Adjustable electrolysis device, electroplating system and electroplating method

Abstract

The invention relates to an adjustable electrolysis device, an electroplating system and an electroplating method. The adjustable electrolysis device comprises an electroplating mold, and the electroplating mold comprises an outer cylinder and an inner cylinder arranged in the outer cylinder; the outer cylinder is provided with an outer outlet and an inner inlet communicated with the outer outlet through a channel. According to the method, the internal cylinder and external cylinder structures of the electroplating mold are determined, so that the uniformity of the local coating film thickness of a semiconductor electronic element and the accuracy of a plating area can be quickly obtained, and the requirement of a high-end semiconductor lead frame in the metal coating electroplating process can be met; and the requirement for the screening accuracy of the optimal condition of the selective adjustable electroplating mold is met. The invention further provides an electroplating mold combination of a disposable adjustable electrolysis device as an update, and a rapid and accurate electroplating method for local plating areas of various semiconductor electronic elements is realized through the adjustable function of the through opening width of a cylinder in the electroplating mold.

Description

Technical Field

[0001] The present invention relates to an adjustable electrolysis device, an electroplating system and an electroplating method, and belongs to the technical field of local electroplating of semiconductor electronic components. Background Art

[0002] Electrolytic metal coating processing is a special processing technology for forming metal coating products with nanoscale or micron-scale in an electrolytic cell according to the principle of electrochemical cathodic deposition. Electroplating processing can be used to manufacture local electrolytic metal coating materials for precision high-end semiconductor electronic components. In semiconductor electronic component technology equipment widely used in the aerospace field, such as flight control systems, navigation systems, communication systems and radar systems, high-precision and high-performance semiconductor electronic components for signal transmission are required. At present, there is still a considerable gap between the manufacturing level of local electrolytic metal coatings of high-performance semiconductor electronic components and the international level. Among them, the electrolytic metal coating processing and manufacturing technology of lead frames for chip packaging in semiconductor electronic components is an extremely important part of the chip packaging production and manufacturing industrial chain of high-performance semiconductor electronic components.

[0003] High-performance semiconductor electronic component high-end precision electrolytic metal coating products need to have reliable and excellent electronic information transmission performance. Therefore, it is necessary to develop a high-speed and stable electrolytic metal coating production and manufacturing technology for local electroplating of various semiconductor electronic components, and the required metal coating formed must have high density, high uniformity and excellent corrosion resistance. The high-performance requirements for the metal coating in the local plating area of semiconductor electronic components are the basic conditions for semiconductor electronic products to maintain normal operation. If the uniformity of the metal coating is not high and the density is poor, it will lead to signal transmission distortion of semiconductor electronic components. In particular, the lack of uniformity and low density of the metal coating will cause a decrease in corrosion resistance, directly resulting in the scrapping of high-end semiconductor electronic products.

[0004] However, for the production and processing of the local plating area of various semiconductor electronic components by existing electroplating technologies, it is very difficult to obtain qualified products with high density, high uniformity and excellent corrosion resistance at one time by using the fabricated electroplating molds to debug the metal coatings in the local plating area. Therefore, the current technical level can only correct the possible electroplating mold structure parameters that affect the performance of the metal coating according to the debugging results of the first set of electroplating molds, and repeatedly adjust the performance requirements of the products. During the debugging process, if the requirements cannot be met only by correcting the original electroplating mold, then only the second set of electroplating molds can be remade for a new round of debugging. The debugging process is repeated until the debugging results meet the requirements that the metal coating has high density, high uniformity and excellent corrosion resistance.

[0005] It can be seen from this that the technical level of the electroplating mold for the local plating area of existing semiconductor electronic components not only requires modifying the original electroplating mold or remaking more than a second set of electroplating molds, resulting in a long debugging time and low efficiency; moreover, the size of the electroplating solution outlet of the mold remains fixed and unchanged, and the pressure of the electroplating solution chamber cannot be accurately regulated. Currently, it can only be adjusted semi-quantitatively through the valve of the solution pipeline; more importantly, the instability of the current metal plating processing and manufacturing technology level for the local plating area of semiconductor electronic components directly leads to the requirement for highly dense, highly uniform, and excellent corrosion-resistant metal plating products, which cannot be continuously and stably achieved. Therefore, exploring and creating an electrolytic device and electroplating system with a rapidly selectively adjustable electroplating mold jet outlet size within a certain range and capable of precisely electroplating various high-end semiconductor electronic component local plating areas has become a very important and urgently needed research topic to be solved. Summary of the Invention

[0006] To solve the above problems, the present invention provides an adjustable electrolytic device, electroplating system, and electroplating method to meet the accuracy requirements for screening the optimal conditions of a selectively adjustable electroplating mold during the metal plating process of high-end semiconductor lead frames.

