, it is easy to cause local overheating, affecting the performance and lifespan of the devices. And it usually needs to be connected to a driving device to drive the circulation flow of the coolant through the driving device, but this coolant circulation cooling method has a high cost and a large noise, and its application scope has limitations. In the prior art, there is also a method of using a thermosyphon to achieve coolant circulation, but this method mainly relies on the thermosyphon effect to achieve the circulation of the coolant, and it is difficult to control the cooling effect according to requirements, thus making the cooling effect uncontrollable and prone to energy waste. Summary of the Invention

[0004] Based on this, the object of the present invention is to provide an immersion liquid cooling device, a control method and a system thereof, aiming to solve the problem in the prior art that there is a lack of an immersion liquid cooling device, a control method and a system with controllable cooling object and cooling effect and wide application scope.

[0005] A control method for an immersion liquid cooling device according to an embodiment of the present invention is applied to an immersion liquid cooling device. The immersion liquid cooling device includes a liquid cooling cabinet, servers and a cabinet-level evaporator arranged in an array in the liquid cooling cabinet, a chip-level evaporator arranged at the chip of the server, a thermosyphon connecting the cabinet-level evaporator and the chip-level evaporator, and an air-cooled condenser for cooling the thermosyphon. The method includes: Real-time obtaining the temperatures at the inlet and outlet of the chip-level evaporator at the chip and the highest chip temperature through a preset sensor; Judging the corresponding relationship between the temperature difference between the inlet and outlet and a preset threshold; If the temperature difference between the inlet and outlet is less than the preset threshold, then according to a preset adjustment method, controlling the valve opening of the pipeline valve corresponding to the temperature difference between the inlet and outlet to decrease as the temperature difference between the inlet and outlet increases, and judging in real time whether the valve opening reaches the minimum; When the valve opening reaches the minimum and the outlet temperature is still lower than the preset threshold, determine the target fan speed according to the highest chip temperature and the chip heating power through a first preset formula, so that the fan in the air-cooled condenser rotates at the target fan speed; If the temperature difference between the inlet and outlet is equal to the preset threshold, determine the target fan speed according to the highest chip temperature and the chip heating power through a first preset formula, so that the fan in the air-cooled condenser rotates at the target fan speed.

[0006] In addition, for a control method of an immersion liquid cooling device according to the above embodiments of the present invention, the following additional technical features may further be included: Further, the first preset formula is:

[0007] wherein, v min is the minimum speed of the fan, K P , K i , K d are the gain coefficients of proportional, integral, and derivative, is the current highest temperature, is the heating power of the chip, C is the fan cooling efficiency constant, t is the time independent variable in the control system, is the integral variable.

[0008] Further, after the step of obtaining the temperatures at the inlet and outlet of the chip-level evaporator at the chip and the highest chip temperature in real time through a preset sensor and determining the corresponding relationship between the temperature difference between the inlet and outlet and the preset threshold, it includes: If the temperature difference between the inlet and outlet is less than the preset threshold, control the valve opening of the pipeline valve corresponding to the temperature difference between the inlet and outlet to increase as the temperature difference between the inlet and outlet increases according to a preset adjustment method; Determine the target fan speed according to the highest chip temperature and the chip heating power through the first preset formula, so that the fan in the air-cooled condenser rotates at the target fan speed, and detect the valve opening and the temperature difference between the inlet and outlet in real time; If the temperature difference between the inlet and outlet is greater than the preset threshold and the valve opening reaches the maximum, generate an alarm message, and perform a shutdown process on the server corresponding to the chip after the duration of the current state exceeds a preset time critical value.

[0009] Further, the step of controlling the valve opening degree of the pipeline valve corresponding to the inlet and outlet temperature difference to decrease as the inlet and outlet temperature difference increases according to the preset adjustment method includes: Determine the real-time system thermal imbalance index through a second preset formula, and determine whether the system thermal imbalance index is less than a preset value; If the system thermal imbalance index is less than the preset value, control the valve opening degree to linearly decrease as the inlet and outlet temperature difference increases; If the system thermal imbalance index is not less than the preset value, adjust the valve opening degrees of each of the valves to adjust the flow rate of the pipelines in each of the chip-level evaporators; The second preset formula is:

[0010] where, is the system thermal imbalance index, is the standard deviation of the outlet temperatures of all pipelines, is the average value of the outlet temperatures of all pipelines, is the weight coefficient, is the maximum value of the highest temperatures corresponding to all chips.

