LED packaging structure and display screen

Abstract

The invention relates to the field of chip packaging, in particular to an LED packaging structure and a display screen. The LED packaging structure comprises a bonding pad assembly, a chip assembly and a packaging layer. The chip assembly comprises a plurality of light-emitting chips, and the bonding pad assembly is connected with electrodes of the light-emitting chips; the packaging layer wraps the bonding pad assembly and the plurality of light-emitting chips and fills gaps between the bonding pad assembly and the plurality of light-emitting chips, and the packaging layer exposes light-emitting surfaces of the plurality of light-emitting chips and pin surfaces of the bonding pad assembly; the bonding pad assembly comprises a common bonding pad which is simultaneously connected with the first electrodes of the plurality of light-emitting chips and a plurality of independent bonding pads which are respectively connected with the second electrodes of the light-emitting chips; under the view angle of the light emitting surface facing the chip assembly, the area ratio of the bonding pad assembly to the packaging layer is 70%-95%. The light-emitting chips are directly connected with the bonding pad assembly, so that the cost is reduced, and the heat dissipation effect can be improved through the bonding pad assembly. The packaging layer supports and fixes the light-emitting chip and the bonding pad assembly and provides a protection function.

Description

Technical Field

[0001] The present application relates to the field of chip packaging, and in particular to an LED packaging structure and a display screen. Background Art

[0002] LED packaging refers to the packaging of RGB light-emitting chips, the purpose of which is to provide adequate protection for the RGB light-emitting chips.

[0003] Currently, LED packaging structures typically involve mounting various light-emitting chips onto a ceramic substrate, and then adding lenses to the surface of the chips. This existing structure suffers from issues such as bulkiness, thickness, and high production costs. Summary of the Invention

[0004] The purpose of this application is to provide an LED packaging structure and a display screen, which are used to solve the problems of large volume, thick thickness and high production cost of existing LED packaging structures.

[0005] The present application provides an LED packaging structure, comprising a pad assembly, a chip assembly, and a packaging layer; The chip assembly includes a plurality of light-emitting chips arranged at intervals, and the pad assembly is connected to electrodes of the plurality of light-emitting chips; the encapsulation layer wraps the pad assembly and the plurality of light-emitting chips, and fills the gaps between the pad assembly and the plurality of light-emitting chips, and the encapsulation layer exposes the light-emitting surfaces of the plurality of light-emitting chips and the pin surfaces of the pad assembly; The pad assembly includes a common pad connected to the first electrodes of the plurality of light-emitting chips at the same time, and a plurality of individual pads connected to the second electrodes of the respective light-emitting chips; From a perspective facing the light-emitting surface of the chip component, the ratio of the area of the pad component to the area of the packaging layer is 70% to 95%.

[0006] In the above technical solution, further, the plurality of light-emitting chips include a first chip, a second chip and a third chip of different colors, the light-emitting color of the first chip is red, the light-emitting color of the second chip is green, and the light-emitting color of the third chip is blue.

[0007] In the above technical solution, further, the shared pad and the plurality of individual pads are arranged at intervals; From a perspective facing the light-emitting surface of the chip component, an outer contour of the pad component consisting of the common pad and the plurality of individual pads matches an outer contour of the packaging layer.

[0008] In the above technical solution, further, a light mixing layer is included; on the side where the light emitting surface is located, the light mixing layer covers the light emitting surfaces of the plurality of light emitting chips and the surface of the packaging layer.

[0009] In the above technical solution, further comprising an anti-color cross-talk layer; The anti-cross-color layer is located between the encapsulation layer and the light mixing layer; the anti-cross-color layer is arranged around the circumference of the light-emitting chip, and is flush with the light-emitting surface of the light-emitting chip and exposes the light-emitting surface.

[0010] In the above technical solution, further, the plurality of light-emitting chips further includes a fourth chip; The light-emitting surface of the fourth chip is covered with a fluorescent layer to convert the light emitted by the fourth chip into white light; the packaging layer wraps the fluorescent layer, and the packaging layer exposes the fluorescent surface on the top of the fluorescent layer.

