Electroplating device and using method thereof

Abstract

According to the electroplating device and the using method thereof, through cooperation of the wafer carrier and the auxiliary device, flexible moving and positioning of the spraying tank are achieved through the telescopic connecting piece, before electroplating, the auxiliary device can wet the surface of a wafer in advance, air in Via and Trench can be effectively removed, it is ensured that electroplating liquid is fully filled, and poor plating and hole generation are avoided; after electroplating, the auxiliary device can quickly clean the residual electroplating liquid on the surface of the wafer and collect the cleaning liquid to prevent the cleaning liquid from being introduced into the electroplating bath to interfere with the concentration of the additive; meanwhile, upwelling electroplating liquid steam can be shielded, and film forming defects caused by contact reaction of the upwelling electroplating liquid steam and the wafer are avoided; in addition, during electroplating, the auxiliary device can rotate to the outer side of the electroplating bath and conduct cleaning liquid discharging operation, normal electroplating steps are not affected, and the stability and efficiency of the electroplating process are improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to an electroplating device and a method of using the same. Background Art

[0002] In the semiconductor manufacturing process, copper electroplating is a process that uses electrolysis to plate a copper interconnect layer on the surface of the wafer. However, the electroplating process has the following important issues that affect the quality of copper electroplating: First, when the wafer is facing down, the openings of the vias and trenches are facing downward, making it difficult for the plating solution to completely fill the vias and trenches during electroplating. Air residue will cause poor plating, resulting in holes or other electroplating defects; second, when the wafer is moved to the carrier, the vapor of the copper sulfate solution will rise and contact the wafer, and the sulfate (SO4 2- ), acid (H + ) and water (H2O) will react with copper to form copper oxide (CuO) or copper sulfide (CuS). The surfaces of these materials cannot be electroplated, resulting in film defects. After the electroplating is completed, the copper sulfate solution remaining on the wafer surface needs to be cleaned with deionized water. However, the introduction of deionized water into the electroplating tank will interfere with the concentration of additives, affect the electroplating process and increase manufacturing costs. These problems will interfere with the normal electroplating process, reduce the quality of the electroplated copper, and increase production costs. Summary of the Invention

[0003] In view of the shortcomings of the prior art described above, the object of the present invention is to provide an electroplating device and a method for using the same, which are used to solve the problems in the prior art that when the via and trench openings face downward during wafer electroplating, air residue causes poor plating, the vapor of the copper sulfate solution rises and reacts with the wafer, thereby causing film formation defects, and when deionized water is used to clean the residual copper sulfate solution on the wafer surface after electroplating, the deionized water will drip into the electroplating tank, interfering with the concentration of additives, affecting the electroplating process and increasing manufacturing costs.

[0004] To achieve the above-mentioned and other related purposes, the present invention provides an electroplating device, which includes: a wafer carrier, an auxiliary device, an electroplating tank, and a telescopic connector;

[0005] The wafer carrier is used to horizontally fix the wafer to be plated, and the wafer carrier can move up and down to drive the wafer to move up and down;

[0006] The auxiliary device includes a spray tank, a liquid inlet pipe buried in the bottom of the spray tank, and a plurality of nozzles connected to the liquid inlet pipe. The nozzles are arranged on the surface of the bottom of the spray tank facing the inner side of the tank body. One end of the liquid inlet pipe is an open end and the other end is a closed end.

[0007] The auxiliary device is connected to the wafer carrier through the telescopic connection. By adjusting the telescopic connection, at least the spray tank of the auxiliary device can be made horizontal with the interior of the tank facing the wafer carrier and placed between the wafer carrier and the electroplating tank, and the auxiliary device can be rotated to the outside of the electroplating tank.

[0008] Optionally, the auxiliary device also includes a liquid outlet pipe buried inside the bottom of the spray tank, the liquid outlet pipe includes a main pipe and several collecting pipes, one end of the collecting pipe is connected to the main pipe, and the other end is flush with the surface of the bottom of the spray tank facing the inner side of the tank body.

[0009] Optionally, the electroplating device further comprises a driving device, and the driving device is used to control the telescopic movement and position adjustment of the telescopic connection member.

[0010] Optionally, when the spray tank of the auxiliary device is horizontal and the interior of the tank faces the wafer carrier and is placed between the wafer carrier and the electroplating tank, the nozzle is located below the wafer, all the nozzles are symmetrically distributed around the center of the wafer, and all the nozzles are facing the wafer surface.

[0011] Optionally, the auxiliary device can be adjusted up and down between the wafer carrier and the electroplating tank by adjusting the telescopic connection.