[0011] Further, the step of adjusting the valve opening degrees of each of the valves to adjust the flow rate of the pipelines in each of the chip-level evaporators includes: Determine the flow rate weight coefficient of each pipeline through a third preset formula, and adjust the valve opening degree of the valve corresponding to each pipeline according to the flow rate weight coefficient to adjust the flow rate of the pipelines in each of the chip-level evaporators; The third preset formula is:

[0012] where, is the flow rate weight coefficient of the th pipeline, is the inlet and outlet temperature difference of the th pipeline, is the total number of pipelines, is the temperature penalty factor, is the highest chip temperature of the th pipeline.

[0013] Further, obtain the chip power consumption change rate and the chip highest temperature change rate to adjust the gain coefficient of the first preset formula through a preset adjustment formula; The preset adjustment formula is:

[0014]

[0015] Among them, and are the gain coefficients of the proportional and integral-differential before adjustment, is the chip power consumption change rate, is the highest temperature change rate, and are the attenuation coefficients.

[0016] Another object of the embodiments of the present invention is to provide an immersion liquid cooling device for implementing the above-mentioned control method of the immersion liquid cooling device. The device includes: A liquid cooling cabinet filled with a highly thermally conductive insulating coolant; Servers, a plurality of which are arranged in an array in the liquid cooling cabinet and are immersed in the coolant. Chips are provided on the servers; A cabinet-level evaporator that is hollow and surrounds the inner wall of the liquid cooling cabinet, and a liquid-phase condensing working medium flows inside for refrigerating all the coolant in the liquid cooling cabinet; Chip-level evaporators, a plurality of which are respectively individually covered on the corresponding chips, and a liquid-phase condensing working medium flows inside for independently refrigerating the corresponding chips; A heat pipe for connecting the cabinet-level evaporator and the chip-level evaporator, so that the cabinet-level evaporator and the chip-level evaporator form a low thermal resistance coupling closed-loop system; An air-cooled condenser is arranged outside the liquid cooling cabinet and is connected to the heat pipe through a pipeline for dissipating heat from the condensing working medium in the heat pipe.

[0017] Furthermore, the cabinet-level evaporator adopts a double-layer coil structure. The inner layer is a channel for the low-temperature liquid condensing working medium, and the outer layer is a channel for the high-temperature steam condensing working medium; the low-temperature liquid condensing working medium flows towards the chip-level evaporator, and the high-temperature steam condensing working medium flows towards the heat pipe air-cooled condenser.

[0018] Furthermore, the pipelines of each heat pipe are composed of a Z-shaped structure. First temperature sensors are provided at the inlets and outlets of the chip-level evaporators of each heat pipe, and second temperature sensors are provided at the chips.

[0019] Another object of the embodiments of the present invention is to provide a control system for an immersion liquid cooling device. The system includes: A parameter acquisition module for obtaining the temperature at the inlets and outlets of the chip-level evaporator and the highest chip temperature at the chip in real time through preset sensors and determining the corresponding relationship between the temperature difference between the inlets and outlets and a preset threshold; A valve adjustment judgment module, configured to, when the temperature difference between the inlet and outlet is less than the preset threshold, control the valve opening of the pipeline valve corresponding to the temperature difference between the inlet and outlet to linearly decrease as the temperature difference between the inlet and outlet increases, and determine in real time whether the valve opening reaches the minimum; A first air-cooling control module, configured to, when the valve opening reaches the minimum and the outlet temperature is still less than the preset threshold, determine a target fan speed according to the highest chip temperature and the chip heating power through a first preset formula, so that the fan in the air-cooled condenser rotates at the target fan speed; A second air-cooling control module, configured to, when the temperature difference between the inlet and outlet is equal to the preset threshold, determine the target fan speed according to the highest chip temperature and the chip heating power through a first preset formula, so that the fan in the air-cooled condenser rotates at the target fan speed.

[0020] Another object of the embodiments of the present invention is to provide a storage medium, on which a computer program is stored, and when the program is executed by a processor, the steps of the above-mentioned control method for an immersion liquid cooling device are implemented.

[0021] Another object of the embodiments of the present invention is to provide an electronic device, including a memory, a processor, and a computer program stored on the memory and executable on the processor, and when the processor executes the program, the steps of the above-mentioned control method for an immersion liquid cooling device are implemented.

