Control method and device of heat dissipation device, electronic equipment and storage medium

Abstract

The invention discloses a control method and device of a heat dissipation device, a computer readable storage medium, an electronic device and a computer program product. The method comprises the steps that a current working scene matched with current running data of a display card to be cooled is determined in a preset scene library; corresponding temperature weights are set for all the working assemblies according to the current working scene, and the higher the load of the working assembly is, the higher the temperature weight of the working assembly is; determining the comprehensive temperature of the display card according to the temperature of each working component and the corresponding temperature weight; and controlling the running state of the heat dissipation device of the display card according to the comprehensive temperature to reduce the temperature of the display card. The comprehensive temperature is obtained by weighting the temperatures of all the working assemblies, so that subsequent control over the operation state of the heat dissipation device of the display card can better meet the heat dissipation requirement of the working assembly with the higher load in the current working scene, and the technical problem that the heat dissipation effect of the display card is poor in the related technology is solved; and the heat dissipation effect of the display card is improved.

Description

Technical Field

[0001] The present application relates to the field of computers, and more specifically, to a control method, device, electronic device, computer-readable storage medium, and computer program product for a heat dissipation device. Background Art

[0002] Graphics cards, a crucial component of modern computer systems, undertake heavy data processing and graphics computing tasks in areas such as high-performance computing, graphics rendering, virtual reality, and machine learning. As data volumes increase and the computing power of graphics processing units (GPUs) rises, graphics card power consumption increases, leading to increased heat generation.

[0003] In the related art, air cooling is usually used to dissipate heat from the graphics card. A heat dissipation device, such as a fan, is installed on the graphics card, and the fan blows cold air through the graphics card to remove the heat from the graphics card.

[0004] However, the control method of the heat dissipation device in the related art cannot well match the heat dissipation requirements of the graphics card, resulting in poor heat dissipation effect of the graphics card. Summary of the Invention

[0005] The present application provides a control method, device, electronic device, computer-readable storage medium, and computer program product for a heat dissipation device, to at least solve the problem of poor heat dissipation effect of graphics cards in the related art.

[0006] The present application provides a method for controlling a heat dissipation device, comprising: determining a current working scene that matches current operating data of a graphics card to be cooled in a preset scene library, wherein the current working scene is used to indicate the load conditions of various working components of the graphics card; setting corresponding temperature weights for various working components according to the current working scene, wherein a working component with a higher load has a corresponding higher temperature weight; determining a comprehensive temperature of the graphics card according to the temperatures of various working components and the corresponding temperature weights; and controlling the operating state of the heat dissipation device of the graphics card according to the comprehensive temperature to reduce the temperature of the graphics card.

[0007] The present application also provides a control device for a heat dissipation device, comprising: a scene determination module, for determining a current working scene that matches the current operating data of a graphics card to be cooled in a preset scene library, wherein the current working scene is used to indicate the load conditions of various working components of the graphics card; a weight setting module, for setting corresponding temperature weights for various working components according to the current working scene, wherein a working component with a higher load has a higher corresponding temperature weight; a temperature determination module, for determining the comprehensive temperature of the graphics card according to the temperatures of various working components and the corresponding temperature weights; and a control module, for controlling the operating state of the heat dissipation device of the graphics card according to the comprehensive temperature to reduce the temperature of the graphics card.

[0008] The present application also provides an electronic device, comprising: a memory for storing a computer program; and a processor for implementing the steps of any of the above-mentioned control methods for the heat dissipation device when executing the computer program.

[0009] The present application also provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the steps of any of the above-mentioned control methods for the heat dissipation device are implemented.

[0010] The present application also provides a computer program product, including a computer program, which implements the steps of any of the above-mentioned control methods for heat dissipation devices when executed by a processor.

[0011] Through the control method of the heat dissipation device of the present application, first, matching is performed in the scene library according to the current operating data of the graphics card to obtain the current working scene that best suits the current working condition of the graphics card. Since the load conditions of the various working components of the graphics card are different in different working scenes, the working scene of the graphics card can be quickly determined by directly matching in the scene library, and then the load conditions of the various working components of the graphics card can be quickly determined, which facilitates subsequent timely and rapid heat dissipation control. Then, according to the current working scenario, corresponding temperature weights are set for each working component. The higher the load of the working component, the higher the corresponding temperature weight. Then, according to the temperature of each working component and the corresponding temperature weight, the comprehensive temperature of the graphics card is determined, so that the temperature of the working component with higher load accounts for a higher proportion in the comprehensive temperature, that is, the greater the impact on the comprehensive temperature. The obtained comprehensive temperature can more comprehensively reflect the temperature of each working component of the graphics card, so that the subsequent control of the operating status of the cooling device of the graphics card is more to meet the cooling needs of the working components with higher loads in the current working scenario, and can better meet the cooling needs of the working components with higher loads in the current working scenario, so that the cooling device can be accurately controlled according to the load conditions of different working components of the graphics card, ensuring that the operating status of the cooling device can meet the cooling needs of each working component of the graphics card as much as possible, solving the technical problem of poor cooling effect of the graphics card in related technologies, and improving the cooling effect of the graphics card. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0013] Figure 1 This is a hardware structure block diagram of a server device according to a method for controlling a heat dissipation device according to an embodiment of the present application;

[0014] Figure 2 is a flow chart of a method for controlling a heat dissipation device according to an embodiment of the present application;

[0015] Figure 3 This is a second flow chart of a method for controlling a heat dissipation device according to an embodiment of the present application;

[0016] Figure 4 This is a third flow chart of a method for controlling a heat dissipation device according to an embodiment of the present application;

[0017] Figure 5 This is a fourth flow chart of a method for controlling a heat dissipation device according to an embodiment of the present application;

[0018] Figure 6 This is a fifth flow chart of a method for controlling a heat dissipation device according to an embodiment of the present application;

[0019] Figure 7 This is a sixth flow chart of a method for controlling a heat dissipation device according to an embodiment of the present application;

[0020] Figure 8 This is a seventh flow chart of a method for controlling a heat dissipation device according to an embodiment of the present application;

[0021] Figure 9 This is a structural block diagram of a control device for a heat dissipation device according to an embodiment of the present application. DETAILED DESCRIPTION

[0022] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0023] It should be noted that, in the description of this application, the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. The terms "first," "second," etc., in this application are used to distinguish similar objects, and are not used to describe a particular order or sequence.

[0024] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0025] In conjunction with the specific application environment architecture or specific hardware architecture on which the execution of the control method for the heat dissipation device depends, the specific application environment architecture or specific hardware architecture is described herein.

[0026] The control method embodiment of the heat dissipation device provided in the embodiment of the present application can be executed in a server device or a similar computing device. Taking running on a server device as an example, Figure 1 This is a hardware structure block diagram of a server device for a control method of a heat dissipation device according to an embodiment of the present application. Figure 1 As shown, the server device may include one or more ( Figure 1Only one is shown) a processor 102 (the processor 102 may include but is not limited to a microprocessor MCU or a programmable logic device FPGA and other processing devices) and a memory 104 for storing data, wherein the above-mentioned server device may also include a transmission device 106 for communication functions and an input and output device 108. It will be understood by those skilled in the art that Figure 1 The structure shown is only for illustration and does not limit the structure of the above server device. Figure 1 More or fewer components than shown, or with Figure 1 Different configurations shown.

