Antistatic semiconductor UV (ultraviolet) visbreaking layer and protective film and preparation method of antistatic semiconductor UV visbreaking layer and protective film

Abstract

The invention relates to the technical field of polyurethane adhesives, and discloses an antistatic semiconductor UV visbreaking adhesive layer, a protective film and a preparation method of the antistatic semiconductor UV visbreaking adhesive layer, and the antistatic semiconductor UV visbreaking adhesive layer is prepared by adding a perylene diimide modified carbon nanotube solution, a reactive diluent and a photoinitiator into a UV polyurethane solution. UV-polymerizable alkenyl is introduced into a polyurethane molecular chain, so that the peel strength is reduced after photocuring, and the viscosity-reducing and easy-to-peel effects are shown. A high-temperature-resistant perylene diimide condensed ring is introduced into a polyurethane main chain, so that the high-temperature resistance of an adhesive layer is improved. The carbon nano tube is subjected to non-covalent surface modification, so that the interfacial force with a polyurethane molecular chain is improved, the dispersity of the carbon nano tube in the viscosity-reducing glue becomes good, the carbon nano tube can be promoted to form a continuous conductive path, and the antistatic performance is improved. The viscosity-reducing adhesive has good practical application in the aspects of semiconductor chip wafer processing, high-temperature-resistant adhesives, antistatic adhesives and the like.

Description

Technical Field

[0001] The invention relates to the technical field of polyurethane adhesives, in particular to an antistatic semiconductor UV viscosity-reducing layer and a protective film and a preparation method thereof. Background Art

[0002] Viscosity-reducing adhesive is an important material in the semiconductor chip wafer processing technology. It is required to have high bonding performance during the processing and be easy to peel off after processing. UV viscosity-reducing adhesive has this characteristic and has a wide range of practical applications in wafer processing and semiconductor fields. Among them, polyurethane UV viscosity-reducing adhesive has a rapid decrease in viscosity and is easy to peel off after exposure to light, and has great application and development prospects.

[0003] Traditional polyurethane adhesives have excellent bonding properties, flexibility, weather resistance, and other properties, and a variety of curing methods, such as thermal curing, light curing, and moisture curing. By using 1,4-butenediol, hydroxyethyl acrylate, and other raw materials, and introducing olefin groups into the polyurethane molecular chain, it is possible to achieve UV light curing, fast curing, and convenient construction. They have important applications in semiconductor chips, electronic appliances, medical devices, and other fields. Traditional polyurethane adhesives have a high surface resistivity, poor antistatic properties, and poor high temperature resistance, which limits their practical application areas. Carbon nanotubes have strong electrical conductivity, good high temperature resistance, and high mechanical properties, and are widely used in polymer materials such as polyurethane. Reducing the agglomeration of carbon nanotubes and improving their dispersibility and compatibility with polymer materials are research difficulties. Summary of the Invention

[0004] The invention solves the problems of poor antistatic performance and high temperature resistance of UV curing polyurethane adhesive.

[0005] The technical solution of the present invention: a method for preparing an antistatic semiconductor UV viscosity-reducing layer:

[0006] S1. Add polytetramethylene glycol, isocyanate monomer, and dibutyltin dilaurate to a reaction vessel, heat to 70-80° C. in a nitrogen atmosphere, and carry out polymerization reaction for 3-4 hours; add ethyl acetate and vinylperylene diimide diol chain extender, reduce the temperature to 50-60° C., and react for 1-1.5 hours to obtain a UV polyurethane solution.

[0007] S2. Add N,N-dimethylformamide, carbon nanotubes, and vinylperylene diimide diol chain extender into a container, ultrasonically disperse for 20-30 minutes, and then stir for 3-8 hours. After filtering, wash with N,N-dimethylformamide. Add the product to ethyl acetate and ultrasonically disperse for 10-20 minutes to obtain a perylene diimide-modified carbon nanotube solution.

