Self-adaptive anti-sticking cable and preparation method and application thereof
Through the gradient-distributed adaptive anti-adhesive layer and multi-functional outer sheath structure, the problems of interface stripping and single function of traditional superconducting cables in extreme environments are solved, and high stability and self-sustaining power transmission performance are achieved.
Patent Information
- Application Number
- CN202510635424.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-16
- Publication Date
- 2025-08-01
AI Technical Summary
In extreme environments, traditional superconducting cables have unstable performance due to interface stripping and single outer sheathing function, which cannot meet the needs of energy self-maintenance and multi-physics coupling protection.
Adaptive anti-adhesion layer with gradient distribution and multifunctional outer sheath structure, including a combination of lead zirconium titanate piezoelectric ceramic particles and thermally responsive nanocapsules, combined with a self-healing insulating layer and a thermoelectric film, is used to compensate interface stress by piezoelectric effect and phase change material to achieve dynamic stress adjustment and thermoelectric conversion.
It improves the interface peeling strength and insulation performance of superconducting cables in extreme environments, and at the same time realizes temperature differential power generation efficiency and radiation protection, significantly improving the stability and self-sustaining capabilities of cables in extreme environments.
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Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of cable composite materials, and particularly to an adaptive anti-sticking cable and its preparation method and application. Background Art
[0002] In extreme environments such as nuclear reactor cooling systems and deep space probes, power transmission cables need to withstand severe temperature fluctuations (-196°C to +300°C), strong radiation, and complex mechanical stresses for a long time. Traditional superconducting cables usually adopt anti-sticking layers and insulating layers with a single homogeneous structure, resulting in interface peeling between the superconducting core wire and the insulating layer due to the difference in thermal expansion coefficients, seriously affecting the stability of superconducting performance. In addition, existing anti-sticking layers mostly rely on static material design and cannot compensate for interface deformation caused by temperature changes through dynamic stress adjustment, and irreversible damage is easily formed under long-term thermal cycling.
[0003] Although traditional insulating layers can achieve crack repair through microcapsule technology, the random distribution of microcapsules easily leads to limited diffusion paths of repair agents and lacks the ability to suppress leakage current in high-energy radiation environments. Moreover, the outer sheath material often only focuses on mechanical protection or heat insulation performance and lacks the synergistic integration of thermoelectric conversion and superhydrophobic functions, making it difficult to meet the requirements of energy self-sustainment and multi-physical field coupling protection in extreme environments. Summary of the Invention
[0004] The purpose of the present invention is to overcome the problems existing in traditional superconducting cables, such as interface deformation and the difficulty of the outer sheath to meet the requirements of energy self-sustainment and multi-physical field coupling protection in extreme environments, and provide an adaptive anti-sticking cable and its preparation method and application.
[0005] An adaptive anti-sticking cable includes the following structural layers arranged in sequence from the inside to the outside:
[0006] A superconducting core wire, which is composed of a carbon fiber substrate with a diameter of 5μm to 20μm and a magnesium diboride (MgB2) superconducting layer with a thickness of 10μm to 50μm grown on its surface by chemical vapor deposition;
[0007] An adaptive anti-sticking layer, which is wrapped outside the superconducting core wire and is composed of a polycaprolactone-polyurethane copolymer matrix, thermoresponsive nanocapsules, and lead zirconate titanate (PZT) piezoelectric ceramic particles modified by silane coupling agent KH-550 on the surface; wherein, the mass fraction of the piezoelectric ceramic particles linearly increases from 5% in the inner layer to 15% in the outer layer, and the mass fraction of the thermoresponsive nanocapsules linearly decreases from 20% in the inner layer to 5% in the outer layer. This gradient distribution is used to generate differential thermal expansion stress through the piezoelectric effect and form a temperature-sensitive interface in combination with the phase change of the thermoresponsive nanocapsules.
[0008] Self-healing insulation layer, coated on the outside of the adaptive anti-sticking layer, is composed of a polydimethylsiloxane (PDMS) matrix, repair microcapsules, and vertically aligned boron nitride nanosheets with Fe3O4 coated on the surface; the thickness of the boron nitride nanosheets is 10 nm to 100 nm, and the distance between adjacent nanosheets is ≤100 nm; the particle size of the repair microcapsules is 1 μm to 10 μm, and they are composed of a polyurea shell encapsulating siloxane monomers and a platinum catalyst;
[0009] Multifunctional outer sheath, coated on the outside of the self-healing insulation layer, is composed of an inner layer of silicon carbide fiber woven mesh, a middle layer of Bi2Te3 / Sb2Te3 thermoelectric thin film, and an outer layer of superhydrophobic silica aerogel.