[0022] In the present invention, by combining a heat pipe with immersion liquid cooling technology, a chip-level evaporator is used to accurately cool the high-heat chips of a server, and a cabinet-level evaporator is used to diffusely cool other electronic components of the server through an immersion liquid cooling medium, realizing partitioned efficient and accurate cooling. Since the heat pipe is a passive heat transfer device that relies on the phase change cycle of the internal working fluid for heat transfer and does not require additional power devices such as pumps, the system structure is simplified, and the energy consumption and noise are reduced, thereby enhancing the applicability of the device. By detecting the temperature difference between the inlet and outlet of the chip-level evaporator and the highest temperature of the corresponding chip, the valve opening of the corresponding pipeline and the rotation speed of the fan in the air-cooled condenser are accurately adjusted according to the heat condition of the chip, so as to adjust the flow rate at the corresponding chip-level evaporator and the heat transfer efficiency between the heat pipe and the fan, realizing targeted control and adjustment of the cooling effect at each chip, so that the chips operate within a normal range, and the rotation speed of the fan will not be too large, thereby ensuring stable control of the cooling effect of each chip and avoiding waste of fan energy. Therefore, the present invention solves the problem in the prior art that there is a lack of an immersion liquid cooling device, a control method and a system in which the cooling object and the cooling effect are controllable and the applicable range is wide. Description of the Drawings

[0023] Figure 1Flow chart of the control method for the immersion liquid cooling device in the first embodiment of the present invention; Figure 2 Block diagram of the control system for the immersion liquid cooling device in the second embodiment of the present invention; Figure 3 Schematic diagram of the structure of the electronic device in the current area embodiment of the present invention; Figure 4 Schematic diagram of the structure of the immersion liquid cooling device in the third embodiment of the present invention; Figure 5 Schematic diagram of the structure of the server in the third embodiment of the present invention; Figure 6 Schematic diagram of the structure of the liquid cooling cabinet in the third embodiment of the present invention; The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. Specific Embodiments

[0024] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0026] Embodiment 1 Please refer to Figure 1 , which shows the control method for the immersion liquid cooling device in the first embodiment of the present invention, applied to the immersion liquid cooling device. The immersion liquid cooling device includes a liquid cooling cabinet, servers and a cabinet-level evaporator arrayed in the liquid cooling cabinet, a chip-level evaporator disposed at the chip of the server, a heat pipe connecting the cabinet-level evaporator and the chip-level evaporator, and an air-cooled condenser for cooling the heat pipe. The method specifically includes S01 - S05.

[0027] S01, obtaining the temperature at the inlet and outlet of the chip-level evaporator at the chip and the highest chip temperature in real time through a preset sensor.

[0028] Specifically, the sensor can be a micro-sensor disposed at the chip-level evaporator and the chip, and is installed together with the cooling device during assembly. It can also be an infrared sensor disposed outside the liquid-cooled cabinet, and remotely obtains the heat conditions at each chip through infrared imaging. Using a micro-sensor can accurately obtain the temperature conditions at the chip, but the assembly difficulty is relatively large and the cost is relatively high. Using the infrared imaging method, the heat conditions of all chips inside the liquid-cooled cabinet can be obtained through a small number of acquisition devices, but a large amount of infrared data needs to be processed in a timely manner to obtain the heat conditions corresponding to each chip, and the data calculation amount is relatively large, so the device needs to have strong data processing capabilities.

[0029] S02, determine the correspondence between the inlet and outlet temperature difference and the preset threshold.

[0030] S03, if the inlet and outlet temperature difference is less than the preset threshold, then according to the preset adjustment method, control the valve opening of the pipeline valve corresponding to the inlet and outlet temperature difference to decrease as the inlet and outlet temperature difference increases, and continuously determine whether the valve opening reaches the minimum.

[0031] Specifically, the step of controlling the valve opening of the pipeline valve corresponding to the inlet and outlet temperature difference to decrease as the inlet and outlet temperature difference increases according to the preset adjustment method includes: Determine the real-time system thermal imbalance index through a second preset formula, and judge whether the system thermal imbalance index is less than the preset value; if the system thermal imbalance index is less than the preset value, then control the valve opening to linearly decrease as the inlet and outlet temperature difference increases; if the system thermal imbalance index is not less than the preset value, then adjust each valve opening to adjust the flow rate of the pipelines inside each chip-level evaporator; the second preset formula is:

[0032] Wherein, is the system thermal imbalance index, is the standard deviation of all pipeline outlet temperatures, is the average value of all pipeline outlet temperatures, is the weighting coefficient, is the maximum value of the highest temperature corresponding to all chips. In specific implementation, due to the large difference in the heat generation of chips in different servers, the traditional current sharing scheme is likely to cause local overheating, and only adjusts the flow rate according to the heat condition of a single chip, unable to accurately judge the heat condition of the entire device system, which may affect the corresponding flow rate at other chips and cause overheating. Therefore, it is necessary to judge the heat condition of the overall system. If the system heat imbalance index is less than the preset value, the valve opening of the valve corresponding to the chip can be adjusted individually, and this adjustment will not have a great impact on the overall heat condition of the system. If the system heat imbalance index is greater than the preset value, the valve openings of all valves in the system need to be adjusted to ensure the cooling effect at the target chip and ensure that other chips are not affected and overheat.