[0012] The present invention also provides a method for using the electroplating device, the method comprising the following steps:

[0013] Providing an electroplating device as described in any one of the above items;

[0014] Fixing the wafer horizontally and facing downward on the wafer carrier, wherein the front side of the wafer has through holes and / or grooves;

[0015] The wafer is subjected to a wetting step, an electroplating step and / or a cleaning step; wherein,

[0016] The immersion step and the cleaning step include: moving the wafer carrier to place the wafer above the electroplating tank; adjusting the telescopic connection to horizontally position the spray tank of the auxiliary device with the interior of the tank facing the wafer between the wafer carrier and the electroplating tank; introducing the cleaning liquid into the liquid inlet pipe and spraying it onto the surface of the wafer through the nozzle;

[0017] The electroplating step includes: adjusting the telescopic connection to rotate the auxiliary device to the outside of the electroplating tank; moving the wafer carrier to place the wafer in the electroplating tank, and electroplating the wafer with the electroplating solution in the electroplating tank.

[0018] Optionally, the auxiliary device also includes a liquid outlet pipe buried inside the bottom of the spray tank, the liquid outlet pipe includes a main pipe and several collecting pipes, one end of the collecting pipe is connected to the main pipe, and the other end is flush with the surface of the bottom of the spray tank facing the inner side of the tank body; in the immersion step and the cleaning step, the liquid inlet pipe introduces the cleaning liquid, and after it is sprayed to the surface of the wafer through the nozzle, it also includes a step of discharging the cleaning liquid through the liquid outlet pipe.

[0019] Optionally, the cleaning solution includes deionized water.

[0020] Optionally, the electroplating solution is a CuSO4 solution, and the steam of the electroplating solution contains SO4 2- 、H + and H2O.

[0021] Optionally, in the wetting step and the cleaning step, when adjusting the telescopic connection to make the spray tank of the auxiliary device horizontal and the interior of the tank facing the wafer and placed between the wafer carrier and the electroplating tank, the step also includes the step of adjusting the auxiliary device up and down to a preset position between the wafer carrier and the electroplating tank.

[0022] As described above, the electroplating device of the present invention and the method of using the same have the following beneficial effects: through the cooperation between the wafer carrier and the auxiliary device, the flexible movement and positioning of the spray tank can be achieved by utilizing the telescopic connection piece. Before electroplating, the auxiliary device can wet the wafer surface in advance, effectively remove the air in the via and trench, ensure that the plating solution is completely filled, and avoid poor plating and the generation of holes; after electroplating, the auxiliary device can quickly clean the residual plating solution on the wafer surface and collect the cleaning solution to prevent the cleaning solution from being introduced into the electroplating tank to interfere with the concentration of additives; at the same time, it can block the rising plating solution vapor to prevent it from contacting and reacting with the wafer to cause film formation defects; in addition, during electroplating, the auxiliary device can be rotated to the outside of the electroplating tank and perform the cleaning solution discharge operation, which does not affect the normal electroplating steps and improves the stability and efficiency of the electroplating process. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram showing the cross-sectional structure of the electroplating device of the present invention when performing an immersion step or a cleaning step.

[0024] Figure 2 It is a schematic diagram showing the cross-sectional structure of the electroplating device of the present invention when performing the electroplating step.

[0025] Figure 3 Shown is a schematic flow chart of a method for using the electroplating apparatus of the present invention.

[0026] Component number description

[0027] 10 Wafer carrier

[0028] 11 Assistive devices

[0029] 12 electroplating tanks

[0030] 13 Telescopic connector

[0031] 14 wafers

[0032] 15 spray tank

[0033] 16 Liquid inlet pipe

[0034] 17 nozzles

[0035] 18 liquid outlet pipe

[0036] 181 Main Pipeline

[0037] 182 Collection Pipeline

[0038] 19 Drive unit

[0039] 20 Ring structure

[0040] 21 Electroplating solution

[0041] 22 Steam DETAILED DESCRIPTION

[0042] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present invention.

[0043] See also Figures 1 to 3 It should be noted that the diagrams provided in this embodiment are merely schematic illustrations of the basic concept of the present invention. Therefore, the diagrams only show components related to the present invention and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be changed arbitrarily, and the component layout may also be more complex.

