Laser transmitting and receiving system, assembling method and laser radar

Abstract

The invention provides a laser transmit-receive system, an assembly method and an optical radar. The laser transmit-receive system comprises an optical chip used for receiving a light beam generated by a laser light source transmitted by an optical fiber array through an input coupling end; the input coupling end is step-shaped; grooves corresponding to the light beams in number are formed in the surface of the lower step and are used for correspondingly placing optical fibers for transmitting the light beams in the optical fiber array; a spot size converter is correspondingly arranged on the connected end face of the upper-layer step and the lower-layer step; waveguides are arranged in a manner of extending towards the upper step along the length direction of the corresponding groove, so that the cross sections of the optical fibers are coupled with the corresponding spot size converters, and light beams in the optical fibers are transmitted to the corresponding waveguides; the optical fiber is arranged on the base and is covered and pressed by the cover plate; the arrangement of the optical fibers on the base corresponds to the arrangement of the grooves; the side, in butt joint with the optical chip, of the optical fiber extends out of the base by a first length, so that pressure is applied to the optical fiber through a cover plate on the extended optical fiber, and the extended optical fiber is pressed into the corresponding groove. The production efficiency is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of optical chip technology, and in particular to a laser transceiver system, an assembly method, and a laser radar. Background Art

[0002] With the development and demand for mobile internet, data centers, cloud computing, and high-definition video, the capacity and transmission rate requirements of communication systems are constantly increasing. At the same time, performance requirements for communication networks, such as integration, low power consumption, intelligence, and large capacity, are also increasing. Photonic technology has become a trend and direction for the future development of optical devices. For example, silicon photonic circuits (PICs) have the advantages of low cost, high integration, and large bandwidth, which can meet the growing demand for data services and network resources.

[0003] Fiber-optic communication has become one of the mainstays of modern communications, playing a crucial role in modern telecommunications networks. It is a key symbol of the world's new technological revolution and the primary means of transmitting information in the future information society. Optical fiber has been widely used to transmit optical signals, providing high-speed communication links. Compared to electrical links, optical links utilizing fiber offer advantages such as high bandwidth, high noise immunity, low power consumption, minimal crosstalk, and low cost. The optical signals carried by optical fibers can be processed by a variety of optical or electronic devices, including integrated circuits.

[0004] Therefore, in order for silicon photonic circuits (here, for example) to function as optical components in optical systems, optical fibers need to be connected to the waveguides on the silicon photonic circuits. Therefore, precise alignment (also known as coupling) between optical fibers and the waveguides on the silicon photonic circuits is becoming increasingly important during the assembly of optical systems.

[0005] At present, the coupling process in the industry is divided into active coupling and passive coupling, among which active coupling is the mainstream process in the industry. For example, during the coupling process, the power of the laser or the response current of the photodiode (PD, PhotoDiode) can be read, and real-time feedback is given as to whether the coupling position is correct. During implementation, the silicon photonic circuit is first bonded and fixed, and then the optical fiber device is precisely moved for coupling alignment. During the coupling process, the status of functional devices such as power or current during the coupling process is read in real time to confirm the coupling state. The coupling equipment usually needs to reach the sub-micron level, and the coupling equipment has high precision requirements and complex equipment functions. After meeting the performance requirements, the coupling is completed. At this time, the optical fiber device needs to be fixed by glue, and the commonly used method is ultraviolet light irradiation + high-temperature baking. After the fixation is completed, testing and verification are required, and then the optical matching between the optical fiber component and the silicon photonic circuit waveguide is performed to meet the performance requirements of the component, and then curing is performed. It can be seen that the above-mentioned active coupling process equipment has complex functions, involves many processes, and has low production efficiency. Summary of the Invention

[0006] The embodiments of the present disclosure provide a laser transceiver system, an assembly method, and a laser radar to solve the problems of complex equipment functions and low production efficiency in the existing active coupling process.