[0007] To achieve the above object, the technical solution adopted by the present invention is as follows: In a first aspect, the present invention provides an adjustable electrolytic device, including an electroplating mold, where the electroplating mold includes an outer cylinder and an inner cylinder disposed within the outer cylinder; the outer cylinder is provided with an outer outlet and an inner inlet connected to the outer outlet through a channel; The area of the outer outlet of the outer cylinder S 外出口 is: S 外出口 = L 外 × D 外 Formula 1 where, L 外 is the long side length of the outer outlet of the outer cylinder, D 外 is the short side length of the outer outlet of the outer cylinder; The area of the inner inlet of the outer cylinder S 内入口 is larger than the area of the outer outlet S 外出口 The area of the inner inlet of the outer cylinder S 内入口 is: S 内入口 = L内 × D 内 Formula 2 Wherein, L 内 is the long side length of the inlet inside the outer cylinder, D 内 is the short side length of the inlet inside the outer cylinder; The number of channels connecting the outer outlet and the inner inlet of the outer cylinder is calculated according to the pitch of semiconductor electronic products as follows: M = 2 πr / 3 P Formula 3 Wherein, M is the number of channels, r is the outer surface radius of the outer cylinder, P is the pitch of semiconductor electronic products; The inner cylinder is provided with an electroplating solution ejection outlet, and the inner cylinder can rotate to displace the electroplating solution ejection outlet of the inner cylinder from the inner inlet of the outer cylinder, so as to adjust the size of the inner inlet of the outer cylinder and the flow rate of the electroplating solution passing through; The width of the electroplating solution ejection outlet of the inner cylinder and the width of the inner inlet of the outer cylinder D 内 are less than the distance between the two outlets W : D 内 < W Formula 4 The outer outlet area of the outer cylinder S 外出口 , satisfies the following formula: S 外出口 ≤ S 实测 ≤ S 外出口 + 0.5mm 2 Formula 5 Wherein, S 实测 is the actual electroplating operation of the local plating area of the semiconductor electronic component, and the surface area of the metal coating specification of the local plating area obtained.

[0008] In an embodiment of the present invention, the outer outlet size of the outer cylinder is adapted to the size of the local plating area of the semiconductor electronic component.

[0009] In an embodiment of the present invention, the outer outlets of several of the outer cylinders are provided on the outer circumference of the outer cylinders, the inner inlets of several of the outer cylinders are provided on the inner circumference of the outer cylinders, and the outer outlets of the outer cylinders correspond to the inner inlets one by one and are connected through channels.

[0010] In an embodiment of the present invention, the metal materials of the outer cylinders include: titanium, platinum-plated titanium, stainless steel 316, and stainless steel 304.

[0011] In an embodiment of the present invention, when the material of the outer cylinder is selected as platinum-plated titanium, only the inside of the channels of the outer cylinder of the electroplating mold is plated.

[0012] In an embodiment of the present invention, the types of metals in the electroplating solution include: monomer coatings Au, Ag, Ni, Sn, Cu, Pd, Rh, Pt; binary alloy metals of alloy coatings Au-Ni, Pd-Ni, Ni-P, and W-Ni.

[0013] In a second aspect, the present invention provides an electroplating system that uses the adjustable electrolysis device described above. The electroplating system includes: an electrolysis device control system and an electroplating condition monitoring system; Among them, the electrolysis device control system includes: A semiconductor electronic component local plating area, which is used to provide the standard for the design of the electroplating solution outlet of the electroplating mold of the adjustable electrolysis device; An external electroplating mold channel control module, including an electroplating mold, the electroplating mold includes an outer cylinder, and the outer cylinder is provided with an electroplating solution outer outlet, a channel connected to the electroplating solution outer outlet, and an electroplating solution inner inlet; An internal electroplating mold adjustment and control module, including an electroplating mold, the electroplating mold includes an inner cylinder, the inner cylinder is provided with an electroplating solution injection outlet corresponding to the inner inlet of the outer cylinder, and the inner cylinder can rotate to displace the electroplating solution injection outlet of the inner cylinder from the inner inlet of the outer cylinder to adjust the size of the inner inlet of the outer cylinder; An electrolysis device accessory configuration control module, including: an electroplating solution tank, an electroplating solution heater, a pump for transporting the electroplating solution, and an electrolysis power supply; Among them, the electroplating condition monitoring system includes: A plating part electroplating condition management and control module, which is used to provide corresponding electroplating condition parameters when the adjustable electrolysis device conducts electroplating operation tests on the local area of the semiconductor electronic component; External electroplating mold condition control module, which is used to perform operations on the parameters of the external cylinder of the electroplating mold and the characteristic data of the local plating area of the semiconductor electronic component through Formula 1, Formula 2, Formula 3 and Formula 4 to obtain the management and control of the specified conditions of the external cylinder of the electroplating mold; Internal electroplating mold condition control module, which can be finely adjusted according to the size of the local plating area of the semiconductor electronic component by rotation. The width of the electroplating solution ejection outlet of the internal cylinder and the inner inlet width of the external cylinder D 内 is less than the distance between the two outlets W : D 内 < W ; Auxiliary configuration operation condition control module, based on the electrolysis device auxiliary configuration control module, is applied to the actual electroplating operation of the local plating area of the semiconductor electronic component. The obtained surface area of the metal coating in the local plating area S 实测 , compare S 外出口 and S 实测 . If it satisfies: S 外出口 ≤ S 实测 ≤ S 外出口 + 0.5mm 2 Formula 5 then confirm that the adjustable electrolysis device is applicable; otherwise, based on the actual S 外出口 and S 实测 , modify S 外出口 and verify S 实测 until Formula 5 is satisfied.

[0014] In a third aspect, the present invention provides an electroplating method, which uses the adjustable electrolysis device or the electroplating system described above. The electroplating method includes the following steps: S1. Assemble the adjustable electrolysis device; S2. Perform electroplating processing on the local plating area of the semiconductor electronic component, manage the operation according to the plating conditions of the workpiece, and control the standard range of the metal coating in the local plating area; S3. Control the conditions of the external electroplating mold. By setting the cross-sectional area of the outer outlet of the external cylinder of the electroplating mold S 外出口 , measure and control the obtained gold-plated surface area S 实测 ; S4. Internal electroplating mold condition control, the cross-sectional area of the through-port adjusted by clockwise rotating the inner cylinder of the electroplating mold S 通口 , the measured gold-plated surface area obtained through control management S 实测 ; S5. Based on S2 - S4, the cross-sectional area of the outer outlet of the outer cylinder set by the local plating area of the semiconductor electronic component S 外出口 Perform actual electroplating operation, and the gold-plated surface area of the local plating area obtained S 实测 , if it satisfies Formula 5: S 外出口 ≤ S 实测 ≤ S 外出口 + 0.5mm 2 Formula 5 Then confirm that the adjustable electrolysis device is applicable; otherwise, based on the actual S 外出口 and S 实测 , modify S 外出口 and verify S 实测 , and loop through steps S2 - S4 until Formula 5 is satisfied.