[0010] Further, in the polycaprolactone-polyurethane copolymer matrix, the proportion of the polycaprolactone (PCL) chain segment is 30% to 50%, and its shape recovery temperature measured by differential scanning calorimetry (DSC) is 145°C ± 5°C; the rupture temperature of the thermoresponsive nanocapsules is 160°C to 200°C.
[0011] Further, the particle size of the lead zirconate titanate piezoelectric ceramic particles is 0.1 μm to 2 μm, the shell of the thermoresponsive nanocapsules is composed of polyurethane, and perfluoropolyether (PFPE) is encapsulated inside.
[0012] Further, the vertically aligned boron nitride nanosheets are embedded in the PDMS matrix by magnetic field orientation technology, and the magnetic field strength is 0.5 T to 2 T.
[0013] A preparation method of an adaptive anti-sticking cable includes the following steps:
[0014] S1: Superconducting core wire preparation: Place carbon fiber in a CVD reaction chamber protected by hydrogen, introduce a mixed gas of borane and magnesium chloride, and react at 800°C to grow a MgB2 superconducting layer. Control the thickness of the superconducting layer to be 10 μm to 50 μm by the reaction time;
[0015] S2: Adaptive anti-sticking layer coating: Using four-dimensional printing technology (4D printing), coat the shape memory polymer, thermoresponsive nanocapsules, and surface-modified piezoelectric ceramic particles on the surface of the superconducting core wire according to a preset gradient distribution, heat to 145°C ± 5°C to trigger the shape memory effect, and cure with ultraviolet light to form an anti-sticking layer with a thickness of 50 μm to 200 μm;
[0016] S3: Self-healing insulation layer construction: Disperse the repair microcapsules and boron nitride nanosheets with Fe3O4 coated on the surface in the PDMS prepolymer through a microfluidic chip, apply a magnetic field of 0.5 T to 2 T to orient the nanosheets, and cure to form an insulation layer with a thickness of 0.5 mm to 2 mm;
[0017] S4: Outer sheath integration:
[0018] S4.1: Prepare a silicon carbide fiber woven mesh by electrospinning, with the fiber diameter being 10 μm to 50 μm;
[0019] S4.2: Deposit a Bi2Te3 / Sb2Te3 thermoelectric thin film on the surface of the woven mesh by magnetron sputtering, with the sputtering power being 200 W to 400 W, and the power ratio of the Bi target, Sb target and Te target being 2:1:3;
[0020] S4.3: Cure silica aerogel on the surface of the thermoelectric thin film by the supercritical drying method, with the drying pressure being 10 MPa to 15 MPa.
[0021] Further, during the magnetron sputtering process, the substrate temperature is 250 °C to 300 °C, the sputtering gas is argon, and the gas pressure is 0.5 Pa to 1.5 Pa.
[0022] An application of an adaptive anti-sticking cable, which is applicable to the power transmission of a nuclear reactor cooling system or a deep space probe. The cable maintains a volume resistivity ≥ 10 4 Ω·cm under a temperature difference of -196 °C to +300 °C and a radiation environment with a dose rate ≤ 10 15 Gy / h through the self-healing insulating layer, and achieves a thermoelectric conversion efficiency ≥ 3% through the Bi2Te3 / Sb2Te3 thermoelectric thin film.
[0023] The beneficial effects of the present invention are:
[0024] (1) Through the composite structure of the carbon fiber substrate and the magnesium diboride superconducting layer grown by chemical vapor deposition, the high thermal conductivity of the carbon fiber can quickly disperse the Joule heat. Combining with the low-temperature high critical current density characteristics of MgB2, the instability of the superconducting state can be effectively avoided.