[0007] Based on the above problem, in a first aspect, a laser transceiver system is provided, comprising: an optical chip, an optical fiber array, and a laser light source; the optical chip is configured to receive, through an input coupling end, a light beam generated by the laser light source and transmitted by the optical fiber array;

[0008] The input coupling end is in a stepped shape; grooves corresponding to the number of the light beams are provided on the surface of the lower step, for correspondingly placing the optical fibers in the optical fiber array that transmit the light beams; spot mode converters are provided on the end surface of the upper step connecting the lower step and corresponding to the grooves; a waveguide is provided extending from the spot mode converter along the length direction of the corresponding groove toward the upper step, so that after the optical fiber is placed in the corresponding groove, the cross section of the optical fiber is coupled with the spot mode converter corresponding to the groove, thereby transmitting the light beam in the optical fiber to the corresponding waveguide;

[0009] The optical fibers in the optical fiber array are arranged on a base and covered by a cover plate; the arrangement of the optical fibers on the base corresponds to the arrangement of the grooves; the side of the optical fiber that is connected to the optical chip extends beyond the first length of the base so that pressure is applied to the optical fiber by the cover plate on the extended optical fiber, and the extended optical fiber is pressed into the corresponding groove.

[0010] In combination with the first aspect, in a possible embodiment, the side where the optical fiber is docked with the optical chip extends out of the cover plate by a second length; the first length is greater than the second length; the second length satisfies the requirement that during the process of the assembly equipment pressing the optical fiber into the corresponding groove, the distance between the end of the optical fiber and the corresponding spot mode converter is controlled by the optical fiber of the second length.

[0011] In combination with the first aspect, in a possible embodiment, the optical fiber array is further provided with a pressure sensor; the pressure sensor is used to detect the pressure applied by the cover plate to the optical fiber during the process of the assembly equipment pressing the optical fiber into the corresponding groove, so that the optical fiber is pressed into the corresponding groove according to the preset pressure.

[0012] In combination with the first aspect, in a possible implementation, the height of the base and the height of the lower step satisfy: after the optical fiber is pressed into the corresponding groove, the optical fiber can maintain a straight and unbent state before being pressed into the corresponding groove.

[0013] In combination with the first aspect, in a possible embodiment, the cover plate and the base and the optical fiber therebetween are fixed by adhesive; the base is assembled and fixed by adhesive at the corresponding position after the optical fiber is placed in the corresponding groove, and the adhesive of the base is applied before the optical fiber is placed in the corresponding groove; after the optical fiber is placed in the corresponding groove, the optical fiber cover plate above the groove and the lower step where the groove is located are assembled and fixed by adhesive.

[0014] In combination with the first aspect, in a possible implementation manner, the first length is greater than a length of the groove.

[0015] In combination with the first aspect, in a possible implementation manner, the groove is V-shaped; and the optical chip is a silicon photonic chip.

[0016] In combination with the first aspect, in one possible implementation, the size of the groove and the radius of the optical fiber satisfy the following formula:

[0017]

[0018] Wherein, a represents half of the width of the V-groove opening; b represents the depth of the V-groove; and r represents the radius of the optical fiber.

[0019] In combination with the first aspect, in a possible embodiment, the optical chip also includes a transmitting end; the transmitting end is arranged at the opposite end of the input coupling end; the optical chip is used to process the light beam received by the input coupling end, and transmit it to the transmitting end through a waveguide for transmission; and / or process the reflected light beam received by the transmitting end, and transmit it to the input coupling end through a waveguide, and further transmit it to the corresponding optical fiber.

[0020] In combination with the first aspect, in a possible implementation, it further includes: a beam splitter; the beam splitter is used to split the light emitted by the laser light source into multiple light beams, and respectively connect them to multiple optical fibers for transmission.

[0021] In a second aspect, a method for assembling a laser transceiver system according to the first aspect or any possible embodiment in combination with the first aspect is provided, comprising:

[0022] Applying adhesive to the bottom of the base of the optical fiber array so as to fix the position of the optical fiber array after the position of the optical fiber array is determined;

[0023] According to the safe distance between the waveguide at the input coupling end of the optical chip and the optical fiber, and the position of the groove at the input coupling end of the optical chip, the optical fibers in the optical fiber array are aligned and placed into the corresponding grooves;

[0024] When it is determined by the optical fiber placed in the corresponding groove and extending out of the cover plate that the position of the optical fiber does not meet the safety distance, adjusting the position of the optical fiber array;

[0025] Applying a preset pressure to the optical fiber array, and monitoring the applied pressure through a pressure sensor provided on the optical fiber array, so that the optical fibers are pressed into the corresponding grooves according to the preset pressure;

[0026] Adhesive is applied between the cover plate of the optical fiber above the groove and the lower step where the groove is located to assemble and fix the optical chip and the optical fiber array.