[0015] The beneficial effects of the present invention are: An adjustable electrolysis device, electroplating system and electroplating method provided by the present invention, through the organic integration of formulas 1-4 in the design of the inner cylinder and outer cylinder of the electroplating mold and the control module of the attached configuration of the electrolysis device, establish the discriminant formula 5 for the local plating area of the adjustable electrolysis device provided by the present invention. Through a series of management and control of formulas 1-5, the structures of the inner cylinder and outer cylinder of the electroplating mold are established. During the actual electroplating process, the adjustable setting range of the inner cylinder opening width of the electroplating mold for various monomer metal salts and binary metal salt electroplating solutions and the discriminant classification standard can be quickly established, and then the adjustable electrolysis device conditions and electroplating methods for the local plating area of the optimal semiconductor electronic components can be obtained. It can not only quickly achieve the uniformity of the local coating thickness and the accuracy of the plating area of the semiconductor electronic components, meet the accuracy requirements for the best condition screening of the selective adjustable electroplating mold during the metal coating electroplating process of high-end semiconductor lead frames. Moreover, aiming at the problem of the existing technology that the electroplating mold needs to be continuously improved or remade, and the method of debugging electroplating products, a combination of electroplating molds for a disposable adjustable electrolysis device is provided for replacement, and through the adjustable function of the inner cylinder opening width of the electroplating mold, a fast and accurate electroplating method for the local plating area of various semiconductor electronic components is realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0017] Figure 1 It is a schematic structural diagram of the outer cylinder provided by the present invention.

[0018] Figure 2 It is a schematic structural diagram of the inner cylinder provided by the present invention.

[0019] Figure 3 It is a schematic structural diagram of the combination of the inner cylinder and the outer cylinder provided by the present invention.

[0020] Figure 4 It is a schematic plan view of the connection inlet and outlet of the inner cylinder and the outer cylinder provided by the present invention.

[0021] Figure 5 It is an overlapping plan view of the connection inlet and outlet of the inner cylinder and the outer cylinder provided by the present invention.

[0022] Figure 6 It is a misaligned plan view of the connection inlet and outlet of the inner cylinder and the outer cylinder provided by the present invention.

[0023] Figure 7 It is a schematic diagram of the connection inlet / outlet dimensions and adjacent distance between the inner cylinder and the outer cylinder provided by the present invention.

[0024] Figure 8 It is a schematic structural diagram of the channel of the outer cylinder provided by the present invention.

[0025] Figure 9 It is a composition diagram of the electroplating system provided by the present invention.

[0026] Figure 10 It is a schematic diagram of the local plating area of a semiconductor electronic component provided by the present invention.

[0027] In the figure: 100, electrolysis device control system; 110, local plating area of semiconductor electronic components; 120, external electroplating mold channel control module; 130, internal electroplating mold adjustment and control module; 140, electrolysis device accessory configuration control module; 200, electroplating condition monitoring system; 210, workpiece electroplating condition management and control module; 220, external electroplating mold condition control module; 230, internal electroplating mold condition control module; 240, accessory configuration operation condition control module; 500, inner cylinder; 600, outer cylinder. Specific Embodiments

[0028] Next, the technical solutions of the present invention will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0029] Embodiment 1 As Figures 1 to 8 shown, this embodiment provides an adjustable electrolysis device for local electroplating processing of semiconductor electronic components. The adjustable electrolysis device includes an electroplating mold, and the electroplating mold includes an outer cylinder 600 and an inner cylinder 500 disposed inside the outer cylinder 600.

[0030] The outer cylinder 600 is provided with an outer outlet for electroplating solution and an inner inlet connected to the outer outlet. The outer outlet size of the outer cylinder 600 matches the size of the local plating area 110 of the semiconductor electronic component, achieving the purpose of only electroplating the local plating area. Among them, the outer outlets of several outer cylinders 600 are disposed on the outer periphery of the outer cylinder 600, and the inner inlets of several outer cylinders 600 are disposed on the inner periphery of the outer cylinder 600. The outer outlets and inner inlets of the outer cylinder 600 correspond one-to-one and are connected through channels. The area of the outer outlet of the outer cylinder 600 S 外出口 is: S 外出口 = L 外 × D 外 Formula 1 wherein, L 外 is the long side length of the outer outlet of the outer cylinder 600, D 外 is the short side length of the outer outlet of the outer cylinder 600.

[0031] The inner inlet area of the outer cylinder 600 S 内入口 is larger than the outer outlet area S 外出口 , that is S 内入口 > S 外出口 ; The inner inlet area of the outer cylinder 600 S 内入口 is: S 内入口 = L 内 × D 内 Formula 2 wherein, L 内 is the long side length of the inner inlet of the outer cylinder 600, D 内 is the short side length of the inner inlet of the outer cylinder 600.

[0032] Optionally, the metal material of the outer cylinder 600 includes: titanium, titanium-plated platinum, stainless steel 316, stainless steel 304, and its selection needs to be determined according to the characteristics of the electroplating solution. According to the requirements of the electroplating solution process, some anode metal surfaces need to be plated with precious metals. Among them, if the material of the outer cylinder 600 is selected as titanium-plated platinum, it is not necessary to plate the whole electroplating mold, and only the inner channel of the outer cylinder 600 of the electroplating mold needs to be plated.