[0025] (2) By linearly increasing the mass fraction of lead zirconate titanate (PZT) piezoelectric ceramic particles in the adaptive anti-sticking layer from 5% in the inner layer to 15% in the outer layer, and linearly decreasing the thermally responsive nanocapsules from 20% in the inner layer to 5% in the outer layer, a gradient piezoelectric-phase change synergistic mechanism is formed. When the temperature rises, the PZT particles generate piezoelectric potential due to the difference in thermal expansion coefficients, driving the phase change release of perfluoropolyether (PFPE) in the nanocapsules to fill the interfacial microcracks; when the temperature drops suddenly, the inverse piezoelectric effect of PZT contracts to compensate for the cold shrinkage stress of the matrix, improving the interfacial peel strength.
[0026] (3) The vertically aligned boron nitride nanosheets in the self-healing insulating layer are magnetically oriented by coating with Fe3O4 (spacing ≤ 100 nm) to form a three-dimensional insulating network, reducing the surface leakage current. When mechanical damage penetrates the insulating layer, the polyurea microcapsules rupture to release the silicone monomer, which in situ crosslinks with the PDMS matrix under the catalysis of platinum for repair. Moreover, the vertical orientation of the boron nitride nanosheets guides the repair agent to diffuse along the depth direction of the crack, achieving precise repair.
[0027] (4) In the multifunctional outer sheath, the silicon carbide fiber braided mesh provides mechanical support; the Bi2Te3 / Sb2Te3 thermoelectric thin film recovers the waste heat on the cable surface at a temperature difference of 300 °C; the superhydrophobic silica aerogel blocks the penetration of liquid water through the nanoporous structure and simultaneously reduces the radiative heat conduction, forming a thermal-electric-mechanical integrated protection system. Specific embodiments
[0028] The following specific examples illustrate the implementation manners of the present invention. Those skilled in the art can easily understand the other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation manners, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other.
[0029] Example 1
[0030] A preparation method of an adaptive anti-sticking cable includes the following steps:
[0031] S1: Preparation of the superconducting core wire: Place a 5-μm carbon fiber substrate in a CVD reaction chamber protected by hydrogen, introduce a mixed gas of borane and magnesium chloride, and react at 800 °C for growth of the MgB2 superconducting layer. Control the reaction time to 1 h, and the thickness of the superconducting layer is 10 μm.
[0032] S2: Coating of the adaptive anti-sticking layer: Using four-dimensional printing technology, coat the surface of the superconducting core wire with shape memory polymer, thermally responsive nanocapsules, and surface-modified piezoelectric ceramic particles according to a preset gradient distribution, heat to 145 °C to trigger the shape memory effect, and cure with ultraviolet light to form an anti-sticking layer with a thickness of 50 μm, and the ultraviolet curing intensity is 30 mW / cm 2Specifically, the mass fraction of the piezoelectric ceramic particles increases linearly from 5% in the inner layer to 15% in the outer layer, and the mass fraction of the thermoresponsive nanocapsules decreases linearly from 20% in the inner layer to 5% in the outer layer. The gradient distribution is used to generate differential thermal expansion stress through the piezoelectric effect and form a temperature-sensitive interface in combination with the phase change of the thermoresponsive nanocapsules. In the polycaprolactone-polyurethane copolymer matrix, the proportion of the polycaprolactone (PCL) chain segment is 30%. The rupture temperature of the thermoresponsive nanocapsules is 160 °C. The particle size of the lead zirconate titanate piezoelectric ceramic particles is 0.1 μm. The outer shell of the thermoresponsive nanocapsules is composed of polyurethane, and perfluoropolyether (PFPE) is encapsulated inside.
[0033] S3: Self-healing insulating layer construction: Repair microcapsules and boron nitride nanosheets coated with Fe3O4 on the surface are dispersed in the PDMS prepolymer through a microfluidic chip, and a magnetic field of 0.5 T is applied to align the nanosheets directionally. After curing, an insulating layer with a thickness of 0.5 mm is formed. The thickness of the boron nitride nanosheets is 10 nm, and the distance between adjacent nanosheets is ≤ 100 nm. The particle size of the repair microcapsules is 1 μm, and they are composed of a polyurea outer shell encapsulating a siloxane monomer and a platinum catalyst.
[0034] S4: Outer sheath integration:
[0035] S4.1: Prepare a silicon carbide fiber woven mesh by electrospinning, with a fiber diameter of 10 μm.
[0036] S4.2: Deposit a Bi2Te3 / Sb2Te3 thermoelectric thin film on the woven mesh surface by magnetron sputtering. The sputtering power is 200 W, and the power ratio of the Bi target, Sb target, and Te target is 2:1:3. During the magnetron sputtering process, the substrate temperature is 250 °C, the sputtering gas is argon, and the gas pressure is 0.5 Pa.