[0027] The memory 104 can be used to store computer programs, for example, software programs and modules of application software, such as the computer program corresponding to the control method of the heat dissipation device in the embodiment of the present application. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, that is, implementing the above method. The memory 104 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 104 may further include a memory remotely located relative to the processor 102, and these remote memories may be connected to a server device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof.

[0028] The transmission device 106 is used to receive or send data via a network. A specific example of the aforementioned network may include a wireless network provided by a communication provider of the server device. In one embodiment, the transmission device 106 includes a network interface controller (NIC), which can be connected to other network devices via a base station to enable communication with the Internet. In another embodiment, the transmission device 106 may be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0029] The embodiment of the present application provides a control method for a heat dissipation device, which is applied to the above-mentioned server equipment. The method is described in detail in conjunction with the execution process of the control method for the heat dissipation device. Figure 2 As shown, the method includes the following steps S200-230:

[0030] Step S200: determining a current working scene that matches the current operating data of the graphics card to be cooled in a preset scene library.

[0031] The current working scene is used to indicate the load conditions of various working components of the graphics card.

[0032] Specifically, the graphics card's real-time operating data is used to determine its current operating scenario, laying the foundation for subsequent temperature weighting. By comparing the graphics card's current status with the characteristics in the scenario library, it can be identified as whether the graphics card is performing computing tasks, cloud rendering, or cloud gaming, thereby understanding the load of each component.

[0033] Among them, the working components can be the graphics processing unit (GPU), video memory, power supply module, etc. inside the graphics card. They each undertake different computing and data processing tasks, and therefore have different load performances.

[0034] Among them, the scene library can be a data set that stores multiple working scenes of the graphics card, as well as the typical operating parameters of the graphics card in each working scene (such as GPU utilization, video memory utilization, GPU core frequency, video memory frequency, power supply module current, etc.). For example, if the GPU utilization and power consumption in the computing scene are relatively high, the scene library can store the data of the GPU utilization and power consumption in the preset computing scene. As long as the GPU utilization and power consumption data of the graphics card correspond to the GPU utilization and power consumption data in the preset computing scene, it is judged that the graphics card is in the computing scene. In the cloud gaming scene, the video memory utilization is relatively high. Therefore, the scene library can store the data of the video memory utilization in the preset cloud gaming scene. As long as the video memory utilization of the graphics card reaches the video memory utilization in the preset cloud gaming scene, it is judged that the graphics card is in the cloud gaming scene. Similarly, other working scenes and corresponding typical operating parameters can also be stored in the scene library, so that the current working scene of the graphics card can be identified by the typical operating parameters of the graphics card.

[0035] For example, the real-time operation data of the graphics card may include GPU temperature, video memory temperature, power supply module temperature, graphics card power consumption, GPU utilization, video memory utilization, GPU core frequency, video memory frequency, power supply module current, etc. Based on the current operation data, the corresponding working scene is matched in the scene library. For example, there are three working scenes preset in the scene library: computing scene, rendering scene, and gaming scene. Correspondingly, in the computing scene, the GPU and video memory are both highly loaded (for example, the GPU core frequency is higher than the preset value, and the video memory utilization is greater than 90%), in the rendering scene, the video memory is highly loaded, and the GPU is moderately loaded, and in the gaming scene, the GPU is highly loaded, and the video memory is moderately loaded. Based on the current operation data, the load condition of each working component can be directly determined.

[0036] Step S210: setting corresponding temperature weights for each working component according to the current working scenario.

[0037] Among them, the higher the load of the working component, the higher the corresponding temperature weight.

[0038] Specifically, according to the current working scenario of the graphics card, appropriate temperature weights are assigned to each working component to ensure that the temperature of the high-load working components is taken into consideration to a greater extent when the heat dissipation device is subsequently controlled, so that the heat dissipation needs of the high-load working components can be met first.

[0039] Among them, the temperature weight is a coefficient specified for each working component of the graphics card in the comprehensive temperature calculation, which indicates its importance to the overall cooling strategy. The higher the load, the greater the weight.

[0040] For example, a set of temperature weight adjustment rules is established based on the workload scenario. For example, in a computing scenario, the GPU temperature weight is set to a high value, such as 0.5; the memory temperature weight is set to a medium value, such as 0.4; and the power supply module and other components are set to a low temperature weight, such as 0.1. This dynamic weighting ensures that the cooling strategy in different scenarios can effectively meet the temperature control needs of each component.

[0041] For example, the scene library has three preset work scenarios: computing scenario, rendering scenario, and gaming scenario. In the computing scenario, both the GPU and video memory are highly loaded; in the rendering scenario, the video memory is highly loaded and the GPU is moderately loaded; and in the gaming scenario, the GPU is highly loaded and the video memory is moderately loaded. The corresponding weights can be shown in Table 1 below:

[0042] Table 1. Weight distribution table.

[0043] Scenario <![CDATA[GPU weight (W gpu )]]> <![CDATA[Video memory weight (W mem )]]> <![CDATA[Power supply module weight (W vrm )]]> Computing scenarios 50％ 40％ 10％ Rendering the scene 30％ 60％ 10％ Game scene 70％ 20％ 10％

[0044] Step S220 , determining the comprehensive temperature of the graphics card according to the temperature of each working component and the corresponding temperature weight.

[0045] Specifically, by combining the actual temperature of each working component with the corresponding temperature weight, a comprehensive temperature value that reflects the overall thermal state of the graphics card is calculated to guide the subsequent adjustment of the operating state of the heat dissipation device. The higher the load of the working component, the higher the corresponding weight, which means that the working component has a greater impact on the comprehensive temperature. Therefore, the comprehensive temperature can better reflect the temperature of the working component with a higher load, so that the subsequent control of the operating state of the heat dissipation device of the graphics card is more to meet the heat dissipation needs of the working components with higher loads in the current working scenario, and better meet the heat dissipation needs of the working components with higher loads in the current working scenario. However, the related art only controls the heat dissipation device according to the temperature value of a fixed position, without considering the comprehensive temperature of different working components, so it cannot match the heat dissipation needs of the graphics card well, resulting in poor heat dissipation effect of the graphics card.

[0046] Among them, the comprehensive temperature can be a weighted average, which takes into account the temperatures of multiple working components (GPU, video memory, power supply module and other heat sources) and reflects the overall thermal load of the graphics card.

[0047] Step S230: controlling the operating state of the heat dissipation device of the graphics card according to the comprehensive temperature to reduce the temperature of the graphics card.

[0048] Specifically, based on the comprehensive temperature of the graphics card, the operating parameters of the heat dissipation device (such as fans, water cooling systems) are intelligently adjusted to ensure that the temperature of the graphics card is maintained within a safe range, avoiding performance degradation and hardware damage caused by overheating.