[0033] Optionally, according to the pitch of semiconductor electronic products, within one-third of the circumference of the outer cylinder 600, that is, within a range of 120°, channels for transporting electroplating solution corresponding to the local plating area of semiconductor electronic components are defined and set. The number of channels connecting the outer outlet and the inner inlet of the outer cylinder 600 is calculated as follows according to the pitch of semiconductor electronic products: M = 2 πr / 3 P Formula 3 wherein, M is the number of channels, ris the outer surface radius of the outer cylinder 600, P is the pitch of the semiconductor electronic product.

[0034] As can be seen from Formula 3, since the effective electroplating area of the electrolytic anode is limited to one-third of the circumference 2 πr of the outer mold 600, its effective length is 2 πr / 3. Divide it by the pitch of the semiconductor electronic product P to obtain the number of channels in this independent plating area M .

[0035] As Figure 2 shown, the inner cylinder 500 is provided with an electroplating solution injection outlet.

[0036] As Figure 3 shown, the inner cylinder 500 and the outer cylinder 600 are precisely sleeved to form an integral electroplating mold. To solve the limitation that the existing electrolytic anode can only be used for the partial plating area of one semiconductor electronic component, the internal configuration of the electrolytic mold of the present invention can be selectively adjusted. Through the adjustment mechanism, fine-tuning can be carried out within a certain range according to the size of the partial plating area of the semiconductor electronic product.

[0037] As Figure 4 shown, the shape and area of the electroplating solution injection outlet of the inner cylinder 500 are the same as the inner inlet of the outer cylinder 600.

[0038] As Figure 5 shown, the shape and area of the electroplating solution injection outlet of the inner cylinder 500 are the same as the inner inlet of the outer cylinder 600, in a completely overlapping state.

[0039] As Figure 6 shown, the inner cylinder 500 can be finely adjusted clockwise. By misaligning the electroplating solution injection outlet of the inner cylinder 500 with the inner inlet of the outer cylinder 600, the size of the inner inlet of the outer cylinder 600 can be adjusted as required. Under the condition that the flow rate of the electroplating solution passing through is constant, that is, the electroplating solution flow rate remains unchanged, the more the misalignment increases the overlap and reduces the solution through-hole, the faster the solution injection flow rate.

[0040] As Figure 7 shown, the width of the electroplating solution injection outlet of the inner cylinder 500 and the width of the inner inlet of the outer cylinder 600 D 内 must be less than the distance between the two outlets W , that is, the following Formula 4: D 内 < W Formula 4 As Figure 8As shown, the inner inlet cross-sectional area of the outer cylinder 600 is much larger than the cross-sectional area of the outer outlet.

[0041] The outer outlet area of the outer cylinder 600 of the adjustable electrolysis device S 外出口 , satisfies the following formula: S 外出口 ≤ S 实测 ≤ S 外出口 + 0.5mm 2 Formula 5 Wherein, S 实测 is the actual electroplating operation of the local plating area of the semiconductor electronic component, and the surface area of the metal plating layer specification of the local plating area obtained.

[0042] Optionally, the metal types of the electroplating solution include: Monomer coatings Au, Ag, Ni, Sn, Cu, Pd, Rh, Pt; Binary alloy metals of alloy coatings Au-Ni, Pd-Ni, Ni-P, W-Ni.

[0043] Among them, only the inner surface of the channel of the outer cylinder 600 of the electroplating mold is plated with a precious metal platinum coating; for the adjustable electrolysis device provided by the present invention, the inner cylinder 500 of the electroplating mold not only has a general function for semiconductor electronic components with similar structures, but also improves the prior art that the electroplating mold must be integrally plated with precious metals. By only performing local plating on the inner surface of the channel, expensive precious metal plating raw materials are saved; at the same time, the electroplating mold of the present invention has a certain degree of versatility. For various products of semiconductor electronic components in different electroplating areas, only the outer cylinder 600 of the electroplating mold needs to be redesigned and manufactured, and it is combined with the general electroplating mold to obtain an electroplating mold for different electroplating areas.