[0008] S3. Add the perylene diimide modified carbon nanotube solution to the UV polyurethane solution. After stirring, add the reactive diluent, dry to remove ethyl acetate, add the photoinitiator and stir well to obtain the antistatic semiconductor UV tackifier adhesive. Coat the antistatic semiconductor UV tackifier adhesive on the surface of the substrate and irradiate and cure it in a UV light curing machine to obtain the antistatic semiconductor UV tack reduction layer. The tack reduction layer forms a protective film on the surface of the substrate.

[0009] Preferably, in S1, the ratio of polytetrahydrofuran ether diol, isocyanate monomer, and vinyl perylene diimide diol chain extender is 1 mol:(2.6 - 3) mol:(1 - 1.2) mol.

[0010] Preferably, the isocyanate monomer is isophorone diisocyanate or toluene - 2,4 - diisocyanate.

[0011] Preferably, the ratio of polytetrahydrofuran ether diol to carbon nanotubes is 1 mol:(15 - 60) g.

[0012] Preferably, in S2, the ratio of carbon nanotubes to vinyl perylene diimide diol chain extender is 1 g:(0.05 - 0.2) g.

[0013] Preferably, in S3, the reactive diluent is dipropylene glycol diacrylate or tripropylene glycol diacrylate.

[0014] Preferably, the photoinitiator is TPO.

[0015] Preferably, the preparation method of the vinyl perylene diimide diol chain extender includes: Add N - methylpyrrolidone, 3,4,9,10 - perylene tetracarboxylic dianhydride with a ratio of 1 mol:(6 - 7) mol, and 3 - [(2 - aminoethyl)amino] - 2 - hydroxypropyl methacrylate to the reaction vessel. Under a nitrogen atmosphere, heat to 140 - 160 °C and react for 12 - 18 h. Add water to the solution to precipitate the solid. Filter and wash with water and methanol, then dry to obtain the vinyl perylene diimide diol chain extender, which contains two hydroxyl groups and can be used as a chain extender for polyurethane. The preparation reaction formula is:

[0016]

[0017] The beneficial technical effects of the present invention: When preparing polyurethane, the vinyl perylene diimide diol chain extender is added, so that vinyl groups that can be UV - polymerized are introduced into the polyurethane molecular chain. Through the photocuring cross - linking reaction, the volume of the cured adhesive layer of the tackifier shrinks, and wrinkles and uneven structures are generated on the surface of the cured adhesive layer, reducing the flatness of the adhesive layer. Thus, the contact area between the adhesive layer and the silicon wafer is reduced, the peel strength is lowered, showing the effect of easy peeling with reduced tack.

[0018] The vinyl perylene diimide diol chain extender of the present invention contains a perylene diimide condensed ring with high temperature resistance. Introduced into the polyurethane main chain, it significantly improves the high temperature resistance of the adhesive layer and is beneficial to increasing the initial thermal decomposition temperature.

[0019] The vinyl perylene diimide diol chain extender of the present invention contains a perylene ring structure, which forms π-π bond interactions with carbon nanotubes, realizing non-covalent surface modification of carbon nanotubes. This is beneficial to improving the agglomeration problem of carbon nanotubes. When added to the polyurethane viscosity-reducing adhesive, the perylene diimide rings of the polyurethane molecular chains simultaneously form strong π-π bond interactions with carbon nanotubes and the vinyl perylene diimide diol chain extender modified on the carbon nanotube surface. This significantly improves the interfacial force between the carbon nanotubes and the polyurethane molecular chains, further enhancing the dispersion of carbon nanotubes in the viscosity-reducing adhesive. It can promote the formation of a continuous conductive path by carbon nanotubes, thereby reducing the surface resistivity of the viscosity-reducing adhesive and improving the antistatic performance. The uniformly dispersed carbon nanotubes also have an enhancing effect on the heat resistance of the viscosity-reducing adhesive, making the viscosity-reducing adhesive exhibit a higher initial thermal decomposition temperature and high temperature resistance. This viscosity-reducing adhesive has good practical applications in semiconductor chip wafer processing, high temperature adhesives, antistatic adhesives, etc. Detailed implementation mode

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] The molecular weight of polytetrahydrofuran ether diol is 2000, and it is dried to remove water before use. The carbon nanotubes have a tube length of 5 - 10 μm and a tube diameter of about 10 nm, and are purchased from Shandong Carbon Peak New Materials Technology Co., Ltd.