[0037] S4.3: Cure silica aerogel on the surface of the thermoelectric thin film by the supercritical drying method, and the drying pressure is 10 MPa.
[0038] Example 2
[0039] A preparation method of an adaptive anti-sticking cable, comprising the following steps:
[0040] S1: Superconducting core wire preparation: Place a 12-μm carbon fiber substrate in a CVD reaction chamber protected by hydrogen, introduce a mixed gas of borane and magnesium chloride, and react at 800 °C to grow a MgB2 superconducting layer. Control the reaction time to 2 h, and the thickness of the superconducting layer is 30 μm.
[0041] S2: Adaptive anti - sticking layer coating: Using four - dimensional printing technology, shape - memory polymers, thermoresponsive nanocapsules, and surface - modified piezoelectric ceramic particles are coated on the surface of the superconducting core wire according to a preset gradient distribution. Heat it to 145 °C to trigger the shape - memory effect, and then cure it with ultraviolet light to form an anti - sticking layer with a thickness of 125 μm. The ultraviolet curing intensity is 50 mW / cm 2 ; Specifically, the mass fraction of the piezoelectric ceramic particles increases linearly from 5% in the inner layer to 15% in the outer layer, the mass fraction of the thermoresponsive nanocapsules decreases linearly from 20% in the inner layer to 5% in the outer layer. The gradient distribution is used to generate differential thermal expansion stress through the piezoelectric effect and form a temperature - sensitive interface in combination with the phase change of the thermoresponsive nanocapsules; in the polycaprolactone - polyurethane copolymer matrix, the proportion of the polycaprolactone (PCL) chain segment is 40%; the rupture temperature of the thermoresponsive nanocapsules is 180 °C. The particle size of the lead zirconate titanate piezoelectric ceramic particles is 1 μm, the shell of the thermoresponsive nanocapsules is composed of polyurethane, and perfluoropolyether (PFPE) is encapsulated inside.
[0042] S3: Self - healing insulation layer construction: Through a microfluidic chip, repair microcapsules and boron nitride nanosheets coated with Fe3O4 are dispersed in the PDMS prepolymer, and a 1.2 T magnetic field is applied to align the nanosheets. After curing, an insulation layer with a thickness of 1.2 mm is formed; the thickness of the boron nitride nanosheets is 80 nm, and the distance between adjacent nanosheets is ≤100 nm; the particle size of the repair microcapsules is 5 μm, and they are composed of a polyurea shell encapsulating siloxane monomers and a platinum catalyst;
[0043] S4: Outer sheath integration:
[0044] S4.1: Prepare a silicon carbide fiber woven mesh by electrospinning, with a fiber diameter of 30 μm;
[0045] S4.2: Deposit a Bi2Te3 / Sb2Te3 thermoelectric thin film on the woven mesh surface by magnetron sputtering. The sputtering power is 300 W, and the power ratio of the Bi target, Sb target, and Te target is 2:1:3; during the magnetron sputtering process, the substrate temperature is 280 °C, the sputtering gas is argon, and the gas pressure is 1 Pa.
[0046] S4.3: Cure silica aerogel on the surface of the thermoelectric thin film by supercritical drying method, and the drying pressure is 12 MPa.
[0047] Example 3
[0048] A preparation method of an adaptive anti - sticking cable, comprising the following steps:
[0049] S1: Preparation of superconducting core wire: Place a 20-μm carbon fiber substrate in a CVD reaction chamber protected by hydrogen, introduce a mixed gas of borane and magnesium chloride, react and grow a MgB2 superconducting layer at 800 °C, control the reaction time to 3 h, and the thickness of the superconducting layer is 50 μm;
[0050] S2: Coating of self-adaptive anti-sticking layer: Using four-dimensional printing technology, a shape memory polymer, thermoresponsive nanocapsules, and surface-modified piezoelectric ceramic particles are coated on the surface of the superconducting core wire according to a preset gradient distribution, heated to 145 °C to trigger the shape memory effect, and ultraviolet light is cured to form an anti-sticking layer with a thickness of 200 μm; Specifically, the mass fraction of the piezoelectric ceramic particles increases linearly from 5% in the inner layer to 15% in the outer layer, the mass fraction of the thermoresponsive nanocapsules decreases linearly from 20% in the inner layer to 5% in the outer layer, and the gradient distribution is used to generate differential thermal expansion stress through the piezoelectric effect and form a temperature-sensitive interface in combination with the phase change of the thermoresponsive nanocapsules; In the polycaprolactone-polyurethane copolymer matrix, the proportion of the polycaprolactone (PCL) chain segment is 50%; The rupture temperature of the thermoresponsive nanocapsules is 200 °C. The particle size of the lead zirconate titanate piezoelectric ceramic particles is 2 μm, the outer shell of the thermoresponsive nanocapsules is composed of polyurethane, and perfluoropolyether (PFPE) is encapsulated inside.