[0011] In the above technical solution, further comprising a transparent layer; The light-emitting surfaces of the first chip, the second chip, and the third chip are covered with a transparent layer; the encapsulation layer wraps the transparent layer, and the encapsulation layer exposes the light-transmitting surface on the top of the transparent layer.

[0012] In the above technical solution, further, the first chip, the second chip, the third chip and the fourth chip are arranged in a rectangular array.

[0013] In the above technical solution, further, the flow conduction area of the common pad is larger than the flow conduction area of any of the individual pads; the common pad and the plurality of individual pads are arranged to form a rectangular outer contour; The width of the gap between any two adjacent light-emitting chips is between 50 μm and 2000 μm.

[0014] The present application also provides a display screen, comprising the LED packaging structure described in the above solution.

[0015] Compared with the prior art, the present invention has the following advantages: The LED packaging structure provided in this application directly connects the red, green, and blue light-emitting chips to a solder pad assembly, replacing the expensive ceramic substrate with the solder pad assembly to reduce costs. The solder pad assembly's large flow-conducting area improves the chip placement yield, and even when the combined heat generation of multiple light-emitting chips is high, the heat dissipation effect is excellent. Furthermore, the encapsulation layer supports and secures the light-emitting chips and the solder pad assembly, providing physical protection and insulation.

[0016] The present application also provides a display screen, including the LED packaging structure described in the above solution. Based on the above analysis, it can be seen that the display screen also has the above beneficial effects, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 This is a schematic diagram of the first structure of the LED packaging structure provided by this application; Figure 2 This is a second structural schematic diagram of the LED packaging structure provided by this application; Figure 3 This is a third structural schematic diagram of the LED packaging structure provided by this application; Figure 4 This is a fourth structural diagram of the LED packaging structure provided by this application; Figure 5 This is a fifth structural diagram of the LED packaging structure provided by this application; Figure 6 This is a sixth structural diagram of the LED packaging structure provided by this application; Figure 7 This is the seventh structural schematic diagram of the LED packaging structure provided in this application.

[0019] In the figure: 101-pad assembly; 102-packaging layer; 103-light-emitting chip; 104-first chip; 105-second chip; 106-third chip; 107-light-emitting part; 108-connecting part; 109-reflective bowl; 110-first electrode; 111-second electrode; 112-common pad; 113-independent pad; 114-light mixing layer; 115-anti-cross-color layer; 116-fourth chip; 117-fluorescent layer; 118-transparent layer. DETAILED DESCRIPTION

[0020] The following will clearly and completely describe the technical solution of this application in conjunction with the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0021] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0023] Example 1 See also Figures 1 to 2 As shown, the LED packaging structure provided by the present application includes a pad component 101, a chip component and a packaging layer 102.

[0024] The chip assembly includes multiple light-emitting chips 103. To reduce the overall thickness of the device, this application eliminates the ceramic substrate structure and directly connects the multiple light-emitting chips 103 to the pad assembly 101. The pad assembly 101 replaces the high-cost ceramic substrate, thereby reducing costs. When the LED package structure is placed horizontally, the horizontal projection area of the pad assembly 101 accounts for 60% to 98% of the horizontal projection area of the entire LED package structure. The outer contour of the pad assembly is similar to that of the package structure, providing better support for the chip assembly. The large diversion area of the pad assembly 101 can improve the chip placement yield of the light-emitting chips 103. Even if the overall heat generation of the multiple light-emitting chips 103 is relatively high, the heat dissipation effect is still good.

[0025] The pad assembly includes a common pad 112 and a plurality of individual pads 113. Each chip includes a first electrode 110 of a first polarity and a second electrode 111 of an opposite polarity. The first electrodes of the plurality of chips are electrically connected to the upper surface of the common pad 112, and the upper surface of the plurality of individual pads 113 is electrically connected to the second electrode of each chip. The gap width between any two adjacent light-emitting chips is between 50um and 2000um. Preferably, the gap width between any two adjacent light-emitting chips is between 51um and 800um, such as 55um, 60um, 100um, 150um, 200um, 300um, 400um, 500um, 600um, and 700um. Smaller spacing will result in a reduction in the pad assemblies, making it easier for interconnection to occur during die bonding. However, excessive chip spacing will result in uneven color mixing.