[0027] In a third aspect, a laser radar is provided, comprising: a laser transceiver system assembled using the laser transceiver system assembly method described in the second aspect.

[0028] The beneficial effects of the embodiments of the present disclosure include:

[0029] The embodiments of the present disclosure provide a laser transceiver system, an assembly method and an optical radar, comprising: an optical chip, an optical fiber array and a laser light source; the optical chip is used to receive a light beam generated by a laser light source transmitted by the optical fiber array through an input coupling end; the input coupling end is in the shape of a step; a groove corresponding to the number of light beams is provided on the table top of the lower step, for correspondingly placing the optical fibers transmitting the above light beams in the optical fiber array; a pattern converter is provided on the end face where the upper step connects to the lower step and corresponds to the groove; a waveguide is extended from the pattern converter to the upper step along the length direction of the corresponding groove, so that after the optical fiber is placed in the corresponding groove, the cross section of the optical fiber is coupled with the pattern converter corresponding to the groove, so that the light beam in the optical fiber is transmitted to the corresponding waveguide; the optical fiber in the optical fiber array is provided on a base, and the optical fiber is covered by a cover plate; the arrangement of the optical fiber on the base corresponds to the arrangement of the groove; the side where the optical fiber is connected to the optical chip extends beyond the first length of the base, so that the cover plate on the extended optical fiber can press the optical fiber into the corresponding groove. The laser transceiver system provided by the disclosed embodiments utilizes a passive coupling method. By providing a groove corresponding to the optical fiber to be inserted at the input coupling end of the optical chip, and providing a cover plate for the optical fibers extending from the base in the design of the optical fiber array, the groove limits the horizontal position of the optical fiber during the process of pressing the optical fiber into the corresponding groove, and the cover plate applies pressure to limit the vertical position of the optical fiber. This multi-directional positioning allows for more precise positioning of the optical fiber in the groove, enabling more precise coupling with the corresponding spot converter. Compared to related technologies, the assembly equipment does not require real-time detection of power or current during the coupling process. The equipment is simple in function, has fewer process steps, shortens assembly time, and achieves high production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1A schematic diagram of the structure of an optical chip provided in an embodiment of the present disclosure;

[0031] Figure 2a A schematic side view of an optical fiber array structure provided in an embodiment of the present disclosure;

[0032] Figure 2b A schematic top view of the optical fiber array structure provided in an embodiment of the present disclosure;

[0033] Figure 3 A side view of the optical chip and optical fiber array assembly structure provided in an embodiment of the present disclosure;

[0034] Figure 4 A schematic diagram of the structure of the optical chip and optical fiber array after assembly according to an embodiment of the present disclosure;

[0035] Figure 5 A schematic cross-sectional view of an optical fiber provided in an embodiment of the present disclosure after being placed in a V-shaped groove;

[0036] Figure 6 A schematic diagram of the dimensions of the optical fiber and the V-groove provided in an embodiment of the present disclosure;

[0037] Figure 7 Flowchart of the optical chip and optical fiber array assembly method provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0038] The present disclosure provides a laser transceiver system, assembly method, and optical radar. Preferred embodiments of the present disclosure are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are intended only to illustrate and explain the present disclosure and are not intended to limit the present disclosure. Furthermore, the embodiments and features within the embodiments may be combined with one another unless there is a conflict.

[0039] The present disclosure provides a laser transceiver system. Figure 1 、 Figure 2a and Figure 2b As shown, it includes: an optical chip 10, an optical fiber array 20 and a laser light source; the optical chip 10 is used to receive the light beam generated by the laser light source transmitted by the optical fiber array 20 through the input coupling end;

[0040] The input coupling end is stepped; grooves 102 corresponding to the number of light beams are provided on the surface of the lower step 101, for accommodating the optical fibers 201 transmitting light beams in the optical fiber array 20; spot mode converters are provided on the end surface of the upper step 103 connecting to the lower step 101 and corresponding to the grooves; and a waveguide 104 extends from the spot mode converter along the length of the corresponding groove toward the upper step 103. After the optical fiber 201 is placed in the corresponding groove 102, the end of the optical fiber 201 couples with the spot mode converter (not shown) corresponding to the groove 102, transmitting the light beam in the optical fiber 201 to the corresponding waveguide 104.