[0022] According to the method in the journal Carbohydrate Polymers 79(2010)277–283, the literature "21-Arm star polymers with different cationic groups based on cyclodextrin core for DNA delivery" (DOI number is 10.1016 / j.carbpol.2009.08.006), 3-[(2-aminoethyl)amino]-2-hydroxypropyl methacrylate was prepared. Add 6.02 g of ethylenediamine and 14.66 g of glycidyl methacrylate to 30 mL of water, react at 25 °C for 45 min, precipitate, filter, wash with ether, and dry to obtain 3-[(2-aminoethyl)amino]-2-hydroxypropyl methacrylate, with the structural formula

[0023] Example 1

[0024] (1) Add 1.2 L of N-methylpyrrolidone, 80 mmol of 3,4,9,10-perylenetetracarboxylic dianhydride, and 480 mmol of 3-[(2-aminoethyl)amino]-2-hydroxypropyl methacrylate to a reaction vessel. Under a nitrogen atmosphere, heat to 160 °C and react for 12 h. Add 4 L of water to the solution to precipitate a solid. After filtration, wash with water and methanol, and dry to obtain a vinyl perylene diimide diol chain extender.

[0025] (2) Add 600 mL of N,N-dimethylformamide, 1.5 g of carbon nanotubes, and 0.075 g of vinyl perylene diimide diol chain extender to a container. Ultrasonically disperse for 20 min in an ultrasonic bath, then stir for 3 h. After filtration, wash with N,N-dimethylformamide. Add the product to 200 mL of ethyl acetate and ultrasonically disperse for 10 min to obtain a perylene diimide-modified carbon nanotube solution.

[0026] (3) Add 0.1 mol of polytetrahydrofuran ether diol, 0.28 mol of toluene-2,4-diisocyanate, and 0.34 g of dibutyltin dilaurate to a reaction vessel. Under a nitrogen atmosphere, heat to 70 °C and carry out a polymerization reaction for 4 h. Add 1 L of ethyl acetate and 0.11 mol of vinyl perylene diimide diol chain extender. Lower the temperature to 60 °C and react for 1 h to obtain a UV polyurethane solution. Then add the perylene diimide-modified carbon nanotube solution prepared above, stir for 30 min, add 48 g of the reactive diluent dipropylene glycol diacrylate, dry to remove ethyl acetate, add 11.2 g of the photoinitiator TPO, and stir well to obtain an antistatic semiconductor UV pressure-sensitive adhesive.

[0027] Example 2

[0028] (1) Add 1.5 L of N-methylpyrrolidone, 80 mmol of 3,4,9,10-perylenetetracarboxylic dianhydride, and 560 mmol of 3-[(2-aminoethyl)amino]-2-hydroxypropyl methacrylate to a reaction vessel. Under a nitrogen atmosphere, heat to 140 °C and react for 18 h. Add 5 L of water to the solution to precipitate a solid. After filtration, wash with water and methanol, and dry to obtain a vinyl perylene diimide diol chain extender.

[0029] (2) Add 600 mL of N,N-dimethylformamide, 3 g of carbon nanotubes, and 0.34 g of vinyl perylene diimide diol chain extender to a container. Ultrasonically disperse for 30 min in an ultrasonic bath, then stir for 6 h. After filtration, wash with N,N-dimethylformamide. Add the product to 300 mL of ethyl acetate and ultrasonically disperse for 20 min to obtain a perylene diimide-modified carbon nanotube solution.