[0026] The multiple light-emitting chips 103 can be light-emitting chips of different colors, for example, including a first chip 104, a second chip 105 and a third chip 106, the light-emitting color of the first chip 104 is red, the light-emitting color of the second chip 105 is green, and the light-emitting color of the third chip 106 is blue. Red, green and blue are the three primary colors in optics. By adjusting the luminous intensity of each chip, a variety of colors can be mixed to achieve a full-color display function. Integrating the three light-emitting chips 103 that generate red, green and blue light in the same packaging structure can reduce the optical path deviation between light sources of different colors and improve the uniformity and consistency of light emission; and the integrated design can also reduce the optical path deviation between light sources of different colors and improve the uniformity and consistency of light emission. Compared with the traditional discrete light source design, this integrated chip component can significantly reduce the overall volume and meet the needs of miniaturization and lightweighting.

[0027] The encapsulation layer 102 encapsulates the pad assembly 101 and the plurality of light-emitting chips 103 and fills the gaps between the pad assembly 101 and the plurality of light-emitting chips 103. The encapsulation layer 102 exposes the lower surface of the pad assembly 101, which serves as the pin surface for connection to an external power source, so that the provision of the encapsulation layer 102 does not affect the light emission of the chip assembly or the electrical connection between the pad assembly 101 and external components. On the one hand, the encapsulation layer 102 provides physical protection and insulation for the pad assembly 101 and the plurality of light-emitting chips 103, preventing damage to the chips and pad assembly 101 from the external environment (such as moisture, dust, mechanical stress, etc.), thereby extending the service life of the LED. On the other hand, the encapsulation layer 102 fills all gaps and supports and secures the pad assembly 101 and the plurality of light-emitting chips 103, enhancing the mechanical stability of the entire packaging structure, reducing the risk of internal connection failure due to vibration or impact, and improving the reliability and durability of the product.

[0028] Preferably, the encapsulation layer 102 can cover the light-emitting surfaces of the multiple light-emitting chips or expose the light-emitting surfaces of the light-emitting chips, which is determined by the material of the encapsulation layer and the desired light profile of the final LED package. For example, the encapsulation layer 102 can be transparent silicone or silicone doped with a reflective material. When the encapsulation layer 102 is a high-reflectivity white plastic layer, the encapsulation layer needs to completely expose the light-emitting surfaces of the multiple light-emitting chips. In this case, the light emitted from the sides of the multiple light-emitting chips 103 is reflected by the encapsulation layer 102 and can be emitted from the top, thereby improving the overall brightness of the LED package structure.

[0029] like Figure 7 As shown, the light-emitting chip 103 includes a light-emitting portion 107 and a connecting portion 108; the connecting portion 108 includes a first electrode 110 and a second electrode 111 with opposite polarities, and the first electrode 110 and the second electrode 111 are specifically copper electrodes. The first electrode 110 and the second electrode 111 are connected to the light-emitting portion 107, and the first electrode 110 and the second electrode 111 are connected to the pad assembly 101. In order to improve the conductive effect of the connection, the first electrode 110 and the second electrode 111 are provided with a Ti layer, a Ni layer or other metal layer.

[0030] In a possible embodiment, the light-emitting chip 103 further includes a reflective cup 109, which is specifically made of transparent silicone and is arranged around the light-emitting portion 107. The light emitted from the side of the light-emitting portion 107 is reflected by the reflective cup 109 and can be emitted from the top of the light-emitting chip 103, thereby improving the brightness of the light-emitting chip 103.

[0031] In the optional solution of this embodiment, Figure 1 and Figure 5 As shown, the pad assembly 101 includes a common pad 112 and multiple individual pads 113, which are spaced apart. The first electrodes 110 of the multiple light-emitting chips 103 have the same polarity and are all connected to the common pad 112. The second electrodes 111 of the multiple light-emitting chips 103 have the same polarity and are each connected to a corresponding individual pad 113. Optionally, the common pad 112 has a larger flow conduction area than any individual pad 113. The common pad 112 and the multiple individual pads 113 are arranged to form a rectangular outer contour.