[0049] The heat dissipation device can be any device used to reduce the temperature of the graphics card, including fans, heat sinks, water cooling circulation systems, etc. The operating state refers to the working mode of the heat dissipation device, such as the fan speed, the water flow rate of the water cooling system, etc.

[0050] For example, a heat sink control strategy could be designed that uses the graphics card's combined temperature as an input signal and adjusts the cooling device's operating status in real time. For example, if the combined temperature exceeds a preset threshold (e.g., 85°C), the fan speed is increased to accelerate heat dissipation; if the temperature falls below a safe lower limit, the speed is appropriately reduced to avoid energy waste. Through real-time monitoring and automatic adjustments, an optimal balance between cooling efficiency and graphics card temperature is achieved.

[0051] In this embodiment, first, a match is performed in the scene library according to the current operating data of the graphics card to obtain the current working scene that best suits the current working condition of the graphics card. Since the load conditions of the various working components of the graphics card are different in different working scenes, the working scene of the graphics card can be quickly determined by directly matching in the scene library, and then the load conditions of the various working components of the graphics card can be quickly determined, which facilitates subsequent timely and rapid heat dissipation control. Then, according to the current working scenario, corresponding temperature weights are set for each working component. The higher the load of the working component, the higher the corresponding temperature weight. Then, according to the temperature of each working component and the corresponding temperature weight, the comprehensive temperature of the graphics card is determined, so that the temperature of the working component with higher load accounts for a higher proportion in the comprehensive temperature, that is, the greater the impact on the comprehensive temperature. The obtained comprehensive temperature can more comprehensively reflect the temperature of each working component of the graphics card, so that the subsequent control of the operating status of the cooling device of the graphics card is more to meet the cooling needs of the working components with higher loads in the current working scenario, and better meet the cooling needs of the working components with higher loads in the current working scenario, so that the cooling device can be accurately controlled according to the load conditions of different working components of the graphics card, ensuring that the operating status of the cooling device can meet the cooling needs of each working component of the graphics card as much as possible, solving the technical problem of poor cooling effect of the graphics card in related technologies, and improving the cooling effect of the graphics card.

[0052] In one embodiment, Figure 3 As shown, step S230 controls the operating state of the heat dissipation device of the graphics card according to the comprehensive temperature. It includes steps S300-S320:

[0053] Step S300: determining the first temperature interval into which the comprehensive temperature falls.

[0054] Specifically, after determining the graphics card's overall temperature, this step compares it with multiple preset temperature ranges and identifies the first temperature range that matches the graphics card's overall temperature. This process is crucial for adjusting the cooling strategy, as it determines the power range within which the graphics card's cooling system operates.

[0055] The first temperature range may be one of a plurality of preset temperature ranges, each range corresponding to a different thermal state of the graphics card, such as a low temperature, a medium temperature or a high temperature range.

[0056] For example, a series of temperature thresholds can be set to divide the temperature range that a graphics card may encounter into multiple temperature intervals. For example, the temperature intervals can be set as: 0-60°C, 60°C-75°C, 75°C-85°C, and above 85°C. Each temperature interval corresponds to a different thermal management strategy. After receiving the graphics card's comprehensive temperature, the system compares and determines the temperature interval into which the graphics card's comprehensive temperature falls, namely the first temperature interval.

[0057] Step S310: determining a first power range of the heat dissipation device corresponding to a first temperature range in a preset control strategy table.

[0058] The control strategy table includes multiple temperature intervals and multiple power intervals of the heat dissipation device, and the multiple temperature intervals and the multiple power intervals correspond one to one.

[0059] Specifically, based on the temperature range to which the graphics card's combined temperature falls, the control strategy table selects the corresponding heat sink power range, namely the first power range. This ensures that the heat sink's operating power matches the current thermal management requirements, avoiding over- or under-heating.

[0060] The control strategy table may be a preset table that records the correspondence between different temperature ranges and operating power ranges of the heat sink. Each temperature range corresponds to a reasonable heat sink power range to meet the heat dissipation requirements of the graphics card at that temperature. The first power range is the power range of the heat sink corresponding to the first temperature range.

[0061] For example, a control strategy table can be constructed, in which temperature ranges correspond one-to-one to the power ranges of the heat sink. Using the graphics card's combined temperature as an index, the control strategy table is searched to find the first power range that matches the current temperature range. For example, if the graphics card's combined temperature is 77.5°C, falling within the 75°C-85°C range, the corresponding heat sink operating power in the control strategy table might be in the 70%-90% range.

[0062] Step S320: Control the heat dissipation device to operate at a first operating power.

[0063] The first operating power is in a first power range.

[0064] Specifically, according to the current thermal state of the graphics card and the guidance of the first power range, the operating power of the heat dissipation device is adjusted to ensure that the operating temperature of the graphics card is within a safe range while avoiding energy waste.

[0065] The first operating power may be an actual operating power set according to the first power range of the heat dissipation device in the current thermal state.

[0066] For example, a dynamic power control mechanism can be designed to automatically adjust the operating power of the heat sink based on the graphics card's combined temperature and the corresponding first power range in the control strategy table. For example, for a fan, the fan speed can be set within the first power range by adjusting the duty cycle of the pulse-width modulation signal to achieve a balance between heat dissipation efficiency and energy consumption. If the first power range is 70%-90%, the heat sink can be set to 81% operating power to meet the graphics card's cooling needs within the 75°C-85°C temperature range.

[0067] In this embodiment, the graphics card's combined temperature is first compared with a preset temperature range, accurately calculated and classified into the corresponding temperature range, thereby determining the graphics card's current thermal state. Next, a control strategy table is searched based on the thermal state, and a matching heat sink power range is selected. Finally, through the dynamic power control mechanism, the heat sink is adjusted to an operating power suitable for the current thermal state. This improves the responsiveness and accuracy of the cooling strategy, ensuring timely and effective cooling of the graphics card under different thermal conditions, and enhancing the graphics card's cooling performance.

[0068] In one embodiment, Figure 4 As shown, after controlling the heat dissipation device to operate at the first operating power in step S320, the method further includes steps S400-S420:

[0069] Step S400 , determining a rate of change of the integrated temperature based on the integrated temperature determined at the previous moment and the integrated temperature determined at the current moment.

[0070] Specifically, by comparing the comprehensive temperatures of two consecutive sampling periods and calculating the temperature change rate, it can be used to determine the changing trend of the comprehensive temperature of the graphics card over time, so that the system can respond to rapid temperature changes in a timely manner and make appropriate adjustments to the cooling strategy.

[0071] The rate of change may be the rate of difference between the integrated temperature at the current moment and the integrated temperature at the previous moment, and the unit is usually degrees per second (° C. / s).

[0072] For example, the previous integrated temperature value can be stored first. Then, at the end of each sampling period, the current integrated temperature value is read. The rate of change of the integrated temperature can be calculated by a simple mathematical operation: the difference between the two values divided by the time interval. For example, if the integrated temperature was 77.5°C at the previous moment and 78.3°C at the current moment, with a sampling period of 0.2 seconds, the rate of change is (78.3-77.5) / 0.2 = 4°C / s.