[0041] The optical fibers 201 in the optical fiber array 20 are arranged on a base 202 and covered by a cover plate 203; the arrangement of the optical fibers 201 on the base 202 corresponds to the arrangement of the grooves 102; the side of the optical fiber 201 that is connected to the optical chip 10 extends a first length beyond the base 202 so that pressure is applied to the optical fiber 201 by the cover plate 203 on the extended optical fiber 201, and the extended optical fiber 201 is pressed into the corresponding groove 102.

[0042] In the embodiment of the present disclosure, the optical chip 10 can be a chip that can be developed and integrated into optical devices based on substrate materials and using certain processes, such as silicon photonic circuits, planar waveguide circuits (PLCs), etc. The system provided by the embodiment of the present disclosure can be applied to the assembly process of an optical system to achieve precise coupling between optical fibers and waveguides in optical chips. As can be seen from the foregoing, existing active coupling solutions have high requirements for coupling equipment and multiple and complex processes, while existing passive coupling solutions have difficulty in achieving precise coupling between optical fibers and spot converters due to the lack of power or current detection.

[0043] The passive coupling solution provided in the embodiment of the present disclosure improves the structures of the optical chip 10 and the optical fiber array 20 in order to solve the problems existing in the existing active coupling solution and the passive coupling solution. Figure 1 As shown, in the embodiment of the present disclosure, the input coupling end of the optical chip 10 is designed to be stepped. At least one groove 102 corresponding to the number of light beams is provided on the surface of the lower step 101, which is used to place the optical fiber 201 that transmits the light beam in the optical fiber array 20. In this way, the end of the optical fiber 201 placed in the groove 102 is opposite to the end face where the upper step 103 and the lower step 101 are connected, and the spot converter can be placed on this end face. Since the size of a certain type of optical fiber is uniform and fixed, the size of the groove (position, etching depth, etc.) can be designed according to the size of the optical fiber, so that after the optical fiber 201 is placed in the corresponding groove 102, the horizontal position of the optical fiber 201 can be accurately defined. Figures 2a-2bAs shown, in the design of the optical fiber array 20, the optical fiber 201 is extended from the base 202, and a cover plate is provided for the extended optical fiber 201 (as shown in the figure, the cover plate portion 2031 covering the extended optical fiber 201), so that in the process of pressing the optical fiber 201 into the corresponding groove 102, the height position of the optical fiber 201 can be accurately defined by applying pressure through the cover plate 2031. In this way, after the horizontal position and height position of the optical fiber 201 can be determined, the position of the spot converter can also be determined. Then, during the assembly process, as long as the size of the groove 102 and the pressure of the cover plate 203 are ensured according to the preset values, the optical fiber 201 can be placed in the corresponding groove 102 and accurately coupled with the corresponding waveguide 104 of the spot converter, thereby solving the problems existing in the prior art.

[0044] In addition, the arrangement of the optical fibers 201 on the base 202 corresponds to the arrangement of the grooves 102, including the number of optical fibers 201 corresponding to the number of grooves 102. For multiple optical fibers 201, the arrangement intervals of the optical fibers 201 correspond to the arrangement intervals of the grooves 102, and the positions of the optical fibers 201 in the optical fiber array 20 correspond to the etching positions of the grooves 102 in the optical chip 10, to ensure that each optical fiber 201 can be accurately placed in the corresponding groove 102. Figure 1 、 Figure 2a-2b In the example above, the number of optical fibers 201 is greater than 1. In practice, the number of optical fibers 201 may also be 1, which corresponds to one groove 102. This is not a limitation.

[0045] Furthermore, the height of the upper step can be different from the height of the lower step, which can be determined according to chip design and process during implementation.

[0046] In another embodiment provided by the present disclosure, the side of the optical fiber 201 that interfaces with the optical chip 10 extends beyond the cover plate by a second length; the first length is greater than the second length;

[0047] The second length satisfies the requirement that when the assembly device presses the optical fiber 201 into the corresponding groove 102 , the distance between the end of the optical fiber 201 and the corresponding spot mode converter is controlled by the optical fiber 201 of the second length.