[0051] S3: Construction of self-healing insulating layer: Through a microfluidic chip, repair microcapsules and boron nitride nanosheets coated with Fe3O4 are dispersed in a PDMS prepolymer, a 2T magnetic field is applied to align the nanosheets, and after curing, an insulating layer with a thickness of 2 mm is formed; The thickness of the boron nitride nanosheets is 100 nm, and the distance between adjacent nanosheets ≤ 100 nm; The particle size of the repair microcapsules is 10 μm, and they are composed of a polyurea outer shell encapsulating a siloxane monomer and a platinum catalyst;
[0052] S4: Outer sheath integration:
[0053] S4.1: Prepare a silicon carbide fiber woven mesh by electrospinning, with a fiber diameter of 50 μm;
[0054] S4.2: Deposit a Bi2Te3 / Sb2Te3 thermoelectric thin film on the woven mesh surface by magnetron sputtering, with a sputtering power of 400 W, and the power ratio of the Bi target, Sb target, and Te target being 2:1:3; During the magnetron sputtering process, the substrate temperature is 300 °C, the sputtering gas is argon, and the gas pressure is 1.5 Pa.
[0055] S4.3: Cure silica aerogel on the surface of the thermoelectric thin film by supercritical drying, with a drying pressure of 15 MPa.
[0056] According to the preparation methods of the above-mentioned Examples 1 to 3, the corresponding Example products were prepared, and the interfacial peel strength, insulation resistivity, and thermoelectric power generation efficiency were tested; the specific values of each example are shown in Table 1 below:
[0057] Table 1: Comparison Table of Technical Parameters of Each Example
[0058]
[0059]
[0060] Among them, 1. Interfacial peel strength test Test standard: ASTM D3164 (Adhesive Tensile Shear Strength Test Method) combined with a special thermal cycle protocol for cables.
[0061] Test equipment: Universal material testing machine (Instron 5967, range 10kN), high and low temperature cycle chamber (ESPECT SE-11-A, temperature range -196°C to +300°C), peel fixture (V-groove fixture, clamping force ≥ 500N);
[0062] Test steps: Sample preparation: Cut a 50 cm cable segment and axially cut to expose the interface between the superconducting core wire and the anti-sticking layer. Thermal cycle treatment: Place the sample in the high and low temperature cycle chamber and cycle 1000 times according to the following procedure: Liquid nitrogen immersion (-196°C, 10 minutes) → High temperature furnace heating (+300°C, 10 minutes) → Room temperature equilibrium (5 minutes). Peel strength test: Fix the cable to the V-groove fixture and peel the superconducting core wire and the anti-sticking layer at a speed of 50 mm / min, and record the maximum peel force (F_max).
[0063] Peel strength calculation formula: σ = F max / b·t (MPa), b: Peel width (cable circumference, unit mm), t: Anti-sticking layer thickness (unit mm); Data validity: Test 5 samples in each group, and take the average value after excluding the deviation values of ±15%.
[0064] 2. Insulation resistivity (after repair) test, IEC 62631-3-1 (Volume Resistivity Test of Solid Insulating Materials) combined with ASTM D257 (DC Resistance Measurement).
[0065] Test equipment: High resistance meter (Keysight B2987A, range 10 16 Ω) / Constant temperature and humidity chamber (temperature 23 ± 2°C, humidity 50 ± 5%) / Crack prefabrication device (diamond tool head, accuracy ±0.1 mm).
