A method for preparing a micro-bristle structure diamond grinding wheel with positive rake angle of abrasive grains and a diamond grinding wheel obtained thereby
By forming a positive back angle and micro-comb structure of abrasive grains on the surface of a diamond grinding wheel, and using electroplating and pulsed laser technology to achieve orderly arrangement and efficient processing of abrasive grains, the problems of high grinding force, low efficiency and subsurface damage during grinding are solved, thus improving grinding quality and efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANDONG UNIV
- Filing Date
- 2025-05-23
- Publication Date
- 2026-07-14
AI Technical Summary
Existing diamond grinding wheels suffer from uneven abrasive distribution, high grinding force, increased grinding temperature, low grinding efficiency, and subsurface damage to the workpiece when grinding hard and brittle materials. Traditional mechanical dressing methods are prone to wear and low processing efficiency.
Pulsed laser processing technology is used to form abrasive grains with a positive back angle and micro-comb structure on the surface of diamond grinding wheel. The orderly arranged abrasive grains are prepared by electroplating, and the tangential dressing and micro-comb structure processing are performed by a pulsed laser system. The laser overlap rate is controlled to achieve uniform distribution of abrasive grains and efficient processing.
It improves grinding quality and efficiency, reduces grinding force and temperature, reduces subsurface damage to workpieces, enhances the bonding strength of abrasive grains and the number of grinding edges, and improves the surface integrity of materials.
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Abstract
Citation Information
Patent Citations
CN105728961B
CN107520770A
CN109333385B
CN118106898A
CN105728961A