[0044] This embodiment provides an electroplating device, such as Figure 1 and Figure 2 As shown, the electroplating device includes: a wafer carrier 10, an auxiliary device 11, an electroplating tank 12 and a telescopic connector 13;

[0045] The wafer carrier 10 is used to horizontally fix the wafer 14 to be plated, and the wafer carrier 10 can move up and down to drive the wafer 14 to move up and down;

[0046] The auxiliary device 11 includes a spray tank 15, a liquid inlet pipe 16 embedded in the bottom of the spray tank 15, and a plurality of nozzles 17 connected to the liquid inlet pipe 16. The nozzles 17 are arranged on the surface of the bottom of the spray tank 15 facing the inner side of the tank body. One end of the liquid inlet pipe 16 is an open end and the other end is a closed end.

[0047] The auxiliary device 11 is connected to the wafer carrier 10 via the telescopic connector 13. By adjusting the telescopic connector 13, the spray tank 15 of the auxiliary device 11 can be at least horizontal with the interior of the tank facing the wafer carrier 10 and placed between the wafer carrier 10 and the electroplating tank 12 (e.g., Figure 1 As shown), and the auxiliary device 11 can be rotated to the outside of the plating tank 12 (as shown Figure 2 shown).

[0048] The electroplating device of this embodiment, through the cooperation of the wafer carrier and the auxiliary device, uses a telescopic connection to achieve flexible movement and positioning of the spray tank. Before electroplating, the auxiliary device can wet the wafer surface in advance, effectively remove the air in the via and trench, ensure that the plating solution is completely filled, and avoid poor plating and the generation of holes; after electroplating, the auxiliary device can quickly clean the residual plating solution on the wafer surface and collect the cleaning solution to prevent the cleaning solution from being introduced into the electroplating tank to interfere with the concentration of additives; at the same time, it can block the rising plating solution vapor to prevent it from contacting and reacting with the wafer to cause film formation defects; in addition, during electroplating, the auxiliary device can be rotated to the outside of the electroplating tank and drain the cleaning solution without affecting the normal electroplating steps, thereby improving the stability and efficiency of the electroplating process.

[0049] As an example, Figure 1 As shown, the auxiliary device 11 also includes a liquid outlet pipe 18 buried inside the bottom of the spray tank 15, and the liquid outlet pipe 18 includes a main pipe 181 and several collecting pipes 182. One end of the collecting pipe 182 is connected to the main pipe 181, and the other end is flush with the surface of the bottom of the spray tank 15 facing the inner side of the tank body. The collecting pipe 182 covers the bottom area of the spray tank 15 to the maximum extent, ensuring that the cleaning liquid is collected quickly and comprehensively, avoiding the cleaning liquid from remaining in the spray tank 15, thereby improving the cleaning liquid collection efficiency.

[0050] As a preferred example, Figure 1 As shown, the electroplating device also includes a driving device 19, which is used to control the telescopic movement and position adjustment of the telescopic connection 13 to improve the automation level and operation accuracy of the electroplating device. By precisely controlling the length and angle of the telescopic connection 13, it can be ensured that the auxiliary device 11 can be accurately positioned to the required position before, during and after electroplating, thereby improving the accuracy and consistency of the electroplating process.

[0051] As a preferred example, the telescopic connector 13 is fixedly connected to the wafer carrier 10 via an annular structure 20. The annular structure 20 can evenly transmit the force of the telescopic connector 13 to the wafer carrier 10, reducing or even preventing local damage to the wafer carrier 10 or the telescopic connector 13 due to uneven force, thereby ensuring the reliability of the electroplating device during the frequent extension and rotation of the auxiliary device 11. In actual applications, the method of fixed connection between the telescopic connector 13 and the wafer carrier 10 can also be customized according to actual needs and is not overly limited here.

[0052] As an example, by adjusting the telescopic connection 13, the auxiliary device 11 can also be adjusted up and down between the wafer carrier 10 and the electroplating tank 12, so that the auxiliary device 11 can accurately adjust the height of the nozzle 17 according to the specific position, wetting and cleaning requirements of the wafer 14, ensuring that the nozzle 17 maintains an optimal distance from the surface of the wafer 14, thereby improving the uniformity and effect of the spraying, and further improving the wetting effect and cleaning effect.

[0053] As a preferred example, Figure 1 As shown, when the spray tank 15 of the auxiliary device 11 is horizontal and the interior of the tank faces the wafer carrier 10 and is placed between the wafer carrier 10 and the electroplating tank 12, the nozzle 17 is located below the wafer 14, and all the nozzles 17 are symmetrically distributed around the center of the wafer 14, and all the nozzles 17 are facing the surface of the wafer 14 to ensure that the sprayed cleaning liquid can evenly and efficiently cover the surface of the wafer 14, thereby further improving the spraying effect, and then improving the wetting effect and the cleaning effect.