[0030] (3) Add 0.1 mol of polytetrahydrofuran ether diol, 0.3 mol of isophorone diisocyanate, and 0.4 g of dibutyltin dilaurate to the reaction vessel. Under a nitrogen atmosphere, heat to 80 °C and carry out a polymerization reaction for 3 h; add 1 L of ethyl acetate and 0.12 mol of vinyl perylene diimide diol chain extender, and lower the temperature to 50 °C and react for 1.5 h to obtain a UV polyurethane solution. Then add the perylene diimide modified carbon nanotube solution prepared above, stir for 30 min, add 55 g of the reactive diluent dipropylene glycol diacrylate, dry to remove ethyl acetate, add 11.7 g of the photoinitiator TPO, and stir and mix evenly to obtain an antistatic semiconductor UV tackifier.

[0031] Example 3

[0032] (1) Add 800 mL of N,N-dimethylformamide, 4.5 g of carbon nanotubes, and 0.76 g of vinyl perylene diimide diol chain extender (prepared in Example 1) to the container, ultrasonically disperse in an ultrasonic instrument for 30 min, then stir for 8 h, filter and wash with N,N-dimethylformamide, add the product to 400 mL of ethyl acetate, and ultrasonically disperse for 20 min to obtain a perylene diimide modified carbon nanotube solution.

[0033] (2) Add 0.1 mol of polytetrahydrofuran ether diol, 0.26 mol of isophorone diisocyanate, and 0.3 g of dibutyltin dilaurate to the reaction vessel. Under a nitrogen atmosphere, heat to 75 °C and carry out a polymerization reaction for 3 h; add 0.8 L of ethyl acetate and 0.1 mol of vinyl perylene diimide diol chain extender (prepared in Example 1), lower the temperature to 50 °C and react for 1.5 h to obtain a UV polyurethane solution. Then add the perylene diimide modified carbon nanotube solution prepared above, stir for 60 min, add 42 g of the reactive diluent dipropylene glycol diacrylate, dry to remove ethyl acetate, add 10.4 g of the photoinitiator TPO, and stir and mix evenly to obtain an antistatic semiconductor UV tackifier.

[0034] Example 4

[0035] (1) Add 800 mL of N,N-dimethylformamide, 6 g of carbon nanotubes, and 1.2 g of vinyl perylene diimide diol chain extender (prepared in Example 1) to the container, ultrasonically disperse in an ultrasonic instrument for 30 min, then stir for 8 h, filter and wash with N,N-dimethylformamide, add the product to 400 mL of ethyl acetate, and ultrasonically disperse for 20 min to obtain a perylene diimide modified carbon nanotube solution.

[0036] (2) Add 0.1 mol of polytetrahydrofuran ether diol, 0.28 mol of toluene-2,4-diisocyanate, and 0.36 g of dibutyltin dilaurate into the reaction vessel. Under a nitrogen atmosphere, heat to 75 °C and carry out the polymerization reaction for 4 h; add 1 L of ethyl acetate and 0.11 mol of vinyl perylene diimide diol chain extender (prepared in Example 1). Lower the temperature to 60 °C and react for 1 h to obtain a UV polyurethane solution. Then add the perylene diimide-modified carbon nanotube solution prepared above, stir for 60 min, add 51 g of the reactive diluent dipropylene glycol diacrylate, dry to remove ethyl acetate, add 11.4 g of photoinitiator TPO, and stir and mix evenly to obtain an antistatic semiconductor UV pressure-sensitive adhesive.

[0037] Comparative Example 1. The main difference between this comparative example and Example 1 is that 1,4-butenediol is used as the chain extender, and at the same time, the perylene diimide-modified carbon nanotube solution is not added.