[0032] In this embodiment, specifically, the shared pad 112 is the positive electrode, and the multiple individual pads 113 are the negative electrode; or the shared pad 112 is the negative electrode, and the multiple individual pads 113 are the positive electrode. The first electrodes 110 of the multiple light-emitting chips 103 are connected to the same shared pad 112. The current passing through the shared pad 112 is the largest, so the shared pad 112 has the largest conduction area. The individual pads 113 are respectively connected to their corresponding light-emitting chips 103, so the conduction area of the individual pads 113 is relatively small. The shared pad 112 and the multiple individual pads 113 are arranged to form a rectangular outer contour, so that the structure of the pad assembly 101 is regular.

[0033] The provision of shared solder pads 112 reduces the number of required pads, thereby reducing circuit complexity. The second electrode 111 of each light-emitting chip 103 is connected to an independent, dedicated solder pad 113, enabling individual control of the brightness and operating state of each light-emitting chip 103, achieving more refined dimming and color control. Furthermore, the design of shared solder pads 112 reduces the space occupied by solder pad assembly 101, helping to improve the overall device integration and reduce the size of the LED package, making it suitable for space-sensitive applications.

[0034] Specifically, the shared pad 112 and the individual pad 113 both include a two-layer structure of a primary enlarged pad and a secondary enlarged pad. The primary enlarged pad is generally made of copper and is directly connected to the light-emitting chip 103. The area of the primary enlarged pad is relatively large, so that it has a better heat dissipation effect. The secondary enlarged pad is generally made of tin and is connected to the side of the primary enlarged pad away from the light-emitting chip 103. The secondary enlarged pad is located within the coverage range of the primary enlarged pad and has a relatively small area, so that the distance between the secondary enlarged pads of multiple pads is larger. In the subsequent patch process, it is necessary to tin the shared pad 112 and the individual pad 113. The larger distance between the secondary enlarged pads can make the distance between the solder paste farther, avoiding short circuits between the pads.

[0035] In the optional solution of this embodiment, Figures 1 to 4 As shown, three light-emitting chips 103, namely a first chip 104, a second chip 105, and a third chip 106, are spaced apart along a predetermined direction. The predetermined direction is the width direction of the first chip 104, the second chip 105, and the third chip 106, i.e., the vertical direction of the illustrated structure. The arrangement direction of the three light-emitting chips 103 is consistent with the length direction of the LED package structure, so that the light source distribution is more uniform and reasonable.

[0036] Furthermore, if Figure 1As shown, in order to connect to multiple light-emitting chips 103 and achieve a reasonable arrangement of multiple pads, the common pad 112 of the pad assembly 101 is rectangular. The common pad 112 is located in the lower left corner and extends upward so that the first electrodes 110 of the three light-emitting chips 103 can all be connected to the common pad 112. The three independent pads have basically the same conduction area, and the three independent pads are arranged in sequence along the top, middle, and bottom. The two upper independent pads are L-shaped, so that the upper independent pad can use the space above and to the right of the common pad 112, and the second electrode 111 at the right end of the upper first chip 104 can be connected to the independent pad. The middle independent pad can use the space to the right of the common pad 112 and the space to the right of the upper independent pad, so that the second electrode 111 at the right end of the middle second chip 105 can be connected to the independent pad. The lower independent pad is located lower, and the second electrode 111 at the right end of the lower third chip 106 can be connected to the independent pad. The independent pad is set to be rectangular so that its conduction area can be basically consistent with the conduction areas of the other two independent pads.

[0037] In the optional solution of this embodiment, Figure 3 As shown, the LED packaging structure also includes a light-mixing layer 114. The light-mixing layer 114 is a transparent glue doped with SiO2, TiO2, Ag powder, Al powder and other particles, and has a thickness between 5 μm and 100 μm. On the side where the light-emitting surface is located, the light-mixing layer 114 covers the light-emitting surfaces of multiple light-emitting chips 103 and the surface of the packaging layer 102. The light-mixing layer 114 can mix the red, green and blue colors of light together, and by adjusting the brightness ratio of each color, it can produce light of various colors. Through reasonable light-mixing design, the luminous efficiency and color rendering index of the LED can be improved, making it more suitable for various application scenarios, such as lighting and display.