[0044] Example Two As Figure 9 shown, this embodiment provides an electroplating system for realizing the actual application of the adjustable electrolysis device to the local plating area of semiconductor electronic components. The electroplating system includes: an electrolysis device control system 100 and an electroplating condition monitoring system (200); Wherein, the electrolysis device control system 100 includes: The local plating area 110 of the semiconductor electronic component, which is used to provide the standard for the electroplating solution outlet design scheme of the outer cylinder 600 of the electroplating mold of the adjustable electrolysis device; External electroplating mold channel control module 120, including an electroplating mold, the electroplating mold includes an external cylinder 600, the external cylinder 600 is provided with an external outlet of electroplating solution, a channel communicating with the external outlet of electroplating solution, and an internal inlet of electroplating solution; Internal electroplating mold adjustment and control module 130, including an electroplating mold, the electroplating mold includes an internal cylinder 500, the internal cylinder 500 is provided with an electroplating solution injection outlet corresponding to the internal inlet of the external cylinder 600, and the internal cylinder 500 can be finely adjusted clockwise. The electroplating solution injection outlet of the internal cylinder 500 is misaligned with the internal inlet of the external cylinder 600 to adjust the size of the internal inlet of the external cylinder 600 as required; Electrolysis device accessory configuration control module 140, including: an electroplating solution tank, an electroplating solution heater, a pump for transporting electroplating solution, and an electrolysis power supply; the electrolysis device accessory configuration control module 140 is applied to the actual test of the embodiment of the present invention; Wherein, the electroplating condition monitoring system (200) includes: Plated part electroplating condition management and control module 210, used to provide corresponding various electroplating condition parameters when the adjustable electrolysis device performs electroplating operation tests on the local area of semiconductor electronic components; External electroplating mold condition control module 220, used to manage and control the determined conditions of the external cylinder 600 of the electroplating mold by performing operations on various parameters of the external cylinder 600 of the electroplating mold and various characteristic data of the local plating area 110 of semiconductor electronic components through Formula 1, Formula 2, Formula 3 and Formula 4; Internal electroplating mold condition control module 230 can be finely adjusted within a certain range according to the size of the local plating area 110 of the semiconductor electronic component by clockwise rotation. The width of the electroplating solution injection outlet of the internal cylinder 500 and the width of the internal inlet of the external cylinder 600 D 内 Less than the distance between the two outlets W That is D 内 < W ; Accessory configuration operating condition control module 240, based on the electrolysis device accessory configuration control module 140, is applied to the actual electroplating operation of the local plating area 110 of the semiconductor electronic component. The surface area of the local plating area metal coating specification obtained S 实测 Compare S 外出口 And S 实测 If it satisfies: S 外出口 ≤ S实测 ≤ S 外出口 + 0.5mm 2 Formula 5 Then it is confirmed that the adjustable electrolysis device is applicable; otherwise, based on the actual S 外出口 and S 实测 as a reference, correct S 外出口 and verify S 实测 , until it meets Formula 5.

[0045] The accessory configuration operation condition control module 240 is used to precisely control the operation conditions of the electrolysis device accessory configuration control module 140 during the actual test operation of the adjustable electrolysis device.

[0046] Embodiment III This embodiment provides an electroplating method that uses the adjustable electrolysis device provided in Embodiment I or the electroplating system provided in Embodiment II, including the following steps: S1. Assemble the adjustable electrolysis device; Among them, the semiconductor electronic component product specifications: The local plating area test piece to be processed in this embodiment is as Figure 10 shown, with 3 columns of units, and the size of each unit is 63.5×8.5mm; the distance between two columns of units is 51mm. The standard thickness of the single-sided gold film is 500nm; The outer cylinder 600 of the electroplating mold: According to the semiconductor electronic component product specifications, the L 外 = 63.5mm, D 外 = 8.5mm; the cross-sectional area of the outer outlet S 外出口 = L 外 × D 外 = 63.5×8.5mm = 539.75mm 2 ; In addition, according to the distance of 51mm between two columns of products, therefore, according to Formula 4, the width of the inner inlet of the outer cylinder 600 of the electroplating mold D 内 must be less than W = 51mm; that is, L 内 = 93mm, D 内 = 45mm; S 内入口 = 4185mm 2; Further, the cross-sectional area of the inner entrances of the three channels of the outer cylinder 600 of the electroplating mold is much larger than that of the outer exits, that is S 内入口 > S 外出口 , with a ratio of more than 7 times; The metal material of the outer cylinder 600 of the electroplating mold is titanium metal. According to the product's gold plating specification, in order to increase its electrical conductivity, only the channels in contact with the electroplating solution are plated with platinum to enhance the electrical conductivity as the anode; The number of channels of the outer cylinder 600 of the electroplating mold can be calculated according to Formula 3. In this embodiment, since the product is a 3-column unit, the number of channels of the outer cylinder 600 of the electroplating mold is 3; The inner cylinder 500 of the electroplating mold: has 3 inner entrances with the same number as the outer cylinder 600, and through-holes with the same cross-sectional area as the inner entrances, that is L 通口 = 93mm, D 通口 = 45mm; S 通口 = 4185mm 2 ; When the through-holes of the inner cylinder 500 of the electroplating mold overlap with the inner entrances of the outer cylinder 600 of the electroplating mold, the cross-sectional area of the through-holes through which the electroplating solution can pass is the largest; The inner cylinder 500 of the electroplating mold can be adjusted within a certain range according to the size requirement of the local plating area 110 of the semiconductor electronic component by rotating clockwise; S2. Electroplate the local plating area 110 of the semiconductor electronic component, and perform operation management according to the electroplating conditions of the workpiece to control the standard range of the metal coating in the local plating area; S3. Control the conditions of the external electroplating mold. By setting the cross-sectional area of the outer exits of the outer cylinder 600 of the electroplating mold S 外出口 , measure and control the obtained gold-plated surface area S 实测 ; S4. Control the conditions of the internal electroplating mold. By setting the cross-sectional area of the through-holes adjusted by rotating the inner cylinder 500 of the electroplating mold clockwise S 通口 , measure and control the obtained gold-plated surface area S 实测 ; S5. Based on S2~S4, through the cross-sectional area of the outer exits of the outer cylinder 600 set by the local plating area 110 of the semiconductor electronic component S 外出口Perform the actual electroplating operation, and obtain the gold-plated surface area of the local plating area S 实测 , if the formula 5 is satisfied: S 外出口 ≤ S 实测 ≤ S 外出口 + 0.5mm 2 Formula 5 Then confirm that the adjustable electrolysis device is applicable; otherwise, based on the actual S 外出口 and S 实测 as the reference, modify S 外出口 and verify S 实测 , and loop through steps S2 - S4 until the formula 5 is satisfied.