[0048] In the embodiment of the present disclosure, Figure 2a-2bAfter the optical fiber 201 is placed in the corresponding groove 102, the end of the optical fiber 201 faces the corresponding spot mode converter. Some waveguides 104 connected to the spot mode converter need to maintain a certain distance from the end of the optical fiber 201. If the cover plate 203 completely covers the end of the optical fiber 201, it is not easy to observe the distance between the end of the optical fiber 201 and the corresponding waveguide 104 during the process of placing the optical fiber 201 in the corresponding groove 102. Therefore, in the embodiment of the present disclosure, the distance between the end of the optical fiber 201 and the corresponding waveguide 104 can be monitored from a top-down perspective through image recognition and other technical means during the process of placing the optical fiber 201 in the corresponding groove 102, thereby accurately positioning the front and rear positions of the optical fiber 201.

[0049] The second length can be determined based on the technical means used to position the optical fiber 201 in the front and rear directions, and is not limited here. However, to facilitate pressure application to the optical fiber 201 (the cover 203 covers most of the optical fiber extending from the base 202, making pressure application easier) and to protect the optical fiber 201, the second length is generally no greater than the first length.

[0050] In another embodiment provided by the present disclosure, the optical fiber array 20 is further provided with a pressure sensor;

[0051] The pressure sensor is used to detect the pressure exerted by the cover plate 203 on the optical fiber 201 during the process of the assembly device pressing the optical fiber 201 into the corresponding groove, so that the optical fiber 201 is pressed into the corresponding groove 102 according to the preset pressure.

[0052] In the disclosed embodiment, as described above, the horizontal position of the optical fiber 201 can be limited by the position of the groove 102. However, the width of the waveguide 104 is on the order of microns. If no pressure is applied during the placement of the optical fiber 201 into the groove 102, the height of the optical fiber 201 will be difficult to accurately align with the micron-sized waveguide, resulting in height inaccuracy and low coupling accuracy. However, the height position of the optical fiber 201 can be limited by applying pressure to the optical fiber 201. During implementation, the corresponding relationship between the pressure applied to the optical fiber 201 and the height of the optical fiber 201 can be determined through multiple tests. The pressure value that ensures accurate coupling between the optical fiber 201 and the corresponding waveguide 104 can be used as the pressure value for positioning the height of the optical fiber 201 during subsequent installation.

[0053] During implementation, the pressure sensor may be disposed at a position where it can measure the pressure exerted by the cover plate 203 on the optical fiber 201 , which is not limited here.

[0054] In another embodiment provided by the present disclosure, the height of the base 202 and the height of the lower step 101 satisfy: after the optical fiber 201 is pressed into the corresponding groove 102, the optical fiber 201 can maintain the straight and unbent state before being pressed into the corresponding groove 102.

[0055] In the disclosed embodiment, the optical chip 10 and the optical fiber array 20 need to be assembled, so the height of the base 202 of the optical fiber array 20 needs to match the height of the lower step 101 of the optical chip 10. After the optical fiber 201 is placed in the corresponding groove 102, the optical fiber 201 will be fixed in the corresponding groove 102. If the height of the base 202 is higher or lower than the height position of the optical fiber 201 at this time, the optical fiber 201 will no longer be straight or even bend, affecting the light transmission efficiency. Therefore, the height of the base 202 and the height of the lower step 101 need to ensure that after the optical fiber 201 is pressed into the corresponding groove 102, the optical fiber 201 can maintain the straight and unbent state before being pressed into the corresponding groove 102, that is, the height of the two is matched.

[0056] In another embodiment provided by the present disclosure, Figure 3 As shown, the cover plate 203 and the base 202 as well as the optical fiber 201 therebetween are fixed by adhesive;

[0057] The base 202 is fixed to the corresponding position after the optical fiber 201 is placed in the corresponding groove 102 by adhesive, and the adhesive of the base 202 is applied before the optical fiber 201 is placed in the corresponding groove 102;

[0058] After the optical fiber 201 is placed in the corresponding groove 102 , the optical fiber cover plate 203 above the groove 102 and the lower step where the groove 102 is located are assembled and fixed by adhesive.