[0038] (1) Add 0.1 mol of polytetrahydrofuran ether diol, 0.28 mol of toluene-2,4-diisocyanate, and 0.34 g of dibutyltin dilaurate into the reaction vessel. Under a nitrogen atmosphere, heat to 70 °C and carry out the polymerization reaction for 4 h; add 1 L of ethyl acetate and 0.11 mol of 1,4-butenediol. Lower the temperature to 60 °C and react for 1 h to obtain a UV polyurethane solution. Then add 48 g of the reactive diluent dipropylene glycol diacrylate, dry to remove ethyl acetate, add 11.2 g of photoinitiator TPO, and stir and mix evenly to obtain a UV pressure-sensitive adhesive.

[0039] Comparative Example 2. The main difference between this comparative example and Example 1 is that 1,4-butenediol is used as the chain extender.

[0040] (1) Add 0.1 mol of polytetrahydrofuran ether diol, 0.28 mol of toluene-2,4-diisocyanate, and 0.34 g of dibutyltin dilaurate into the reaction vessel. Under a nitrogen atmosphere, heat to 70 °C and carry out the polymerization reaction for 4 h; add 1 L of ethyl acetate and 0.11 mol of 1,4-butenediol. Lower the temperature to 60 °C and react for 1 h to obtain a UV polyurethane solution. Then add the perylene diimide-modified carbon nanotube solution (prepared in Example 1), stir for 30 min, add 48 g of the reactive diluent dipropylene glycol diacrylate, dry to remove ethyl acetate, add 11.2 g of photoinitiator TPO, and stir and mix evenly to obtain a UV pressure-sensitive adhesive.

[0041] Comparative Example 3. The main difference between this comparative example and Example 1 is that the perylene diimide-modified carbon nanotube solution is not added.

[0042] (1) 48 g of the active diluent tripropylene glycol diacrylate was added to the UV polyurethane solution (prepared in Example 1), and ethyl acetate was removed by drying. 11.2 g of the photoinitiator TPO was added, and the mixture was stirred and mixed evenly to obtain the UV tackifier adhesive.

[0043] Comparative Example 4. The main difference between this comparative example and Example 1 was that an unmodified carbon nanotube solution was added.

[0044] (1) 1.5 g of carbon nanotubes was added to 200 mL of ethyl acetate, and ultrasonic dispersion was carried out for 10 min to obtain a carbon nanotube solution.

[0045] (2) The above-prepared carbon nanotube solution was added to the UV polyurethane solution (prepared in Example 1), and the mixture was stirred for 30 min. 48 g of the active diluent tripropylene glycol diacrylate was added, and ethyl acetate was removed by drying. 11.2 g of the photoinitiator TPO was added, and the mixture was stirred and mixed evenly to obtain the UV tackifier adhesive.

[0046] The UV tackifier adhesive was coated on the surface of the PET film. The side of the PET film coated with the tackifier adhesive was bonded to a polished silicon wafer, and it was left for 24 h. The 180° peel strength before photocuring was tested using a peel strength tester, and the peeling speed was 300 mm / min. Each group of specimens was tested 3 times, and the average value was taken.

[0047] The UV tackifier adhesive was coated on the surface of the PET film. The side of the PET film coated with the tackifier adhesive was bonded to a polished silicon wafer, and it was placed in a UV light curing machine (power 2 kW) and irradiated for curing for 60 s to form a tackifier layer. It was left for 24 h. The 180° peel strength after photocuring was tested using a peel strength tester, and the peeling speed was 300 mm / min. Each group of specimens was tested 3 times, and the average value was taken.

[0048] The UV tackifier adhesive was coated in a mold and placed in a UV light curing machine (power 2 kW) and irradiated for curing for 60 s to form a cured adhesive layer. The surface resistivity was tested according to the standard of GB / T 26825-2011.

[0049] 5 mg of the cured adhesive layer was weighed and placed in a thermogravimetric analyzer for testing in a nitrogen atmosphere. The heating rate was 10 °C / min, and the test temperature range was 25 - 700 °C.