[0054] like Figures 1 to 3 As shown, this embodiment also provides a method for using the electroplating device, the method comprising the following steps:

[0055] S1, providing the electroplating device as described above;

[0056] S2, fixing the wafer 14 horizontally and facing downward on the wafer carrier 10, wherein the front side of the wafer 14 has through holes and / or grooves;

[0057] S3, performing a wetting step, an electroplating step and / or a cleaning step on the wafer 14; wherein,

[0058] like Figure 1As shown, the immersion step and the cleaning step include: moving the wafer carrier 10 to place the wafer 14 above the electroplating tank 12; adjusting the telescopic connection 13 to horizontally position the spray tank 15 of the auxiliary device 11 between the wafer carrier 10 and the electroplating tank 12 with the interior of the tank facing the wafer 14; introducing the cleaning liquid through the liquid inlet pipe 16 and spraying it onto the surface of the wafer 14 through the nozzle 17;

[0059] like Figure 2 As shown, the electroplating step includes: adjusting the telescopic connection 13 to rotate the auxiliary device 11 to the outside of the electroplating tank 12; moving the wafer carrier 10 to place the wafer 14 in the electroplating tank 12, and the electroplating solution 21 in the electroplating tank 12 electroplates the wafer 14.

[0060] The method for using the electroplating device of this embodiment is as follows: in the wetting step, the spray tank is placed under the wafer by adjusting the telescopic connection, and the cleaning liquid is sprayed to wet the wafer surface, effectively removing the air in the via and trench, ensuring that the subsequent electroplating liquid is completely filled, and avoiding poor plating and the generation of holes; in the cleaning step, the spray tank collects the cleaning liquid to prevent the cleaning liquid from entering the electroplating tank, reducing interference with the concentration of electroplating liquid additives; at the same time, it can block the rising electroplating liquid vapor to prevent it from contacting and reacting with the wafer to cause film formation defects; in addition, during electroplating, the auxiliary device can be rotated to the outside of the electroplating tank and perform the cleaning liquid discharge operation, which does not affect the normal electroplating steps and improves the stability and efficiency of the electroplating process.

[0061] As an example, Figure 1 As shown, the auxiliary device 11 also includes a liquid outlet pipe 18 embedded within the bottom of the spray tank 15. The liquid outlet pipe 18 includes a main pipe 181 and several collection pipes 182. One end of the collection pipe 182 is connected to the main pipe 181, and the other end is flush with the bottom surface of the spray tank 15 facing the inner side of the tank. During the immersion and cleaning steps, after the cleaning liquid is introduced into the liquid inlet pipe 16 and sprayed onto the surface of the wafer 14 through the nozzle 17, the cleaning liquid is discharged through the liquid outlet pipe 18. This ensures that the cleaning liquid is quickly and comprehensively collected and discharged, further preventing the cleaning liquid from entering the electroplating tank and interfering with the concentration of additives. During the electroplating step, the auxiliary device 11 is located outside the electroplating tank 12, and the telescopic connector 13 is extended on one side to facilitate the discharge of the cleaning liquid from the collection pipe 182.

[0062] As an example, the cleaning liquid includes deionized water, which can effectively wet the surface of the wafer 14 in the immersion step, remove air and optimize the filling of the electroplating solution, and can quickly remove residues in the cleaning step.

[0063] As an example, when the electroplating solution 21 is a CuSO4 solution and the steam 22 of the electroplating solution 21 contains SO4 2- 、H + When the steam 22 is heated to 100 ℃ and H 2 O is added, the spray tank 15 can shield the rising steam 22 to prevent it from contacting the wafer 14 and reacting to cause poor plating.

[0064] As an example, in the wetting step and the cleaning step, when adjusting the telescopic connection part 13 to make the spray tank 15 of the auxiliary device 11 horizontal and the inside of the tank facing the wafer 14 and placed between the wafer carrier 10 and the electroplating tank 12, it also includes the step of adjusting the auxiliary device 11 up and down to a preset position between the wafer carrier 10 and the electroplating tank 12, so that the auxiliary device 11 can accurately adjust the height of the nozzle 17 according to the specific position, wetting and cleaning requirements of the wafer 14, ensuring that the nozzle 17 maintains an optimal distance from the surface of the wafer 14, thereby improving the uniformity and effect of the spray, and then improving the wetting effect and the cleaning effect.