[0073] Step S410 , when it is determined based on the change rate that the rate of increase of the integrated temperature is greater than the first threshold and the integrated temperature is still in the first temperature range, a second power range corresponding to the second temperature range is determined in the control strategy table.

[0074] The lower temperature limit of the second temperature interval is greater than the upper temperature limit of the first temperature interval.

[0075] Specifically, when the rate of increase of the combined temperature is detected to have exceeded a preset first threshold, even though the current combined temperature is still within the first temperature range, to prevent further rapid temperature increases, the system will preemptively implement stronger cooling measures. Specifically, the system will search the control strategy table for a heat sink operating power range (the second power range) that matches the higher temperature range (the second temperature range) to facilitate subsequent enhanced cooling. In other words, the rate of change of the graphics card's combined temperature is regularly monitored. Once the rate of increase exceeds the preset first threshold, even if the temperature itself is still within a safe range, the system foresees a possible rapid temperature increase and quickly searches the control strategy table for a power range that corresponds to the higher temperature range, thereby preemptively increasing the heat sink's operating power.

[0076] The rise rate is the rate at which the graphics card's overall temperature rises over time. The first threshold can be a system-defined temperature change rate threshold, used to determine whether to increase cooling intensity in advance. The second temperature range represents a greater cooling requirement.

[0077] For example, a first threshold value for the rate of increase, such as 2.5°C / s, is set to monitor the rate of change of the integrated temperature. Once the rate of change exceeds this threshold, even if the integrated temperature (e.g., 77.5°C) has not yet reached the upper limit of the first temperature range (85°C), the system will refer to the control strategy table to determine a second power range corresponding to a higher temperature range (e.g., 85°C-95°C, i.e., the second temperature range). This facilitates the subsequent determination of the operating power corresponding to the second temperature range to increase the operating power of the heat dissipation device.

[0078] Step S420: Control the power of the heat dissipation device to increase from the first operating power to the second operating power.

[0079] The second operating power is in a second power range.

[0080] Specifically, once the system determines that the heat dissipation intensity needs to be increased, this step will adjust the actual operating power of the heat dissipation device from the current first operating power (for example, 81%) to the second operating power within the second power range (for example, 90%) to cope with the rapid increase in graphics card temperature.

[0081] The first operating power is the current operating power of the graphics card's heat sink, and the second operating power is a higher operating power determined by the system to cope with a rapid temperature increase.

[0082] In this embodiment, by first monitoring the rate of change of the integrated temperature in real time, it is possible to predict a rapid temperature increase. Secondly, by preemptively switching to a higher power range, the system can enhance heat dissipation before the temperature exceeds the current safe zone limit, thus preventing overheating. Finally, dynamic adjustment of the cooling device's operating power ensures a precise match between the cooling effect and the graphics card's thermal state, improving the graphics card's cooling efficiency. This proactive graphics card cooling strategy can effectively curb rapid temperature increases, avoid potential overheating risks, and thus enhance the stability and reliability of the graphics card and the server on which it resides.

[0083] In one embodiment, Figure 5 As shown, after controlling the heat dissipation device to operate at the first operating power in step S320, the method further includes steps S500-S520:

[0084] Step S500 , determining a rate of change of the integrated temperature based on the integrated temperature determined at the previous moment and the integrated temperature determined at the current moment.

[0085] Specifically, by comparing the integrated temperatures of two consecutive sampling periods, the integrated temperature change rate of the two consecutive sampling periods is calculated to ensure that the system can respond promptly to any temperature drop trend.

[0086] For example, the temperature monitoring module in the system can be used to continuously record the integrated temperature value of the graphics card. At the end of each sampling period, the current integrated temperature value is compared with the value of the previous period. For example, if the integrated temperature of the previous period was 83.5°C and the current period is 82.8°C, and the sampling period is 0.2 seconds, the calculated rate of change is (82.883.5) / 0.2 = -3.5°C / s, which means that the integrated temperature of the graphics card is decreasing at a rate of -3.5°C / s.

[0087] Step S510 : When it is determined based on the change rate that the rate of decrease of the integrated temperature is greater than a second threshold, the power of the heat dissipation device is controlled to remain unchanged within a first preset time period.

[0088] Specifically, when the rate of decrease of the graphics card's combined temperature exceeds a preset second threshold, the current cooling strategy is effective and the temperature begins to drop rapidly. However, to avoid possible temperature fluctuations (i.e., a momentary temperature drop followed by a quick rebound), power control of the cooling device is delayed, maintaining the current power of the cooling device unchanged until the first preset duration expires, ensuring that the cooling device's power is not frequently adjusted.

[0089] The second threshold value may be a critical value of the temperature reduction rate set by the system, used to determine whether the heat dissipation power should be temporarily kept unchanged. The first preset time length: To avoid frequent adjustments to the power of the heat dissipation device, the heat dissipation power is set to remain unchanged for a period of time.

[0090] For example, a second threshold, such as -2.0°C / s, is set to monitor the rate of change of the integrated temperature. Once the rate of change exceeds this threshold, the system records the start time and maintains the current power of the heat sink for a first preset duration (e.g., 5 seconds). During this period, although the graphics card temperature may continue to drop, the heat sink power is initially maintained to prevent the possibility of temperature fluctuations.

[0091] Step S520: After the first preset time period, the operating power of the heat dissipation device is controlled according to the current comprehensive temperature of the graphics card.

[0092] Specifically, after the power remains unchanged for a first period of time, the system checks the integrated temperature of the graphics card again and adjusts the operating power of the heat dissipation device according to the current value of the integrated temperature of the graphics card.

[0093] For example, after the first preset period of time in which the power remains constant, the system reads the integrated temperature value of the graphics card again. If the temperature has indeed dropped, the operating power of the heat sink can be reduced (e.g., by lowering the fan speed) to save energy and meet current heat dissipation requirements.

[0094] In this embodiment, the rate of change of the comprehensive temperature is first monitored to promptly identify the temperature drop trend; then, when the temperature drops rapidly, the heat dissipation power is kept constant to avoid possible temperature fluctuations (that is, a momentary temperature drop but a quick rise again). Therefore, the power control of the heat dissipation device is delayed to keep the current power of the heat dissipation device unchanged until the first preset time period ends, ensuring that the power of the heat dissipation device is not frequently adjusted, thereby improving the stability of the heat dissipation device.

[0095] In one embodiment, step S320, controlling the heat dissipation device to operate at a first operating power, includes:

[0096] A power adjustment strategy corresponding to the first power interval is determined.

[0097] Specifically, different temperature intervals correspond to different power intervals, and different temperature intervals correspond to different power adjustment strategies. The power adjustment strategies may include fixed power, linear power increase, exponential power increase, maximum power, and the like.