[0059] In the embodiment of the present disclosure, Figure 3 As shown, the optical fiber 201, base 202 and cover 203 of the optical fiber array 20 can be assembled into a whole, and the three are bonded and fixed by adhesive. The present disclosure does not fix the adhesive application position, and can be, for example, Figure 3 The position 301 indicated in the figure (this is not a position point, but refers to an area around 301).

[0060] Furthermore, during implementation, the position of the optical chip 10 can be fixed first, so that the position of the groove 102 is fixed, and then the optical fiber 201 is placed in the corresponding groove 102 with a fixed position, and the position of the optical fiber array is fixed. Before placing the optical fiber 201 in the corresponding groove 102, the bottom end of the base 202 (such as Figure 3After the optical fibers 201 are placed in the corresponding grooves 102 and adjusted, the base 202 can be fixed. Since the adhesive has been pre-applied, the freshly applied adhesive will not affect the adjustment of the base 202 position. After the position is adjusted, the base 202 can be fixed in the adjusted position after the adhesive dries, improving assembly efficiency. Compared to related art methods that apply adhesive to fix the position after adjusting the optical fiber array 20, the adhesive application process may cause the adjusted position to change, requiring further adjustment, resulting in lower assembly efficiency.

[0061] In addition, after the optical fiber 201 is placed in the corresponding groove 102, the space between the optical fiber cover plate 203 above the groove 102 and the lower step where the groove 102 is located (such as Figure 3 The optical chip 10 and the optical fiber array 20 are assembled and fixed by adhesive. Figure 4 shown.

[0062] In addition, the adhesives applied at different positions of the optical chip 10 and the optical fiber array 20 can be the same adhesive or different adhesives, which can be selected according to actual needs and are not limited here.

[0063] In another embodiment provided by the present disclosure, Figure 3 As shown, the first length is greater than the length of the groove 102 .

[0064] In the embodiment of the present disclosure, the length of the optical fiber 201 extending from the base 202 (i.e., the first length) should be greater than the length of the groove 102. In this way, after the optical fiber 201 is placed in the corresponding groove 102, a gap 304 can be formed between the lower step 101 of the optical chip 102 and the base 202 to prevent the adhesive pre-applied at position 302 from seeping into position 303 and affecting the positioning of the optical fiber 201.

[0065] In another embodiment provided by the present disclosure, Figure 5 As shown, the groove 102 is V-shaped; the optical chip 10 is a silicon photonic chip.

[0066] In the embodiment of the present disclosure, the cross section of the optical fiber 201 is generally circular. When the circular optical fiber 201 is placed in the V-shaped groove, the optical fiber 201 can have two cut surfaces that are tangent to two sides of the V-shaped groove. The cover plate 203 also makes the third cut surface of the optical fiber 201 tangent to the cover plate 203. Figure 5 As shown, the optical fiber 201 can stably fix itself at a preset position through three cut surfaces.

[0067] In another embodiment provided by the present disclosure, Figure 6 As shown, the size of the groove 102 and the radius of the optical fiber 201 satisfy the following formula:

[0068]

[0069] Wherein, a represents half of the width of the V-groove opening; b represents the depth of the V-groove; and r represents the radius of the optical fiber.

[0070] In one embodiment, Figure 6 As shown, the center of optical fiber 201 is o, i.e., the center of the cross section of optical fiber 201. The etched dimensions of groove 102 can be determined based on the numerical relationship in the above formula, so that groove 102 defines the horizontal position of optical fiber 201. In practice, the dimensions of optical fiber 201 and the V-groove can also satisfy other numerical relationships based on actual needs, and this is not a limitation herein.

[0071] In another embodiment provided by the present disclosure, Figure 1 As shown, the optical chip 10 further includes a transmitting end 105; the transmitting end 105 is arranged at the opposite end of the input coupling end;

[0072] The optical chip 10 is used to process the light beam received by the input coupling end and transmit it to the transmitting end 105 through the waveguide 104; and / or process the reflected light beam received by the transmitting end 105, transmit it to the input coupling end through the waveguide 104, and further transmit it to the corresponding optical fiber 201.