[0033] Further, the step of adjusting the valve openings to adjust the flow rate in the pipelines of each chip-level evaporator includes: determining the flow weight coefficient of each pipeline through a third preset formula, and according to the flow weight coefficient, adjusting the valve opening of the valve corresponding to each pipeline to adjust the flow rate in the pipelines of each chip-level evaporator; the third preset formula is:

[0034] Wherein, is the flow weight coefficient of the pipeline, is the temperature difference between the inlet and outlet of the pipeline, is the total number of pipelines, is the temperature penalty factor, is the highest chip temperature of the pipeline. In specific implementation, based on the real-time highest temperature condition of the chip, the weight of the flow rate of each pipeline is adjusted, so as to overall adjust the flow rate condition in all pipelines in the device, and then the cooling effect at each chip can be adjusted specifically to ensure the cooling effect and efficiency at the locally overheated chip, and avoid overheating of chips in other areas. In addition, the sum of all flow weight coefficients calculated by the above formula may be greater than 1, so normalization processing is also required, and the flow rate in the pipeline is adjusted according to the flow weight coefficient after normalization processing.

[0035] S04, when the valve opening reaches the minimum and the outlet temperature is still less than the preset threshold, determine the target fan speed through the first preset formula according to the highest chip temperature and chip heating power, so that the fan in the air-cooled condenser rotates at the target fan speed.

[0036] By way of example and not limitation, in some alternative embodiments, the output u(t) of the controller can be expressed as: , where is the temperature error, K P , K i , K d are the proportional, integral, and derivative gain coefficients, and the set fan speed v(t) is proportional to the output u(t) of the PID controller: , where v min is the minimum speed of the fan (to ensure basic heat dissipation), K is the proportionality coefficient that maps the PID output to the speed. For energy conservation, we hope that v(t) is as small as possible, but we also need to ensure that T max ≤ 85 °C. The dynamic model of the set maximum chip temperature T max can be simplified as: , P in is the heating power of the chip, P cool (v) is the cooling power of the fan, which is proportional to the fan speed v: , so , where C is the fan cooling efficiency constant. Combining the above, the following relationship can be obtained: , where: , so . Combining the above equation, we can solve for:

[0037] where v min is the minimum speed of the fan, K P , K i , K d are the proportional, integral, and derivative gain coefficients, is the current maximum temperature, is the heating power of the chip, C is the fan cooling efficiency constant, t is the time independent variable in the control system, is the integration variable.

[0038] Furthermore, obtain the chip power consumption change rate and the chip maximum temperature change rate to adjust the gain coefficients of the first preset formula through a preset adjustment formula; The preset adjustment formula is:

[0039]

[0040] Among them, and are the gain coefficients of the proportional and integral-differential before adjustment, is the chip power consumption change rate, is the maximum temperature change rate, and are the attenuation coefficients. In specific implementation, the chip power consumption change rate can accurately reflect the severity of power change, and the maximum temperature change rate can accurately reflect the temperature response speed. Then, the gain coefficients can be dynamically adjusted according to these two parameters to avoid the oscillation of the fan speed and temperature to ensure stability. In addition, when the power changes drastically ( is large), is reduced to avoid overshoot (temperature oscillation) caused by excessive control action. The exponential decay form ensures that rapidly decreases when the power suddenly changes, while recovers to a larger value when the load is stable to improve the response speed. When the temperature change rate ( ) is large, is increased to accelerate the elimination of the static error (for example, when the temperature rises rapidly, a stronger integral action is required to suppress it). Here, linear increase is used to ensure that the integral action is enhanced when the temperature changes rapidly, and the integral action returns to normal when the temperature is stable to avoid integral saturation.

[0041] S05, if the temperature difference between the inlet and outlet is equal to the preset threshold, then the target fan speed is determined according to the chip maximum temperature and the chip heating power through a first preset formula, so that the fan in the air-cooled condenser rotates at the target fan speed.

[0042] Specifically, the equality of the outlet temperature difference and the preset threshold indicates that the chip is in a suitable operating temperature range. Then, the fan speed is adjusted to ensure that the chip can continuously operate in this temperature range. Thus, the fan speed is adjusted so that, on the premise of meeting the heat dissipation requirements of the chip, the fan speed will be as small as possible to avoid energy waste.