[0098] For example, taking the cooling device as a fan, as shown in the following table, set the mapping relationship between the Tevg temperature range and the cooling strategy. When the system detects that the integrated temperature Tevg of the graphics card is in a certain range, the fan speed is adjusted according to the strategy corresponding to the range. For example, if Tevg is 68°C, which falls in the range of 60≤Tevg<75°C, the system will start the "linear growth rate" cooling strategy, and the fan speed will be adjusted between 30% and 70%. The specific speed depends on the actual integrated temperature. For another example, if the integrated temperature is calculated as Tevg=80.5℃, 75≤Tevg<85, then the corresponding cooling control strategy is exponential growth rate, and the fan speed can be calculated by the following exponential function formula:

[0099]

[0100] Where Tevg is the integrated temperature.

[0101]

[0102] A first power is determined according to a power adjustment strategy and the current comprehensive temperature.

[0103] Specifically, within different temperature ranges, there is a corresponding relationship between temperature and power. For example, the above formula can be used to calculate the power corresponding to the heat dissipation device based on the comprehensive temperature.

[0104] The higher the lower limit of the temperature range, the greater the power increase for each unit temperature increase. The unit temperature can be a unit increment of temperature, such as 1°C. In other words, the higher the temperature value corresponding to the temperature range, the faster the power increases with temperature. For example, as shown in the table above, in the temperature range of 60≤Tevg<75, the fan speed increases linearly with temperature, and in the temperature range of 75≤Tevg<85, the fan speed increases exponentially with temperature. This is because the higher the temperature, the greater the damage to the hardware and the more likely the hardware will be damaged. Therefore, in the high temperature range, faster power increase speed is used to enhance heat dissipation to protect the hardware from overheating damage.

[0105] For example, the slope or rate of increase in heat sink power within different temperature ranges can be preset. For example, when Tevg is in the high temperature range of 75°C ≤ Tevg < 85°C, the heat sink power increase ratio for each 1°C increase is greater than the heat sink power increase ratio within the range of 60°C ≤ Tevg < 75°C. This means that in the high temperature range, a small change in temperature will result in a significant increase in fan speed, thereby quickly enhancing the heat dissipation effect and preventing further temperature increases.

[0106] The power of the heat dissipation device is controlled using the determined first power.

[0107] In this embodiment, the system can implement differentiated cooling measures based on different temperature ranges, ensuring both efficient cooling and energy conservation. By accelerating the power ramp-up rate in high-temperature ranges, the system can quickly respond to overheating risks, avoiding performance degradation and hardware failures caused by localized overheating in the graphics card, thereby improving hardware reliability. Refined power control of the cooling device not only optimizes cooling effectiveness but also avoids unnecessary power waste. Specifically, matching cooling strategies and fan speed ranges are selected based on the graphics card's integrated temperature range, ensuring accurate alignment between cooling measures and thermal conditions. Within each temperature range, by setting a mapping between temperature and power, the system calculates the optimal fan speed in real time based on temperature changes. This allows for faster cooling intensity increases as temperatures rise, preventing overheating. Furthermore, in high-temperature ranges, the significantly faster power ramp-up rate allows the system to quickly respond to sudden temperature increases, effectively preventing hardware overheating by promptly enhancing heat dissipation and protecting the graphics card's stability and hardware security.

[0108] In one embodiment, Figure 6 As shown, step S220 determines the comprehensive temperature of the graphics card based on the temperature of each working component and the corresponding temperature weight. It includes: steps S600-S610:

[0109] Step S600: obtaining the current temperature of each working component and the temperature threshold corresponding to each working component.

[0110] Specifically, the real-time temperature data of each working component inside the graphics card (such as the Graphics Processing Unit (GPU), video memory, power supply module, etc.) is collected, and the upper temperature thresholds of these components under normal working conditions are obtained.

[0111] The current temperature is the actual measured temperature of each working component at the current moment. The temperature threshold is the maximum allowable temperature of each working component set to ensure normal operation of the hardware.

[0112] For example, a temperature sensor inside a graphics card can be used to periodically (e.g., every 200ms) measure the temperature of each component. Simultaneously, temperature thresholds for each component are obtained from system configuration or hardware specifications, which are determined during graphics card design.

[0113] Step S610: When the current temperature of each working component does not exceed the corresponding temperature threshold, the current temperature of each working component is weighted and summed according to the temperature weight corresponding to each working component to obtain the comprehensive temperature of the graphics card.

[0114] Specifically, when the current temperatures of all working components are lower than the corresponding preset temperature thresholds, the system performs a weighted summation on the current temperatures of each component according to the preset temperature weights to obtain a comprehensive temperature value that reflects the overall temperature status of the graphics card.

[0115] For example, in a computing scenario, the GPU's stable weight is 50%, the video memory's weight is 40%, and the power supply module's weight is 10%. Then, using the real-time temperature value and the corresponding weight, the integrated temperature of the graphics card is calculated through mathematical operations (such as weighted average). The integrated temperature T evg The calculation formula is as follows:

[0116] T evg =T gpu ×W gpu +T mem ×W mem +T vrm ×W vrm Among them, T evg is the integrated temperature, T gpu is the GPU temperature, T mem is the memory temperature, T vrm is the power module temperature, W gpu 、W mem 、W vrm These are the temperature weights for the GPU, video memory, and power module, respectively. For example, if the current GPU temperature is 75°C, the video memory is 80°C, and the power module is 85°C, and the corresponding weights are 0.5, 0.4, and 0.1, respectively, the calculated composite temperature is 75*0.5+80*0.4+85*0.1=77.5°C.

[0117] In this embodiment, first, by regularly acquiring the real-time temperature of each working component, the system can monitor the thermal status of the graphics card in real time, ensuring the dynamic responsiveness of the cooling strategy; second, by setting temperature thresholds, the system can determine whether the temperature of each component is within a safe range, providing a basis for the formulation of subsequent cooling strategies; finally, by calculating the comprehensive temperature of the graphics card through weighted summation, the system can comprehensively evaluate the thermal status of the graphics card, providing key data for the implementation of intelligent cooling strategies.

[0118] In one embodiment, Figure 7 As shown, after obtaining the current temperature of each working component and the temperature threshold corresponding to each working component in step S600, the method further includes steps S700-S710:

[0119] Step S700: When it is determined that the current temperature of at least one working component of the graphics card exceeds a corresponding temperature threshold, control the heat dissipation device to operate at a preset upper limit power.

[0120] Specifically, when the system detects that the temperature of any one or more working components of the graphics card exceeds a preset safety threshold, it immediately increases the operating power of the heat dissipation device to a preset upper limit power to quickly cool the overheated components and prevent hardware damage.

[0121] The upper limit power is the maximum power that the heat sink can operate at. The current temperature of the working component is the temperature measurement value of each working component of the graphics card at the current moment.

[0122] For example, the temperature of each operating component is monitored. Once the temperature of any component is detected to exceed a preset safety threshold, an instruction is immediately sent to the heat dissipation device control unit to adjust the operating power of the heat dissipation device to an upper limit. For example, the speed of the graphics card fan is increased to 100%.

[0123] Step S710: After the heat dissipation device operates at a preset upper power limit for a second preset period of time, if the current temperature of at least one working component still exceeds the corresponding temperature threshold, control the operating frequency of at least one working component to decrease.