[0047] Tests 1 - 9 Adopt the adjustable electrolysis device, electroplating system and electroplating method provided by the present invention, and various conditions are implemented according to S1 - S5 in the above-mentioned Embodiment 3, where: The standard gold-plated area of the local plating area 110 of the semiconductor electronic component S 标准 is: 539.75mm 2 ; Set the cross-sectional area of the outer outlet of the outer cylinder 600 of the electroplating mold S 外出口 to be the same as S 标准 : 539.75mm 2 ; The width of the through-port of the inner cylinder 500 of the electroplating mold is D 通口 = 45mm. By rotating the inner cylinder 500 clockwise, different through-port widths can be obtained, that is, the through-port width range is 0 < D 通口 ≤ 45mm; The detection standard for the test conditions implemented below is: 1. The average gold-plated film thickness ≥ 500nm, 2. The uniformity of the gold-plated film thickness distribution 0.0% ≤ film thickness error < 1.0% excellent 1.0% ≤ film thickness error < 3.0% good 3.0% ≤ film thickness error < 5.0% qualified 5.0% ≤ film thickness error unqualified 3. The measured gold-plated area S 实测The accuracy to check if it meets Formula 5.

[0048] Table 1 Inner Cylinder Port Width Conditions of Electroplating Molds (mm)

[0049] For the implementation conditions of Tests 1 - 9, except that the inner cylinder 500 port width condition in Table 1 increases incrementally, other conditions remain unchanged. The processing method of the obtained gold-plated samples is illustrated below using Test 1 as an example: The film thickness is detected using the Fischer FISCHERSCOPE X-RAY XDV-SDD. The detection position is at the center of the coating area of the coating area of the semiconductor electronic component, at each black dot ● in Figure 10 ; The test results are shown in Table 2.

[0050] Table 2 Gold-Plated Film Thickness of Test 1 (nm)

[0051] As can be seen from Table 2, for the gold-plating standard of 500 nm in the local plating area 110 of the semiconductor electronic component, the measured range is 514.43 - 526.27 nm. The film thickness error range based on the gold-plating standard of 500 nm is 2.89% - 5.25%. According to the detection classification standard for the uniformity of the gold-plated film thickness distribution, 5.0% ≤ the result of Test 1 ≤ 5.25%, which is classified as unqualified; Therefore, the set condition of the inner cylinder 500 port width of the electroplating mold D 通口 = 7.5 mm cannot meet the classification requirements for the uniformity of the gold-plated film thickness distribution in the local plating area 110 of the semiconductor electronic component.

[0052] Furthermore, a Keyence 3D profilometer VR-6000 is used to detect the gold-plated area of the local plating area 110 of the semiconductor electronic component. The results are as follows: For Test 1 S 实测 is: 540.58 mm 2 ; Furthermore, the tests of Tests 2 - 9 are the same as those of Test 1, and the specific test data will not be elaborated in detail. The statistical results of the gold-plated film thickness are shown in Table 3, and the results of the gold-plated area of the local plating area are shown in Table 4.

[0053] Table 3 Gold-Plated Film Thickness of Tests 1 - 9 (nm)

[0054] Table 4 Gold-Plated Area of Tests 1 - 9 (mm 2 )

[0055] As can be seen from Table 3, the set conditions of the through-hole width of the inner cylinder 500 of the electroplating mold for Tests 1 to 9 D 通口 are different, and the uniformity of the gold plating film thickness distribution in the partial plating area 110 of the semiconductor electronic component is different; when the D 通口 is less than or equal to the set outer outlet width of the outer cylinder 600 D 外出口 at that time, the uniformity of the obtained gold plating film thickness distribution in the test all exceeds the 5% limit value of the discrimination classification. Therefore, Tests 1 and 2 belong to the unqualified category; further, when the D 通口 is far higher than the set outer outlet width of the outer cylinder 600 D 外出口 8.5 mm, the uniformity of the obtained gold plating film thickness distribution in the test exceeds 5%. Therefore, Tests 8 and 9 also belong to the unqualified category; for Tests 3 to 7 other than Tests 1, 2, 8, and 9, the uniformity of their gold plating film thickness distribution is less than the 5% limit value of the discrimination classification. Therefore, they are all in the qualified category, among which, Tests 5 and 6 have good judgment results.

[0056] Further, as can be seen from Table 4, according to the set conditions of the through-hole width of the inner cylinder 500 of the electroplating mold for Tests 1 to 9 D 通口 are different, and the gold plating area of the partial plating area 110 of the semiconductor electronic component is different; the actually measured gold plating area of Test 1 S 实测 and the standard gold plating area of the partial plating area S 标准 the difference S 实测 ~ S 标准 , is greater than the discrimination standard of 0.5 mm 2 , therefore, Test 1 belongs to the unqualified category; further, when the D 通口 is far higher than the set outer outlet width of the outer cylinder 600 D 外出口 8.5 mm, the obtained gold plating area in the test exceeds the discrimination standard of 0.5 mm 2 , therefore, Tests 8 and 9 also belong to the unqualified category; for Tests 2 to 7 other than Tests 1, 8, and 9, the uniformity of their gold plating film thickness distribution is less than the limit value of the discrimination standard of 0.5 mm 2 , therefore, they are all in the qualified category, among which, Tests 4 and 5 have excellent test results.