[0038] In the optional solution of this embodiment, Figure 4 As shown, the LED packaging structure also includes an anti-cross-color layer 115; the anti-cross-color layer 115 is located between the top of the packaging layer 102 and the light mixing layer 114; the anti-cross-color layer 115 is arranged around the circumference of the light-emitting chip 103, and is flush with the light-emitting surface of the light-emitting chip 103 and completely exposes the light-emitting surface of each light-emitting chip 103. In the horizontal projection direction, the area of the anti-cross-color layer 115 is less than or equal to the area of the packaging layer 102.

[0039] In this embodiment, the anti-cross-color layer 115 is a dark film layer, specifically a black adhesive layer formed by silica gel doped with carbon powder, with a thickness between 1 μm and 100 μm. The anti-cross-color layer 115 is primarily used to prevent crosstalk between light emitting chips 103 of different colors. The anti-cross-color layer 115 isolates the light emitting chips 103 of different colors, ensuring that each color of light remains independent before reaching the light mixing layer 114. This prevents uneven color mixing, helps improve the color purity of the overall light output, and makes the final mixed light color more accurate and consistent.

[0040] Example 2 The LED packaging structure in the second embodiment is an improvement on the above embodiment. The technical contents disclosed in the above embodiment will not be described repeatedly, and the contents disclosed in the above embodiment also belong to the contents disclosed in the second embodiment.

[0041] See also Figures 5 to 7 As shown, in an optional solution of this embodiment, the multiple light-emitting chips 103 also include a fourth chip 116; the light-emitting surface of the fourth chip 116 is covered with a fluorescent layer 117 to convert the light emitted by the fourth chip 116 into white light; the packaging layer 102 wraps the fluorescent layer 117, and the packaging layer 102 exposes the fluorescent surface on the top of the fluorescent layer 117.

[0042] In this embodiment, on the basis of the light-emitting chips 103 of red, green and blue, the present application further adds a light-emitting chip 103 that generates white light, thereby forming an RGBW four-color pixel. This structure can produce a more realistic and soft white light, and can display colors more accurately. Specifically, the fourth chip 116 is generally a blue light chip, and the fluorescent layer 117 can convert the blue light emitted by the fourth chip 116 into white light. The fluorescent layer 117 is formed by transparent glue doped with phosphor and particles such as SiO2 and TiO2. The light emitted by the fourth chip 116 is converted in wavelength after passing through the fluorescent layer 117, and white light can be emitted.

[0043] In the optional solution of this embodiment, Figure 5 As shown, the LED packaging structure also includes a transparent layer 118; the light-emitting surfaces of the first chip 104, the second chip 105 and the third chip 106 are covered with the transparent layer 118; the packaging layer 102 wraps the transparent layer 118, and the packaging layer 102 reveals the light-transmitting surface on the top of the transparent layer 118.

[0044] In this embodiment, transparent layer 118 is specifically a transparent adhesive doped with SiO2, TiO2 powder, or other particles, and has a thickness between 5 μm and 100 μm. Transparent layer 118 effectively improves light extraction efficiency, allowing more light to be transmitted from light-emitting chip 103 to the outside, thereby improving overall luminous efficacy. Furthermore, transparent layer 118 covers the light-emitting surface of light-emitting chip 103, providing a layer of physical protection against dust, moisture, and other external factors, preventing direct contact with the chip. This reduces the risk of mechanical damage, extends the chip's lifespan, and improves the reliability of the LED.

[0045] In an optional solution of this embodiment, the first chip 104, the second chip 105, the third chip 106 and the fourth chip 116 are arranged in a rectangular array, so that the LED package structure as a whole is rectangular, which can achieve a more efficient and regular arrangement in a limited space, reduce manufacturing costs, and improve the consistency of product quality; and the regular arrangement makes the distribution of light-emitting points of the LED package structure more reasonable, which can ensure that the image output is more uniform and clear.