[0124] Among them, the current temperature of at least one working component is continuously monitored, and when the current temperature of at least one working component still exceeds the corresponding temperature threshold, the operating frequency of at least one working component is controlled to be continuously reduced until the current temperature of at least one working component does not exceed the corresponding temperature threshold.

[0125] Specifically, if the graphics card's working components are still overheated after running at the upper power limit of the heat dissipation device for a preset period of time, the system will take further measures to reduce the operating frequency of these overheated components to reduce the heat generated by the working components until the temperature returns to a safe range.

[0126] The second preset duration is the time the system waits for the temperature to return to normal when the cooling device is running at maximum power. The operating frequency of the working component is the clock frequency of the graphics card's working components, such as the GPU and video memory. The higher the frequency, the greater the processing power, but also the greater the heat generated.

[0127] For example, a second preset duration, such as 30 seconds, is set to monitor the temperature changes of the overheating component. If the temperature has not returned to normal after the second preset duration, the system will send instructions to the graphics card's frequency control module to gradually reduce the operating frequency of the overheating component, for example, reducing the GPU core frequency from 2295MHz to 1800MHz and the memory frequency from 10251MHz to 8000MHz, until the monitored temperature is lower than the preset temperature threshold.

[0128] In this embodiment, by comparing the temperature of the working components with the corresponding temperature thresholds, overheating conditions within the graphics card can be quickly identified. When the system detects that the temperature of the graphics card's working components exceeds a preset safety threshold, it immediately takes the emergency measure of operating the heat sink at its upper power limit. This helps to quickly reduce the temperature of the overheated components and avoid potential hardware damage. Secondly, by setting the upper power limit and a second preset duration for the heat sink, the effectiveness of emergency cooling is ensured while avoiding unnecessary long-term operation at maximum power, thus balancing energy efficiency and hardware protection. Finally, if, even at the upper power limit, the temperature of the working components remains above the safety threshold after the second preset duration, the system will further reduce the operating frequency of these components, fundamentally reducing the heat generated by the heat source until the temperature returns to a safe range, thus implementing a double insurance mechanism for graphics card thermal management.

[0129] In one embodiment, Figure 8 As shown, step S210 sets the corresponding temperature weight for each working component according to the current working scene. It includes: steps S800-S840:

[0130] Step S800 : determining, from among a plurality of parameter indices of a working component, a parameter indices having the greatest impact on the temperature of the working component as a load indicator.

[0131] The load indicator includes at least one of the following: operating frequency, memory utilization, and power.

[0132] Specifically, among the multiple parameter indicators of the graphics card working components, such as operating frequency, memory utilization and power, determine which indicator has the greatest impact on the temperature of the working components, which serves as the key basis for subsequent load condition evaluation and temperature weight allocation.

[0133] The operating frequency is the clock frequency of a component, such as a GPU or video memory. The higher the frequency, the greater the component's power consumption and heat generation. Memory utilization is the percentage of memory (such as video memory) occupied by the component. High utilization indicates increased data processing and heat generation. Power is the amount of electricity consumed by the component in its current operating state. Increased power typically results in increased heat generation.

[0134] For example, the correlation between each parameter and the temperature of the working component can be analyzed, which can be determined through historical data statistics or experimental methods. For example, the operating frequency, memory utilization, power and temperature data of the graphics card under different computing tasks can be collected, and the parameter most closely related to temperature changes can be found through data analysis algorithms (such as correlation coefficient calculation). Once a parameter (such as operating frequency) is determined as the load indicator, the next step will be to analyze the load situation and assign temperature weights based on this indicator.

[0135] Step S810: Determine the load status of each working component according to the load index of each working component.

[0136] Specifically, based on the determined load index, the current load status of each working component is analyzed in detail to provide data support for the subsequent temperature weight allocation.

[0137] The load condition refers to the current amount of computing tasks or data processing of the working component, which indirectly reflects the heat generation of the working component. The load condition can be evaluated using load indicators.

[0138] For example, sensor data and system monitoring information can be used to monitor the load indicators of working components in real time. For example, if the operating frequency is a load indicator, the GPU core frequency can be monitored to see if it is close to full load. For video memory, the data transfer rate or usage of the video memory can be monitored to assess whether the memory is under high load. These indicators are compared with the performance specifications of the graphics card to determine the load of each working component.

[0139] Step S820: Classify the load conditions of each working component using a preset load classification rule, and determine the load level of each working component.

[0140] Specifically, the load conditions of each working component are quantitatively graded so that the temperature weight can be adjusted according to different load levels later.

[0141] The load classification rule may be a preset rule for quantifying the monitored load conditions into different levels, such as light, medium, and heavy loads.

[0142] For example, load classification rules are set, such as dividing operating frequency into three levels: low (less than 60%), medium (60%-80%), and high (greater than 80%). Similarly, corresponding classification standards are set for memory utilization and power, such as through threshold judgment or range division.

[0143] Step S830: assigning target temperature weights to the respective working components according to the load levels of the respective working components.

[0144] Specifically, the target temperature weights are redistributed according to the load level of each working component to ensure that the heat dissipation strategy is more accurate and effective.

[0145] The target temperature weight is the weight determined based on the load level of the working component, and is used to calculate the weight value when calculating the comprehensive temperature of the graphics card.

[0146] For example, based on the load classification results, target temperature weights are assigned to each operating component. For example, a highly loaded GPU is assigned a higher target temperature weight, while a lightly loaded power supply module is assigned a lower weight. This allows the calculated graphics card temperature to more accurately reflect current cooling requirements, ensuring more rational adjustments to the cooling strategy.

[0147] Step S840: When the current temperature weight corresponding to each working component is inconsistent with the corresponding target temperature weight, the current temperature weight corresponding to each working component is updated to the corresponding target temperature weight.

[0148] Specifically, ensure that the temperature weights of each working component of the graphics card match the actual load conditions. Once the weights are inconsistent, update the weights immediately to adjust the cooling strategy.

[0149] Among them, the current temperature weight is the temperature weight of each working component assigned according to the current working scenario determined in the graphics card cooling strategy. The target temperature weight is the temperature weight value recalculated for each working component based on the latest load conditions. Since the process of calculating the temperature weight based on the load index through steps S800-S830 requires a certain amount of calculation, this process is time-consuming but more accurate. Step S210 directly matches the scene to assign weights more quickly, and the temperature adjustment requires a quick response to avoid hardware damage. Therefore, this embodiment is a solution for further fine-tuning the temperature weight on the basis of step S210.

[0150] For example, the system monitors the graphics card's operating status and, upon detecting a change in the load level of a component, compares the current temperature weight with the target temperature weight. If the two differ, the system automatically updates the current temperature weight to the target temperature weight, ensuring that the cooling strategy responds to changes in the graphics card's internal thermal state in real time.