[0057] From the results of Table 3 and Table 4, it can be seen that for the gold plating method of the local plating area 110 of semiconductor electronic components using the adjustable electrolysis device of the present invention, the adjustable setting range of the through-hole width of the inner cylinder 500 of the electroplating mold is from 13.5 to 33.5 mm in Tests 3 to 7. D 通口 On the other hand, it should be particularly noted that Example 3 is only a representative of many implementable local plating areas 110 of semiconductor electronic components. According to the electroplating mold combination characteristics of the adjustable electrolysis device of the present invention, for semiconductor electronic component products with various different local plating area sizes, only the outer cylinder 600 of the electroplating mold needs to be made according to the method of the present invention, and its outer outlet is made according to the size and shape of different semiconductor electronic component local plating areas 110; its inner inlet has the same through-hole size as the through-hole of the original inner cylinder 500 of the electroplating mold, and it only needs to be fitted and overlapped. In other words, the prior art so far, by continuously improving the electroplating mold or remaking the electroplating mold and debugging the electroplating product method, can be replaced by the electroplating mold combination of the adjustable electrolysis device of the present invention at one time, and through the adjustable function of the through-hole width of the inner cylinder 500 of the electroplating mold, a fast and accurate electroplating method for various semiconductor electronic component local plating areas 110 can be realized.

[0058] In summary, an adjustable electrolysis device, electroplating system and electroplating method provided by the present invention, through the organic integration of Formulas 1 to 4 in the design of the inner cylinder 500 and the outer cylinder 600 of the electroplating mold and the control module 140 of the accessory configuration of the electrolysis device, establishes the discriminant formula 5 for the local plating area of the adjustable electrolysis device provided by the present invention. Through a series of management and control of Formulas 1 to 5, the structures of the inner cylinder 500 and the outer cylinder 600 of the electroplating mold are established. During the actual electroplating process, the adjustable setting range and discriminant classification standard of the through-hole width of the inner cylinder 500 of the electroplating mold for various different monomer metal salt and binary metal salt electroplating solutions can be quickly established, and then the optimal adjustable electrolysis device conditions and electroplating methods for the local plating area 110 of semiconductor electronic components can be obtained. It can not only quickly achieve the uniformity of the local coating film thickness and the accuracy of the plating area of semiconductor electronic components, meet the accuracy requirements for the best condition screening of the selective adjustable electroplating mold during the metal coating electroplating process of high-end semiconductor lead frames. Moreover, for the problem of the prior art that the electroplating mold needs to be continuously improved or remade and the electroplating product needs to be debugged, a disposable electroplating mold combination of the adjustable electrolysis device is provided for replacement, and through the adjustable function of the through-hole width of the inner cylinder 500 of the electroplating mold, a fast and accurate electroplating method for various semiconductor electronic component local plating areas can be realized.

[0059] In summary, an adjustable electrolysis device, electroplating system and electroplating method provided by the present invention, through the organic integration of Formulas 1 to 4 in the design of the inner cylinder 500 and the outer cylinder 600 of the electroplating mold and the control module 140 of the accessory configuration of the electrolysis device, establishes the discriminant formula 5 for the local plating area of the adjustable electrolysis device provided by the present invention. Through a series of management and control of Formulas 1 to 5, the structures of the inner cylinder 500 and the outer cylinder 600 of the electroplating mold are established. During the actual electroplating process, the adjustable setting range and discriminant classification standard of the through-hole width of the inner cylinder 500 of the electroplating mold for various different monomer metal salt and binary metal salt electroplating solutions can be quickly established, and then the optimal adjustable electrolysis device conditions and electroplating methods for the local plating area 110 of semiconductor electronic components can be obtained. It can not only quickly achieve the uniformity of the local coating film thickness and the accuracy of the plating area of semiconductor electronic components, meet the accuracy requirements for the best condition screening of the selective adjustable electroplating mold during the metal coating electroplating process of high-end semiconductor lead frames. Moreover, for the problem of the prior art that the electroplating mold needs to be continuously improved or remade and the electroplating product needs to be debugged, a disposable electroplating mold combination of the adjustable electrolysis device is provided for replacement, and through the adjustable function of the through-hole width of the inner cylinder 500 of the electroplating mold, a fast and accurate electroplating method for various semiconductor electronic component local plating areas can be realized.

[0060] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. An adjustable electrolysis device, characterized in that, It includes an electroplating mold, and the electroplating mold includes an outer cylinder (600) and an inner cylinder (500) disposed within the outer cylinder (600); the outer cylinder (600) is provided with an outer outlet and an inner inlet that is connected to the outer outlet through a channel; The outer outlet area of the external cylinder (600) S 外出口 is as follows: S 外出口 = L 外 × D 外 Formula 1 Among them, L 外 is the long side length of the outer outlet of the outer cylinder (600), D 外 is the short side length of the outer outlet of the outer cylinder (600); The inner inlet area of the external cylinder (600) S 内入口 is larger than the outer outlet area S 外出口 The inner inlet area of the external cylinder (600) S 内入口 is: S 内入口 = L 内 × D 内 Formula 2 Among them, L 内 is the long side length of the inner entrance of the outer cylinder (600), D 内 is the short side length of the inner entrance of the outer cylinder (600); The number of channels connecting the outer outlet and the inner inlet of the outer cylinder (600) is calculated according to the pitch of semiconductor electronic products as follows: M = 2 πr / 3 P Formula 3 Among them, M is the number of channels, r is the outer surface radius of the outer cylinder (600), P is the pitch of the semiconductor electronic product; The inner cylinder (500) is provided with an electroplating solution ejection outlet, and the inner cylinder (500) is capable of rotating to displace the electroplating solution ejection outlet of the inner cylinder (500) from the inner inlet of the outer cylinder (600), so as to adjust the size of the inner inlet of the outer cylinder (600) and regulate the flow rate of the electroplating solution passing through; The width of the electroplating solution ejection outlet of the inner cylinder (500) and the inner inlet width of the outer cylinder (600) D 内 is less than the distance between the two outlets W : D 内 < W Formula 4 The outer outlet area of the said outer cylinder (600) S 外出口 , satisfies the following formula: S 外出口 ≤ S 实测 ≤ S 外出口 + 0.5mm 2 Formula 5 Among them, S 实测 is the actual electroplating operation of the local plating area of semiconductor electronic components, and the surface area of the metal coating specification of the local plating area obtained.