[0043] Additionally, after the step of obtaining the temperatures at the inlet and outlet of the chip-level evaporator and the maximum chip temperature at the chip in real time through preset sensors and determining the corresponding relationship between the inlet-outlet temperature difference and the preset threshold, the following steps are included: If the inlet-outlet temperature difference is less than the preset threshold, then according to a preset adjustment method, control the valve opening of the pipeline valve corresponding to the inlet-outlet temperature difference to increase as the inlet-outlet temperature difference increases; determine the target fan speed through the first preset formula based on the maximum chip temperature and the chip heating power, so that the fan in the air-cooled condenser rotates at the target fan speed, and detect the valve opening and the inlet-outlet temperature difference in real time; If the inlet-outlet temperature difference is greater than the preset threshold and the valve opening reaches the maximum, generate an alarm message, and perform a shutdown process on the server corresponding to the chip after the duration of the current state exceeds the preset time critical value. In specific implementation, when overheating occurs at the chip, it is necessary to adjust the valve opening and the fan speed according to the real-time temperature condition to enable the chip to dissipate heat quickly. When the heat dissipation efficiency of the device is maximized and the chip is still in an overheated state, it indicates a malfunction at the chip, and it is necessary to perform a shutdown process on the server to avoid affecting the stable operation of other servers or chips.

[0044] In summary, in the immersion liquid cooling device control method in the above embodiments of the present invention, by combining the thermosyphon with the immersion liquid cooling technology, the chip-level evaporator is used to accurately cool the high-heat chips of the server, and the cabinet-level evaporator is used to diffusely cool other electronic devices of the server through the immersion liquid cooling medium, realizing partitioned high-efficiency and accurate cooling. Since the thermosyphon is a passive heat transfer method, relying on the phase change cycle of the internal working fluid for heat transfer, without additional power devices such as pumps, the system structure is simplified, the energy consumption and noise are reduced, and the applicability of the device is enhanced. By detecting the temperature difference between the inlet and outlet of the chip-level evaporator and the maximum temperature of the corresponding chip, the valve opening of the corresponding pipeline and the rotation speed of the fan in the air-cooled condenser are accurately adjusted according to the heat condition of the chip, so as to adjust the flow rate at the corresponding chip-level evaporator and the heat transfer efficiency between the thermosyphon and the fan, realizing targeted control and adjustment of the cooling effect at each chip, so that the chip operates within a normal range, and the rotation speed of the fan will not be too large, thus ensuring stable control of the cooling effect at each chip and avoiding waste of fan energy. Therefore, the present invention solves the problem in the prior art that there is a lack of an immersion liquid cooling device, control method and system with controllable cooling object, cooling effect and wide application range.

[0045] Embodiment 2 Please refer to Figure 2, shown is the structural block diagram of the control system of the immersion liquid cooling device proposed in the second embodiment of the present invention. The control system 20 of the immersion liquid cooling device includes: a parameter acquisition module 21, a judgment module 22, a valve adjustment judgment module 23, a first air cooling control module 24, and a second air cooling control module 25, where: The parameter acquisition module 21 is configured to obtain in real time the temperatures at the inlet and outlet of the chip-level evaporator at the chip and the highest chip temperature through a preset sensor, and determine the corresponding relationship between the inlet and outlet temperature difference and a preset threshold; The judgment module 22 is configured to judge the corresponding relationship between the inlet and outlet temperature difference and the preset threshold; The valve adjustment judgment module 23 is configured to, when the inlet and outlet temperature difference is less than the preset threshold, control the valve opening of the pipeline valve corresponding to the inlet and outlet temperature difference to linearly decrease as the inlet and outlet temperature difference increases, and judge in real time whether the valve opening reaches the minimum; The first air cooling control module 24 is configured to, when the valve opening reaches the minimum and the outlet temperature is still less than the preset threshold, determine the target fan speed according to the highest chip temperature and the chip heating power through a first preset formula, so that the fan in the air-cooled condenser rotates at the target fan speed; The second air cooling control module 25 is configured to, when the inlet and outlet temperature difference is equal to the preset threshold, determine the target fan speed according to the highest chip temperature and the chip heating power through a first preset formula, so that the fan in the air-cooled condenser rotates at the target fan speed.

[0046] The functions or operation steps realized when the above modules are executed are substantially the same as those in the above method embodiment, and will not be elaborated here.