[0151] In this embodiment, by determining the load index that has the greatest impact on temperature, the system can more accurately evaluate the actual thermal load of each working component of the graphics card, providing key data for subsequent adjustments to the cooling strategy. The load conditions of each working component are then quantified based on the load index, laying the foundation for subsequent load level division and temperature weight allocation. Secondly, the introduction of load grading rules makes the thermal status evaluation of the graphics card more quantitative and standardized, avoiding cooling strategy errors caused by subjective judgment or improper parameter selection; thirdly, by dynamically allocating target temperature weights, the system can adjust the proportion of the working component in the comprehensive temperature calculation of the graphics card in real time according to the actual load conditions of the working component, ensuring that the cooling strategy can effectively respond to changes in the heat source; finally, through the weight update mechanism, the graphics card cooling strategy can quickly adapt to load changes, avoiding poor cooling effects or waste of resources due to inappropriate weights.

[0152] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus the necessary general hardware platform, and of course it can also be implemented by hardware, but in many cases the former is a better implementation method.

[0153] In one embodiment, the method of any of the above embodiments can be executed by a baseboard management controller (BMC). The baseboard management controller is electrically connected to the graphics card via a bus (e.g., an Inter-Integrated Circuit (I2C) bus or a System Management Bus (SMBus)). The BMC can communicate with the server motherboard where the graphics card is located via an independent network interface (typically a dedicated management port), independent of the main operating system. Even if the server is shut down or the operating system crashes, the administrator can still access the server's hardware status through the BMC.

[0154] In the relevant technology, since the graphics card driver is the bridge for communication between the operating system and the graphics card hardware, it is responsible for managing the operating status of the graphics card, including the adjustment of the fan speed. However, driver regulation has obvious limitations: Control failure caused by driver abnormality: If the graphics card driver fails or is abnormal, the operating system will lose the communication channel with the graphics card hardware and will not be able to control the fan speed through the standard interface, which may cause the fan to stop or run at a fixed low speed, making it impossible to dissipate heat effectively. Dependency of in-band regulation: Both driver regulation and third-party software regulation are in-band regulation, which means that they are completely dependent on the operating status of the server operating system. Once the operating system crashes, in-band regulation will not be able to continue, and the graphics card cooling will be out of control. Occupation of computing resources: In-band regulation will occupy the server's computing resources, especially under intensive computing tasks, which may have an adverse effect on the server's performance because some computing resources are used for temperature control rather than core tasks.

[0155] Therefore, to address the aforementioned issues, the method in any of the above embodiments of the present application can be executed out-of-band via a baseboard management controller (BMC). The BMC is unaffected by the state of the server's operating system. Even if the operating system crashes, the BMC can still take over the graphics card's thermal management and continue to control the fan speed to ensure that the graphics card does not overheat. The BMC's thermal management is completely independent of the server's computing tasks and does not consume any server computing resources, thereby avoiding negative impacts on server performance.

[0156] Among them, BMC can realize out-of-band (OOB) management and monitoring functions. It allows administrators to remotely monitor, configure and manage the hardware status of the server without relying on the server operating system. The main functions of BMC include: Remote monitoring: Monitor the hardware status of the server, including CPU temperature, memory temperature, fan speed, power status, voltage, etc. Provide real-time hardware health status reports. Remote management: Remotely access the server through the network interface, even if the server operating system is not started or crashes. Support remote power on, off, restart, power management and other operations. System status management: Record hardware event logs (SEL, System Event Log) to help administrators quickly locate hardware problems. Provide hardware diagnostic functions to detect hardware failures.

[0157] In this embodiment, a baseboard management controller (BMC) is designed to perform the methods described in the above embodiments out-of-band. Because the BMC can operate independently of the operating system, the graphics card cooling system can continue to function properly even in the event of a software failure or system downtime. This significantly improves the stability of the data processing center and avoids potential hardware overheating-induced system downtime or performance degradation. This improves the stability of the control of the graphics card cooling device. Furthermore, the BMC's cooling control does not consume server computing resources, allowing the server to devote all resources to computing tasks, thereby avoiding resource waste and optimizing computing performance.

[0158] The embodiment of the present application also provides a control device for a heat dissipation device, Figure 9 : is a structural block diagram of a control device for a heat dissipation device according to an embodiment of the present application, the device comprising:

[0159] The scene determination module 901 is used to determine a current working scene that matches the current operating data of the graphics card to be cooled in a preset scene library, wherein the current working scene is used to indicate the load conditions of various working components of the graphics card.

[0160] The weight setting module 902 is used to set a corresponding temperature weight for each working component according to the current working scene, wherein the working component with a higher load has a higher corresponding temperature weight.

[0161] The temperature determination module 903 is used to determine the comprehensive temperature of the graphics card according to the temperature of each working component and the corresponding temperature weight.

[0162] The control module 904 is used to control the operating state of the heat dissipation device of the graphics card according to the comprehensive temperature to reduce the temperature of the graphics card.

[0163] In an exemplary embodiment, the control module 904 is further configured to determine a first temperature interval within which the comprehensive temperature falls. A first power interval for the heat sink corresponding to the first temperature interval is determined in a preset control strategy table, wherein the control strategy table includes multiple temperature intervals and multiple power intervals for the heat sink, and the multiple temperature intervals and the multiple power intervals correspond one-to-one. The heat sink is controlled to operate at a first operating power, wherein the first operating power is within the first power interval.

[0164] In an exemplary embodiment, the apparatus further comprises:

[0165] The first change rate determination module is used to determine the change rate of the comprehensive temperature according to the comprehensive temperature determined at the previous moment and the comprehensive temperature determined at the current moment.

[0166] The power determination module is used to determine a second power interval corresponding to a second temperature interval in the control strategy table when the rate of increase of the comprehensive temperature is determined to be greater than a first threshold value based on the rate of change and the comprehensive temperature is still in the first temperature interval, wherein the lower temperature limit value of the second temperature interval is greater than the upper temperature limit value of the first temperature interval.

[0167] The first power adjustment module is used to control the power of the heat dissipation device to increase from a first operating power to a second operating power, wherein the second operating power is in a second power range.

[0168] In an exemplary embodiment, the apparatus further comprises:

[0169] The second change rate determination module is used to determine the change rate of the comprehensive temperature according to the comprehensive temperature determined at the previous moment and the comprehensive temperature determined at the current moment.

[0170] The power maintaining module is used to control the power of the heat dissipation device to remain unchanged within a first preset time period when the reduction rate of the comprehensive temperature is greater than a second threshold value determined according to the change rate.

[0171] The second power adjustment module is used to control the operating power of the heat dissipation device according to the current comprehensive temperature of the graphics card after the first preset time period.

[0172] In an exemplary embodiment, the temperature determination module 903 is further configured to obtain the current temperature of each operating component and the temperature threshold corresponding to each operating component. If the current temperature of each operating component does not exceed the corresponding temperature threshold, the current temperature of each operating component is weighted and summed according to the temperature weight corresponding to each operating component to obtain the overall temperature of the graphics card.

[0173] In an exemplary embodiment, the apparatus further comprises:

[0174] The third power adjustment module is used to control the heat dissipation device to operate at a preset upper limit power when it is determined that the current temperature of at least one working component of the graphics card exceeds the corresponding temperature threshold.