[0065] In summary, the electroplating device and its use method of the present invention, through the cooperation of the wafer carrier and the auxiliary device, utilizes a telescopic connector to achieve flexible movement and positioning of the spray tank. Before electroplating, the auxiliary device can pre-wet the wafer surface, effectively remove the air in the via and trench, ensure that the plating solution is completely filled, and avoid poor plating and the generation of holes; after electroplating, the auxiliary device can quickly clean the residual plating solution on the wafer surface and collect the cleaning solution, preventing the cleaning solution from being introduced into the electroplating tank and interfering with the additive concentration; at the same time, it can block the rising plating solution vapor to prevent it from contacting and reacting with the wafer to cause film defects; in addition, during electroplating, the auxiliary device can rotate to the outside of the electroplating tank and perform the cleaning solution discharge operation, which does not affect the normal electroplating steps and improves the stability and efficiency of the electroplating process. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has high industrial utilization value.

[0066] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. An electroplating device, characterized in that: The electroplating device includes: a wafer carrier, an auxiliary device, an electroplating tank and a telescopic connector; The wafer carrier is used to horizontally fix the wafer to be plated, and the wafer carrier can move up and down to drive the wafer to move up and down; The auxiliary device includes a spray tank, a liquid inlet pipe buried in the bottom of the spray tank, and a plurality of nozzles connected to the liquid inlet pipe. The nozzles are arranged on the surface of the bottom of the spray tank facing the inner side of the tank body. One end of the liquid inlet pipe is an open end and the other end is a closed end. The auxiliary device is connected to the wafer carrier through the telescopic connection. By adjusting the telescopic connection, at least the spray tank of the auxiliary device can be made horizontal with the interior of the tank facing the wafer carrier and placed between the wafer carrier and the electroplating tank, and the auxiliary device can be rotated to the outside of the electroplating tank.

2. The electroplating device according to claim 1, wherein: The auxiliary device also includes a liquid outlet pipe buried inside the bottom of the spray tank, the liquid outlet pipe includes a main pipe and several collecting pipes, one end of the collecting pipe is connected to the main pipe, and the other end is flush with the surface of the bottom of the spray tank facing the inner side of the tank body.

3. The electroplating device according to claim 1, wherein: The electroplating device further includes a driving device, which is used to control the telescopic movement and position adjustment of the telescopic connecting member.

4. The electroplating device according to claim 1, wherein: When the spray tank of the auxiliary device is horizontal and the interior of the tank faces the wafer carrier and is placed between the wafer carrier and the electroplating tank, the nozzle is located below the wafer, all the nozzles are symmetrically distributed around the center of the wafer, and all the nozzles are facing the wafer surface.

5. The electroplating device according to claim 1, wherein: The auxiliary device can also be adjusted up and down between the wafer carrier and the electroplating tank by adjusting the telescopic connection piece.

6. A method for using an electroplating device, characterized in that: The method of use comprises the following steps: Providing an electroplating device according to any one of claims 1 to 5; Fixing the wafer horizontally and facing downward on the wafer carrier, wherein the front side of the wafer has through holes and / or grooves; The wafer is subjected to a wetting step, an electroplating step and / or a cleaning step; wherein, The immersion step and the cleaning step include: moving the wafer carrier to place the wafer above the electroplating tank; adjusting the telescopic connection to horizontally position the spray tank of the auxiliary device with the interior of the tank facing the wafer between the wafer carrier and the electroplating tank; introducing the cleaning liquid into the liquid inlet pipe and spraying it onto the surface of the wafer through the nozzle; The electroplating step includes: adjusting the telescopic connection to rotate the auxiliary device to the outside of the electroplating tank; moving the wafer carrier to place the wafer in the electroplating tank, and electroplating the wafer with the electroplating solution in the electroplating tank.

7. The method for using the electroplating device according to claim 6, wherein: The auxiliary device also includes a liquid outlet pipe buried inside the bottom of the spray tank, and the liquid outlet pipe includes a main pipe and several collecting pipes. One end of the collecting pipe is connected to the main pipe, and the other end is flush with the surface of the bottom of the spray tank facing the inner side of the tank body; in the immersion step and the cleaning step, the liquid inlet pipe introduces the cleaning liquid, and after it is sprayed to the surface of the wafer through the nozzle, it also includes a step of discharging the cleaning liquid through the liquid outlet pipe.

8. The method for using the electroplating device according to claim 6, wherein: The cleaning solution includes deionized water.

9. The method for using the electroplating device according to claim 6, wherein: The electroplating solution is a CuSO4 solution, and the steam of the electroplating solution contains SO4 2- 、H + and H2O.

10. The method for using the electroplating device according to claim 6, wherein: In the wetting step and the cleaning step, when adjusting the telescopic connection part to make the spray tank of the auxiliary device horizontal and the interior of the tank facing the wafer and placed between the wafer carrier and the electroplating tank, it also includes the step of adjusting the auxiliary device up and down to a preset position between the wafer carrier and the electroplating tank.

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