[0047] Embodiment Three Please refer to Figures 4 to 6 , on the other hand, the present invention also proposes an immersion liquid cooling device, The device includes: A liquid cooling cabinet 9 filled with a highly thermally conductive insulating coolant; Servers 1, multiple servers 1 are arranged in an array in the liquid cooling cabinet 9 and are immersed in the coolant, and chips 2 are provided on the servers 1; A cabinet-level evaporator 4, the cabinet-level evaporator 4 is hollow and surrounds the inner wall of the liquid cooling cabinet 9, and a liquid-phase condensing working medium flows inside for refrigerating all the coolant in the liquid cooling cabinet 9; Chip-level evaporators 3, multiple chip-level evaporators 3 respectively cover the corresponding chips 2 alone, and a liquid-phase condensing working medium flows inside for independently refrigerating the corresponding chips 2; A thermosyphon 5 is used to connect the cabinet-level evaporator 4 and the chip-level evaporator 3, so that the cabinet-level evaporator 4 and the chip-level evaporator 3 form a low-thermal-resistance coupled closed-loop system; An air-cooled condenser 8 is arranged outside the liquid-cooled cabinet 9 and connected to the thermosyphon 5 through a pipeline, and is used to dissipate heat from the condensing working fluid in the thermosyphon 5.

[0048] Specifically, the cabinet-level evaporator 4 adopts a double-layer coil structure. The inner layer is a channel for the low-temperature liquid condensing working fluid, and the outer layer is a channel for the high-temperature vapor condensing working fluid; the low-temperature liquid condensing working fluid flows to the chip-level evaporator 3, and the high-temperature vapor condensing working fluid flows to the thermosyphon 5 and the air-cooled condenser 8. The air-cooled condenser 8 includes an integrated finned tube heat exchanger 10 and a fan 11. A power supply 14 and an expansion card 13 are also provided on the server. Through the double-layer coil structure, the heat exchange efficiency between the two channels is reduced, the heat dissipation effect is ensured, and the space is utilized to a great extent.

[0049] In addition, the pipelines of each thermosyphon 5 are composed of a Z-shaped structure. A first temperature sensor 6 is provided at the inlet and outlet of the chip-level evaporator 3 in each thermosyphon 5, and a second temperature sensor 12 is provided at the chip 2. The temperatures at the inlet and outlet of the chip 2 and the chip-level evaporator 3 are monitored by the temperature sensors to adjust the valve opening of the valve 7 at the corresponding pipeline and the cooling efficiency of the air-cooled condenser 8, so as to realize the targeted cooling of the chip 2.

[0050] In specific implementation, the liquid-phase working fluid in the liquid-cooled cabinet 9 is a highly thermally conductive insulating coolant such as 3M fluorinated liquid, PAO or mineral oil, and the two-phase refrigerant of the low-boiling working fluid circulates in the chip-level evaporator 3 of the thermosyphon 5.

[0051] In summary, by combining the thermosyphon 5 with the immersion liquid cooling technology, the chip-level evaporator 3 is used to accurately cool the high-heat chips of the server, and the cabinet-level evaporator 4 is used to diffusely cool other electronic devices of the server 1 through the immersion liquid cooling medium, so as to achieve efficient and accurate zone cooling; and combined with the corresponding control method, the sensor is used to sense the highest temperature of the chip and the temperature difference at the inlet and outlet of the chip-level evaporator 3, and the rotation speed of the fan 11 and the refrigerant supply amount of different evaporators are respectively adjusted to solve the problem of uneven liquid distribution of the cabinet-level evaporator 4 and the chip-level evaporator 3 in the immersion liquid cooling coupled thermosyphon 5 partition cooling system, so as to achieve the purpose of eliminating local hot spots and improving the system energy efficiency.

[0052] Embodiment 4 On the other hand, the present invention also proposes an electronic device. Please refer to Figure 3, which shows a schematic diagram of an electronic device in an embodiment of the current region of the present invention, including a memory 200, a processor 100, and a computer program 300 stored on the memory and executable on the processor. When the processor 100 executes the computer program 300, it implements the immersion liquid cooling device control method as described above.

[0053] Among them, in some embodiments, the processor 100 may be a central processing unit (CPU), a controller, a microcontroller, a microprocessor, or other data processing chips, and is used to run the program code stored in the memory 200 or process data, such as executing an access restriction program, etc.

[0054] Among them, the memory 200 includes at least one type of readable storage medium, and the readable storage medium includes flash memory, hard disk, multimedia card, card-type memory (such as SD or DX memory, etc.), magnetic memory, magnetic disk, optical disk, etc. In some embodiments, the memory 200 may be an internal storage unit of the electronic device, such as the hard disk of the electronic device. In other embodiments, the memory 200 may also be an external storage device of the electronic device, such as a plug-in hard disk equipped on the electronic device, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. Further, the memory 200 may also include both an internal storage unit and an external storage device of the electronic device. The memory 200 can not only be used to store application software and various types of data of the electronic device, but also be used to temporarily store data that has been output or will be output.

[0055] It should be noted that Figure 3 the structure shown does not constitute a limitation on the electronic device. In other embodiments, the electronic device may include fewer or more components than shown in the figure, or combine certain components, or have different component arrangements.