[0175] The frequency adjustment module is used to control the operating frequency of at least one working component to decrease after the heat dissipation device has been running for a second preset period of time according to a preset upper limit power, when the current temperature of at least one working component still exceeds the corresponding temperature threshold, until the current temperature of at least one working component does not exceed the corresponding temperature threshold.

[0176] In an exemplary embodiment, the apparatus further comprises:

[0177] The indicator determination module is used to determine the parameter indicator with the greatest impact on the temperature of the working component among multiple parameter indicators of the working component as the load indicator, wherein the load indicator includes at least one of the following: working frequency, memory utilization, and power.

[0178] The load determination module is used to determine the load condition of each working component according to the load index of each working component.

[0179] The grading module is used to grade the load conditions of each working component using a preset load grading rule and determine the load level of each working component.

[0180] The weight allocation module is used to allocate target temperature weights to each working component according to the load level of each working component.

[0181] The weight updating module is used to update the current temperature weight corresponding to each working component to the corresponding target temperature weight when the current temperature weight corresponding to each working component is inconsistent with the corresponding target temperature weight.

[0182] For the description of the features in the embodiment corresponding to the control device of the heat dissipation device, reference can be made to the relevant description of the embodiment corresponding to the control method of the heat dissipation device, which will not be repeated here.

[0183] An embodiment of the present application further provides an electronic device, comprising a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute the steps in any of the above-mentioned control method embodiments of the heat dissipation device.

[0184] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored, wherein the computer program is configured to execute the steps of any of the above-mentioned control method embodiments of the heat dissipation device when running.

[0185] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk, or an optical disk.

[0186] An embodiment of the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the steps in any of the above-mentioned control method embodiments of the heat dissipation device are implemented.

[0187] An embodiment of the present application also provides another computer program product, including a non-volatile computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, it implements the steps in any of the above-mentioned control method embodiments of the heat dissipation device.

[0188] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0189] The above is a detailed introduction to the control method, device, electronic device, computer-readable storage medium, and computer program product of a heat dissipation device provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A control method for a heat dissipation device, characterized in that: The method comprises: Determining a current working scene that matches current operating data of the graphics card to be cooled in a preset scene library, wherein the current working scene is used to indicate a load condition of each working component of the graphics card; Setting a corresponding temperature weight for each working component according to the current working scenario, wherein a working component with a higher load has a higher corresponding temperature weight; determining a comprehensive temperature of the graphics card according to the temperatures of the various working components and corresponding temperature weights; The operating state of the heat dissipation device of the graphics card is controlled according to the comprehensive temperature to reduce the temperature of the graphics card.

2. The control method of the heat dissipation device according to claim 1, characterized in that: The step of controlling the operating state of the heat dissipation device of the graphics card according to the comprehensive temperature includes: determining a first temperature interval into which the comprehensive temperature falls; Determining a first power interval of the heat dissipation device corresponding to the first temperature interval in a preset control strategy table, wherein the control strategy table includes multiple temperature intervals and multiple power intervals of the heat dissipation device, and the multiple temperature intervals and the multiple power intervals have a one-to-one correspondence; The heat dissipation device is controlled to operate at a first operating power, wherein the first operating power is within the first power range.

3. The control method of the heat dissipation device according to claim 2, characterized in that: After controlling the heat dissipation device of the graphics card to operate at the first operating power, the method further includes: Determining a rate of change of the integrated temperature based on the integrated temperature determined at a previous moment and the integrated temperature determined at a current moment; If it is determined according to the change rate that the rate of increase of the integrated temperature is greater than a first threshold value and the integrated temperature is still within the first temperature range, determining a second power range corresponding to a second temperature range in the control strategy table, wherein a lower temperature limit value of the second temperature range is greater than an upper temperature limit value of the first temperature range; The power of the heat dissipation device is controlled to increase from the first operating power to a second operating power, wherein the second operating power is within the second power range.

4. The control method of the heat dissipation device according to claim 2, characterized in that: After controlling the heat dissipation device of the graphics card to operate at the first operating power, the method further includes: Determining a rate of change of the integrated temperature based on the integrated temperature determined at a previous moment and the integrated temperature determined at a current moment; When it is determined according to the change rate that the rate of decrease of the integrated temperature is greater than a second threshold, controlling the power of the heat dissipation device to remain unchanged for a first preset time period; After the first preset time period, the operating power of the heat dissipation device is controlled according to the current comprehensive temperature of the graphics card.

5. The control method for a heat dissipation device according to any one of claims 1 to 4, characterized in that: Determining the comprehensive temperature of the graphics card according to the temperatures of the various working components and the corresponding temperature weights includes: Obtaining the current temperature of each working component and the temperature threshold corresponding to each working component; When the current temperature of each working component does not exceed the corresponding temperature threshold, the current temperature of each working component is weighted and summed according to the temperature weight corresponding to each working component to obtain the comprehensive temperature of the graphics card.

6. The control method of the heat dissipation device according to claim 5, characterized in that: After obtaining the current temperature of each working component and the temperature threshold corresponding to each working component, the method further includes: When it is determined that the current temperature of at least one working component of the graphics card exceeds a corresponding temperature threshold, controlling the heat dissipation device to operate at a preset upper limit power; After the heat dissipation device operates for a second preset period of time according to the preset upper limit power, if the current temperature of the at least one working component still exceeds the corresponding temperature threshold, the operating frequency of the at least one working component is controlled to decrease until the current temperature of the at least one working component does not exceed the corresponding temperature threshold.

7. The control method for a heat dissipation device according to any one of claims 1 to 4, characterized in that: After setting corresponding temperature weights for the respective working components according to the current working scenario, the method further includes: Determining, from among a plurality of parameter indicators of the working component, a parameter indicator having the greatest impact on the temperature of the working component as a load indicator, wherein the load indicator includes at least one of the following: operating frequency, memory utilization, and power; Determining the load conditions of the respective working components according to the load indicators of the respective working components; Using a preset load classification rule to classify the load conditions of each working component, and respectively determine the load level of each working component; Allocating target temperature weights to the respective working components according to the load levels of the respective working components; In a case where the current temperature weight corresponding to each working component is inconsistent with the corresponding target temperature weight, the current temperature weight corresponding to each working component is updated to the corresponding target temperature weight.

8. A control device for a heat dissipation device, characterized in that: include: a scene determination module, configured to determine, from a preset scene library, a current operating scene that matches current operating data of the graphics card to be cooled, wherein the current operating scene is used to indicate a load condition of each operating component of the graphics card; A weight setting module is used to set a corresponding temperature weight for each working component according to the current working scene, wherein the working component with a higher load has a higher corresponding temperature weight; a temperature determination module, configured to determine a comprehensive temperature of the graphics card based on the temperatures of the various working components and corresponding temperature weights; The control module is used to control the operating state of the heat dissipation device of the graphics card according to the comprehensive temperature to reduce the temperature of the graphics card.

9. An electronic device, characterized in that: include: memory for storing computer programs; A processor, configured to implement the steps of the method according to any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, wherein the computer program implements the steps of the method according to any one of claims 1 to 7 when executed by a processor.

11. A computer program product comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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