[0066] Test procedures: Crack prefabrication: Use a diamond knife to cut a 3-mm deep crack (width 0.2 mm, length 10 mm) on the surface of the insulating layer. Place the sample in an environment of 23 °C for 24 hours to trigger microcapsule repair. Resistivity measurement: Adopt a three-electrode system: a high-voltage electrode (copper foil, covering the outer surface of the cable), a measurement electrode (ring-shaped copper strip, width 10 mm), and a protection electrode (to eliminate edge leakage current); apply a 500-V DC voltage, and read the current value (I) after stabilizing for 30 seconds.
[0067] Calculation formula for volume resistivity: ρ = U·A / I·d (Ω·cm), U: applied voltage (V), A: area of the measurement electrode (cm 2 ), d: thickness of the insulating layer (cm); Data verification: The resistivity after repair needs to have a fluctuation of ≤ ±5% in the measured values for three consecutive times.
[0068] 3. Thermoelectric power generation efficiency test
[0069] Test standard: EN 50382 (Performance test for railway cables) combined with the measurement specification of the Seebeck coefficient.
[0070] Test equipment: Thermoelectric property test system (Linseis LSR-3, temperature range -70 °C to +600 °C), data acquisition instrument (Agilent 34970A, sampling rate 1 kHz), thermal imager (FLIR A615, accuracy ±1 °C);
[0071] Test procedures: Temperature difference establishment: Connect one end of a 1-m long cable segment to a heating plate (set temperature Th), and the other end to a cooler (set temperature Tc), and maintain ΔT = 200 K (e.g., Th = 300 °C, Tc = 100 °C). Use a thermal imager to monitor the temperature distribution on the outer sheath surface to ensure that the temperature difference gradient is stable (fluctuation ≤ ±2 °C). Electrical output measurement: Weld leads at both ends of the thermoelectric thin film and connect them to the data acquisition instrument to measure the open-circuit voltage (Voc) and short-circuit current (Isc).
[0072] Calculation formula for power generation:
[0073] P = Voc·Isc / 4 (maximum power point method)
[0074] Efficiency calculation:
[0075] Formula for thermoelectric power generation efficiency:
[0076] η = P out / Q in ×100% = P out / (k·A·ΔT) × 100%, Q in : input heat flux (W), k: thermal conductivity of the thermoelectric thin film (W / (m·K)), A: effective heat transfer area (m 2); Error control: Heat flux calibration: The thermal conductivity test module is calibrated using a standard reference material (SRM1453). Voltage / current measurement: A 0.05 - level standard resistor (IET Labs SRX - 1) is used for systematic error compensation.
[0077] According to the above - mentioned test method, the test data are shown in Table 1 as follows:
[0078] Table 1: Test results of the embodiment
[0079]
[0080] Analyzing the above results, the cable test results in this solution are better than the technical indicators in the prior art.
[0081] Next, the innovative points in this solution will be further elaborated.
[0082] Comparative Example 1: Traditional homogeneous anti - sticking layer cable (comparative design based on Example 2)
[0083] Structural differences: Based on Example 2, in Comparative Example 1, the material distribution of the adaptive anti - sticking layer is adjusted, and the remaining structures (superconducting core wire, self - healing insulation layer, multi - functional outer sheath) are exactly the same as those in Example 1. Specifically, in the adaptive anti - sticking layer, PZT particles and nano - capsules are homogeneously distributed, the mass fraction of PZT is fixed at 10% (non - gradient distribution), and the mass fraction of thermoresponsive nano - capsules is fixed at 12.5% (non - gradient decreasing). The performance comparison is as follows
[0084]
[0085] Conclusion:
[0086] The homogeneously distributed PZT particles in Comparative Example 1 cannot dynamically respond to temperature changes, and the thermal expansion stress concentrates at the interface, resulting in delamination failure. The gradient - distributed PZT particles (5% in the inner layer → 15% in the outer layer) in Example 1 generate differential electric potential through the piezoelectric effect, driving the nano - capsules to release the phase - change material (PFPE) to fill the micro - cracks, realizing dynamic stress compensation.
[0087] The gradient - distributed PZT and nano - capsules improve the interface stress compensation efficiency.