[0050] Table 1 Properties of the UV Tackifier Adhesive

[0051]

[0052] After testing, the 180° peel strength of the UV tackifier adhesives in Examples 1-4 before photocuring reached 25.2-30.7 N / 25 mm, and the 180° peel strength after photocuring was only 2.46-4.61 N / 25 mm, showing good tack reduction and easy peeling effects. This is mainly because vinyl perylene diimide diol chain extender was added, introducing UV-polymerizable alkenyl groups into the polyurethane molecular chain. Through photocuring crosslinking reaction, the volume of the cured adhesive layer of the tackifier adhesive shrank, and wrinkles and uneven structures were generated on the surface of the cured adhesive layer, reducing the flatness of the adhesive layer. As a result, the contact area between the adhesive layer and the silicon wafer was reduced, the peel strength was lowered, and the tack reduction and easy peeling effects were shown. At the same time, the heat-resistant perylene diimide condensed ring was introduced into the polyurethane main chain, significantly improving the heat resistance of the adhesive layer and being beneficial to increasing the initial (5% mass loss) thermal decomposition temperature. And the vinyl perylene diimide diol chain extender contains a perylene ring structure, forming π-π bond interaction with carbon nanotubes, realizing non-covalent surface modification of carbon nanotubes, which is beneficial to improving the agglomeration problem of carbon nanotubes. When added to the polyurethane tackifier adhesive, the perylene diimide rings of the polyurethane molecular chain simultaneously form strong π-π bond interactions with carbon nanotubes and the vinyl perylene diimide diol chain extender with modified carbon nanotube surface, significantly increasing the interfacial force between carbon nanotubes and the polyurethane molecular chain, further improving the dispersion of carbon nanotubes in the tackifier adhesive, promoting the formation of a continuous conductive path by carbon nanotubes, thereby reducing the surface resistivity of the tackifier adhesive and improving the antistatic performance. Uniformly dispersed carbon nanotubes also have an enhancing effect on the heat resistance of the tackifier adhesive, making the tackifier adhesive show a higher initial thermal decomposition temperature.

[0053] In Comparative Example 1, conventional 1,4-butanediol was used as the chain extender to introduce alkenyl groups into the polyurethane molecular chain, endowing the polyurethane tackifier adhesive with good UV photocuring performance. The 180° peel strength decreased significantly after UV curing, and it also had good tack reduction and easy peeling effects. However, 1,4-butanediol does not contain a heat-resistant perylene diimide condensed ring structure, and carbon nanotubes were not added, resulting in a lower initial thermal decomposition temperature and heat resistance of the polyurethane tackifier adhesive, a larger surface resistivity, and poor antistatic performance.

[0054] In Comparative Example 2, on the basis of Comparative Example 1, a solution of perylene diimide-modified carbon nanotubes was added. Since the polyurethane molecular chain does not contain perylene diimide groups, the initial thermal decomposition temperature and heat resistance of the polyurethane tackifier adhesive are relatively low. Moreover, the polyurethane cannot form π-π bond interactions with carbon nanotubes and the vinyl perylene diimide diol chain extender formed on the surface, resulting in poor interfacial force between carbon nanotubes and the polyurethane molecular chain and poor dispersion of carbon nanotubes in the tackifier adhesive. A continuous conductive path was not well formed, and the surface resistivity of the tackifier adhesive was greater than that of Example 1, with poor antistatic performance.

[0055] In Comparative Example 3, the perylene diimide-based carbon nanotube solution was not added. The surface resistivity of the polyurethane viscosity-reducing adhesive was very high, the antistatic performance was very poor, and the initial thermal decomposition temperature and high-temperature resistance were lower than those of Example 1.

[0056] In Comparative Example 4, unmodified carbon nanotubes were added. They were prone to agglomeration, and the π-π bond interaction force with the polyurethane viscosity-reducing adhesive was lower than that of Example 1, resulting in an interfacial interaction force between the carbon nanotubes and the polyurethane viscosity-reducing adhesive lower than that of Example 1, poor dispersibility in the viscosity-reducing adhesive, and failure to form a continuous conductive path well. The surface resistivity was greater than that of Example 1, and the antistatic performance was not good.