2. The adjustable electrolysis device according to claim 1, characterized in that The size of the outer outlet of the outer cylinder (600) is adapted to the size of the partial plating area (110) of the semiconductor electronic component.

3. The adjustable electrolysis device according to claim 1, characterized in that, The outer outlets of a plurality of the outer cylinders (600) are disposed on the outer circumference of the outer cylinder (600), and the inner inlets of a plurality of the outer cylinders (600) are disposed on the inner circumference of the outer cylinder (600). The outer outlets and the inner inlets of the outer cylinders (600) correspond one by one and are connected through channels.

4. An adjustable electrolysis device according to claim 1, wherein, The metal materials of the outer cylinder (600) include: titanium, platinum-plated titanium, stainless steel 316, and stainless steel 304.

5. The adjustable electrolysis device according to claim 4, characterized in that, When the material of the outer cylinder (600) is selected as platinum-plated titanium, only the inside of the channel of the outer cylinder (600) of the electroplating mold is plated.

6. The adjustable electrolysis device according to claim 1, wherein The metal types of the electroplating solution include: Monomer coatings Au, Ag, Ni, Sn, Cu, Pd, Rh, Pt; Binary alloy metals of alloy coatings Au-Ni, Pd-Ni, Ni-P, W-Ni.

7. An electroplating system, characterized in that, Using an adjustable electrolysis device according to any one of claims 1-6, the electroplating system includes: an electrolysis device control system (100) and an electroplating condition monitoring system (200); Wherein, the electrolysis device control system (100) includes: The partial plating area (110) of the semiconductor electronic component, which is used to provide a standard for the electroplating solution outlet design of the outer cylinder (600) of the adjustable electrolysis device; The outer electroplating mold channel control module (120), which includes an electroplating mold, and the electroplating mold includes an outer cylinder (600). The outer cylinder (600) is provided with an electroplating solution outer outlet, a channel connected to the electroplating solution outer outlet, and an electroplating solution inner inlet; The inner electroplating mold adjustment and control module (130), which includes an electroplating mold, and the electroplating mold includes an inner cylinder (500). The inner cylinder (500) is provided with an electroplating solution ejection outlet corresponding to the inner inlet of the outer cylinder (600), and the inner cylinder (500) is capable of rotating to displace the electroplating solution ejection outlet of the inner cylinder (500) from the inner inlet of the outer cylinder (600) to adjust the size of the inner inlet of the outer cylinder (600); The electrolysis device accessory configuration control module (140), which includes: an electroplating solution tank, an electroplating solution heater, a pump for transporting the electroplating solution, and an electrolysis power supply; Wherein, the electroplating condition monitoring system (200) includes: The plating part electroplating condition management and control module (210) is used to provide corresponding electroplating condition parameters when the adjustable electrolysis device conducts electroplating operation tests on the local part of the semiconductor electronic component; The external electroplating mold condition control module (220) is used to manage and control the determined conditions of the external cylinder (600) of the electroplating mold by calculating the parameters of the external cylinder (600) of the electroplating mold and the characteristic data of the local plating area (110) of the semiconductor electronic component through Formula 1, Formula 2, Formula 3 and Formula 4; Internal electroplating mold condition control module (230), which can be adjusted according to the size of the local plating area (110) of semiconductor electronic components by rotation, the width of the electroplating solution ejection outlet of the internal cylinder (500) and the inner inlet width of the external cylinder (600) D 内 is less than the distance between the two outlets W : D 内 < W ; The accessory configuration operating condition control module (240), based on the electrolysis device accessory configuration control module (140), is applied to the actual electroplating operation of the local plating area (110) of the semiconductor electronic component, and obtains the surface area of the metal coating specification of the local plating area S 实测 , compare S 外出口 and S 实测 , if the following conditions are met: S 外出口 ≤ S 实测 ≤ S 外出口 + 0.5mm 2 Formula 5 Then confirm that the adjustable electrolysis device is applicable; otherwise, based on the actual S 外出口 and S 实测 as a reference, correct S 外出口 and verify S 实测 until formula 5 is satisfied.

8. An electroplating method, characterized in that, Using an adjustable electrolysis device according to any one of claims 1-6 or a plating system according to claim 7, the plating method comprises the following steps: S1. Assemble the adjustable electrolysis device; S2. Perform electroplating processing on the local plating area (110) of the semiconductor electronic component, manage and operate according to the electroplating conditions of the plating part, and control the standard range of the metal coating in the local plating area; S3. Control of external electroplating mold conditions. By setting the cross-sectional area of the outer outlet of the external cylinder (600) of the electroplating mold S 外出口 , the gold-plated surface area obtained through on-site control and management is measured S 实测 ; S4. Control of internal electroplating mold conditions, the cross-sectional area of the through-hole adjusted by rotating the internal cylinder (500) of the electroplating mold clockwise S 通口 , and the measured gold-plated surface area obtained through control management S 实测 ; S5. Based on S2 to S4, the outer outlet cross-sectional area of the external cylinder (600) set by the local plating area (110) of the semiconductor electronic component S 外出口 Perform the actual electroplating operation, and obtain the gold plating surface area of the local plating area S 实测 , if the formula 5 is satisfied: S 外出口 ≤ S 实测 ≤ S 外出口 + 0.5mm 2 Formula 5 Then confirm that the adjustable electrolysis device is applicable; otherwise, based on the actual S 外出口 and S 实测 as a reference, correct S 外出口 and verify S 实测 , and loop through steps S2 to S4 until formula 5 is satisfied.

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