[0088] Comparative Example 2: Cable with randomly distributed boron nitride insulation layer
[0089] Structural differences: In the self - healing insulation layer, boron nitride nanosheets are randomly dispersed without magnetic field orientation (spacing 200 - 500 nm), and the rest is the same as in Example 2. The performance comparison is as follows:
[0090] Test item Comparative Example 2 Example 2 Surface leakage current (μA / m) 12.4 0.8 Breakdown field strength (kV / mm) 300 450 Repair efficiency (3mm crack) 45% 92%
[0091] Conclusion: In Comparative Example 2, the boron nitride nanosheets are randomly dispersed without magnetic field orientation, resulting in the inability to form a continuous insulating barrier. That is, the vertically aligned boron nitride nanosheets in this solution improve the insulation performance.
[0092] Comparative Example 3: Single-functional outer sheath cable
[0093] Structural differences: The multi-functional outer sheath only retains the silicon carbide fiber braided mesh, without the thermoelectric thin film and aerogel layer. The performance comparison is as follows:
[0094]
[0095] Conclusion: Without the deposition of Bi2Te3 / Sb2Te3 thermoelectric thin film on the outer sheath, it is impossible to generate electricity using the Seebeck effect (220 μV / K). Without the superhydrophobic silica aerogel, liquid water penetrates through the gaps between the silicon carbide fibers. The nanoporous structure of the aerogel layer can block radiative heat transfer, and the thermal conductivity of the single silicon carbide mesh is 3 times higher. That is: Integrating the thermoelectric thin film and the aerogel layer realizes energy recovery and superhydrophobic collaborative protection.
[0096] Comparative Example 4: Conventional microcapsule self-healing cable
[0097] Structural differences: Self-healing insulation layer: Using urea-formaldehyde resin microcapsules (particle size 5 μm, without platinum catalyst), and the repair agent is epoxy resin. The performance comparison is as follows:
[0098] Test item Comparative Example 4 Example 2 High temperature repair efficiency (200°C) 38% 92% Retention rate of repair activity after radiation 20% 95% Microcapsule rupture temperature 120°C (accidental leakage) 160°C (controlled release)
[0099] Conclusion: The outer shell of the urea-formaldehyde resin microcapsules has poor heat resistance (rupture temperature 120 °C), rupturing prematurely at high temperatures, and the epoxy resin is incompatible with the PDMS matrix. The epoxy repair agent has its chemical bonds broken under γ-ray irradiation (10 4 Gy / h), and the active ingredients are inactivated. The low rupture temperature causes the microcapsules to accidentally release the repair agent under non-damaging conditions, resulting in material waste. That is: The polyurea microcapsules are compatible with the siloxane / platinum system in high-temperature and radiation environments, improving the repair reliability.
[0100] Verification of extreme environment adaptability
[0101] Test conditions: Temperature cycle: 1000 cycles; Radiation environment: 60 Co γ-ray irradiation, dose rate 10 4 Gy / h, cumulative dose 10 6 Gy; Mechanical bending: Curvature radius 5D, cyclic bending 5000 times. The test results are as follows
[0102]
[0103] Conclusion: The performance attenuation rate of this cable under extreme conditions is ≤10%, which is significantly better than that of traditional cables (attenuation rate ≥50%).
[0104] The test results of Comparative Examples 1 to 4 verify the technological breakthroughs of the present invention in gradient material design, function integration, and adaptability to extreme environments, and its comprehensive performance is significantly better than that of traditional cables.
[0105] The above-described embodiments only represent the specific implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, and these all belong to the protection scope of the present invention.
Claims
1. An adaptive anti-sticking cable, characterized in that: It includes the following structural layers arranged from the inside to the outside in sequence: A superconducting core wire, which is composed of a carbon fiber substrate with a diameter of 5 μm to 20 μm and a magnesium diboride (MgB2) superconducting layer with a thickness of 10 μm to 50 μm grown on its surface by chemical vapor deposition; An adaptive anti-sticking layer, which is wrapped outside the superconducting core wire and is composed of a polycaprolactone-polyurethane copolymer matrix, thermoresponsive nanocapsules, and lead zirconate titanate (PZT) piezoelectric ceramic particles modified on the surface with a silane coupling agent KH-550; wherein, the mass fraction of the piezoelectric ceramic particles linearly increases from 5% in the inner layer to 15% in the outer layer, and the mass fraction of the thermoresponsive nanocapsules linearly decreases from 20% in the inner layer to 5% in the outer layer. This gradient distribution is used to generate differential thermal expansion stress through the piezoelectric effect and form a temperature-sensitive interface in combination with the phase change of the thermoresponsive nanocapsules; A self-healing insulating layer, which is coated outside the adaptive anti-sticking layer and is composed of a polydimethylsiloxane (PDMS) matrix, repair microcapsules, and vertically arranged boron nitride nanosheets coated with Fe3O4 on the surface; the thickness of the boron nitride nanosheets is 10 nm to 100 nm, and the spacing between adjacent nanosheets is ≤ 100 nm; the particle size of the repair microcapsules is 1 μm to 10 μm, and they are composed of a polyurea shell encapsulating a siloxane monomer and a platinum catalyst; A multifunctional outer sheath, which is coated outside the self-healing insulating layer and is composed of an inner layer of silicon carbide fiber woven mesh, a middle layer of Bi2Te3 / Sb2Te3 thermoelectric thin film, and an outer layer of superhydrophobic silica aerogel.