[0056] The embodiment of the present invention also proposes a computer-readable storage medium, on which a computer program is stored, and when the program is executed by a processor, it implements the immersion liquid cooling device control method as described above.

[0057] Those skilled in the art can understand that the logic and / or steps represented in the flowchart or described in other ways herein, for example, can be considered as a defined sequence list of executable instructions for implementing logical functions, and can be specifically implemented in any computer-readable medium for use by an instruction execution system, apparatus, or device (such as a computer-based system, a system including a processor, or other systems that can fetch and execute instructions from the instruction execution system, apparatus, or device), or used in combination with these instruction execution systems, apparatus, or devices. For the purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transport a program for use by or in combination with an instruction execution system, apparatus, or device.

[0058] More specific examples (a non-exhaustive list) of computer-readable media include the following: an electrical connection portion (electronic device) having one or more wirings, a portable computer diskette (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium can even be paper or other suitable media on which the program can be printed, because the program can be obtained electronically, for example, by optically scanning the paper or other media, followed by editing, interpretation, or other suitable processing as necessary, and then stored in a computer memory.

[0059] It should be understood that various parts of the present invention can be implemented by hardware, software, firmware, or a combination thereof. In the above-described embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, any one or a combination of the following techniques well known in the art can be used: discrete logic circuits having logic gate circuits for implementing logical functions on data signals, application-specific integrated circuits having appropriate combinational logic gate circuits, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), and the like.

[0060] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0061] The above embodiments merely represent several implementation manners of the present invention. The description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the invention patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all fall within the protection scope of the present invention. Therefore, the protection scope of the invention patent of the present invention shall be subject to the appended claims.

Claims

1. A control method for an immersion liquid cooling device, characterized in that, Applied to an immersion liquid cooling device, the immersion liquid cooling device includes a liquid cooling cabinet, servers and a cabinet-level evaporator arranged in an array in the liquid cooling cabinet, a chip-level evaporator arranged at the chip of the server, a heat pipe connecting the cabinet-level evaporator and the chip-level evaporator, and an air-cooled condenser for cooling the heat pipe. The method includes: Obtain the temperature at the inlet and outlet of the chip-level evaporator at the chip and the highest chip temperature in real time through a preset sensor; Judge the corresponding relationship between the temperature difference between the inlet and outlet and a preset threshold; If the temperature difference between the inlet and outlet is less than the preset threshold, according to a preset adjustment method, control the valve opening of the pipeline valve corresponding to the temperature difference between the inlet and outlet to decrease as the temperature difference between the inlet and outlet increases, and judge in real time whether the valve opening reaches the minimum; When the valve opening reaches the minimum and the outlet temperature is still less than the preset threshold, determine the target fan speed through a first preset formula according to the highest chip temperature and the chip heating power, so that the fan in the air-cooled condenser rotates at the target fan speed; If the temperature difference between the inlet and outlet is equal to the preset threshold, determine the target fan speed through the first preset formula according to the highest chip temperature and the chip heating power, so that the fan in the air-cooled condenser rotates at the target fan speed.

2. The control method of the immersion liquid cooling device according to claim 1, wherein The first preset formula is: where v min is the minimum rotational speed of the fan, K P , K i , K d are the gain coefficients of proportional, integral, and derivative, is the current maximum temperature, is the heat generation power of the chip, C is the fan cooling efficiency constant, t is the time independent variable in the control system, is the integral variable.

3. The control method of the immersion liquid cooling device according to claim 2, characterized in that, After the step of obtaining the temperature at the inlet and outlet of the chip-level evaporator at the chip and the highest chip temperature in real time through a preset sensor and determining the corresponding relationship between the temperature difference between the inlet and outlet and a preset threshold, it includes: If the temperature difference between the inlet and outlet is less than the preset threshold, according to a preset adjustment method, control the valve opening of the pipeline valve corresponding to the temperature difference between the inlet and outlet to increase as the temperature difference between the inlet and outlet increases; Determine the target fan speed through the first preset formula according to the highest chip temperature and the chip heating power, so that the fan in the air-cooled condenser rotates at the target fan speed, and detect the valve opening and the temperature difference between the inlet and outlet in real time; If the temperature difference between the inlet and outlet is greater than the preset threshold and the valve opening reaches the maximum, generate an alarm message, and perform a shutdown process on the server corresponding to the chip after the duration of the current state exceeds a preset time critical value.