[0057] The above are the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A method for preparing an antistatic semiconductor UV adhesion-reducing layer, characterized in that, The preparation method comprises the following steps: S1. Add polytetrahydrofuran ether diol, isocyanate monomer, and dibutyltin dilaurate into a reaction vessel, and carry out a polymerization reaction in a nitrogen atmosphere; add ethyl acetate and vinyl perylene diimide diol chain extender, and continue the reaction to obtain a UV polyurethane solution; S2. Add N,N-dimethylformamide, carbon nanotubes, and vinyl perylene diimide diol chain extender into a container, perform ultrasonic dispersion and then stirring, filter and wash, add the product into ethyl acetate, and perform ultrasonic dispersion to obtain a perylene diimide modified carbon nanotube solution; S3. Add the perylene diimide modified carbon nanotube solution into the UV polyurethane solution, add a reactive diluent after stirring, dry to remove ethyl acetate, add a photoinitiator and stir to mix evenly to obtain an antistatic semiconductor UV tackifier; coat the antistatic semiconductor UV tackifier on the surface of a substrate, and irradiate and cure it in a UV light curing machine to obtain an antistatic semiconductor UV tackifying layer.

2. The preparation method of the antistatic semiconductor UV adhesive-reducing layer according to claim 1, wherein In the above S1, the ratio of polytetrahydrofuran ether diol, isocyanate monomer, and vinyl perylene diimide diol chain extender is 1 mol:(2.6 - 3) mol:(1 - 1.2) mol; the isocyanate monomer is isophorone diisocyanate or toluene-2,4-diisocyanate.

3. The preparation method of the antistatic semiconductor UV adhesion-reducing layer according to claim 1, characterized in that, The ratio of polytetrahydrofuran ether diol to carbon nanotubes is 1 mol:(15 - 60) g.

4. The preparation method of the antistatic semiconductor UV tack reduction layer according to claim 1, characterized in that, In the above S1, the temperature of the polymerization reaction is 70 - 80 °C, and the reaction time is 3 - 4 h; the temperature during the continuous reaction is 50 - 60 °C, and the reaction time is 1 - 1.5 h.

5. The preparation method of the antistatic semiconductor UV adhesion-reducing layer according to claim 1, characterized in that, In the above S2, the ratio of carbon nanotubes to vinyl perylene diimide diol chain extender is 1 g:(0.05 - 0.2) g.

6. The preparation method of the antistatic semiconductor UV adhesion-reducing layer according to claim 1, characterized in that, In the above S2, the time of ultrasonic dispersion is 20 - 30 min; the time of stirring is 3 - 8 h; the time of ultrasonic dispersion is 10 - 20 min.

7. The preparation method of the antistatic semiconductor UV de-adhesion layer according to claim 1, characterized in that, In the above S3, the reactive diluent is dipropylene glycol diacrylate or tripropylene glycol diacrylate; the photoinitiator is TPO.

8. The preparation method of the antistatic semiconductor UV adhesion-reducing layer according to claim 5, wherein The preparation method of the vinyl perylene diimide diol chain extender comprises: add N-methylpyrrolidone, 3,4,9,10-perylene tetracarboxylic dianhydride and 3-[(2-aminoethyl)amino]-2-hydroxypropyl methacrylate in a ratio of 1 mol:(6 - 7) mol into a reaction vessel, heat to 140 - 160 °C in a nitrogen atmosphere, react for 12 - 18 h, add water into the solution, precipitate a solid, filter and wash, and dry to obtain the vinyl perylene diimide diol chain extender.

9. An antistatic semiconductor UV tackifying layer obtained by the preparation method according to any one of claims 1 - 8.

10. A protective film formed by the antistatic semiconductor UV tackifying layer according to claim 9.

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