2. The self-adaptive anti-sticking cable according to claim 1, wherein: In the polycaprolactone-polyurethane copolymer matrix, the proportion of the polycaprolactone (PCL) chain segment is 30% to 50%, and its shape recovery temperature measured by differential scanning calorimetry (DSC) is 145 °C ± 5 °C; the rupture temperature of the thermoresponsive nanocapsules is 160 °C to 200 °C.
3. The self-adaptive anti-sticking cable according to claim 2, characterized in that: The particle size of the lead zirconate titanate piezoelectric ceramic particles is 0.1 μm to 2 μm, and the shell of the thermoresponsive nanocapsules is composed of polyurethane and internally encapsulates perfluoropolyether (PFPE).
4. An adaptive anti-sticking cable according to claim 1, wherein: The vertically arranged boron nitride nanosheets are embedded in the PDMS matrix through a magnetic field orientation technique, and the magnetic field strength is 0.5 T to 2 T.
5. A preparation method of an adaptive anti-sticking cable according to any one of claims 1 to 4, characterized in that, It includes the following steps: S1: Preparation of the superconducting core wire: Place the carbon fiber in a CVD reaction chamber protected by hydrogen, introduce a mixed gas of borane and magnesium chloride, and react at 800 °C to grow the MgB2 superconducting layer. Control the thickness of the superconducting layer to be 10 μm to 50 μm through the reaction time; S2: Coating of the adaptive anti-sticking layer: Adopt four-dimensional printing technology (4D printing) to coat the shape memory polymer, thermoresponsive nanocapsules, and surface-modified piezoelectric ceramic particles on the surface of the superconducting core wire according to a preset gradient distribution, heat to 145 °C ± 5 °C to trigger the shape memory effect, and cure with ultraviolet light to form an anti-sticking layer with a thickness of 50 μm to 200 μm; S3: Construction of the self-healing insulating layer: Disperse the repair microcapsules and boron nitride nanosheets coated with Fe3O4 on the surface in the PDMS prepolymer through a microfluidic chip, apply a magnetic field of 0.5 T to 2 T to orient the nanosheets, and cure to form an insulating layer with a thickness of 0.5 mm to 2 mm; S4: Outer sheath integration: S4.1: Prepare a silicon carbide fiber woven mesh by electrospinning, with a fiber diameter of 10 μm to 50 μm; S4.2: Deposit a Bi2Te3 / Sb2Te3 thermoelectric thin film on the surface of the woven mesh by magnetron sputtering, with a sputtering power of 200 W to 400 W, and a power ratio of Bi target, Sb target to Te target of 2:1:3; S4.3: Cure silica aerogel on the surface of the thermoelectric thin film by supercritical drying method, with a drying pressure of 10 MPa to 15 MPa.
6. The preparation method of an adaptive anti-sticking cable according to claim 5, characterized in that: During the magnetron sputtering process, the substrate temperature is 250 °C to 300 °C, the sputtering gas is argon, and the gas pressure is 0.5 Pa to 1.5 Pa.
7. Application of an adaptive anti-sticking cable, characterized in that: Applicable to power transmission in a nuclear reactor cooling system or a deep space probe. The cable maintains a volume resistivity ≥ 10 4 Ω·cm through the self-healing insulating layer under a temperature difference of -196°C to +300°C and a radiation environment with a dose rate ≤ 10 15 Gy / h, and realizes a thermoelectric power generation efficiency ≥ 3% through the Bi2Te3 / Sb2Te3 thermoelectric thin film.
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