4. The control method of the immersion liquid cooling device according to claim 1, wherein The step of controlling the valve opening of the pipeline valve corresponding to the temperature difference between the inlet and outlet to decrease as the temperature difference between the inlet and outlet increases according to a preset adjustment method includes: Determine the real-time system thermal imbalance index through a second preset formula, and judge whether the system thermal imbalance index is less than a preset value; If the system thermal imbalance index is less than the preset value, control the valve opening to decrease linearly as the temperature difference between the inlet and outlet increases; If the system thermal imbalance index is not less than the preset value, adjust each valve opening to adjust the flow rate of the pipeline in each chip-level evaporator; The second preset formula is: Among them, is the system thermal imbalance index, is the standard deviation of the outlet temperatures of all pipelines, is the mean value of the outlet temperatures of all pipelines, is the weighting coefficient, is the maximum value of the highest temperatures corresponding to all chips.

5. The control method of the immersion liquid cooling device according to claim 4, characterized in that The step of adjusting each valve opening to adjust the flow rate of the pipeline in each chip-level evaporator includes: Determine the flow rate weight coefficients of each pipeline through a third preset formula, and adjust the valve opening degrees of the valves corresponding to each pipeline according to the flow rate weight coefficients to adjust the flow rates of the pipelines in each chip-level evaporator; The third preset formula is: wherein, is the flow rate weighting coefficient of the th pipeline, is the temperature difference between the inlet and outlet of the th pipeline, is the total number of pipelines, is the temperature penalty factor, is the maximum chip temperature of the th pipeline.

6. The control method of the immersion liquid cooling device according to claim 2, characterized in that: Obtain the chip power consumption change rate and the chip maximum temperature change rate to adjust the gain coefficient of the first preset formula through a preset adjustment formula; The preset adjustment formula is: Among them, and are the gain coefficients of the proportional and integral-differential before adjustment, is the chip power consumption change rate, is the highest temperature change rate, and are the attenuation coefficients.

7. An immersion liquid cooling device, characterized in that, For implementing the control method of the immersion liquid cooling device according to any one of claims 1 to 6, the device includes: A liquid cooling cabinet filled with a highly thermally conductive insulating coolant; Servers, a plurality of the servers are arranged in an array in the liquid cooling cabinet and are immersed in the coolant, and chips are provided on the servers; A cabinet-level evaporator, which is hollow and surrounds the inner wall of the liquid cooling cabinet, and a liquid-phase condensing working medium flows inside for refrigerating all the coolant in the liquid cooling cabinet; Chip-level evaporators, a plurality of the chip-level evaporators respectively cover the corresponding chips alone, and a liquid-phase condensing working medium flows inside for independently refrigerating the corresponding chips; A heat pipe, which is used to connect the cabinet-level evaporator and the chip-level evaporator to form a low thermal resistance coupled closed-loop system for the cabinet-level evaporator and the chip-level evaporator; An air-cooled condenser, which is arranged outside the liquid cooling cabinet and is connected to the heat pipe through a pipeline for dissipating heat from the condensing working medium in the heat pipe.

8. The immersion liquid cooling device according to claim 7, characterized in that, The cabinet-level evaporator adopts a double-layer coil structure, the inner layer is a channel for the low-temperature liquid condensing working medium, and the outer layer is a channel for the high-temperature vapor condensing working medium; the low-temperature liquid condensing working medium flows to the chip-level evaporator, and the high-temperature vapor condensing working medium flows to the air-cooled condenser of the heat pipe.

9. The immersion liquid cooling device according to claim 7, wherein, The pipelines of each heat pipe are composed of a Z-shaped structure, and first temperature sensors are arranged at the inlets and outlets of the chip-level evaporators in each heat pipe, and second temperature sensors are arranged at the chips.

10. An immersion liquid cooling device control system, characterized in that, For implementing the control method of the immersion liquid cooling device according to any one of claims 1 to 6, the system includes: A parameter acquisition module, which is used to acquire the temperature at the inlets and outlets of the chip-level evaporator at the chip and the chip maximum temperature in real time through preset sensors; A judgment module, which is used to judge the corresponding relationship between the inlet and outlet temperature difference and a preset threshold; A valve adjustment judgment module, which is used to control the valve opening degree of the pipeline valve corresponding to the inlet and outlet temperature difference to linearly decrease with the increase of the inlet and outlet temperature difference when the inlet and outlet temperature difference is less than the preset threshold, and judge in real time whether the valve opening degree reaches the minimum; A first air-cooling control module, which is used to determine the target fan speed through a first preset formula according to the chip maximum temperature and the chip heating power when the valve opening degree reaches the minimum and the outlet temperature is still less than the preset threshold, so that the fan in the air-cooled condenser rotates at the target fan speed; The second air-cooling control module is used to, when the temperature difference between the inlet and the outlet is equal to the preset threshold, determine the target fan speed according to the highest chip temperature and the chip heating power through a first preset formula, so that the fan in the air-cooled condenser rotates at the target fan speed.

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