[0073] In the disclosed embodiment, the optical chip 10 receives a light beam provided by a laser light source through an input coupling end and couples the light beam to the corresponding waveguide 104 through a spot converter. The waveguide within the optical chip 10 can be split by a beam splitter, and the light beam is emitted through the waveguide 104 on the side of the transmitting end 105. In some application scenarios, the reflected light obtained by the emitted light beam reflecting off an object can be received by the waveguide 104 on the side of the transmitting end 105, and a portion of the reflected light is transmitted to the waveguide 104 on the input coupling end, and then further transmitted to the corresponding optical fiber 201.

[0074] In yet another embodiment provided by the present disclosure, the system further comprises: a beam splitter;

[0075] The beam splitter is used to split the light emitted by the laser light source into multiple beams, and respectively connect them to the multiple optical fibers 201 for transmission.

[0076] In the embodiment of the present disclosure, for the case of multiple optical fibers 201, the light beam provided by the laser light source can be split by a beam splitter to obtain multiple light beams, which are then connected to the corresponding optical fibers 201 through connectors, thereby transmitting the multiple light beams separately through the multiple optical fibers 201.

[0077] The present disclosure provides an assembly method based on any of the above laser transceiver system embodiments, such as Figure 7Shown, including:

[0078] S701, applying adhesive to the bottom of the base of the optical fiber array so as to fix the position of the optical fiber array after the position of the optical fiber array is determined;

[0079] S702, aligning the optical fibers in the optical fiber array and placing them into corresponding grooves based on the safe distance between the waveguide at the input coupling end of the optical chip and the optical fiber, and the position of the groove at the input coupling end of the optical chip;

[0080] S703: If the position of the optical fiber determined by inserting the optical fiber extending out of the cover plate into the corresponding groove does not meet the above safety distance, adjust the position of the optical fiber array;

[0081] S704: applying a preset pressure to the optical fiber array, and monitoring the applied pressure through a pressure sensor provided in the optical fiber array, so that the optical fibers are pressed into the corresponding grooves according to the preset pressure;

[0082] S705 , injecting adhesive between the cover plate of the optical fiber above the groove and the lower step where the groove is located, to assemble and fix the optical chip and the optical fiber array.

[0083] In the embodiments of the present disclosure, the implementation entity may be an assembly device. Through the assembly method provided by the embodiments of the present disclosure based on any of the aforementioned laser transceiver system embodiments, an optical chip and fiber array can be assembled, ensuring precise coupling between the optical fiber and the waveguide. Even with passive coupling, precise active coupling can be achieved with simple assembly equipment, simplifying the steps and improving production efficiency.

[0084] An embodiment of the present disclosure provides a laser radar, comprising: a laser transceiver system assembled using the above-mentioned laser transceiver system assembly method.

[0085] Through the description of the above embodiments, those skilled in the art can clearly understand that the embodiments of the present disclosure can be implemented through hardware or by means of software plus a necessary general hardware platform. Based on this understanding, the technical solutions of the embodiments of the present disclosure can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a USB flash drive, a mobile hard disk, etc.), including a number of instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in the various embodiments of the present disclosure.

[0086] Those skilled in the art will understand that the accompanying drawings are merely schematic diagrams of a preferred embodiment, and the modules or processes in the accompanying drawings are not necessarily required for implementing the present disclosure.

[0087] Those skilled in the art will appreciate that the modules in the devices of the embodiments may be distributed in the devices of the embodiments as described in the embodiments, or may be located in one or more devices different from the embodiments with corresponding changes. The modules of the above embodiments may be combined into one module or further split into multiple submodules.

[0088] The serial numbers of the above-mentioned embodiments of the present disclosure are for description only and do not represent the advantages or disadvantages of the embodiments.

[0089] Obviously, those skilled in the art may make various changes and modifications to the present disclosure without departing from the spirit and scope of the present disclosure. Thus, if these modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include these modifications and variations.