[0046] like Figure 6 As shown, in order to connect with multiple light-emitting chips 103 and realize the reasonable arrangement of multiple pads, the common pad 112 of the pad assembly 101 is rectangular and located in the middle, two independent pads 113 are arranged on the left side of the common pad 112, and two independent pads 113 are arranged on the right side of the common pad 112, and the diversion areas of the four independent pads are basically the same.

[0047] Example 3 Embodiment 3 of the present application provides a display screen, comprising the LED packaging structure of any of the above embodiments, and thus has all the beneficial technical effects of the LED packaging structure of any of the above embodiments, which will not be repeated here.

[0048] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit them. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application. In addition, those skilled in the art will understand that although some embodiments herein include certain features included in other embodiments but not other features, the combination of features of different embodiments means that they are within the scope of the present application and form different embodiments.

Claims

1. An LED packaging structure, characterized in that: Including pad components, chip components and packaging layers; The chip assembly includes a plurality of light-emitting chips arranged at intervals, and the pad assembly is connected to electrodes of the plurality of light-emitting chips; the encapsulation layer wraps the pad assembly and the plurality of light-emitting chips, and fills the gaps between the pad assembly and the plurality of light-emitting chips, and the encapsulation layer exposes the light-emitting surfaces of the plurality of light-emitting chips and the pin surfaces of the pad assembly; The pad assembly includes a common pad connected to the first electrodes of the plurality of light-emitting chips at the same time, and a plurality of individual pads connected to the second electrodes of the respective light-emitting chips; From a perspective facing the light-emitting surface of the chip component, the ratio of the area of the pad component to the area of the packaging layer is 70% to 95%.

2. The LED packaging structure according to claim 1, wherein: The plurality of light emitting chips include a first chip, a second chip and a third chip of different colors. The light emitting color of the first chip is red, the light emitting color of the second chip is green, and the light emitting color of the third chip is blue.

3. The LED packaging structure according to claim 1, wherein: The shared pad and the plurality of individual pads are spaced apart from each other; From a perspective facing the light-emitting surface of the chip component, the outer contour of the pad assembly consisting of the common pad and the multiple individual pads matches the outer contour of the packaging layer.

4. The LED packaging structure according to claim 3, characterized in that: It also includes a light mixing layer; on the side where the light emitting surface is located, the light mixing layer covers the light emitting surfaces of the plurality of light emitting chips and the surface of the packaging layer.

5. The LED packaging structure according to claim 4, characterized in that: Also includes an anti-color bleed layer; The anti-cross-color layer is located between the encapsulation layer and the light mixing layer; the anti-cross-color layer is arranged around the circumference of the light-emitting chip, and is flush with the light-emitting surface of the light-emitting chip and exposes the light-emitting surface.

6. The LED packaging structure according to claim 2, wherein: The plurality of light-emitting chips further includes a fourth chip; The light-emitting surface of the fourth chip is covered with a fluorescent layer to convert the light emitted by the fourth chip into white light; the packaging layer wraps the fluorescent layer, and the packaging layer exposes the fluorescent surface on the top of the fluorescent layer.

7. The LED packaging structure according to claim 6, characterized in that: Also includes a transparent layer; The light-emitting surfaces of the first chip, the second chip, and the third chip are covered with a transparent layer; the encapsulation layer wraps the transparent layer, and the encapsulation layer exposes the light-transmitting surface on the top of the transparent layer.

8. The LED packaging structure according to claim 6, wherein: The first chip, the second chip, the third chip and the fourth chip are arranged in a rectangular array.

9. The LED packaging structure according to claim 2, wherein: The common pad has a larger flow conduction area than any of the individual pads; the common pad and the individual pads are arranged to form a rectangular outer contour; The width of the gap between any two adjacent light-emitting chips is between 50 μm and 2000 μm.

10. A display screen, characterized in that: The LED packaging structure comprises the LED packaging structure according to any one of claims 1 to 9.

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