Claims

1. A laser transceiver system, characterized in that: include: An optical chip, an optical fiber array, and a laser light source; the optical chip is used to receive the light beam generated by the laser light source transmitted by the optical fiber array through an input coupling end; The input coupling end is in a stepped shape; grooves corresponding to the number of the light beams are provided on the surface of the lower step, for correspondingly placing the optical fibers in the optical fiber array that transmit the light beams; spot mode converters are provided on the end surface of the upper step connecting the lower step and corresponding to the grooves; a waveguide is provided extending from the spot mode converter along the length direction of the corresponding groove toward the upper step, so that after the optical fiber is placed in the corresponding groove, the cross section of the optical fiber is coupled with the spot mode converter corresponding to the groove, thereby transmitting the light beam in the optical fiber to the corresponding waveguide; The optical fibers in the optical fiber array are arranged on a base, and the optical fibers are covered and pressed by a cover plate; The arrangement of the optical fibers on the base corresponds to the arrangement of the grooves; the side of the optical fiber that is docked with the optical chip extends beyond the first length of the base so that pressure is applied to the optical fiber through the cover plate on the extended optical fiber, pressing the extended optical fiber into the corresponding groove.

2. The system according to claim 1, wherein The side of the optical fiber connected to the optical chip extends beyond the cover plate by a second length; the first length is greater than the second length; The second length satisfies the requirement that, when the assembly device presses the optical fiber into the corresponding groove, the distance between the optical fiber end and the corresponding spot mode converter is controlled by the optical fiber of the second length.

3. The system according to claim 1, wherein: The optical fiber array is also provided with a pressure sensor; The pressure sensor is used to detect the pressure applied by the cover plate to the optical fiber during the process of the assembly equipment pressing the optical fiber into the corresponding groove, so that the optical fiber is pressed into the corresponding groove according to the preset pressure.

4. The system according to claim 1, wherein: The height of the base and the height of the lower step satisfy the following requirement: after the optical fiber is pressed into the corresponding groove, the optical fiber can maintain a straight and unbent state before being pressed into the corresponding groove.

5. The system according to claim 1, wherein: The cover plate, the base and the optical fiber therebetween are fixed by adhesive; The base is assembled and fixed to the corresponding position after the optical fiber is placed in the corresponding groove by adhesive, and the adhesive of the base is applied before the optical fiber is placed in the corresponding groove; After the optical fiber is placed in the corresponding groove, the optical fiber cover plate above the groove and the lower step where the groove is located are assembled and fixed by adhesive.

6. The system according to claim 1, wherein: The first length is greater than a length of the groove.

7. The system according to claim 1, wherein: The groove is V-shaped; the optical chip is a silicon photonic chip.

8. The system according to claim 7, wherein: The size of the groove and the radius of the optical fiber satisfy the following formula: Wherein, a represents half of the width of the V-groove opening; b represents the depth of the V-groove; and r represents the radius of the optical fiber.

9. The system according to claim 1, wherein: The optical chip further includes a transmitting end; the transmitting end is arranged at the opposite end of the input coupling end; The optical chip is used to process the light beam received by the input coupling end, transmit it to the transmitting end through a waveguide, and / or process the reflected light beam received by the transmitting end, transmit it to the input coupling end through a waveguide, and further transmit it to the corresponding optical fiber.

10. The system according to claim 1, wherein: Also includes: beam splitters; The beam splitter is used to split the light emitted by the laser light source into multiple light beams, and respectively connect them to multiple optical fibers for transmission.

11. A method for assembling the laser transceiver system according to any one of claims 1 to 10, characterized in that: Includes: Applying adhesive to the bottom of the base of the optical fiber array so as to fix the position of the optical fiber array after the position of the optical fiber array is determined; According to the safe distance between the waveguide at the input coupling end of the optical chip and the optical fiber, and the position of the groove at the input coupling end of the optical chip, the optical fibers in the optical fiber array are aligned and placed into the corresponding grooves; When it is determined by the optical fiber placed in the corresponding groove and extending out of the cover plate that the position of the optical fiber does not meet the safety distance, adjusting the position of the optical fiber array; Applying a preset pressure to the optical fiber array, and monitoring the applied pressure through a pressure sensor provided on the optical fiber array, so that the optical fibers are pressed into the corresponding grooves according to the preset pressure; Adhesive is applied between the cover plate of the optical fiber above the groove and the lower step where the groove is located to assemble and fix the optical chip and the optical fiber array.

12. A laser radar, characterized in that: include: A laser transceiver system assembled using the laser transceiver system assembly method described in claim 11.

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